KR20180132307A - The equipment and method for semiconductor PCB(Printed Circuit Board) inspection - Google Patents

Abstract

The present invention relates to equipment to test a semiconductor printed circuit board (PCB), capable of quickly and correctly test the semiconductor PCB. According to the present invention, the equipment to test a semiconductor PCB comprises: a first glass substrate (302) to attach the semiconductor PCB (301) thereto; a third glass substrate (304) spaced apart from the first glass substrate (302) at a constant interval; left, right, upper, and lower glass substrate fixing plates (310, 311, 314, 315) to fix the first and third glass substrates (302, 304) by being spaced apart at a constant interval, wherein the first and third glass substrates (302, 304) form a stacked glass substrate (314); a semiconductor PCB X-Y axial moving plate (108) to move the stacked glass substrate (314) in an X-Y axial direction; and a vacuum control device (313) connected to a predetermined glass substrate fixing plate among the left, right, upper, and lower glass substrate fixing plates (310, 311, 314, 315).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor PCB inspection apparatus and a method of inspecting a semiconductor PCB,

The present invention relates to an improved semiconductor PCB (Printed Circuit Board) inspection apparatus and inspection method, and more particularly, to an inspection apparatus and an inspection apparatus which can quickly and accurately perform inspection of a semiconductor PCB through quick and accurate determination of a failure reason through double- ≪ / RTI >

Recently, the development of semiconductor technology and the reduction of the semiconductor wiring width to the nano unit have further reduced the wiring width of the printed circuit board (PCB) that seats the semiconductor. In addition, as the number of semiconductor fins increases due to the expansion of various functions of semiconductors, it has become very important for the reliability of the entire system including the semiconductor to check the normal / defective of the semiconductor PCB clearly.

1 shows a semiconductor PCB (Printed Circuit Board). In general, one semiconductor PCB is composed of 80 to 120 PCB cells 20.

2 shows a conventional semiconductor PCB inspection step. In the step of inspecting the semiconductor PCB, it is an inspecting step to determine normal / defect of 80 to 120 internal cells. The inspection of the existing semiconductor PCB consists of the following six steps in total.

- Step 1: First Vision Scan Test

- Step 2: Second Vision Inspection Inspection

- Phase 3: Final judgment by a third microscope

Step 4: Laser marking step

- Step 5: Dust and dust cleaning step

- Step 6: Identify the final quantity

In the first step (first vision scan test), the semiconductor PCB 120 is scanned as a whole using a vision camera. In the first step, it is firstly determined whether 80 to 120 PCB cells (20) within one semiconductor PCB are defective.

In the second step (the second vision check), a PCB 20 is mounted on a semiconductor mobile device that moves the semiconductor PCB 120 along the X axis and the Y axis using a vision camera, The detailed reason for the failure is judged specifically. The first side (front side) of the semiconductor PCB 120 is connected to a second side (front side) of the semiconductor PCB 120 to identify a second side (back side) opposite to the first side It is necessary to pass the semiconductor PCB 120 manually by the user after the confirmation of the vision. And the second side (back side) completes the second vision check. In the second step, the detailed reason for the PCB 20 is determined by the help of the computer.

However, the reason for the failure may not be clear in the second vision verification test of the semiconductor PCB 120, and in this case, the third step (the final judgment by the third microscope) is performed.

In the third step (the final judgment by the person using the third microscope), the computer read out from the first step (first vision scan test) and the second step (second vision check) The person (the inspector) observes the ambiguous reason for failure with a microscope and confirms the final reason for the failure.

In the conventional semiconductor PCB inspection step, the first step (first vision scan test), the second step (second vision confirmation test), and the third step (the third step ) Of the PCB 120 to determine whether the PCB 20 is normal or defective.

In the fourth step (laser marking step), the PCB 20 inside the semiconductor PCB 120 is defective. When the PCB 20 is not suitable for use, the center of the PCB 20 is marked with a laser, The side rail mark 10 is performed on the semiconductor PCB 120. This is a part for marking information on which row (row) and column (column) of the PCB 20 in the semiconductor PCB 120 is defective by performing laser marking on the side rail .

In the fifth step (dust collecting and dust cleaning step), cleaning is performed by using water to remove dust and dust caused by laser marking in the fourth step.

In the sixth step (final counting step), final counts of the normal PCB cells and the defective PCB cells in the side rail mark 10 are finally determined using a vision system.

FIG. 3 shows a conventional semiconductor PCB inspection step-by-step equipment. In the first step, a first vision scan test equipment is required. In the second step, a second vision scan test equipment is required on the semiconductor mobile equipment moving in the X-axis and the Y axis. At the stage, you need a microscope that you can check yourself. In the fourth step, a laser marking equipment for displaying information on the defective PCB cell and the side rail mark 10 is required. In the fifth step, water is used to remove dust and dust caused by laser marking Cleaning equipment is required. Finally, in the 6th step, a quantity identification device is required to use the vision system to grasp the final quantity of the normal PCB cell and the defective PCB cell.

[Patent Document 1] Korean Patent Laid-Open Publication No. 10-2016-0034491, Publication Date 2016.03.30. [Patent Document 2] Korean Registered Patent Application No. 10-0910705, Published on Aug. 4, 2009. [Patent Document 3] Korean Registered Patent No. 10-1431917, Published Date 2014.08.12. Patent Document 1 discloses a semiconductor inspection equipment including an ion beam milling unit for irradiating a cluster ion beam onto the surface of a sample wafer to etch the surface of the sample wafer and an image measuring unit for measuring an image of the etched surface . [Patent Document 2] discloses a semiconductor material defect inspection apparatus for identifying and transporting defective materials through inspection of the bottom (molding surface) and the plane (SIP surface) of the materials transferred in the cleaning process. Patent Document 3 discloses an inspection apparatus for inspecting a semiconductor package by irradiating a plurality of lights with light from various angles at the same time.

In the present invention, the progress of the conventional semiconductor PCB inspection is composed of six steps, but it is a task to solve the problem of performing fast and accurate semiconductor PCB inspection in which the total of four steps is reduced to two steps. That is, The present invention proposes a semiconductor PCB inspection equipment and inspection method that can quickly and accurately perform inspection of a semiconductor PCB through a quick and accurate determination of the cause of the defect.

In the present invention, the progress of the conventional semiconductor PCB inspection is performed in six stages, but it is for carrying out a fast semiconductor PCB inspection in which the total of four stages is reduced to two stages. In the conventional semiconductor PCB inspection, And the fourth step (laser marking step) of the first step (the second step (second vision check) + the third step (the final judgment of the person by the third microscope) + the fourth step The present invention provides a semiconductor PCB inspection equipment and inspection method.

In the second and third steps of the conventional semiconductor PCB inspection step, the first PCB (front surface) of the semiconductor PCB 120 is subjected to a second vision confirmation inspection, It is necessary to turn the hand over with the hand, thereby prolonging the inspection time of the semiconductor PCB, and the unexpected PCB cell 20 may be defective due to the human hand being closed to the semiconductor PCB.

In the present invention, a semiconductor PCB inspection equipment 100 for improving such a part is proposed. The most important feature of this equipment is that it can shoot both sides simultaneously without turning the semiconductor PCB upside down. A first camera 110 (1) for photographing a first surface (front surface) of the semiconductor PCB and a second camera 110 (2) for photographing a second surface (back surface) of the semiconductor PCB do. In addition, the semiconductor PCB inspection apparatus 100 is configured to detect the image of the first and second cameras 110 (1) and 110 (2) that photograph the first side (front side) and the second side The reason for the failure is determined by comparing the Big Data image with various artificial intelligence programs (AI (Artificial Intelligence) program). Based on this, the defective PCB cell 20 and the side rail ) Is integrated with the laser equipment 112 for laser marking, which enables fast and accurate semiconductor PCB inspection.

The present invention can simultaneously photograph the first side (front side) and the second side (back side) of the semiconductor PCB, without simultaneously turning the semiconductor PCB to a human hand (or a mechanical device) The reason for the failure is determined quickly and precisely. Since the laser devices 112 for laser marking are incorporated in the defective PCB cell 20 and the side rail, the process steps are reduced, There is an improved effect that can be examined.

In addition, if the PCB 20 of the inspected semiconductor PCB 120 is (1) partially defective (2) non-defective (if there is no defect) and (3) Therefore, each of the semiconductor PCB loading boxes 114, 115, and 116 after the first, second, and third inspections using the second picker 113 respectively has an improved effect in subsequent processes. In this way, the PCB 20 of the semiconductor PCB 120 is divided into (1) defective part (2) defective defect, and (3) In the step of grasping the final quantity of the normal PCB cell and the defective PCB cell in the side rail mark 10 using the invisible vision system, In this case, there is no need to use the Vision system to determine the quantity, so that it is possible to more quickly and efficiently grasp the final quantity of the normal PCB cell and the defective PCB cell.

1 shows a semiconductor PCB (Printed Circuit Board)
FIG. 2 is a cross-
FIG. 3 is a diagram illustrating a conventional semiconductor PCB inspection step-by-
Fig. 4 is a graph showing a relationship between a metal defect (first defect of a semiconductor PCB)
Fig. 5 is a cross-sectional view showing a protrusion (second defective semiconductor PCB)
Fig. 6 is a schematic diagram showing a pin hole (third defective semiconductor PCB)
FIG. 7 is a graph showing the results of copper (Cu) exposure (fourth defective semiconductor PCB)
FIG. 8 is a schematic view showing a state in which plating plating or plated lump (the fifth bad semiconductor PCB)
Figure 9 shows the pit or dent (sixth semiconductor PCB failure)
Fig. 10 is a schematic view showing a case where scratches (the seventh defective semiconductor PCB)
11 shows cracks (8th defect of semiconductor PCB)
FIG. 12 is a graph showing the relationship between discolor or stain (9th defect of semiconductor PCB)
Fig. 13 is a graph showing the relationship between a foreign substance (10th defect of semiconductor PCB)
Fig. 14 is a graph showing the results of measurement of nickel (Ni)
Fig. 15 is a schematic view showing a solder resist (Blistering)
FIG. 16 is a graph showing the relationship between solder-resist overflow (semiconductor PCB 13 defects)
FIG. 17 shows a state in which a solder-resist drop (a semiconductor substrate 14 defective)
FIG. 18 shows the misalignment (misalignment) of the via-hole (semiconductor PCB 15th defect)
FIG. 19 is a flowchart illustrating a conventional semiconductor PCB inspection step and a proposed semiconductor PCB inspection step
FIG. 20 is a cross-
FIG. 21 is a diagram showing the entire skeleton (first inspection example) of the proposed semiconductor PCB inspection equipment,
22 is a schematic view of the proposed semiconductor PCB inspection table (first inspection table embodiment)
23 shows the detailed structure (front view and side view) of the proposed semiconductor PCB inspection equipment (first inspection stand embodiment)
FIG. 24 is a diagram showing the entire skeleton (second inspection example) of the proposed semiconductor PCB inspection equipment,
25 shows the proposed semiconductor PCB test stand (second test stand embodiment)
26 is a detailed structure (front view and side view) of the proposed semiconductor PCB inspection equipment (the second inspection unit embodiment)
Fig. 27 is a diagram showing the arrangement of the laminated glass substrates (first, second, and third glass substrates) for moving the semiconductor PCB in the X-
Fig. 28 shows a device for moving the semiconductor PCB in the X-axis-Y-axis moving band
FIG. 29 shows a device for moving the semiconductor PCB in the X-axis-Y-axis moving band (first moving example)
30 shows a device for moving a semiconductor PCB in an X-axis-Y-axis moving band (first moving example)
31 shows the arrangement of the laminated glass substrates (the first and third glass substrates) for moving the semiconductor PCB in the X-axis-Y-axis moving band
32 shows a device for moving the semiconductor PCB in the X-axis-Y-axis moving band (second moving example)
FIG. 33 shows a device for moving the semiconductor PCB in the X-axis-Y-axis moving table (second moving-example embodiment)
Fig. 34 shows a device for moving the semiconductor PCB in the X-axis-Y-axis moving band (second moving example)

The present invention will now be described in detail with reference to the accompanying drawings.

FIGS. 4 through 18 illustrate fifteen typical defects of the semiconductor PCB 120. FIG.

4 shows a metal (metal) defect due to the first defect of the semiconductor PCB. The metal defects are defects such that the metal of the circuit portion is lapped or excessively etched.

FIG. 5 shows a second defect of a semiconductor PCB to indicate a protrusion. The protrusion is a defect that protrudes perpendicularly or horizontally to the substrate.

6 shows a pin hole due to the third defect of the semiconductor PCB. The pinhole is defective with a small hole in the land or metal wiring.

Figure 7 shows copper (Cu) exposure to a fourth defect in a semiconductor PCB. The copper (Cu) exposure is a defect in which the copper (Cu) is exposed while the gold plating layer is peeled off.

Fig. 8 shows a plating failure or plating hump due to the fifth defect of the semiconductor PCB. And the foreign material or plating is aggregated in the plating lump or the plating or plating site to become a lump.

9 shows pits or dents by the sixth defect of the semiconductor PCB. The pit occurs in the gold plating process and has a circular shape with a small size. The dent is a defect in a state in which the semiconductor PCB 120 is pressed or pressed by another object.

10 shows a scratch due to the seventh defect of the semiconductor PCB. The scratch is a defect in a state in which the semiconductor PCB 120 is scratched by another object.

11 shows cracks due to the eighth defect of the semiconductor PCB. The crack is a defect that the semiconductor PCB 120 is cracked or cracked.

12 is a ninth defect of the semiconductor PCB, which indicates discoloration or stain. The discolor is defective when the semiconductor PCB 120 is changed to a color other than the intrinsic color, and the stain is a defective color of the substrate due to the chemical reaction of the organic material that can not be removed.

13 shows a foreign substance due to the tenth defect of the semiconductor PCB. The foreign matter is a defect that a foreign substance is attached to the semiconductor PCB 120, not a unique material.

14 shows the appearance of nickel (Ni) due to the eleventh failure of the semiconductor PCB. The nickel (Ni) coating is a defect that the gold plating layer is peeled off and the nickel (Ni) below the coating is exposed

15 shows solder-resist flicker due to the twelfth defect of the semiconductor PCB. The solder-resist blistering is a defect that the solder resist does not adhere to the semiconductor PCB 120.

16 shows solder-resist overflow due to the 13th defect of the semiconductor PCB. The solder-resist overflow is a defect in which the solder resist has invaded the plating site.

FIG. 17 shows solder-resist dropout at the 14th defect of the semiconductor PCB. The solder-resist dropout is a defect that the solder-resist is not necessarily present.

Figure 18 shows via-hole misalignment due to the fifteenth failure of the semiconductor PCB. The misalignment of the via-holes is a defect that the via-holes are out of the correct land position.

4 to 18 illustrate fifteen typical defects of the semiconductor PCB 120. In the present invention, the first surface (front surface) and the second surface (back surface) of the semiconductor PCB are simultaneously photographed, and the Big Data ) Is used as the most important technical feature to judge the cause of the defect quickly and accurately compared with the images and the numerous existing defects.

Figure 19 compares the steps of testing a conventional semiconductor PCB and a testing of a proposed semiconductor PCB. Although the conventional semiconductor PCB inspection process consists of six steps, the proposed semiconductor PCB inspection step is for carrying out a fast semiconductor PCB inspection in which the total of four steps and two steps are reduced. (The second step of the second vision inspection) + the third step (the final judgment of the person by the third microscope) + the fourth step Marking step) can be carried out in one integrated manner by providing an improved semiconductor PCB inspection equipment.

20 shows the proposed semiconductor PCB inspection step.

- Step 1: First Vision Scan Test

- Phase 2: Vision II Artificial intelligence (AI) Final decision and laser marking phase

- Stage 3: Dust and dust cleaning stage

- Step 4: Identify the final quantity

In the first step (first vision scan test), the semiconductor PCB 120 is scanned as a whole using a vision camera. In the first step, it is firstly determined whether 80 to 120 PCB cells (20) within one semiconductor PCB are defective.

In the second step (second vision artificial intelligence (AI) final determination and laser marking step), in the conventional semiconductor PCB inspection, in the second step to the fourth step (the second step (Final confirmation by the third microscope) + the fourth step (laser marking step)] is performed in a single step. The semiconductor PCB inspection table 200 of the semiconductor PCB inspection apparatus 100 has a slope of 40 degrees to 60 degrees and includes a first camera 110 for photographing a first surface (front surface) of the semiconductor PCB 120, (1)), and a second camera (110 (2)) for photographing a second side (back side) of the semiconductor PCB (120). The semiconductor PCB inspection apparatus 100 includes first and second cameras 110 (1) and 110 (2) for photographing a first surface (front surface) and a second surface (rear surface) Cell 20 and side rail are integrated with laser equipment 112 for laser marking, it is possible to quickly and accurately determine the reason for failure of a semiconductor PCB and to perform laser marking.

In the third step (dust collecting and dust cleaning step), cleaning is performed using water to remove dust, dust and the like caused by laser marking in the second step.

Finally, in the fourth step (final counting step), final counts of the normal PCB cells and the defective PCB cells in the side rail mark 10 are determined using a vision system.

Fig. 21 shows the entire skeleton (first inspection zone embodiment) of the proposed semiconductor PCB inspection equipment 100. Fig. The semiconductor PCB inspection apparatus 100 has a horizontal structure in which the semiconductor PCB inspection table 200 is disposed.

22 shows a proposed semiconductor PCB test stand 200 (first test stand embodiment) arranged horizontally.

23 shows the detailed structure (front view and side view) (first inspection stand embodiment) of the proposed semiconductor PCB inspection equipment.

Referring to the side view of FIG. 22 and FIG. 23, the proposed semiconductor PCB inspection table 200 is horizontally disposed.

23, the PCB inspection apparatus 100 includes a semiconductor PCB 120 to be inspected in the inspection standby semiconductor PCB loading box 106. In FIG. The semiconductor PCB 120 to be inspected is moved to the semiconductor PCB loading box 106 using the first picker 107 to the semiconductor PCB X axis-Y axis moving table 108. That is, the semiconductor PCB 120 is moved from position 1 to position 2. The semiconductor PCB X-Y-axis moving table 108 moves the semiconductor PCB 120 in the X-axis and Y-axis, and moves it from the ② position to the ③, ④, and ⑤ position. The first camera (X-Y axis) moves from the second position to the third position, and the third camera moves from the first camera (120) to the first camera And the second camera 110 (2) that photographs the second surface (back surface) of the semiconductor PCB 120 simultaneously and transmits the image to the computer. More specifically, in order to observe the detailed reason of 80 to 120 PCB cells 20 of the semiconductor PCB 120, the PCB X-Y-axis moving band 108 moves precisely in the X-axis and Y-axis As a technical feature.

4 to 18 are diagrams showing examples of the fifteen representative defects and various defects of the semiconductor PCB 120 and storing them as Big Data. The first surface (front surface) of the semiconductor PCB 120 and the second surface (Back side) and the above-mentioned Big Data and Big Data images about the defective and various defects are compared with the AI (Artificial Intelligence) program in the computer (not shown) It is a technical feature to judge quickly and accurately.

In addition, the semiconductor PCB X-Y-axis moving table 108 moves from the third position to the fourth position, and at the fourth position, the defective PCB cell 20 and the side Perform laser marking on the rail (Side Rail).

Thereafter, the semiconductor PCB X-Y-axis moving table 108 moves from the fourth position to the fifth position, and at the fifth position, the semiconductor PCB 120 moves along the semiconductor PCB 120 after the first, 115, and 116, respectively.

If there is a defect in the PCB 20 of the semiconductor PCB 120, the semiconductor PCB loading box 114 after the first inspection is moved from the fifth position to the second position using the second picker 113 And moves to the semiconductor PCB loading box 114 (position 6) after the first inspection.

When the PCB 20 of the semiconductor PCB 120 is free of defects (ie, no defects), the semiconductor PCB loading box 115 after the second inspection has a second picker 113 To the semiconductor PCB loading box 115 (the sixth position) after the second inspection at the fifth position.

When the PCB 20 of the semiconductor PCB 120 is not properly inspected, the semiconductor PCB loading box 116 after the third inspection is moved to the position 5 of the PCB using the second picker 113 To the semiconductor PCB loading box 116 (position 6) after the third inspection.

In the side view of FIG. 23 (first inspection example), the semiconductor PCB 120 is disposed on a laminated glass substrate 121 or 314 made of two or three sheets.

24 shows the entire skeleton of the proposed semiconductor PCB inspection equipment 100 (the second inspection unit embodiment). In the semiconductor PCB inspection apparatus 100, the semiconductor PCB inspection table 200 is arranged at a slope of 40 degrees to 60 degrees.

Fig. 25 (second inspection example) shows a proposed semiconductor PCB inspection table 200 tilted at a slope of 40 to 60 degrees.

26 shows a detailed structure (front view and side view) of the proposed semiconductor PCB inspection equipment.

Referring to the side view of FIG. 25 and FIG. 26, it is a technical feature that the angle A of the proposed semiconductor PCB inspection table 200 has a slope of 40 degrees to 60 degrees.

26, the PCB inspection apparatus 100 includes a semiconductor PCB 120 to be inspected in the inspection standby semiconductor PCB loading box 106. In this case, The semiconductor PCB 120 to be inspected is moved to the semiconductor PCB loading box 106 using the first picker 107 to the semiconductor PCB X axis-Y axis moving table 108. That is, the semiconductor PCB 120 is moved from position 1 to position 2. The semiconductor PCB X-Y-axis moving table 108 moves the semiconductor PCB 120 in the X-axis and Y-axis, and moves it from the ② position to the ③, ④, and ⑤ position. The first camera (X-Y axis) moves from the second position to the third position, and the third camera moves from the first camera (120) to the first camera And the second camera 110 (2) that photographs the second surface (back surface) of the semiconductor PCB 120 simultaneously and transmits the image to the computer. More specifically, in order to observe the detailed reason of 80 to 120 PCB cells 20 of the semiconductor PCB 120, the PCB X-Y-axis moving band 108 moves precisely in the X-axis and Y-axis As a technical feature.

4 to 18 are diagrams showing examples of the fifteen representative defects and various defects of the semiconductor PCB 120 and storing them as Big Data. The first surface (front surface) of the semiconductor PCB 120 and the second surface (Back side) and the above-mentioned Big Data and Big Data images about the defective and various defects are compared with the AI (Artificial Intelligence) program in the computer (not shown) It is a technical feature to judge quickly and accurately.

In addition, the semiconductor PCB X-Y-axis moving table 108 moves from the third position to the fourth position, and at the fourth position, the defective PCB cell 20 and the side Perform laser marking on the rail (Side Rail).

Thereafter, the semiconductor PCB X-Y-axis moving table 108 moves from the fourth position to the fifth position, and at the fifth position, the semiconductor PCB 120 moves along the semiconductor PCB 120 after the first, 115, and 116, respectively.

If there is a defect in the PCB 20 of the semiconductor PCB 120, the semiconductor PCB loading box 114 after the first inspection is moved from the fifth position to the second position using the second picker 113 And moves to the semiconductor PCB loading box 114 (position 6) after the first inspection.

When the PCB 20 of the semiconductor PCB 120 is free of defects (ie, no defects), the semiconductor PCB loading box 115 after the second inspection has a second picker 113 To the semiconductor PCB loading box 115 (the sixth position) after the second inspection at the fifth position.

When the PCB 20 of the semiconductor PCB 120 is not properly inspected, the semiconductor PCB loading box 116 after the third inspection is moved to the position 5 of the PCB using the second picker 113 To the semiconductor PCB loading box 116 (position 6) after the third inspection.

In the side view of FIG. 26 (the second inspection unit embodiment), the semiconductor PCB 120 is disposed on a laminated glass substrate 121 or 314 composed of two or three sheets.

27 shows the arrangement of the laminated glass substrates (first, second and third glass substrates) 302, 303 and 304 for moving the semiconductor PCB 120 or 301 in the X axis-Y axis moving table 108 ). The laminated glass substrate 121 or 314 is made up of three glass substrates as its greatest technical characteristic.

A first camera 110 (1) that photographs a first surface (front surface) of the semiconductor PCB 120 while allowing the semiconductor PCB 120 or 301 to move freely in the X axis-Y axis moving table 108, Three transparent glass substrates are used for smooth photographing of the second camera 110 (2) that photographs the second surface (back surface) of the PCB 120. [

A plurality of holes 305 are arranged at regular intervals on the first glass substrate 302 and the rim of the second glass substrate 303 is divided into a plurality of partitions A plurality of outer vacuum passages 307 are provided between the partition 306 and the partition walls 306 and a central vacuum passage 308 is formed at the center of the second glass substrate 303 , And an opening 309 is present at one end of the second glass substrate 303. The third glass substrate 304 is a flat glass substrate.

The first, second, and third glass substrates 302, 303, and 304 are bonded to each other to form a laminated glass substrate 121 or 314, and a semiconductor PCB 301 is placed thereon.

Figs. 27 to 30 (first movement example) are apparatus for moving the semiconductor PCB in the X-axis-Y-axis movement table 108, and the left, right, A glass substrate fixing table 310 and a right glass substrate fixing table 311. The right glass substrate fixing table 311 is connected to a vacuum control device 313 through a vacuum tube 312 .

Accordingly, the semiconductor PCB 120 or 301 is not limited to the X-Y-Y-axis moving table 108 (the first moving example of FIGS. 21-23) but also the X- The semiconductor PCB 120 or 301 must be fixed to the laminated glass substrate 121 or 314 in order to move freely without slipping even in the case of the semiconductor substrate 108 (the second moving embodiment of Figs. 24 to 26) .

When the semiconductor PCB 120 or 301 to be inspected of the inspection standby semiconductor PCB loading box 106 is moved to the laminated glass substrate 121 or 314 disposed on the semiconductor PCB X axis-Y axis moving table 108, The vacuum control device 313 begins to make a vacuum to fix the semiconductor PCB 120 or 301 to the laminated glass substrate 121 or 314 so that the outer vacuum passage 307 and the central vacuum passage 308 are evacuated (眞 空) is made. A plurality of holes 305 of the first glass substrate 302 are disposed on the outer vacuum path 307 of the second glass substrate 303 to form a plurality of holes 305, The semiconductor PCB 120 or 301 is attached to the laminated glass substrate 121 or 314 through a plurality of holes 305 arranged at regular intervals in one glass substrate 302. [

28 to 30 (first movement example) of the present invention, an opening 309 is present on the right side (right side) of the second glass substrate 303, and the vacuum tube The vacuum control device 313 is disposed through the vacuum control valve 312, but it is possible to easily change the vacuum control device 313 to a different direction (left side, etc.) if the vacuum control device 313 has a general knowledge in the technical field.

The semiconductor PCB 120 or 301 is attached to the laminated glass substrate 121 or 314 and moved to the semiconductor PCB 120 or 314 even if the semiconductor PCB 120 moves in the X- (Back side) of the semiconductor PCB 120 and the first camera 110 (1) that photographs the first side (front side) of the semiconductor PCB 120 and the second camera 110 .

In addition, the image captured by the first camera 110 (1) and the second camera 110 (2), and the Big Data and the AI (Artificial Intelligence) And a semiconductor PCB inspection table 200 on which the semiconductor PCB X-Y-axis moving table 108 is disposed is determined by comparing a plane (the first moving example in FIGS. 21 to 23) or an inclined angle (A) is arranged at a slope of 40 to 60 degrees (the second moving embodiment of FIGS. 24 to 26), and the defective PCB cell 20 and the side rail Vision Artificial Intelligence (AI) final marking and laser marking step of performing laser marking on the rail and the rail are performed, the vacuum control device 313 relaxes the vacuum, The semiconductor PCB 120 and 301 are moved to the semiconductor PCB loading boxes 114, 115 and 116 after the first, And by the technical features.

31 shows the arrangement (second moving example) of the laminated glass substrates (first and third glass substrates) 302 and 304 for moving the semiconductor PCB 120 or 301 in the X axis-Y axis moving table 108 . The laminated glass substrate 121 or 314 is made up of two glass substrates as its greatest technical characteristic.

A first camera 110 (1) that photographs a first surface (front surface) of the semiconductor PCB 120 while allowing the semiconductor PCB 120 or 301 to move freely in the X axis-Y axis moving table 108, Two transparent glass substrates are used for smooth photographing of the second camera 110 (2) for photographing the second surface (back surface) of the PCB 120. [

In particular, the first glass substrate 302 has a plurality of holes 305 arranged at regular intervals, and the third glass substrate 304 is a flat glass substrate. In the second moving example, the second glass substrate is not provided. In place of the second glass substrate, the second glass substrate is fixed to the first glass substrate through the fixing bars 310, 311, 314, 315 of the left, right, The first glass substrate 302 and the third glass substrate 304 are kept at a constant interval.

The first and third glass substrates 302 and 304 are bonded to each other to form a laminated glass substrate 121 or 314, and a semiconductor PCB 301 is placed thereon.

32 to 34 (second moving example) of the present invention are devices for moving the semiconductor PCB in the X-axis-Y-axis moving table 108, wherein the first and third glass substrates 302 and 304 are arranged on the left and right sides And the upper glass substrate fixing table 311 is connected to the vacuum control device 313 through the vacuum tube 312. The vacuum control device 313 is connected to the vacuum control device 313 .

Accordingly, the semiconductor PCB 120 or 301 is not limited to the X-Y-Y-axis moving table 108 (the first moving example of FIGS. 21-23) but also the X- The semiconductor PCB 120 or 301 must be fixed to the laminated glass substrate 121 or 314 in order to move freely without slipping even in the case of the semiconductor substrate 108 (the second moving embodiment of Figs. 24 to 26) .

When the semiconductor PCB 120 or 301 to be inspected of the inspection standby semiconductor PCB loading box 106 is moved to the laminated glass substrate 121 or 314 disposed on the semiconductor PCB X axis-Y axis moving table 108, The vacuum control device 313 begins to make a vacuum to fix the semiconductor PCB 120 or 301 to the laminated glass substrate 121 or 314 so that the outer vacuum passage 307 and the central vacuum passage 308 are evacuated (眞 空) is made. The inside of the first glass substrate 302 and the inside of the third glass substrate 304 are in a vacuum state so that the first glass substrate 302 has a plurality of The semiconductor PCB 120 or 301 is attached to the laminated glass substrate 121 or 314 through the hole 305 of the glass substrate 121 or 314.

32 to 34 (second moving embodiment) of the present invention, the vacuum control device 313 is disposed through the vacuum tube 312 through the right glass substrate fixing table 311, , Upper side, lower side, etc.) can be easily changed if they have the usual knowledge in the technical field.

The semiconductor PCB 120 or 301 is attached to the laminated glass substrate 121 or 314 and moved to the semiconductor PCB 120 or 314 even if the semiconductor PCB 120 moves in the X- (Back side) of the semiconductor PCB 120 and the first camera 110 (1) that photographs the first side (front side) of the semiconductor PCB 120 and the second camera 110 .

In addition, the image captured by the first camera 110 (1) and the second camera 110 (2), and the Big Data and the AI (Artificial Intelligence) And a semiconductor PCB inspection table 200 on which the semiconductor PCB X-Y-axis moving table 108 is disposed is mounted on a flat X-Y-axis moving table 108 (see FIGS. 21 to 23 Axis movement table 108 (the second movement embodiment in Figs. 24 to 26) inclined at 40 to 60 degrees, as well as the laser apparatus 112 A second vision artificial intelligence (AI) final judgment and a laser marking step for performing laser marking on a defective PCB cell 20 and a side rail using a laser beam The vacuum control device 313 relaxes the vacuum and uses the second picker 113 to transfer the semiconductor PCB 120 and 301 to the first, 3, and then moved to the semiconductor PCB loading boxes 114, 115, and 116. FIG.

In the present invention, a suitable vacuum degree for attaching the semiconductor PCB 120 or 301 to the laminated glass substrate 121 or 314 is suitably in the range of 0.1 to 0.5 [MPa] (megapascals).

The present invention relates to a semiconductor PCB inspection equipment, comprising: a semiconductor PCB (120 or 301) having a plurality of PCB cells (20); A first glass substrate 302 to which the semiconductor PCB 301 is attached; a plurality of holes 305 are arranged at regular intervals in the first glass substrate 302; A third glass substrate 304 spaced apart from the first glass substrate 302 at a constant interval; the third glass substrate 304 is a flat glass substrate; Fixing boards 310, 311, 314, 315 of the left, right, upper and lower glass substrates for spacing and fixing the first and third glass substrates 302, 304 at a constant interval; The first and third glass substrates 302 and 304 form a laminated glass substrate 314 and are connected to a semiconductor PCB X axis-Y axis moving table 108 for moving the laminated glass substrate 314 in the X axis- ; A vacuum control device 313 connected to a specific glass substrate fixing table among the fixing tables 310, 311 and 314 315 of the left, right, upper and lower glass substrates, the vacuum control device 313, And a plurality of holes 305 of the first glass substrate 302 are disposed between the third glass substrate 304 and the third glass substrate 304. The first glass substrate 302 has a plurality of holes 305, A suction force is generated in a plurality of holes 305 arranged at regular intervals on the glass substrate 302 so that the semiconductor PCB 301 is attached to the laminated glass substrate 314. [ I want to.

In addition, in the semiconductor PCB inspection equipment, a semiconductor PCB 120 or 301 having a plurality of PCB cells 20; A first glass substrate 302 to which the semiconductor PCB 301 is attached; a plurality of holes 305 are arranged at regular intervals in the first glass substrate 302; A second glass substrate 303 in contact with the first glass substrate 302 has a rim of the second glass substrate 303 with a plurality of barrier ribs 306, A plurality of external vacuum passages 307 are provided between the second glass substrate 303 and a central vacuum passage 308 at the center of the second glass substrate 303. One end of the second glass substrate 303 An opening 309 is present; A third glass substrate 304 in contact with the second glass substrate 303; the third glass substrate 304 is a flat glass substrate; The first, second, and third glass substrates 302, 303, and 304 are superposed to form a laminated glass substrate 314, and a semiconductor PCB X-Y axis movement (108); A left glass substrate fixing table 310 and a right glass substrate fixing table 311 for fixing the laminated glass substrate 314; The left glass substrate fixing table 310 or the right glass substrate fixing table 311 is connected to a vacuum control device 313 via a vacuum tube 312. The vacuum control device 313 is connected to the first glass substrate 302, And the central vacuum passage 308 and the outer vacuum passage 307 and the central vacuum passage 308 of the second glass substrate 303 located between the first glass substrate 302 and the third glass substrate 304 are vacuumed, A suction force is generated in a plurality of holes 305 arranged at regular intervals on the first glass substrate 302 due to the vacuum, And the PCB 301 is attached to the laminated glass substrate 314.

The inclined angle A of the semiconductor PCB inspection table 200 on which the semiconductor PCB X-axis and Y-axis moving table 108 is disposed is set at a slope of 40 to 60 degrees or the angle A is 0 (Arrangement).

Further, in the semiconductor PCB inspection step,

First, the semiconductor PCB 120 or 301 is scanned as a whole using a vision camera to determine whether a PCB cell 20 inside the semiconductor PCB 120 or 301 is defective or not, A first vision scan test step for judging the first vision vision;

Second step: The semiconductor PCB 120 or 301 is moved in the X axis-Y axis by using the semiconductor PCB X axis-Y axis moving table 108 and the first surface (front surface ) Of the semiconductor PCB 120 or 301 by using the first camera 110 (1) that photographs the semiconductor PCB 120 or 301 and the second camera 110 (2) that photographs the second surface (back surface) And detects images of PCB cells 20 of the first camera 110 (1) and the second camera 110 (2) A first glass substrate 302 to which the semiconductor PCB 120 or 301 is attached is compared with a Big Data image by an artificial intelligence (AI) program to determine the cause of the failure. The substrate 302 has a plurality of holes 305 arranged at regular intervals and a third glass substrate 304 spaced apart from the first glass substrate 302 by a predetermined distance,The rear substrate 304 is a flat glass and has fixing tables 310, 311 and 314 315 of left, right, upper and lower glass substrates for separating and fixing the first and third glass substrates 302 and 304 at a predetermined interval, 1,3 Glass substrates 302 and 304 form a laminated glass substrate 314 and include a semiconductor PCB X-Y axis moving table 108 for moving the laminated glass substrate 314 in the X-axis and Y-axis directions; Vision for artificial intelligence (AI) final determination and laser marking for performing laser marking on a defective PCB cell (20) and a side rail using a laser device (112) step;

(3) washing with water in order to remove dust, dust and the like caused by laser marking in the second step;

Step 4: Determining the final quantity of the normal PCB cell and the defective PCB cell in the side rail mark 10 by using a vision system. .

In another semiconductor PCB inspection step,

First, the semiconductor PCB 120 or 301 is scanned as a whole using a vision camera to determine whether a PCB cell 20 inside the semiconductor PCB 120 or 301 is defective or not, A first vision scan test step for judging the first vision vision;

Second step: The semiconductor PCB 120 or 301 is moved in the X axis-Y axis by using the semiconductor PCB X axis-Y axis moving table 108 and the first surface (front surface ) Of the semiconductor PCB 120 or 301 by using the first camera 110 (1) that photographs the semiconductor PCB 120 or 301 and the second camera 110 (2) that photographs the second surface (back surface) And detects images of PCB cells 20 of the first camera 110 (1) and the second camera 110 (2) A first glass substrate 302 to which the semiconductor PCB 120 or 301 is attached is compared with a Big Data image by an artificial intelligence (AI) program to determine the cause of the failure. The substrate 302 has a plurality of holes 305 arranged at regular intervals and a second glass substrate 303 in contact with the first glass substrate 302, TED A plurality of external vacuum passages 307 are provided between the partition 306 and the partition 306. A central vacuum chamber 307 is formed at the center of the second glass substrate 303, And a third glass substrate 304 in contact with the second glass substrate 303. The third glass substrate 304 has an opening 309 at one end of the second glass substrate 303, 3 glass substrate 304 is a flat glass substrate and the first, second and third glass substrates 302, 303 and 304 are combined to form a laminated glass substrate 314. The laminated glass substrate 314 is aligned in the X- A Y-axis movable base 108 for moving a semiconductor PCB; Vision for artificial intelligence (AI) final determination and laser marking for performing laser marking on a defective PCB cell (20) and a side rail using a laser device (112) step;

(3) washing with water in order to remove dust, dust and the like caused by laser marking in the second step;

Step 4: Determining the final quantity of the normal PCB cell and the defective PCB cell in the side rail mark 10 by using a vision system. .

The PCB 120 is disposed on the laminated glass substrate 121 for simultaneously photographing the first surface (front surface) and the second surface (rear surface) of the semiconductor PCB 120 in the PCB X-Y-axis moving table 108.

A first camera 110 (1) for photographing a first surface (front surface) of the semiconductor PCB 120 and a second camera 110 (2) for photographing a second surface (back surface) of the semiconductor PCB 120 ) Are simultaneously photographed on the first surface (front surface) and the second surface (rear surface) of the semiconductor PCB 120. [

If there is some defect in the PCB 20 of the semiconductor PCB 120, the semiconductor PCB 120 is moved to the semiconductor PCB loading box 114 after the first inspection using the second picker 113, When the PCB 20 of the semiconductor PCB 120 is free of defects (ie, there is no defect), the second PCB 115 is removed from the second PCB 115 using the second picker 113 If the PCB 20 of the semiconductor PCB 120 is not properly inspected, the semiconductor PCB loading box 116 is moved after the third inspection using a second picker 113 The present invention relates to a semiconductor PCB inspection apparatus,

The PCB 20 of the semiconductor PCB 120 may be partially or completely defective (if there is no defect) and (3) if it is not properly inspected. Moving each of the semiconductor PCB loading boxes 114, 115 and 116 after the first, second and third inspection using the second picker 113 has an improved effect in subsequent processes. In this way, the PCB 20 of the semiconductor PCB 120 is divided into (1) defective part (2) defective defect, and (3) In the step of grasping the final quantity of the normal PCB cell and the defective PCB cell in the side rail mark 10 using the invisible vision system, In this case, there is no need to use the Vision system to determine the quantity, so that it is possible to more quickly and efficiently grasp the final quantity of the normal PCB cell and the defective PCB cell.

The present invention can be applied to semiconductor PCB inspection equipment and inspection methods by various modifications by a person having ordinary skill in the art, and it should be admitted that the scope of the technology which easily transforms technically belongs to the scope of the present patent will be.

10: Side Rail Mark
20: PCB cell (Cell)
100: Semiconductor PCB inspection equipment
101: First picker conveying rail
102: 2nd picker conveying rail
104: First picker pedestal
105: second picker pedestal
106: Waiting for Semiconductor PCB Loading
107: First picker (Picker)
108: Semiconductor PCB X-Y axis movement
109: First camera stand
110 or 110 (1): first camera
110 (2): the second camera
111: Laser equipment stand
112: Laser equipment
113: Picker 2 (Picker)
114: Semiconductor PCB loading box after the first inspection
115: Semiconductor PCB loading box after 2nd inspection
116: Semiconductor PCB loading box after the 3rd inspection
120 or 301: Semiconductor PCB
121 or 314: laminated glass substrates (first, second and third glass substrates)
122: motor for controlling the first picker or the second picker
200: Semiconductor PCB inspection board
302: first glass substrate
303: second glass substrate
304: third glass substrate
305: Hole
306: partition wall (partition wall)
307: outer vacuum passage
308: central vacuum passage
309: opening
310: Fixture of the left glass substrate
311: Fixture of right glass substrate
312: vacuum tube
313: Vacuum control device
314: Fixture of upper glass substrate
315: Fixture of the lower glass substrate

Claims (15)

In semiconductor PCB inspection equipment,
A semiconductor PCB 120 or 301 having a plurality of PCB cells 20;
A first glass substrate 302 to which the semiconductor PCB 301 is attached; a plurality of holes 305 are arranged at regular intervals in the first glass substrate 302;
A third glass substrate 304 spaced apart from the first glass substrate 302 at a constant interval; the third glass substrate 304 is a flat glass substrate;
Fixing boards 310, 311, 314, 315 of the left, right, upper and lower glass substrates for spacing and fixing the first and third glass substrates 302, 304 at a constant interval;
The first and third glass substrates 302 and 304 form a laminated glass substrate 314 and are connected to a semiconductor PCB X axis-Y axis moving table 108 for moving the laminated glass substrate 314 in the X axis- ;
A vacuum control device 313 connected to a specific glass substrate fixing table among the fixing tables 310, 311 and 314 315 of the left, right, upper and lower glass substrates, the vacuum control device 313, And a plurality of holes 305 of the first glass substrate 302 are disposed between the third glass substrate 304 and the third glass substrate 304. The first glass substrate 302 has a plurality of holes 305, Wherein a suction force is generated in a plurality of holes (305) arranged at regular intervals on the glass substrate (302) to attach the semiconductor PCB (301) to the laminated glass substrate (314) In semiconductor PCB inspection equipment,
A semiconductor PCB 120 or 301 having a plurality of PCB cells 20;
A first glass substrate 302 to which the semiconductor PCB 301 is attached; a plurality of holes 305 are arranged at regular intervals in the first glass substrate 302;
A second glass substrate 303 in contact with the first glass substrate 302 has a rim of the second glass substrate 303 with a plurality of barrier ribs 306, A plurality of external vacuum passages 307 are provided between the second glass substrate 303 and a central vacuum passage 308 at the center of the second glass substrate 303. One end of the second glass substrate 303 An opening 309 is present;
A third glass substrate 304 in contact with the second glass substrate 303; the third glass substrate 304 is a flat glass substrate;
The first, second, and third glass substrates 302, 303, and 304 are superposed to form a laminated glass substrate 314, and a semiconductor PCB X-Y axis movement (108);
A left glass substrate fixing table 310 and a right glass substrate fixing table 311 for fixing the laminated glass substrate 314;
The left glass substrate fixing table 310 or the right glass substrate fixing table 311 is connected to a vacuum control device 313 via a vacuum tube 312. The vacuum control device 313 is connected to the first glass substrate 302, And the central vacuum passage 308 and the outer vacuum passage 307 and the central vacuum passage 308 of the second glass substrate 303 located between the first glass substrate 302 and the third glass substrate 304 are vacuumed, A suction force is generated in a plurality of holes 305 arranged at regular intervals on the first glass substrate 302 due to the vacuum, Characterized in that the PCB (301) is attached to a laminated glass substrate (314) The method according to claim 1 or 2,
(Front surface) and the second surface (back surface) of the semiconductor PCB 120 or 301 on the PCB X-Y-axis moving table 108 on the laminated glass substrate 314 Semiconductor PCB inspection equipment with technical features The method according to claim 1 or 2,
A first camera 110 (1) for moving the semiconductor PCB 120 or 301 from the semiconductor PCB X-Y-axis moving table 108 to photograph a first surface (front surface) of the semiconductor PCB 301, And a second camera (110 (2)) for photographing a second side (back side) of the semiconductor PCB (301) The method according to claim 4,
Artificial intelligence (AI) is applied to the images captured by the first camera 110 (1) and the second camera 110 (2) and the existing Big Data images of various defects. A semiconductor PCB inspection device The method according to claim 5,
The laser marking is performed on the defective PCB cell 20 and the side rail of the semiconductor PCB 120 or 301 on the basis of the defective reason determined to be AI (artificial intelligence) Semiconductor PCB inspection equipment In semiconductor PCB inspection equipment,
A semiconductor PCB 120 or 301 having a plurality of PCB cells 20;
A first glass substrate 302 to which the semiconductor PCB 301 is attached; a plurality of holes 305 are arranged at regular intervals in the first glass substrate 302;
A third glass substrate 304 spaced apart from the first glass substrate 302 at a constant interval; the third glass substrate 304 is a flat glass substrate;
Fixing boards 310, 311, 314, 315 of the left, right, upper and lower glass substrates for spacing and fixing the first and third glass substrates 302, 304 at a constant interval;
The first and third glass substrates 302 and 304 form a laminated glass substrate 314 and are connected to a semiconductor PCB X axis-Y axis moving table 108 for moving the laminated glass substrate 314 in the X axis- ;
A vacuum control device 313 connected to a specific glass substrate fixing table among the fixing tables 310, 311 and 314 315 of the left, right, upper and lower glass substrates, the vacuum control device 313, And a plurality of holes 305 of the first glass substrate 302 are disposed between the third glass substrate 304 and the third glass substrate 304. The first glass substrate 302 has a plurality of holes 305, A suction force is generated in the plurality of holes 305 arranged at regular intervals on the glass substrate 302 so that the semiconductor PCB 301 is attached to the laminated glass substrate 314;
Wherein the inclined angle (A) of the semiconductor PCB inspection table (200) on which the semiconductor PCB X-axis and Y-axis moving table (108) is disposed is set to a slope of 40 to 60 degrees In semiconductor PCB inspection equipment,
A semiconductor PCB 120 or 301 having a plurality of PCB cells 20;
A first glass substrate 302 to which the semiconductor PCB 301 is attached; a plurality of holes 305 are arranged at regular intervals in the first glass substrate 302;
A third glass substrate 304 spaced apart from the first glass substrate 302 at a constant interval; the third glass substrate 304 is a flat glass substrate;
Fixing boards 310, 311, 314, 315 of the left, right, upper and lower glass substrates for spacing and fixing the first and third glass substrates 302, 304 at a constant interval;
The first and third glass substrates 302 and 304 form a laminated glass substrate 314 and are connected to a semiconductor PCB X axis-Y axis moving table 108 for moving the laminated glass substrate 314 in the X axis- ;
A vacuum control device 313 connected to a specific glass substrate fixing table among the fixing tables 310, 311 and 314 315 of the left, right, upper and lower glass substrates, the vacuum control device 313, And a plurality of holes 305 of the first glass substrate 302 are disposed between the third glass substrate 304 and the third glass substrate 304. The first glass substrate 302 has a plurality of holes 305, A suction force is generated in the plurality of holes 305 arranged at regular intervals on the glass substrate 302 so that the semiconductor PCB 301 is attached to the laminated glass substrate 314;
Wherein the inclined angle (A) of the semiconductor PCB inspection table (200) on which the semiconductor PCB X-axis and Y-axis moving table (108) is disposed is 0 degrees and is arranged flat. In semiconductor PCB inspection equipment,
A semiconductor PCB 120 or 301 having a plurality of PCB cells 20;
A first glass substrate 302 to which the semiconductor PCB 301 is attached; a plurality of holes 305 are arranged at regular intervals in the first glass substrate 302;
A second glass substrate 303 in contact with the first glass substrate 302 has a rim of the second glass substrate 303 with a plurality of barrier ribs 306, A plurality of external vacuum passages 307 are provided between the second glass substrate 303 and a central vacuum passage 308 at the center of the second glass substrate 303. One end of the second glass substrate 303 An opening 309 is present;
A third glass substrate 304 in contact with the second glass substrate 303; the third glass substrate 304 is a flat glass substrate;
The first, second, and third glass substrates 302, 303, and 304 are superposed to form a laminated glass substrate 314, and a semiconductor PCB X-Y axis movement (108);
A left glass substrate fixing table 310 and a right glass substrate fixing table 311 for fixing the laminated glass substrate 314;
Wherein the inclined angle (A) of the semiconductor PCB inspection table (200) on which the semiconductor PCB X-axis and Y-axis moving table (108) is disposed is set to a slope of 40 to 60 degrees In semiconductor PCB inspection equipment,
A semiconductor PCB 120 or 301 having a plurality of PCB cells 20;
A first glass substrate 302 to which the semiconductor PCB 301 is attached; a plurality of holes 305 are arranged at regular intervals in the first glass substrate 302;
A second glass substrate 303 in contact with the first glass substrate 302 has a rim of the second glass substrate 303 with a plurality of barrier ribs 306, A plurality of external vacuum passages 307 are provided between the second glass substrate 303 and a central vacuum passage 308 at the center of the second glass substrate 303. One end of the second glass substrate 303 An opening 309 is present;
A third glass substrate 304 in contact with the second glass substrate 303; the third glass substrate 304 is a flat glass substrate;
The first, second, and third glass substrates 302, 303, and 304 are superposed to form a laminated glass substrate 314, and a semiconductor PCB X-Y axis movement (108);
A left glass substrate fixing table 310 and a right glass substrate fixing table 311 for fixing the laminated glass substrate 314;
Wherein the inclined angle (A) of the semiconductor PCB inspection table (200) on which the semiconductor PCB X-axis and Y-axis moving table (108) is disposed is 0 degrees and is arranged flat. 11. The method according to any one of claims 7 to 10,
The stacked glass substrate 314 is vacuum controlled by the vacuum control device 313 connected to the vacuum tube 312 and has a degree of vacuum of 0.1 to 0.5 MPa Mega-pascal) semiconductor PCB inspection equipment In the semiconductor PCB inspection step,
First, the semiconductor PCB 120 or 301 is scanned as a whole using a vision camera to determine whether a PCB cell 20 inside the semiconductor PCB 120 or 301 is defective or not, A first vision scan test step for judging the first vision vision;
Second step: The semiconductor PCB 120 or 301 is moved in the X axis-Y axis by using the semiconductor PCB X axis-Y axis moving table 108 and the first surface (front surface ) Of the semiconductor PCB 120 or 301 by using the first camera 110 (1) that photographs the semiconductor PCB 120 or 301 and the second camera 110 (2) that photographs the second surface (back surface) And detects images of PCB cells 20 of the first camera 110 (1) and the second camera 110 (2) A first glass substrate 302 to which the semiconductor PCB 120 or 301 is attached is compared with a Big Data image by an artificial intelligence (AI) program to determine the cause of the failure. The substrate 302 has a plurality of holes 305 arranged at regular intervals and a third glass substrate 304 spaced apart from the first glass substrate 302 by a predetermined distance, The rear substrate 304 is a flat glass and has fixing tables 310, 311 and 314 315 of left, right, upper and lower glass substrates for separating and fixing the first and third glass substrates 302 and 304 at a predetermined interval, 1,3 Glass substrates 302 and 304 form a laminated glass substrate 314 and include a semiconductor PCB X-Y axis moving table 108 for moving the laminated glass substrate 314 in the X-axis and Y-axis directions; Vision for artificial intelligence (AI) final determination and laser marking for performing laser marking on a defective PCB cell (20) and a side rail using a laser device (112) step;
(3) washing with water in order to remove dust, dust and the like caused by laser marking in the second step;
Step 4: Determining the final quantity of the normal PCB cell and the defective PCB cell in the side rail mark 10 by using a vision system. In the semiconductor PCB inspection step,
First, the semiconductor PCB 120 or 301 is scanned as a whole using a vision camera to determine whether a PCB cell 20 inside the semiconductor PCB 120 or 301 is defective or not, A first vision scan test step for judging the first vision vision;
Second step: The semiconductor PCB 120 or 301 is moved in the X axis-Y axis by using the semiconductor PCB X axis-Y axis moving table 108 and the first surface (front surface ) Of the semiconductor PCB 120 or 301 by using the first camera 110 (1) that photographs the semiconductor PCB 120 or 301 and the second camera 110 (2) that photographs the second surface (back surface) And detects images of PCB cells 20 of the first camera 110 (1) and the second camera 110 (2) A first glass substrate 302 to which the semiconductor PCB 120 or 301 is attached is compared with a Big Data image by an artificial intelligence (AI) program to determine the cause of the failure. The substrate 302 has a plurality of holes 305 arranged at regular intervals and includes a second glass substrate 303 in contact with the first glass substrate 302, TED A plurality of external vacuum passages 307 are provided between the partition 306 and the partition 306. A central vacuum chamber 307 is formed at the center of the second glass substrate 303, And a third glass substrate 304 in contact with the second glass substrate 303. The third glass substrate 304 has an opening 309 at one end of the second glass substrate 303, 3 glass substrate 304 is a flat glass substrate and the first, second and third glass substrates 302, 303 and 304 are combined to form a laminated glass substrate 314. The laminated glass substrate 314 is aligned in the X- A Y-axis movable base 108 for moving a semiconductor PCB; Vision for artificial intelligence (AI) final determination and laser marking for performing laser marking on a defective PCB cell (20) and a side rail using a laser device (112) step;
(3) washing with water in order to remove dust, dust and the like caused by laser marking in the second step;
Step 4: Determining the final quantity of the normal PCB cell and the defective PCB cell in the side rail mark 10 by using a vision system. The method according to claim 12 or 13,
A first picker 107 for moving the semiconductor PCB 120 or 301 to be inspected of the inspection standby semiconductor PCB loading box 106 of the second stage to the semiconductor PCB X axis-Y axis moving table 108, And a second picker (113) for transferring the marked semiconductor PCB (120 or 301) to the semiconductor PCB loading boxes (114, 115, 116) after the first, second and third tests The method according to claim 12 or 13,
If there is a defect in the PCB 20 of the semiconductor PCB 120 or 301 of the second stage, the semiconductor PCB loading box 114 is inspected after the first inspection by using a second picker 113, And if the PCB 20 of the semiconductor PCB 120 or 301 has no defects (no defects), a second picker 113 is used to perform a second inspection The PCB 20 is moved to the semiconductor PCB loading box 115. When the PCB 20 of the semiconductor PCB 120 or 301 is not properly inspected, a third picker 113 is used to perform a third inspection And then moving the semiconductor PCB loading box (116)

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