KR20180125731A - Apparatus of inspecting denting trace of anisotropic film - Google Patents

Abstract

The present invention relates to an apparatus for inspecting a denting trace in attaching a conductive film, and more specifically relates to the apparatus for inspecting a denting trace in attaching a conductive film, in which a plurality of objects to be inspected for denting trace inspection can be automatically arranged in a precise location, a precise denting trance inspection can be performed via inspections such as status grasping of a conductive particle, removal of noise, clustering, and counting a particle size quantity by lead. Such inspections for the objects to be inspected can be simultaneously performed in one device such that a large quantity of objects for denting trace inspection can be performed in a short time. In addition, a defect of a conduction particle within an ACF, which is generated when an electrode of a substrate is in contact with an FPC for conduction, can be precisely inspected.

Description

[0001] Apparatus for inspecting denting trace of anisotropic film [0002]

TECHNICAL FIELD The present invention relates to an integrated and automated inspection apparatus for easily and easily testing an indentation state when a conductive film is attached.

2. Description of the Related Art Generally, an electronic apparatus such as a mobile phone, a mobile terminal, or a liquid crystal TV is provided with an LCD panel (hereinafter referred to as a " substrate "). Such a substrate is typically mounted on a substrate by a FOG (Film On Glass) / FOP (Film On Panel) method or a COG (Chip On Glass) / COP (Chip On Panel) method.

That is, in the FOG / FOP bonding method, an anisotropic conductive film (hereinafter referred to as ACF) is usually attached to an electronic circuit electrode printed on a glass or plastic substrate, a film or an FPC is disposed on the ACF, And the electrodes of the FPC and the substrate are brought into contact with each other.

At this time, the ACF contains conductive particles, and when a certain pressure is applied, the insulating film is broken and electricity can be applied through the conductive particles.

In the COG / COP bonding method, an anisotropic conductive film is usually attached to an electrode of a substrate, a semiconductor chip is disposed on the ACF, and an appropriate pressure is applied to the bump, to be.

 Thus, in the process of connecting an FPC or a chip to a substrate through the COG / COP and FOG / FOP processes, the attachment state of the ACF is a very important factor.

That is, the degree of breakage of the conductive particles in the ACF is a factor greatly affecting the determination of whether or not the product is defective.

Therefore, after the ACF is attached to the electrode of the substrate, it is essential that the foreign substance state, mounting position, indentation state (number of indentations of ACF conductive particles, indentation strength, indentation length, indentation distribution) to be.

At this time, there is a need for a method of judging whether or not there is a defect by calculating the number, strength, length, and distribution of conductive particles in each bump by analyzing the image information, to be.

Conventionally, the apparatus for high-speed image capturing due to the development of peripheral technology has been satisfied in the conventional inspection apparatus, but it has a problem that the technique of noise and clustering of the conductive particles is not easily obtained by drawing it based on the photographed image.

 As a result, the defective material is transferred to the next process due to a failure to determine whether the adhesion of the conductive particles is poor or not, thereby causing damage to the process and increasing the possibility of production of defective products. .

Korean Patent Publication No. 10-0976802 Korean Patent Publication No. 10-0766394

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to make it possible to sequentially and simultaneously perform indentation inspection on a plurality of inspection specimens for indentation inspection, It is possible to automatically control the arrangement and visualize the images captured using an optical camera to check the status of conductive particles, eliminate jitter, clustering, and count the number of particles per lead. And to provide an indentation state inspection apparatus for attaching a conductive film so as to accurately determine whether or not a relatively large number of inspection objects are defective.

Other objects and advantages of the present invention will be described hereinafter and will be understood by the embodiments of the present invention. Further, the objects and advantages of the present invention can be realized by the means and the combination shown in the claims.

SUMMARY OF THE INVENTION The present invention, as a means for solving the above problems,

An indentation state inspection apparatus for attaching a conductive film, comprising: a plurality of stage units (100) mounted with inspection bodies (110) and spaced apart and fixed to each other; A plurality of inspection bodies 110 in which reference marks are printed and are placed and arranged in the Y axis direction, which is the longitudinal direction of each stage unit 100; An alignment illumination unit 120 operated when the inspection object 110 is disposed; An alignment camera 140 which moves toward the X-axis direction, which is the arrangement direction of the plurality of stage units 100, and photographs the alignment mark of each of the plurality of inspection objects 110 disposed on each stage; An inspection illumination unit 150 that completes the placement of the inspection object 110 and is operated for an indentation state inspection of the inspection object 110; An optical camera 160 for indentation inspection for imaging the inspection object 110 disposed on the stage for indentation inspection while being moved toward the X axis direction in which the plurality of stage units 100 are arranged; The inspection unit 110 is connected to the alignment camera unit 140 so as to compare the alignment mark position of the inspection unit 110 with a predetermined arrangement position and to arrange the inspection unit 110 at an accurate position. A control unit 170 for calculating the degree of distortion to correct the position of the inspection object 110 and checking the indentation state of the inspection object 110 with the optical image camera 160 connected to the optical camera unit 160; And a control unit.

As described above, according to the present invention, a large amount of inspection of indentations is automatically performed simultaneously, thereby increasing indentation inspection efficiency, shortening inspection time, reducing labor costs, and increasing inspection accuracy.

In addition, the present invention provides an inspection speed at which indentations can be inspected at the time of indentation inspection, so that a complete and accurate inspection can not be performed, thereby preventing a problem that a process defect is conveyed to a next process.

In addition, the present invention has the effect of making it possible to determine the defect due to accurate inspection by checking the condition of the conductive particles, eliminating the size of the particles, clustering, counting the particle size quantity per lead, etc. and performing indentation inspection.

FIG. 1A and FIG. 1B are views of an embodiment showing an indentation state inspection apparatus when a conductive film is attached according to the present invention. FIG.
2 is an original panel image taken by an optical camera according to the present invention.
FIG. 3 is a diagram illustrating a step of setting an enlarged area to a set inspection area according to the present invention. FIG.
FIG. 4 is a diagram illustrating a Discrete Fourier Transform (DFT) for transforming an image according to the present invention into a frequency domain. FIG.
5 is a view showing an image obtained by reversing the rotation angle of the lead according to the present invention.
FIG. 6 is an image diagram showing an image profile in which a lead image performed according to the present invention is projected in a vertical direction; FIG.
7 is a diagram illustrating a step of generating a reference mask by generalizing an indentation to extract an indentation having a predetermined inspection sensitivity or more according to the present invention.
FIG. 8 is a view illustrating an image obtained by filtering an image according to an exemplary embodiment of the present invention in units of regions and amplifying the indentation characteristics so as to be well displayed.
9 is a diagram showing a binary image according to the present invention.
FIGS. 10A and 10B are views showing a result of post-processing according to the present invention; FIG.
11 is a view showing a step of displaying the quantity of indentation and the length of indentation distribution by leads according to the present invention.

Before describing in detail several embodiments of the invention, it will be appreciated that the application is not limited to the details of construction and arrangement of components set forth in the following detailed description or illustrated in the drawings. The invention may be embodied and carried out in other embodiments and carried out in various ways. It should also be noted that the device or element orientation (e.g., "front," "back," "up," "down," "top," "bottom, Expressions and predicates used herein for terms such as "left," " right, "" lateral, " and the like are used merely to simplify the description of the present invention, Or that the element has to have a particular orientation. Also, terms such as " first "and" second "are used herein for the purpose of the description and the appended claims, and are not intended to indicate or imply their relative importance or purpose.

The present invention has the following features in order to achieve the above object.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be interpreted in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

An embodiment according to the present invention will be described below.

An indentation state inspection apparatus for attaching a conductive film, comprising: a plurality of stage units (100) mounted with inspection bodies (110) and spaced apart and fixed to each other; A plurality of inspection bodies 110 in which reference marks are printed and are placed and arranged in the Y axis direction, which is the longitudinal direction of each stage unit 100; An alignment illumination unit 120 operated when the inspection object 110 is disposed; An alignment camera 140 which moves toward the X-axis direction, which is the arrangement direction of the plurality of stage units 100, and photographs the alignment mark of each of the plurality of inspection objects 110 disposed on each stage; An inspection illumination unit 150 that completes the placement of the inspection object 110 and is operated for an indentation state inspection of the inspection object 110; An optical camera 160 for indentation inspection for imaging the inspection object 110 disposed on the stage for indentation inspection while being moved toward the X axis direction in which the plurality of stage units 100 are arranged; The inspection unit 110 is connected to the alignment camera unit 140 so as to compare the alignment mark position of the inspection unit 110 with a predetermined arrangement position and to arrange the inspection unit 110 at an accurate position. A control unit 170 for calculating the degree of distortion to correct the position of the inspection object 110 and checking the indentation state of the inspection object 110 with the optical image camera 160 connected to the optical camera unit 160; And a control unit.

The control unit 170 controls the optical camera unit 160 so that the image of the indentation can be clearly seen on the basis of the preset reference when the photographed image of the inspection target 110 is received through the optical camera unit 160. [ And the illumination illumination angle of the illumination unit for inspection 150 mounted on the illumination unit 150 is changed to set an optimum illumination illumination angle.

In addition, the control unit 170 may include an image enlarging unit 10 for receiving a panel image to be inspected through an optical camera and enlarging a predetermined inspection area of the panel image for indentation state inspection. A lead confirmation unit (20) for vertically rotating and aligning leads in the enlarged inspection area and recognizing a complete lead having a predetermined length; An indentation detecting unit (30) for detecting an indentation by binarizing the lead selected in the lead confirmation unit (20) using indentation model filtering; An indentation noise remover (40) for removing noise of the indentations detected by the indentation filler portion to detect only indentations of a predetermined size; An indentation clustering unit 50 for graphically representing noise-removed indentations, and clustering the indentations located adjacent to each other within the preset distance among the indented indentations; An indent data extractor 60 for each lead for counting the quantity and distribution length of the indentations for each lead; A lead failure determination unit 70 for comparing the extracted indentation data by the lead to the indentation data for each preset lead to determine whether or not the indentation of the inspection object is good and determining whether or not to use the indentation; And a control unit.

In order to perform rotational alignment so that the leads having a slope are vertically parallel to each other, the lead confirmation unit 20 performs discrete Fourier transform (DFT) processing to convert the enlarged inspection region lead image into the frequency domain, A frequency analysis unit 21 for determining the rotation angle of the lead and rotating the image inversely; The lead image is projected in the vertical direction to secure the image profile so that the peak and the lowest point in the image profile are the boundaries of the respective leads and the lead lengths below the set point are incomplete leads, A histogram analyzing unit 22; And the like.

The indentation detecting unit 30 may include a graphical unit 31 for generating shadows on indentations through an inclined tube, filtering each indentation image by unit area, amplifying the indentation image, and then rendering the indentation image into an original image through a binarization imaging process; An indentation sensitivity determination unit (32) for determining the detection sensitivity of an indentation so as to appear lighter or darker on the image depending on the degree of pressing of the conductive ball; And the like.

The indentation noise removing unit 40 removes indentations having a size larger than or smaller than a predetermined size as noise based on the binarized image region of the indentation detecting unit 30.

In addition, the indentation clustering unit 50 displays the indentation as a post-processing result image, and when the detected indentation within a predetermined size is located within a predetermined distance, the indentation clustering unit 50 counts the indentation as one indentation.

In order to distinguish the leads having the number of conductive balls that do not satisfy the amount of electric current, the lead failure determination unit 70 determines whether or not the lead ball is within the predetermined distribution length of each lead, And it is confirmed whether or not the number of the predetermined conductive balls is applied.

Hereinafter, an apparatus for examining an indentation state when a conductive film is attached according to a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1A to 11. FIG.

The apparatus for testing an indentation state at the time of attaching a conductive film according to the present invention includes a stage unit 100, an inspection unit 110, an alignment unit 120, an aligning camera unit 140, an inspection illumination unit 150, An optical camera unit 160, and a control unit 170. [

The stage unit 100 has a structure in which a plurality of or more staging units 100 are disposed at a predetermined interval from each other.

That is, in the present invention, a plurality of such stage units 100 are arranged and fixed in the X direction (lateral direction).

The inspection object 110 is an object to be inspected which is placed on the upper surface of the stage unit 100 so that a reference mark is printed so that the inspection object 110 can be disposed at an accurate position of the stage unit 100. This inspection member 110 is placed and placed on the upper surface of the stage unit 100 in the Y axis direction, which is the longitudinal direction of the stage unit 100.

The alignment illumination unit 120 is used for accurately positioning the inspection object 110 at a predetermined position on the upper surface of the stage unit 100 and is used together with the alignment camera unit 140 for confirming such an arrangement .

The position of the illumination unit 120 may be spaced apart from the upper surface of the stage unit 100. The position of the illumination unit 120 may be different from that of the stage unit 100, If it is for use, various changes will be possible.

The alignment camera unit 140 is installed on the upper surface of the plurality of stage units 100 so as to be slidable leftward and rightward in the lateral X axis direction in which the plurality of stage units 100 are installed.

The alignment camera unit 140 moves from the first leftmost stage portion 100 of the stage unit 100 to the left final stage unit 100 of the stage unit 100, 110) of the image.

The reference mark of the inspection target 110 on each stage unit 100 photographed by the alignment camera unit 140 is transmitted to the control unit 170 to be described later and the control unit 170 determines the information thus received, When the inspection body 110 is adjusted and changed to X (lateral), Y (longitudinal), T (rotational), or the like through a separate correction feeder (not shown) And the reference mark of the inspection object 110 is sequentially picked up from the left side of the sieve 110 toward the left side.

That is, the alignment camera unit 140 confirms the position of the inspection object 110 on the stage, and the control unit 170 confirms the position of the inspection object 110 to automatically correct the position of the inspection object 110 to an accurate position.

As described above, when the position of each inspection object 110 on the upper surface of the stage unit 100 is correctly positioned, the inspection illumination unit 150 is turned off while the alignment illumination unit 120 is turned on, The illumination unit for inspection 150 mounted on the camera unit 160 is turned on.

The illumination unit 150 for inspection is for securing a clear and clear image at the time of photographing by the optical camera unit 160.

As in the above-described alignment camera unit 140, the optical camera unit 160 for indentation inspection is installed on the upper surface of the plurality of stage units 100, and can sequentially photograph the upper surfaces of the plurality of stage units 100 Axis direction of the stage unit 100 so as to be slidable.

The optical camera unit 160 photographs the inspected object 110 placed on the upper surface of each stage unit 100 and sends it to the control unit 170 to be described later to perform the indentation inspection in the control unit 170.

The indentation inspection area of the inspection object 110 for the indentation inspection may be different depending on the type of the inspection object 110. In general, The left and right end regions of the inspected object 110 on which the reference marks used for aligning to be located in the photographing region are printed and additionally sets a central region between the left and right sides according to the inspection standard to prepare for photographing .

The control unit 170 is connected to the alignment camera unit 140 and the optical camera unit 160, respectively, as described above.

The control unit 170 controls the alignment unit 140 to align the alignment mark position of the inspection object 110 with the image information received from the alignment camera unit 140, It is possible to compare and judge the placement position previously set in the control unit 170 and to determine the placement position of the inspection object 110 through a separate conveyance correction apparatus (the apparatus which has transferred the initial inspection object 110 to the upper surface of the stage unit 100 as it is) The position of the inspection object 110 is automatically corrected by calculating the degree of deformation of the inspection object 110 in order to arrange the inspection object 110 at an accurate position.

In the inspection step in which the photographing information is received from the optical camera unit 160, the control unit 170 may check the indentation state of the photographed image received by the optical camera unit 160 to determine whether the image is defective .

In addition, when receiving a photograph of the inspection object 110 through the optical camera unit 160, the image of the indentation may be clearly displayed on the optical camera 160, The illumination illumination angle of the inspection illumination unit 150 is changed so that the optimum illumination illumination angle can be set.

The control unit 170 includes an image enlarging unit 10, a lead checking unit 20, an indenting detecting unit 30, an indentation noise removing unit 40, an indentation clustering unit 50, (60), and a lead failure determination unit (70).

1. The image enlarging unit 10 receives a panel image to be inspected through an optical camera and enlarges a predetermined inspection area of the panel image.

As shown in FIG. 3, an area for performing indentation inspection may be included in the photographed inspection area, which is not utilized for indentation inspection, such as a mark for alignment, a margin of the inspection target 110, It is a part to set. Of course, it is natural that the user can specify the lead in the inspection area semi-automatically or manually.

2. The lead confirmation unit 20 is a part that vertically aligns leads in the above-mentioned enlarged inspection area and recognizes a complete lead having a predetermined length.

In order to automatically perceive each lead of the inspection object 110, a pixel profile analysis using a vertical projection technique is performed. In order to apply this technique, in order to recognize the characteristics of the sample, the graded leads are rotated The image is transformed into a frequency domain in advance for this purpose. For this purpose, a discrete Fourier transform (DFT) is performed to transform an image into a frequency domain as shown in FIG. 4 will be.

As shown in FIG. 5, after the rotation angle of the lead is determined, the image is rotated inversely, and then the performed lead image is projected in the vertical direction to secure an image profile, as shown in FIG.

More specifically, the lead confirmation unit 20 includes a frequency analysis unit 21 and a histogram analysis unit 22.

The frequency analyzer 21 performs a discrete Fourier transform (DFT) to convert the enlarged inspection area lead image into the frequency domain to determine the rotation angle of the lead and rotate the image inversely,

The histogram analyzer 22 projects the lead image in the vertical direction to secure the image profile so that the highest and lowest points in the image profile are the boundaries of the respective leads and the lead length below the set is the incomplete lead, And extract indentations for each lead.

In the image profile, the peaks and troughs will be the boundaries of each lead, and this information will automatically recognize the leads and prepare them for extracting indentations for each lead.

If the projection accumulation value of the lead pixel is insufficient on the profile, it is determined that the sloped lead is an incomplete lead that occurs in the structure of designating a rectangular inspection area and excluded from the inspection object. In one embodiment, Is relatively shorter than the other lead lengths in the central portion, it is judged to be an incomplete lead and is excluded from the inspection board.

3. The indentation detection unit 30 is a unit for detecting indentation by binarizing the lead selected in the lead confirmation unit 20 using indentation model filtering.

6, an incomplete lead is excluded, and indentation is extracted as an enlarged image of one indentation among the plurality of indentations represented on the lead, as shown in FIG. 7, based on the selected lead. For example, in the shape of a circle of indentation, a mask having information that the upper semicircle is bright and the lower semicircle is dark is designed by using an oblique light illuminated by the optical device to generate a shadow on the indentation, As shown in FIG. 8, the image is filtered by unit areas and amplified so that the characteristics are well-

As shown in FIG. 9, an indentation region of a size smaller than a predetermined size is removed, and only an indentation region larger than a predetermined size is extracted to form an original image. In one embodiment, Means indentation, and extracts a white point having a predetermined size or more with respect to the white point.

In other words, the indentation detecting section 30 includes a diagramming section 31 and an indentation sensitivity determination section 32.

The diagramming unit 31 generates shadows on the indentation through the inclined tube, amplifies the indentation images by unit area, amplifies the indentation images, and then displays the images on the original image through the binarization imaging process.

The indentation sensitivity determination unit 32 determines the detection sensitivity of the indentation so as to appear lighter or darker on the image depending on the degree of depression of the conductive ball. The detection sensitivity is set when the indentation is detected, and it can be expressed more lighter or darker on the image depending on the degree of depression of the conductive ball.

As shown in FIG. 7, a portion for setting the detection sensitivity in detecting the indentation may be rendered lighter or darker on the image depending on the degree of depression of the conductive ball, and the region of the conductive ball is determined to be indent In one embodiment, the sensitivity of the test method is divided into 10 steps, and indentations can be detected or detected more according to the set step.

4. The indentation noise remover 40 is a part for removing only the indentations of a predetermined size by removing noise of the indents detected at the indentation filler portion.

Among the indentations displayed by the binarized image, indentations that are less than the minimum indentation size and deviating from the maximum ideal size are regarded as noise and removed.

In an embodiment of the present invention, a portion of the indentation that is less than the minimum size and deviates from the maximum size by using the size or area information among the detected indentation information is regarded as noise, Or indentations exceeding 250 pixels are determined to be noise.

The reason for the set value may be based on the actual size information of the conductive balls generating the indentations, but the small and large indentations are generated depending on the degree of crushing and the crowded state of the conductive balls in the randomly spreading ACF, And the set value is set as a reference.

5. The indentation clustering unit 50 is a unit for graphically representing the indentations with noise removed and clustering the indents adjacent to each other within the predetermined distance among the indented indentations.

As shown in the post-processing result image of FIG. 10A, the indentation is schematized and the indentation is detected and processed. In the process of pressing or breaking the conductive ball by a specific temperature and pressure in the process, , When a plurality of detected indentations within a certain size are located within a certain distance, counting with one indentation as shown in FIG. 10B is referred to as clustering. Clustering criterion values are basically based on the size of the conductive balls, and experimental and numerical values may be set because there may be differences in the sample and the process.

6. The indentation data extraction unit 60 is a unit for counting the quantity and distribution length of indentations for each lead.

As shown in FIG. 11, the quantity and distribution length of the indentations may vary according to the density of the conductive display balls in the inspection display device and the ACF coated thereon. In one embodiment, If the number of balls is set to 10 or more per lead and the distribution length, which is a criterion for judging whether the conductive balls are not spread evenly over a limited lead area, is set to 200 μm, This is the part that extracts the data so that the rejection process can be performed.

Unlike the indentation shown in FIG. 11, the indentations at the lowest point and the highest point of the lead are represented by green, and the distance between the indentations is calculated to determine the distribution length.

7. The lead failure judgment unit 70 compares the extracted indentation data for each lead with the indentation data for each preset lead to determine whether the indentation of the inspection object is good or not and determines whether or not to use the indention data.

Based on the extracted number of indents and the distribution length of the leads, it is determined whether the indentation of the inspection target 110 is good or bad according to the inspection standard promised in advance, and classified whether to use or not to produce the product.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It is to be understood that various changes and modifications may be made without departing from the scope of the appended claims.

10: image check unit 20: lead check unit
21: Frequency analysis unit 22: Histogram analysis unit
30: indentation detecting unit 31:
32: indentation sensitivity determination unit 40: indentation noise elimination unit
50: indentation clustering unit 60: indentation data extracting unit
70: Lead failure determination unit 100:
110: Inspection body 120: Illuminator illuminator
140: an alignment camera unit 150: a test lighting unit
160: Optical camera unit 170: Control unit

Claims (8)

In an indentation state inspection apparatus for attaching a conductive film,
A plurality of stage units 100 spaced apart and fixed to each other;
A plurality of inspection bodies 110 on which reference marks are printed and mounted on the upper surface of each stage unit 100;
An alignment illumination unit 120 operated when the inspection object 110 is disposed;
An alignment camera 140 which moves toward the arrangement direction of the plurality of stage units 100 and photographs the alignment mark of each of the plurality of inspection objects 110 disposed on each stage;
An inspection illumination unit 150 that completes the placement of the inspection object 110 and is operated for an indentation state inspection of the inspection object 110;
An optical camera 160 for indentation inspection, which is moved toward the array direction of the plurality of stage units 100 and photographs the inspection target 110 disposed on the stage for indentation inspection;
The alignment unit 120 is connected to the alignment camera unit 140 and compares the alignment mark position of the inspection target 110 with the predetermined alignment position to calculate the degree of the deviation of the inspection target 110, A control unit 170 connected to the optical camera unit 160 for checking an indentation state of the inspection object 110 with the received image;
Wherein the conductive film is formed on the surface of the conductive film.
The method according to claim 1,
The control unit 170
Upon receiving the photographed image of the inspection target 110 through the optical camera unit 160,
The illumination illumination angle of the inspection illumination unit 150 mounted on the optical camera unit 160 is changed so that the image of the indentation can be seen clearly in the preset reference, and the optimum illumination illumination angle is set Apparatus for detecting indentation when a conductive film is attached.
The method according to claim 1,
The control unit 170
For indentation status examination,
An image enlarging unit (10) for receiving a panel image to be inspected through an optical camera and enlarging a predetermined inspection area of the panel image;
A lead confirmation unit (20) for vertically rotating and aligning leads in the enlarged inspection area and recognizing a complete lead having a predetermined length;
An indentation detecting unit (30) for detecting an indentation by binarizing the lead selected in the lead confirmation unit (20) using indentation model filtering;
An indentation noise remover (40) for removing noise of the indentations detected by the indentation filler portion to detect only indentations of a predetermined size;
An indentation clustering unit 50 for graphically representing noise-removed indentations, and clustering the indentations located adjacent to each other within the preset distance among the indented indentations;
An indent data extractor 60 for each lead for counting the quantity and distribution length of the indentations for each lead;
A lead failure determination unit 70 for comparing the extracted indentation data by the lead to the indentation data for each preset lead to determine whether or not the indentation of the inspection object is good and determining whether or not to use the indentation;
And an indentation state inspection device for attaching the conductive film.
The method of claim 3,
The lead confirmation unit 20
In order to rotate and align the sloped leads so that they are vertically parallel to each other,
A frequency analyzer 21 for performing a discrete Fourier transform (DFT) to convert the enlarged inspection area lead image into a frequency domain to determine the rotation angle of the lead and rotate the image inversely;
The lead image is projected in the vertical direction to secure the image profile so that the peak and the lowest point in the image profile are the boundaries of the respective leads and the lead lengths below the set point are incomplete leads, A histogram analyzing unit 22;
Wherein the conductive film is formed on the surface of the conductive film.
The method of claim 3,
The indentation detecting unit 30
A diagramming unit 31 for generating shadows on the indentations through the inclined tubes, filtering the indentation images by unit areas, amplifying the indentations, and then rendering the indentation images into an original image through a binarization imaging process;
An indentation sensitivity determination unit (32) for determining the detection sensitivity of an indentation so as to appear lighter or darker on the image depending on the degree of pressing of the conductive ball;
Wherein the conductive film is formed on the surface of the conductive film.
The method of claim 3,
The indentation noise removing unit 40
Wherein an indentation having a size larger than or equal to a predetermined size is regarded as noise and removed with reference to a binarized image region of the indentation detecting unit (30).
The method of claim 3,
The indentation clustering unit 50
Wherein the indentation is displayed as a result of post-processing, and when the detected indentations within a predetermined size are located within a predetermined distance, the indentation is counted as one indentation.
The method of claim 3,
The lead failure determination unit 70
It is determined whether or not the number of the predetermined conductive balls is applied within the predetermined distribution length of each lead in order to distinguish the leads having the number of conductive balls that do not satisfy the amount of electric discharge And the like.

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