KR20180124738A - Light emitting device and method for manufacturing the same - Google Patents

Abstract

Provided are a light emitting device having high efficiency of light extraction and a method for manufacturing same. The light emitting device (10) includes: a rectangular substrate (22); a light emitting element (16) mounted on the substrate; a reflective member (17) to surround the light emitting element with a gap therebetween; a light guide member (24) filling the inside of the reflective member to cover the light emitting element in the reflection member; and a light transmitting member (25) provided on the light guide member. The reflective member includes one or more first reflective members (18) provided to face a lateral surface of the light emitting element, and a second reflective member (20) located on the outside of the first reflective member. The first reflective member has an inner surface which is inclined or curved so that a gap becomes large toward the light transmitting member. The second reflective member covers a lateral surface of the light transmitting member and an outer lateral surface of the first reflective member, wherein an upper surface of the second reflective member is the same plane as an upper surface of the light transmitting member.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device,

The present disclosure relates to a light emitting device and a manufacturing method of the light emitting device.

As a light emitting device, for example, Patent Documents 1 and 2 disclose a configuration in which a covering member is provided around a light emitting element.

Japanese Patent Application Laid-Open No. 2013-219397 Japanese Patent Application Laid-Open No. 2016-219743

However, the light emitting devices disclosed in the above Patent Documents 1 and 2 are required to have higher light extraction efficiency.

Accordingly, an embodiment of the present disclosure provides a light emitting device having high light extraction efficiency and a method of manufacturing the light emitting device.

A light emitting device according to an embodiment of the present disclosure includes a rectangular substrate, a light emitting element mounted on the substrate, a reflecting member provided so as to surround the light emitting element with a space therebetween, And a light transmitting member provided on the light guiding member, wherein the reflecting member includes: a first reflecting member provided so as to face a side surface of the light emitting device; And a second reflection member which is disposed outside the member and surrounds the light emitting element, wherein the first reflection member has an inclined surface or an inner surface of a curved surface that is inclined so as to widen the interval facing the light transmissive member, 2 reflective member covers the side surface of the light transmissive member and the outer surface of the first reflective member and the upper surface of the second reflective member covers the upper surface of the light transmissive member As shown in Fig.

A manufacturing method of a light emitting device according to another embodiment of the present disclosure includes the steps of arranging a plurality of light emitting elements on a substrate and providing a first reflecting member spaced apart from the light emitting element between the light emitting elements A step of providing a light guiding member covering the light emitting element and contacting the first reflecting member; a step of providing a light transmitting member on the light guiding member and the first reflecting member; A step of forming a first groove in the first groove by removing a part of the first reflecting member and a second reflecting member in contact with the light transmitting member and the first reflecting member in the first groove; .

According to the light emitting device according to the embodiment of the present disclosure, since the area surrounded by the reflective member and the light transmissive member is filled with the light guiding member, the inclined sheet having a high light extraction efficiency, By the side, more light can be widely propagated.

According to the manufacturing method of the light emitting device according to the embodiment of the present disclosure, the inclination is formed on the inner surface of the first reflecting member, the outer wall of the apparatus is formed by the second reflecting member, and the periphery of the light emitting element The light emitting device for filling can be easily manufactured.

1 is a perspective view of a light emitting device according to a first embodiment as viewed from a light emitting surface side;
2 is a perspective view of the light emitting device according to the first embodiment as viewed from the electrode side.
3A is a perspective view showing a section of a light emitting device according to the first embodiment cut in a plane parallel to a longitudinal direction of the light emitting device and perpendicular to the light emitting surface.
FIG. 3B is a cross-sectional view showing the light emitting device according to the first embodiment cut along a plane parallel to the long-side direction and parallel to the light-emitting surface.
Fig. 3c is a cross-sectional view showing the light emitting device according to the first embodiment cut in a plane parallel to the short longitudinal direction thereof and perpendicular to the light emitting surface. Fig.
4 is a flowchart showing an example of a manufacturing method of a light emitting device according to the first embodiment of the present invention.
5A is a plan view of a substrate in which a part of the steps for arranging the light emitting elements in the flowchart of FIG. 4 is omitted; FIG.
5B is a cross-sectional view for explaining a step of providing a first reflection member in the flowchart of FIG. 4;
FIG. 5C is a cross-sectional view for explaining the step of installing the light guiding member in the flowchart of FIG. 4;
FIG. 5D is a cross-sectional view for explaining a step of removing in the flowchart of FIG. 4;
5E is a cross-sectional view for explaining a step of providing a light transmitting member in the flow chart of FIG. 4;
FIG. 5F is a cross-sectional view for explaining a step of forming the first groove and a step of forming the second groove in the flowchart of FIG. 4;
FIG. 5g is a cross-sectional view for explaining a step of providing a second reflection member in the flowchart of FIG. 4;
5H is a cross-sectional view for explaining the individualizing step in the flowchart of FIG. 4;
6A is a plan view for explaining a step of forming the first groove and a step of forming the second groove in the flowchart of FIG. 4;
FIG. 6B is a plan view for explaining the step of installing the second reflection member in the flowchart of FIG. 4;
6C is a plan view for explaining a step of individualizing in the flowchart of FIG. 4; FIG.
7 is a cross-sectional view schematically showing a light emitting device according to the second embodiment.
8 is a cross-sectional view for explaining the manufacturing process of the light emitting device according to the second embodiment.
9 is a cross-sectional view schematically showing a light emitting device according to the third embodiment.
10 is a cross-sectional view schematically showing a light emitting device according to a fourth embodiment.
11 is a cross-sectional view schematically showing a light emitting device according to a fifth embodiment.
12 is a cross-sectional view schematically showing a light emitting device according to the sixth embodiment.
13A is a cross-sectional view partially showing a first reflecting member of a light emitting device showing a modification of the embodiment of the present invention.
FIG. 13B is a cross-sectional view partially showing a first reflecting member of a light emitting device showing another modification of the embodiment of the present invention. FIG.

Hereinafter, a light emitting device and a manufacturing method thereof according to the embodiment will be described. In addition, the drawings referred to in the following description schematically show the present embodiment, so that the scale, interval, positional relationship, and the like of each member may be exaggerated or a part of members may be omitted. In the following description, the same names and reference numerals denote the same or similar members in principle, and the detailed description will be appropriately omitted. In Figs. 5A to 5H and Figs. 6A to 6C or 8, only a part of the whole is partially extracted. In each figure, the irradiation direction Br of the central light emitted from the light emitting device 10 is indicated by an arrow. In the following description, the irradiation direction Br of the light emitted from the light emitting device 10 is described above and the direction opposite to the irradiation direction Br is described below.

≪ Light emitting device &

As shown in Figs. 1 and 3A to 3C, the light emitting device 10 includes a rectangular substrate 22, a light emitting element 16 mounted on the substrate 22, A light transmitting member 25 provided on the light guiding member 24 and a reflecting member 17 provided around the light transmitting member 24 around the light transmitting member 25 and the light guiding member 24 , A device electrode 15, and a wiring 14. [0031] As shown in Fig. The light emitting device 10 irradiates light through the light-transmissive member 25 which is the light-emitting surface 12. In the example shown in the figure, the light transmitting member 25 includes a phosphor layer 26 and a light transmitting layer 28 stacked thereon. In the present invention, the phosphor layer 26 is not necessarily indispensable. The following description will be made by taking the case where the light transmitting member 25 includes the phosphor layer 26 as an example. The reflecting member 17 includes a first reflecting member 18 disposed on the side of the light emitting element 16 and a second reflecting member 18 located outside the first reflecting member 18 so as to surround the light emitting element 16 And has a second reflecting member 20.

Hereinafter, each configuration will be described in turn.

As shown in Figs. 3A to 3C, the light emitting element 16 includes a light transmitting substrate, a semiconductor layer, and a device electrode 15. It is preferable that the light emitting element 16 has a rectangular shape when viewed from above, particularly a rectangular shape having long sides and short sides. Further, the light emitting element 16 may have other shapes, for example, a hexagonal shape may improve the luminous efficiency. It is preferable that the light emitting element 16 has a p-channel electrode (p, n) on the same side. The light emitting device 16 may be included in one light emitting device 10, or a plurality of light emitting devices 16 may be included. When a plurality of light emitting elements 16 are included, they can be connected in series or in parallel.

Further, the light-transmissive substrate may be of any type as long as it is usually used for manufacturing a semiconductor light-emitting device, and specifically, a sapphire substrate is used. It is also preferable that the semiconductor layer includes a laminate of semiconductor layers, that is, at least an n-type semiconductor layer and a p-type semiconductor layer, and the active layer is interposed therebetween. As the semiconductor material, it is preferable to use a nitride semiconductor which is a material capable of emitting light having a short wavelength that can efficiently excite a wavelength conversion material. The nitride semiconductor is mainly represented _{by the} general formula In _x Al _y Ga _{1 -x- y} N (0? X, 0? _Y , x + y? 1). The device electrodes 15 are formed on the same surface side. The device electrode 15 is required to be a metal material that can be mounted, but the kind of the metal is not particularly limited as long as it is a conductive member capable of electrical connection. The device electrode 15 is bonded to the substrate 22 to be described later via a bonding member.

The bonding member may be provided so as to be interposed between the device electrode 15 of the light emitting element 16 and the wiring 14 of the substrate 22. [ The light emitting element 16 may be provided on the wiring 14 of the substrate 22 in the area where the light emitting element 16 is placed or on the element electrode 15 side of the light emitting element 16, It may be installed in both of them. The bonding member may be appropriately selected from a conductive liquid or paste form, such as a potting method, a printing method, and a transferring method depending on viscosity and the like.

The substrate 22 is constituted by a substrate that holds at least the wiring 14 and the wiring 14.

The wiring 14 may be formed on at least the upper surface (front surface) of the substrate, and may also be formed on the inside and / or the side surface and / or the lower surface (rear surface) of the substrate. The wiring 14 can be formed of, for example, copper or a copper alloy. Further, the substrate may be made of resin or fiber-reinforced resin, ceramics, glass, metal, paper or the like if it is a rigid substrate. It is preferable to use a substrate having physical properties close to the coefficient of linear expansion of the light-emitting element.

The light guiding member 24 is a member provided to be filled in a region surrounded by the reflecting member 17 and sealing the light emitting element 16 mounted on the substrate 22. [ As the light guiding member 24, a material having good light transmittance with respect to the wavelength of light emitted by the light emitting element 16 and having good weather resistance, light resistance and heat resistance as the sealing member is preferable. The light guide member 24 is provided on the side surface of the light emitting element 16 to guide the light from the side surface of the light emitting element 16 to the light transmitting member 25 more efficiently. Thus, light loss can be suppressed and the light extraction efficiency of the light emitting device 10 can be improved.

Examples of the material of the light guide member 24 include thermoplastic resin and thermosetting resin. As the thermoplastic resin, for example, a polyphthalamide resin, a liquid crystal polymer, polybutylene terephthalide (PBT), unsaturated polyester and the like can be used. As the thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin and the like can be used.

The reflecting member 17 constitutes a side wall of the light emitting device and reflects light from the light emitting element 16 to extract light from the light emitting surface 12 to the outside. The reflecting member 17 includes a first reflecting member 18 and a second reflecting member 20. The reflective member 17 enhances the light extraction efficiency by the first reflective member 18 and the second reflective member 20.

The reflective member 17 preferably has a light reflectance of 70% or more, more preferably 80% or more, and more preferably 90% or more in terms of the light emission peak wavelength of the light emitting element from the viewpoint of forward light extraction efficiency More preferable. Further, it is preferable that the reflecting member 17 is white. Therefore, it is preferable that the reflective member 17 contains a white pigment in the base material.

As the base material of the reflecting member 17, a resin can be used, and examples thereof include a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, or a modified resin thereof. Among them, the silicone resin and the modified silicone resin are preferable because they have excellent heat resistance and light resistance. Specific examples of the silicone resin include a dimethyl silicone resin, a phenyl-methyl silicone resin and a diphenyl silicone resin. The base material of the reflecting member may contain various fillers in the resin. Examples of the filler include silicon oxide, aluminum oxide, zirconium oxide, and zinc oxide. As the filler, one kind or two kinds or more of these may be used in combination. Particularly, silicon oxide having a small thermal expansion coefficient is preferable. Further, by using nanoparticles as the filler, it is possible to increase the scattering including the Rayleigh scattering of the blue light of the light emitting element, thereby reducing the amount of the wavelength conversion material used. The term "nanoparticle" means particles having a particle diameter of 1 nm or more and 100 nm or less. The " particle size " in this specification is defined, for example, as D50.

The white pigment is at least one of titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide and zirconium oxide May be used in combination. The shape of the white pigment is not particularly limited, and may be amorphous or crushed, and spherical in view of fluidity. The particle size of the white pigment may be, for example, about 0.1 탆 or more and about 0.5 탆 or less, and is preferably as small as possible in order to enhance the effect of light reflection or coating. The content of the white pigment in the reflective member can be appropriately selected and is preferably 10 wt% or more and 80 wt% or less, more preferably 20 wt% or more and 70 wt% or less, for example, from the viewpoint of light reflectivity and viscosity in liquid phase , More preferably 30 wt% or more and 60 wt% or less. Represents the ratio of the weight of the material to the total weight of the first reflective member 18 or the second reflective member 20. The term " wt% "

The first reflecting member 18 is provided at a position opposite to the short side of the light emitting element 16 when the light emitting element 16 having long sides and short sides as viewed from above is used. The first reflecting member 18 has an inclined surface or a curved inner surface 19 that is inclined so as to widen the gap facing the light transmissive member 25. In other words, each of the pair of first reflection members 18 has an inclined surface or a curved inner surface 19 which is inclined so that the distance therebetween is gradually widened toward the irradiation direction Br. The outer surface of the first reflecting member 18 is provided in contact with the inner surface of the second reflecting member 20. The upper end of the first reflecting member 18 is provided in contact with the lower surface of the phosphor layer 26. The first reflective member 18 is in contact with the side surface of the substrate opposite to the short side of the substrate 22 and the lower surface of the first reflective member 18 is provided so as to be flush with the lower surface of the substrate 22 . A part of the first reflecting member 18 enters the lower end of the second reflecting member 20 at the position where the second reflecting member 20 is provided and the lower end of the second reflecting member 20 enters the first And is positioned higher than the lower end of the reflective member 18. [ The first reflective member 18 uses, for example, a light reflective material such as a second reflective member 20 described later.

The second reflecting member 20 is provided so as to surround the first reflecting member 18 and the light emitting element 16. The second reflecting member 20 forms a side wall of the light emitting device 10. The upper end of the second reflecting member 20 is provided so as to be flush with the upper surface of the light transmitting member 25 and the side surface of the light transmitting member 25 Covering have. 3C, the second reflection member 20 is provided so as to be in contact with the upper surface of the peripheral edge of the substrate 22 in the longitudinal direction thereof. The thickness of the second reflecting member 20 is set to be less than half the thickness of the first reflecting member 18. In this case, It is more preferable that the thickness of the second reflecting member 20 is equal to or thinner than the thickness of the first reflecting member 18. By thinning the second reflecting member 20, the light emitting surface 12 can be made wider, and the taken-out light can be propagated in a wide range.

The second reflecting member 20 is manufactured by filling the groove provided in the first reflecting member 18 after the first reflecting member 18 is first installed in accordance with the manufacturing method described later. The material of the second reflective member 20 and the material of the first reflective member 18 set to be thinner than the thickness of the first reflective member 18 may be the same or different from each other . Here, an example is described as the same material, and therefore, for example, it is preferable to use the reflective member described above.

With such a configuration, the first reflecting member 18 and the second reflecting member 20 can suppress absorption of light from the light emitting element 16 and the phosphor. The first reflecting member 18 and the second reflecting member 20 serve to reflect light from the light emitting element 16 and the phosphor and to guide the light to the light emitting surface 12. By reducing the thickness of the second reflecting member 20, the light emitting surface 12 can be made as wide as possible on the top surface of the light emitting device 10, and the light extraction efficiency is improved.

The phosphor layer 26 is provided on the upper surface of the first reflecting member 18 and the light guide member 24. The phosphor layer 26 converts the light from the light emitting element 16 into a wavelength. For example, the light emitting element 16 emits blue light, and the phosphor layer 26 converts the wavelength conversion material, which is a phosphor, into a part of blue light, for example, yellow light. As a result, light (for example, white light) in which these lights are mixed can be emitted from the light emitting device 10. The wavelength conversion material contained in the phosphor layer 26 may be of a plurality of kinds or may contain a filler similar to the base material of the reflection member in place of or in addition to the wavelength conversion material.

As the wavelength conversion material (phosphor) contained in the phosphor layer 26, those known in the art can be used. For example, yttrium, aluminum, garnet (YAG) -based phosphors activated with cerium which emit green to yellow light, lutetium-aluminum-garnet (LAG) -based phosphors activated with cerium to emit green, (CaO-Al ₂ O ₃ -SiO ₂ ) -based phosphor activated with europium and / or chromium and a silicate ((Sr, Ba) ₂ SiO ₄ ) system activated with europium emitting blue- phosphor, between β emitting green light sialon phosphor, CaAlSiN ₃ emitting red light: represented by Eu is CASN-based or (Sr, Ca) AlSiN _3: nitride-based fluorescent material such as SCASN-based fluorescent material is represented by Eu, which emits red light A K ₂ SiF ₆ : Mn (KSF) -based phosphor, and a sulfide-based phosphor emitting red light.

The light-transmitting layer 28 transmits light from the phosphor layer 26, light from the light emitting element 16, and light from the reflecting member 17 to the outside. The upper surface of the light-transmitting layer 28 is used as the light-emitting surface 12. The light-transmitting layer 28 is provided so as to be in contact with the phosphor layer 26 and its peripheral side in contact with the second reflecting member 20. [ The upper surface of the light-transmitting layer 28 and the upper surface of the second reflecting member 20 are formed to be flush with each other. The light-transmitting layer 28 is preferably a material having light transmittance and being excellent in weather resistance, light resistance and heat resistance as the sealing member.

The term "translucency" as used herein means that the light transmittance at the luminescence peak wavelength of the light emitting element is preferably at least 60%, more preferably at least 70%, even more preferably at least 80%. As the base material of the light-transmitting layer 28, a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, or a modified resin thereof may be used. The base material of the light-transmitting layer 28 may be glass. Among them, the base material of the light-transmitting layer 28 is preferably a silicone resin and a modified silicone resin because of excellent heat resistance and light resistance. Specific examples of the silicone resin include a dimethyl silicone resin, a phenyl-methyl silicone resin and a diphenyl silicone resin. The light transmitting member 25 can be formed by laminating one kind of these base materials or two or more kinds of these base materials. The base material of the light-transmitting layer 28 may contain a filler similar to the base material of the first reflective member 18 and the second reflective member 20 in the resin or glass.

The light emitting device 10 is configured as described above so that the light transmitting member 25 (the phosphor layer 26 and the light transmitting layer 28) And is taken out from the light emitting surface 12 to the outside. A part of the light from the light emitting element 16 is likely to be taken out to the light emitting surface 12 side by the inclined surface or the curved inner surface 19 of the first reflecting member 18. [ The second reflecting member 20 covers the side surfaces of the fluorescent layer 26 and the light transmitting layer 28 so that light reflected by the second reflecting member 20 is extracted from the emitting surface 12 .

The first reflecting member 18 has a required thickness (for example, a thickness equal to or larger than that of the substrate 22) and forms a frame of the light emitting device 10 together with the substrate 22, Thereby maintaining the strength of the entire apparatus. The light emitting surface 12 can be made as wide as possible on the upper surface of the light emitting device 10 by disposing the phosphor layer 26 and the light transmitting layer 28 above the upper end of the first reflecting member 18. [ In addition, since the inclined surface or the curved inner surface 19 is formed on the upper surface of the first reflecting member 18, the light from the light emitting element 16 can easily be taken out from the light emitting surface 12. Therefore, the light emitting device 10 improves the light extraction efficiency and alleviates the unevenness in color tone.

≪ Method of manufacturing light emitting device &

Next, a manufacturing method of the light emitting device according to the first embodiment will be described below.

4, the manufacturing method of the light emitting device includes a step S101 for arranging the light emitting elements 16, a step S102 for installing the first reflection member 18, a step S103 for installing the light guiding member 24 A step S106 in which the light-transmissive member 25 is provided, a step S106 in which the first groove 32 is formed, a step S108 in which the second reflective member 20 is provided, and a step S109 in which the individual is formed Is done. In the manufacturing method of the light emitting device, the step S104 may be performed after the step S103 in which the light guide member 24 is provided. Alternatively, after the step S106 of forming the first groove 32, ) May be formed. Each step will be described below.

First, as shown in Figs. 4 and 5A, in step S101 of arranging the light emitting elements 16, a plurality of light emitting elements 16 are arranged on the substrate 22 on which the wirings 14 are formed. In the case of arranging the light emitting elements 16, it is preferable to carry out flip chip mounting through a bonding member. A plurality of the light emitting elements 16 are arranged in the row direction and the column direction at a predetermined interval. The arranged light emitting elements 16 are arranged such that the intervals on the heat side are larger than the intervals on the row side. The substrate 22 is provided with a through hole 22a on the heat side. The through hole 22a is formed continuously in the row direction, specifically, at a position opposite to the short side of the light emitting element 16, and is not formed at the periphery of the substrate 22. [ Further, the substrate 22 is subjected to an operation in a state in which the adhesive sheet 30 is attached to the back surface thereof.

In the step S102 of providing the first reflection member 18, in the light emitting element 16 arranged in the row direction and the column direction on the substrate 22, the light emitting element 16 is arranged between the rows of the light emitting elements 16 arranged in the column direction 1 reflection member 18 is provided. In other words, in FIG. 5A, the first reflecting member 18 is provided in the through hole 22a formed in the column direction. Specifically, as shown in Fig. 5B, the first reflection member 18 is provided on both sides of the light emitting device 16 mounted on the substrate 22, opposite to the short sides.

The first reflecting member 18 is provided so as to be spaced apart from the light emitting element 16 so as to maintain the height of the upper surface of the substrate 22 or higher while the viscosity of the first reflecting member 18 has been adjusted in advance and in the through hole 22a do. The substrate 22 is provided with a through hole 22a in advance along the area where the first reflecting member 18 is provided and is provided on the lower surface of the substrate 22 so as to close the opening of the through hole 22a. (30). Therefore, the lower surface of the first reflecting member 18 is formed so as to be flush with the lower surface of the substrate 22. Further, on the upper portion of the first reflection member 18, a portion which becomes a slant surface or a curved surface due to surface tension or viscosity is formed. The first reflecting member 18 is provided so as to be higher than the upper end of the light emitting element 16. The guide may be arranged on the substrate so that the first reflection member 18 has a predetermined shape and height when the first reflection member 18 is installed and the guide arranged when the first reflection member 18 is cured may be removed. The first reflection member 18 can be formed by transfer molding, injection molding, compression molding, potting and the like.

4 and 5C, in step S103 in which the light guide member is provided, the space between the first reflecting member 18 and the light emitting element 16 and the space between the light emitting elements 16 Is filled to be filled with the light guide member 24. Here, the light guiding member 24 is filled to a height at which the first reflecting member 18 and the light emitting element 16 are filled, and is cured. It is preferable that the light guiding member 24 is actively irradiated with ultraviolet rays when curing, when it is a thermosetting resin, and when it is ultraviolet ray curable resin. Examples of the charging method include transfer molding, injection molding, compression molding, and potting.

4 and 5D, in step S104, the light guide member 24 is left above the light emitting element 16, and a part of the upper part of the first reflection member 18 is removed The light guiding member 24 and the first reflecting member 18 are removed to be flat. Further, the light-guiding member 24 and the first reflecting member 18 may be removed by grinding with a grindstone, a disk-shaped rotary blade, a cloth or the like.

Thereafter, as shown in Figs. 4 and 5E, in step S105 in which the light-transmissive member is provided, a sheet member to be the phosphor layer 26 containing the phosphor in advance and a sheet member to be the light- The sheet member that is the light transmissive member 25 is provided on the upper surface of the light guide member 24 and the first reflective member 18 via the light transmissive bonding member. 5E, the sheet member of the phosphor layer 26 is formed thicker than the sheet member of the light-transmitting layer 28, but is not limited thereto. The phosphor layer 26 and the light-transmitting layer 28 may have the same thickness or the light-transmitting layer 28 may be formed thicker than the phosphor layer 26. Although the sheet-shaped light transmitting member 25 is used in the above description, the present invention is not limited thereto. The liquid light transmitting member 25 may be formed by spraying, or may be formed by printing or the like.

Subsequently, as shown in Figs. 4, 5F and 6A, in the step S106 of forming the first groove 32, the light transmitting member 25 (the phosphor layer The first groove 32 having a predetermined groove width is diced by a disk-like rotary blade or the like to remove a part of the first reflecting member 18 and the light reflecting layer 28 do. It is preferable that the depth of the first groove 32 penetrates through the light transmissive member 25 and the tip end of the first groove 32 is in the first reflecting member 18. The entire side surface of the light transmitting member 25 can be covered with the second reflecting member 20 in the step S108 of installing the second reflecting member 20 in the first groove 32 as the next step. This makes it possible to prevent color leakage from the side surface of the light transmitting member 25 when individualized in the individualizing step S109.

The first groove 32 is formed by a processing apparatus using a blade that rotates while moving the center of the first reflecting member 18. In the case of forming the first grooves 32, the table on which the substrate 22 is placed is moved in the X direction and the Y direction orthogonal to the X direction, and the machining apparatus is fixed to perform the machining operation. The table may be fixed and the processing apparatus may be moved to perform a machining operation. Here, step S107 of forming a second groove in the row direction, which is a direction orthogonal to the first groove 32, is performed here. The second grooves 34 are formed with respect to a space between a plurality of light emitting elements 16 arranged two-dimensionally. It is preferable that the second grooves 34 are formed so as to penetrate through the light transmissive member 25 and the light guide member 24 and reach the substrate 22. [ As a result, in step S108 in which the second reflecting member, which will be described later, is provided, the entire light guiding member 24 on the inter-row side is covered with the second reflecting member 20, Can be prevented.

4, 5G and 6B, in step S108 in which the second reflection member is provided, the second reflection member 20 is provided in the first groove 32 and in the second groove 34 Transfer molding, injection molding, compression molding, potting, and the like. The second reflection member 20 is formed of the same material as the first reflection member 18, for example. Here, after the second reflective member 20 is cured, a removal process is performed to adjust the thickness of the sheet member of the transparent layer 28 and the thickness of the second reflective member 20. Here, removal processing is performed so that the light-transmitting layer 28 is flat and has a predetermined thickness.

Lastly, as shown in Figs. 4, 5H and 6C, in the step S109 for individualizing, the center of the second reflecting member 20 is moved in the direction of the matrix by the working device until reaching the adhesive sheet 30 A cutting blade of an ultrasonic cutter, a cutter of a push cut type, and the like, thereby forming notched grooves 38. The cut grooves 38 are formed by cutting the cut grooves. In the step S109 for individualizing, a blade having a width narrower than that in the case where the first groove 32 and the second groove 34 are formed is used, and a machining operation is performed. And the individual light emitting devices 10 are bonded to the adhesive sheet 30 by being individualized. Then, the adhesive sheet 30 is peeled off, thereby forming the individual light emitting devices 10.

In the light emitting device 10, the first reflecting member 18 is configured such that the lower surface is located at the same position as the substrate 22. Therefore, in such a configuration of the light emitting device 10, the portion of the reflecting member 17 is singulated by dicing it with a disk-shaped rotary blade, a cutting edge of an ultrasonic cutter, It is possible to facilitate the individualization without cutting the cutter 22.

≪ Second Embodiment >

Next, a second embodiment of the light emitting device will be described with reference to Figs. 7 and 8. Fig. The same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

7, the light emitting device 10A includes the light emitting element 16 in the region between the first reflecting member 18 and the light emitting element 16 on the substrate 22, And / or the short sides of the first and second side walls. The third reflecting member 36 has an inclined surface or a curved inner surface which is tilted so as to come into contact with the inner surface of the first reflecting member 18 and face the light transmitting member 25 with a gap therebetween. In other words, each of the third reflecting members 36 has an inclined surface or an inner surface of a curved surface which is in contact with the inner surface of the first reflecting member 18, and whose distance between the facing surfaces is gradually widened toward the irradiation direction Br have.

The third reflecting member 36 is provided so as to be lower than the height of the light emitting element 16. The third reflecting member 36 is provided so as to be spaced apart from the light emitting element 16. The third reflecting member 36 may be formed of the same material as the first reflecting member 18 and the second reflecting member 20, or may be formed of another material. By providing the third reflecting member 36, light absorption on the upper surface of the substrate 22 is reduced and light is properly attracted to the light emitting surface 12, thereby further improving the light extraction efficiency.

The light emitting device 10A is provided after the step S102 of installing the first reflecting member in each of the steps shown in Fig. 4, and the step of installing the third reflecting member is performed before the step S103 of installing the light guiding member is performed . That is, as shown in Fig. 8, in the step of providing the third reflecting member, the third reflecting member 36 is provided inside the first reflecting member 18 along the column direction. The third reflecting member 36 is adjusted to a predetermined viscosity and forms an inclined surface or a curved surface toward the light emitting surface 12. [ After the step of providing the third reflecting member, the step S103 of installing the light guide member is performed, and the subsequent steps are as shown in Fig.

Next, the third to fifth embodiments will be described with reference to FIG. 9 to FIG. In addition, the same components as those already described are denoted by the same reference numerals, and the description thereof is appropriately omitted.

≪ Third Embodiment >

9, in the light emitting device 10B, the lower surface of the first reflecting member and the lower surface of the substrate 2 are formed to be flush with each other. Specifically, the lower end of the wiring 14, which is the lower surface of the substrate 22, is formed so as to be flush with the first reflecting member 18. Also in the other embodiments already described, it is preferable that the lower surface of the substrate 22 is formed to be flush with the first reflecting member 18. As a result, the light emitting device is stable at the time of mounting, and it becomes difficult for the light emitting device to tilt, thereby increasing the mounting accuracy.

The wiring 14 may be set on the lower surface side of the substrate 22 by changing the lengths of one and the other. Since the short and long sides of the wiring 14 indicate polarity, mistakes can be easily prevented when the light emitting device 10B is connected to an external device.

≪ Fourth Embodiment &

As shown in Fig. 10, the light emitting device 10C may be configured so as to pass through a via 114 formed by forming a through hole in the substrate 22 with respect to the wiring 14. The via 114 has a cylindrical inner wall surface wiring 114a provided on the inner peripheral surface of the through hole formed in the thickness direction of the substrate 22 and a filling member 114b provided in the inner wall surface wiring 114a . As the inner wall surface wiring 114a of the via 114, a member similar to the wiring 14 described above can be used. The inner wall surface wiring 114a is electrically connected to the device electrode 15 via the wiring 14 on the upper surface of the substrate 22 and is connected to the wiring 14 formed on the lower surface of the substrate 22. [ The filling member 114b of the via 114 is formed by filling an insulating member such as an epoxy resin, for example. Further, the filling member 114b is formed to have a dimension longer than the thickness dimension of the substrate 22. The wiring 14 includes a base wiring 14a which is provided in a predetermined range on the upper surface and the lower surface of the substrate 22 in advance and which is located at the upper and lower ends of the filling member 114b and communicates with the inner wall wiring 114a, And a connection wiring 14b which faces the base wiring 14a and covers the filling member 114b and is electrically connected to the device electrode 15. The wirings 14 are provided so as to correspond to the device electrodes 15 on the upper surface side and the lower surface side of the substrate 22 and are provided so as to face the upper and lower wirings 14 opposed to each other by the inner wall surface wirings 114a. As shown in Fig.

In the light emitting device 10C, the lower surface of the first reflecting member 18 is provided so as to be in contact with the upper surface of the substrate 22. [ The upper surface of the first reflecting member 18 is formed so as to be positioned higher than the upper surface of the light emitting element 16. The light emitting device 10C is formed such that the second reflecting member 20 is formed in a range from the center side in the thickness direction of the substrate 22 to the upper surface of the light transmitting member 25. [

≪ Embodiment 5 >

As shown in Fig. 11, the light emitting device 10D is formed so as to have an inclined surface 20d that is inclined so that the interval at which the second reflecting member 20D faces the light transmitting member 25D is narrowed. The second reflecting member 20D is formed in a triangular shape in section from the middle (middle) of the height direction of the first reflecting member 18D to the top surface of the light transmitting member 25D, for example. By forming the second reflecting member 20D, the portion of the first reflecting member 18D, which faces the second reflecting member 20D, becomes an inclined surface. In addition, the phosphor layer 26D and the light-transmitting layer 28D are formed into a trapezoidal shape in cross section by the formation of the second reflecting member 20D. The second reflective member 20D can form the upper side surface of the light transmissive member 25D with a predetermined thickness so that the light transmissive member 25D is damaged due to contact of the light emitting device 10D with other components, Can be further improved.

When manufacturing the light emitting device 10D, referring to FIG. 5F, the first groove 32 for mounting the second reflection member 20D can be formed by making a V-shaped cross section. The sectional shape of the second reflecting member 20D may be a trapezoidal shape, a triangular shape, or a step shape as long as the thickness of the side of the light transmitting member 25D is larger and the thickness of the second reflecting member 20D is decreased toward the substrate 22 .

≪ Sixth Embodiment &

As shown in Fig. 12, the light emitting device 10E is formed so as to have a plurality of (two in the drawing) light emitting elements 16 in the light emitting device 10C shown in the fourth embodiment. The base wire 14a on one side of the wire 14 is electrically connected to the conductive wire 14c so as to be electrically connected to each other so that the two light emitting devices 16 provided in the light emitting device 10E can be simultaneously turned on and off. As shown in Fig. Further, the light emitting device of another embodiment may be configured to include a plurality of light emitting devices 16 as in the light emitting device 10E.

In the first to fifth embodiments described above, the second reflecting members 20 and 20D are arranged in such a manner that the strength of the members is made larger than that of the first reflecting members 18 and 18D, It is more preferable to increase the hardness of the film. That is, since the portions of the second reflection members 20 and 20D are easy to contact with other external components such as the light guide plate, even if an excessive load is applied, the member strength and the member hardness are large, Can be suppressed. Here, when the hardness of the member is increased, even if the resins of the bases of the first reflecting member and the second reflecting member are the same, the hardness can be increased by changing the addition amount of the containing material such as titanium oxide have. Also, when the same silicone resin is used, different hardness is selected, and a silicone resin having high hardness is used as the second reflective member 20, 20D. Further, the hardness can be changed by making the second reflecting members 20 and 20D and the first reflecting members 18 and 18D different from each other. For example, a silicone resin is used for the first reflecting members 18 and 18D, and an epoxy resin having generally higher hardness than the silicone resin is used for the second reflecting members 20 and 20D.

The case where the strength of the member is large refers to a silicone resin having a large tensile strength in comparison with a tensile strength when the base resin is the same silicone resin. The case where the strength of the member is large refers to, for example, an epoxy resin having a large bending strength in comparison with a bending strength when the base resin is the same epoxy resin. When the types of the resins are different, for example, when one of them is a silicone resin and the other is an epoxy resin, the bending strength and the tensile strength are compared with each other in terms of strength to determine the magnitude of the strength.

When the hardness of the member or the strength of the member is to be determined, it can be determined by measurement by a known measuring method such as JIS. In addition, the strength of a member refers to a resistance against deformation or fracture.

<Modification Example>

Although the through holes 22a are formed in the substrate 22 and the lower surface of the first reflecting member 18 and the lower surface of the substrate 22 are formed in the same plane in each of the embodiments, The lower surface of a part of the first reflection member 18 may be formed so as to be flush with the lower surface of the substrate 22 as shown in Fig. Here, in the state that the left and right ends of the first reflecting member 18 are in contact with the upper surface of the substrate 22, the center of the first reflecting member 18 is flush with the lower surface of the substrate 22 To be installed. By thus forming the lower surface of the first reflecting member 18 inside or outside the through hole 22a of the substrate 22, the bonding area between the substrate 22 and the first reflecting member 18 can be increased to improve the adhesion have.

13B, the first reflecting member 18 may be provided on the upper surface of the substrate 22 without forming the through hole 22a in the substrate 22. [ By providing the first reflecting member 18 on the upper surface of the substrate 22 as described above, the amount of the material used for the first reflecting member 18 is set to be larger than the case of forming the through hole 22a in the substrate 22 .

Further, the material of the first reflecting member 18 and the second reflecting member 20 may be changed. The first reflecting member 18, the second reflecting member 20, and the third reflecting member 36 may be made of different reflecting materials. By changing the reflection material, it becomes easy to adjust, for example, the light extraction efficiency.

The translucent member 25 has been described as having the phosphor layer 26 and the translucent layer 28. The translucent member 25 may be used only as the translucent layer 28 or as the phosphor layer 26 May be used.

As the wavelength conversion material (phosphor) used for the phosphor layer 26, other materials known in the art may be used in addition to those described above. Further, the phosphor layer 26 may be provided not only as a single layer but also as a plurality of layers. When the phosphor layer is provided as a plurality of layers, the wavelength conversion material may be provided for each phosphor layer.

The first reflecting member 18 may be provided so as to surround the light emitting element. In other words, the light emitting device 16 may be provided with a predetermined distance from all sides thereof. The first reflecting member 18 has an inclined surface or an inner surface of a curved surface so as to widen the gap facing the light transmitting member 25. Thereby, the light from the light emitting element 16 is more easily taken out from the light emitting surface by the first reflecting member 18, and the light takeout efficiency is improved.

In this case, it becomes feasible to prepare a substrate in which a through hole is formed also in the column direction like the through hole 22a in the row direction.

In the manufacturing method of the light emitting device, the step S105 of installing the following light transmitting member is performed without performing the step S104 of removing the part of the first reflecting member 18 and the part of the light guiding member 24 . It is preferable that the light guiding member 24 is filled to a height up to the upper end of the first reflecting member 18 when the step S104 is not performed.

Then, the step S107 for forming the second groove may be carried out to the step S109 for individualizing only the first groove 32, without doing so. In this case, a reflective plate capable of reflecting light from the light emitting element 16 may be provided on the front and back sides of the portion where the second groove 34 is formed.

10, 10A to 10D: Light emitting device
12: light emitting surface
14: Wiring
14a: base wiring
14b: connection wiring
14c: conduction wiring
15: Device electrode
16: Light emitting element
17: reflective member
18: first reflection member
19: My side
20: a second reflection member
22: substrate
24: light guiding member
25: Light-transmissive member
26: Phosphor layer
28:
30: Pressure sensitive adhesive sheet
32: First Home
34: 2nd home
36: Third reflective member
38: notch groove
S101: Step of arranging the light emitting element
S102: Step of installing the first reflecting member
S103: Step of installing light guide member
S104: Step of removing
S105: Step of installing the light transmitting member
S106: Step of forming first groove
S107: Step of forming second groove
S108: Step of installing the second reflecting member
S109: Individualization process
Br: Survey direction

Claims (17)

A rectangular substrate,
A light emitting element mounted on the substrate,
A reflecting member provided so as to surround the light emitting element with a gap therebetween,
A light guiding member filled in the inside of the reflecting member so as to cover the light emitting element in the reflecting member,
And a light transmitting member provided on the light guiding member,
Wherein the reflective member includes a first reflective member disposed to face the side surface of the light emitting element and a second reflective member located outside the first reflective member and surrounding the light emitting element,
Wherein the first reflecting member has an inclined surface or an inner surface of a curved surface that is inclined so that the interval facing the light transmitting member is wider,
The second reflecting member covers the side surface of the light transmitting member and the outer surface of the first reflecting member and the upper surface of the second reflecting member is flush with the upper surface of the light transmitting member. The method according to claim 1,
Wherein the lower surface of the first reflecting member and the lower surface of the substrate are flush with each other. 3. The method according to claim 1 or 2,
And at least a part of the first reflecting member is disposed on an upper surface of the substrate. 4. The method according to any one of claims 1 to 3,
Wherein the light transmitting member is positioned above the upper end of the first reflecting member. 5. The method according to any one of claims 1 to 4,
And the second reflecting member has an inclined surface that is inclined so that an interval facing the light transmitting member is narrowed. 6. The method according to any one of claims 1 to 5,
Wherein the material of the first reflecting member and the material of the second reflecting member are the same. 6. The method according to any one of claims 1 to 5,
Wherein the material of the first reflecting member and the material of the second reflecting member are different from each other. 8. The method according to any one of claims 1 to 7,
And the intensity of the second reflecting member is larger than the intensity of the first reflecting member. 8. The method according to any one of claims 1 to 7,
And the hardness of the second reflective member is larger than the hardness of the first reflective member. 10. The method according to any one of claims 1 to 9,
Wherein the light transmitting member comprises a phosphor layer and a light transmitting layer laminated thereon. 11. The method according to any one of claims 1 to 10,
Wherein the reflecting member further comprises a third reflecting member having an inclined surface or a curved inner surface which is tilted so as to be in contact with the inner surface of the first reflecting member and facing the light transmitting member. A step of arranging a plurality of light emitting elements on a substrate,
A step of providing a first reflecting member spaced apart from the light emitting element between the light emitting elements,
A step of providing a light guide member covering the light emitting element and contacting the first reflection member;
A step of providing a light transmitting member on the light guiding member and the first reflecting member,
A step of forming a first groove by removing the light transmitting member and a part of the first reflecting member,
Providing a second reflective member in contact with the light transmissive member and the first reflective member in the first groove;
And cutting the second reflecting member to individualize the second reflecting member. 13. The method of claim 12,
Wherein the light emitting elements are arranged in the row direction and the column direction, and the step of providing the first reflection member is provided only between the rows of the light emitting elements arranged in the column direction. 14. The method of claim 13,
And a step of forming a second groove by removing a part of the light guiding member and the light transmitting member between the rows of the light emitting elements arranged in the row direction before the step of installing the second reflecting member,
The step of providing the second reflecting member includes a step of providing the second reflecting member in contact with the light transmitting member and the light guiding member in the second groove. 15. The method according to any one of claims 12 to 14,
Wherein the step of providing the light transmitting member includes the step of providing the light guiding member so as to cover the upper surface of the first reflecting member, wherein, before the step of providing the light transmitting member, Further comprising the step of removing a part of the light-emitting element and leaving the light-guiding member above the light-emitting element. 16. The method according to any one of claims 12 to 15,
Wherein the substrate has a through hole and includes a step of forming a part of the first reflecting member in the through hole. 17. The method according to any one of claims 12 to 16,
A third reflecting member having an inclined surface or an inner surface of a curved surface that is tilted so as to be opposed to the inner surface of the first reflecting member and faces the light transmitting member before the step of installing the light guiding member, Wherein the light emitting device further comprises a step of installing the light emitting device.

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