KR20180115423A - Carrier tape and fabricating method thereof - Google Patents

Abstract

The present invention relates to a carrier tape and a method for manufacturing the carrier tape, including a base layer having a certain width and formed long in the longitudinal direction, a sprocket hole formed to penetrate one side or both sides of the base layer width, first and second electrified layers formed on the upper and lower surfaces of the base layer to be electrically connected to and in contact with a side surface of the base layer and the surface of the sprocket hole, and an accommodating groove formed by the base layer and the first and second electrified layers being formed to be continuous at regular intervals in the longitudinal direction in one row by a mold between the sprocket holes or on the other side. Accordingly, the first and second electrified layers are brought into contact and electrically connected, and thus generated static electricity can be easily removed even in a state where multiple carrier tapes are stacked. Accordingly, breakage of electronic components in the accommodating groove attributable to static electricity can be prevented. In addition, exposure after embedding or burrs or fine particles into the first and second electrified layers during the formation of the first and second electrified layers without a separate process can be prevented, and thus removal time decreases and productivity is improved.

Description

≪ Desc / Clms Page number 1 > Carrier tape and fabricating method &

The present invention relates to a carrier tape and a manufacturing method thereof, and more particularly to a carrier tape for packaging electronic components such as semiconductor devices and a manufacturing method thereof.

Electronic components such as semiconductor devices are packed on a carrier tape for convenience of transportation and assembly, and the carrier tape is wound on a take-up reel and carried. In order to prevent each electronic component, such as a packaged semiconductor element, from being destroyed by static electricity, the carrier tape includes a conductive material on the upper and lower surfaces of a base layer made of a non- The first and second charge control layers are formed. Even if static electricity is generated by the first and second charge control layers, the charge is discharged to the outside without being transferred to electronic components such as semiconductor elements in the receiving recess. This prevents the electronic components such as semiconductor devices from being broken down.

In the above carrier tape, first and second electroconductive layers are formed on the upper and lower surfaces of the base layer, which is cut so as to have a constant width of the sheet fabric of the nonconductive synthetic resin, The upper and lower molds are press-formed with air as they come in contact with each other, and the receiving grooves for receiving the electronic components such as the semiconductor elements are continuously arranged in a row in the longitudinal direction. Sprocket holes are formed on one side or both sides of the receiving grooves formed in series in the longitudinal direction in order to move the carrier tape in a saw-like shape.

The carrier tape has a base layer cut to have a certain width after the first and second conductive layers having conductivity are formed on the upper and lower surfaces of the sheet fabric of the nonconductive synthetic resin to be used as the base layer, Not only is the removal of all of the two antistatic layers, but also the formation of fine burrs in which a part of a certain layer or a part of a plurality of layers remains on the cut surface, as well as the cutting surfaces are not smooth and rough, resulting in microscopic particles adhered weakly. Such burrs and fine particles are attached to an electronic component such as a semiconductor element accommodated in a receiving groove in use and short-circuit the electronic component to destroy it. Therefore, the carrier tape must remove burrs and fine particles formed on the cut surface.

An apparatus for removing burrs and fine particles according to the prior art is disclosed in Korean Patent Publication No. 2002-0075684 entitled "Burr removing apparatus for carrier tape for electronic chip components".

A burr removing device for a carrier tape for electronic chip components according to the related art includes a body; Guiding means provided on the body for holding and guiding the carrier tape for carrier tape guided from the punching device to the rewinding device; And burning means for burning burrs and fine particles generated in the chip insertion holes of the carrier tape guided by the guide means.

The carrier tape for electronic chip components includes at least a first and a second electrification layer on the upper surface and the lower surface of the base layer made of synthetic resin and having a strength to such an extent that the shape can be maintained.

The burning means for removing the burrs and the fine particles is composed of at least one heater, and the heating temperature of the heater is 100 to 1000 ° C to be,

The opposite side of the heater further includes a supporting means for supporting the opposite side of the heating surface of the carrier tape for carrier tape so as to prevent the carrier tape from being pushed by hot air generated from the heater.

However, when the apparatus according to the prior art is removed at a low temperature of about 100 캜 when burrs formed on the carrier tape and fine particles adhering weakly to the cut surfaces are removed, the removal time is increased to lower the productivity, There is a problem that carrier tape is deformed by heat when it is removed at a high temperature of about 1000 캜. The carrier tape on which burrs and fine particles have been removed has a problem in that it is difficult to remove the static electricity generated in the laminated state because the first and second electrification layers formed on the upper surface and the lower surface of the base layer are electrically separated.

Accordingly, an object of the present invention is to provide a carrier tape capable of improving productivity by preventing burrs and fine particles from being buried in the inside when forming the first and second charge control layers, .

It is another object of the present invention to provide a carrier tape capable of easily removing static electricity generated in a state where first and second electrification layers formed on the upper surface and the lower surface of the base layer are electrically connected and laminated, and a method of manufacturing the same. .

According to an aspect of the present invention, there is provided a carrier tape comprising: a base layer having a predetermined width and elongated in a longitudinal direction; a sprocket hole formed to penetrate one side or both sides of the width of the base layer; First and second electrification layers formed in contact with each other at a side surface of the base layer and at the surface of the sprocket hole so as to be electrically connected to each other, and a base layer and first and second electrification layers formed between the sprocket holes, And a receiving groove formed continuously in the longitudinal direction at regular intervals in the opened rows.

The base layer is formed of a solvent resin or a solvent-resistant resin with a thickness of 0.1 to 2 mm and a width of 10 to 100 mm.

The first and second charge control layers may be formed of at least one selected from the group consisting of PEDOT / PSS (3,4-Ethylene Di-Oxythiophene / PSS), polyaniline, polythiophene, sulfur nitride, and the like.

In order to accomplish the above objects, a method of manufacturing a carrier tape according to the present invention comprises the steps of cutting a sheet end to form a base layer, punching the cut base layer to penetrate the base layer at one side or both sides in a widthwise direction, A step of forming first and second electrified layers so as to be in contact with each other so as to cover the surfaces of the sprocket holes and the side surfaces cut on the upper and lower surfaces of the base layer, And forming a receiving groove such that the receiving groove is continuously formed in one row in the longitudinal direction of the cut sheet raw material at a predetermined interval on the other side of the sprocket holes by press-molding the second releasing layer with air.

The base layer is formed of a solvent resin or a solvent-resistant resin.

In this case, the cutting of the base layer and the formation of the sprocket holes proceed sequentially or simultaneously.

The first and second conductive layer in the PEDOT / PSS (PEDOT: 3,4- Ethylene Di Oxy Thiophene / PSS: Poly Stylene Sulfonate), polyaniline (polyaniline), polythiophene (polythiophene), and poly sulfur nitride (poly sulfur nitride, and the like.

The first and second electroless layers may be formed by applying one or more of the conductive polymers to one of the conductive polymers such as Toluene, MEK (methyl ethyl ketone), acetone, acetic acid, TCE (Tri Chlor Ethylene), DMSO (Di Methyl Sulfoxide) (Hexafluoro-2-propanol), and alcohols, or the like, in a mixed state.

The first and second charge control layers are formed by any one of roller coating method, dipping method, spray method, squeeze coating, or pad coating by automatic or manual methods.

The first and second charge control layers are formed to have a thickness of 0.001 to 0.3 mm.

Accordingly, since the first and second electrification layers are in contact with and electrically connected to each other, the static electricity generated even when a plurality of carrier tapes are laminated can be easily removed, so that the electronic parts in the receiving recess are destroyed by static electricity There is an advantage that it can be prevented. In addition, burrs and fine particles are prevented from being buried in the first and second charge control layers when the first and second charge control layers are formed, And the productivity is improved.

1 is a perspective view of a carrier tape according to the present invention;
Fig. 2 is a sectional view taken along line AA of Fig. 1; Fig.
3 is a view showing the state of use of the carrier tape according to the present invention.
Figs. 4A to 4C are views showing a manufacturing process of a carrier tape according to the present invention. Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

Fig. 1 is a perspective view of a carrier tape 10 according to the present invention, and Fig. 2 is a sectional view taken along line A-A of Fig. 1. Fig.

The carrier tape 10 according to the present invention includes a base layer 11, a sprocket hole 23, first and second electrifying layers 13 and 15, and a receiving groove 19.

The base layer 11 is made of a synthetic resin having a thickness of about 0.1 to 2 mm and a constant width, for example, a width of about 10 to 100 mm, so that the carrier tape 10 has strength enough to maintain its shape, . The base layer 11 may be formed of any one of a solvent-resistant resin which is not soluble in an organic solvent such as polyethylene (PE), polypropylene (PP), polyester (Polyethylene Terephthalate) and polycarbonate (PC) And a solvent resin dissolved in an organic solvent such as polystyrene (PS), polyvinyl chloride (PVC), and ABS (Acrylonitrile Butadiene Styrene).

The sprocket holes 23 are punched and penetrated to one side or both sides of the base layer 11. The sprocket holes 23 are used to move the carrier tape 10 by a certain distance in order to smoothly extract an electronic component such as a semiconductor element in the receiving groove 19.

First and second conductive layers 13, 15 is PEDOT / PSS on top surface and bottom surface of the base layer (11) (PEDOT: 3,4- Ethylene Di Oxy Thiophene / PSS: Poly Stylene Sulfonate), polyaniline ( polyaniline), polythiophene (formed by any one of a conductive polymer such as polythiophene) and poly sulfur nitride (poly sulfur nitride). The first and second electrifying layers 13 and 15 may be formed by a roller coating method or an immersion method such as an automatic or manual method so as to have a surface resistance of about 10 ⁶ to 10 ⁹ ohm / , A spray method, a squeeze coating, or a PAD coating. The first and second charge generation layers 13 and 15 may be formed of any one of the conductive polymers described above such as toluene, MEK (methyl ethyl ketone), acetone, acetic acid chelate, TCE (Tri chloro Ethylene), DMSO Or a mixture of two or more of organic solvents such as methanol, ethanol, methyl sulfoxide, DCM (Di Chloro Methane), HFP (Hexafluoro-2-Propanol) and alcohols.

The first and second electrifying layers 13 and 15 are formed on the upper surface and the lower surface of the base layer 11 as well as on the side surface so as to be electrically connected to each other. Since the first and second electrification layers 13 and 15 are electrically connected to each other, the static electricity generated even when the carrier tape 10 is stacked in a plurality of layers can be easily removed, It is possible to prevent the parts from being destroyed by the static electricity. Since the first and second electrifying layers 13 and 15 are formed on the side surface of the base layer 11 and are formed so that burrs (not shown) that may remain on the cut side of the base layer 11 The fine particles may be covered by the above-mentioned conductive polymer forming the first and second electrifying layers 13 and 15, so that they are not exposed or may be dissolved and removed by an organic solvent mixed with the conductive polymer.

The first and second electrifying layers 13 and 15 are also formed on the punched surface of the sprocket hole 23 so that burrs (not shown), which may remain on the surface, and fine particles, Lt; RTI ID = 0.0 > 11, < / RTI >

The receiving groove 19 accommodates an electronic component such as a semiconductor element so that the base layer 11 and the first and second electrifying layers 13 and 15 are continuously heated in the longitudinal direction between the upper and lower molds And is formed by press-molding with air.

Fig. 3 is a state of use of the carrier tape 10 according to the present invention.

The receiving groove 19 of the carrier tape 10 according to the present invention is sealed with the cover tape 27 in a state where the electronic component 25 such as a semiconductor element is accommodated. The cover tape 27 is formed of thermoplastic adhesive such as thermoplastic EVA (Ethylene Vinyl Acetate Copolymer) having flexibility or synthetic resin such as silicone adhesive or acrylic adhesive. The cover tape 27 can prevent the electronic component 25 such as a semiconductor element contained in the receiving groove 19 from flowing out to the outside when the carrier tape 10 is unwound from the take-up reel.

4A to 4C are views showing a manufacturing process of a carrier tape according to the present invention.

Referring to FIG. 4A, a sheet material having a thickness of about 0.1 to 2 mm may be formed to have a constant width, for example, about 10 to 100 mm, so that the carrier tape 10 can have a strength enough to maintain its shape. The base layer 11 is formed by cutting the base layer 11 in the longitudinal direction. The sprocket holes 23 are formed by punching the cut base layer 11 so as to penetrate the base layer 11 so as to be continuous at one side or both sides in the width direction at regular intervals. Not only a large number of burrs 21 are generated on the cut surface of the base layer 11 cut at the above but also the cut surfaces are not smooth but rough and weakly attached fine particles are generated. Also, a large number of burrs 21 and fine particles are generated on the punched surface on which the sprocket holes 23 are formed as in the cut surface of the base layer 11. The burrs 21 and the fine particles may be formed without being completely removed from the cut surface of the base layer 11 or the punched surface of the sprocket holes 23. [

The sprocket holes 23 may be sequentially formed after the base fabric layer 11 is formed by cutting the sheet fabric. In another embodiment of the present invention, the base fabric layer 11 is formed by cutting the sheet fabric, The hole 23 can be formed.

Referring to FIG. 4B, the first and second charge generating layers 13 and 15 are formed on the upper and lower surfaces of the base layer 11, respectively. First and second conductive layers (13) (15) PEDOT / PSS in the above (: 3,4-Ethylene Di Oxy Thiophene / PSS: PEDOT Poly Stylene Sulfonate), polyaniline (polyaniline), polythiophene (polythiophene), and poly sulfur nitride (poly sulfur nitride) which of the conductive polymer, such as one surface resistance of 10 ⁶ ~ 10 ⁹ ohm / sq degree is such that the roller coating method by automatically or manually so as to have a thickness of 0.001 to 0.3 degree respectively, dip , A spray method, a squeeze coating, or a PAD coating.

The first and second charge generation layers 13 and 15 may be formed of any one of the conductive polymers described above by adding toluene, MEK (methyl ethyl ketone), acetone, acetic acid, TCE (tri chloro ethylene), DMSO Or an organic solvent such as methanol, ethanol, propanol, methyl sulfoxide, DCM (Di Chloro Methane), HFP (Hexafluoro-2-Propanol) and alcohols.

The first and second electrified layers 13 and 15 are formed on the upper surface and the lower surface of the base layer 11 as well as on the side surface and are electrically connected to each other. Since the first and second electrification layers 13 and 15 are electrically connected to each other, the static electricity generated even when the carrier tape 10 is stacked in a plurality of layers can be easily removed, It is possible to prevent the parts from being destroyed by the static electricity. Since the first and second electrifying layers 13 and 15 are formed on the side surface of the base layer 11 and are formed so that burrs (not shown) that may remain on the cut side of the base layer 11 The fine particles are covered by the above-mentioned conductive polymer forming the first and second electrifying layers 13 and 15 and are not exposed or can be dissolved and removed by an organic solvent mixed with the conductive polymer.

4C, the base layer 11 on which the first and second electrification layers 13 and 15 are formed is press-formed between the upper and lower molds with air to form the receiving grooves 19 between the sprocket holes 23 or on the other side. . The receiving groove 19 of the receiving groove 19 is formed so as to be continuous at a predetermined interval in a single row in the longitudinal direction of the base layer 11 cut by receiving the electronic component such as a semiconductor element.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be apparent to those of ordinary skill in the art.

10: Carrier tape 11: Base layer film
13: first conductive layer 15: second conductive layer
17: conductive layer 19: receiving groove
21: burr 23: sprocket hole

Claims (11)

A base layer having a predetermined width and elongated in the longitudinal direction,
A sprocket hole formed to penetrate one side or both sides of the width of the base layer,
First and second electroless plating layers formed on upper and lower surfaces of the base layer so as to be electrically connected to each other at a side surface of the base layer and a surface of the sprocket hole,
Wherein the base layer and the first and second electrification layers are formed by a metal mold in a continuous manner in a longitudinal direction in a row between the sprocket holes or on the other side.
The carrier tape according to claim 1, wherein the base layer is formed of a solvent resin or a solvent-resistant resin.
The carrier tape according to claim 1, wherein the base layer has a thickness of 0.1 to 2 mm and a width of 10 to 100 mm.
The method according to claim 1 wherein the first and second conductive layer is PEDOT / PSS (PEDOT: 3,4- Ethylene Di Oxy Thiophene / PSS: Poly Stylene Sulfonate), polyaniline (polyaniline), polythiophene (polythiophene), and poly sulfur knit A carrier tape formed from any one of conductive polymers of poly sulfur nitride.
Forming a base layer by cutting the sheet fabric so as to form the sprocket holes by punching the cut base layer so as to penetrate to one side or both sides in the width direction so as to be continuous at regular intervals;
Forming first and second electroless layers so as to cover the side surfaces cut on the upper and lower surfaces of the base layer and the surfaces of the sprocket holes to be in electrical contact with each other,
Forming the base layer and the first and second electrifying layers by pressurizing with air to form receiving grooves continuously in one row in the longitudinal direction of the cut sheet raw material in the space between the sprocket holes or on the other side A method for manufacturing a carrier tape.
The carrier tape manufacturing method according to claim 5, wherein the base layer is formed of a solvent resin or a solvent-resistant resin.
The method of manufacturing a carrier tape according to claim 5, wherein cutting of the base layer and formation of a sprocket hole are performed sequentially or simultaneously.
The method according to claim 5 wherein the first and second conductive layers of PEDOT / PSS (PEDOT: 3,4- Ethylene Di Oxy Thiophene / PSS: Poly Stylene Sulfonate), polyaniline (polyaniline), polythiophene (polythiophene), and poly sulfur knit Wherein the conductive polymer is formed by applying any one of conductive polymers of poly sulfur nitride.
[8] The method of claim 8, wherein the first and second electroless plating layers are formed on one of the conductive polymers by using one of toluene, MEK (methyl ethyl ketone), acetone, acetic acid, TCE (tri chloro ethylene), DMSO Wherein the carrier tape is formed by applying one or more kinds of organic solvents such as DCM (Di Chloro Methane), HFP (Hexa Fluoro-2-Propanol) and alcohols in a mixed state.
The carrier tape manufacturing method according to claim 5, wherein the first and second charge control layers are formed by any one of roller coating method, dipping method, spray method, squeeze coating method, or pad coating method by automatic or manual method.
The carrier tape manufacturing method according to claim 5, wherein the first and second charge control layers are formed to a thickness of 0.001 to 0.3 mm.

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