KR20180109440A - Adhesive dissipation sheet having 3-dimension dissipation structure and manufacturing method for adhesive dissipation sheet having 3-dimension dissipation structure - Google Patents

Abstract

The present invention relates to an adhesive heat dissipation sheet having a three-dimensional heat dissipation structure, configured to maximize thermal conductivity through a three-dimensional material composition and an alignment structure so as to implement high heat dissipation characteristics; and to a manufacturing method thereof. According to the present invention, a manufacturing method of the adhesive heat dissipation sheet having a three-dimensional heat dissipation structure comprises: a base substrate preparing step of preparing a base substrate formed of a flexible material; and a heat dissipation adhesive layer forming step of forming and stacking an adhesive layer including a particulate heat dissipation material with thermal conductivity on the base substrate. In the heat dissipation adhesive layer forming step, at least two or more layers having different contents of the particulate heat dissipation material with respect to an adhesive resin are formed. The heat dissipation adhesive layer forming step comprises a step of interconnecting the particulate heat dissipation materials constituting the heat dissipation adhesive layer so that the adhesive heat dissipation sheet has a multi-directional alignment structure including horizontal and vertical directions.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an adhesive heat-dissipating sheet having a three-dimensional heat-dissipating structure and a method of manufacturing an adhesive heat-dissipating sheet having a three-dimensional heat-

The present invention relates to a process for producing a heat-sensitive adhesive sheet having a heat-sensitive adhesive sheet and a three-dimensional heat radiation structure, and more particularly to a process for producing a heat- Dimensional heat radiation structure and a method of manufacturing a heat radiation adhesive sheet having a three dimensional heat radiation structure.

This study is the result of research carried out by the Ministry of Commerce, Industry and Energy and the Korea Industrial Technology Development Agency to promote the economic cooperation industry.

(This research was supported by the Ministry of Trade, Industry & Energy (MOTIE), Korea Institute for Advancement of Technology (KIAT) through the Encouragement Program for the Industries of Economic Cooperation Region.

Heat dissipation materials are widely used in various industrial fields such as automobiles, electric and electronic devices. Particularly, various researches on the above-mentioned heat-radiating materials have been continuing as complexing of structural materials, miniaturization of parts and structures, weight reduction, and high performance have been accelerated.

For example, since the high integration of electronic devices is realized, many heat generated in the electronic device causes problems such as malfunction of the peripheral devices of the electronic device and deterioration of the substrate as well as deterioration of functions of the device itself, There is a growing demand for heat dissipation materials.

In recent years, in order to release the heat generated in the electronic device to the outside, a heat radiation sheet formed by curing a pressure-sensitive adhesive composition containing thermally conductive particles and formed into a sheet is used as a heat radiation material. For example, the heat-radiating sheet is sandwiched between a heat-generating body such as an electronic part built in an electronic product such as a computer, a monitor, and a mobile phone, and a heat-dissipating body such as a heat sink, a heat- It is used for heat dissipation.

For example, the conventional heat radiation sheet mainly uses a metal foil such as aluminum, and recently, as a method for increasing the thermal conductivity, a metal layer, a metal thin film or a mesh And a heat radiation coating layer (Document 1: Korean Patent Laid-Open Publication No. 10-2012-73792).

However, such a heat-radiating sheet such as a metal foil and a metal foil has a problem in that there are obstacles in terms of uniform heat dissipation due to defects such as cracks and cracks during frequent folding of a flexible circuit board and the like.

Further, as a heat-radiating sheet which does not use a metal foil or a metal thin film, a high-conductivity layer is deposited by another sputtering process or the like to improve heat dissipation property, and then a heat- (Patent Document 2: Korean Patent Laid-open Publication No. 10-2016-0033110).

However, such a pure polymer type heat-radiating sheet is excellent in folding property, but has a problem that the heat radiation property is deteriorated.

In addition, although the thermal problem caused by the electronic component is solved through the heat-radiating sheet formed using the resin composition for heat radiation material including the thermally conductive filler such as alumina or silica, the heat accumulation phenomenon by the electronic component is increased Accordingly, development of a heat-radiating sheet having a heat dissipation property that is more improved than that of a conventional heat dissipating material is required.

(Document 1) Korean Patent Laid-Open No. 10-2012-0073792 (Published on July 5, 2012) (Document 2) Korean Patent Publication No. 10-2016-0033029 (published on November 22, 2016) (Document 3) Korean Patent Registration No. 10-1303229 (Announcement of Mar. 31, 2013) (Document 4) Korean Patent Laid-open Publication No. 10-2015-0034380 (published on April 03, 2013)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide an adhesive heat radiation sheet having a three-dimensional heat dissipation structure capable of realizing a high heat dissipation characteristic by maximizing thermal conductivity through a three- And a method for manufacturing the heat-sensitive adhesive sheet.

The present invention has been made in view of the above problems, and it is an object of the present invention to provide an apparatus and method for controlling the same.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a base substrate having a base substrate made of a flexible material; And a heat radiation adhesive layer forming step of forming an adhesive layer including a particulate heat radiation material having thermal conductivity on the base material, wherein the step of forming a heat radiation adhesive layer comprises a step of forming a heat radiation adhesive layer, Wherein the step of forming the heat radiation adhesive layer includes a step of interconnecting the particulate heat radiation materials constituting the heat radiation adhesive layer so as to have a multi-directional alignment structure including a horizontal direction and a vertical direction A heat radiation sheet having a three-dimensional heat radiation structure is provided.

In one aspect of the present invention, in the case where the base substrate provided in the base substrate preparation step is composed of a film base material of a fiber base material or a resin base material and the base base material is a film base material of resin, Wherein the heat radiation adhesive layer is made of a particulate heat radiation material in which a metal is synthesized with inorganic particles and the heat radiation adhesive layer is applied with an electric field or a magnetic field so as to have a melting point higher or lower than the melting point of the adhesive resin, May be interconnected to have a multi-directionally oriented heat transfer structure.

In one aspect of the present invention, the step of forming a heat-radiating adhesive layer includes the steps of: preparing a heat-radiating material to form a particulate heat- Providing a pressure-sensitive adhesive composition comprising the particulate heat dissipation material and a viscous resin mixed at a predetermined ratio; A first adhesive layer forming step of forming a first adhesive layer on the base substrate using the adhesive composition; A curing step of curing the first adhesive layer; A second adhesive layer forming step of forming a second adhesive layer on the cured first adhesive layer using the adhesive composition; And a curing step of curing the second adhesive layer, wherein the first adhesive layer and the second adhesive layer have different mixing concentrations of the particulate heat dissipation material for the adhesive resin, and the first adhesive layer and the second adhesive layer And forming a heat load in at least a horizontal direction and a vertical direction by applying an electric field or a magnetic field to at least one of the adhesive layers to connect the particulate heat dissipation materials.

In one aspect of the present invention, the heat-rod forming step may be performed before the first adhesive layer or the second adhesive layer is formed and cured, or may be performed to the second adhesive layer and performed on the cured laminate .

In one aspect of the present invention, the heat dissipation material provided in the step of preparing the heat dissipation material includes at least one inorganic particle selected from the group consisting of boron nitride (BN), aluminum nitride (AlN) and silicon carbide (SiC) Wherein the inorganic particles have a particle size ranging from 2 nm to 100 μm and the metallic material is at least one selected from the group consisting of aluminum, iron, zinc, tin, titanium, antimony, magnesium and vanadium Wherein the coating of the metallic material on the inorganic particles is performed by one of chemical vapor deposition, physical vapor deposition, and acidification, and the adhesive resin in the adhesive composition forming step is an epoxy resin, An acrylic resin, a urethane resin, and a silicone-urethane resin It characterized by comprising a resin on.

In one aspect of the present invention, the heat dissipation material is characterized by being made of a heat dissipation material in which siloxane is synthesized.

In one aspect of the present invention, the first adhesive layer is composed of a pressure-sensitive adhesive composition in which the blending ratio of the particulate heat-radiating material to the adhesive resin is 0 wt% to 65 wt% in the adhesive composition preparing step, Layer may be composed of a pressure-sensitive adhesive composition in which the blending ratio of the particulate heat-radiating material to the viscous resin is 20 wt% to 85 wt% in the adhesive composition preparation step.

In one aspect of the present invention, the adhesive composition provided in the adhesive composition preparation step further comprises a curing agent, and the adhesive composition preparation step further includes a defoaming step for removing air bubbles after stirring the adhesive composition , And the curing agent includes at least one substance selected from the group consisting of an isocyanate compound, an epoxy compound, an aziridine compound, and a metal chelate compound.

In one aspect of the present invention, the mixing ratio of the particulate heat dissipation material to the adhesive resin is different from that of the first adhesive layer and the second adhesive layer after the curing of the first adhesive layer and after the curing of the first adhesive layer And forming a heat load in at least a horizontal direction and a vertical direction by connecting the particulate heat dissipation materials by applying an electric field or a magnetic field to form a laminate and curing the first adhesive layer, .

In one aspect of the present invention, the interposition layer is characterized in that the content ratio of the particulate heat dissipation material to the viscous resin is 10% to 75%.

According to an aspect of the present invention, it is preferable that the method further includes a step of laminating a release film on the upper surface of the second adhesive layer which has undergone the second curing step.

According to another aspect of the present invention, there is provided a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure produced by the method for manufacturing a heat radiation adhesive sheet according to the first aspect.

According to still another aspect of the present invention, there is provided a flexible base substrate made of a flexible material; A plurality of adhesive layers laminated on one surface of the soft base material; And a releasing film laminated on the uppermost exposed surface of the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is composed of a layer in which metallic particulate heat dissipation material synthesized from inorganic particles and a viscous resin are mixed in a predetermined ratio, Wherein each of the plurality of adhesive layers to be laminated is formed such that the content of the metallic particulate heat-radiating material with respect to the adhesive resin increases from the adhesive layer laminated on the soft base substrate toward the lamination direction.

In another aspect of the present invention, the metallic particulate heat-radiating material constituting the pressure-sensitive adhesive layer is connected to the multi-directional including at least a vertical direction and a horizontal direction through a predetermined process, And a heat transfer orientation structure.

According to another aspect of the present invention, in the case where the soft base substrate comprises a film base material of a fiber base material or a resin base material and the base base material is a film base material of resin, And the adhesive layer may be made to have a heat transfer structure in which an electric field or a magnetic field is applied so that the metallic particulate heat dissipation materials in the adhesive layer are interconnected and oriented in multiple directions.

In another aspect of the present invention, the adhesive resin is composed of at least one resin selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, and a silicone-urethane resin, and the metallic particulate heat dissipating material comprises boron nitride (BN At least one polyvalent metal selected from the group consisting of aluminum, iron, zinc, tin, titanium, antimony, magnesium and vanadium is added to at least one inorganic particle selected from the group consisting of aluminum nitride (AlN) and silicon carbide And the inorganic particles may have a particle size ranging from 2 nm to 100 탆.

According to another aspect of the present invention, the metallic particulate heat dissipation material is characterized by being formed of a heat dissipation material in which siloxane is synthesized.

In another aspect of the present invention, the adhesive layer is composed of three layers, wherein the first layer has a blending ratio of the particulate heat-radiating material to the viscous resin in the range of 0 wt% to 65 wt% 10 wt% to 75 wt%, and the third layer comprises 20 wt% to 85 wt%.

In another aspect of the present invention, the adhesive layer may further comprise a curing agent, and the curing agent may be at least one selected from the group consisting of an isocyanate compound, an epoxy compound, an aziridine compound, and a metal chelate compound You can include,

According to the above-described adhesive heat-radiating sheet having the three-dimensional heat-radiating structure and the method of manufacturing the adhesive heat-radiating sheet having the three-dimensional heat-radiating structure, the horizontal and vertical thermal conductive structures are provided, thereby maximizing the thermal conductivity and realizing the high heat- Therefore, the present invention can be applied to electronic parts having a thermal direct phenomenon.

According to the present invention, the present invention can be applied to electronic parts requiring frequent folding because it can be realized in a flexible film or a fibrous substrate. Thus, continuous and uniform heat distribution can be achieved without causing defects such as cracks and cracks, So that it is possible to secure general versatility.

The effects of the present invention are not limited to those mentioned above, and other solutions not mentioned may be clearly understood by those skilled in the art from the following description.

1 is a flow chart showing a method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure according to the present invention.
2 is a flow chart showing a process of forming a heat-sensitive adhesive layer constituting a method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure according to the present invention.
3 is a view schematically showing the internal structure before and after the heat road forming step in the method of manufacturing the adhesive heat radiation sheet having the three-dimensional heat radiation structure according to the present invention.
Fig. 4 is a photograph of a test piece of a heat-sensitive adhesive heat-dissipating sheet obtained by a method for producing a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure according to the present invention, and showing the dispersibility by self-orientation.
FIG. 5 is a schematic view for explaining that a particulate heat dissipation material is oriented through a heat-load process in a method of manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat dissipation structure according to the present invention.
6 is a schematic view for explaining the structure of a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure according to the present invention.
Fig. 7 shows the case where boron nitride is simply contained in a heat-radiating sheet composed of a particulate adhesive resin and a particulate heat dissipating material (BN), a case in which there is no orientation structure, and a case in which the present invention (LFA; Laser / Light Flash Analysis).
8 is a graph showing the relationship between the thermal conductivity of the heat-radiating sheet according to the present invention and the content (filler content) of the particulate heat-radiating material.
9 is a graph showing the relationship between the thermal diffusivity and the content (filler content) of the particulate heat dissipation material in the heat radiation sheet according to the present invention.
10 is a graph showing the results of confirming that the dispersibility of the heat-radiating sheet according to the present invention is improved by siloxane treatment.

Further objects, features and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings.

Before describing the present invention in detail, it is to be understood that the present invention is capable of various modifications and various embodiments, and the examples described below and illustrated in the drawings are intended to limit the invention to specific embodiments It is to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Also, the terms " part, "" unit," " module, "and the like, which are described in the specification, refer to a unit for processing at least one function or operation, Software. ≪ / RTI >

In the following description with reference to the accompanying drawings, the same components are denoted by the same reference numerals regardless of the reference numerals, and redundant explanations thereof will be omitted. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, a method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure and a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

First, a method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure according to the present invention will be described in detail with reference to FIGS. 1 to 4. FIG. FIG. 1 is a flow chart showing a method of manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure according to the present invention. FIG. 2 is a cross- 3 is a view schematically showing an internal structure before and after a heat road forming step of a method of manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure according to the present invention, and Fig. 4 is a cross- FIG. 6 is a photograph of a test piece of a heat-sensitive adhesive heat-radiating sheet obtained by a method for producing a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure according to the invention, and showing the dispersibility by self-orientation. FIG.

1 to 4, a method of manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure according to the present invention includes the steps of preparing a base substrate S100 (step S100) for providing a base substrate made of a flexible material, ); And a heat radiation adhesive layer forming step (S200) of laminating an adhesive layer including a particulate heat radiation material having thermal conductivity on one surface of the base material, wherein the heat radiation adhesive layer formation step (S200) (Containing concentration) of the heat dissipation adhesive layer, and connecting the particulate heat dissipation materials constituting the heat dissipation / adhesive layer to each other to form a heat road.

The base substrate provided in the base material preparing step (S100) may be formed of a flexible fiber base material or a resin film base material.

When the base substrate is made of a fiber substrate, it may be a woven fabric, a knitted fabric or a nonwoven fabric. Here, the fiber substrate may include carbon fibers, and may alternatively include carbon nanotubes, graphite, or graphene.

In addition, the base substrate provided in the base material preparing step (S100) may be made of a film base material of a resin stream. In this case, the film base material of the resin may have a melting point higher or lower than that of the adhesive resin constituting a heat- Resins can be used.

Next, the heat-radiation adhesive layer forming step (S200) includes a heat radiation material preparation step (S210) of providing a particulate heat radiation material obtained by synthesizing a metal to inorganic particles, a particulate heat radiation material provided in the heat radiation material preparation step (S210) (S220) for preparing a pressure-sensitive adhesive composition prepared by mixing a resin at a predetermined ratio and a pressure-sensitive adhesive composition prepared by mixing the pressure-sensitive adhesive composition at a predetermined ratio in the pressure-sensitive adhesive composition preparation step (S220) A first adhesive layer forming step S230 for forming a first adhesive layer and a second adhesive layer forming step S230 for applying a magnetic field or an electric field to the first adhesive layer formed in the first adhesive layer forming step S230, A heat-rod forming step (S240) of forming a heat road by aligning the centers of the first adhesive layer and the second adhesive layer, and curing the first adhesive layer The first adhesive layer is laminated on the cured first adhesive layer using the adhesive composition mixed at a predetermined ratio in the first and second curing steps S250 and S220, (S260) forming a first adhesive layer and a curing step (S240) of curing the second adhesive layer to form a first adhesive layer and a second adhesive layer And the adhesive resin and the particulate heat-radiating material are characterized by different mixing ratios (mixing concentration of the particulate heat-radiating material with respect to the adhesive resin).

The second adhesive layer may be formed in step S200 of forming the heat-radiating adhesive layer, and the heat-rod forming step S280 may be performed before the second adhesive layer is cured (S270) ) May be carried out to connect the particulate heat-radiating materials included in the second adhesive layer to form a heat load.

The heat dissipation material provided in the heat dissipation material preparation step S210 serves to dissipate heat generated in the electric and electronic devices and is made of boron nitride (BN), aluminum nitride (AlN), and silicon carbide (SiC). And at least one inorganic particle selected from the group consisting of a metal material coated thereon.

The inorganic particles preferably have an average particle size of 2 nm to 100 탆. When the size of the inorganic particles is less than 2 nm, the manufacturing process becomes complicated to manufacture the inorganic particles of that size. When the size of the inorganic particles is larger than 20 m, the surface area per unit volume of the inorganic particles becomes smaller, .

The inorganic particles may have various structures such as globular, crystal, irregular, and hexagonal, and preferably, the inorganic particles may have a globular structure.

The metal material may be a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium, and / or vanadium. The metal material may be formed by chemical vapor deposition (CVD), physical vapor deposition Physical Vapor Deposition, or acidification.

Here, it is preferable that the heat dissipation material is made of a heat dissipation material in which a siloxane is synthesized (for example, coated) on the heat dissipation material to improve the dispersibility of the heat dissipation material. Such a siloxane-containing heat-radiating material can be obtained by synthesizing (coating) a siloxane-synthesized siloxane compound metal material with inorganic particles.

Next, the pressure-sensitive adhesive composition provided in the pressure-sensitive adhesive composition preparation step (S220) is composed of a pressure sensitive adhesive resin and a particulate heat radiation material. The composition ratio of the pressure sensitive adhesive composition of the first pressure sensitive adhesive layer to the pressure sensitive adhesive composition of the second pressure sensitive adhesive layer The mixing concentration of the particulate heat-radiating material).

Specifically, the pressure-sensitive adhesive composition for a first adhesive layer provided in the pressure-sensitive adhesive composition preparation step (S220) has a mixing ratio of the particulate heat-radiating material to the pressure-sensitive adhesive resin ranging from 0% by weight to 65% by weight so as to be a relatively low- And the pressure-sensitive adhesive composition for the second pressure-sensitive adhesive layer has a mixing ratio of the particulate heat-radiating material to the pressure-sensitive adhesive resin ranging from 20% by weight to 85% by weight, so that the pressure-sensitive adhesive layer is relatively high density. As can be seen from this, the second adhesive layer contains a relatively high density heat dissipating material as compared with the first adhesive layer. The term weight percent, as used herein, means that each component of a material is expressed as a percentage by weight.

When the mixing ratio of the particulate heat-radiating material is less than 20% by weight, the thermal conductivity of the heat-radiating sheet is low, so that the electrical and electronic elements It is not suitable for heat dissipation. When the mixing ratio of the particulate heat dissipation material is larger than 85 wt%, the possibility that the particulate heat dissipation material is not uniformly dispersed in the adhesive resin or cracks are generated after the heat dissipation sheet is cured increases.

Preferably, the mixing ratio of the particulate heat dissipation material to the adhesive resin in the adhesive composition for a first adhesive layer is in the range of 25 wt% to 60 wt%. In this case, the thermal conductivity of the heat-radiating sheet sharply increases, the degree of dispersion improves, and the possibility of cracking is remarkably reduced.

The adhesive resin is used for providing an adhesive force for adhering to an electric / electronic device. The adhesive resin is not particularly limited and any resin can be used without limitation as long as it is excellent in adhesiveness.

For example, the viscous resin may include at least one resin selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, and a silicone-urethane resin. Preferably, the viscous resin may include an acrylic resin, But is not limited thereto.

In addition, the adhesive composition provided in the adhesive composition preparing step (S220) may further comprise a curing agent separately from the inorganic particles and the adhesive resin. The curing agent can play a role of controlling physical properties such as cohesive force and adhesive property when the adhesive layer is cured, and the kind of the curing agent is not particularly limited.

For example, the curing agent may include at least one material selected from the group consisting of an isocyanate-based compound, an epoxy-based compound, an aziridine-based compound, and a metal chelate-based compound.

Examples of the isocyanate compound include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoboron diisocyanate, tetramethylxylene diisocyanate, or naphthalene diisocyanate, and at least one isocyanate A reaction product of polyol (ex. Trimethylolpropane), or a mixture of two or more kinds of them.

Examples of the epoxy compound include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylol propane triglycidyl ether, N, N, N ', N'-tetraglycidyl ethylenediamine and glycerin diglycidyl ether And at least one selected from the group consisting of

Examples of the aziridine compound include N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane-4,4'-bis Amide), triethylene melamine, bisisopropanoyl-1- (2-methyl aziridine), and tri-1-aziridinyl phosphine oxide.

Examples of the metal chelate compound include compounds in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium, and / or vanadium is coordinated to acetylacetone or ethyl acetoacetate. But is not limited to.

The content of the curing agent may be 0.01 to 10 parts by weight based on 100 parts by weight of the adhesive resin.

For example, when the content of the curing agent is less than 0.01 parts by weight, the cohesive force may be lowered when the adhesive layer is cured, and bubbles may be generated when the high-temperature reliability is measured. When the content of the curing agent exceeds 10 parts by weight, There is a fear that the durability is deteriorated because the degree of hardening is too high and the adhesive force and the peeling force are lowered so that delamination or peeling phenomenon occurs.

Further, in preparing the adhesive composition, a solvent may be further added to the adhesive resin, the particulate heat dissipation material, and the curing agent to stir the mixture. The solvent is not particularly limited, and solvents commonly used in this field can be used without limitation. Preferably, the solvent may comprise methyl ethyl ketone.

For example, when the adhesive resin is 100 parts by weight, the content of the solvent may be 0.1 part by weight to 10 parts by weight. When the content of the solvent is less than 0.1 part by weight, the mixture may not be uniformly stirred. When the content of the solvent is more than 10 parts by weight, the viscosity of the pressure-sensitive adhesive composition may become too high, .

Stirring of the pressure-sensitive adhesive composition may be carried out by stirring in a rotary stirrer at a rotation speed of 250 rpm to 350 rpm for 30 minutes to 90 minutes.

At stirring speeds lower than 250 rpm or less than 30 minutes, the composition may not mix uniformly, and rotational speeds higher than 350 rpm or longer than 90 minutes may damage the particulate heat dissipation material.

Here, the adhesive composition that has been subjected to the stirring process may be placed in a vacuum oven and subjected to a defoaming process to remove bubbles which may be formed in the adhesive composition, thereby enhancing thermal conductivity and adhesion.

Subsequently, the adhesive composition prepared as described above is put through a hopper or the like into a base material which proceeds to one side, and forms an adhesive layer (first adhesive layer) having a predetermined thickness while passing through the pair of roller members S230). Since the process of forming the first adhesive layer is also applied to forming the second adhesive layer, the description of the second adhesive layer forming process (S270) is omitted.

Then, the heat-rod forming step S240 is performed by passing the base substrate on which the adhesive layer is formed to the electric field or magnetic field generating region (for example, passing between the pair of magnets in FIG. 5) So that the materials are connected to each other by the magnetic force, so that the particulate heat dissipation material in the adhesive layer has a horizontal alignment and / or a vertical alignment as shown in Fig. 5, thereby having a three-dimensional alignment structure. FIG. 5 is a schematic view for explaining that a particulate heat dissipation material is oriented through a heat-load process in a method of manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat dissipation structure according to the present invention.

In other words, the heat-load forming step S240 may be performed by vertically and / or horizontally passing the base substrate on which the adhesive layer is laminated to an electric field or a magnetic field so that the particulate heat- In the state where they are not connected to each other, they are connected to each other as shown in the right side of Fig. 3, which has a structure oriented vertically and / or horizontally with respect to the base substrate, Thereby forming a heat road capable of achieving a vertical thermal conduction effect.

The heat-rod forming step (S240) may be selectively applied to the second adhesive layer. Instead of the first adhesive layer, only the second adhesive layer may be applied and applied to both the first adhesive layer and the second adhesive layer. can do.

Next, the curing step (S250, S270) of the adhesive layer is cured by using a UV heater or the like.

Further, the present invention is characterized in that the content ratio of the particulate heat dissipation material (mixing ratio of the particulate heat dissipation material to the adhesive resin) is different from that of the first adhesive layer and the second adhesive layer, for example, And a third adhesive layer (interposed layer) having an intermediate content ratio of the content ratio of the particulate heat dissipation material is formed between the first adhesive layer and the second adhesive layer.

That is, after the curing of the first adhesive layer and before the formation of the second adhesive layer, a third adhesive layer (intervening layer) is laminated and cured on the upper surface of the first adhesive layer, The second adhesive layer may be formed on the upper surface of the adhesive layer (intervening layer) and cured. Such a third adhesive layer (interposing layer) can also be made to undergo the heat rod forming step.

Here, the third adhesive layer (interposing layer) has an intermediate content ratio of the content ratio of the particulate heat-radiating material between the first adhesive layer and the second adhesive layer. For example, the third adhesive layer may have a content ratio of 10% to 75% Lt; / RTI >

As can be seen from this, the adhesive layer produced by the present invention has a plurality of adhesive layers sequentially laminated on an adhesive layer which is laminated on a base substrate, wherein the adhesive layer is laminated on the base substrate, The content concentration of the particulate heat dissipation material with respect to the adhesive resin gradually increases.

Meanwhile, the present invention may further comprise a release film peeling step (S290) for laminating an release film on the upper surface of the second adhesive layer which has undergone the second curing step in the step of forming the heat radiation adhesive layer (S200) 2 adhesive layer (that is, the adhesive surface of the heat-radiating sheet) is protected, thereby completing the final heat-radiating sheet.

Fig. 6 is a schematic view for explaining the structure of a heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure according to the present invention, which is produced by the method for manufacturing a heat- The adhesive heat radiation sheet comprises a flexible base substrate (100) made of a fiber or a resin material; A plurality of adhesive layers 200 and 300 stacked on one surface of the soft base material 100; And a release film (400) laminated on the uppermost exposed surface of the adhesive layer (200, 300), wherein the adhesive layer is formed by mixing a particulate heat dissipation material obtained by synthesizing a metal with inorganic particles and a viscous resin in a predetermined ratio And each of the plurality of laminated adhesive layers is formed such that the content ratio of the particulate heat dissipation material (concentration of the particulate heat dissipation material) increases from the adhesive layer stacked on the flexible base substrate 100 toward the lamination direction, The metallic particulate heat-radiating material constituting the adhesive layer is vertically and / or horizontally connected to each other through a predetermined process so as to have a vertical and / or horizontal heat-transfer alignment structure.

The details of the constituent elements of the adhesive heat-radiating sheet having the three-dimensional heat-dissipating structure according to the present invention have been described in detail in the foregoing, and a description thereof will be omitted.

The inventors of the present invention have confirmed thermal conductivity, thermal diffusivity and dispersibility by treatment with siloxane through a comparative experiment on the process for producing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure as described above and the heat-

Fig. 7 shows the case where boron nitride is simply contained in a heat-radiating sheet composed of a particulate adhesive resin and a particulate heat dissipating material (BN), a case in which there is no orientation structure, and a case in which the present invention FIG. 8 is a graph showing the relationship between the thermal conductivity of the heat-radiating sheet according to the present invention and the content (filler content) of the particulate heat-radiating material; FIG. And FIG. 9 is a graph showing the relationship between the thermal diffusivity and the content (Filler content) of the particulate heat-radiating material in the heat-radiating sheet according to the present invention. FIG. 10 is a graph showing the relationship between the thermal diffusivity Fig.

According to the present invention, as can be seen from FIG. 7 to FIG. 9, it is confirmed that the thermal diffusivity can be drastically increased by implementing the three-dimensional heat dissipation structure through the orientation process. This is because the thermoelectric conversion by the phonon lattice vibration of the inorganic material (inorganic particle) and the thermoelectric conversion by the free electron transfer of the metal synthesized by the phonon exhibit a synergy effect, so that the morphological configuration in the adhesive layer, The thermal conductivity and the thermal diffusivity are remarkably increased in connection with the orientation structure.

According to the present invention, as can be seen from FIG. 10, the siloxane is synthesized and treated in the heat-radiating material, thereby remarkably improving the dispersibility of the heat-radiating material. This ensures the uniformity of thermal conductivity and thermal diffusivity by securing the dispersibility of the heat dissipation material.

According to the above-described method of manufacturing the adhesive heat-radiating sheet having the three-dimensional heat-radiating structure and the adhesive heat-radiating sheet having the three-dimensional heat-radiating structure according to the present invention, it is possible to maximize the thermal conductivity by having horizontal and vertical heat- And can be applied to electronic parts having a thermal direct phenomenon.

According to the present invention, the present invention can be applied to electronic parts requiring frequent folding because it can be realized in a flexible film or a fibrous substrate. Thus, continuous and uniform heat distribution can be achieved without causing defects such as cracks and cracks, It can be employed in a product, and there is an advantage that general versatility can be secured.

The embodiments and the accompanying drawings described in the present specification are merely illustrative of some of the technical ideas included in the present invention. Therefore, it is to be understood that the embodiments disclosed herein are not for purposes of limiting the technical idea of the present invention, but rather are not intended to limit the scope of the technical idea of the present invention. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: base substrate
200, 300: adhesive layer
400: release film
S100: Base material preparation step
S200: step of forming a heat-sealable adhesive layer
S210: Step of preparing heat-radiating material
S220: Adhesive composition preparing step
S230: First adhesive layer formation step
S240, S280: heat-rod forming step (alignment step)
S250, S270: Curing step
S260: Second adhesive layer forming step
S290: Release type peeling film laminating step

Claims (19)

A base substrate preparing step of providing a base substrate made of a flexible material; And
And a heat radiation adhesive layer forming step of forming an adhesive layer including a particulate heat radiation material having thermal conductivity on the base material,
The heat-radiating adhesive layer forming step has at least two or more layers having different contents of the particulate heat-radiating material with respect to the adhesive resin,
And the step of forming the heat-radiating adhesive layer comprises connecting the heat-radiating and heat-dissipating materials constituting the heat-radiating adhesive layer so as to have a multi-directional alignment structure including a horizontal direction and a vertical direction
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
The method of claim 1,
Wherein the base substrate provided in the base substrate preparing step is composed of a fibrous base material or a resin film base material,
When the base substrate is composed of a film substrate of a resin stream, it has a melting point higher or lower than the melting point of the adhesive resin forming the adhesive layer,
Wherein the heat radiation adhesive layer is made of a particulate heat dissipation material in which a metal is synthesized on the inorganic particles,
The heat-dissipating adhesive layer is formed by applying an electric field or a magnetic field so that the particulate heat-radiating materials in the adhesive layer are mutually connected to have heat transfer structures oriented in multiple directions
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
The method of claim 1,
The heat-radiating adhesive layer forming step
A step of preparing a heat dissipation material for providing a particulate heat dissipation material in which a metal is synthesized with inorganic particles;
Providing a pressure-sensitive adhesive composition comprising the particulate heat dissipation material and a viscous resin mixed at a predetermined ratio;
A first adhesive layer forming step of forming a first adhesive layer on the base substrate using the adhesive composition;
A curing step of curing the first adhesive layer;
A second adhesive layer forming step of forming a second adhesive layer on the cured first adhesive layer using the adhesive composition; And
And a curing step of curing the second adhesive layer,
Wherein the first adhesive layer and the second adhesive layer have different mixing concentrations of the particulate heat dissipation material with respect to the adhesive resin,
Forming a heat load in at least a horizontal direction and a vertical direction by applying an electric field or a magnetic field to at least one of the first adhesive layer and the second adhesive layer to connect the particle heat- Characterized by
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
4. The method of claim 3,
Wherein the heat-rod forming step is performed before the first adhesive layer or the second adhesive layer is formed and cured, or is performed on the cured laminate formed up to the second adhesive layer
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
The method of claim 3,
The heat dissipation material provided in the step of preparing the heat dissipation material is formed by coating a metal material on at least one inorganic particle selected from the group consisting of boron nitride (BN), aluminum nitride (AlN), and silicon carbide (SiC)
Wherein the inorganic particles have a particle size ranging from 2 nm to 100 탆,
Wherein the metal material is at least one multivalent metal selected from the group consisting of aluminum, iron, zinc, tin, titanium, antimony, magnesium and vanadium,
The coating of the metallic material with the inorganic particles is performed by one of chemical vapor deposition, physical vapor deposition, and acidification,
Wherein the adhesive resin in the adhesive composition forming step comprises at least one resin selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, and a silicone-urethane resin
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
6. The method of claim 5,
Wherein the heat dissipation material is formed of a heat dissipation material in which siloxane is synthesized
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
The method of claim 3,
Wherein the first adhesive layer comprises a pressure-sensitive adhesive composition in which the blending ratio of the particulate heat-radiating material to the adhesive resin is 0 wt% to 65 wt% in the adhesive composition preparing step,
Wherein the second adhesive layer comprises a pressure-sensitive adhesive composition in which the mixing ratio of the particulate heat-radiating material to the adhesive resin in the adhesive composition forming step is 20 wt% to 85 wt%
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
8. The method of claim 7,
The adhesive composition provided in the adhesive composition forming step may further comprise a curing agent,
The step of preparing a pressure-sensitive adhesive composition further includes a defoaming step for removing air bubbles after stirring the pressure-sensitive adhesive composition,
Wherein the curing agent comprises at least one substance selected from the group consisting of an isocyanate compound, an epoxy compound, an aziridine compound and a metal chelate compound
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
8. The method of claim 7,
Wherein the mixing ratio of the particulate heat dissipation material to the adhesive resin is different from that of the first adhesive layer and the second adhesive layer after the curing of the first adhesive layer and before the formation of the second adhesive layer, Layered and cured, and then applying an electric field or a magnetic field to connect the particulate heat dissipation materials to form a heat load in at least a horizontal direction and a vertical direction
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
10. The method of claim 9,
Wherein the interposition layer is formed so that the content ratio of the particulate heat dissipation material to the viscous resin is 10 wt% to 75%
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
The method of claim 3,
Further comprising the step of laminating a release film on the upper surface of the second adhesive layer which has undergone the second curing step
A method for manufacturing a heat-sensitive adhesive sheet having a three-dimensional heat radiation structure.
A heat-sensitive adhesive sheet having a three-dimensional heat-radiating structure produced by the method for manufacturing a heat-sensitive adhesive sheet according to any one of claims 1 to 11.
A flexible base material made of a flexible material;
A plurality of adhesive layers laminated on one surface of the soft base material; And
And a release film provided on the uppermost exposed surface of the adhesive layer,
Wherein the adhesive layer comprises a layer in which a metallic particulate heat dissipation material synthesized from a metal and inorganic particles and a viscous resin are mixed at a predetermined ratio,
Wherein each of the plurality of adhesive layers to be laminated is formed such that the content of the metallic particulate heat-radiating material with respect to the adhesive resin increases from the adhesive layer laminated on the soft base substrate toward the lamination direction
Adhesive heat-radiating sheet.
14. The method of claim 13,
The metallic particulate heat-radiating material constituting the pressure-sensitive adhesive layer is configured to have a multi-directional heat transfer alignment structure including at least a vertical direction and a horizontal direction connected to each other in at least a plurality of directions including a vertical direction and a horizontal direction through a predetermined process To
Adhesive heat-radiating sheet.
15. The method of claim 14,
Wherein the soft base substrate comprises a fibrous substrate or a film substrate of resin stream,
Wherein when the base substrate is made of a film base material of resin, it has a melting point higher than the melting point of the adhesive resin forming the adhesive layer,
The pressure-sensitive adhesive layer is made to have a heat transfer structure in which the metallic particulate heat-radiating materials in the pressure-sensitive adhesive layer are mutually connected and oriented in multiple directions by applying an electric field or a magnetic field
Adhesive heat-radiating sheet.
16. The method of claim 15,
Wherein the adhesive resin comprises at least one resin selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin and a silicone-urethane resin,
The metallic particulate heat dissipation material may be at least one inorganic particle selected from the group consisting of boron nitride (BN), aluminum nitride (AlN) and silicon carbide (SiC), aluminum, iron, zinc, tin, titanium, antimony, And at least one polyvalent metal selected from the group consisting of polyvalent metals,
Wherein the inorganic particles have a particle size ranging from 2 nm to 100 mu m
Adhesive heat-radiating sheet.
17. The method of claim 16,
Wherein the metallic particulate heat dissipation material is made of a heat dissipation material in which siloxane is synthesized
Adhesive heat-radiating sheet. 18. The method according to any one of claims 13 to 17,
Wherein the adhesive layer comprises three layers, wherein the mixing ratio of the particulate heat dissipation material to the adhesive resin in the first layer is 0 wt% to 65 wt%, and the second layer is 10 wt% to 75 wt% And the third layer comprises 20 wt% to 85 wt%.
Adhesive heat-radiating sheet.
19. The method of claim 18,
Wherein the adhesive layer further comprises a curing agent,
Wherein the curing agent comprises at least one substance selected from the group consisting of an isocyanate compound, an epoxy compound, an aziridine compound and a metal chelate compound
Adhesive heat-radiating sheet.

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