KR20180092171A - Fingerprint sensor module and method of manufacturing the same - Google Patents

Fingerprint sensor module and method of manufacturing the same Download PDF

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KR20180092171A
KR20180092171A KR1020170017602A KR20170017602A KR20180092171A KR 20180092171 A KR20180092171 A KR 20180092171A KR 1020170017602 A KR1020170017602 A KR 1020170017602A KR 20170017602 A KR20170017602 A KR 20170017602A KR 20180092171 A KR20180092171 A KR 20180092171A
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fingerprint sensor
metal layer
sensor module
solder ball
present
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KR1020170017602A
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Korean (ko)
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손동남
김성근
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크루셜텍 (주)
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • G06K9/00006—
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

The present invention relates to a fingerprint sensor module and a manufacturing method thereof capable of reducing overall thickness and lowering manufacturing costs. The fingerprint sensor module comprises a cover part; a color layer formed on one surface of the cover part; a plurality of first metal layers formed on the color layer; a plurality of second metal layers formed on the first metal layer; and a plurality of solder balls formed on the second metal layer, wherein some of the solder balls are electrically connected to a fingerprint sensor.

Description

지문센서 모듈 및 이의 제조방법{FINGERPRINT SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME}FIELD OF THE INVENTION [0001] The present invention relates to a fingerprint sensor module,

본 발명은 지문센서 모듈 및 이의 제조방법에 관한 것으로, 더욱 상세하게는 두께가 슬림하고, 실장이 용이한 구조를 가지는 휴대용 전자기기에 장착 가능한 지문센서 모듈 및 이의 제조방법에 관한 것이다.The present invention relates to a fingerprint sensor module and a method of manufacturing the fingerprint sensor module, and more particularly, to a fingerprint sensor module that can be mounted on a portable electronic device having a slim and easy mounting structure.

최근 스마트폰(Smartphone)이나 태블릿 피씨(Tablet PC)를 비롯한 휴대용 전자기기에 대하여 대중들의 관심이 집중되면서, 관련 기술분야에 대한 연구개발이 활발히 진행되고 있다.Background of the Invention [0002] Recent interest in portable electronic devices including smartphones and tablet PCs has been actively researched and developed in the related technology fields.

휴대용 전자기기는 사용자로부터 특정한 명령을 입력 받기 위한 입력장치의 하나로서 표시장치인 디스플레이와 일체화된 터치스크린(Touch Screen)을 내장하는 경우가 많다. 또한 휴대용 전자기기는 터치스크린 이외의 입력장치로서 각종 기능키(Function Key)나 소프트키(Soft Key)를 구비하기도 한다.In many cases, a portable electronic device incorporates a touch screen integrated with a display, which is a display device, as an input device for receiving a specific command from a user. In addition, portable electronic devices may be equipped with various function keys or soft keys as input devices other than a touch screen.

이러한 기능키나 소프트키는 홈 키로서 동작할 수 있는데, 예를 들면, 실행 중인 애플리케이션을 빠져나와 초기 화면으로 돌아가는 기능을 수행하거나, 유저 인터페이스를 한 계층 전으로 돌아가게 하는 백(BACK)키 또는 자주 쓰는 메뉴를 호출하는 메뉴키로서 동작할 수 있다. 이러한 기능키나 소프트키는 물리적 버튼으로 구현될 수 있다. 또한, 이러한 기능키나 소프트키는 도전체의 정전 용량을 감지하는 방식, 또는 전자기펜의 전자기파를 감지하는 방식 또는 이 두 가지 방식이 모두 구현된 복합 방식으로 구현될 수 있다.These function keys or soft keys may act as home keys, for example, to exit a running application and return to the home screen, or to return the user interface to a previous layer, And can operate as a menu key for calling up a write menu. These function keys or soft keys may be implemented as physical buttons. In addition, the function key or the soft key can be realized by a method of sensing the electrostatic capacity of the conductor, a method of sensing the electromagnetic wave of the electromagnetic pen, or a combined method in which both methods are implemented.

한편, 최근 스마트폰과 같은 휴대용 전자기기의 용도가 보안이 필요한 서비스로 급격히 확장됨에 따라, 지문 센서를 휴대용 전자기기에 장착하려는 추세가 늘고 있다. 일 예로, 지문센서는 물리적인 기능키에 일체화되어 구현될 수 있다.Meanwhile, as the use of portable electronic devices such as smart phones has rapidly expanded to services requiring security, there has been an increasing tendency to install fingerprint sensors in portable electronic devices. In one example, the fingerprint sensor may be implemented in a unitary fashion with a physical function key.

지문센서는 인간의 손가락 지문을 감지하는 센서이며, 지문센서를 통해 사용자등록이나 인증 절차를 거치도록 함으로써 휴대용 전자기기에 저장된 데이터를 보호하고 보안사고를 미연에 방지할 수 있다.The fingerprint sensor is a sensor for detecting the fingerprint of a human being. The fingerprint sensor allows the user to register and authenticate through the fingerprint sensor, thereby protecting the data stored in the portable electronic device and preventing a security accident in advance.

한편, 지문센서를 각종 휴대용 전자기기에 장착하기 위하여, 지문센서를 주변 부품이나 구조를 포함하는 모듈의 형태로 제조하고 있다.Meanwhile, in order to mount a fingerprint sensor on various portable electronic devices, a fingerprint sensor is manufactured in the form of a module including peripheral parts and structures.

이때, 모듈은 크게 지문센서 패키지와 커버부를 포함할 수 있다.At this time, the module may include a fingerprint sensor package and a cover part.

이때, 지문센서 패키지는 베이스기판에 지문센서가 실장되고, 실장된 지문센서는 베이스기판과 와이어본딩으로 전기적 연결되며, 지문센서와 와이어본딩을 보호하기 위한 몰딩부로 구성될 수 있다.At this time, the fingerprint sensor package is mounted on the base substrate, the mounted fingerprint sensor is electrically connected to the base substrate by wire bonding, and the fingerprint sensor can be configured as a molding part for protecting the fingerprint sensor and the wire bonding.

하지만, 이러한 종래의 모듈에 포함된 지문센서 패키지는 와이어본딩의 루프로 인해 두께를 낮추는데 제약이 있고, 또한 제조 단가가 높은 몰딩부 공정이 추가로 진행되어야 하기 때문에 제조비용이 증가하는 문제점이 있다.However, the fingerprint sensor package included in such a conventional module has a limitation in reducing the thickness due to the loop of wire bonding, and further requires a molding part process with a high manufacturing cost, which increases the manufacturing cost.

상기와 같은 문제점을 해결하기 위하여, 본 발명이 이루고자 하는 기술적 과제는 모듈의 전체 두께를 줄이는 구조와 제조비용을 낮출 수 있는 지문센서 모듈 및 이의 제조방법을 제공하는 것이다.In order to solve the above problems, a technical problem to be solved by the present invention is to provide a fingerprint sensor module capable of reducing the overall thickness of a module and a manufacturing cost, and a method of manufacturing the fingerprint sensor module.

본 발명은 커버부; 커버부의 일면에 형성된 컬러층; 컬러층에 복수 개로 형성된 제1메탈층; 제1메탈층에 복수 개로 형성된 제2메탈층; 제2메탈층에 복수 개로 형성된 솔더볼; 및 복수 개의 솔더볼 중 일부가 지문센서와 전기적으로 연결된다.According to the present invention, A color layer formed on one surface of the cover portion; A first metal layer formed in a plurality of color layers; A second metal layer formed on the first metal layer in a plurality of layers; A plurality of solder balls formed on the second metal layer; And a part of the plurality of solder balls is electrically connected to the fingerprint sensor.

복수 개의 솔더볼은 지문센서의 센싱면과 마주보며 전기적으로 연결되는 제1솔더볼과 지문센서 주변으로 외부와 전기적으로 연결되는 제2솔더볼로 구성된다.The plurality of solder balls are composed of a first solder ball electrically connected to the sensing surface of the fingerprint sensor and a second solder ball electrically connected to the outside around the fingerprint sensor.

본 발명은 모듈의 전체두께를 줄일 수 있는 것은 물론 제조단가가 높은 몰딩공정을 생략할 수 있어 제조비용을 줄이는 효과가 있다.The present invention can reduce the overall thickness of the module and omit the molding process, which has a high manufacturing cost, thereby reducing manufacturing costs.

또한, 본 발명은 웨이퍼 공정 과정에서 모든 제조가 가능하여 제조비용 및 생산시간을 단축하는 효과가 있다.Further, the present invention is capable of manufacturing all of the processes in the wafer process, thereby reducing manufacturing cost and production time.

본 발명의 효과는 상기한 효과로 한정되는 것은 아니며, 본 발명의 상세한 설명 또는 특허청구범위에 기재된 발명의 구성으로부터 추론 가능한 모든 효과를 포함하는 것으로 이해되어야 한다.It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

도 1은 본 발명의 실시예에 따른 지문센서 모듈을 나타낸 단면예시도.1 is a cross-sectional exemplary view showing a fingerprint sensor module according to an embodiment of the present invention;

이하에서는 첨부한 도면을 참조하여 본 발명을 설명하기로 한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 부재를 사이에 두고 "간접적으로 연결"되어 있는 경우도 포함한다. 또한, 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 구비할 수 있다는 것을 의미한다.Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when a part is referred to as "comprising ", it means that it can include other components as well, without excluding other components unless specifically stated otherwise.

이하, 첨부된 도면을 참고하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 실시예에 따른 지문센서 모듈을 나타낸 단면예시도이다.1 is a cross-sectional view illustrating a fingerprint sensor module according to an embodiment of the present invention.

도 1에 도시된 바와 같이, 본 발명의 실시예에 따른 지문센서 모듈(100)은 커버부(101), 컬러층(102), 제1메탈층(103), 제2메탈층(104), 솔더볼(105) 및 지문센서(106)를 포함할 수 있다.1, the fingerprint sensor module 100 according to the embodiment of the present invention includes a cover 101, a color layer 102, a first metal layer 103, a second metal layer 104, A solder ball 105 and a fingerprint sensor 106.

먼저, 커버부(101)는 글라스, 세라믹 등이 될 수 있으며, 특별한 소재로 한정되는 것은 아니다.First, the cover 101 may be made of glass, ceramics or the like, and is not limited to a specific material.

그리고, 커버부(101)의 일면에는 컬러층(102)이 형성될 수 있다. 이때, 컬러층은 코팅 또는 증착으로 구현될 수 있다.The color layer 102 may be formed on one side of the cover portion 101. At this time, the color layer can be realized by coating or vapor deposition.

또한, 컬러층(102)에는 일정한 간격을 두고 제1메탈층(103)이 형성될 수 있다. 이어서, 제1메탈층(103)과 닿는 면적이 동일하게 제2메탈층(104)이 적층될 수 있다. 제2메탈층(104)은 다양한 금속이 될 수 있는데, 니켈 또는 금 등이 될 수 있다.In addition, the first metal layer 103 may be formed in the color layer 102 at regular intervals. Then, the second metal layer 104 may be laminated to have the same area as the first metal layer 103. The second metal layer 104 may be various metals, such as nickel or gold.

이어서 제2메탈층에는 전기적 연결을 위한 솔더볼이 형성될 수 있다. 그리고, 이러한 솔더볼의 일부에는 전기적으로 연결된 지문센서가 포함될 수 있다. 지문센서는 일종의 다이 형태로 구성되며, 사용자 손가락의 지문을 감지하는 역할을 한다.Then, a solder ball for electrical connection may be formed on the second metal layer. A fingerprint sensor electrically connected to a part of the solder ball may be included. The fingerprint sensor is formed in a die shape and serves to detect the fingerprint of the user's finger.

한편, 솔더볼(105)은 지문센서의 센싱면과 마주보며 전기적으로 연결되는 제1솔더볼(105a)과 지문센서 주변으로 외부와 전기적으로 연결되는 제2솔더볼(105b)로 구분될 수 있다.The solder ball 105 may be divided into a first solder ball 105a electrically connected to the sensing surface of the fingerprint sensor and a second solder ball 105b electrically connected to the outside around the fingerprint sensor.

전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

본 발명의 범위는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100 : 지문센서 모듈 101 : 커버부
102 : 컬러층 103 : 제1메탈층
104 : 제2메탈층 105 : 솔더볼
105a: 제1솔더볼 105b :제2솔더볼
106 : 지문센서100: fingerprint sensor module 101: cover part
102: color layer 103: first metal layer
104: second metal layer 105: solder ball
105a: first solder ball 105b: second solder ball
106: Fingerprint sensor

Claims (2)

커버부;
상기 커버부의 일면에 형성된 컬러층;
상기 컬러층에 일정한 간격을 두고 형성된 제1메탈층;
상기 제1메탈층에 적층 된 제2메탈층;
상기 제2메탈층에 형성된 솔더볼; 및
상기 솔더볼 중 일부가 지문센서와 전기적으로 연결되는 것인 지문센서 모듈.A cover portion;
A color layer formed on one surface of the cover portion;
A first metal layer formed on the color layer at regular intervals;
A second metal layer stacked on the first metal layer;
A solder ball formed on the second metal layer; And
Wherein some of the solder balls are electrically connected to the fingerprint sensor. 제1항에 있어서,
상기 솔더볼은 지문센서의 센싱면과 마주보며 전기적으로 연결되는 제1솔더볼과 지문센서 주변으로 외부와 전기적으로 연결되는 제2솔더볼로 구성되는 것인 지문센서 모듈.The method according to claim 1,
Wherein the solder ball comprises a first solder ball electrically connected to the sensing surface of the fingerprint sensor and a second solder ball electrically connected to the outside around the fingerprint sensor.
KR1020170017602A 2017-02-08 2017-02-08 Fingerprint sensor module and method of manufacturing the same KR20180092171A (en)

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