KR20180087896A - Apparatus and method for repairing bad elements - Google Patents

Abstract

The present invention relates to a method for repairing a bad element which can selectively replace only a bad element present on a substrate, and a repairing apparatus therefor. According to the present invention, the method for repairing a bad element comprises: a pressurizing step; a bad element removing step; and a replacement element bonding step. According to the present inventin, the repairing apparatus of a bad element comprises a first adhesive film, a pressurizing unit, and a second adhesive film. According to the present invention, the method for repairing a bad element and a repairing apparatus therefor attaches and detaches a bad element to and from the first adhesive film, and attaches a replacement element attached to the second adhesive film to a removal position from whihch the bad element is removed for bonding.

Description

Technical Field [0001] The present invention relates to a repair method for a defective device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a repair method for a defective device and a repair apparatus therefor, and more particularly, to a repair method for a defective device capable of selectively replacing only defective devices existing in a substrate and a repair apparatus therefor.

Electronic components are manufactured through a process of mounting various circuit elements on a printed circuit board (PCB). For example, a memory card used in a computer can be manufactured through a process of mounting a plurality of memory devices on a printed circuit board. Recently, a display using a micro LED has attracted a great deal of attention because a large number of LED devices are mounted on a modular circuit board And are connected by solder.

The manufactured electronic parts are subjected to a check process to check the performance thereof. The defective device is removed from the printed circuit board and is then subjected to a repair process for switching to a good product.

In the conventional defective device repairing device, only the defective device among a plurality of devices arranged on the substrate is locally heated by using the pre-heated micro-solder to dissolve the solder adhered to the defective device, and a fine vacuum suction tool The defective element and the solder were removed.

As nanotechnology has recently developed, the size of the device has become smaller and smaller. However, the repair device of the conventional defective device is becoming difficult to apply to such a small device due to the physical size of the vacuum adsorption tool. Therefore, there is a demand for a defective device repair device capable of effectively removing a defective device included in a plurality of micro devices arranged on a substrate and replacing the defective device with a new device.

Korean Registered Patent No. 10-1228306 (Registered on Mar. 31, 201, entitled " Device and method for removing circuit elements "

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a method of manufacturing a flexible printed circuit board, which removes a defective element attached to a substrate using an adhesive film and removes residual solder using an elastic stamp or an adhesive film, The present invention provides a repair method of a defective device capable of easily removing a minute defective device and firmly attaching a new device at a position where a defective device is removed, and a repair device therefor.

According to an aspect of the present invention, there is provided a repair method for a defective device, including: pressing a first adhesive film of a light-transmitting material to adhere to a defective device attached to a substrate; Removing the defective device from the substrate by separating the first adhesive film from the substrate while the defective device is adhered to the first adhesive film; And a substitute device joining step of bringing the substitute device attached to the second adhesive film of the light transmitting material into contact with the removed position of the substrate from which the defective device has been removed, thereby bonding the substitute device to the substrate.

The method of repairing a defective device according to the present invention is characterized in that after the defective device removing step, a portion of the elastic stamp is deformed and pressed so as to be in close contact with the removal position of the substrate, And removing the residual solder removing step.

The method of repairing a defective device according to the present invention may further comprise the steps of forming an alternative solder at a removal position where the defective device is removed from the substrate after the defective device removing step, An alternative solder application step to form an alternate solder.

In the repair method of a defective device according to the present invention, the pressing step may melt the solder by irradiating a laser beam to the hardened solder between the defective device and the substrate.

In the defective element repairing method according to the present invention, the residual solder removing step may irradiate the residual solder with the laser beam in a state in which the elastic stamp is in close contact with the removal position of the substrate.

In the defective element repairing method according to the present invention, the residual solder removing step may include a step of removing the residual solder by increasing the adhesive force between the elastic stamp and the residual solder by a metal structure layer formed on one surface of the elastic stamp, .

In the defective element repairing method according to the present invention, the replacing element bonding step includes irradiating a laser beam onto the replacement solder while pressing the replacement element to the substrate side to bond the replacement element and the replacement solder Alternatively, ultrasonic waves may be applied in a state in which the substitute element is pressed toward the substrate to bond the substitute element and the substitute solder.

According to an aspect of the present invention, there is provided a repair device for a defective device, including: a first adhesive film disposed to face a substrate including a defective device and made of a light-transmitting material; A pressing part for pressing the first adhesive film so as to be in close contact with the defective element so that the defective element is adhered to and removed from the first adhesive film; And a second adhesive film having an alternative element which is adhered to the removed position of the substrate from which the defective element is removed.

And a laser irradiating unit for irradiating the solder with a laser beam to transmit the first adhesive film to melt the cured solder between the defective device and the substrate in the defective device repair apparatus according to the present invention .

In the repairing apparatus for a defective element according to the present invention, a remaining portion of the substrate remaining at the removal position of the substrate, while being opposed to the removal position of the substrate from which the defective element has been removed, And an elastic stamp for removing the solder.

In the repair device for defective devices according to the present invention, the elastic stamp may be formed with a metal structure layer on one side of the elastic stamp, which is in contact with the substrate, so that the adhesive force between the elastic stamp and the residual solder increases.

In the defective device repair device according to the present invention, the pressing portion may include a pressing jig disposed apart from the substrate, and a pressing jig for moving the pressing jig up and down so that the pressing jig is pressed against the first adhesive film or the elastic stamp And may include a pressure driver.

In the defective device repair apparatus according to the present invention, the pressing jig is provided in a lens shape having a light-transmitting material, and the laser beam irradiated from the laser irradiation portion passes through the pressing jig, May be configured to form a focus.

In the defective device repair apparatus according to the present invention, a solder application section for forming an alternative solder at a removal position of the substrate from which the defective element is removed, or a solder application section for forming an alternative solder on one surface of the replacement element closely attached to the substrate .

In the repair device for a defective device according to the present invention, the pressing portion presses the replacement device so that the replacement device is brought into close contact with the substrate, and transmits the second adhesive film to bond the replacement device and the replacement solder A laser irradiating unit for irradiating the replacement solder with a laser beam; Or an ultrasonic generator for applying ultrasonic waves to the substitute element to join the substitute element and the substitute solder.

According to the repair method and the repair apparatus for the defective device of the present invention, it is possible to easily and easily remove the defective device regardless of the area or the thickness of the defective device.

Further, according to the repair method of a defective element of the present invention and the repair apparatus therefor, the replacement solder can be firmly adhered to the substrate, and the replacement element which is adhered to the replacement solder is mounted higher than the neighboring elements by the residual solder It is possible to prevent inclined mounting.

According to the repair method and repair apparatus for defective devices of the present invention, the adhesive force between the elastic stamp and the residual solder is increased through the metal structure layer formed on one surface of the elastic stamp to make the residual solder remaining on the substrate cleaner Can be removed.

In addition, according to the repair method and repair apparatus for defective devices of the present invention, the metal structure layer can be made of a material having good wettability with the solder, so that the adhesion between the elastic stamp and the residual solder can be further increased.

Further, according to the repairing method and the repairing apparatus therefor of the present invention, the pressing jig is provided in the form of a lens having a light-transmitting material to replace the function of the condensing lens and to press a part of the elastic stamp And perform the function of pressing the substitute element as necessary.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the configuration of a repair device for a defective device according to an embodiment of the present invention,
FIG. 2 is a view illustrating a process of removing a defective device by a first adhesive film formed in a defective device repair device of FIG. 1,
FIG. 3 is a view illustrating a process of removing residual solder on an elastic stamp formed in the repairing apparatus of FIG. 1,
FIG. 4 is a view showing that an alternative solder is formed by a solder applying unit configured in the repairing apparatus of FIG. 1,
FIG. 5 is a view showing a process in which an alternative device attached to a second adhesive film formed in the repair device of the defective device of FIG. 1 is bonded to a removal position of the substrate from which the defective device is removed,
6 is a block diagram illustrating a repair method of a defective device according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a repair method of a defective device and a repair device therefor according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view schematically showing the construction of a repair device for a defective device according to an embodiment of the present invention. FIG. 2 is a view showing a process of removing a defective device by a first adhesive film formed in the repair device of FIG. FIG. 3 is a view showing a process of removing residual solder on the elastic stamp formed in the repair device of FIG. 1, and FIG. 4 is a view showing a process of removing the residual solder by the solder application unit provided in the repair device of FIG. FIG. 5 is a view showing a process in which an alternative device attached to the second adhesive film formed in the repair device of the defective device of FIG. 1 is bonded to a removal position of the substrate from which the defective device is removed And FIG. 6 is a block diagram illustrating a repair method of a defective device according to an embodiment of the present invention.

1 to 6, the repair device for a defective device according to the present embodiment is an apparatus for selectively replacing a defective device E1 existing on a substrate W. The repair device includes a first adhesive film 100, A pressing portion 200, and a second adhesive film 300.

As shown in FIG. 1, the first adhesive film 100 is disposed to face the substrate W including the defective element E1 and is made of a light-transmitting material. The first adhesive film 100 includes a viscoelastic material to which an attraction force (electromagnetic force or van der Waals attractive force) with the element E can be applied and is made of a flexible material so as to be wound on the roller.

The first adhesive film 100 typically includes an optically clear adhesive (OCA) film on a film made of a transparent plastic material such as polyolefin (PO), polyethylene naphthalate (PEN), polyimide (PI), or cyclic olefin copolymer (COC) And the like.

The first adhesive film 100 may be wound on the first roller 110 and moved to one side by driving the first roller 110. [ Although not shown, the first adhesive film 100 may be moved in the first and second directions to move the first roller 110 in the horizontal and vertical directions to move the first adhesive film 100 against the substrate W, And may further include a moving means (not shown).

The defective element E1 refers to a device in which cracks have occurred in a large number of elements E arranged on the substrate W, a device mounted at a wrong position, a device in which the current flow is not smooth or short-circuited.

The pressing portion 200 presses a portion of the first adhesive film 100 facing the defective element E1 so as to be in close contact with the defective element E1. When the pressurization of the pressing portion 200 is released, the defective element E1 is adhered to the first adhesive film 100 and removed from the substrate W. [

The pressing unit 200 includes a pressing jig 210 spaced apart from the substrate W and a pressing jig 210 so that the pressing jig 210 is pressed against the first adhesive film 100 or an elastic stamp 500 And a pressure driver 220 for lifting and lowering the pressure chamber 210.

In this embodiment, the laser irradiation unit 400 may further be included so that the defective device E1 can be smoothly removed from the substrate W. The laser irradiation unit 400 transmits the first adhesive film 100 to melt the solder P between the defective element E1 and the substrate W to irradiate the solder P with the laser beam L do.

The laser irradiation unit 400 includes an oscillator 410 for outputting a laser beam L, a reflection lens 420 for reflecting the laser beam toward the substrate, a focal point f of the laser beam L, (Not shown) that condenses the laser beam L so that the laser beam L is formed on the substrate P as shown in FIG.

The solder P is an adhesive material that physically and electrically connects the element E and the substrate W to each other and is a paste containing low temperature molten metal particles and a flux or a low- As shown in FIG.

In the removal position Wa of the substrate W from which the defective element E1 has been removed after the defective element E1 is adhered to the first adhesive film 100 and removed from the substrate W, Leaving a trace amount of residual solder P1 remaining. To eliminate this, the present invention may further include an elastic stamp 500.

3, the elastic stamp 500 is arranged to face the substrate W from which the defective element E1 has been removed, and a part of the elastic stamp 500 is deformed to come in close contact with the removal position Wa of the substrate W, The remaining solder P1 remaining in the removal position Wa of the wafer W is removed.

The material of the elastic stamp 500 is not particularly limited, but it is preferably made of a material having an adhesive strength of a certain standard or more, being flexible, and having transparency through which the laser beam L can pass. Films made of PDMS (Polydimethylsiloxane), silicone rubber, EVA (Ethylene Vinyl Acetate), PET (Polyethylene terephthalate), PES (Polyether Sulfone), PEN (Polyethylene Naphthalate) and COC (Cyclic Olefin Copolymer) may be used.

The residual solder P1 is removed by the elastic stamp 500 so that the subsequent replacement solder P2 can be firmly adhered to the substrate W and the replacement element E2 Can be prevented from being mounted or inclinedly mounted by the residual solder P1 higher than the neighboring elements.

At this time, the metal structure layer 510 may be formed on one side of the elastic stamp 500 contacting with the substrate W so that the adhesive force between the elastic stamp 500 and the residual solder P1 is increased. The metal structure layer 510 acts to increase the adhesive force between the elastic stamp 500 and the residual solder P1 and has a thickness (usually within 50 nm) so as to be bent together with the elastic stamp 500 It is preferable that the metal is coated or formed into a two-dimensional or three-dimensional shape through a patterning method.

The metal structure layer 510 may be composed of any one of gold, platinum, silver, tin, palladium, and rhodium, or an alloy containing such a metal. These metals are metals having a relatively good wettability with the solder P, and the adhesion between the elastic stamp 500 and the residual solder P1 is further increased in proportion to the wettability. As a result, residual solder P1 remaining on the substrate W can be removed more smoothly.

It is advantageous in view of the facility to press the first adhesive film 100 and the elastic stamp 500 by using one pressing means. Therefore, it is preferable that the pressing portion 200 presses the elastic stamp 500 so that the elastic stamp 500 is partially deformed and brought into close contact with the removal position Wa of the substrate W. [

The condensing lens may be separately installed in the laser irradiating unit 400 so as to condense the laser beam L. However, in order to reduce facilities, in this embodiment, the pressing jig 210 is provided in a lens shape having a light- And forms a focus f on the defective element E1 or the solder P while the laser beam L irradiated from the laser irradiation part 400 passes through the pressing jig 210. [

The function of the condensing lens to be provided in the laser irradiating unit 400 can be replaced with a function of pressing a part of the elastic stamp 500 and the substitute element E2 can be replaced with the replacement solder P2 It may perform the function of pressing the substitute element E2 so as to be surely adhered.

In this embodiment, the solder applying unit 600 may be further included. The solder applying unit 600 applies the replacement solder P2 to the removed position Wa of the substrate W where the defective element E1 is adhered to the first adhesive film 100 as shown in FIG. Alternatively, an alternative solder P2 may be formed on one surface of the substitute element E2, which is not shown, but which is in close contact with the substrate W at a convenience.

The solder applying unit 600 may be configured in various ways such as an inkjet printing method using thermal or mechanical vibration to jet fine solder ink to a nozzle, or an e-jet printing method using an electric field that pushes solder ink to flow out .

The second adhesive film 300 has an alternative element E2 which is disposed opposite the substrate W to which the replacement solder P2 is applied and which is attached to the replacement solder P2. The second adhesive film 300 may be made of the same film as the first adhesive film 100 for convenience of production, but is not limited to the same film.

The second adhesive film 300 may be wound around the second roller 310 and moved to one side by driving the second roller 310, like the first adhesive film 100. When the replacement element E2 is bonded to the substrate W, the second adhesive film 300 is wound to a predetermined length, and another replacement element E2 attached to the second adhesive film 300 is wound on the substrate W. [ As shown in FIG.

Although not shown, the second roller 310 is moved in the horizontal direction and the vertical direction to move the second adhesive film 300 in order to bring the second adhesive film 300 into close contact with the substrate W, And may further include a moving means. It is preferable to relatively move the basic structures of the present invention including the first and second adhesive films 100 and 300 relative to the substrate W in a state in which the substrate W is transported at a constant height in terms of continuity of the process .

Unlike the conventional vacuum suction type repair device, the repair device of the present invention having the above-described structure can easily remove the minute defective device E1 using the adhesive force of the adhesive film.

The conventional vacuum suction type repair apparatus can adsorb and remove the defective element E1 when the width of the defective element E1 is 0.5 mm or more or the thickness of the defective element E1 is 20 μm or more, , The defective element E1 can not be smoothly processed due to the design limit of the adsorption pad (vacuum grooving restriction).

On the other hand, the defective device E1 is adhered to the first adhesive film 100 in the process of attaching and detaching the first adhesive film 100 to the substrate for a while, It is possible to smoothly remove the defective element E1 regardless of the area or the thickness of the defective element E1.

Hereinafter, a repair method of a defective device according to the present invention will be described. A repair method of a defective device according to the present invention includes a pressing step (S1), a defective element removing step (S2), and a replacement device bonding step (S3).

The pressing step S1 is a step of pressing the first adhesive film 100 of a light-transmitting material to adhere to the defective element E1 attached to the substrate W as shown in FIG. 2 or FIG.

The laser beam L is irradiated to the solder P hardened between the defective element E1 and the substrate W so that the mutual coupling force between the defective element E1 and the substrate W is lost in the pressing step S1 It is preferable to melt the solder (P).

In the defective element removing step S2, the defective element E1 is adhered to the first adhesive film 100, and the first adhesive film 100 is separated from the substrate W to remove the defective element E1 from the substrate W ).

Thereafter, the defective element E1 adhered to the first adhesive film 100 by the driving of the first roller 110 is moved to one side and processed. In order to adhere the other defective element E1, A new side of the substrate 100 may be disposed facing the substrate W.

Residual solder removing step S2a may be performed to treat a small amount of remaining solder P1 remaining in the removal position Wa of the substrate W from which the defective element E1 has been removed. 3, the residual solder removing step S2a is performed so that a part of the elastic stamp 500 is deformed to be pressed against the removal position Wa of the substrate W, And removing the remaining residual solder P1.

The remaining solder P1 which has been melted by the laser beam L in the pressing step S1 may hardly stick to the elastic stamp 500 in the residual solder removing step S2a because it hardens after a certain time. Accordingly, in the residual solder removing step S2a, the residual solder P1 is irradiated with the laser beam L to melt the residual solder P1, and at the same time, the elastic stamp 500 is removed from the removal position Wa of the substrate W To remove the residual solder P1 effectively.

The metal structure layer 510 is previously formed on one side of the elastic stamp 500 contacting the substrate W so that the adhesive force between the elastic stamp 500 and the residual solder P1 can be increased in the residual solder removing step S2a And the metal structure layer 510 may be formed of any one of gold, platinum, silver, tin, palladium, and rhodium. The effect is as described above.

An alternative solder applying step S2b may be performed after the residual solder removing step S2a. The alternative solder applying step S2b may be performed by applying the replacement solder P2 to the removed position Wa where the defective element E1 is removed from the substrate W as shown in FIG. Forming an alternate solder on one side of the replacement element.

The replacement solder P2 is precisely supplied in an accurate amount and is formed to have a width and a thickness equal to those of the solder P already formed. For this purpose, the solder ink can be supplied to the removal position Wa of the substrate W by using the head unit employing the E-jet printing method.

5, the replacement element E2 attached to the second adhesive film 300 of a light transmitting material is pressed by the pressing jig 210 to the removal position of the substrate W And the replacement solder P2 is hardened by irradiating the laser beam L to the replacement solder P2 between the replacement device E2 and the substrate W to remove the replacement device E2 from the substrate W W).

The replacement solder P2 in the paste state in the state in which the replacement element E2 is in close contact with the replacement solder P2 starts to be hardened by the heat generated by the laser beam L, The replacement solder P2 is completely cured and the replacement element E2 is physically and electrically bonded to the substrate W. [

It is also possible to apply ultrasonic waves in addition to the method of irradiating the laser beam L to the replacement solder P2 between the replacement element E2 and the substrate W in the replacement element bonding step S3. That is, in a state in which the substitute element E2 attached to the second adhesive film 300 is pressed by the pressing jig 210 to the removal position Wa of the substrate W, The replacement element E2 and the replacement solder P2 can be bonded by applying ultrasonic waves to the pressing jig 210 using a generating unit (not shown) and applying pressure.

Thereafter, the second adhesive film 300 is separated from the substrate W, and the second adhesive film 300 is wound to a predetermined length by driving the second roller 310 for the next repair process, And may be positioned to face the substrate W.

The repair method and the repair apparatus for the defective device of the present invention constructed as described above are characterized in that the defective device is adhered to the first adhesive film in the process of temporarily sticking and peeling the first adhesive film to the substrate, It is possible to easily and smoothly remove the defective device without being affected by the defects.

Further, in the repair method and repair apparatus for a defective device of the present invention constructed as described above, since the residual solder is removed by the elastic stamp, the subsequent solder to be applied subsequently can be firmly adhered to the substrate, It is possible to prevent an alternative device which is brought into close contact with the first and second substrates by preventing the solder from being mounted higher or higher than the neighboring devices by the residual solder.

The method for repairing a defective element of the present invention having the structure as described above and the repair apparatus for the same may further comprise the steps of increasing the adhesive force between the elastic stamp and the residual solder through the metal structure layer formed on one surface of the elastic stamp, It is possible to obtain an effect that it can be removed more cleanly.

In addition, the repair method and the repair apparatus for the defective device according to the present invention, which are constructed as described above, have a structure in which the metal structure layer is made of a material having good wettability with the solder to further increase the adhesive force between the elastic stamp and the residual solder Can be obtained.

In addition, the repairing method and the repairing apparatus for the defective element of the present invention constructed as described above are characterized in that the pressing jig is provided in the form of a lens having a light-transmitting material so that the function of the collecting lens is replaced, It is possible to perform the function of pressurizing and to perform the function of pressing the substitute element as necessary.

The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

100: First adhesive film
200:
300: Second adhesive film
400: laser irradiation unit
500: elastic stamp
600: Solder dispensing part
W: substrate
E1: Defective element
E2: Replacement device
P: Solder
P1: Residual solder
P2: Replacement solder

Claims (15)

A pressing step of pressing the first adhesive film of a light-transmitting material to adhere to a defective element attached to the substrate;
Removing the defective device from the substrate by separating the first adhesive film from the substrate while the defective device is adhered to the first adhesive film; And
And an alternative device bonding step of bonding an alternative device attached to the second adhesive film of a light-transmitting material to the substrate at a removal position of the substrate from which the defective device is removed to bond the replacement device to the substrate. Repair method. The method according to claim 1,
After the defective element removing step,
Further comprising a remaining solder removing step of removing residual solder remaining at a removal position of the substrate by pressing the portion of the elastic stamp to be deformed and brought into close contact with the removal position of the substrate. The method according to claim 1,
After the defective element removing step,
Further comprising an alternative solder applying step of forming an alternative solder at a removal position where the defective device is removed from the substrate or forming an alternative solder on one surface of the replacement device which is in close contact with the substrate, Way. The method according to claim 1,
Wherein the pressing step comprises:
And irradiating a laser beam onto the hardened solder between the defective device and the substrate to melt the solder. 3. The method of claim 2,
The residual solder removing step includes:
And the laser beam is irradiated to the residual solder while the elastic stamp is in close contact with the removal position of the substrate. 3. The method of claim 2,
The residual solder removing step includes:
Wherein the adhesive strength between the elastic stamp and the residual solder is increased by the metal structure layer formed on one surface of the elastic stamp contacting the substrate. The method of claim 3,
The alternative device bonding step may include:
The alternate element is pressed to the substrate side, the laser beam is irradiated to the replacement solder to bond the replacement element and the replacement solder, or ultrasonic waves are applied in a state where the replacement element is pressed toward the substrate, And the replacement solder are bonded to each other. A first adhesive film disposed opposite the substrate including the defective device and made of a light transmitting material;
A pressing part for pressing the first adhesive film so as to be in close contact with the defective element so that the defective element is adhered to and removed from the first adhesive film; And
And a second adhesive film having an alternative element which is adhered to the removed position of the substrate from which the defective element is removed. 9. The method of claim 8,
And a laser irradiating unit for irradiating the solder with a laser beam through the first adhesive film to melt the cured solder between the defective device and the substrate. 9. The method of claim 8,
And an elastic stamp disposed opposite to the removed position of the substrate from which the defective element has been removed and removing residual solder remaining in the removed position of the substrate while being deformed to come in close contact with the removed position of the substrate Repair device of defective device. 11. The method of claim 10,
Wherein the elastic stamp has a metal structure layer formed on one surface of the elastic stamp that contacts the substrate so that the adhesion between the elastic stamp and the residual solder becomes large. 11. The method of claim 10,
Wherein the pressing portion includes a pressing jig which is disposed apart from the substrate and a pressing driving portion that moves the pressing jig up and down so that the pressing jig is pressed against the first adhesive film or the elastic stamp. Repair device. 13. The method of claim 12,
The pressing jig is provided in a lens shape having a light-transmitting material,
And the laser beam irradiated from the laser irradiation unit passes through the pressing jig to form a focus on the defective element or the solder. 11. The method of claim 10,
Further comprising a solder applying unit for forming an alternative solder at a removal position of the substrate from which the defective device is removed or a solder applying unit for forming replacement solder on one surface of the replacement device closely contacting the substrate. 15. The method of claim 14,
The pressing portion presses the substitute element so that the substitute element is brought into close contact with the substrate,
A laser irradiator for transmitting the laser beam to the replacement solder through the second adhesive film to bond the replacement device and the replacement solder; Or an ultrasonic generator for applying ultrasonic waves to the substitute element to bond the substitute element and the substitute solder.

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