KR20180085096A - Copper clad laminates for preventing short-circuit of a via hole and the manufacturing method - Google Patents

Abstract

The present invention provides a copper-clad laminate capable of preventing short-circuiting of via holes. The copper-clad laminate of the present invention comprises: an upper laminated part in which an upper copper-clad laminate formed on an upper part thereof, and an upper insulator for insulating the upper copper-clad laminate are laminated; a lower laminated part in which a lower copper-clad laminate formed on a lower part thereof, and a lower insulator are laminated; a shielding part which has a shielding body for shielding noise between the upper laminated part and the lower laminated part; via holes which are plated so that the via holes communicate between the upper copper-clad laminate and the lower copper-clad laminate, thereby being electrified mutually, wherein the shielding body includes a filling hole facing inward such as to form a space with outer walls of the plated via holes. Therefore, the copper-clad laminate of the present invention can allow the copper-clad laminates connected through the via holes and the shielding body formed of a conductive metal material to be insulated from each other, thereby being applicable to a combo antenna including two or more antennas integrally formed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper clad laminate capable of preventing short-circuiting of via-

The present invention relates to a copper-clad laminate capable of preventing short-circuiting of a via hole and a method of manufacturing the same.

BACKGROUND ART Printed circuit boards (PCBs) are used for component mounting and wiring of electronic devices. After a thin plate of copper or the like is attached to one side of a phenol resin insulating plate or an epoxy resin insulating plate or the like, (By leaving the circuit on board only and removing it by corrosion) to make the required circuit, and to drill a hole to mount the components.

Such a printed circuit board includes a single-sided PCB on which wiring is formed on only one side of an insulating substrate, a double-sided PCB on which wiring is formed on both sides, and a multi-layered board (MLB) in which circuit patterns are multilayered.

In recent years, the complexity of circuits has increased, and the demand for high density and miniaturization circuits has increased. In recent years, the use of double-sided printed circuit boards or multi-layer printed circuit boards It is common.

A method for manufacturing such a printed circuit board includes the steps of fabricating a printed circuit board using an insulator, a shield 310, and a copper-clad laminate in which a copper foil is sequentially laminated. The double-sided copper-clad laminate and its manufacturing process are shown in Figs. 1 and 2.

FIG. 1 is a flow chart showing a process of manufacturing a conventional copper-clad laminate, and FIG. 2 is a sectional view showing a conventional copper-clad laminate.

1, step S10 of stacking the upper copper foil 1 and the lower copper foil 7 on both sides of the conventional wafer, step S20 of processing the via hole 9, plating the inner surface of the via hole 9 S30.

Step S10 includes a lower copper foil 7 and an upper copper foil 1 which are positioned on the uppermost and lowermost sides to form a surface opposite to the one surface of the printed circuit board and a lower insulator 3 and a shield 4, And the upper insulator 5 as the adhesive 2, respectively.

The lower shield 3 and the upper shield 5 are electrically insulated from each other by a plate type sheet SHEET which is made of a metal material so as to shield electromagnetic waves to be supplied through a via hole 9 And may be formed of a polyimide series sheet SHEET.

Step S20 is a step of forming a via hole 9 passing through the lamination structure of step S10. Here, the via hole 9 is formed as a device such as a drill for conducting electricity between the lower copper foil 7 and the upper copper foil 1.

Step S30 is a step of copper plating the inner surface of the via hole 9. The copper plating electrically conducts between the lower copper foil 7 and the upper copper foil 1.

The copper-clad laminate produced by such a process was produced by laminating a dry film (DF), placing an artwork film (not shown) on the laminated dry film, irradiating ultraviolet rays (UV) And then is subjected to an exposure and etching process to form a printed circuit board.

Here, in the conventional copper-clad laminate, when the shielding body is formed of a metal-type plate-like sheet, when the plating tube is formed after the via hole processing, electricity can be conducted between the plating tube and the shielding body.

That is, in the conventional copper-clad laminate, horizontal current is supplied between the via hole and the shielding body together with the vertical energization through the via hole, so that all the via-holes communicating with the shielding body are energized.

Therefore, for example, a combo antenna in which two or more antennas (for example, an antenna for short-range communication and a wireless-rechargeable antenna) And the B pattern of the antenna for short-range communication and the B pattern of the antenna for short-range communication are formed on the opposite surface, the patterns A and B of the short-range communication antenna are A, B patterns of the wireless- B pattern.

However, according to the conventional art, as the shield is electrically connected to any one of the via-holes of the copper-clad laminate as described above, it can be electrically connected to the entire via hole, so that two or more antennas included in the combo antenna are operated as one antenna .

Korean Patent Laid-Open Publication No. 10-2014-0057861 (published May 4, 2014)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a copper clad laminate capable of preventing a short circuit between a shield and a copper foil, and a method for manufacturing the same.

Another object of the present invention is to provide a copper-clad laminate capable of preventing short-circuiting of a via hole, which is suitable for a combo antenna in which two or more antennas are integrated, and a method of manufacturing the same.

Therefore, the present invention can provide the following embodiments in order to achieve the above object.

A preferred embodiment according to the present invention is characterized in that it comprises an upper lamination part in which an upper copper foil formed on the upper part is laminated with an upper insulator which insulates the upper copper foil, a lower lamination part in which a lower copper foil and a lower insulator are laminated, A shielding portion having a shield for shielding noise between the upper laminated portion and the lower laminated portion; and a via hole plated so as to communicate between the upper copper foil and the lower copper foil so as to be energizable with each other, And a filling hole which is inwardly directed to form a spaced-apart space.

Therefore, the present invention can mutually isolate the copper foil connected through the via hole and the shield made of the conductive metal material, thereby preventing the characteristic deterioration due to the abnormal short-circuit between the via-holes in the printed circuit board.

Further, the present invention obtains the effect of improving the characteristics of the combo antenna in which two or more antennas are integrated.

1 is a flowchart showing a manufacturing process of a conventional copper clad laminate.
2 is a cross-sectional view showing a conventional copper-clad laminate.
3 is a cross-sectional view illustrating a copper-clad laminate capable of preventing an interlayer short-circuit of a via hole according to the present invention.
4 is a flowchart showing a method of manufacturing a copper clad laminate capable of preventing an interlayer short circuit of a via hole according to the present invention.
5 is a sectional view showing the step S100.
6 is a cross-sectional view showing the step S200.
7 is a sectional view showing the step S300.
8 is a sectional view showing the step S400.
9 is a sectional view showing the step S500.

Hereinafter, embodiments and examples of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention.

However, the present invention may be embodied in many different forms and is not limited to the embodiments and examples described herein, and the terms and words used in the specification and claims are not to be construed in a conventional or dictionary sense, It should be construed as meaning and concept consistent with the technical idea of.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

Hereinafter, preferred embodiments of a copper-clad laminate and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a cross-sectional view illustrating a copper-clad laminate capable of preventing short-circuiting of a via hole according to the present invention.

3, the copper-clad laminate according to the present invention includes a lower laminate 100, an upper laminate 200, a laminate of the lower laminate 100 and the upper laminate 200, A shielding portion 300 for shielding the via hole 400, and a plating pipe 500.

The lower laminate part 100 includes a lower copper foil 110 forming a lower face of the copper-clad laminate and a lower insulator 120 laminated above the lower copper foil 110.

The lower copper foil 110 forms the lower surface of the copper clad laminate and forms a pattern of the antenna.

Adhesives 131 and 132 are applied to both surfaces of the lower insulator 120 and bonded to the upper surface of the lower copper foil 110 and the lower surface of the shield 310, respectively. Here, the lower insulator 120 may be made of, for example, a polyimide series so as to insulate the shield 310 from the lower copper foil 110. [

The shielding unit 300 includes a shield 310 made of a metal plate type sheet capable of shielding noise of electrical characteristics such as electromagnetic waves and a shielding unit 310. The shielding unit 300 is coated on the upper surface of the shielding unit 310, (320).

The shield 310 is laminated on the upper surface of the lower insulator 120 by a second adhesive 132 applied to the upper surface of the lower insulator 120 as a metal type sheet SHEET. The shield 310 includes a filling hole 311 and a hole insulating material 312 fixed to an inner wall surface of the filling hole 311.

The filling hole 311 is a concave hole opened inwardly from the upper surface of the shielding body 310 and has an open space inside the shielding body 310 by the bottom surface and the wall surface.

The hole insulating material 312 is fixed to the wall surface and / or the bottom surface of the filling hole 311 to insulate the shielding body 310 from the plated via hole 400 described later.

The laminating means 320 is applied to the upper surface of the shielding body 310 to fill the filling hole 311 and adhesively fix the upper stacking portion 200. For example, the luting means 320 may be formed of any one selected from liquid or gel epoxy (EPOXY), glass epoxy, acrylic, silicone, PET, and PC resin And is filled with the filling hole 311 at the same time.

The laminating means 320 is divided into packing means (not numbered) for filling the filling hole 311 and bonding means (not numbered) for laminating the upper laminated portion 200 It is possible to use it. For example, a liquid or gel-like epoxy resin is used as the filling means, and the adhesive means is a double-sided tape applied to the upper surface of the shielding body 310 after the epoxy resin is filled in the filling hole 311 can do.

The laminating means 320 is not limited to the one described above and may be a single or a plurality of laminating means capable of filling the filling hole 311 and adhering and fixing the upper laminate portion 200 on the upper surface of the shielding material 310 Lt; / RTI >

The upper laminate portion 200 includes an upper insulator 220 laminated on the upper side of the lamination means 320 and an upper copper laminate 210 laminated on the upper side of the upper insulator 220.

Here, the upper insulator 220 is adhered and fixed by the joining means 320 to insulate the shield 310 from the upper copper foil 210.

The upper copper foil 210 is adhered and fixed by an adhesive 231 applied on the upper surface of the upper insulator 220 to form the upper surface of the copper clad laminate.

The via hole 400 is communicated to communicate between the lower copper foil 110 and the upper copper foil 210. The plating pipe 500 is plated on the inner side of the via hole 400, And the thin plate 210 is electrically energized.

Here, the copper-plated via hole 400 extends through the filling hole 311. At this time, since the length of the filling hole 311 is larger than the diameter of the via hole 400, direct contact between the plating pipe 500 of the via hole 400 and the shielding body 310 is prevented.

That is, according to the present invention, since the via hole 400 is formed in the shield 310 so as to communicate the fill hole 311 filled with the epoxy resin, it is possible to prevent the short circuit between the shield 310 and the via hole 400 .

Hereinafter, a method of manufacturing a copper-clad laminate capable of preventing short-circuiting of a via hole according to the present invention will be described.

4 is a flowchart showing a method of manufacturing a copper clad laminate capable of preventing short-circuiting of a via hole according to the present invention.

Referring to FIG. 4, the present invention includes a step S100 of processing the filler hole 311 in the shielding body 310, a step S200 of joining the shielding part 300 and the lower stacking part 100, The step S300 of applying the laminating means 320 to the upper layer portion 200, the step S400 of joining the upper layer portion 200, the step S500 of processing the via hole 400, and the step S600 of plating the via hole 400.

Referring to FIG. 5, step S100 is a step of processing the filling hole 311 so as to have a predetermined space having a bottom surface and a wall surface inwardly from the top surface of the shield 310. [ Here, the filling hole 311 is, for example, in the form of a cup having a top surface opened and a wall surface and a bottom surface.

In step S100, a hole insulating material 312 is provided so as to be in close contact with a wall surface of the filling hole 311.

At this time, the hole insulating material 312 is fixed to the wall surface of the filling hole 311 as a plate material. Preferably, the hole insulating material 312 is an insulating plate material, and the adhesive liquid is coated on one surface thereof and fixed to the wall surface of the filling hole 311.

Referring to FIG. 6, in step S200, the shield 310 having the filling hole 311 and the hole insulating material 312 is joined to the lower stacking unit 100. The lower laminate part 100 has a lower insulator 120 laminated on the lower surface of the lower copper foil 110. Adhesives 131 and 132 are applied to both surfaces of the lower insulator 120. [ Therefore, the shielding body 310 is bonded to the lower stacking unit 100 by the adhesive 131 or 132 applied on the upper surface of the lower insulator 120.

Referring to FIG. 7, in step S300, the filler hole 311 is coated by applying a joining means 320 (e.g., an epoxy resin) to the upper surface of the shielding body 310 . At this time, the filling hole 311 is filled with the joining means 320.

8, the upper laminate part 200 in which the upper copper foil 210 and the upper insulator 220 are sequentially laminated is laminated on the upper side of the lamination means 320 to form the lower laminate part 100, And the upper stacking unit 200 are joined together. The upper lamination part 200 is laminated on the upper surface of the shielding body 310 and is then pressed by a hot press (for example, HOT-PRESS). At this time, the thermocompression process can be carried out at a temperature of 60 to 250 ° C and a pressure of 150 Kg / cm 2 or less.

Referring to FIG. 9, step S500 is a step of processing the via hole 400 in the copper-clad laminate laminated in step S400. Here, the via hole 400 is vertically formed so as to conduct electricity between the lower movable copper foil 110 and the upper upper copper foil 210. At this time, the via hole 400 extends to pass through the filling hole 311.

Since the diameter of the filling hole 311 is larger than the diameter of the via hole 400, the shield 310 is spaced apart from the via hole 400 and the spaced space is filled with the above- .

In step S600, the plating process is performed on the inner wall of the via hole 400 to form the plating pipe 500 so that the via hole 400 can be energized. At this time, the outer wall of the plating pipe 500 is spaced apart from the wall surface of the filling hole 311 of the shielding body 310 to form a space filled with the joining means 320.

Accordingly, the via hole 400 according to the present invention is formed by the conventional via hole 400 and the plating tube 500 as the shielding body 310 and the plating tube 500 are spaced apart and the gap means 320 is filled therebetween. No electric current is generated due to electrical contact between the electrodes.

It will be apparent to those skilled in the art that various modifications and variations may be made in the present invention.

Therefore, it is to be understood that the present invention is not limited to the above-described embodiments. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

100: lower lamination part 110: lower copper laminate
120: lower insulator 131, 132, 231: adhesive
200: upper laminate part 210: upper copper thin plate
220: upper insulator 300: shield
310: shielding body 311: filling hole
312: Hole insulating material 320: Lapping means
400: via hole 500: plating tube

Claims (8)

An upper laminate part having an upper copper foil formed on the upper part and an upper insulating part insulating the upper copper foil;
A lower laminated portion having a lower copper foil formed on a lower portion thereof and a lower insulator insulating the lower copper foil;
A shielding portion having a shield for shielding noise between the upper laminated portion and the lower laminated portion; And
And a via hole which is connected to the upper copper foil and the lower copper foil and is plated so as to be energized with each other,
The shield
And a filling hole which is inwardly directed to form a spaced space from an outer wall of the plated via hole.
The apparatus of claim 1, wherein the shield
And a jointing means for applying a top coat to the upper surface of the shielding member and bonding the upper laminated portion to the shielding member.
3. The apparatus of claim 2,
Wherein the resin is a resin made of one selected from the group consisting of epoxy, glass epoxy, acrylic, silicone, PET and PC.
3. The copper-clad laminate according to claim 2, wherein the filling hole is filled with the joining means.
a) machining an inward filling hole in a shield for shielding noise;
b) stacking the lower copper foil, the lower copper foil and the lower insulator, and joining the shield on the upper surface of the lower insulator;
c) applying a jointing means having an adhesive force in liquid or gel form to the upper surface of the shielding body;
d) laminating an upper copper foil and an upper insulator, which form an upper surface, and laminating and laminating the upper copper foil and the upper insulator on the upper surface of the shielding material coated with the joining means;
e) forming a via hole vertically communicating between the upper copper foil and the lower copper foil, and plating the via hole to be conductive,
And the outer wall of the plated via hole and the wall surface of the filling hole are spaced apart from each other.
6. The apparatus of claim 5,
Wherein the resin is a resin made of at least one selected from the group consisting of epoxy, glass epoxy, acrylic, silicone, PET, and PC in the form of liquid or gel.
6. The method of claim 5, wherein in step a)
A method for manufacturing a copper-clad laminate, which is capable of preventing short-circuiting of a via hole having an open top surface and a wall surface and a bottom surface.
6. The method of claim 5, wherein, in step c)
Wherein the filler is filled in an upper surface of the shielding body and in an empty space of the filler hole.

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