KR20180084508A - Semiconductor device and light emitting device package having thereof - Google Patents
Semiconductor device and light emitting device package having thereof Download PDFInfo
- Publication number
- KR20180084508A KR20180084508A KR1020170008210A KR20170008210A KR20180084508A KR 20180084508 A KR20180084508 A KR 20180084508A KR 1020170008210 A KR1020170008210 A KR 1020170008210A KR 20170008210 A KR20170008210 A KR 20170008210A KR 20180084508 A KR20180084508 A KR 20180084508A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- light emitting
- algan
- semiconductor device
- semiconductor layer
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
An embodiment of the present invention relates to a semiconductor device and a light emitting device package having the same. The semiconductor device according to the embodiment includes: a substrate; a buffer layer on the substrate; a first conductive semiconductor layer on the buffer layer; an AlGaN based active layer on the first conductive semiconductor layer; and a second conductive semiconductor layer on the active layer. The buffer layer includes a first superlattice structure layer having a plurality of pairs of AlN/AlGaN layers or AlGaN/AlGaN layers having a different aluminum composition, and the first conductivity type semiconductor layer may include a first semiconductor pattern of SiNx (x is a positive integer). The embodiment can improve the external appearance and light emitting efficiency by preventing cracks and reducing treading dislocation (TD).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170008210A KR20180084508A (en) | 2017-01-17 | 2017-01-17 | Semiconductor device and light emitting device package having thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170008210A KR20180084508A (en) | 2017-01-17 | 2017-01-17 | Semiconductor device and light emitting device package having thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20180084508A true KR20180084508A (en) | 2018-07-25 |
Family
ID=63058631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170008210A KR20180084508A (en) | 2017-01-17 | 2017-01-17 | Semiconductor device and light emitting device package having thereof |
Country Status (1)
Country | Link |
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KR (1) | KR20180084508A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200019502A (en) * | 2018-08-14 | 2020-02-24 | 엘지이노텍 주식회사 | Epitaxial wafer and method for fabricating the same |
EP4276921A1 (en) * | 2022-05-12 | 2023-11-15 | The Regents of the University of California | High efficiency ultraviolet light-emitting devices incorporating a novel multilayer structure |
-
2017
- 2017-01-17 KR KR1020170008210A patent/KR20180084508A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200019502A (en) * | 2018-08-14 | 2020-02-24 | 엘지이노텍 주식회사 | Epitaxial wafer and method for fabricating the same |
EP4276921A1 (en) * | 2022-05-12 | 2023-11-15 | The Regents of the University of California | High efficiency ultraviolet light-emitting devices incorporating a novel multilayer structure |
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