KR20180084508A - Semiconductor device and light emitting device package having thereof - Google Patents

Semiconductor device and light emitting device package having thereof Download PDF

Info

Publication number
KR20180084508A
KR20180084508A KR1020170008210A KR20170008210A KR20180084508A KR 20180084508 A KR20180084508 A KR 20180084508A KR 1020170008210 A KR1020170008210 A KR 1020170008210A KR 20170008210 A KR20170008210 A KR 20170008210A KR 20180084508 A KR20180084508 A KR 20180084508A
Authority
KR
South Korea
Prior art keywords
layer
light emitting
algan
semiconductor device
semiconductor layer
Prior art date
Application number
KR1020170008210A
Other languages
Korean (ko)
Inventor
음정현
문용태
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020170008210A priority Critical patent/KR20180084508A/en
Publication of KR20180084508A publication Critical patent/KR20180084508A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/12Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

Abstract

An embodiment of the present invention relates to a semiconductor device and a light emitting device package having the same. The semiconductor device according to the embodiment includes: a substrate; a buffer layer on the substrate; a first conductive semiconductor layer on the buffer layer; an AlGaN based active layer on the first conductive semiconductor layer; and a second conductive semiconductor layer on the active layer. The buffer layer includes a first superlattice structure layer having a plurality of pairs of AlN/AlGaN layers or AlGaN/AlGaN layers having a different aluminum composition, and the first conductivity type semiconductor layer may include a first semiconductor pattern of SiNx (x is a positive integer). The embodiment can improve the external appearance and light emitting efficiency by preventing cracks and reducing treading dislocation (TD).
KR1020170008210A 2017-01-17 2017-01-17 Semiconductor device and light emitting device package having thereof KR20180084508A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020170008210A KR20180084508A (en) 2017-01-17 2017-01-17 Semiconductor device and light emitting device package having thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170008210A KR20180084508A (en) 2017-01-17 2017-01-17 Semiconductor device and light emitting device package having thereof

Publications (1)

Publication Number Publication Date
KR20180084508A true KR20180084508A (en) 2018-07-25

Family

ID=63058631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170008210A KR20180084508A (en) 2017-01-17 2017-01-17 Semiconductor device and light emitting device package having thereof

Country Status (1)

Country Link
KR (1) KR20180084508A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200019502A (en) * 2018-08-14 2020-02-24 엘지이노텍 주식회사 Epitaxial wafer and method for fabricating the same
EP4276921A1 (en) * 2022-05-12 2023-11-15 The Regents of the University of California High efficiency ultraviolet light-emitting devices incorporating a novel multilayer structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200019502A (en) * 2018-08-14 2020-02-24 엘지이노텍 주식회사 Epitaxial wafer and method for fabricating the same
EP4276921A1 (en) * 2022-05-12 2023-11-15 The Regents of the University of California High efficiency ultraviolet light-emitting devices incorporating a novel multilayer structure

Similar Documents

Publication Publication Date Title
RU2014138822A (en) INTEGRATION OF LEDS ON GALLIUM NITRIDE WITH INSTRUMENTS ON ALUMINUM-GALIUM NITRIDE / GALLIUM NITRIDE ON SILICON SUBSTRATES FOR AC LED
EP4235823A3 (en) Compact light emitting diode chip
EP2752894A3 (en) Semiconductor light-emitting device and light source device including the same
EP2378572A3 (en) Electrode configuration for a light emitting device
ATE535027T1 (en) III-NITRIDE LIGHT-EMITTING DEVICE HAVING A STRESS-REDUCED LIGHT-EMITTING LAYER
WO2010036055A3 (en) Group iii nitride semiconductor light emitting device
EP2348547A3 (en) Light emitting device, method of manufacturing the same, light emitting device package and lighting system
WO2009005894A3 (en) Non-polar ultraviolet light emitting device and method for fabricating same
WO2012039754A3 (en) Light emitting and lasing semiconductor methods and devices
EP2709172A3 (en) Light emitting device
MY183934A (en) Light emitting diode and fabrication method thereof
EP2355175A3 (en) Light emitting device, method of manufacturing the same, light emitting device package and lighting system
JP2015149342A5 (en)
JP2015511407A5 (en)
TW200636983A (en) Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices
EP2372790A3 (en) Light emitting diode, light emitting diode package, and lighting system
KR20180084508A (en) Semiconductor device and light emitting device package having thereof
JP2010045338A (en) Light-emitting device
WO2011055203A3 (en) Vertical light emitting diode having an outward frame-type electrode and equipment thereof
EP2519982A4 (en) Epitaxial wafer, method for manufacturing the same and method for manufacturing led chip
WO2016014345A3 (en) Two-terminal electronic devices and their methods of fabrication
TWI528582B (en) Light emitting structure and semiconductor light emitting element having the same
TW201614862A (en) Thin-film flip-chip light emitting diode having roughening surface and method for manufacturing the same
WO2009091153A3 (en) Iii-nitride semiconductor light emitting device and method for manufacturing the same
CN105514235A (en) Multiple-quantum well structure for optoelectronic device

Legal Events

Date Code Title Description
N231 Notification of change of applicant