KR20180078674A - Multilayer metal thin film forming apparatus and method for forming multi-metal layer - Google Patents

Abstract

The present invention relates to a multilayer metal thin film forming apparatus for forming a multilayer metal thin film on a film having a metal layer. The multilayer metal thin film forming apparatus comprises: a first roller unit for releasing a wound film; a preprocessing unit for removing foreign matters from the film; a first washing unit for washing the surface of the film; a first drying unit for drying the surface of the film; a first thin film forming unit for forming a first metal thin film on the film; a second thin film forming unit for forming a second metal thin film on the film; a third thin film forming unit for forming a third metal thin film on the film; a second washing unit for washing the surface of the film; a second drying unit for drying the surface of the film; and a second roller unit for winding the film. The components are mounted consecutively.

Description

TECHNICAL FIELD [0001] The present invention relates to a multilayer metal thin film forming apparatus and method for forming a multilayer metal thin film,

The present invention relates to an apparatus and method for forming a multilayer metal thin film for forming a multilayer metal thin film, and more particularly, to an apparatus and method for forming a multilayer metal thin film for forming a multilayer metal thin film, Forming apparatus and method.

Generally, the pattern formed on the circuit board is formed by electrolytic plating. In the electroplating, a plating target to be plated is charged into an electrolytic solution, and a plating process is performed using a metal to be electrodeposited with the target to be a cathode as an anode.

As an example of a plating apparatus using a film as a plated body, the film transfer apparatus of Patent Publication No. 10-2009-0048814 includes a tension adjusting member disposed in a spaced-apart space between upper rollers, And a control unit for controlling the speed of the driving unit by detecting the position of the tension adjusting member moving up and down through the sensor unit, Uniform plating is performed on the entire surface of the film so that the film under plating can always maintain a constant tension.

In order to form a continuous metal thin film, it is necessary to form a primary metal thin film, a cleaning process, a secondary metal thin film formation, a cleaning (cleaning) process, Process, etc., which requires a space cost occupied by the plating apparatus and the cleaning apparatus.

On the other hand, most of the plating apparatus using the film material as the object to be plated is kept stationary during the plating process, and in the structure in which the cathode electrode is electrically connected to both sides of the film material, the plating quality is affected by the anode electrode The thin film thickness varies depending on the region.

Korean Patent Publication No. 10-2009-0048814 Korean Patent Publication No. 10-2016-0030901 Korean Utility Model Registration No. 20-0430114

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an apparatus and a method for forming a multilayered metal thin film for forming a multilayered metal thin film capable of continuously forming a multilayered metal thin film on a plated body There is a purpose.

It is an object of the present invention to provide an apparatus and a method for forming a multilayer metal thin film for forming a multilayer metal thin film having a plating apparatus in which plating treatment and rinsing cleaning are implemented in one apparatus.

Embodiments of the present invention provide a plating apparatus capable of forming a uniform plating metal layer on a film by forming a curved mesh as an anode of a plating apparatus.

The problems to be solved by the present invention are not limited to the above-mentioned problems. Other technical subjects not mentioned will be apparent to those skilled in the art from the following description.

According to an embodiment of the present invention, there is provided an apparatus for forming a multilayer metal thin film on a film having a metal layer formed thereon, the apparatus comprising: a first roller unit for unwinding the wound film; A pretreatment unit for removing foreign substances from the film; a first cleaning unit cleaning the surface of the film; A first drying section for drying the surface of the film; A first metal thin film forming unit for forming a first metal thin film on a film; A second metal thin film forming unit for forming a second metal thin film on the film; A third metal thin film forming unit for forming a third metal thin film on the film; A second cleaner for cleaning the surface of the film; A second drying section for drying the surface of the film; And a second roller portion for winding the film are continuously provided.

The pretreatment unit can remove foreign matters with an alkaline solution.

Wherein the first metal thin film forming part forms a copper (Cu) metal thin film by a chemical plating process, and the second metal thin film forming part forms an indium (In) metal thin film by a chemical plating process, A gallium (Ga) metal thin film can be formed by a plating process.

The first to third metal thin film forming units may sequentially perform formation and cleaning of the metal thin film.

According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, the method comprising: removing foreign matter on a surface of a film having a metal layer formed thereon with an alkaline solution; Washing the alkaline solution on the surface of the film with distilled water; Removing the distilled water remaining on the surface of the film through an air knife to dry the film; Forming a first metal thin film on the dried film; Forming a second metal thin film on a film on which the first metal thin film is formed; Forming a third metal thin film on a film on which the first and second metal thin films are formed; Washing the surface of the film with distilled water; And removing the distilled water remaining on the surface of the film through an air knife to dry the film.

Embodiments of the present invention can continuously form the multi-layered metal thin film on the plated body.

The embodiments of the present invention can provide a multilayered metal thin film forming apparatus for forming a multilayered metal thin film by downsizing the metal thin film forming apparatus by providing the plating apparatus having the plating treatment and the rinse cleaning implemented in one apparatus.

Embodiments of the present invention can form a uniform plating metal layer on a film by forming a curved mesh as the anode of the plating apparatus.

1 is a configuration diagram of a multi-layer metal thin film forming apparatus for forming a multi-layer metal thin film according to an embodiment of the present invention.
2 is a perspective view of a plating apparatus according to an embodiment of the present invention.
3 is a cross-sectional view of a plating apparatus according to an embodiment of the present invention.
4 is a view illustrating lifting and lowering of an outbath according to an embodiment of the present invention.
5 is a view showing the shape of an outbath and an inner bass according to an embodiment of the present invention.
FIG. 6 is a view illustrating lifting and lowering of an inner bass from an outbath according to an embodiment of the present invention.
7 is a view showing a stage of a plating apparatus according to an embodiment of the present invention.
8 is a cross-sectional view of a stage according to an embodiment of the present invention.
9 is a view showing a coupled portion of the outbath and the stage and a coupled portion of the innerbath and the stage.
10 is a cutaway view of a part of a plating apparatus according to an embodiment of the present invention.
11 and 12 are views showing an anode and a cathode according to an embodiment of the present invention.
13 and 14 are diagrams illustrating plating processing using a plating apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The present invention will be described in detail with reference to the portions necessary for understanding the operation and operation according to the present invention. In describing the embodiments of the present invention, description of technical contents which are well known in the art to which the present invention belongs and which are not directly related to the present invention will be omitted. This is for the sake of clarity of the present invention without omitting the unnecessary explanation.

In describing the constituent elements of the present invention, the same reference numerals may be given to constituent elements having the same name, and the same reference numerals may be given to different drawings. However, even in such a case, it does not mean that the corresponding component has different functions according to the embodiment, or does not mean that it has the same function in different embodiments, and the function of each component is different from that of the corresponding embodiment Based on the description of each component in FIG.

1 is a configuration diagram of a multi-layer metal thin film forming apparatus for forming a multi-layer metal thin film according to an embodiment of the present invention.

1, the apparatus for forming a multilayer metal thin film includes a first roller unit 11, a pretreatment unit 10, a first cleaning unit 20, a first drying unit 30, a first metal thin film forming unit The first metal thin film forming unit 40, the second metal thin film forming unit 50, the third metal thin film forming unit 60, the second cleaning unit 70, the second drying unit 80 and the second roller unit 12 .

Hereinafter, the specific configuration and operation of each component of the multi-layer metal thin-film forming apparatus of FIG. 1 will be described.

The first roller unit 11 uncovers a film having a metal layer wound in a circular shape through a roller provided thereon, and moves the precoated film to the preprocessing unit 10.

The pretreatment unit 10 removes foreign substances on the surface of the film unwound from the first roller unit 11 with an alkaline solution. That is, the pretreatment unit 10 performs a pretreatment process using alkaline cleaning.

The first cleaner 20 rinses the alkaline solution on the surface of the film with distilled water.

The first drying unit 30 completely removes distilled water remaining on the surface of the film through an air knife to dry the film.

Thereafter, the first metal thin film forming unit 40 forms the first metal thin film on the completely dried film.

The second metal thin film forming unit 50 forms a second metal thin film on the film on which the first metal thin film is formed.

Next, the third metal thin film forming unit 60 forms a third metal thin film on the film having the first and second metal thin films formed thereon. The first metal thin film forming part 40, the second metal thin film forming part 50 and the third metal thin film forming part 60 are formed with different kinds of metal thin films. These metals may be selected from metals such as copper (Cu), indium (In), gallium (Ga) and the like.

For example, when the first metal thin film, the second metal thin film, and the third metal thin film are copper (Cu), indium (In), and gallium (Ga), the first metal thin film forming portion 40 is formed by chemical plating The second metal thin film forming part 50 forms a metal thin film of indium by a chemical plating process and the third metal thin film forming part 60 forms a metal thin film of gallium by a chemical plating process .

Here, after one metal thin film is formed in the first metal thin film forming part 40, the second metal thin film forming part 50 must be rinsed clean before forming the second metal thin film. To this end, the first to third metal thin film forming parts 40 to 60) are each rinsed after forming a metal thin film. That is, the first metal thin film forming unit 40, the second metal thin film forming unit 50, and the third metal thin film forming unit 60 sequentially form and clean the first to third metal thin films, respectively. The formation of the metal thin film and the cleaning may be performed successively in the order of the first to third metal thin film forming portions 40 to 60.

When all of the first to third metal thin films are formed, the second cleaner 70 cleans the surface of the film with distilled water.

The second drying unit 80 completely removes the distilled water remaining on the surface of the film through an air knife to dry the film.

The second roller portion 12 is wound in a circular shape through a roller provided with a film from which the distilled water has been completely removed.

On the other hand, the first to third metal thin film forming units 40 to 60 are all formed of the same plating apparatus, but differ only in the kind of metal to be plated.

Therefore, only one plating apparatus will be described below. Here, the multi-layer metal thin-film forming unit may include N (N is a natural number) metal thin-film forming units as needed.

FIG. 2 is a perspective view of a plating apparatus for forming a multi-layer metal thin film according to an embodiment of the present invention, and FIG. 3 is a sectional view of a plating apparatus according to an embodiment of the present invention.

A plating apparatus according to an embodiment of the present invention includes a stage 100, an out bath 200 disposed at an upper portion of the stage 100, and an inner bath 300 .

The stage 100 is fixed to a frame (not shown) of the plating apparatus, and the outbath 200 is elevated from the stage 100.

A base plate 400 is provided below the stage 100. And a fixing plate 410 is installed below the base plate 400. A first cylinder (Cylinder-1, 431) is installed below the fixing plate (410). As shown in FIG. 2, the fixing plate 410 is coupled to each other by the outbath 200 and the four support bars 420. Therefore, the fixing plate 410 and the outbath 200 can be raised and lowered simultaneously with respect to the base plate 400 (since the base plate is fixed in position).

4 is a view illustrating lifting and lowering of an outbath according to an embodiment of the present invention.

FIG. 4 illustrates the lifting and lowering of the outbee 200 according to an embodiment of the present invention. When the first cylinder 431 is driven, the fixing plate 410 and the outbath 200 can vertically move up and down. When the outbath 200 descends, it is coupled to the base plate 400. When the outbath 200 ascends, the base plate 400 is separated.

5 is a view showing the shape of an outbath and an inner bass according to an embodiment of the present invention.

An inner bath 300 is installed inside the outbath 200. 5 shows an outbass 200 and an inner bass 300 according to an embodiment of the present invention and shows the inner bass 300 ascending and descending from an outbass 200 according to an embodiment of the present invention. FIG. The outbath 200 according to an embodiment of the present invention has a through hole formed at an upper portion thereof, and an inner bass 300 is coupled to the through hole. The inner bass 300 is installed to be able to move up and down from the outbath 200. To this end, the inner bass 300 is lifted and lowered by the second cylinder 432 to the outbath 200.

The outbath 200 has a body 210 and a protrusion 220 of the outbath 200 formed at an upper end of the body 210. A second cylinder 220 is formed on the protrusion 220, 2, and 432 are installed. The inner bass 300 is composed of a lower portion 310 and an upper portion 320. The lower portion 310 is made of a metal material and the upper portion 320 is made of a transparent material such as glass so that an operator can see the inside. The lower portion 310 is formed with a protrusion 330 in the outward direction. The second cylinder 432 is coupled to the protrusion 330 and the inner bath 300 can be moved up and down by the second cylinder 432.

FIG. 6 is a view illustrating lifting and lowering of an inner bass from an outbath according to an embodiment of the present invention.

6, a curved anode 520 having a central portion 122 formed to be convex downward is provided on the inner upper side of the inner bass 300, and the outbath 200 and the inner bass 300 A cathode electrode 510 is provided. Here, the anode 520 is formed of a curved mesh. The cathode electrode 510 is in contact with both side edge regions of the film 101. A metal layer is formed on the upper surface of the film 101. When the film 101 and the anode 520 are immersed in the plating solution, the film 101 may be plated by application of power.

FIG. 7 shows a stage of a plating apparatus according to an embodiment of the present invention, and FIG. 8 shows a sectional view of a stage according to an embodiment of the present invention.

The stage 100 according to an embodiment of the present invention is configured to have a rectangular shape and having a rectangular outer side rest 110 and a rectangular inner side rest 120 provided inside the outer side rest 110 . A guide pin 130 installed at an edge portion between the outer seating base 110 and the inner seating base 120 may be coupled. The guide pin 130 is used when a glass rather than a film is used as an object to be plated. The guide pin 130 is detachable from the stage 100. A guide pin coupling groove (not shown) is provided in the stage 100 for coupling the guide pin 130. The guide pins 130 position the four corners of the glass to induce accurate seating of the glass. In the present invention, since the film 101 is used as a plated body, the guide pin 130 for seating the glass is removed.

The outer seating block 110 includes a flat portion 111 and a protrusion 111-1 on which the film 101 is seated. A rectangular space portion is formed in the plane portion 111. The rectangular seating space is provided with an inner seating base 120.

The projection portion 111-1 of the outer seating base 110 is provided only on the upper and lower portions of the plane portion 111. As shown in the figure, the projection portion 111-1 is formed on the upper and lower portions of the plane portion 111, -1) is formed.

The inner seating base 120 is installed in the space of the outer seating base 110. The inner seating part 120 includes an edge part 121 and a center part 122. The upper surface of the edge part 121 is formed at the same height as the upper surface of the outer seating rest 110. [ The center portion 122 is formed lower than the edge portion 121. As shown in the drawing, holes are formed in the central part 122 at regular intervals. The holes are for the flow of air. The holes are formed in order to facilitate the movement of the film 101 from the stage 100 after the film 101 is seated and the plating process is completed. Accordingly, the portion of the film 101, which contacts the upper portion of the stage 100, becomes the edge portion 121 and can be easily removed. If the lower surface of the film 101 and the inner mounting table 120 of the stage 100 are both in contact with each other, the coating solution or rinsing liquid, which may be between the film 101 and the inner mounting table 120 of the stage 100, It is not easily separated by the.

The plated body is seated on the upper surface of the edge portion 121 of the inner seating base 120.

In the drawing, the empty space 140 (drain) of the lower portion of the stage 100 shows a region where the plating chemical solution and the rinsing liquid collect after the treatment. The collected plating solution and rinsing liquid can be discharged or reused after purification.

9 shows a portion where the outbath 200 and the stage are coupled and a portion where the innerbath 300 and the stage are coupled.

Referring to the drawing, an O-ring 311 is provided at a lower end of the outbass 200. The outbath 200 and the flat surface portion 111 of the outer mounting seat 110 of the stage 100 are completely brought into close contact with each other by the O-ring 311 and the plating solution and the rinsing liquid are supplied to the outside of the outbath 200 It does not leak.

Also, an O-ring 311 is provided at a lower end of the inner bass 300. The inner bails 300 and the edge portions 121 of the inner seating base 120 of the stage 100 are completely brought into close contact with each other by the O- Here, if the film 101 is seated on the stage 100, the top edge of the film 101 is completely brought into close contact with the inner seat 120 by the O-ring 311. The plating solution and the rinse solution do not flow out to the outside of the inner bath 300.

FIG. 10 is a sectional view of a part of a plating apparatus according to an embodiment of the present invention, and FIGS. 11 and 12 show an anode and a cathode according to an embodiment of the present invention.

Referring to the drawing, the anode 520 is made of a mesh. The edge region of the anode 520 is formed higher than the central region and the central region of the anode 520 is formed lower. Here, the edge region of the anode 520 indicates a region where the film 101 is drawn into and out of the plating region of the plating apparatus. In other words, the anode 520 has a rounded shape bent downward. The cathode electrode (510) is configured to contact both side edges of the film (101).

Hereinafter, the plating process using the plating apparatus according to an embodiment of the present invention will be described with reference to FIGS. 13 and 14. FIG.

13 (a), after the outbath 200 and the inner bath 300 are lifted from the stage 100, the film 101 is placed on the stage 100 (Fig. 13 (b)). The film 101 is provided on the stage 100 in a roll-to-roll manner. After the outbath 200 and the inner bath 300 are lowered, the cathode electrode 510 is brought into close contact with the upper surface of the film 101 (FIG. 13 (c)). The film 101 may have a metal layer formed thereon for electrical current flow.

After the outbath 200 and the inner bath 300 are brought into close contact with the stage 100, the plating solution is filled in the inner bath 300 (Fig. 13 (d)). Subsequently, when the plating process is performed, the inner bath 300 is lifted as shown in FIG. 13 (e). When the inner bath 300 is raised, the plating chemical solution AA inside the inner bath 300 is discharged to the space between the inner bath 300 and the outbas 200.

Although the cathode electrode 510 is in close contact with the glass in FIG. 13, the cathode electrode 510 can be raised at the same time as the inner bath 300 is lifted up to protect the cathode electrode 510. Even if the inner bass 300 and the outbath 200 are raised, the film 101 is pulled to both sides by the roll-to-roll method, and thus the film 101 does not easily flow.

14 (f) and 14 (g), the inner bath 300 is lowered again, and the inner bath 300 is filled with the rinsing liquid. When the rinsing liquid is rinsed, the inner bath 300 is raised. The rinsing liquid BB in the inner bath 300 is discharged to the space between the inner bath 300 and the outbas 200. In this case,

When the plating process and the cleaning process are completed, as shown in Fig. 14 (i), both the outbath 200 and the inner bath 300 are raised to move the plated films 101 at regular intervals, Thereby performing a plating process.

The lifting and lowering of the outbath 200 is performed by a first cylinder 431 installed at a lower portion of the stage 100 and the lifting and lowering of the innerbath 300 is performed by a second cylinder 432 ).

Although the cathode electrode 510 is in close contact with the upper portion of the film 101 in the drawing, it can be raised at the same time as the inner bath 300 is lifted up to protect the cathode electrode 510.

There is an advantage that plating and cleaning can be performed in one inner bath 300 by lifting and lowering the outbath 200 and the innerbath 300 according to an embodiment of the present invention.

Hereinafter, a method of forming a multi-layer metal thin film performed by the multi-layer metal thin film forming apparatus according to an embodiment of the present invention will be described.

First, a process of loosening and moving through a film provided with a film of a metal layer wound in a circular shape is carried out.

Then, a process of removing foreign matter on the surface of the unwound film with an alkaline solution is performed. That is, a pretreatment process using alkaline liquid cleaning is performed.

Then, a step of washing the alkaline solution on the surface of the film with distilled water is carried out.

Then, the distilled water remaining on the surface of the film is completely removed through the air knife to dry the film.

Thereafter, a step of forming the first metal thin film on the completely dried film is performed.

Then, a process of forming a second metal thin film on a film having the first metal thin film is performed.

Next, a process of forming a third metal thin film on a film on which the first and second metal thin films are formed is performed. Here, the first metal thin film, the second metal thin film and the third metal thin film are formed of different kinds of metal thin films. For example, when the first metal thin film, the second metal thin film and the third metal thin film are copper (Cu), indium (In) or gallium (Ga), a process of forming a metal thin film of copper, And a process in which a metal thin film of gallium is formed are sequentially performed. Here, the first metal thin film forming step, the second metal thin film forming step, and the third metal thin film forming step sequentially perform formation and cleaning of the first to third metal thin films, respectively.

When all of the first to third metal thin films are formed in this way, a process of cleaning the surface of the film with distilled water is performed.

The distilled water remaining on the surface of the film is completely removed through the air knife, and the film is dried.

A process of winding the film in which the distilled water has been completely removed in a circular shape through a roller provided is performed to complete the method of forming a multilayered metal film for forming a multilayered metal film.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or essential characteristics thereof. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

11 and 12: First and second roller portions
10:
20 and 70: first and second taxi < RTI ID = 0.0 >
30 and 80: First and second drying units
40: First metal thin film forming part
50: second metal thin film forming part
60: Third metal thin film forming part
100: stage
110:
111:
111-1:
120: inner seat
121:
122:
130: Guide pin
200: Outbeth
210: Body
220: protrusion of outbath
300: Inner Beth
310: Lower part of the inner bass
320: upper part of inner bath
330: Inner boss protrusion
400: base plate
410: Fixed plate
420:
431 and 432: first and second cylinders
510: cathode electrode
520: anode

Claims (5)

A multi-layered metal thin film forming apparatus for forming a multi-layered metal thin film on a film having a metal layer formed thereon,
The multi-layer metal film forming apparatus includes: a first roller portion for unwinding the wound film; A pretreatment unit for removing foreign substances from the film; a first cleaning unit cleaning the surface of the film; A first drying section for drying the surface of the film; A first metal thin film forming unit for forming a first metal thin film on a film; A second metal thin film forming unit for forming a second metal thin film on the film; A third metal thin film forming unit for forming a third metal thin film on the film; A second cleaner for cleaning the surface of the film; A second drying section for drying the surface of the film; And a second roller portion for winding the film are continuously provided. The method according to claim 1,
Wherein the pretreatment unit removes the foreign substance with an alkaline solution. The method according to claim 1,
The first metal thin film forming part forms a copper (Cu) metal thin film by chemical plating,
The second metal thin film forming part forms an indium (In) metal thin film by a chemical plating process,
Wherein the third metal thin film forming unit forms a gallium metal thin film by a chemical plating process. The method according to claim 1,
Wherein the first to third metal thin film forming units sequentially perform formation and cleaning of a metal thin film. Removing foreign matters on the surface of the film having the metal layer formed thereon with an alkaline solution;
Washing the alkaline solution on the surface of the film with distilled water;
Removing the distilled water remaining on the surface of the film through an air knife to dry the film;
Forming a first metal thin film on the dried film;
Forming a second metal thin film on a film on which the first metal thin film is formed;
Forming a third metal thin film on a film on which the first and second metal thin films are formed;
Washing the surface of the film with distilled water; And
Removing the distilled water remaining on the surface of the film through an air knife to dry the film;
Lt; / RTI >

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