KR20180076337A - Composition for organic electronic device encapsulant and encapsulant manufactured by using the same - Google Patents

Abstract

A composition for an encapsulant according to an embodiment of the present invention comprises: (A) polyorganosiloxane comprising at least one alkenyl group; (B) polyorganohydrogensiloxane comprising at least one hydrogen group; (C) a platinum-based catalyst; and (D) an organic light scattering material. According to the present invention, users can produce an encapsulant which can effectively block oxygen and moisture from the outside and extend the lifetime of an organic electronic device using the composition.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for an organic electronic device encapsulant and a encapsulant formed using the same,

This application claims the benefit of Korean Patent Application No. 10-2016-0180105, filed on December 27, 2016, to the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for an organic electronic element encapsulant and an encapsulant formed using the same.

The organic EL element has a structure in which an organic light emitting medium layer is sandwiched between two electrode layers having at least one light transmitting property, and a self-light emitting ) Light emitting device. This organic EL element is expected as a flat panel display in place of a cathode ray tube or a liquid crystal display because it has advantages of a wide viewing angle, a fast response speed and low power consumption. The organic light emitting device includes a substrate, a first electrode layer, an organic layer including a light emitting layer, and a second electrode layer sequentially. The indium tin oxide (ITO) generally used as a transparent electrode layer in the structure of the organic light emitting device, the organic layer, and the substrate, which is typically a glass substrate, have refractive indices of about 2.0, 1.8, and 1.5, respectively. Due to the relationship of the refractive indexes, for example, light generated in the organic light emitting layer in the bottom emission type device is trapped by the total internal reflection phenomenon or the like at the interface between the organic layer and the first electrode layer, Only a very small amount of light is emitted.

As a method for solving such a problem, attempts have been made to insert a light scattering layer as a separate layer between the respective layers forming the organic EL element. For example, KR 2013-0108207 A discloses an organic light emitting device in which a base layer, a hole injecting electrode layer, an organic lamination structure, and a hole or electron injecting electrode layer are laminated in this order, Are separately formed and inserted. KR 2015-0055296 A, the material comprising the fluorine in the same, but to form a scattering layer on the overcoat layer, the scattering layer and LiF, CsF, BeF ₂ to an OLED display including a substrate, a thin film transistor, and an overcoat layer The OLED display device according to claim 1, In KR 2015-0069871 A, as a substance forming a scattering layer, at least one substituent of a benzoyl group, a carboxyl group, an aminophenoxyl group, a tricarbonate group, and a styryl group is added to a base material such as benzene, naphthalene, anthracene, Substituted < / RTI > compounds. On the other hand, KR 2014-0073611A discloses a method of depositing an organic material such as Alq ₃ by chemical vapor deposition to form a separate scattering layer having a nonuniform surface on a substrate.

Incidentally, since the light emitting medium layer of the organic EL device is composed of an organic material, it is likely to be deteriorated by the influence of moisture, oxygen, heat, or the like in the atmosphere. This deterioration attenuates the light-emitting performance of the organic EL device, so that the display characteristic is liable to be deteriorated. Therefore, in order to prevent the deterioration of the organic EL device, the upper part of the organic EL device formed on the glass substrate is covered with a glass substrate (glass cover), the inside is made into a hollow structure, and an adsorbing desiccant One structure has been adopted. A structure in which a hollow portion between two glass substrates is filled with an epoxy resin having low moisture permeability and the entire organic EL element is sealed is also proposed. However, in the structure in which the desiccant desiccant is disposed in the hollow portion in the glass cover, the deterioration of the organic EL device can not be sufficiently suppressed because the desorbing ability of the desiccant is insufficient. Further, in the method of filling the epoxy resin into the hollow portion and sealing, the deterioration of the organic EL element is liable to occur due to insufficient management of the moisture contained in the epoxy resin, and since the curing temperature of the epoxy resin is high, There is a problem that the organic EL element is deteriorated by heat.

Korean Patent Publication No. 10-2012-0001148

The present invention relates to a composition capable of improving the lifetime of an organic electronic device and capable of effectively producing an encapsulant capable of effectively blocking oxygen and moisture from the outside, and an encapsulating material using the composition, and at the same time, And it is an object of the present invention to provide an organic electronic device capable of avoiding damage to an electrode layer or an organic thin film layer (light emitting layer).

According to an embodiment of the present invention,

(A) a polyorganosiloxane containing at least one alkenyl group,

(B) a polyorganohydrogensiloxane containing at least one hydrogen group,

(C) a platinum-based catalyst, and

(D) Organic light scattering material

The composition for an encapsulant.

Another embodiment of the present invention provides an encapsulation material formed using the composition for encapsulation.

Further, another embodiment of the present invention provides an organic electronic device including the sealing material.

The composition for an encapsulant according to one embodiment of the present invention may be an addition curing silicone composition capable of curing at a low temperature of 100 ° C or lower. In addition, since the moisture content (ratio) of the composition for encapsulant is adjusted to be as low as 400 ppm or less, deterioration of the organic electronic device due to moisture contained in the sealing material itself and deterioration of the organic electronic device due to heating during curing of the sealing layer are prevented can do.

Thus, by using the composition for a sealing material, it is possible to form an excellent sealing material which does not cause peeling and does not cause cracking due to a temperature change, and can obtain an organic electronic device excellent in light- can do. In addition, since the composition for a sealing material has a light scattering property by mixing an organic light scattering material, the light extraction efficiency of the organic electronic device can be maximized.

The present application will be described in detail below.

(A) a polyorganosiloxane containing at least one alkenyl group, (B) a polyorganohydrogensiloxane containing at least one hydrogen group, (C) a polyorganosiloxane having at least one hydroxyl group, A platinum-based catalyst, and (D) an organic light scattering material.

In one embodiment of the present invention, the composition for encapsulating material is liquid at normal temperature, has a curing temperature of 100 캜 or less, and has a water content of 400 ppm or less.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a composition for an encapsulating material of an organic electronic device and an organic electronic device according to embodiments will be described in detail.

[Component (A)] [

The component (A) is a base polymer of the addition reaction curable silicone composition and has an alkenyl group bonded to an average of at least 0.5 silicon atoms in one molecule for sufficiently curing the resulting composition. Preferably an alkenyl group bonded to an average of at least 0.6 silicon atoms in one molecule, more preferably at least two silicon atoms in one molecule. As the silicon atom-bonded alkenyl group, for example, a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group and the like are exemplified, preferably a vinyl group. The alkenyl group may be either bonded to the silicon atom at the molecular chain end or bonded to the silicon atom in the molecular chain or may be bonded to the silicon atom in the molecular chain. However, from the viewpoints of the curing rate of the obtained composition and physical properties after curing, , Particularly preferably bonded to silicon atoms at both ends of the molecular chain.

Examples of the silicon atom-bonded organic group other than the alkenyl group of the component (A) include alkyl groups such as methyl group, ethyl group and propyl group, cycloalkyl groups such as cyclopentyl group and cyclohexyl group, phenyl group, tolyl group, Or a halogenated hydrocarbon group in which a hydrogen atom thereof is partially substituted with a chlorine atom, a fluorine atom or the like, and usually has about 1 to 12 carbon atoms, preferably about 1 to 8 carbon atoms . The silicon atom-bonded organic group is preferably an alkyl group or an aryl group, more preferably a methyl group or a phenyl group.

The molecular structure of the component (A) is not particularly limited, and examples thereof include linear, cyclic, and branched chains. It is preferable to use a straight chain in view of the mechanical strength of the cured product. The component (A) may be used singly or in combination of two or more.

The viscosity of the component (A) at 23 DEG C is 10 to 1,000,000 mPas, preferably 100 to 1,000,000 mPas. If the viscosity is less than 10 mPas, the mechanical strength after curing tends to lower. On the other hand, if the viscosity exceeds 1,000,000 mPas, the workability of the resultant composition tends to deteriorate.

The component (A) may include at least one compound represented by the following general formula (1), but is not limited thereto.

[Chemical Formula 1]

In Formula 1,

At least one of R ₁ to R ₆ is an alkenyl group,

An epoxy group, an acrylate group, a methacrylate group, an epoxide group, a carboxyl group, a vinyl group, an acrylate group, a methacrylate group, an epoxide group, May be selected from the group consisting of a cyclic ether group, a sulfide group, an acetal group, a lactone group and an amide group,

a, b, c, and d are independently 0 to 1 real numbers, and (a + b + c + d)

[Component (B)] [

The polyorganohydrogensiloxane as the component (B) is a crosslinking agent of the component (A) and has hydrogen atoms (SiH groups) bonded to two or more, preferably three or more, silicon atoms in one molecule. This SiH group may be located at the molecular chain terminal, the molecular chain middle portion, or both.

The component (B) may include at least one compound represented by the following general formula (2), but is not limited thereto.

(2)

In Formula 2,

At least one of R ₁ to R ₆ is a hydrogen group,

An epoxy group, an acrylate group, a methacrylate group, an epoxide group, a carboxyl group, a vinyl group, an acrylate group, a methacrylate group, an epoxide group, May be selected from the group consisting of a cyclic ether group, a sulfide group, an acetal group, a lactone group and an amide group,

a, b, c, and d are independently 0 to 1 real numbers, and (a + b + c + d)

The component (B) may also include a compound represented by the following general formula (3).

(3)

In Formula 3,

R is a substituted or unsubstituted monovalent hydrocarbon group, which is the same or different, except for an aliphatic unsaturated bond. Examples of R include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, hexyl, cyclohexyl and octyl; Aryl groups such as phenyl and tolyl; An aralkyl group such as a benzyl group or a phenylethyl group; And those in which some or all of the hydrogen atoms of these groups are substituted with a halogen atom such as fluorine, chlorine, bromine or the like or a cyano group, for example, a chloromethyl group, a bromoethyl group, a trifluoropropyl group or a cyanoethyl group Having 1 to 12 carbon atoms. Among them, an alkyl group having 1 to 4 carbon atoms such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group and an isobutyl group is preferable in terms of ease of synthesis and cost, S and t are integers satisfying 0.5? S? 2.2, 0? T? 2, 0.5 <s + t? 3, preferably 0.6? S? 2.0, 0.01? T? s + t? 2.8.

The molecular structure of the component (B) may be any of linear, branched, annular, or three-dimensional mesh shapes. The viscosity of the component (B) at 23 캜 is 5,000 mPas or less, preferably 1 to 1,000 mPas.

Examples of the component (B) include 1,1,3,3-tetramethyl-1,3-dihydrogen siloxane, methylhydrogen cyclic polysiloxane, methylhydrogen siloxane-dimethylsiloxane cyclic copolymer, Blocked methylhydrogenpolysiloxane, blocked trimethylsiloxy-blocked dimethylsiloxane-methylhydrogenpolysiloxane copolymer, capped terminal dimethylhydrogensiloxy blocked dimethylsiloxane, capped terminal dimethylhydrogensiloxy blocked dimethylsiloxane-methylhydrogenosiloxane copolymer Terminated trimethylsiloxy-terminated methylhydrogensiloxane-diphenylsiloxane copolymers, both terminal trimethylsiloxy-terminated methylhydrogensiloxane-diphenylsiloxane-dimethylsiloxane copolymers, both terminal dimethylhydrogensiloxy-terminated methylhydrogen- diphenylsiloxane-dimethylsiloxane _{copolymer, (CH 3) 2 HSiO 1} /2 units and SiO _4/2 There may be mentioned _{copolymers, (CH 3) 2 HSiO 1} /2 units and SiO _4/2 units and (C ₆ H ₅₎ SiO copolymer consisting of _3/2 units such as the unit consisting of.

The amount of the component (B) to be added is such that the amount of the hydrogen atom (SiH group) bonded to the silicon atom of the component (B) is 0.2 to 5, preferably 0.5 to 3, relative to one alkenyl group of the component (A) to be. When the SiH group of the component (B) is less than 0.2, sufficient crosslinking is not obtained. On the other hand, when the number exceeds 5, unreacted SiH groups remain and the physical properties of the cured product are likely to become unstable.

[Component (C)] [

As the platinum catalyst as the component (C), a known platinum catalyst used in the hydrosilylation reaction can be used. Examples thereof include platinum black, platinum chloride, chloroplatinic acid, a reaction product of chloroplatinic acid with a monohydric alcohol, a complex of chloroplatinic acid with an olefin or a vinyl siloxane, and platinum bisacetoacetate. The blending amount of the component (C) can be appropriately adjusted in accordance with the desired curing rate and the like. Is usually from 0.1 to 1,000 ppm, preferably from 0.5 to 500 ppm in terms of platinum element based on the total amount of the composition.

[Component (D)] [

The organic light scattering material as the component (D) is, for example, a polystyrene resin or a derivative thereof; An acrylic resin or a derivative thereof; Silicone resins or derivatives thereof; And an organic material bead having at least one selected from the group consisting of a novolak resin or a derivative thereof. Most preferably, the organic light scattering material uses a bead formed of a polystyrene / polymethyl methacrylate copolymer resin. Preferably, the maximum particle diameter of the organic light scattering material beads is 2 탆 or less. The control over the maximum particle size is for improving the surface uniformity of the substrate including it. On the other hand, the organic light scattering material preferably has a moisture content of 100 ppm or less and a volatile content of 0.2% or less.

Preferably, the refractive index nf of the organic light scattering material is 1.5 or more, and when the mixture of the polyorganosiloxane and the polyorganohydrogensiloxane is a matrix resin, the refractive index nf of the organic light scattering material and the refractive index The refractive index (nr) ratio is nf / nr = 1.0 to 1.5 at a wavelength of 400 nm.

The content of the light scattering material is 1 to 30 parts by weight, preferably 5 to 20 parts by weight, based on 100 parts by weight of the matrix resin. When the content of the light scattering material is less than 1 part by weight, the light scattering effect is not sufficient. When the amount of the light scattering material is more than 30 parts by weight, it is difficult to uniformly form the transparent electrode layer to be laminated thereon. Generally, the weight of the beads relative to the total amount of the composition is 0.1 to 30 wt%, preferably 1 to 25 wt%.

[Other optional ingredients]

The addition reaction curable silicone composition at room temperature, which is a composition for an encapsulating material of the embodiment, contains the above components (A) to (D) as basic components and optionally contains optional filler, reaction inhibitor, A heat resistance improving agent, an adhesion imparting agent, a roughening imparting agent, a pigment, a plasticizer and the like may be added within the range not impairing the object of the present invention. Examples of the filler include silica and titanium oxide. The amount of the filler to be added is not particularly limited so long as it keeps good workability and does not impair the properties of the cured product, and is preferably 1 to 50 parts by weight per 100 parts by weight of the component (A). Examples of the reaction inhibitor include acetylenic alcohols such as 3,5-dimethyl-1-hexyn-3-ol, 2-methyl-3-hexyn- Methyl-3-pentene-1-phosphorene, 3,5-dimethyl-3-hexene-1-phosphorene, etc., or methylvinylsiloxane cyclic compounds, organic chiral compounds and organic phosphorus compounds. The amount of the reaction inhibitor to be added is not particularly limited so long as the curing reactivity and storage stability are kept good and the properties of the cured product are not impaired. The amount is preferably 0.001 to 1 part by weight per 100 parts by weight of the component (A).

[Composition for encapsulating material and method for producing the same]

In order to produce the composition for an encapsulating material of the embodiment, the polyorganohydrogensiloxane (B) (crosslinking agent) is added to the alkenyl group-containing polyorganosiloxane as the component (A), the polyorganohydrogensiloxane (C) (D) an organic light scattering material is further added thereto, and the mixture is kneaded at room temperature or optionally heated (for example, at 80 to 200 ° C) with a known kneader. As the kneader, a well-known apparatus equipped with a heating means and a cooling means can be used.

The method of dispersing the organic light scattering material in the resin is not particularly limited and methods such as ultrasonic dispersion, a ball mill, a roll mill, a Clare mix, a homogenizer, a bead mill and a media dispersing machine can be used. A ball mill, a roll mill, a homogenizer, and a bead mill are preferably used. For redispersion of organic light scattering, for example, surface treatment of an organic light scattering material, addition of a dispersant, addition of a surfactant, addition of a solvent and the like may be carried out in order to improve dispersibility. Examples of the surface treatment of the organic light scattering material include rosin treatment, acid treatment, basic treatment, and the like, besides treatment with various coupling agents such as silane, titanium, and aluminum, fatty acid, and phosphoric acid ester. A wetting agent such as a nonionic, cationic, anionic surfactant, a polycarboxylic acid, an amphipathic substance, a resin having a substituent for a high steric hindrance, etc. may be further added.

The composition for a sealing material of the embodiment thus obtained has a curing temperature of room temperature (usually 23 ° C) or more and 100 ° C or less. Also, the moisture content (ratio) in the composition for the encapsulating material is adjusted to be 400 ppm or less. When the curing temperature of the composition is lower than room temperature, it takes time until curing, resulting in poor workability. When the curing temperature is higher than 100 ° C, the organic light emitting element tends to deteriorate due to heat at the time of heat curing, and there is a high possibility that the effective pixel area of the organic electronic element is lowered. When the water content (ratio) exceeds 400 ppm, there is a high possibility that the organic electronic device is deteriorated by moisture generated in the composition used as the sealing material, which is not preferable.

In order to adjust the water content in the composition to the above range, a method of heating at least one of the component (A) and the component (B) while adjusting the temperature and the time may be adopted before compounding and kneading. Particularly, it is preferable to adopt a method of heating the component (A) under a reduced pressure. That is, it is preferable to adjust the water content in the composition to 400 ppm or less by heating the component (A) under reduced pressure as needed and evaporating and volatilizing the moisture in the component (A). Further, it is also possible to knead the component (A) subjected to the heat treatment with the other component, and then add water to the obtained composition, as long as the moisture content in the finally obtained composition can be controlled to 400 ppm or less. In addition, the sealing composition of the embodiment preferably has a viscosity at 23 캜 of 10 to 1,000,000 mPas.

[Cured product of composition for encapsulating material]

The composition for a sealing material of the embodiment of the present invention can be cured by heating at a temperature of 100 DEG C or less for 5 to 120 minutes (for example, at 80 DEG C for 60 minutes). (100 DEG C or less) of the organic electronic device (organic EL device), so that it can be suitably used as an encapsulating material for sealing the organic EL device. The molding of the composition, the curing method, the curing condition, and the like can be performed by known methods and conditions.

Hereinafter, the present invention will be described in more detail by way of examples. However, the following embodiments are intended to illustrate the present disclosure and are not intended to limit the present disclosure.

< Example >

< Example  1>

First, (A) 100 parts by weight of a polydimethylsiloxane having a viscosity of 3,000 mPas at 23 DEG C and containing both ends of the molecular chain blocked with dimethylvinylsiloxy groups was subjected to heat treatment at a temperature of 150 DEG C for 2 hours while reducing the pressure to 10 mmHg. To 100 parts by weight of the polydimethylsiloxane after the heat treatment, 1.5 parts by weight of polymethylhydrogen siloxane having a hydroxyl group in a proportion of 50 mol% in the side chain (B) (the number of hydrogen groups in one molecule was about 20) (H / Vi ratio) of the hydrogen group of the component (B) to the vinyl group of the component (A) is 1.5), 10 ppm (platinum amount) of the vinyl siloxane complex compound of the chloroplatinic acid and 1-ethynyl- And 0.05 part by weight of 1-cyclohexanol were added and uniformly kneaded at room temperature. 10 parts by weight of (D) Sekisui's organic bead (XX-3224Z) were well mixed and dispersed using a 3-roll-mill to prepare a light scattering seal composition &Lt; / RTI &gt;

< Example  2>

A composition was prepared in the same manner as in Example 1 except that the amount of the organic beads used in Example 1 was changed to 25 parts by weight

Thus, the silicone compositions of Examples 1 and 2 were obtained.

< Comparative Example  1>

A composition was prepared in the same manner as in Example 1, except that the organic beads were not mixed.

< Comparative Example  2>

A composition was prepared in the same manner as in Example 1 except that the light-scattering beads of Example 1 were Aluminum Beads (AA-1) of Sumitomo Corporation.

< Comparative Example  3>

The moisture content of the composition of Example 1 was increased by adding 5,000 ppm of water.

< Comparative Example  4>

A composition was prepared in the same manner as in Example 1, except that the silicone resin (A) of Example 1 was changed to an epoxy resin (EH1600-G2 of Inata Kogyo Co., Ltd.).

The organic EL devices were sealed using the silicone compositions obtained in Examples 1 to 2 and Comparative Examples 1 to 4. First, an organic EL device was produced. That is, a pattern of an ITO film (thickness: 150 nm) as a first electrode layer was formed on a glass substrate by sputtering, and then a mixture (thickness: 20 nm) of poly (3,4-ethylenedioxythiophene) and polystyrene sulfonic acid (MEHPPV) (thickness: 100 nm) was formed on the light-emitting layer by spin coating, and the hole transport layer And unnecessary portions were removed using methanol and toluene as the light emitting layer to form a pattern of the organic light emitting medium layer. Subsequently, a Ca film (thickness: 5 nm) and an Al film (thickness: 150 nm) were formed as a second electrode layer by a vapor deposition method. Further, a silicon nitride film (500 nm) was formed as a barrier layer (protective layer) by the plasma CVD method. Subsequently, the silicone compositions obtained in Examples 1 and 2 and Comparative Examples 1 to 4 were applied onto the thus obtained organic EL device, respectively, and a glass cover was attached thereon. The effective pixel area and the light efficiency of the organic EL device were analyzed by using the optical equipment in the thus fabricated organic EL panel. Further, a long-term test was carried out at 85 캜 for 500 hours to analyze the effective pixel area after the long-term test.

The compositions obtained in Examples 1 to 2 and Comparative Examples 1 to 4 were coated on a glass to a thickness of 20 μm using an applicator, and then cured at 100 ° C. for 1 hour. Thereafter, a haze guard device (ASTM D1004). Transmittance and haze were analyzed. A sample was sent to SGS and the out-gas value was obtained from Agilent's GC / MS (EPA5021, 8260). The water content was analyzed using a Karl Fischer instrument from Mitsubishi (E1064).

The results of these measurements are shown in Table 1 below.

[Table 1]

As described above, in the organic EL panel having the sealing layer formed using the silicone composition obtained in Examples 1 and 2, the effective pixel area of the organic EL device did not decrease even after the long-term test, 55% to 60% increase.

On the contrary, in the organic EL panel having the sealing layer formed using the silicon and epoxy compositions obtained in Comparative Examples 1 to 4, the pixel area was not reduced in the Comparative Example 1, but the light efficiency was not increased. In the composition of Comparative Example 2, the light transmittance value of the light scattering bead was low, and even though the light scattering characteristic was exhibited, the efficiency was lowered and the effect of increasing the light efficiency could not be found. In the organic EL panel having the sealing layer formed using the epoxy resin of the comparative example 4, the composition of the comparative example 3 caused a decrease in the effective pixel area after the long-term test due to the influence of the contained moisture, The effective pixel area of the organic EL device was significantly lowered by heating, and cracks partially occurred after the long-term test, and the effective pixel area was reduced, and the light efficiency analysis could not proceed.

As described above, the composition for an encapsulant according to one embodiment of the present invention may be an addition curing silicone composition capable of curing at a low temperature of 100 ° C or lower. In addition, since the moisture content (ratio) of the composition for encapsulant is adjusted to be as low as 400 ppm or less, deterioration of the organic electronic device due to moisture contained in the sealing material itself and deterioration of the organic electronic device due to heating during curing of the sealing layer are prevented can do.

Thus, by using the composition for a sealing material, it is possible to form an excellent sealing material which does not cause peeling and does not cause cracking due to a temperature change, and can obtain an organic electronic device excellent in light- can do. In addition, since the composition for a sealing material has a light scattering property by mixing an organic light scattering material, the light extraction efficiency of the organic electronic device can be maximized.

Claims (11)

(A) a polyorganosiloxane containing at least one alkenyl group,
(B) a polyorganohydrogensiloxane containing at least one hydrogen group,
(C) a platinum-based catalyst, and
(D) Organic light scattering material
&Lt; / RTI &gt; The composition for encapsulant according to claim 1, wherein the composition for encapsulating material is liquid at normal temperature, has a curing temperature of 100 캜 or less, and has a moisture content of 400 ppm or less. The polyorganosiloxane composition according to claim 1, wherein the content of the polyorganohydrogensiloxane is such that the number of hydrogen groups bonded to silicon atoms of the polyorganohydrogensiloxane is 0.2 to 5 per one alkenyl group of the polyorganosiloxane / RTI &gt; The sealant composition according to claim 1, wherein the polyorganosiloxane comprises at least one compound represented by the following formula (1):
[Chemical Formula 1]

In Formula 1,
At least one of R ₁ to R ₆ is an alkenyl group,
An epoxy group, an acrylate group, a methacrylate group, an epoxide group, a carboxyl group, a vinyl group, an acrylate group, a methacrylate group, an epoxide group, May be selected from the group consisting of a cyclic ether group, a sulfide group, an acetal group, a lactone group and an amide group,
a, b, c, and d are independently 0 to 1 real numbers, and (a + b + c + d) The sealant composition according to claim 1, wherein the polyorganohydrogensiloxane comprises at least one compound represented by the following formula (2):
(2)

In Formula 2,
At least one of R ₁ to R ₆ is a hydrogen group,
An epoxy group, an acrylate group, a methacrylate group, an epoxide group, a carboxyl group, a vinyl group, an acrylate group, a methacrylate group, an epoxide group, May be selected from the group consisting of a cyclic ether group, a sulfide group, an acetal group, a lactone group and an amide group,
a, b, c, and d are independently 0 to 1 real numbers, and (a + b + c + d) The sealant composition according to claim 1, wherein the organic light scattering material comprises a bead formed of a polystyrene / polymethyl methacrylate copolymer resin. 7. The composition for a sealant according to claim 6, wherein the maximum particle diameter of the beads is 2 mu m or less. The organic light scattering material according to claim 1, wherein the refractive index (nf) of the organic light scattering material is 1.5 or more,
When the mixture of the polyorganosiloxane and the polyorganohydrogensiloxane is referred to as a matrix resin, the refractive index (nf) of the organic light scattering material and the refractive index (nr) of the matrix resin satisfy nf / nr = 1.0 to 1.5. [Claim 9] The composition according to claim 8, wherein the content of the organic light scattering agent is 1 to 30 parts by weight based on 100 parts by weight of the matrix. An encapsulating material formed by using the composition for encapsulating material according to any one of claims 1 to 9. An organic electronic device comprising the encapsulant of claim 10.