KR20180059861A - Moving device, exposure device, manufacturing method of flat panel display, device manufacturing method, and moving method of object - Google Patents

Abstract

The substrate stage device 20 for moving the substrate P includes a noncontact holder 32 for supporting the substrate P in a noncontact manner, a first driving part for moving the noncontacting holder 32, A scale plate 46 and a Y head 78y and one of the scale plate 46 and the Y head 78y is formed in the noncontact holder 32, A first measuring section formed between the scale plate 82 and the non-contact holder 32 and the other of the Y head 78 and the Y head 78y for measuring the positional information of the Y head 78y, And a position measuring system for obtaining positional information of the non-contact holder 32 on the basis of the positional information measured by the first and second measuring units do.

Description

Moving device, exposure device, manufacturing method of flat panel display, device manufacturing method, and moving method of object

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a moving body apparatus, an exposure apparatus, a method of manufacturing a flat panel display, a device manufacturing method, and a moving method of an object, and more particularly, to a moving body apparatus and a moving method, An exposure apparatus, a flat panel display using an exposure apparatus, or a manufacturing method of a device.

Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display devices and semiconductor devices (integrated circuits) and the like, a mask or a reticle (hereinafter collectively referred to as a "mask"), a glass plate, Scan type exposure apparatus in which a pattern formed on a mask is transferred onto a substrate using an energy beam while synchronously moving a substrate (hereinafter, referred to as a " substrate "Quot;) is used.

An exposure apparatus of this type is known to include an optical interferometer system that obtains position information in a horizontal plane of a substrate to be exposed using a bar mirror (a long mirror) of the substrate stage apparatus (for example, , See Patent Document 1).

Here, when the position information of the substrate is obtained by using the optical interferometer system, the influence of so-called air blur can not be ignored.

U.S. Patent Application Publication No. 2010/0266961

According to a first aspect of the present invention, there is provided an apparatus for controlling an object, comprising: a support for supporting an object in a non-contact manner; a holding unit for holding the object not supported by the support in a non-contact manner; A reference member serving as a reference for movement of the holding unit in the first and second directions, a first lattice unit having a measurement component in the first direction, and a second lattice unit arranged to face the first lattice unit And a first head for irradiating a measurement beam to the first grating portion, wherein one of the first grating portion and the first head is formed in the holding portion, and the first grating portion and the first head A first measuring portion formed between the reference member and the holding portion and measuring the position information of the first head by the first head and the first grating member; Head Position information of the holding unit holding the object in the first and second directions based on the positional information measured by the first and second measuring units, There is provided a moving body apparatus having a position measuring system to be obtained.

According to a second aspect of the present invention, there is provided an exposure apparatus comprising a moving body apparatus according to the first aspect and a pattern forming apparatus for forming a predetermined pattern on the object using an energy beam.

According to a third aspect of the present invention, there is provided a method of manufacturing a flat panel display, comprising: exposing the object using the exposure apparatus according to the second aspect; and developing the exposed object.

According to a fourth aspect of the present invention, there is provided a device manufacturing method comprising: exposing an object using an exposure apparatus according to the second aspect; and developing the exposed object.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: providing a noncontact support of an object by a support; holding the object not supported by the support by the retainer; and holding the retainer in first and second directions A first grating portion having a measurement component in the first direction and a second grating portion arranged to face the first grating portion, Wherein one of the first lattice portion and the first head is formed in the holding portion, the other of the first lattice portion and the first head moves in the first and second directions of the holding portion, Measuring the positional information of the first head using the first head and the first lattice member by a first measuring section formed between the reference member and the holding section as a reference of the first head and the first lattice member, And a second measuring unit for measuring positional information of the other of the first and second heads based on positional information measured by the first measuring unit and the second measuring unit in the first and second directions, And obtaining the position information of the holding unit that holds the object.

1 is a view schematically showing a configuration of a liquid crystal exposure apparatus according to the first embodiment.
2 is a sectional view taken along the line AA in Fig.
Fig. 3 is a view showing the details of the substrate stage apparatus provided in the liquid crystal exposure apparatus shown in Fig. 1. Fig.
4 is an enlarged view of a main part of the substrate stage apparatus.
5 is a conceptual diagram of a substrate position measuring system provided in the liquid crystal exposure apparatus shown in Fig.
Fig. 6 is a block diagram showing the input / output relationship of the main controller that constitutes the control system of the liquid crystal exposure apparatus.
7 is a view for explaining the operation (step operation in the -Y direction) of the substrate stage device.
Figs. 8A and 8B are drawings (respectively a plan view and a front view) for explaining the operation (1) of the substrate stage apparatus in the exposure operation.
Figs. 9A and 9B are views (a plan view and a front view, respectively) for explaining the operation (No. 2) of the substrate stage device in the exposure operation.
Figs. 10A and 10B are drawings (respectively a plan view and a front view) for explaining the operation (No. 3) of the substrate stage device in the exposure operation.
11 is a conceptual diagram of a substrate position measuring system according to the second embodiment.
Figs. 12 (a) and 12 (b) are diagrams (sectional views and plan views, respectively) showing the substrate stage device according to the third embodiment.

&Quot; First embodiment "

Hereinafter, the first embodiment will be described using Figs. 1 to 10 (b).

Fig. 1 schematically shows the structure of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 is a liquid crystal exposure apparatus in which a rectangular glass substrate P (hereinafter, simply referred to as a substrate P) used for a liquid crystal display (flat panel display) And a so-called " scanner "

The liquid crystal exposure apparatus 10 includes a mask stage 14 for holding an illumination system 12, a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, an apparatus main body 18, A substrate stage device 20 for holding a substrate P coated with a resist (sensitizer) on a surface facing the + Z side, and a control system thereof. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned relative to the projection optical system 16 in the exposure is referred to as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is referred to as the Y- And a direction orthogonal to the Y-axis is defined as a Z-axis direction. The rotation directions of the X-axis, Y-axis, and Z-axis rotations are described as? X,? Y, and? Z directions, respectively.

The illumination system 12 is constructed in the same manner as the illumination system disclosed in, for example, U.S. Patent No. 5,729,331. That is, the illumination system 12 irradiates light emitted from a light source (not shown) (for example, a mercury lamp) through a reflector, a dichroic mirror, a shutter, a wavelength selection filter, And irradiates the mask M as illumination light (illumination light) IL. As the illumination light IL, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm) ) Is used.

The mask stage 14 holds a mask M of a light transmission type. The main controller 50 (see Fig. 6) is configured to move the mask stage 14 (i.e., the mask M) through the mask stage driving system 52 (see Fig. 6) including, for example, 12) (illumination light IL) with a predetermined long stroke in the X-axis direction (scanning direction) and fine-motion in the Y-axis direction and the? Z direction. Position information in the horizontal plane of the mask stage 14 is obtained by a mask stage position measuring system 54 (see FIG. 6) including, for example, a laser interferometer.

The projection optical system 16 is disposed below the mask stage 14. The projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as that of the projection optical system disclosed in, for example, U.S. Patent No. 6,552,775. For example, And includes a plurality of centric optical systems. The optical axis AX of the illumination light IL projected from the projection optical system 16 onto the substrate P is parallel to the Z axis.

In the liquid crystal exposure apparatus 10, when the mask M positioned in a predetermined illumination area is illuminated by the illumination light IL from the illumination system 12, the illumination light IL passing through the mask M is projected A projection image (partial pattern image) of a pattern of the mask M in the illumination area is formed in the exposure area on the substrate P through the optical system 16. The substrate M is moved relative to the illumination area (illumination light IL) in the scanning direction and the substrate P is moved in the scanning direction with respect to the exposure area (illumination light IL) P is performed, and a pattern (entire pattern corresponding to the scanning range of the mask M) formed on the mask M is transferred to the shot area. Here, the illumination region on the mask M and the exposure region (illumination region of the illumination light) on the substrate P are optically conjugated with each other by the projection optical system 16.

The apparatus main body 18 is a portion for supporting the mask stage 14 and the projection optical system 16 and is provided on the floor F of the clean room through a plurality of dustproof devices 18. [ The apparatus main body 18 is constructed in the same manner as the apparatus main body disclosed in, for example, United States Patent Application Publication No. 2008/0030702, and an upper portion supporting the projection optical system 16 (Also referred to as an optical surface plate or the like), a pair of lower portions 18b (see Fig. 2, one of which is not shown because the ground surface is overlapped in the direction of Fig. 1 in Fig. 1) And has a middle portion 18c.

The substrate stage device 20 is a part for precisely positioning the substrate P with respect to the projection optical system 16 (illumination light IL) and has a horizontal plane (X axis direction and Y axis direction) Then, it is driven with a predetermined long stroke and is slightly driven in the six degrees of freedom direction. The substrate stage device 20 includes a base frame 22, a rough motion stage 24, a weight canceling device 26, an X guide bar 28, a substrate table 30, a noncontact holder 32, A pair of sub-tables 34, a substrate carrier 40, and the like.

The base frame 22 is provided with a pair of X beams 22a. The X-beam 22a is made of a member having a YZ cross-sectional rectangle extending in the X-axis direction. The pair of X beams 22a are arranged at predetermined intervals in the Y axis direction and are separated from the apparatus main body 18 through vibrating legs 22b As shown in Fig. The pair of X beams 22a and the leg portions 22b are integrally connected by a connecting member 22c.

The coarse movement stage 24 is a portion for driving the substrate P in the X axis direction by a long stroke and has a pair of X carriages 24a corresponding to the pair of X beams 22a . The X carriage 24a is formed in an inverted L shape in YZ cross section and mounted on a corresponding X beam 22a through a plurality of mechanical linear guide devices 24c.

Each pair of X carriages 24a is driven by a main controller 50 (see Fig. 6) through an X linear actuator which is a part of a substrate table driving system 56 (see Fig. 6) for driving the substrate table 30 , And are synchronously driven along a corresponding X-beam 22a in a predetermined long stroke (about 1 to 1.5 times the length of the substrate P in the X-axis direction) in the X-axis direction. In Fig. 2, for example, the mover of the X carriage 24a and the stator of the corresponding X beam 22a are arranged in the X- But the present invention is not limited thereto. For example, a feed screw (ball screw) device or the like may be used.

2, the coarse movement stage 24 has a pair of Y stators 62a. The Y stator 62a is composed of a member extending in the Y-axis direction (see Fig. 1). The Y stator 62a on the one side is located in the vicinity of the end on the + X side of the coarse movement stage 24 and the other Y stator 62a is located in the vicinity of the end on the -X side of the coarse movement stage 24 (See Fig. 1) on a pair of X carriages 24a, respectively. The function of the Y stator 62a will be described later.

The weight canceling device 26 is inserted between a pair of X carriages 24a of the coarse movement stage 24 and controls the weight of the system including the substrate table 30 and the noncontact holder 32 From below. Details of the weight canceling device 26 are disclosed in, for example, U.S. Patent Application Publication No. 2010/0018950, and a description thereof will be omitted. The weight canceling device 26 is mechanically connected to the coarse movement stage 24 through a plurality of connecting devices 26a (also referred to as flexure devices) extending radially from the weight canceling device 26 And moves in the X-axis direction integrally with the coarse movement stage 24 by being pulled by the coarse movement stage 24. The weight canceling device 26 is connected to the coarse movement stage 24 via the connection device 26a extending radially from the weight canceling device 26. Since the weight canceling device 26 moves only in the X axis direction, May be connected to the coarse movement stage (24) by a connection device (26a) extending in the direction of the coarse movement.

The X guide bar 28 serves as a base plate when the weight canceling device 26 moves. 1, the X guide bar 28 is inserted between a pair of X beams 22a of the base frame 22, and is inserted into the apparatus main assembly 18 Are fixed on the leg portion 18b. With respect to the Y axis direction, the center of the X guide bar 28 substantially coincides with the center of the exposure area formed on the substrate P by the illumination light IL. The upper surface of the X guide bar 28 is set parallel to the XY plane (horizontal plane). The weight canceling device 26 is placed on the X guide bar 28 in a noncontact state via, for example, an air bearing 26b. When the coarse movement stage 24 moves in the X axis direction on the base frame 22, the weight canceling device 26 moves on the X guide bar 28 in the X axis direction.

The substrate table 30 is made of a rectangular plate-shaped (or box-like) member having a longitudinal direction in the X-axis direction as viewed in a plan view. The central portion of the substrate table 30 is supported by XY Contacted from below to the weight canceling device 26 in such a state that it can freely swing with respect to the plane. 1, a pair of sub-tables 34 (not shown in Fig. 2) are connected to the substrate table 30. As shown in Fig. Functions of the pair of auxiliary tables 34 will be described later.

2, the substrate table 30 is a part of the substrate table driving system 56 (see Fig. 6), and includes a plurality of coils including a stator of the coarse stage 24 and a movable element of the substrate table 30 itself The X axis direction, the? X direction, and the? Y direction (hereinafter referred to as " X axis ") with respect to the coarse movement stage 24 by the linear motor 30a (e.g., voice coil motor) , Z tilt direction).

The substrate table 30 is mechanically connected to the coarse movement stage 24 via a plurality of connection devices 30b (flexure devices) extending radially from the substrate table 30. [ The connection device 30b includes, for example, a ball joint so as not to inhibit relative movement of the substrate table 30 by the microstroke in the Z tilt direction with respect to the coarse movement stage 24. When the coarse movement stage 24 is moved in the X-axis direction by a long stroke, the coarse movement stage 24 and the substrate table 30 are pulled by the coarse movement stage 24 via the plurality of connection devices 30b, Moves integrally in the X-axis direction. Since the substrate table 30 does not move in the Y axis direction, a plurality of connection devices 30b parallel to the X axis direction, not the connection device 30b extending radially with respect to the coarse movement stage 24, And may be connected to the coarse stage 24.

The noncontact holder 32 is a rectangular plate-shaped (or box-shaped) member having a longitudinal direction in the X-axis direction when viewed from the plane, and supports the substrate P from below on the upper surface thereof. The noncontact holder 32 has a function of preventing the substrate P from being sagged or wrinkled (flatness correction). The noncontact holder 32 is fixed on the upper surface of the substrate table 30 and moves integrally with the substrate table 30 in the X-axis direction in the long stroke and in the Z-tilt direction.

The length of each of the oblique lines on the upper surface (substrate supporting surface) of the noncontact holder 32 is set to be substantially equal to the length of each of the oblique sides of the substrate P (actually slightly shorter). Therefore, the noncontact holder 32 is configured to support substantially the whole of the substrate P from below, more specifically, to hold the substrate P in the exposure target area (the margin formed in the vicinity of the end of the substrate P (Region excluding the region) from below.

To the noncontact holder 32, a pressurized gas supply device (not shown) and a vacuum suction device provided outside the substrate stage device 20 are connected to each other through a pipe member such as a tube. In addition, on the upper surface (substrate surface) of the noncontact holder 32, a plurality of minute holes communicating with the piping member are formed. The noncontact holder 32 ejects the substrate P from the lower surface of the substrate P through a part of the hole so that a pressurized gas (for example, compressed air) . The noncontact holder 32 sucks air between the lower surface of the substrate P and the substrate supporting surface by the vacuum suction force supplied from the vacuum suction apparatus in combination with the ejection of the pressurized gas. Thus, a load (preload) acts on the substrate P, and the surface is corrected along the upper surface of the noncontact holder 32. However, since a gap is formed between the substrate P and the non-contact holder 32, the relative movement of the substrate P and the non-contact holder 32 in the direction parallel to the horizontal plane is not hindered.

The substrate carrier 40 is a portion for holding the substrate P. The substrate carrier 40 is movable in the three degrees of freedom direction (X-axis direction, Y-axis direction, and the like) in the horizontal plane with respect to the illumination light IL theta z direction). The substrate carrier 40 is formed in a rectangular frame shape (frame shape) when viewed from the plane and is in a state of maintaining a region (margin region) near the end portion (outer peripheral edge portion) of the substrate P Contact holder 32 along the XY plane. Hereinafter, the details of the substrate carrier 40 will be described with reference to FIG.

As shown in Fig. 3, the substrate carrier 40 includes a pair of X frames 42x and a pair of Y frames 42y. The pair of X frames 42x are each formed of a flat plate member extending in the X axis direction and are arranged in a predetermined direction in the Y axis direction (wider than the dimension of the substrate P and the noncontact holder 32 in the Y axis direction) Respectively. Each of the pair of Y frames 42y is formed of a flat plate member extending in the Y axis direction and has a predetermined dimension in the X axis direction (the dimension in the X axis direction of the substrate P and the non- Wide).

 The Y frame 42y on the + X side is connected to the lower surface in the vicinity of the end on the + X side of each pair of X frames 42x via the spacer 42s. Similarly, the Y frame 42y on the -X side is connected to the lower surface in the vicinity of the end on the -X side of each pair of X frames 42x via the spacer 42s. Thus, the height position (position in the Z-axis direction) of the upper surface of the pair of Y frames 42y is set lower than the height position of the pair of X frames 42x (on the -Z side).

A pair of suction pads 44 are mounted on the lower surface of each pair of X frames 42x in the X-axis direction. Thus, the substrate carrier 40 has, for example, four adsorption pads 44 in total. The adsorption pads 44 are arranged so as to protrude in a direction opposite to each other (the inside of the substrate carrier 40) from the surfaces of the pair of X frames 42x facing each other. For example, the four adsorption pads 44 support the vicinity of the four corners (blank areas) of the substrate P from below in a state where the substrate P is inserted between the pair of X frames 42x (A mounting position with respect to the X frame 42x) in the horizontal plane is set so that the X frame 42x can be mounted. For example, a vacuum suction device (not shown) is connected to each of the four adsorption pads 44. The adsorption pad 44 adsorbs and holds the lower surface of the substrate P by a vacuum suction force supplied from the vacuum suction apparatus. In addition, the number of the adsorption pads 44 is not limited to this and can be suitably changed.

2, in a state where the non-contact holder 32 and the substrate carrier 40 are combined, the substrate P is held in the vicinity of the four corners of the substrate carrier 40 by the adsorption pad 44 of the substrate carrier 40 (Adsorbed and held) from below, and the substantially entire surface including the center portion is noncontact-supported by the non-contact holder 32 from below. In this state, the end portions of the substrate P on the + X side and the -X side are respectively protruded from the end portions on the + X side and the -X side of the noncontact holder 32. For example, four adsorption pads 44 2), a portion of the substrate P protruding from the non-contact holder 32 is held by suction. That is, the mounting position of the adsorption pad 44 with respect to the X frame 42x is set so as to be located outside the noncontact holder 32 with respect to the X axis direction.

Next, the substrate carrier driving system 60 (see Fig. 6) for driving the substrate carrier 40 will be described. 6) drives the substrate carrier 40 with a long stroke in the Y-axis direction with respect to the non-contact holder 32 via the substrate carrier driving system 60 (see Fig. 6) And is finely driven in the three-degree-of-freedom direction in the horizontal plane. The main control device 50 is configured to move the noncontact holder 32 and the substrate carrier 40 in the X axis direction through the substrate table drive system 56 (refer to Fig. 6) described above and the substrate carrier drive system 60 And are driven integrally (synchronously).

2, the substrate carrier driving system 60 includes a Y stator 62a of the aforementioned coarse stage 24 and a Y stator 62a which cooperates with the Y stator 62a to generate Y And a pair of Y linear actuators 62 including a movable member 62b. As shown in Fig. 4, a Y stator 64a and an X stator 66a are mounted on Y movable parts 62b of each pair of Y linear actuators 62, respectively.

The Y stator 64a includes a Y voice coil 64a that cooperates with the Y mover 64b mounted on the substrate carrier 40 (the lower surface of the Y frame 42y) and applies thrust in the Y axis direction to the substrate carrier 40 The motor 64 is constituted. The X stator 66a cooperates with the X movable element 66b mounted on the substrate carrier 40 (the lower surface of the Y frame 42y) to apply X-directional thrust to the substrate carrier 40 And constitutes a voice coil motor 66. [ The substrate stage device 20 has one Y voice coil motor 64 and one X voice coil motor 66 on the + X side and the -X side of the substrate carrier 40, respectively.

Here, the Y voice coil motor 64 and the X voice coil motor 66 on the + X side and the -X side of the substrate carrier 40 are arranged in point symmetry about the center of gravity of the substrate P, respectively . The X voice coil motor 66 on the + X side of the substrate carrier 40 and the X voice coil motor 66 on the -X side of the substrate carrier 40 are used to drive the substrate carrier 40 in the X axis direction It is possible to obtain the same effect as a thrust exerted parallel to the X axis direction at the center of gravity position of the substrate P when the thrust is exerted, that is, when a moment in the? Z direction is applied to the substrate carrier 40 (substrate P) Can be suppressed. Since the pair of Y voice coil motors 64 are disposed with the center of gravity (line) of the substrate P relative to the X axis direction interposed therebetween, a moment in the? Z direction It does not work.

The substrate carrier 40 is driven by the main controller 50 (see Fig. 6) through the pair of Y voice coil motors 64 and the pair of X voice coil motors 66 to drive the coarse stage 24 (That is, the non-contact holder 32) in the three-degree-of-freedom direction in the horizontal plane. The main controller 50 is configured such that when the coarse movement stage 24 (i.e., the noncontact holder 32) moves in the X-axis direction in the long stroke, the noncontact holder 32 and the substrate carrier 40 integrally move in X Axis direction to the substrate carrier 40 by using the pair of X voice coil motors 66 so as to move to the long stroke in the axial direction.

The main controller 50 (see Fig. 6) uses the pair of Y linear actuators 62 and a pair of Y voice coil motors 64 to move the substrate carrier 40 to the non-contact holder 32 In the Y-axis direction with a long stroke. More specifically, the main controller 50 moves the Y mover 62b of the pair of Y linear actuators 62 in the Y-axis direction while moving the Y stator 64a (64a) mounted on the Y mover 62b Axis direction to the substrate carrier 40 by using a Y voice coil motor 64 including a Y- Thus, the substrate carrier 40 is separated from the non-contact holder 32 (separated) and moves in the Y-axis direction in the long stroke.

As described above, in the substrate stage device 20 of the present embodiment, the substrate carrier 40 holding the substrate P is integrally formed with the non-contact holder 32 in the X- And moves to the long stroke independently of the non-contact holder 32 with respect to the Y-axis direction. 2, the Z position of the suction pad 44 partially overlaps with the Z position of the noncontact holder 32, but the substrate carrier 40 is held in the noncontact holder 32 by the long stroke It is possible for the suction pad 44 and the non-contact holder 32 to come into contact with each other only in the Y-axis direction.

When the substrate table 30 (i.e., the non-contact holder 32) is driven in the Z-tilt direction, the substrate P that has been plane-corrected to the non-contact holder 32 is moved in the Z- The substrate carrier 40 for holding and holding the substrate P changes posture with respect to the substrate P in the z-tilt direction. Further, the posture of the substrate carrier 40 may be prevented from being changed by the elastic deformation of the adsorption pad 44.

1, the pair of sub-tables 34 cooperate with the non-contact holder 32 when the substrate carrier 40 is separated from the non-contact holder 32 and relatively moved in the Y-axis direction, And the substrate carrier 40 (X frame 42x). Since the substrate carrier 40 moves relative to the non-contact holder 32 while holding the substrate P as described above, for example, when the substrate carrier 40 moves from the state shown in Fig. 1 to the + Y The vicinity of the end on the + Y side of the substrate P is not supported by the noncontact holder 32. [ Therefore, in the substrate stage device 20, in order to suppress the warp caused by the self-weight of the portion of the substrate P which is not supported by the non-contact holder 32, the substrate P is paired with the pair of sub- 34 from below. The pair of sub-tables 34 are substantially the same structure except that they are arranged symmetrically on the ground.

As shown in Fig. 3, the sub-table 34 has a plurality of air floating units 36. [ In the present embodiment, the air floating unit 36 is formed in a rod shape extending in the Y axis direction, and a plurality of air floating units 36 are arranged at predetermined intervals in the X axis direction. However, The shape, the number, the arrangement, and the like are not particularly limited as long as warpage attributable to the warp of the warp P can be suppressed. As shown in Fig. 4, the plurality of air floating units 36 are supported from below by an arm-shaped support member 36a protruded from the side surface of the substrate table 30. A small clearance is formed between the plurality of air floating units 36 and the non-contact holder 32.

The height position of the upper surface of the air floating unit 36 is set to be substantially equal to (or slightly lower than) the height position of the upper surface of the noncontact holder 32. The air floating unit 36 ejects a gas (for example, air) onto the lower surface of the substrate P from the upper surface thereof, thereby supporting the substrate P in a noncontact manner. Although the above-described non-contact holder 32 performs the plane calibration of the substrate P by applying a preload to the substrate P, the air floating unit 36 is capable of suppressing warpage of the substrate P It is only necessary to supply gas to the lower surface of the substrate P and the height position of the substrate P on the air floating unit 36 need not be specifically controlled.

Next, a substrate position measuring system 70 (see Fig. 6) for measuring the position information in the six degrees of freedom direction of the substrate P (substrate carrier 40) will be described. The substrate position measuring system 70 of the present embodiment has a pair of head units 72 as shown in Fig. One of the head units 72 is disposed on the -Y side of the projection optical system 16 and the other head unit 72 is disposed on the + Y side of the projection optical system 16.

Each of the pair of head units 72 is provided with position information in the horizontal plane of the substrate P (position information in the X-axis direction and the Y-axis direction, and in the? Z direction Is obtained. As shown in Fig. 3, a plurality (six in Fig. 3, for example) of X frames 42x are provided on the upper surface of each pair of X frames 42x of the substrate carrier 40, corresponding to the pair of head units 72, The scale plate 46 is attached to the base plate. The scale plate 46 is a strip-shaped member as viewed in a plane extending in the X-axis direction. The length of the scale plate 46 in the X axis direction is shorter than the length of the X frame 42x in the X axis direction and the plurality of scale plates 46 are arranged at a predetermined interval Be arranged

Fig. 5 shows an X frame 42x on the -Y side and a head unit 72 corresponding thereto. An X scale 48x and a Y scale 48y are formed in each of the plurality of scale plates 46 fixed on the X frame 42x. The X scale 48x is formed in the half of the -Y side of the scale plate 46 and the Y scale 48y is formed in the half of the + Y side of the scale plate 46. [ The X scale 48x has a reflection type X diffraction grating and the Y scale 48y has a reflection type Y diffraction grating. 5, the intervals (pitches) between a plurality of grid lines forming the X scale 48x and the Y scale 48y are shown to be wider than actual in order to facilitate understanding.

4, the head unit 72 includes a Y linear actuator 74 and a Y linear actuator 74 which are movable relative to the projection optical system 16 (see Fig. 1) with a predetermined stroke in the Y-axis direction And a plurality of measurement heads (X encoder heads 78x and 80x, Y encoder heads 78y and 80y, Z sensor heads 78z and 80z) fixed to the Y slider 76 Respectively. 1 and 4, the pair of head units 72 are constructed in the same manner except that they are configured to be symmetrical on the left and right in the drawing. In addition, a plurality of scale plates 46 fixed to each of the pair of X frames 42x are symmetrically arranged in Fig. 1 and Fig.

The Y linear actuator 74 is fixed to the lower surface of the upper portion 18a of the apparatus main body 18. The Y linear actuator 74 is provided with a linear guide for linearly guiding the Y slider 76 in the Y axis direction and a drive system for applying thrust to the Y slider 76. The type of the linear guide is not particularly limited, but an air bearing with high repeatability is suitable. The type of the drive system is not particularly limited, and for example, a linear motor, a belt (or wire) drive, or the like can be used.

The Y linear actuator 74 is controlled by the main controller 50 (see Fig. 6). The amount of stroke of the Y slider 76 in the Y axis direction by the Y linear actuator 74 is set equal to the amount of stroke of the substrate P (substrate carrier 40) in the Y axis direction.

5, the head unit 72 includes a pair of X encoder heads 78x (hereinafter referred to as "X head 78x"), a pair of Y encoder heads 78y (hereinafter referred to as " Y head 78y "), and a pair of Z sensor heads 78z (hereinafter referred to as" Z head 78z "). The pair of X head 78x, Y head 78y, and Z head 78z are arranged apart from each other by a predetermined distance in the X axis direction.

The X head 78x and the Y head 78y are encoder heads of the so-called diffraction interference type, for example, as disclosed in U.S. Patent Application Publication No. 2008/0094592, and a corresponding scale (X scale 48x) (Direction of rotation of the main carrier 40) by irradiating the measurement beam in the downward direction (-Z direction) to the main controller 50 (Y scale 48y) and receiving the beam (return light) 6).

In other words, in the substrate position measuring system 70 (see Fig. 6), the total of the pair of head units 72 includes, for example, four X heads 78x, The X-scale 48x constitutes, for example, four X linear encoder systems for obtaining positional information of the substrate carrier 40 in the X-axis direction. Similarly, the sum of the pair of head units 72 is set to be, for example, four Y heads 78y and Y scales 48y opposed to the Y heads 78y, For example, four Y linear encoder systems for obtaining positional information in the Y-axis direction.

Here, the interval in the X-axis direction of each of the pair of X heads 78x and the pair of Y heads 78y of each of the pair of head units 72 is set such that the distance between the adjacent scale plates 46 And is set wider than the interval. Accordingly, in the X encoder system and the Y encoder system, at least one of the pair of X heads 78x always faces the X scale 48x, regardless of the position of the substrate carrier 40 in the X axis direction , At least one of the pair of Y heads 78y is always opposed to the Y scale 48y.

Specifically, in a state in which the pair of X heads 78x are opposed to the X scale 48x together, the main controller 50 (refer to FIG. 6) determines the average value of the outputs of the pair of X heads 78x The X position information of the substrate carrier 40 is obtained. The main control device 50 also controls the substrate carrier 40 based on only the output of one of the X heads 78x in a state where only one of the pair of X heads 78x faces the X scale 48x, The X-position information of the X- Therefore, the X encoder system can supply positional information of the substrate carrier 40 to the main controller 50 without being interrupted. The same is true for the Y encoder system.

A laser displacement gauge is used as a pair of Z sensor heads 78z for obtaining positional information of the substrate carrier 40 (that is, the substrate P (see Fig. 3) in the z-tilt direction). Here, the plurality of scale plates 46 fixed on the X frame 42x corresponding to the head unit 72 on the -Y side are arranged in the area on the + Y side on the upper surface of the X frame 42x (See FIG. 1). Thus, in the region on the -Y side of the upper surface of the X frame 42x, a band-shaped region extending in the X-axis direction, on which the scale plate 46 is not mounted, is formed.

The belt-like region on the upper surface of the X frame 42x is a reflecting surface by, for example, mirror-surface processing. Each of the pair of Z heads 78z irradiates the measurement beam (downward) with respect to the reflection surface and receives the reflected beam from the reflection surface so that the substrate carrier 40 ) In the Z-axis direction is supplied to the main controller 50 (refer to FIG. 6). The main control device 50 (refer to Fig. 6) is provided with a pair of Z heads 78z, that is, a total of, for example, four Z heads 78z each having a pair of head units 72 Thereby obtaining the position information of the substrate carrier 40 in the Z tilt direction. The type of the Z head 78z is set so that the displacement in the Z axis direction of the substrate carrier 40 (more specifically, the X frame 42x) with reference to the apparatus main body 18 Is not particularly limited as long as it can be measured with accuracy (resolution) and in a noncontact manner.

As described above, since the substrate carrier 40 of the present embodiment can move in a predetermined long stroke even in the Y-axis direction, the main controller 50 (see Fig. 6) can move the X head 78x ) Of the pair of head units 72 in accordance with the position of the substrate carrier 40 in the Y-axis direction so that the opposite scales 48x, 48y, Y heads 78y, (See FIG. 7) through the Y linear actuator 74 (see FIG. 4) so as to follow the substrate carrier 40 (see FIG. The main control device 50 controls the overall operation of the substrate carrier 40 (Y) by integrally moving the displacement amount (position information) of the Y slider 76 (i.e., each of the heads 78x and 78y) and the output from each of the heads 78x and 78y ) In the horizontal plane.

The position (displacement amount) information in the horizontal plane of the Y slider 76 (see FIG. 4) is obtained by an encoder system of measurement accuracy equivalent to that of the encoder system using the X head 78x and the Y head 78y. 4 and 5, the Y slider 76 includes a pair of X encoder heads 80x (hereinafter referred to as "X head 80x"), and a pair of Y encoder heads (Hereinafter referred to as " Y head 80y "). The pair of X heads 80x and the pair of Y heads 80y are arranged at a predetermined distance in the Y axis direction.

6) includes a plurality of scale plates 82 fixed to the lower surface of the main portion 18a (see Fig. 1) of the apparatus main body 18, and the Y slider 76 ) In the horizontal plane. The scale plate 82 is made of a strip-shaped member as viewed in a plane extending in the Y-axis direction. In the present embodiment, for example, two scale plates 82 are arranged above the pair of head units 72 at predetermined intervals (apart from each other) in the Y-axis direction.

An X scale 84x is formed opposite to the pair of X heads 80x in the area on the + X side of the lower surface of the scale plate 82, A Y scale 84y is formed opposite to the pair of Y heads 80y in the area on the -X side in the bottom surface. The X scale 84x and the Y scale 84y are light reflective diffraction gratings having substantially the same configuration as the X scale 48x and the Y scale 48y formed in the scale plate 46 described above. The X head 80x and the Y head 80y are also an encoder head of the diffraction interference type having the same configuration as the above-described X head 78x and Y head 78y (downward head).

The pair of X heads 80x and the pair of Y heads 80y irradiate the measurement beam upward (+ Z direction) to the corresponding scales (X scale 84x and Y scale 84y) By receiving the beam from the scale, displacement amount information in the horizontal plane of the Y slider 76 (see Fig. 4) is supplied to the main controller 50 (see Fig. 6). The interval in the Y axis direction of each of the pair of X heads 80x and the pair of Y heads 80y is set wider than the interval between the adjacent scale plates 82. [ Thus, at least one of the pair of X heads 80x is always opposed to the X-scale 84x, and the pair of Y heads 80y is always opposed to the X-scale 84x, regardless of the position of the Y slider 76 in the Y- At least one of them is always opposed to the Y scale 84y. Therefore, the position information of the Y slider 76 can be supplied to the main controller 50 (refer to FIG. 6) without being interrupted.

4, since the Y slider 76 is linearly guided in the Y-axis direction by the linear guide device in the head unit 72, a plurality of (The X heads 78x and 80x, the Y heads 78y and 80y, and the Z heads 78z and 80z). Thus, the main controller 50 (see Fig. 6) is provided with four Z sensor heads 80z (hereinafter referred to as " Z head 80z ") mounted on the Y slider 76 (Inclusive of the displacement amount in the direction of the optical axis) of the Y slider 76 and the inclination (deviation of the optical axis of the measurement light) of the Y slider 76 is obtained And the outputs of the respective measurement heads (X heads 78x and 80x, Y heads 78y and 80y and Z head 78z) are corrected based on the outputs of four sensor heads 80z, for example. In the present embodiment, for example, four sensor heads 80z (upward head) are disposed at four points that are not on the same straight line. However, the present invention is not limited to this. For example, (80z) may be disposed at three points that are not on the same straight line.

In this embodiment, the same laser displacement gauge as the sensor head 78z is used as the sensor head 80z (upward sensor) as an example, and the upper portion is fixed to the lower surface of the base portion 18a (see Figs. 9 and 11) Information about the tilt amount of the Y slider 76 is obtained by using a not-shown target (reflecting surface extending in the Y-axis direction), that is, a top surface of the base portion 18a. The kind of the sensor head 80z is not particularly limited as long as information on the tilt amount of the Y slider 76 can be obtained with a desired accuracy. In this embodiment, for example, two scale plates 82 are disposed apart from each other in the Y-axis direction. Therefore, a target separate from the scale plate 82 is used. However, In the case of using one scale plate longer than the first scale plate 82, the lattice plane of the long scale plate may be used as a target (reflecting surface).

6 is a block diagram showing the input / output relationship of the main controller device 50 that mainly controls the control system of the liquid crystal exposure apparatus 10 (see Fig. 1) and performs overall control of the respective constituent elements. The main controller 50 includes a work station (or a microcomputer) and controls the components of the liquid crystal exposure apparatus 10 as a whole.

The liquid crystal exposure apparatus 10 (refer to Fig. 1) configured as described above is configured so as to be capable of moving the mask stage 14 on the mask stage 14 under the control of the main controller 50 (see Fig. 6) The loading of the mask M is carried out and the loading of the substrate P onto the substrate stage device 20 (the substrate carrier 40 and the non-contact holder 32) is performed by a substrate loader do. Thereafter, the main controller 50 performs alignment measurement using an alignment detection system (not shown) and focus mapping using an autofocus sensor (a surface position measurement system of the substrate P), not shown, After completion of the measurement and focus mapping, a sequential step-and-scan type exposure operation is performed on a plurality of shot areas set on the substrate P. [ The liquid crystal exposure apparatus 10 has been described as performing the focus mapping for determining the position of the substrate P in the Z direction in advance. However, without performing the scan exposure in advance, The focus mapping may be performed immediately before.

Next, an example of the operation of the substrate stage device 20 in the exposure operation will be described with reference to Figs. 8 (a) to 10 (b). In the following description, the case where four short regions are set on one substrate P (the case of so-called four chamfers) will be described, but the number of shot regions set on one substrate P and The arrangement can be suitably changed. In the present embodiment, the exposure process is described as being performed from the first short region S1 set on the -Y side and the + X side of the substrate P as an example. 8 (a) to 10 (b), a part of the elements of the substrate stage device 20 are omitted in order to avoid the complication of the drawings.

8A and 8B are a plan view and a front view of the substrate stage device 20 in a state where the aligning operation and the like are completed and the preparation of the exposure operation for the first shot area S1 is completed Respectively. 8 (a), the substrate stage device 20 irradiates the illumination light IL (see FIG. 8 (b)) from the projection optical system 16 to expose the substrate P The end portion of the first shot region S1 on the + X side is slightly smaller than the region IA (in the state shown in Fig. 8 (a), the illumination light IL is not yet irradiated to the substrate P) The substrate P is positioned based on the output of the substrate position measuring system 70 (refer to FIG. 6) so as to be located on the -X side.

Since the center of the exposure area IA and the center of the X guide bar 28 (i.e., the noncontact holder 32) substantially coincide with each other in the Y axis direction, The vicinity of the end on the + Y side of the projection P protrudes from the non-contact holder 32. The protruded portion of the substrate P is supported from below by an auxiliary table 34 disposed on the + Y side of the noncontact holder 32. At this time, the vicinity of the end on the + Y side of the substrate P is not subjected to the plane calibration by the non-contact holder 32, but the region including the first shot area S1 to be exposed is subjected to planar calibration The exposure accuracy is not affected.

Subsequently, from the state shown in Figs. 8 (a) and 8 (b), as shown in Figs. 9 (a) and 9 (b), in synchronization with the mask M 40 and the noncontact holder 32 are driven (synchronized) with the X guide bar 28 integrally (synchronously) in the + X direction on the basis of the output of the substrate position measuring system 70 Drive, and deceleration) (see the black arrows in Fig. 9 (a)). The substrate P is irradiated with the illumination light IL (see FIG. 1) and the illumination light IL (which has passed through the projection optical system 16) onto the substrate P while the substrate carrier 40 and the noncontact holder 32 are driven at the constant speed in the X- (See Fig. 9 (b), respectively) are irradiated, whereby the mask pattern of the mask M is transferred to the shot area S1. At this time, the substrate carrier 40 is appropriately minutely driven in the three-degree-of-freedom direction in the horizontal plane with respect to the non-contact holder 32 according to the result of the alignment measurement, and the non- And is appropriately minutely driven in the Z tilt direction.

When the substrate carrier 40 and the non-contact holder 32 are driven in the X-axis direction (+ X direction in FIG. 9A) in the substrate position measuring system 70 The Y slider 76 of each of the head units 72 is in a stopped state.

When the transfer of the mask pattern to the first shot area S1 on the substrate P is completed, in the substrate stage apparatus 20, as shown in Figs. 10 (a) and 10 (b) The substrate carrier 40 is moved in the -Y direction relative to the non-contact holder 32 by a predetermined distance (in the width direction dimension of the substrate P) in order to perform the exposure operation for the second shot area S2 set on the + Y side of the non- (Y step drive) based on the output of the substrate position measuring system 70 (see FIG. 6) (see a white arrow in FIG. 10 (a)). The vicinity of the end on the -Y side of the substrate P held by the substrate carrier 40 is moved to the auxiliary table 34 disposed on the -Y side of the noncontact holder 32 by the Y step operation of the substrate carrier 40, As shown in Fig.

6) includes a Y-slider 76 (see Fig. 4, respectively) of each of the pair of head units 72 when the substrate carrier 40 is driven in the -Y direction ) In the -Y direction in synchronism with the substrate carrier 40 with respect to the Y-axis direction (see the black arrows in FIG. 10 (a)). 7, when the substrate carrier 40 moves in a predetermined stroke in the -Y direction, the pair of Y sliders 76 is moved in the -Y direction in synchronization with the substrate carrier 40 Move. Means that the substrate carrier 40 and the Y slider 76 move in a state in which the relative positional relationship is maintained substantially, and the position (moving direction and speed) is The present invention is not limited to the case of moving in a strictly matched state.

Although not shown, the substrate carrier 40 and the non-contact holder 32 are driven in the -X direction in synchronization with the mask M (see Fig. 1), so that the scanning exposure for the second short region S2 . The Y step operation of the substrate carrier 40 and the uniform movement of the substrate carrier 40 in synchronism with the mask M and the non-contact holder 32 in the X axis direction are appropriately repeated, The scan exposure operation for the set entire shot area is sequentially performed.

According to the substrate stage apparatus 20 of the liquid crystal exposure apparatus 10 according to the first embodiment described above, the substrate position measuring system 70 for obtaining the positional information of the substrate P in the XY plane includes: The influence of air blurring can be reduced, for example, as compared with the conventional interferometer system. Therefore, the positioning accuracy of the substrate P is improved. In addition, since the influence of air blurring is small, the partial air conditioning facility, which is essential in the case of using the conventional interferometer system, can be omitted, and the cost can be reduced.

Further, in the case of using the interferometer system, it is necessary to provide a large and heavy bar mirror in the substrate stage device 20. However, in the encoder system according to the present embodiment, the bar mirror is unnecessary, The weight including the weight of the substrate P is reduced, and the position controllability of the substrate P is improved. Further, as compared with the case where the interferometer system is used, since the adjustment point is reduced to a small extent, the substrate stage device 20 is cost-reduced and the maintenance property is also improved. Also, adjustment during assembly is facilitated.

In the substrate position measuring system 70 (encoder system) according to the present embodiment, the Y slider 76 of each pair of head units 72 is driven in the Y axis direction in synchronization with the substrate P It is necessary to arrange a scale extending in the Y-axis direction on the substrate stage device 20 side (or in the Y-axis direction on the apparatus main body 18 side) It is not necessary to arrange a plurality of heads). Therefore, the configuration of the substrate position measuring system 70 can be simplified, and the cost can be reduced.

In the substrate position measuring system 70 (encoder system) according to the present embodiment, the output of the adjacent pair of encoder heads (X head 78x, Y head 78y) Even when the plurality of scale plates 46 are arranged at predetermined intervals (apart from each other) in the X-axis direction, the position of the substrate carrier 40 Can be obtained without interruption in the middle. Therefore, it is not necessary to prepare a scale plate having a length equivalent to the stroke amount of the substrate carrier 40, and it is possible to reduce the cost. Especially, in the liquid crystal exposure apparatus 10 using the large-sized substrate P as in the present embodiment Suitable.

The substrate stage device 20 is configured such that when the substrate P is subjected to highly precise positioning in the XY plane of the substrate P, a frame-shaped substrate carrier 40 for holding only the outer periphery of the substrate P is provided in the horizontal plane 3 Compared with the case where the substrate holder for attracting and holding the entire lower surface of the substrate P is driven in the direction of three degrees of freedom in the horizontal plane to perform highly accurate positioning of the substrate P, Since the object (the substrate carrier 40 in this embodiment) is lightweight, the position controllability is improved. In addition, it is possible to downsize the actuators for driving (in this embodiment, the Y voice coil motor 64 and the X voice coil motor 66).

&Quot; Second Embodiment &

Next, a second embodiment will be described with reference to Fig. The liquid crystal exposure apparatus according to the second embodiment obtains positional information in the horizontal plane of the substrate P using an encoder system in the same manner as in the first embodiment described above, The head unit and the head unit for the Z-tilt position measuring instrument are independent from each other in the first embodiment. Hereinafter, differences from the first embodiment will be described, and elements having the same configurations and functions as those of the first embodiment will be denoted by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

The substrate position measuring system 70A according to the second embodiment is provided with one head unit 72A and one head unit 72B on one side and the other side of the projection optical system 16 (see Fig. 1) Unit 72B (only one side is shown in Fig. 11). The position of the head unit 72A with respect to the X-axis direction substantially coincides with the projection optical system 16. The two head units 72B are disposed on one side and the other side of the head unit 72A with respect to the X axis direction.

The head unit 72A is obtained by removing the Z heads 78z and 80z from the head unit 72 (see Fig. 5) related to the first embodiment. That is, the head unit 72A is constituted by a pair of X heads 78x and a pair of Y heads 78y, by using a plurality of scale plates 46 mounted on the substrate carrier 40, Position information of the carrier 40 in the XY plane is obtained. A pair of X heads 78x and a pair of Y heads 78y move in the Y axis direction in synchronization with the substrate carrier 40 and that the positional information of the pair of X heads 80x, The points obtained by using the scale plate 82 by the pair of Y heads 80y are the same as those in the first embodiment, and the description will be omitted.

The head unit 72B is obtained by removing the X heads 78x and 80x and the Y heads 78y and 80y from the head unit 72 (see FIG. 5) according to the first embodiment. In other words, the head unit 72B is formed by a pair of Z heads 78z, which are arranged on the upper surface (reflecting surface) of the X frame 42x of the substrate carrier 40 so as to face the substrate carrier 40 in the Z tilt direction Get location information. The pair of Z heads 78z move in the Y axis direction in synchronization with the substrate carrier 40 and that the attitude change is detected by the four Z heads 80z in the apparatus main body 18 ) Is the same as that of the first embodiment described above, and a description thereof will be omitted.

According to the second embodiment, since the head unit 72A of the position measuring system in the horizontal plane of the substrate P and the head unit 72B of the position measuring instrument in the Z tilt direction of the substrate are independent of each other, The configuration of the head unit is simple, and the arrangement of each measurement head is easy.

&Quot; Third Embodiment &

Next, the third embodiment will be described with reference to Figs. 12 (a) and 12 (b). The configuration of the liquid crystal exposure apparatus according to the third embodiment is similar to the configuration of the substrate stage apparatus 120 for accurately positioning the substrate P with respect to the projection optical system 16 (see Fig. 1) It is different from the shape. The configuration of the measuring system for obtaining the position information of the substrate P in the six degrees of freedom direction is the same as that of the first embodiment. Hereinafter, the third embodiment will be described only in terms of differences (differences) from the first embodiment, and elements having the same configuration and function as those of the first embodiment will be described with reference to the first embodiment The same reference numerals are attached thereto, and the description thereof is omitted.

In the first embodiment, the frame carrier (40) having a frame shape (frame shape) for holding the substrate (P) is supported by the noncontact holder (32) In the substrate stage device 120 according to the third embodiment shown in Figs. 12 (a) and 12 (b), while the substrate carrier 120 is relatively movable with a predetermined stroke Contact holder 140 moves in a predetermined long stroke integrally with the non-contact holder 32 in each of the scanning direction (X-axis direction) and the non-scanning direction. The substrate carrier 140 is movable relative to the non-contact holder 32 in a three-degree-of-freedom direction in the horizontal plane with a very small stroke, which is the same as that of the substrate stage device 20 of the first embodiment.

More specifically, in the third embodiment, the coarse movement stage 124 is configured to be movable in a predetermined long stroke in the X-axis and Y-axis directions. The configuration for moving the coarse movement stage 124 in the Y-axis direction to the long stroke is not particularly limited. For example, a known gantry type XY stage such as disclosed in U.S. Patent Application Publication No. 2012/0057140, Devices can be used. The weight canceling device 26 is connected to the coarse movement stage 124 so as to move in a predetermined long stroke in the X and Y axis directions integrally with the coarse movement stage 124. In addition, the X guide bar 28 (see Fig. 1, etc.) is also movable in the Y axis direction by a predetermined long stroke. The configuration for moving the X guide bar 28 in the Y-axis direction in the long stroke is not particularly limited, but may be mechanically connected to the Y stage, for example, of the XY stage apparatus. The point that the coarse movement stage 124 and the substrate table 30 are connected mechanically (in a state in which they can be moved in small tilt directions) through a plurality of connection devices 30b (flexure devices) Is the same as the embodiment. Thus, the substrate table 30 and the noncontact holder 32 move together with the coarse movement stage 124 in a predetermined long stroke in the X-axis and Y-axis directions.

The substrate carrier 140 has a body portion 142 formed in a rectangular frame shape when viewed in plan view and a suction portion 144 fixed to the upper surface of the body portion 142. Similar to the body portion 142, the suction portion 144 is formed in a rectangular frame shape when viewed in plan. The substrate P is held, for example, by vacuum suction on the adsorption unit 144. [ The noncontact holder 32 is inserted into the opening of the suction portion 144 in a state in which a predetermined gap is formed on the inner wall surface of the suction portion 144. [ Contact holder 32 applies a load (pre-load) to the substrate P to perform plane calibration in a noncontact manner in the same manner as in the first embodiment.

A plurality of (for example, four in this embodiment) guide plates 148 extend radially from the lower surface of the substrate table 30 along the horizontal plane. The substrate carrier 140 has a plurality of pads 146 including air bearings corresponding to the plurality of guide plates 148. The substrate carrier 140 has a plurality of pads 146, In a non-contact state on the guide plate 148 by a static pressure of the guide plate 148. When the substrate table 30 is minutely driven in the Z tilt direction, the plurality of guide plates 148 also move in the z-tilt direction (change in posture) in unison with the substrate table 30, The attitude of the substrate table 30, the non-contact holder 32, and the substrate carrier 140 (that is, the substrate P) changes integrally.

The substrate carrier 140 includes a plurality of linear motors 152 (X voice coil motors and Y voice coil motors) including a stator included in the mover of the substrate carrier 140 and the substrate table 30 And is slightly driven in the three degrees of freedom direction in the horizontal plane with respect to the substrate table 30. When the substrate table 30 moves to the long stroke along the XY plane, the substrate table 30 and the substrate carrier 140 are integrally moved along the XY plane by a long stroke so that the plurality of linear motors 152 The thrust is imparted to the substrate carrier 140.

A plurality of scale plates 46 are fixed to the upper surface of the substrate carrier 140 in the vicinity of the + Y side and the -Y side end, respectively, as in the first embodiment. The scale plate 46 and the top surface (reflecting surface) of the substrate carrier 140 are used to obtain the position information in the six degrees of freedom direction of the substrate carrier 140 (i.e., the substrate P) The description is omitted.

The configurations described in the first to third embodiments can be appropriately changed. For example, in each of the above embodiments, a plurality of scale plates 46 are arranged on the substrate carrier 40 at predetermined intervals in the X-axis direction, but the length in the X- May be used. In this case, each of the X head 78x and the Y head 78y may be formed for each of the pair of head units 72. When a plurality of scale plates 46 are formed, the lengths of the scale plates 46 may be different from each other. For example, by setting the length of the scale plate extending in the X-axis direction longer than the length of the shot area in the X-axis direction, the head unit 72 can be moved in the X- It is possible to avoid positional control of the position P of the object. Further, the lengths may be different from each other on the scale arranged on one side of the projection optical system 16 and on the scale arranged on the other side (for example, four chamfering and six chamfering). A plurality of scale plates arranged in the Y-axis direction may be arranged at different positions spaced apart from each other in the X-axis direction (for example, a projection optical system 16 (The + X side) and the other side (the -X side) with respect to the Y axis direction, the positions of the gaps at the predetermined intervals are not overlapped in the Y axis direction . When a plurality of scale arrays are arranged in this manner, there is no case in which the heads arranged in correspondence with each other in scale arrays are simultaneously out of the measurement range (in other words, both heads face the gaps at the same time).

In the scale group (scale array) in which a plurality of scales are successively arranged in the X-axis direction while interposing a gap of a predetermined interval on the substrate carrier 40, in the above embodiment, the scales having the same length are arranged However, scales having different lengths may be arranged in a line. For example, in the scale row on the substrate carrier 40, the lengths in the X-axis direction of the scales (scales arranged in each end portion in the scale column) disposed near both ends in the X- The scale to be disposed may be physically elongated.

In addition, a plurality of scales in the X-axis direction are arranged on the substrate carrier 40 in a scale group (scale array) arranged successively with a gap of a predetermined interval interposed therebetween, (The length of one shot area (length in which the device pattern is irradiated and formed on the substrate when scanning exposure is performed while moving the substrate on the substrate holder in the X-axis direction)) can be continuously measured . In this way, since the head replacement control for the plurality of scales is not performed during the scan exposure in the one shot area, the position measurement (position control) of the substrate P (substrate holder) during the scan exposure is facilitated .

Although the position information in the XY plane of each of the substrate P and the Y slider 76 is obtained by the X encoder heads 78x and 80x and the Y encoder heads 78y and 80y, The position information in the XY plane of each of the substrate P and the Y slider 76 and the position information in the XY plane of the substrate P and the Y slider 76 are detected by using a two-dimensional encoder head (XZ encoder head or YZ encoder head) The Z-tilt displacement amount information of each of the Z-tilt displacement amount information 76 may be obtained. In this case, the sensor heads 78z and 80z for obtaining Z tilt position information of the substrate P can be omitted. In this case, in order to obtain the z-tilt position information of the substrate P, it is necessary that the two downward Z heads always face the scale plate 46. Therefore, the scale plate 46 is placed between the X frame 42x and the X- It is preferable to arrange the two-dimensional encoder heads by a single long scale plate having the same length or to arrange the two-dimensional encoder heads at predetermined intervals in the X-axis direction, for example, three or more.

In the encoder system of each of the above embodiments, the substrate carriers 40 and 140 have the scale plate 46 (diffraction grating) and the head unit 72 has the measurement head. However, the present invention is not limited to this, Even when the substrate carriers 40 and 140 have a measurement head and a scale plate moving in synchronism with the measurement head is mounted on the apparatus main body 18 (even in the opposite arrangement to the above-described embodiments).

In the above embodiments, the plurality of scale plates 46 are arranged at predetermined intervals in the X-axis direction, but the present invention is not limited thereto. For example, the scale plates 46 may have the same degree as the length of the substrate carrier 40 in the X- May be used as the scale plate. In this case, since the opposed state of the scale plate and the head is always maintained, one X head 78x and one Y head 78y of each head unit 72 may be provided. The same is true for the scale plate 82. Although the scale plate 46 is mounted on almost the entire upper surface of the X frame 42x in the first embodiment described above, the range in which the scale plate 46 is mounted is the range in which the X- It can be changed appropriately according to the movement range. That is, if a plurality of heads can face the scale plate 46 at the most + X side and the scale plate 46 at the most-X side within the movement range of the substrate carrier 40, The mounting range may be shorter. In addition, in some cases, a plurality of (or one long) scale plates may be formed in a range longer than the X-axis direction length of the X-axis frame 42x. In this case, The scale plate 46 may be mounted on a separate long member. In the above-described embodiments, the two-dimensional measurement is performed by combining the one-dimensional encoder system constituted by the one-dimensional scale and the one-dimensional head. However, the present invention is not limited to this. (XY head) may be used.

In the above embodiments, the position information of the substrate carrier 40 and the position information of the Y slider 76 are respectively obtained by the encoder system. However, the position information of the Y slider 76 is not limited to this, May be obtained by another measurement system such as an optical interferometer system, for example.

In the substrate stage device 20 of the first embodiment, the noncontact holder 32 and the substrate carrier 40 are integrally movable in the X-axis (scanning) direction and the substrate carrier 40 The noncontact holder 32 and the substrate carrier 40 can move integrally in the Y axis direction or can move in the Y axis direction (non-scanning direction) with respect to the noncontact holder 32. On the contrary, The carrier 40 may be configured to be movable in the X-axis direction with respect to the non-contact holder 32. [ In this case, in the scanning exposure operation, only the substrate carrier 40 is moved in the scanning direction in the long stroke, and the position controllability is improved because the driven object is light in weight. In addition, the actuators for driving can be downsized.

In each of the above-described embodiments, the substrate carrier 40 and the like are arranged along the outer peripheral edge (four sides) of the substrate P, for example, four frame members (in the first embodiment, And the pair of Y frames 42y), the present invention is not limited to this, and the substrate carrier 40 is not limited to this, as long as the suction and holding of the substrate P can be reliably performed. Or the like may be constituted by a frame member along a part of the outer peripheral edge portion of the substrate P, for example. Concretely, the substrate carrier may be formed in a U-shape when viewed from the plane, for example, by three frame members along three sides of the substrate P, For example, by two frame members along the sides, and may be formed in an L shape when viewed in plan. The substrate carrier may be formed only along one side of the substrate P, for example, only by one frame member. The substrate carrier may be constituted by a plurality of members holding different portions of the substrate P and being positionally controlled independently of each other.

In the above embodiments, the non-contact holder 32 supports the substrate P in a noncontact manner. However, if the substrate P does not hinder the relative movement of the substrate P and the non-contact holder 32 in the direction parallel to the horizontal plane, But may be supported in contact with each other through a rolling member such as a ball.

The wavelength of the light source used in the illumination system 12 and the illumination light IL irradiated from the light source is not particularly limited and ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 Nm) or vacuum ultraviolet light such as F2 laser light (wavelength 157 nm).

In each of the above-described embodiments, a back-projection system is used as the projection optical system 16, but the present invention is not limited to this, and a reduction system or an enlargement system may be used.

The use of the exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern to a rectangular glass plate. For example, an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, A thin film magnetic head, a micromachine, a DNA chip, and the like. In addition, in order to manufacture a mask or a reticle used in not only a micro device such as a semiconductor device but also a light exposure device, EUV exposure device, X-ray exposure device, and electron beam exposure device, a circuit pattern is transferred onto a glass substrate or a silicon wafer It is also applicable to an exposure apparatus.

The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, a mask blank, or the like. When the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited and includes, for example, a film-like (sheet-shaped member having flexibility). Further, the exposure apparatus of the present embodiment is particularly effective when the substrate having a length of one side or a diagonal length of 500 mm or more is an object to be exposed. When the substrate to be exposed is a flexible sheet, the sheet may be formed in a roll shape.

An electronic device such as a liquid crystal display element (or a semiconductor element) has a function of designing a function and a performance of a device, a step of manufacturing a mask (or a reticle) based on the design step, a step of manufacturing a glass substrate , A lithography step of transferring the pattern of the mask (reticle) onto the glass substrate by the exposure apparatus of each of the embodiments described above, and the exposure method thereof, a development step of developing the exposed glass substrate, An etching step of removing the exposed member of the portion by etching, a resist removing step of removing the unnecessary resist after etching, a device assembling step, and an inspection step. In this case, in the lithography step, the above-described exposure method is carried out using the exposure apparatus of the above-described embodiment, and the device pattern is formed on the glass substrate, so that a highly integrated device can be manufactured with good productivity.

Further, the disclosure of all of the U.S. patent application publications and the U.S. patent specification relating to the exposure apparatuses and the like cited in the above-mentioned embodiments are referred to as a part of the description of this specification.

Industrial availability

INDUSTRIAL APPLICABILITY As described above, the moving body apparatus and the moving method of the present invention are suitable for moving objects. Further, the exposure apparatus of the present invention is suitable for exposing an object. In addition, the method of manufacturing a flat panel display of the present invention is suitable for manufacturing a flat panel display. Further, the device manufacturing method of the present invention is suitable for manufacturing micro devices.

10: liquid crystal exposure apparatus
20: substrate stage device
32: Non-contact holder
40: substrate carrier
48: scale plate
70: Substrate position measuring system
76: Y Slider
78x, 80x: X encoder head
78y, 80y: Y encoder head
82: scale plate
P: substrate

Claims (23)

A support portion for supporting the object in a non-contact manner,
A holding portion for holding the object not supported by the support portion,
A first driving unit for moving the holding unit in first and second directions intersecting with each other,
A reference member that is a reference for movement of the holding portion in the first and second directions,
A first grating portion having a measurement component in the first direction and a first head arranged to face the first grating portion and irradiating a measurement beam to the first grating portion, Wherein one side of the first head is formed in the holding portion, the other of the first grating portion and the first head is formed between the reference member and the holding portion, and the first head and the first grating member A first measuring unit for measuring positional information of the first head by the first measuring unit,
A second measuring unit for measuring position information of the other of the first lattice unit and the first head,
And a position measuring system for obtaining positional information of the holding unit holding the object with respect to the first and second directions based on the positional information measured by the first and second measuring units. The method according to claim 1,
Wherein the first driving unit relatively moves the object held by the holding unit in the second direction with respect to the supporting unit. 3. The method according to claim 1 or 2,
And a second driving unit for moving the supporting unit in the first direction,
And the first and second driving portions move the holding portion and the supporting portion in the first direction. 4. The method according to any one of claims 1 to 3,
Further comprising a moving body on which the first lattice portion and the other of the first head are formed,
Wherein the moving body is driven in the second direction at a timing different from a driving direction of the holding portion by the first driving portion in the second direction. 5. The method of claim 4,
A plurality of moving bodies are formed at predetermined intervals in the second direction,
Wherein the first measuring unit includes position information by one of the first lattice portion formed on each of the plurality of moving bodies and the other of the first head and the first lattice portion formed on the holding portion and the first head Measuring device. The method according to claim 4 or 5,
Wherein the second measuring portion has a second grating portion having a measurement component in the second direction and a second head for irradiating a measurement beam to the second grating portion, One of which is formed on the movable body, and one of the second lattice portion and the second head is formed on the reference member. The method according to claim 6,
Wherein the first measurement unit includes a plurality of first measurement systems disposed at a distance from each other in the first direction and a plurality of first measurement systems disposed apart from each other in the first direction,
The second measurement unit includes a plurality of second measurement systems disposed apart from each other in the second direction and a plurality of second measurement systems disposed apart from each other in the second direction,
Wherein the first and second measuring units are wider than the interval between a pair of adjacent measurement units, wherein the interval between the pair of adjacent measurement units is larger than the interval between the pair of adjacent measurement units. 8. The method according to any one of claims 1 to 7,
Wherein the support portion and the holding portion are formed in a non-contact manner with each other. 9. The method according to any one of claims 1 to 8,
And the support portion noncontactly supports the lower surface of the object. 10. The method according to any one of claims 1 to 9,
Wherein the holding portion includes a frame-shaped member that holds at least a part of an outer peripheral edge portion of the object. 11. A mobile communication device comprising: the mobile device according to any one of claims 1 to 10;
And a pattern forming device for forming a predetermined pattern on the object using an energy beam. 12. The method of claim 11,
Wherein the support portion has a support surface capable of supporting substantially the whole area of the object on which the pattern is formed in the object. 13. The method of claim 12,
Wherein the first driving unit relatively moves the holding unit and the supporting unit such that at least a part of the object is displaced from the supporting unit in the second direction. 14. The method according to any one of claims 11 to 13,
Wherein the object is a substrate used in a flat panel display. 15. The method of claim 14,
Wherein the substrate has a length or a diagonal length of at least one side of 500 mm or more. 14. A method of exposing an object using the exposure apparatus according to any one of claims 11 to 14,
And developing the exposed object. ≪ Desc / Clms Page number 19 > 14. A method of exposing an object using the exposure apparatus according to any one of claims 11 to 14,
And developing the exposed object. Contact support of an object by a supporting part,
Holding the object not supported by the support portion by the holding portion,
The holding portion is moved by the first driving portion in the first and second directions intersecting with each other,
A first grating portion having a measurement component in the first direction and a first head arranged to face the first grating portion and irradiating a measurement beam to the first grating portion, Wherein one of the first head is formed in the holding portion and the other of the first lattice portion and the first head is used as a reference for movement of the holding portion in the first and second directions, Measuring the position information of the first head using the first head and the first grating member by a first measuring unit formed between the first measuring unit and the first measuring unit,
Measuring the position of the other of the first lattice and the first head by the second measuring unit,
And obtaining positional information of the holding unit holding the object with respect to the first and second directions based on the positional information measured by the first and second measuring units. 19. The method of claim 18,
Wherein the moving by the first driving part includes relative movement of the object held by the holding part in the second direction with respect to the supporting part. 20. The method according to claim 18 or 19,
Wherein the moving by the first driving unit includes moving the holding unit in the first direction and moving the supporting unit in the first direction by the second driving unit. 21. The method according to any one of claims 18 to 20,
Wherein the first lattice portion and the other of the first head are formed at a different timing from the driving of the holding portion by the first driving portion in the second direction, And moving in the second direction. 22. The method of claim 21,
A plurality of moving bodies are formed at predetermined intervals in the second direction,
Wherein the position information of the first head is measured by using the first grating portion formed on each of the plurality of moving bodies and the other of the first head and the first grating portion formed on the holding portion, And the position information is measured by one of the two directions. 23. The method of claim 21 or 22,
Wherein the second measuring portion has a second grating portion having a measurement component in the second direction and a second head for irradiating a measurement beam to the second grating portion, Wherein one of the second grid and the second head is formed on the moving member, and one of the second grid and the second head is formed on the reference member.

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