KR20180052133A - Method of manufacturing a high-current and large-heat-dissipating printed circuit board - Google Patents

Method of manufacturing a high-current and large-heat-dissipating printed circuit board Download PDF

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Publication number
KR20180052133A
KR20180052133A KR1020160148499A KR20160148499A KR20180052133A KR 20180052133 A KR20180052133 A KR 20180052133A KR 1020160148499 A KR1020160148499 A KR 1020160148499A KR 20160148499 A KR20160148499 A KR 20160148499A KR 20180052133 A KR20180052133 A KR 20180052133A
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South Korea
Prior art keywords
bus bar
circuit board
substrate
manufacturing
present
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KR1020160148499A
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Korean (ko)
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신광재
양원모
김명종
이충식
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대덕지디에스 주식회사
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Publication of KR20180052133A publication Critical patent/KR20180052133A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention provides a manufacturing method of a circuit board which inserts a bus bar into a substrate to increase connection reliability and reduces a size and a weight of the substrate. The manufacturing method of a circuit board comprises: a step (a) of selectively drilling the substrate, and forming a cavity; a step (b) of inserting copper into the cavity, and forming the bus bar; a step (c) of sequentially stacking and laminating an insulating layer and a copper foil; a step (d) of forming a connection hole so that the bus bar is selectively exposed; a step (e) of performing copper plating to conduct the bus bar and the copper foil on the substrate surface; and a step (f) of selectively removing the copper foil on the substrate surface, and forming a circuit.

Description

대전류 고방열 회로기판 제조방법{METHOD OF MANUFACTURING A HIGH-CURRENT AND LARGE-HEAT-DISSIPATING PRINTED CIRCUIT BOARD}BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a high-current high-

본 발명은 회로기판(Printed Circuit Board; PCB) 제조에 관한 것으로서, 특히 대전류 고방열 회로기판에 관한 것이다. 보다 상세하게는, 대전류 공급을 위한 버스바(Bus Bar)를 기판에 내장하는 기술에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board (PCB) manufacturing method, and more particularly, to a high current and high heat dissipation circuit board. More particularly, the present invention relates to a technology for inserting a bus bar for supplying a large current into a substrate.

친환경 전기 자동차와 에너지 하베스팅(Energy Harvesting) 기술에 대한 시장이 팽창함에 따라 대전류용 회로기판의 수요가 증가하고 있다. 회로기판에 있어 대전류를 감당하기 위해서는 버스바(Bus Bar)가 사용되고 있다. As the market for environmentally friendly electric vehicles and energy harvesting technology expands, the demand for large current circuit boards is increasing. A bus bar is used in the circuit board to handle a large current.

도1a 및 도1b는 종래기술에 따라 흔히 사용되는 버스바를 개략적으로 나타낸 도면이다. 도1a 및 도1b를 참조하면, 종래기술은 전원공급장치(10)가 공급하는 전류를 버스바(20)를 통해 공급받아, 회로기판(30)은 고전류가 필요한 전류구동칩(40)에 고전류를 공급하는 방식을 사용하고 있다. Figures 1A and 1B are schematic diagrams of bus bars commonly used in accordance with the prior art. 1A and 1B, a conventional technique is a method in which a current supplied from a power supply device 10 is supplied through a bus bar 20 and a circuit board 30 is connected to a current drive chip 40 requiring a high current, Is used.

그런데 도1a 및 도1b에 도시한 종래기술은 진동 등 물리적 충격에 의해 PCB 기판(30)과 버스바(20) 접속에 불량이 발생할 수 있으며, 버스바(20)의 회로길이가 증가함에 따라 전송효율이 감소하는 문제가 발생한다. 또한, 버스바 접속부 개별 구성으로 인하여 PCB 기판의 사이즈가 커지고 기판 무게가 무거워지는 등의 기술적 한계가 있다. However, in the prior art shown in FIGS. 1A and 1B, the connection between the PCB substrate 30 and the bus bar 20 may be poor due to a physical impact such as vibration. As the circuit length of the bus bar 20 increases, The efficiency is reduced. In addition, there is a technical limitation in that the size of the PCB substrate is increased due to the individual configuration of the bus bar connection portion, and the weight of the substrate is increased.

1. 대한민국 특허공개 제10-2016-0118009호.1. Korean Patent Publication No. 10-2016-0118009. 2. 대한민국 특허공개 제10-2013-0008288호.2. Korean Patent Publication No. 10-2013-0008288. 3. 대한민국 특허공개 제10-2010-0021182호.3. Korean Patent Publication No. 10-2010-0021182.

본 발명의 제1 목적은 대전류 고방열 회로기판을 제조하는 방법을 제공하는 데 있다.A first object of the present invention is to provide a method of manufacturing a high current high heat dissipation circuit board.

본 발명의 제2 목적은 상기 제1 목적에 부가하여, 버스바를 기판 내부에 삽입하여 접속 신뢰성을 증가하고, 기판 사이즈 및 무게를 감소시키는 회로기판 제조방법을 제공하는 데 있다.A second object of the present invention is to provide a circuit board manufacturing method for inserting a bus bar into a substrate to increase connection reliability, and reduce a substrate size and weight, in addition to the first object.

상기 목적을 달성하기 위하여, 본 발명은 (a) 기판을 선택적으로 드릴하여 캐비티를 형성하는 단계; (b) 캐비티 속에 구리를 삽입하여 버스바를 형성하는 단계; (c) 절연층과 동박을 차례로 적층하고 라미네이트 하는 단계; (d) 상기 버스바가 선택적으로 노출되도록 접속홀을 형성하는 단계; (e) 동도금을 진행해서 상기 버스바와 기판 표면의 동박을 서로 통전시키는 단계; 및 (f) 기판 표면의 동박을 선택적으로 제거해서 회로를 형성하는 단계를 포함하는 회로기판 제조방법을 제공한다.According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: (a) selectively drilling a substrate to form a cavity; (b) inserting copper into the cavity to form a bus bar; (c) laminating and laminating an insulating layer and a copper foil in order; (d) forming a connection hole such that the bus bar is selectively exposed; (e) conducting copper plating to energize the bus bars and the copper foil on the surface of the substrate; And (f) selectively removing the copper foil on the substrate surface to form a circuit.

본 발명은 버스바를 기판 내부에 삽입함으로써, 접속 신뢰성을 개선함과 동시에 기판 사이즈 및 무게를 감소시키는 효과가 있다. 또한, 고전류 고방열 효과를 지니는 회로기판을 제공하는 장점이 있다. The present invention has the effect of improving the connection reliability and reducing the substrate size and weight by inserting the bus bar into the inside of the substrate. Further, there is an advantage of providing a circuit board having a high current and high heat radiation effect.

도1a 및 도1b는 종래기술에 따라 흔히 사용되는 버스바를 개략적으로 나타낸 도면.
도2a 및 도2b는 본 발명에 따라 버스바를 삽입하여 제작한 회로기판을 개략적으로 나타낸 도면.
도3은 본 발명에 따라 버스바를 삽입하여 제작한 회로기판을 예시한 도면.
도4a 내지 도4h는 본 발명에 따라 버스바를 회로기판에 내장하여 제작하는 공정을 나타낸 도면.
도5는 본 발명에 따라 제작된 배터리 전력제어기판을 예시한 도면.BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A and 1B schematically illustrate bus bars commonly used in accordance with the prior art. Fig.
2A and 2B are schematic views of a circuit board manufactured by inserting a bus bar according to the present invention.
3 is a diagram illustrating a circuit board manufactured by inserting a bus bar according to the present invention.
4A to 4H are diagrams showing a process of manufacturing a bus bar by embedding the bus bar in a circuit board according to the present invention.
Figure 5 illustrates a battery power control board fabricated in accordance with the present invention.

이하, 첨부도면 도2 내지 도4를 참조하여 본 발명을 상세히 설명한다. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings 2 to 4.

도2a 및 도2b는 본 발명에 따라 버스바를 삽입하여 제작한 회로기판을 개략적으로 나타낸 도면이다. 도2a 및 도2b를 참조하면, 본 발명은 회로기판(30) 내부에 버스바(20)를 직접 삽입하여 접속 신뢰성을 증가하고, 기판 사이즈 및 무게를 감소한다. 2A and 2B are views schematically showing a circuit board manufactured by inserting a bus bar according to the present invention. Referring to FIGS. 2A and 2B, the present invention inserts the bus bar 20 directly inside the circuit board 30 to increase connection reliability, and reduce the substrate size and weight.

도3은 본 발명에 따라 버스바를 삽입하여 제작한 회로기판을 예시한 도면이다. 도3을 참조하면, 버스바(20)가 회로기판(30) 속으로 내장되어 있고, 회로기판(30) 위에 칩(40)들이 실장되어 있어 버스바(30)로부터 전류를 공급받는다. 3 is a diagram illustrating a circuit board manufactured by inserting a bus bar according to the present invention. 3, the bus bar 20 is embedded in the circuit board 30 and the chips 40 are mounted on the circuit board 30 so that current is supplied from the bus bar 30.

도4a 내지 도4h는 본 발명에 따라 버스바를 회로기판에 내장하여 제작하는 공정을 나타낸 도면이다. 4A to 4H are views showing a process of manufacturing a bus bar by embedding the bus bar in the circuit board according to the present invention.

본 발명의 양호한 실시예로서 CCL(copper cladded laminate)를 시작재로 사용할 수 있다. 도4a를 참조하면, CCL을 시작재로 한 기판(100)을 선택적으로 드릴 해서 캐비티(110)를 형성한다. As a preferred embodiment of the present invention, a copper cladded laminate (CCL) can be used as a starting material. Referring to FIG. 4A, a cavity 110 is formed by selectively drilling a substrate 100 having a CCL as a starting material.

도4b를 참조하면, 캐비티(110) 속에 구리(Cu; 120)를 삽입한다. 캐비티(110) 속에 삽입되는 구리(Cu; 120)로써 동(Cu) 덩어리가 사용될 수 있다. 도4c를 참조하면, 기판(100) 양면에 절연층(130)과 동박(140)을 적층하고 가열 가압하여 라미네이트(laminate)를 진행한다. Referring to FIG. 4B, copper (Cu) 120 is inserted into the cavity 110. Copper (Cu) masses may be used as the copper (Cu) 120 to be inserted into the cavity 110. Referring to FIG. 4C, the insulating layer 130 and the copper foil 140 are laminated on both sides of the substrate 100, and the laminate is heated and pressed.

본 발명에 따른 절연층(130)의 양호한 실시예로서, 프리프레그 또는 레진이 사용될 수 있다. 도4d를 참조하면, 레이저 드릴 또는 기계적 드릴을 이용해서 접속홀(150)과 관통홀(160)을 제작한다. As a preferred embodiment of the insulating layer 130 according to the present invention, a prepreg or a resin can be used. Referring to FIG. 4D, a connection hole 150 and a through hole 160 are formed using a laser drill or a mechanical drill.

이어서, 동도금을 실시해서 통전을 한다. 도4e를 참조하면, 접속홀(150) 내부가 동도금으로 충진되어 있고, 관통홀(160)의 내벽이 동도금으로 피복되어 있다. 이어서 도4f를 참조하면, 사진, 현상, 식각 등 일련의 이미지 프로세스를 진행해서 기판의 양 표면에 회로를 형성한다. 도4g를 참조하면, 선택적으로 솔더레지스트(SR; 180)를 인쇄한다. 도4h를 참조하면, 패드 위에 솔더를 사용해서 칩, 모듈 등 부품(200)을 장착한다. 도5는 본 발명에 따라 제작된 배터리 전력제어기판을 예시한 도면이다. Then, copper plating is performed to conduct electricity. Referring to FIG. 4E, the inside of the connection hole 150 is filled with copper plating, and the inside wall of the through hole 160 is covered with copper plating. Referring to FIG. 4F, a series of image processes such as photo, development, etching, and the like are performed to form circuits on both surfaces of the substrate. Referring to FIG. 4G, a solder resist (SR) 180 is selectively printed. Referring to FIG. 4H, chip 200 is mounted on the pad using solder. 5 is a diagram illustrating a battery power control board fabricated in accordance with the present invention.

전술한 내용은 후술할 발명의 특허청구범위를 더욱 잘 이해할 수 있도록 본 발명의 특징과 기술적 장점을 다소 폭넓게 개선하였다. 본 발명의 특허청구범위를 구성하는 부가적인 특징과 장점들이 이하에서 상술 될 것이다. 개시된 본 발명의 개념과 특정 실시예는 본 발명과 유사 목적을 수행하기 위한 다른 구조의 설계나 수정의 기본으로서 즉시 사용될 수 있음이 당해 기술 분야의 숙련된 사람들에 의해 인식되어야 한다. The foregoing has somewhat improved the features and technical advantages of the present invention in order to better understand the claims of the invention described below. Additional features and advantages that constitute the claims of the present invention will be described in detail below. It should be appreciated by those skilled in the art that the disclosed concepts and specific embodiments of the invention can be used immediately as a basis for designing or modifying other structures to accomplish the invention and similar purposes.

또한, 본 발명에서 개시된 발명 개념과 실시예가 본 발명의 동일 목적을 수행하기 위하여 다른 구조로 수정하거나 설계하기 위한 기초로서 당해 기술 분야의 숙련된 사람들에 의해 사용될 수 있을 것이다. 또한, 당해 기술 분야의 숙련된 사람에 의한 그와 같은 수정 또는 변경된 등가 구조는 특허 청구 범위에서 기술한 발명의 사상이나 범위를 벗어나지 않는 한도 내에서 다양한 진화, 치환 및 변경이 가능하다. In addition, the inventive concepts and embodiments disclosed herein may be used by those skilled in the art as a basis for modifying or designing other structures to accomplish the same purpose of the present invention. It will be apparent to those skilled in the art that various modifications, substitutions and alterations can be made hereto without departing from the spirit or scope of the invention as defined in the appended claims.

이상과 같이, 본 발명은 버스바를 기판 내부에 삽입함으로써, 접속 신뢰성을 개선함과 동시에 기판 사이즈 및 무게를 감소시키는 효과가 있다. 또한, 고전류 고방열 효과를 지니는 회로기판을 제공하는 장점이 있다. As described above, the present invention has the effect of improving the connection reliability and decreasing the board size and weight by inserting the bus bars into the inside of the board. Further, there is an advantage of providing a circuit board having a high current and high heat radiation effect.

Claims (1)

회로기판을 제작하는 방법에 있어서,
(a) 기판을 선택적으로 드릴하여 캐비티를 형성하는 단계;
(b) 캐비티 속에 구리를 삽입하여 버스바를 형성하는 단계;
(c) 절연층과 동박을 차례로 적층하고 라미네이트 하는 단계;
(d) 상기 버스바가 선택적으로 노출되도록 접속홀을 형성하는 단계;
(e) 동도금을 진행해서 상기 버스바와 기판 표면의 동박을 서로 통전시키는 단계; 및
(f) 기판 표면의 동박을 선택적으로 제거해서 회로를 형성하는 단계
를 포함하는 회로기판 제조방법.A method of manufacturing a circuit board,
(a) selectively drilling a substrate to form a cavity;
(b) inserting copper into the cavity to form a bus bar;
(c) laminating and laminating an insulating layer and a copper foil in order;
(d) forming a connection hole such that the bus bar is selectively exposed;
(e) conducting copper plating to energize the bus bars and the copper foil on the surface of the substrate; And
(f) selectively removing the copper foil on the substrate surface to form a circuit
≪ / RTI >
KR1020160148499A 2016-11-09 2016-11-09 Method of manufacturing a high-current and large-heat-dissipating printed circuit board KR20180052133A (en)

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