KR20180049943A - Functional circuit protection contactor - Google Patents

Abstract

Provided is a functional contactor. According to one embodiment of the present invention, the functional contactor includes: a conductive elastic part having elasticity and making electrical contact with one of a circuit board of an electronic device, a bracket coupled to the circuit board, and a conductor contactable with a human body; a substrate including a plurality of dielectric layers; and a functional element including a first electrode electrically connected in series to the conductive elastic part, and a second electrode disposed opposite to the first electrode while being spaced by a predetermined distance from the first electrode. In this case, the dielectric layers are disposed between the first electrode and the second electrode, a first dielectric layer, a second dielectric layer, and a third dielectric layer are sequentially laminated at a top of the second electrode, and the second dielectric layer is formed of sintered ceramic having a dielectric constant higher than dielectric constants of the first dielectric layer and the third dielectric layer. Accordingly, the present invention is easy to manufacture and suitable for mass production, so that a manufacturing cost and a process time are reduced so as to improve efficiency of a manufacturing process. In addition, alignment and stable coupling of the conductive elastic part are facilitated so as to improve reliability of a product, and performance deterioration of the functional element implemented by using a large-area substrate is compensated, so that the mass production is possible while properties of the product are improved.

Description

{Functional circuit protection contactor}

The present invention relates to a contactor for an electronic device such as a smart phone, and more particularly, to a contactor that can be easily manufactured while using a fired ceramic having a high dielectric constant.

In recent portable electronic devices, there is an increasing tendency to adopt a metal housing to improve esthetics and robustness. Such a portable electronic device alleviates an impact from the outside and simultaneously penetrates into the portable electronic device or reduces the electromagnetic waves leaked from the portable electronic device and provides an external housing and a portable electronic device for electrical contact between the antenna disposed in the external housing and the internal circuit board. A conductive elastic part such as a conductive gasket or a conductive clip is used between the internal circuit boards of the electronic device.

However, since the conductive elastic part can form an electrical path between the external housing and the internal circuit board, when static electricity having a high voltage instantaneously flows through a conductor such as an outer metal housing, the conductive elastic part Static electricity may enter the internal circuit board and cause damage to circuits such as IC. If leakage current generated by AC power is transmitted to the external housing along the ground of the circuit, it may cause discomfort to the user. It causes an electric shock which can be applied.

A protective element for protecting the user from such static electricity or leakage current is provided together with a conductive elastic part for connecting the metal housing and the circuit board. Depending on the use of a conductor such as a metal case, There is a need for a functional contactor having various functions for protecting a circuit in a device or for smoothly transmitting a communication signal.

On the other hand, since the protective element used in the conventional functional contactor is made of a fired ceramic, it is difficult to manufacture by applying complicated and various electrode structures and mass production is not easy, The mass production plan is urgent.

In addition, in the process of bonding the conductive elastic part and the protection element by soldering, since the two parts are individually bonded, it is difficult to manufacture them. In particular, since both parts are small, It is difficult to improve it.

KR 2007-0109332A (Released Nov. 15, 2007)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a functional contactor capable of mass production by implementing a functional device using a fired ceramic having a high dielectric constant and a large area substrate.

Another object of the present invention is to provide a functional contactor which is easy to manufacture by performing a soldering process of a conductive elastic part using a large area substrate provided with functional devices.

In order to solve the above-mentioned problems, the present invention provides an electronic device comprising: a conductive elastic part having an elastic force to be in electrical contact with any one of a circuit board of an electronic device, a bracket coupled to the circuit board, and a human- A substrate made of a plurality of dielectric layers; And a functional element including a first electrode electrically connected in series to the conductive elastic portion, and a second electrode oppositely disposed at a predetermined distance from the first electrode. Here, the plurality of dielectric layers are disposed between the first electrode and the second electrode, and the first dielectric layer, the second dielectric layer, and the third dielectric layer are sequentially stacked from the upper side of the second electrode, And a sintered ceramic having a dielectric constant higher than that of the first dielectric layer and the third dielectric layer and having a high dielectric constant.

According to a preferred embodiment of the present invention, the second dielectric layer may be made of low temperature co-fired ceramic (LTCC) or a varistor material.

The varistor material may include any one of a semiconductive material containing at least one of ZnO, SrTiO ₃ , BaTiO ₃ and SiC, or a Pr and Bi-based material.

In addition, the first dielectric layer and the third dielectric layer may be made of FR4 or polyimide (PI).

The first dielectric layer and the third dielectric layer may be made of materials having different dielectric constants.

In addition, any one of the first dielectric layer and the third dielectric layer may be made of polyimide (PI), and the other may be made of FR4.

Further, between the first dielectric layer and the second dielectric layer and between the second dielectric layer and the third dielectric layer may be laminated via an insulating adhesive layer.

The first electrode and the second electrode may be formed on a top surface and a bottom surface of the substrate.

The first electrode and the second electrode may be formed on the entire upper and lower surfaces of the substrate.

The functional device may include an electric shock prevention function for blocking a leakage current of an external power source flowing from the ground of the circuit board of the electronic device, a communication signal transmitting function for passing a communication signal flowing into the conductive case or from the circuit board, And an ESD protection function for allowing the static electricity to pass therethrough without causing insulation breakdown upon the introduction of static electricity from the conductive case.

The conductive elastic part may be any one of a conductive gasket, a silicone rubber pad, and a clip-shaped conductor having elasticity.

In addition, the conductive elastic part may be in line contact or point contact so as to reduce galvanic corrosion.

The functional contactor may be formed by cutting a plurality of conductive elastic portions on a large-area substrate having a plurality of the functional elements, each of the plurality of conductive elastic portions being soldered on the large-area substrate, and then cutting into unit sizes.

In addition, the second dielectric may be coupled between the third dielectric layer on which the first electrode is formed and the first dielectric layer on which the second electrode is formed, through the insulating adhesive layer.

According to the present invention, by forming a functional element electrode using a large-area substrate and realizing a fired ceramic with a high dielectric constant as a part of the substrate, it is easy to manufacture and suitable for mass production, Thereby improving the efficiency of the manufacturing process.

Also, the present invention can improve the reliability of a product because the conductive elastic part can be easily aligned and stably bonded by bonding the conductive elastic part by soldering on a large-area substrate provided with a functional device.

Further, by using a fired ceramic having a high dielectric constant, the present invention can compensate for deterioration in performance of a functional device implemented using a large-area substrate, thereby enabling mass production and improving the characteristics of the product.

1 is a cross-sectional view of an example of a functional contactor according to an embodiment of the present invention,
Figure 2 is a perspective view of the functional contactor of Figure 1,
3 is a cross-sectional view of another example of a functional contactor according to an embodiment of the present invention,
4 is a perspective view illustrating a process of forming a substrate in a manufacturing process of a functional contactor according to an embodiment of the present invention;
5 is a perspective view illustrating an example of a process in which a conductive elastic part is soldered during a manufacturing process of a functional contactor according to an embodiment of the present invention,
FIG. 6 is a perspective view illustrating another example of a process of soldering conductive elastic parts in a manufacturing process of a functional contactor according to an embodiment of the present invention. Referring to FIG.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

The functional contactor 100 according to an embodiment of the present invention includes a conductive elastic part 110, a substrate 120, and a functional device 130, as shown in FIGS.

Such a functional contactor 100 is for electrically connecting a conductive case such as an external metal case to a circuit board or a conductive bracket electrically coupled to a circuit board on one side in a portable electronic device.

That is, the functional contactor 100 may be configured such that the conductive elastic part 110 is brought into contact with the circuit board or the conductive bracket and the substrate 120 can be coupled to the conductive case, And the substrate 120 may be bonded to the circuit board.

For example, if the functional contactor 100 is of the SMT type, i.e., coupled through soldering, the substrate 120 is coupled to the circuit board of the portable electronic device and, if it is an adhesive layer type, When coupled, the substrate 120 may be coupled to the conductive case.

Meanwhile, the portable electronic device may be in the form of a portable electronic device that is portable and portable. For example, the portable electronic device may be a portable terminal such as a smart phone, a cellular phone, and the like, and may be a smart watch, a digital camera, a DMB, an electronic book, a netbook, a tablet PC, Such electronic devices may comprise any suitable electronic components including antenna structures for communication with external devices. In addition, it may be a device using local area network communication such as WiFi and Bluetooth.

Here, the conductive case may be an antenna for communication between the portable electronic device and an external device. Such a conductive case may be provided, for example, to partially surround or partially surround the sides of the portable electronic device.

The conductive elastic part 110 is in electrical contact with any one of the circuit board of the electronic device, the bracket coupled to the circuit board, and the human contactable conductor, and has an elastic force.

Such a conductive elastic part 110 is shown and described as being a clip-shaped conductor having an elastic force in FIG. 1, but is not limited thereto, and may be a conductive gasket, or a silicone rubber pad.

Here, when the conductive elastic part 110 is in contact with the circuit board, the conductive bracket, and the conductor, the conductive elastic part 110 can be contracted toward the substrate 120 by the pressing force, If separated, it can be restored to its original state by its elastic force.

On the other hand, when the conductive elastic part 110 is pressed, galvanic corrosion occurs due to a potential difference between dissimilar metals. At this time, in order to minimize galvanic corrosion, it is preferable that the contact area of the conductive elastic part 110 is made small.

That is, the conductive elastic part 110 is not only in surface contact but also preferably in line contact and / or point contact. At this time, when the conductive elastic part 110 is a conductive gasket or a silicone rubber pad, it may be surface-contacted, and in the case of a clip-shaped conductor, it may be in line contact and / or point contact.

For example, when the conductive elastic portion 110 is a clip-shaped conductor, the clip-shaped conductor includes the contact portion 111, the bent portion 112, and the terminal portion 113.

Here, the clip-shaped conductor may be a C-clip having a roughly "C" shape. Since the clip-shaped conductor 110 is in line contact or point contact, galvanic corrosion resistance can be excellent.

The contact portion 111 has a curved shape and can be in electrical contact with either the circuit board or the conductive bracket, and the conductive case. The bent portion 112 extends from the contact portion 111 and can have an elastic force. The terminal portion 113 may be a terminal electrically connected to the substrate 120.

The contact portion 111, the bent portion 112, and the terminal portion 113 may be integrally formed of a conductive material having an elastic force.

The substrate 120 is composed of a plurality of dielectric layers 121 to 123. For example, the substrate 120 may be composed of three dielectric layers 121 to 123. The three dielectric layers 121 to 123 are disposed between the first electrode 131 and the second electrode 132 and are sequentially stacked from the top of the second electrode 132. The first dielectric layer 121, The second dielectric layer 122 may be disposed on the upper side of the first dielectric layer 121 and the third dielectric layer 123 may be disposed on the upper side of the second dielectric layer 122 .

Here, the second dielectric layer 122 is made of a sintered ceramic having a dielectric constant higher than that of the first dielectric layer 121 and the second dielectric layer 122. In one example, the second dielectric layer 122 may be comprised of a low temperature co-fired ceramic (LTCC) or varistor material. The second dielectric layer 122 constitutes a part of the functional device 130 as described later.

In addition, the first dielectric layer 121 and the third dielectric layer 123 may be formed of FR4 or polyimide (PI) so that the first dielectric layer 121 and the third dielectric layer 123 can be manufactured through a large-area substrate and electrode formation is facilitated. Here, the first dielectric layer 121 and the third dielectric layer 123 may be formed of materials having different dielectric constants depending on the characteristics of the electrodes to be formed.

That is, any one of the first dielectric layer 121 and the third dielectric layer 123 may be made of polyimide (PI), and the other may be made of FR4. For example, the first dielectric layer 121 may be made of polyimide (PI), and the third dielectric layer 123 may be made of FR4.

At this time, the first dielectric layer 121 and the second dielectric layer 122 and the second dielectric layer 122 and the third dielectric layer 123 may be laminated via an insulating adhesive layer. That is, since the first dielectric layer 121 and the third dielectric layer 123 and the second dielectric layer 122 disposed therebetween are made of different materials, they can be laminated through the insulating adhesive layer.

However, the lamination of the plurality of dielectric layers 121 to 123 is not limited to this, and the lamination method is not particularly limited as long as the bonding force between the dielectric layers can be ensured.

Since the dielectric layer of the substrate is provided on both sides of the fired ceramic as described above, electrodes can be easily formed using the substrate manufacturing process, and a large-area substrate can be used, so that the functional device 130 can be easily manufactured and mass- have.

Meanwhile, the substrate 120 may serve as a guide as a medium for fixing the conductive elastic part 110 and the functional device 130 and coupling the conductive elastic part 110 and the functional device 130 to the conductive case. That is, the substrate 120 can provide stable bonding through the conductive adhesive layer or the like even when soldering is difficult when the conductive elastic part 110 and the functional device 130 are coupled.

The functional element 130 is electrically connected to the conductive elastic part 110 in series, and is integrally formed with the substrate 120. Here, the functional device 130 may have a function for protecting a user or an internal circuit.

That is, the functional device 130 can block the leakage current of the external power source flowing from the ground of the circuit board of the electronic device. At this time, the functional device 130 may be configured such that the breakdown voltage Vbr or the breakdown voltage thereof is larger than the rated voltage of the external power supply of the electronic device. Here, the rated voltage may be a standard rated voltage for each country, for example, 240V, 110V, 220V, 120V, and 100V.

In addition, when the conductive case has an antenna function, the functional device 130 functions as a capacitor to cut off a leakage current of an external power source and to pass a communication signal flowing from a conductor or a circuit board.

Further, the functional device 130 can pass the static electricity (ESD) flowing from the conductive case without being broken. At this time, the functional device 130 may be configured such that the breakdown voltage Vbr thereof is smaller than the insulation breakdown voltage Vcp of the substrate 120.

Accordingly, the functional contactor 100 can block the leakage current of the external power source from the circuit board from being transmitted to the conductive case by electrically connecting the conductive case and the circuit board to the communication signal, the electrostatic discharge (ESD) .

The functional device 130 includes a first electrode 131, a second electrode 132, and a second dielectric layer 122, as shown in FIGS. 1 and 2, for example.

The first electrode 131 is disposed on the third dielectric layer 123 to be electrically connected to the conductive elastic part 110. The first electrode 131 may be formed on a part of the upper surface of the third dielectric layer 123.

The first electrode 131 may have a size similar to that of the lower surface of the conductive elastic part 110 to facilitate alignment and engagement of the conductive elastic part 110 when the conductive elastic part 110 is soldered. have.

The second electrode 132 is arranged opposite to the first electrode 131 at a predetermined distance and disposed below the first dielectric layer 121. The second electrode 132 may be formed on a lower surface of the first dielectric layer 121. In addition, the second electrode 132 may have the same size as the first electrode 131.

The second dielectric layer 122 is disposed between the first dielectric layer 121 and the second dielectric layer 122. The second dielectric layer 122 is made of a dielectric material having a larger dielectric constant than the first dielectric layer 121 and the third dielectric layer 123 provided on the upper and lower sides of the second dielectric layer 122.

The second dielectric layer 122 may be formed of a sintered ceramic, for example, a low temperature co-fired ceramic (LTCC) or a varistor material. Here, the varistor material may include any one of a semiconductive material containing at least one of ZnO, SrTiO ₃ , BaTiO ₃ and SiC, or a Pr and Bi-based material.

The characteristic of the functional device 130 can be improved by implementing the functional device 130 using the high-dielectric material such as the sintered ceramic. In other words, when a substrate manufacturing process is used for mass production, since the functional element 130 can not provide the required dielectric constant depending on the material of the dielectric layer constituting the substrate, 120, the characteristics of the functional device 130 can be improved.

The functional element 130 has a dielectric constant of the second dielectric layer 122 such that the internal voltage of the functional element 130 is larger than the rated voltage of the external power source of the electronic device and a capacitance that allows the communication signal flowing from the conductor to pass therethrough, ) And the second electrode 132, and the respective areas can be set.

The functional element 130 configured as described above can prevent damage to the user or damage to the internal circuit such as electric shock through a conductor such as a conductive case. For example, when the functional device 130 flows from the ground of the circuit board of the electronic device, since the internal pressure between the first electrode 131 and the second electrode 132 is larger than the rated voltage of the external power source, It is possible to cut off the leakage current without passing the leakage current.

In addition, when the communication signal is input from the conductor or the circuit board, the functional device 130 may function as a capacitor to perform a communication signal transfer function.

In addition, when the electrostatic discharge (ESD) flows from the conductor, since the breakdown voltage between the first electrode 131 and the second electrode 132 is larger than the breakdown voltage therebetween, Electrostatic discharge (ESD) can be passed. Such an electrostatic discharge (ESD) is configured to be transmitted to the ground portion of the circuit board, thereby protecting the internal circuit.

3, the functional contactor 200 may include a first electrode 231 and a second electrode 232 in order to increase the capacitance. That is, the first electrode 231 may be formed on the entire upper surface of the third dielectric layer 123, and the second electrode 232 may be formed on the entire lower surface of the first dielectric layer 121.

Since the functional layers 130 and 230 are provided on both sides of the sintered ceramics, it is possible to manufacture the functional layers 130 and 230 by using the substrate manufacturing process as compared with the conventional functional devices formed only by the sintering process. It is easy to manufacture, and when a large-area substrate is used, it can be suitable for mass production. Therefore, the manufacturing cost and the process time can be shortened, and the efficiency of the manufacturing process can be improved.

Such functional contactors 100 and 200 can be manufactured using a large area substrate. For example, the functional contactors 100 and 200 may include a plurality of functional elements 130 on a large-area substrate 120a, a plurality of conductive elastic portions 110 soldered on the large-area substrate 120a, As shown in FIG.

The manufacturing process of the functional contactors 100 and 200 will be described in detail with reference to FIGS. 4 to 6. FIG.

First, as shown in FIG. 4, a large-area substrate 120a corresponding to each of the plurality of dielectric layers 121 to 123 can be formed. At this time, the second electrode 132 may be formed on the lower surface of the first dielectric layer 121 through the substrate manufacturing process, and the first electrode 131 may be formed on the upper surface of the third dielectric layer 123 . Here, the first electrode 131 and the second electrode 132 may be formed to have a size corresponding to the conductive elastic part 110 (see FIG. 5).

Alternatively, the first electrode 231 and the second electrode 232 may have the same size as the upper surface of the unit third dielectric layer 123 and the lower surface of the unit first dielectric layer 121 6).

Thus, the first electrode 231 and the second electrode 232 are formed on the upper side of the third dielectric layer 123 and the lower side of the first dielectric layer 121 through the substrate manufacturing process, thereby simplifying the process.

Here, the plurality of dielectric layers 121 to 123 may be sequentially stacked (see FIG. 4). That is, the second dielectric layer 122 is disposed on the upper surface of the first dielectric layer 121 where the second electrode 132 is not formed, and the second dielectric layer 122 is formed on the second dielectric layer 122, 3 dielectric layer 123 can be disposed. The second dielectric layer 122 may be coupled between the third dielectric layer 123 having the first electrode 131 and the first dielectric layer 121 having the second electrode 132 formed thereon through an insulating adhesive layer.

As described above, by implementing the functional device 130 on the substrate 120 by using the large-area substrate 120a, it is easy to manufacture and can be mass-produced. Moreover, since the functional device 130 is realized in the process of manufacturing the substrate 120, the process can be simplified compared with the case where the functional device 130 is coupled to the guide.

5 and 6, a conductive elastic part 110 is formed on a large-area substrate 120a including a plurality of dielectric layers 121 to 123 and provided with functional devices 130 through soldering can do.

That is, a plurality of conductive elastic portions 110 (110) are formed on the first electrodes 131 via solder in a state where a plurality of first electrodes 131 are formed on the upper surface of the large-area substrate 120a provided with the functional elements 130, The conductive elastic portion 110, the substrate 120, and the functional device 130 can be integrally formed (see FIG. 5).

6), that is, when the first electrode 231 is formed to be larger than the conductive elastic part 110, the conductive elastic part 110 can be easily aligned with the conductive elastic part 110. In addition, when the first electrode 231 is integrally formed A stopper for alignment of the conductive elastic part 110 can be provided on the first electrode 231. [

Since the plurality of conductive elastic portions 110 are soldered to the plurality of first electrodes 131 on the large-area substrate 120a or the first electrode 231 formed integrally with the large-area substrate 120a through the solder, Alignment and soldering of the conductive elastic part 110 can be easily and accurately performed, thereby improving the reliability of the product as well as the efficiency of the manufacturing process.

At this time, by cutting the large-area substrate 120a along the cut line 120b having a unit size, the unit functional contactors 100 and 200 can be mass-produced.

Since the implementation of the plurality of functional devices 130 and the soldering of the conductive elastic part 110 can be simultaneously carried out in a large quantity using the large-area substrate 120a as described above, it is possible to mass-produce the functional contactors 100 and 200 .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: Functional Contactor 110: Conductive Elastic Portion
120: substrate 121: first dielectric layer
122: second dielectric layer 123: third dielectric layer
130, 230: Functional elements 131, 231: First electrode
132, 232: second electrode 120a: large area substrate
120b: cutting line

Claims (14)

A conductive elastic part having an elastic force that is in electrical contact with any one of a circuit board of the electronic device, a bracket coupled to the circuit board, and a human-contactable conductor;
A substrate made of a plurality of dielectric layers; And
And a functional element including a first electrode electrically connected in series to the conductive elastic part, and a second electrode oppositely disposed at a predetermined distance from the first electrode,
Wherein the plurality of dielectric layers are disposed between the first electrode and the second electrode, the first dielectric layer, the second dielectric layer, and the third dielectric layer are sequentially laminated from the upper side of the second electrode, 1 dielectric layer and a sintered ceramic having a dielectric constant higher than that of the third dielectric layer and having a high dielectric constant. The method according to claim 1,
Wherein the second dielectric layer is comprised of a low temperature co-fired ceramic (LTCC) or varistor material. 3. The method of claim 2,
The varistor material is functional contactor containing ZnO, SrTiO _3, BaTiO _3, semiconductive material, or Pr, and either one of Bi-based material comprising at least one of SiC. The method according to claim 1,
Wherein the first dielectric layer and the third dielectric layer are made of FR4 or polyimide (PI). 5. The method of claim 4,
Wherein the first dielectric layer and the third dielectric layer are made of a material having a different dielectric constant from each other. 6. The method of claim 5,
Wherein one of the first dielectric layer and the third dielectric layer is made of polyimide (PI), and the other is made of FR4. The method according to claim 1,
The first dielectric layer and the second dielectric layer, and the second dielectric layer and the third dielectric layer are laminated via an insulating adhesive layer. The method according to claim 1,
Wherein the first electrode and the second electrode are formed on a top surface and a bottom surface of the substrate. The method according to claim 1,
Wherein the first electrode and the second electrode are formed on the entire upper and lower surfaces of the substrate. The method according to claim 1,
Wherein the functional device has an electric shock prevention function for blocking a leakage current of an external power source flowing from a ground of a circuit board of the electronic device, a communication signal transmitting function for passing a communication signal flowing into the conductive case or from the circuit board, And a function of at least one of an ESD protection function for allowing the static electricity to pass therethrough without causing insulation breakdown upon introduction of static electricity from the conductive case. The method according to claim 1,
Wherein the conductive elastic portion is any one of a conductive gasket, a silicone rubber pad, and a clip-shaped conductor having elasticity. The method according to claim 1,
Wherein the conductive elastic portion is in line or point contact to reduce galvanic corrosion. The method according to claim 1,
Wherein the functional contactor is formed by cutting a plurality of electrically conductive elastic portions on a large-area substrate having a plurality of functional elements, each of the plurality of electrically conductive elastic portions being soldered on the large-area substrate and then cut to a unit size. The method according to claim 1,
Wherein the second dielectric is coupled through the insulating adhesive layer between the third dielectric layer on which the first electrode is formed and the first dielectric layer on which the second electrode is formed.

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