KR20180036544A - Imprint apparatus, and method of fabricating article - Google Patents

Abstract

The present invention provides an imprint apparatus for performing an imprint processing to form a pattern of an imprint material on a substrate by using a mold. The imprint apparatus comprises: a holder support unit which holds the mold to support the same; an actuator which provides a force to a side surface of the mold held and supported by the holder support unit; a first measurement unit which measures a force provided to the side surface of the mold by the actuator; a second measurement unit which measures a position of the mold held and supported by the holder support unit; a control unit which controls a target force value that corresponds to a force to be provided by the actuator on the side surface of the mold, and controls an operation amount to be entered into the actuator; an input unit which converts a target position value corresponding to a position in which the mold should be positioned in the holder support unit, and an output difference of the second measurement unit, into a force operation amount and inputs the same into the control unit. The control unit, based on the operation amount entered from the input unit, controls an operation amount to be entered into the actuator.

Description

[0001] IMPRINT APPARATUS AND METHOD OF FABRICATING ARTICLE [0002]

The present invention relates to an imprint apparatus and a method of manufacturing an article.

Demand for miniaturization of semiconductor devices has progressed, and in addition to conventional photolithography techniques, imprint technology capable of forming fine patterns (structures) of several nanometers order on a substrate has been attracting attention. In the imprint technique, an imprint material which is uncured on a substrate is supplied (applied), and the imprint material and the mold are brought into contact with each other to form a pattern of the imprint material corresponding to the fine irregular pattern formed on the mold, Processing technology.

In the imprint technique, there is a photocuring method as one of the hardening methods of the imprint material. The photo-curing method is a method of forming a pattern of an imprint material on a substrate by irradiating light with the imprint material supplied to the shot region on the substrate in contact with the mold to cure the imprint material and separating the mold from the cured imprint material .

When the pattern of the mold is overlapped with the pattern (base) formed on the substrate, the mold and the substrate are relatively moved based on the relative positions of the mark formed on the mold and the mark formed on the substrate, thereby correcting the shift in the shift direction and the rotational direction have. Further, by deforming the mold (pattern), the shape errors such as magnification, skew, trapezoid, arch shape, and failure are corrected.

In order to achieve high accuracy of superposition of the pattern of the mold and the base, a device for deforming the mold with accuracy of several nanometers or less is required. Such an apparatus includes an actuator and a sensor for changing the pattern into an arbitrary shape by applying an external force to the mold, and is disposed at a plurality of places so as to surround the outer periphery of the mold. For example, an imprint apparatus having an actuator between a side surface of a mold and a support structure and a force sensor between the actuator and the support structure has been proposed in Japanese Patent Application Laid-Open No. 2009-141328 and Japanese Patent No. 4573873 . In such an imprint apparatus, the compressive force applied to the side surface of the mold from the actuator is detected by the force sensor and feedback control is performed.

However, in the imprint apparatus, a shift in the mold and a displacement in the rotational direction occur due to an external force exerted on the mold in a stamping step of bringing the mold into contact with the imprint material on the substrate or a mold releasing step of separating the mold from the imprint material on the substrate . In this case, in principle, the mold can not be returned to the original position in the feedback control using the force sensor as described above.

The displacement of the mold causes unintentional deformation (distortion) in the mold due to friction between the mold and the holding portion (chuck) holding the mold, thereby causing a reduction in the overlapping accuracy. In addition, since the relative positional deviation between the mold and the substrate immediately after the stamping step is increased, the amount of movement of the mold and the substrate required for alignment (alignment) between the mold and the substrate becomes large, thereby affecting the alignment time. Further, since the spring characteristic of the imprint material acts between the mold and the substrate, a force proportional to the movement amount of the mold or the substrate required for alignment is applied to the mold, thereby causing deformation (distortion) in the mold.

INDUSTRIAL APPLICABILITY The present invention provides an imprint apparatus which is advantageous in suppressing positional deviation of a mold.

An imprint apparatus according to one aspect of the present invention is an imprint apparatus for performing an imprint process for forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus comprising: a holding support section for holding the mold; A first measuring unit for measuring a force applied to the side surface of the mold from the actuator; a second measuring unit for measuring a position of the mold held by the holding unit; A control unit for controlling a manipulated variable to be input to the actuator based on a force target value corresponding to a force to be given to the side surface of the mold and an output of the first measuring unit; The difference between the position target value corresponding to the target position and the output of the second measuring unit Wherein the control unit controls the manipulated variable to be input to the actuator based on the manipulated variable input from the input unit.

Further objects or other aspects of the present invention will be apparent from the following description of preferred embodiments with reference to the accompanying drawings.

1 is a schematic view showing a configuration of an imprint apparatus as one aspect of the present invention.
Fig. 2 is a schematic view showing a mold, an actuator, a first measuring section and a second measuring section of the imprint apparatus shown in Fig. 1 in the Z-axis direction. Fig.
3 is a block diagram showing a control system relating to the correction of the mold shape of the imprint apparatus shown in Fig.
4 is a flow chart for explaining the operation of the imprint apparatus shown in Fig.
5 (a) to 5 (f) are diagrams for explaining a method of manufacturing an article.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The same reference numerals throughout the drawings denote the same members, and a repeated description thereof will be omitted.

1 is a schematic view showing a configuration of an imprint apparatus 100 as one aspect of the present invention. The imprint apparatus 100 is used in a manufacturing process of a semiconductor device and is a lithography apparatus that performs an imprint process for forming a pattern of an imprint material on a substrate by using a mold. In the present embodiment, the imprint apparatus 100 forms the pattern of the cured product transferred with the concave-convex pattern of the mold by bringing the imprint material supplied on the substrate into contact with the mold and imparting curing energy to the imprint material.

In the imprint material, a curable composition (sometimes referred to as uncured resin) is used which is cured by imparting curing energy. As curing energy, electromagnetic waves, heat, etc. are used. As the electromagnetic wave, for example, light such as infrared rays, visible light, and ultraviolet rays whose wavelength is selected from the range of 10 nm to 1 mm is used.

The curable composition is a composition which is cured by irradiation of light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as required. The non-polymer compound is at least one member selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

The imprint material may be imparted as a film on the substrate by a spin coater or a slit coater. The imprint material may be provided on the substrate by a liquid ejection head in a droplet shape or an island shape or a film shape formed by connecting a plurality of droplets. The viscosity (viscosity at 25 캜) of the imprint material is, for example, from 1 mPa s to 100 mPa s.

1, the imprint apparatus 100 includes an irradiation unit 1, a mold holding unit 4, an actuator 5, a first measuring unit 6, a second measuring unit 7, A substrate stage 9, a supply unit 10, an alignment measurement unit 11, and a control unit 15.

The irradiating unit 1 irradiates the imprint material on the substrate with ultraviolet rays via the mold 2. The irradiation unit 1 includes, for example, a light source and a plurality of optical elements for adjusting ultraviolet rays from the light source to a state suitable for imprint processing.

The mold 2 has a rectangular outer shape and is a mold in which a pattern to be transferred to the imprint material on the substrate is formed in a three-dimensional shape on the surface facing the substrate 8. [ The surface of the pattern of the mold 2 is processed in a high planar view in order to maintain adhesion with the imprint material (substrate 8) on the substrate. The mold 2 is made of a material which transmits ultraviolet rays such as quartz.

The mold retention support portion 4 includes a chuck or the like for pulling the mold 2 by attraction force or static electricity, and holds the mold 2. The mold holding portion 4 is driven by the mold driving portion. The mold driving section drives the mold holding section 4 in the Z axis direction in order to contact the mold 2 with the imprint material on the substrate or to separate the mold 2 from the imprint material on the substrate.

The actuator 5 (mold deforming mechanism) imparts a force (compressive force) to the side surface of the mold 2 held by the mold holding portion 4 and deforms the pattern of the mold 2. [ The first measuring unit 6 includes a force sensor such as a load cell or a strain gauge and measures the force applied to the side surface of the mold 2 from the actuator 5. [ The second measuring section 7 includes a displacement sensor and measures a position (side displacement) of the side surface of the mold 2 held by the mold holding section 4. [

The supply unit 10 (dispenser) supplies (applies) the imprint material to the substrate. In the present embodiment, the imprint material has a property of being cured by irradiation of ultraviolet rays (photo-curable property). The imprint material is appropriately selected depending on the kind of the semiconductor device to be manufactured. The substrate stage 9 is a stage that holds the substrate 8 by vacuum suction and is freely movable in the XY plane.

The alignment measurement section 11 includes a measurement light source 12 such as a He-Ne laser that emits light of a wavelength that does not harden the imprint material on the substrate, and a detector 13 such as a CCD image sensor. The alignment measuring section 11 is used when the pattern of the mold 2 and the pattern (base) formed on the substrate 8 are overlapped. The alignment measurement section 11 irradiates light from the measurement light source 12 to the alignment marks formed on the mold 2 and the substrate 8 and irradiates the interference pattern formed by the light from these marks to the detector 13 And the relative positions of the marks are measured.

The control unit 15 includes a CPU, a memory, and the like, and controls the entire operation of the imprint apparatus 100. The control unit 15 controls each section of the imprint apparatus 100 in a general manner to perform the imprint processing. In addition, the control unit 15 controls processing relating to alignment of the mold 2 and the substrate 8 (alignment). For example, positional deviations of the mold 2 and the substrate 8 in the X-axis direction, the Y-axis direction, and the rotational direction are obtained from the measurement results (relative positions of the alignment marks) of the alignment measurement section 11, The positional deviation between the mold 2 and the substrate 8 is corrected. The shape errors such as magnification, skew, trapezoid, arch shape, failure, etc. between the mold 2 and the substrate 8 are obtained by deforming the pattern of the mold 2 by the actuator 5, . As the control relating to the correction of the shape of the mold 2 by the actuator 5, open control and feedback control can be considered. The open control is carried out in such a manner that the mold 2 is deformed before the mold 2 is brought into contact with the imprint material on the substrate, for example, based on the shape correction amount obtained from the measurement result of the pattern formed on the substrate 8 by the imprinting process, . The feedback control is a control for deforming the mold 2 in real time based on the measurement result of the alignment measurement section 11. [

2 is a schematic view showing the mold 2, the actuator 5, the first measuring portion 6 and the second measuring portion 7 in the Z-axis direction. The actuator 5 for the mold 2, (6) and the second measurement section (7). At the center of the mold 2, a pattern 20 to be transferred to the imprint material on the substrate is formed. The pattern 20 includes an alignment mark 21 for measuring a relative position with respect to the alignment mark formed on the substrate 8.

2, a plurality of actuators 5 are arranged so as to surround the mold 2, that is, to oppose each of the four side faces 2a, 2b, 2c and 2d of the mold 2. [ In the present embodiment, four actuators 5 are disposed on one side surface (side surfaces 2a to 2d) of the mold 2, respectively. Each of the actuators 5 is supported by a mold holding portion 4 for holding the mold 2. In the actuator 5, generally, a piezo actuator having a small heating value and excellent response is used. Each of the actuators 5 is provided with a first measuring portion 6 for measuring a force applied to the side surface of the mold 2 from the actuator 5. [

The second measuring portion 7 for measuring the position of the side surface of the mold 2 is supported by the mold holding portion 4. [ At least three second measuring portions 7 are arranged on two side surfaces of the four sides 2a to 2d of the mold 2 which are perpendicular to each other. In other words, the second measuring portion 7 measures two positions in the side face (first side face) of the mold 2 and one position in the side face (second side face) perpendicular to this side face And at least three measurement axes. Thus, the second measuring unit 7 measures the positional deviation X in the X-axis direction of the mold 2, the positional deviation Y in the Y-axis direction of the mold 2, and the positional deviation Qz in the rotational direction of the mold 2 . 2, two second measuring portions 7a and 7b are disposed on the side surface 2b of the mold 2 along the Y-axis direction, and the X-axis of the mold 2 One second measuring portion 7c is disposed with respect to the side surface 2a along the direction, but the present invention is not limited thereto. For example, one second measuring portion 7 may be disposed on the side surface 2b of the mold 2, and two second measuring portions 7 may be disposed on the side surface 2a of the mold 2 Two second measuring portions 7 may be arranged for each of the side surfaces 2a and 2a of the mold 2. [

Fig. 3 is a block diagram showing a control system relating to the correction of the shape of the mold 2 in the control unit 15. Fig. This control system is composed of a force control loop (minor loop) for performing force control and a position control loop (major loop) for position control.

The force control loop controls the actuator 5 based on the force target value corresponding to the force to be given to the side surface of the mold 2 by the actuator 5 and the output of the first measuring section 6. [ (Functioning as a control unit). The position control loop also converts the difference between the position target value corresponding to the position at which the mold 2 should be positioned and the output of the second measurement section 7 in the mold retention section 4 into the manipulated variable of the force, Input to the loop (functioning as an input unit). The force control loop controls the manipulated variable input to the actuator 5 based on the manipulated variable input from the position control loop.

First, the force control loop will be described. The force control loop is configured independently for each of the actuators 5 (16 axes in this embodiment). The shape target value for setting the mold 2 to a desired shape is input to the force target value generating section 301 as a correction amount (deformation amount) for each shape component such as magnification, skew, trapezoid, and failure. The shape target value may be a correction amount for correcting the shape error obtained from the measurement result of the pattern formed on the substrate 8 by the imprinting process by a measuring device such as SEM. The shape target value may be a correction amount for correcting the relative error between the mold 2 and the substrate 8 measured by the alignment measurement section 11. [ The shape target value may be a correction amount that combines both the shape error and the relative error.

The force target value generating section 301 generates a force target value corresponding to the force each of the actuators 5 should give to the side surface of the mold 2 based on the inputted shape target value. The force target value is a unit system of force and is generated for each of the actuators 5 (16 axes in this embodiment) according to the following equation (1).

In Equation (1), matrix [r] is a matrix composed of elements of n distortion components decomposed by magnification, skew, trapezoid, failure, and the like. The matrix [f] is a matrix consisting of m elements corresponding to the number of actuators 5, which is an element of the force target value (compression force) for the feedback control system of the actuator 5. [ The matrix [A] is a matrix composed of m × n elements for determining the force target value [f] from the deformation component [r], and the shape, Young's modulus and Poisson's ratio of the mold 2, And the frictional force by holding the mold 2. The matrix [A] is obtained in advance by simulation. Specifically, the amount of deformation of the pattern 20 of the mold 2 when a force corresponding to the force target value [f] is applied to the side surface of the mold 2 is obtained by a known method such as the finite element method (FEA) , And calculates each strain component [r]. This processing is performed while changing the force target value [f], and the matrix [A] is calculated from the force target value [f] (element of the matrix) and its strain component [r] (element of the matrix) ]. The equation (1) corresponds to the simultaneous equations of the first order. However, in order to correct the shape of the mold 2 with high precision, the equation (1) may be developed to increase the order.

The force target value generated by the force target value generating section 301 is a difference (deviation) from the output of the first measuring section 6 (force applied from the actuator 5 to the side surface of the mold 2) And is input to the compensator 302. The compensator 302 includes a PID controller or filter (low-pass filter, notch filter) or the like used in general feedback control. The manipulated variables output from the compensator 302 are amplified via a driver 303 such as a current amplifier and input to the actuator 5. [ The actuator 5 applies a force (a force for deforming the mold 2) to the side surface of the mold 2 in accordance with the manipulated variable from the compensator 302. The force applied to the side surface of the mold 2 from the actuator 5 is used by the first measuring section 6 to measure the deviation input to the compensator 302 as described above.

Next, the position control loop will be described. The second measuring unit 7 measures the positions X1 and X2 in the X axis direction of the side surface of the mold 2 and the position Y in the Y axis direction of the side surface of the mold 2 and outputs them to the coordinate conversion unit 305 Output. The coordinate conversion unit 305 converts the output (positions X1 and X2, position Y) of the second measurement unit 7 into position displacement X in the X axis direction of the mold 2 and displacement in the Y axis direction of the mold 2 Y and the positional deviation Qz in the rotational direction of the mold 2. [ For example, the positional deviation X in the X-axis direction of the mold 2 is an average value of the positions X1 and X2 measured by the second measuring unit 7, and the positional deviation Y in the Y-axis direction of the mold 2 is , And the position Y measured by the second measuring unit 7 is set. The positional deviation Qz in the rotational direction of the mold 2 is obtained by dividing the difference between the position X1 and the position X2 by the mounting pitch (distance in the Y-axis direction) of the second measuring portion 7 measured therefrom.

On the other hand, when the mold 2 is deformed by the actuator 5 so that the shape of the pattern 20 of the mold 2 becomes the target shape, the displacement of the deformed component becomes the positional error as the output of the second measuring portion 7 . Therefore, in the present embodiment, the position of the side surface of the mold 2 in the state in which the actuator 5 applies the force corresponding to the target force value to the side surface of the mold 2 is defined as the positional deviation X, Y, And is stored in a storage unit 306 such as a memory as a unit system of Qz. For example, in the control system shown in Fig. 3, an arithmetic unit for calculating the position (displacement) of the side surface of the mold 2 in a state in which the mold 2 is deformed by the actuator 5 is provided, And stores the position of the side of the mold 2 calculated in the memory 306 as the position target value. The position of the side surface of the mold 2 measured by the second measuring unit 7 in the state in which the mold 2 is deformed by the actuator 5 may be stored in the storage unit 306 as the position target value. The position target value corresponds to the position at which the mold 2 should be located in the mold retention support 4. [

The position deviations X, Y, and Qz output from the coordinate conversion unit 305 are input to the compensator 307 as a difference (positional deviation) from the position target value. This positional deviation corresponds to the difference between the position target value corresponding to the position at which the mold 2 is to be located in the mold holding portion 4 and the output of the second measuring portion 7. The compensator 307, like the compensator 302, includes a PID controller or a filter (low-pass filter, notch filter) and the like.

The position manipulated variable output from the compensator 307 is input to the force conversion unit 308. [ The force converting section 308 converts the position manipulated variable from the compensator 307 into an manipulated variable of the force and inputs it to the force control loop as a force correction quantity which is a unit system of force. The force converting section 308 inputs (distributes) the force correction amount to the force control loop so as to be added to the force target value in each force control loop or to the output of the first measuring section 6. [

Since the principle of superposition is established, the correction of the position of the mold 2 can represent the distribution of the amount of force correction by the following expression (2). In the equation (2), the matrix [B] is a matrix consisting of m × 3 elements. m corresponds to the number of force control loops (the number of actuators 5). The matrix [cf] is a force correction amount input to the force control loop, and is made up of m elements.

In the present embodiment, the force correction amount from the force converting unit 308 is added to the force target value in each force control loop or the output of the first measuring unit 6 to make the position control loop a major loop, The control loop is a minor loop. However, by constructing a loop that adds the force correction amount of the position control loop to the manipulation amount from the compensator 302 in the force control loop, the force control loop may be a major loop and the position control loop may be a minor loop.

The operation of the imprint apparatus 100 will be described with reference to FIG. In the imprint apparatus 100, the force control loop and the position control loop may be always effective, or the position control loop may be made effective as required. Hereinafter, the case where the position control loop is made effective as required will be described.

In S401, the deformation amount of the mold 2 is initialized. More specifically, the mold 2 held in the imprint apparatus 100 is held by the mold holding portion 4, and a force corresponding to the initial value is applied from the actuator 5 to the side surface of the mold 2 do. At this time, the force control loop is made valid, the mold 2 is deformed, and the position control loop is made invalid.

In S402, a force is applied to the side surface of the mold 2 from the actuator 5 to deform the mold 2 so that the shape of the pattern 20 of the mold 2 becomes the target shape.

In step S403, the position control loop is made effective. Specifically, the position of the mold 2 is measured by the second measuring section 7 in a state in which the actuator 5 applies a force to the side surface of the mold 2 (S403). Then, the positional deviations X, Y and Qz of the mold 2 are obtained from the measurement results of the second measuring unit 7 and stored in the storage unit 306 as positional target values. Thereby, the positional deviation (displacement) of the mold 2 caused by the disturbance or the like is measured as the positional deviation based on the positional target value, and the positional deviation is corrected.

In step S404, a stamping process is performed. Specifically, the mold 2 and the substrate 8 relatively approach each other, and the mold 2 and the imprint material supplied on the substrate are brought into contact with each other. Then, the substrate stage 9 is moved to align the mold 2 and the substrate 8. In step S405, a curing process is performed. Specifically, in a state in which the mold 2 and the imprint material on the substrate are in contact with each other, ultraviolet rays are irradiated from the irradiating unit 1 to cure the imprint material on the substrate. In S406, the release process is performed. Specifically, the mold 2 and the substrate 8 are relatively separated from each other, and the mold 2 is separated from the cured imprint material on the substrate.

Since the mold 2 is in contact with the imprint material on the substrate in S404 to S406, the force generated by moving the substrate stage 9 in the force or alignment occurring in the stamping process or the mold releasing process, 2). However, in the present embodiment, the displacement of the mold 2 due to such disturbance can be suppressed by making the position control loop effective.

In step S407, it is determined whether or not imprint processing has been performed on all shot areas of the substrate 8. [ When the imprint process is performed on all shot areas of the substrate 8, the operation of the imprint apparatus 100 is terminated. On the other hand, if the imprint process is not performed on all the shot areas of the substrate 8, the process proceeds to S408. In step S408, the position control loop is made invalid, and the process advances to step S402 to perform the imprint process on the next shot area.

In Fig. 4, S404, S405, and S406 may be performed only by the force control loop without making the position control loop effective in S403. However, at the timing of S403, the position of the mold 2 is measured in a state where the actuator 5 applies a force to the side surface of the mold 2 to obtain the position deviations X, Y and Qz of the mold 2 , And stores it in the storage unit 306 as the position target value. In other words, every time the imprint process for one shot area of the substrate 8 is terminated, the actuator 5 is placed in the second measurement section 7 in the state where the force is given to the side surface of the mold 2 And stores the position of the mold 2 as a position target value. In this case, although the positional deviation of the mold 2 generated in S404, S405, and S406 can not be corrected, since the position target value is stored in S403, the position control loop is made effective at the timing of S407, To the original position. Thereafter, the position control loop is invalidated, and the imprint processing for each shot area of the substrate 8 is repeated.

For example, it has been confirmed that the positional deviation of the mold 2 with respect to the mold retention support portion 4 tends to occur in one direction by repeating the imprint process. By correcting the initial position (diving position) of the substrate stage 9, the positional error in alignment can be reduced, if the direction in which the positional deviation of the mold 2 occurs is known in advance. The positional error between the mold 2 and the mold holding portion 4 is accumulated every time the imprinting process is repeatedly carried out so that the mold 2 and the mold holding portion 4 are displaced by the frictional force between the mold 2 and the mold holding portion 4, Unintentional deformation (distortion) is generated. Such distortion of the mold 2 causes a factor of lowering the superposition accuracy. In the present embodiment, since the positional deviation of the mold 2 can be corrected each time the imprint process is performed on one shot area, the unintended deformation of the mold 2 as described above can be reduced.

The pattern of the cured product formed by using the imprint apparatus 100 is temporarily used for at least a part of various articles or temporarily when manufacturing various articles. An article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include a volatile or nonvolatile semiconductor memory such as a DRAM, an SRAM, a flash memory, and an MRAM, and a semiconductor element such as an LSI, a CCD, an image sensor, and an FPGA. Examples of molds include imprint molds and the like.

The pattern of the cured product is used as it is as a constituent member of at least part of the above-mentioned article, or temporarily used as a resist mask. After etching or ion implantation is performed in the processing step of the substrate, the resist mask is removed.

Next, a specific manufacturing method of the article will be described. As shown in Fig. 5A, a substrate 8 such as a silicon wafer having a surface to be processed such as an insulator is prepared, and then an imprint material is applied to the surface of the material to be processed by an ink jet method or the like do. In this case, a plurality of droplet-shaped imprint materials are provided on the substrate.

As shown in Fig. 5 (b), the imprint mold 2 is opposed to the imprint material on the substrate with the side on which the concavo-convex pattern is formed. As shown in Fig. 5 (c), the mold 8 is brought into contact with the substrate 8 to which the imprint material has been applied, and pressure is applied. The imprint material is filled in the gap between the mold 2 and the material to be processed. When light is irradiated through the mold 2 as curing energy in this state, the imprint material is cured.

As shown in Fig. 5 (d), when the mold 2 and the substrate 8 are separated after the imprint material is cured, a cured pattern of the imprint material is formed on the substrate. The pattern of the cured product is such that the concave portion of the mold 2 has a shape corresponding to the convex portion of the cured product and the convex portion of the mold 2 corresponds to the concave portion of the cured product, .

As shown in FIG. 5 (e), when etching is performed using a pattern of the cured product as an etching resistant mask, portions of the surface of the material to be processed that are free of cured material or thinly remaining are removed, . As shown in Fig. 5 (f), when the pattern of the cured product is removed, an article having a groove formed on the surface of the material to be processed can be obtained. Here, although the pattern of the cured product is removed, it may be used as a constituent member of an interlayer insulating film, that is, an article included in a semiconductor element or the like, without being removed after the processing.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the present invention.

Claims (10)

An imprint apparatus for forming a pattern of an imprint material on a substrate using a mold,
A holding portion for holding the mold,
An actuator for applying a force to a side surface of the mold held by the holding portion,
A first measuring unit for measuring a force applied to a side surface of the mold from the actuator,
A second measuring unit for measuring a position of the mold held by the holding unit,
A control unit for controlling a manipulated variable to be input to the actuator based on a force target value corresponding to a force to be given to the side surface of the mold by the actuator and an output of the first measuring unit;
And an input unit for converting the difference between the position target value corresponding to the position where the mold should be positioned and the output of the second measuring unit into the manipulated variable of the force in the holding unit and inputting the manipulated variable to the control unit,
Wherein the control unit controls an operation amount input to the actuator based on an operation amount input from the input unit. The method according to claim 1,
Wherein the input section includes a storage section for storing the position target value. 3. The method of claim 2,
Wherein the memory stores the position of the mold in a state in which the actuator applies a force corresponding to the force target value to the side surface of the mold as the position target value. The method of claim 3,
Wherein the input section includes an operation section for calculating a position of the mold in the state,
Wherein the memory stores the position of the side surface of the mold calculated by the calculation unit as the position target value. The method of claim 3,
Wherein the memory stores the position of the mold measured by the second measuring unit in the state as the position target value. 6. The method of claim 5,
A plurality of shot regions are formed on the substrate,
Wherein the storage unit stores the position of the mold measured by the second measuring unit in the state as the position target value each time a pattern of the imprint material is formed for one shot area of the substrate. The method according to claim 1,
The second measuring unit includes at least three measuring axes for measuring two positions of the first side face of the mold and one position of the second side face perpendicular to the first side face of the mold Wherein the imprinting device is configured to perform the printing process. An imprint apparatus for forming a pattern of an imprint material on a substrate using a mold,
A holding portion for holding the mold,
An actuator for applying a force to a side surface of the mold held by the holding portion,
A first measuring unit for measuring a force applied to a side surface of the mold from the actuator,
A second measuring unit for measuring a position of the mold held by the holding unit,
And a controller for controlling an operation amount input to the actuator,
Wherein the control unit controls the deformation of the mold and the control of shifting the mold relative to the holding unit based on the output of the first measuring unit and the output of the second measuring unit. A step of forming a pattern on a substrate using an imprint apparatus,
A step of processing the substrate on which the pattern is formed in the step
/ RTI >
The imprint apparatus includes:
Forming a pattern of an imprint material on the substrate using a mold,
A holding portion for holding the mold,
An actuator for applying a force to a side surface of the mold held by the holding portion,
A first measuring unit for measuring a force applied to a side surface of the mold from the actuator,
A second measuring unit for measuring a position of the mold held by the holding unit,
A control unit for controlling a manipulated variable to be input to the actuator based on a force target value corresponding to a force to be given to the side surface of the mold by the actuator and an output of the first measuring unit;
And an input unit for converting the difference between the position target value corresponding to the position where the mold should be positioned and the output of the second measuring unit into the manipulated variable of the force in the holding unit and inputting the manipulated variable to the control unit,
Wherein the control unit controls an operation amount input to the actuator based on an operation amount input from the input unit. A step of forming a pattern on a substrate using an imprint apparatus,
A step of processing the substrate on which the pattern is formed in the step
/ RTI >
The imprint apparatus includes:
Forming a pattern of an imprint material on the substrate using a mold,
A holding portion for holding the mold,
An actuator for applying a force to a side surface of the mold held by the holding portion,
A first measuring unit for measuring a force applied to a side surface of the mold from the actuator,
A second measuring unit for measuring a position of the mold held by the holding unit,
And a controller for controlling an operation amount input to the actuator,
Wherein the control unit controls the deformation of the mold and the control of shifting the mold relative to the holding unit based on the output of the first measuring unit and the output of the second measuring unit.

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