KR102378292B1 - Position alignment method, imprint apparatus, program and manufacturing method of an article - Google Patents

Abstract

A method for aligning the position of a formwork and a substrate based on the detection results of the form-side mark and the substrate-side mark, wherein the form-side mark and the first substrate-side mark are detected at a plurality of detection points in each of a plurality of shot regions on a first substrate a step of obtaining a first amount of displacement between the form-side mark and the first substrate-side mark based on the detected detection result; deforming the formwork or the second substrate based on the shape correction amount, and in each of the plurality of shot regions on the second substrate, the form-side mark and the second substrate-side mark are detected at fewer detection points than the plurality of detection points, Based on the detected detection result, it has the process of calculating|requiring the 2nd amount of position shift between the form side mark and the 2nd board|substrate side mark, and based on the 2nd position shift amount, the formwork and the 2nd board|substrate are aligned.

Description

Position alignment method, imprint apparatus, program and manufacturing method of an article

The present invention relates to a method of aligning a position, an imprint apparatus, a program and a method of manufacturing an article.

There is an imprint technique for forming a fine pattern by bringing a mold into contact with an imprint material on a substrate. One of the imprint techniques is a photocuring method using a photocurable resin as an imprint material. In an imprint apparatus employing this photocuring method, first, an imprint material is supplied onto a substrate. Then, the imprint material on the substrate and the mold are brought into contact. Then, in a state in which the mold and the imprint material are in contact, the imprint material is cured by irradiation with light, and then the mold is peeled from the cured imprint material, whereby a pattern is formed on the substrate.

The alignment between the substrate and the form when the form is brought into contact with the imprint material may be performed by a die-by-die alignment method. The die-by-die alignment method is an alignment method in which, for each of a plurality of shot regions on the substrate, a mark formed in the shot region and a mark formed in the mold are optically detected, the displacement of the positional relationship between the substrate and the mold is measured, and the shift is corrected. . The misalignment can be corrected by moving, rotating and deforming the formwork or the substrate. For example, the deformation of the formwork or substrate is a method of deforming by applying a force to the side surface of the formwork (Patent Document 1), a method of deforming the form with heat (Patent Document 2), a method of deforming by applying force to the substrate and stretching (Patent Document 2) Patent Document 3) and a method of deforming the substrate with heat (Patent Document 4).

Japanese Patent Laid-Open No. 2012-23092 Japanese Patent No. 4328785 Publication Japanese Patent Publication No. 5064743 Japanese Patent Laid-Open No. 2013-89663

Due to the influence of individual differences in the mold or substrate, deformation of the mold or substrate due to a series of imprint processes, the amount of correction of the shift may be different for each substrate or for each shot region. If the position at which alignment measurement (position alignment measurement) is performed is increased, the correction amount of the shift can be accurately obtained, but throughput is lowered.

It is an object of the present invention to provide a method of positioning which is advantageous, for example in terms of throughput.

In order to solve the above problems, the present invention is a positioning method for aligning a mold and a substrate based on a detection result of a mold-side mark formed on a mold and a substrate-side mark formed on a substrate, and among a plurality of substrates, a first substrate With respect to each of the plurality of shot regions on the image, the form-side mark and the first substrate-side mark formed on the first substrate are detected between the form-side mark and the first substrate-side mark based on the detection results at the plurality of detection points. A step of obtaining a first amount of positional displacement; a step of obtaining a shape correction amount of the formwork or the first substrate for aligning the positional alignment between the formwork and the first substrate based on the first amount of positional deviation; a step of deforming a formwork or a second substrate different from the first one of the plurality of substrates, and for each of a plurality of shot regions on the second substrate, a form-side mark of the formwork and a second substrate-side mark formed on the second substrate based on the detection results detected at detection points smaller than the plurality of detection points, a step of obtaining a second amount of displacement between the form-side mark and the second substrate-side mark, based on the second amount of displacement, It is characterized in that the position of the formwork and the second substrate are aligned.

According to the present invention, it is possible to provide a position alignment method advantageous in terms of throughput, for example.

1 is a diagram showing the configuration of an imprint apparatus according to a first embodiment.
2 is a flowchart of an imprint method according to the first embodiment.
3 is a diagram illustrating a plurality of shot regions on a substrate and alignment marks provided in each shot region;
4 is a flowchart of an imprint process in the detailed measurement mode.
5 is a flowchart of an imprint process in the normal measurement mode.
6 is a flowchart of an imprint method according to the second embodiment.
7 is a view for explaining a method of manufacturing an article.

EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated with reference to drawings etc. FIG.

first embodiment

1A and 1B are views showing the configuration of the imprint apparatus 100 and the configuration of the deformable part 123 according to the first embodiment of the present invention. The imprint apparatus is an apparatus for forming a pattern of a cured product onto which the concavo-convex pattern of the form is transferred by bringing an imprint material supplied on a substrate into contact with a form and applying hardening energy to the imprint material. Here, as an imprint apparatus using a photocuring method, an ultraviolet curing type imprint apparatus for curing the uncured imprint material R on the substrate W by irradiation of ultraviolet rays is used. In addition, in the following drawings, the Z axis is taken parallel to the optical axis of the ultraviolet light irradiated to the imprint material R on the substrate W, and the X axis and the Y axis are taken orthogonal to each other in a plane perpendicular to the Z axis. The imprint apparatus of the present embodiment is configured to form a pattern in a plurality of shot regions (shots) of the substrate W by repeating the imprint process. Here, the imprint process refers to the supply of the imprint material R to the substrate W, the contact between the mold M and the imprint material R, and the filling and alignment of the imprint material R to the pattern of the mold M. (alignment), hardening (exposure) and peeling of the formwork M shall be referred to as a series of cycles.

The imprint apparatus 100 includes a substrate stage 110 , a structure 120 , an application unit (dispenser) 130 , a first control unit 140 , and a second control unit 150 . The substrate stage 110 holds the substrate (wafer) W (eg, by vacuum suction), and is controlled to be movable in six degrees of freedom by the second control unit 150 . The substrate W is carried into the substrate stage 110 from the outside of the imprint apparatus 100 by a transfer means (not shown). After the imprint process, the substrate stage 110 is transported out of the imprint apparatus 100 by the transport means. The second control unit 150 also includes a measurement unit that measures the position of the substrate stage 110 , and controls the substrate stage 110 based on the measurement result (detection result).

The structure 120 is provided with an irradiation unit 121 , an alignment measurement unit 122 , and a deformation unit 123 , respectively. The irradiation unit 121 irradiates ultraviolet light to the imprint material R through the form M. The alignment measurement unit 122 includes a plurality of scopes 122a to 122d and a driving unit (not shown). In this embodiment, the relative position of the form M and the board|substrate W is measured by the die-by-die alignment method, and position alignment is performed. Therefore, as the scopes 122a to 122d, an alignment mark (form-side mark) formed on the form M and an alignment mark (substrate-side mark) formed on the substrate W are detected through the form M (Through TTM). The Mask) scope is used. In this embodiment, although the alignment mark is detected after making the form M and the board|substrate W (imprint material R) contact, it is not limited to this, You may detect before a contact. In addition, the alignment measurement unit 122 may detect the image of the alignment mark formed on the form M and the image of the alignment mark formed on the substrate W, respectively, for example, from the form-side mark and the substrate-side mark like a moire pattern. of light may be detected. In addition, the number of scopes is not limited to 4. The drive unit of the alignment measurement unit 122 positions the plurality of scopes 122a to 122d.

The deformable part 123 is a mechanism for adjusting the relative position or shape difference between the form M and the substrate W by deforming the form M. As shown in FIG. For example, the mold M is deformed by pressing the mold M from the outer circumferential direction using a cylinder operated with a fluid such as air or oil. In addition, the deformable part 123 includes a temperature control means for controlling the temperature of the substrate W by applying heat to the substrate W, and deforms the shape of the substrate W by controlling the temperature of the substrate W. It may be a tool that makes The substrate W may be deformed (typically, expanded or contracted) by going through a process such as heat treatment. The deformable part 123 corrects the shape of the mold M or the substrate W so that the positions of the substrate W and the mold M match according to the deformation of the substrate W. In addition, the deformable part 123 is not limited to the above-described pressure and temperature control, and may deform the shape of the mold M or the substrate W by other methods. Furthermore, you may use several means together, for example, the deformation|transformation part 123 being equipped with both the means which deform|transforms the form M by the pressurization from the outer peripheral direction, and the means which controls the temperature of the board|substrate W. .

The applicator 130 includes, for example, a tank for storing the imprint material R, a nozzle (discharge port) for discharging the imprint material R supplied from the tank through a supply path to the substrate W, and the corresponding It has a valve provided in the supply path, and a supply amount control part. The supply amount control unit typically controls the supply amount of the imprint material to the substrate W by controlling the valve so that the imprint material R is applied to one shot region in one ejection operation.

As the imprint material R, a curable composition (sometimes referred to as an uncured resin) that is cured when energy for curing is applied is used. As the energy for curing, electromagnetic waves or heat are used. Examples of the electromagnetic wave include light such as infrared rays, visible rays or ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less. A curable composition is a composition hardened|cured by irradiation of light or by heating. Among these, the photocurable composition hardened|cured by irradiation of light contains a polymeric compound and a photoinitiator at least, and may contain a nonpolymerizable compound or a solvent as needed. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal addition type mold release agent, a surfactant, an antioxidant, and a polymer component.

The imprint material R is applied on the substrate in a droplet shape or an island shape or a film shape formed by connecting a plurality of droplets by the application unit 130 . Alternatively, the imprint material R may be applied in the form of a film on the substrate by a spin coater or a slit coater. The viscosity (viscosity in 25 degreeC) of the imprint material R is 1 mPa*s or more and 100 mPa*s or less, for example.

The form M has, for example, a rectangular outer periphery, a predetermined concave-convex pattern is formed in a three-dimensional form on the surface opposite to the substrate W, and is composed of a material (such as quartz) that transmits ultraviolet rays. . The substrate W is a substrate to which the concave-convex pattern is transferred, and includes, for example, a single crystal silicon substrate, a silicon on insulator (SOI) substrate, or the like. In addition, glass, ceramics, metal, semiconductor, resin, etc. are used for the board|substrate W, and the member which consists of a material different from the board|substrate may be formed in the surface as needed as needed. Specific examples of the substrate include a silicon wafer, a compound semiconductor wafer, or quartz glass.

The structure 120 may be provided with a form holder for holding the form (M). The formwork holder includes a chuck that holds the formwork M, a drive unit that drives the chuck to move the formwork M, and a base that supports the drive unit. The holding of the mold M by the chuck is based on vacuum suction force, electrostatic force, or the like. The driving part of the form holder part adjusts the position of the form M to 6 degrees of freedom, brings the form M into contact with the substrate W or the imprint material R on the substrate W, or a cured imprint material. The form (M) is peeled (released) from (R).

The first control unit 140 and the second control unit 150 are connected to each component of the imprint apparatus 100 through a line, and control the operation and adjustment of each component according to a program or the like. The first control unit 140 and the second control unit 150 include, for example, a computer, and although not shown, a calculation unit such as a CPU or DSP, and a storage unit such as a memory or hard disk for storing recipes, etc. do. Here, a recipe is information (data) which consists of serial process parameters at the time of processing the board|substrate W or the board|substrate group lot which performs the same process. The processing parameters are, for example, the layout of the shot regions, the order of the shot regions to be imprinted, or imprint conditions in each shot region. As the imprint conditions, for example, a filling time, which is a time for pressing the mold M against the imprint material R applied on the substrate W, or a time for curing the imprint material R by irradiating ultraviolet rays (exposure time) ) is there. As the imprint conditions, there is also an application amount of the imprint material R applied to each shot region and the like.

FIG. 1B is a diagram showing the configuration of the deformable part 123 . The alignment measurement unit 122 has a plurality of scopes 122a to 122d. The deformable portion 123 includes a plurality of actuators disposed on the side surface of the form (M). Each actuator is individually controlled based on the command value (control amount) stored in the memory|storage part of the 1st control part 140, and applies a force in the center direction of the form M. In addition, the number of actuators, an arrangement position, a size, etc. are not restrict|limited to the example shown in FIG.1(B). The method of deformation|transformation may be the method of adsorb|sucking and extending|stretching the form M from the side, for example. In addition, a sensor for measuring the position of the actuator may be disposed, and the first control unit 140 may control the position of the actuator based on the measured value. As mentioned above, you may use other methods, such as controlling the temperature of the board|substrate W, other than deforming the form M by pressurization. Moreover, as the deformable part 123, you may match the shape of the board|substrate W and the formwork M using several means.

In addition, the position alignment of the board|substrate W and the formwork M shall refer to matching a position (including a relative rotation) and a shape. The position alignment of the board|substrate W and the formwork M is performed by deform|transforming or moving at least one of the board|substrate W and the formwork M. The shape shift includes a linear shift such as the substrate W or the mold M being deformed at different magnifications in the X-direction and the Y-direction, or deformed in a rhombus shape, and a non-linear shift due to arbitrary deformation.

2 is a flowchart of an imprint method according to the present embodiment. In the imprint method of this embodiment, a detailed measurement mode for performing alignment measurement in detail, and a normal measurement mode for performing alignment measurement with fewer measurement points than the mode, a method of aligning the positions of the substrate W and the formwork M hire The mode switching timing is saved in the recipe in advance. A higher effect is obtained when this invention is applied to the board|substrate group to which the similar process was performed, such as a lot. For example, the timing of switching, such as performing alignment measurement in the detailed measurement mode for only the first sheet (first substrate) of the lot, and applying the normal measurement mode to the second and subsequent substrates (second substrate) selected from the same lot, is considered do. Each process is performed under the control of the first control unit 140 or the second control unit 150 . In step S101 , a transport means (not shown) carries the substrate W into the substrate stage 110 from outside the imprint apparatus 100 . In process S102, the 1st control part 140 refers to a recipe, and sets the measurement mode at the time of alignment measurement of the board|substrate W carried in to the substrate stage 110 in process S101. In process S102, when the detailed measurement mode is set, it progresses to process S103, and when the normal measurement mode is set, it progresses to process S106.

Steps S103 to S105 are steps in the detailed measurement mode, and steps S106 to S108 are steps in the normal measurement mode. In step S103 , an imprint process is performed by the first control unit 140 and the second control unit 150 . The details of step S103 will be described later. In step S104, the first control unit 140 stores the amount of shape correction of the mold M by the deforming unit 123 in the step S103 in the storage unit for each shot area. Here, the shape correction amount means a control amount (position) of each actuator included in the deformable part 123 . Further, when the deformable portion 123 includes means for controlling the temperature of the substrate W, the applied heat distribution (position and amount of the applied heat) is stored as the shape correction amount. In step S105, it is determined whether the first control unit 140 has performed steps S103 and S104 for the entire shot area. When it is determined that the processing of the entire shot region is finished (“Yes”), in step S109 , a transport means (not shown) transports the substrate W out of the imprint apparatus 100 . If it is determined that the processing of the entire shot area is not finished (No), steps S103 and S104 are repeated for the unprocessed shot area.

In step S106, the first control unit 140 refers to the shape correction amount of the mold M corresponding to the shot area to be processed stored in the storage unit in step S104. In step S107, an imprint process is performed by the first control unit 140 and the second control unit 150 based on the shape correction amount obtained in the step S106. The details of step S107 will be described later. In step S108, it is determined whether the first control unit 140 has performed steps S106 and S107 for the entire shot area. When it is determined that the processing for the entire shot region is finished (“Yes”), in step S109 , a transport means (not shown) transports the substrate W out of the imprint apparatus 100 . If it is determined that the processing has not been completed for the entire shot area (No), steps S106 and S107 are repeated for the unprocessed shot area.

3A to 3C are views illustrating a plurality of shot regions on the substrate W and alignment marks provided in each shot region. FIG. 3A is a diagram illustrating a plurality of shot regions SR partitioned on the substrate W, and representative shot regions (sample shot regions) SS of some of the plurality of shot regions SR. In FIG. 3A , the sample shot region SS is hatched with an oblique line. 3B and 3C are diagrams illustrating the alignment marks AM provided in the shot region SR. The number in alignment mark AM shows the alignment mark AM set (detection point) measured simultaneously. That is, the alignment mark AM indicated by the number 1 is simultaneously measured by the alignment measurement unit 122 . The alignment mark AM in Fig. 3B is an alignment mark AM measured in the detailed measurement mode, and the alignment mark AM in Fig. 3C is an alignment mark AM measured in the normal measurement mode ( AM).

FIG. 4 is a flowchart of an imprint process in the detailed measurement mode in step S103 of the flowchart of FIG. 2 . In the detailed measurement mode, a plurality of alignment marks AM as shown in Fig. 3B are measured for each shot region. Each process is performed under the control of the first control unit 140 or the second control unit 150 . In step S401, the imprint material R is applied to the substrate W, the form M and the imprint material R are brought into contact, and the pattern of the form M is filled with the imprint material R. Specifically, the second controller 150 controls the substrate stage 110 , moves the substrate W to just below the applicator 130 , and the first controller 140 controls the applicator based on the recipe. Control 130, and apply the imprint material R to the target shot area. When the coating is finished, the second control unit 150 controls the substrate stage 110 , and moves the substrate W to just below the mold M. Based on the recipe, the first control unit 140 makes the mold M contact the imprint material R applied on the substrate W to fill the pattern of the mold M with the imprint material R.

In process S402, the 1st control part 140 controls the drive part which is not shown in figure, and moves the some scope 122a-122d contained in the alignment measurement part 122. In the first measurement, each scope 122a to 122d is moved to the position where the alignment mark AM assigned with the number 1 shown in Fig. 3B is measured. A set of alignment marks AM measured at the same time is saved in the recipe in advance. In step S403, the 1st control part 140 measures the alignment mark AM on each scope 122a-122d after movement, and based on the measurement result, the displacement amount of the positional relationship between the formwork M and the board|substrate W. to save In step S404, the first control unit 140 determines whether the amount of deviation obtained in step S403 exceeds a predetermined threshold. When the threshold is not exceeded (No), the flow advances to step S407, where the first control unit 140 determines whether the measurement and alignment of all alignment mark AM sets have been completed. When it is determined that measurement and alignment have been completed (“Yes”), in step S408 , the first control unit 140 or the second control unit 150 controls each unit to cure (exposure) and peel the mold M is performed, and a series of imprint processing is completed.

If it is determined in step S404 that the threshold has been exceeded (“Yes”), in step S405 , the first control unit 140 controls each actuator included in the deformable unit 123 to correct the shape of the mold M . In addition, when the deformable part 123 includes a means for controlling the temperature of the substrate W, heat is applied to the substrate W to correct the shape of the substrate W. In step S406 , the second control unit 150 controls the substrate stage 110 to correct the position in the XY direction of the substrate W and the position in the rotation direction of each axis. After the correction of steps S405 and S406 is finished, the flow returns to step S403, and alignment measurement of the alignment mark AM set is performed again. If it is determined in the succeeding step S404 that the shift amount has not exceeded the predetermined threshold (No), the flow advances to step S407.

In step S407, when it is determined that the measurement of all alignment mark AM sets has not been completed (No), for another set of alignment marks AM (for example, the set numbered with number 2), the step Steps after S402 are performed. Further, the control amount of each actuator included in the deformation unit 123 in step S405 is stored in the storage unit by the first control unit 140 (step S104). Here, when the deformable portion 123 includes means for controlling the temperature of the substrate W, the applied heat distribution is stored in the storage unit.

In this embodiment, after the measurement of all the alignment mark AM sets set in advance was complete|finished, although the example which performs hardening and mold release was demonstrated, it is not limited to this. For example, after the measurement of all the alignment mark AM sets is finished in step S407, it returns to step S402, repeats step S406 from step S402 a preset number of times to align more precisely. .

FIG. 5 is a flowchart of an imprint process in the normal measurement mode in the flowchart step S107 of FIG. 2 . In the present embodiment, the number of alignment marks AM equal to the number of a plurality of scopes included in the alignment measurement unit 122 is simultaneously measured for each shot region. The alignment mark AM measured simultaneously is a mark shown by the number 1 in FIG.3(C), for example. In the normal measurement mode, after correcting the shape of the mold M by the shape correction amount (control amount of each actuator) corresponding to the shot area of the mold M obtained in the detailed measurement mode, the alignment mark AM is measured. do Here, when the deformable portion 123 includes means for controlling the temperature of the substrate W, by applying heat to the substrate W based on the shape correction amount (heat distribution) obtained in the detailed measurement mode, the substrate ( Correct the shape of W). Then, based on the measurement result (detection result) of the alignment mark AM, the 2nd control part 150 controls the board|substrate stage 110, The XY direction position of the board|substrate W, and the rotation direction position of each axis. to correct Each process is performed under the control of the first control unit 140 or the second control unit 150 .

In step S501, as in step S401, the application of the imprint material R to the substrate W, the contact between the mold M and the imprint material R, and the filling of the imprint material R to the pattern of the mold M are performed. is done In step S502 , based on the control amount of each actuator obtained in the detailed measurement mode referenced in step S106 , the first control unit 140 controls each actuator included in the deformable unit 123 to correct the shape of the formwork M make it Here, as described above, when the deformable portion 123 includes means for controlling the temperature of the substrate W, heat is applied to the substrate W based on the heat distribution obtained in the detailed measurement mode, and the substrate W is Correct the shape of W). In process S503, the 1st control part 140 makes each scope 122a-122d measure the alignment mark AM of the number 1 shown to FIG.3(C), and the position of the formwork M and the board|substrate W Find the disparity in the relationship. In step S504 , the second control unit 150 controls the substrate stage 110 to correct the position in the XY direction of the substrate W and the position in the rotation direction of each axis. In step S505, the first control unit 140 or the second control unit 150 controls each unit, curing (exposure) and peeling of the mold M are performed, and a series of imprint processing is completed.

Moreover, you may add the shape correction process of the formwork M similar to process S502 further between process S503 and process S504. In this step, the first control unit 140 obtains a control amount from the measurement result in step S503 on the basis of the control amount of each actuator used in step S502, and corrects the shape of the formwork M based on the obtained control amount . In addition, when the deformable portion 123 includes means for controlling the temperature of the substrate W, the heat distribution used in the step S502 is used as a reference, and the substrate W is added based on the measurement result in the step S503. You may apply heat with a furnace and perform shape correction of the board|substrate W.

Here, the case where the process of shape correction of the formwork M similar to process S502 is further added between process S503 and process S504 is demonstrated in detail. For example, consider the case where the shift|offset|difference amount measured in process S503 is the magnification (G _x in X direction, G _y in Y direction) different in the X direction and Y direction. The obtained control amount is, with respect to the _actuators provided on each side of the _{frame M} of _FIG . a natural number from 1 to n). n represents the number of actuators, and in this embodiment, n=7. In addition, the control amount used in step S502 is, with respect to the actuators provided on each side of the form M, the upper side is a _i , the left side is b _i , the right side is c _i , and the lower side is d _i (i is 1) to n natural numbers). G _x and G _y are 1.0 when the size of the pattern area of the form M and the shot area of the substrate W are the same, 1.0 or more when the pattern area of the form M is small, and 1.0 when the size is large. Set it to a value that is less than or equal to The control amount obtained using the above parameters becomes the following formula (1).

When the shift amount measured in step S503 is the perpendicularity error T (inclination error between the X-axis and the Y-axis) of the pattern region of the formwork M with respect to the shot region of the substrate W (when shifted in a diamond shape) ), the obtained control amount becomes the following formula (2). In addition, T is set to be 0 when there is no inclination error between the X-axis and the Y-axis (the axes are orthogonal to each other). In addition, y has shown the Y-coordinate of the actuator in the coordinate system which made the center of the pattern area on the form M as an origin.

When the process of correcting the shape of the formwork M is included between the steps S503 and S504, the same as that of the step S502, after this step, in the step S504, the substrate stage 110 based on the amount of deviation measured in the step S503. to drive Therefore, by adding the process of shape correction of the formwork M after the process S503, based on the actual measurement result in the board|substrate W to which the normal measurement mode is applied, the formwork M by the deformation|transformation part 123. Alternatively, the shape of the substrate W may be corrected.

In this embodiment, an example has been described in which the determination of the shape correction amount (step S103), storage (step S104), and reference (step S106) are performed in the same imprint apparatus, but the present invention is not limited thereto. For example, the determined shape correction amount for each shot region may be transmitted to an external control device. In this case, when performing equivalent imprint processing, it is possible to receive and use the shape correction amount determined by its own device or another equivalent device from an external control device.

As described above, the alignment method of the present embodiment performs detailed alignment on a previously designated substrate, obtains the control amount of the actuator, and uses the control amount in the subsequent substrate imprint process. Thereby, alignment precision can be improved, without reducing a throughput. According to this embodiment, it is possible to provide a position alignment method advantageous in terms of throughput.

second embodiment

In the first embodiment, in the detailed measurement mode, the imprint process of the entire shot region in the substrate was performed on a previously designated substrate (eg, the first substrate in the lot). In the second embodiment, in the detailed measurement mode, the imprint process is performed on the sample shot region SS shown in FIG. 3A with respect to a substrate designated in advance. That is, the first embodiment sets the measurement mode for each substrate, whereas the present embodiment sets the measurement mode for each shot region.

Specifically, first, only the sample shot area SS is imprinted in the detailed measurement mode. Next, the amount of shape correction in the sample shot region SS is statistically calculated, and the amount of shape correction in the shot regions other than the sample shot region SS is calculated. Finally, a shot region other than the sample shot region SS is imprinted in the normal measurement mode. Hereinafter, in this way, the measurement mode including both the detailed measurement mode and the normal measurement mode for one substrate is referred to as a sample shot measurement mode.

6 is a flowchart of the imprint method according to the present embodiment. Each process progresses under the control of the 1st control part 140 or the 2nd control part 150 similarly to 1st Embodiment. In step S701 and step S702, similarly to step S101 and step S102, the loading of the substrate W and the setting of the measurement mode are performed. In step S702, when the sample shot measurement mode is set for the substrate W loaded into the substrate stage 110, the flow advances to step S703, and when the normal measurement mode is set, the flow advances to step S106.

Steps S703 to S705 are steps in the sample shot measurement mode. In addition, since process S709 - process S711 are the processes of the normal measurement mode similar to process S106 - process S108 of 1st Embodiment, respectively, the detail is abbreviate|omitted. In step S703, the same imprint processing as in step S103 is performed. In step S704 , the first control unit 140 determines whether the processing of all the sample shot areas SS has been completed. If it is determined in step S704 that it has not been finished (No), the flow returns to step S703 to perform imprint processing of the unprocessed sample shot area SS, and if it is determined that the process has been completed (Yes), proceed to step S705 do.

In step S705, the first control unit 140 statistically processes the shape correction amount in each sample shot area SS when the imprint treatment is performed in the detailed measurement mode in step S703, and performs a statistical process for shots other than the sample shot area SS. The shape correction amount in the region is calculated. Here, the calculated shape correction amount is stored in the storage unit by the first control unit 140 .

In step S706, the first control unit 140 reads the shape correction amount obtained in step S705 from the storage unit. In step S707, based on the read shape correction amount, imprint processing is performed on shot regions other than the sample shot region SS in the same normal measurement mode as in the first embodiment. In step S708, the first control unit 140 determines whether the processing of steps S706 and S707 has been performed in all shot areas other than the sample shot area SS, and when it is determined that the processing is complete (Yes), It proceeds to step S712. When it is judged that it has not been completed (No), the processing of steps S706 and S707 is executed for the unprocessed shot area. In step S712 , the substrate W is transported out of the imprint apparatus 100 by a transport means (not shown).

Next, an example of the method of calculating the shape correction amount of the shot region other than the sample shot region SS by the first control unit 140 in the step S705 will be described. First, as the statistic of each actuator, the average value S of the control amount, the amount of change M of the control amount in the X direction, and the amount of change R of the control amount in the Y direction are calculated. In practice, it is calculated by the known least squares method with respect to the following formula (3) using these statistics as coefficients. In the calculation, the positions of the respective actuators in the sample shot and the center positions x and y of the sample shot region in XY coordinates on the substrate plane with the center of the substrate W as the origin are used.

In Formula (3), a _i , b _i , c _i , and d _i are the same as in Formula (1). Incidentally, the average value S, the amount of change in the X direction M, and the amount of change in the Y direction R are calculated for each actuator, and the subscripts indicate the corresponding actuators. After obtaining the coefficient of Equation (3), which is the above statistical value, for each shot, by substituting the position of the center of each shot in the XY coordinates on the substrate plane with the center of the substrate as the origin into x and y of Equation (3) for each shot, in each shot Each actuator control amount of is calculated. In addition, in this embodiment, although a linear polynomial was used for Formula (3), you may use an expression of any order.

As described above, in the alignment method of the present embodiment, compared to the first embodiment, since there are fewer shot areas using the detailed measurement mode, further reduction in throughput can be expected. In addition, although the example in which the sample shot measurement mode and the normal measurement mode are switched according to the measurement mode set for each board|substrate was demonstrated in this embodiment, you may imprint all board|substrates in the sample shot measurement mode.

In addition, in the said embodiment, although the form M was deformed at the time of alignment, it is not limited to this, The board|substrate W may be deformed, and both of these may be deformed. As in the above embodiment, the imprint apparatus 100 may be configured not to include the first control unit 140 and the second control unit 150 capable of communicating with each other, but may include an integrated control unit. In addition, the first control unit 140 and the second control unit 150 may be configured integrally with other parts of the imprint apparatus 100 (in a common housing) or separately from other parts of the imprint apparatus 100 ( in another housing). In addition, the method according to the above embodiment may be executed by the computer of the first control unit 140 as a program.

Embodiment related to article manufacturing method

A method of manufacturing a device as an article (semiconductor integrated circuit element, liquid crystal display element, etc.) includes a step of pattern forming on a substrate (wafer, glass plate, film-like substrate) by an imprint apparatus using the method described above. Additionally, the manufacturing method may include a step of etching the substrate on which the pattern is formed. Further, in the case of manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processing of processing the substrate on which the pattern is formed instead of etching. The article manufacturing method of the present embodiment is advantageous compared to the conventional method in at least one of performance, quality, productivity, and production cost of the article.

The pattern of the cured product formed by using the imprint apparatus is permanently used for at least a part of various articles or temporarily when various articles are manufactured. An article is an electric circuit element, an optical element, MEMS, a recording element, a sensor, a formwork, etc. Examples of the electric circuit element include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory or MRAM, and semiconductor elements such as LSI, CCD, image sensor or FPGA. As a formwork, the mold for imprints, etc. are mentioned.

The pattern of the cured product is used as it is as a constituent member of at least a part of the article, or is temporarily used as a resist mask. After etching or ion implantation is performed in the processing step of the substrate, the resist mask is removed.

Next, a specific manufacturing method of the article will be described. As shown in Fig. 7A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed on the surface is prepared, and then, the workpiece 2z is formed by an inkjet method or the like. An imprint material 3z is applied (applied) to the surface. Here, the state in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate is shown.

As shown in Fig. 7(B) , the imprint form 4z is made to face the imprint material 3z on the substrate with the side on which the concave-convex pattern is formed. As shown in FIG. 7C , the substrate 1 on which the imprint material 3z has been applied is brought into contact with the mold 4z, and a pressure is applied thereto. The imprint material 3z is filled in the gap between the formwork 4z and the material to be processed 2z. In this state, when light is transmitted through the mold 4z and irradiated as energy for curing, the imprint material 3z is cured.

As shown in FIG. 7D , after curing the imprint material 3z, when the mold 4z and the substrate 1z are separated, the pattern of the cured product of the imprint material 3z on the substrate 1z this is formed The pattern of the cured product has a shape such that the concave portion of the mold 4z corresponds to the convex portion of the cured product and the convex portion of the mold 4z corresponds to the concave portion of the cured product, that is, the imprint material 3z is attached to the mold 4z. of the concave-convex pattern is transferred.

As shown in FIG. 7E , when etching is performed using the pattern of the cured product as an etching mask, a portion without the cured product or thinly remaining on the surface of the material to be processed 2z is removed, and the groove 5z ) becomes As shown in Fig. 7F, when the pattern of the cured product is removed, an article having grooves 5z formed on the surface of the material 2z to be processed can be obtained. Although the pattern of the cured product is removed here, it may be used as a structural member of an interlayer insulating film included in, for example, a semiconductor element or the like, ie, an article without removing the pattern even after processing.

the other embodiment

The present invention can also be realized as a process in which a program for realizing one or more functions of the above-described embodiments is supplied to a system or apparatus via a network or a storage medium, and one or more processors in their computer read and execute the program. Do. It is also feasible by a circuit (eg, an ASIC) for realizing one or more functions.

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to these embodiment, Various deformation|transformation and change are possible within the scope of the summary.

100: imprint device
110: substrate stage
120: structure
121: investigation department
122: alignment measurement unit
123: deformation part
130: applicator (dispenser)
140: first control unit
150: second control unit
M: frame
W: substrate

Claims (16)

A position alignment method for aligning the position of the formwork and the substrate based on the detection result of the form-side mark formed on the formwork and the substrate-side mark formed on the substrate,
With respect to the first substrate,
In each of the plurality of shot regions, based on a detection result of detecting the plurality of form-side marks and the plurality of first substrate-side marks formed on the first substrate, the amount of first positional shift between the form and the first substrate The process of finding
an acquisition step of acquiring a shape correction amount of the mold or the first substrate for deforming the shape of the mold or the first substrate based on the first position shift amount;
With respect to a second substrate different from the first substrate,
a deforming step of deforming the formwork or the second substrate based on the shape correction amount in the first substrate;
After the deformation step, in each of a plurality of shot regions, without using the detection results of the plurality of the first substrate-side marks, the plurality of the form-side marks and the plurality of second substrate-side marks formed on the second substrate are used. based on the detection result of detecting
a step of aligning the formwork and the second substrate based on the second positional shift amount;
The position alignment method according to claim 1, wherein the number of the detected second substrate-side marks is smaller than the number of the first substrate-side marks. According to claim 1,
A plurality of shot regions on the first substrate correspond to a plurality of shot regions on the second substrate, and the first substrate-side mark corresponds to the second substrate-side mark. According to claim 1,
The first substrate and the second substrate are selected from the same lot. According to claim 1,
The alignment method according to any one of the preceding claims, wherein the alignment of the mold and the second substrate based on the second displacement amount includes deforming at least one of the mold and the second substrate. According to claim 1,
The alignment method according to claim 1, wherein the alignment between the formwork and the second substrate based on the second positional shift amount is performed by applying a force to a side surface of the formwork. According to claim 1,
The alignment method according to claim 1, wherein the alignment of the formwork and the second substrate based on the second positional shift amount is performed by applying heat to the second substrate. According to claim 1,
The alignment method according to claim 1, wherein the alignment of the mold and the second substrate based on the second positional shift includes moving at least one of the mold and the second substrate. 5. The method of claim 4,
The position alignment method according to claim 1, wherein the deformation of the formwork or the second substrate is performed on the basis of the amount of correction obtained from the amount of the second positional deviation, based on the amount of correction obtained from the amount of the first positional deviation as a reference. According to claim 1,
In the step of determining the first amount of positional shift, the form-side mark and the first substrate-side mark formed on the first substrate are set at a plurality of detection points with respect to a part of the shot region among the plurality of shot regions on the first substrate. is detected, and a positional shift amount obtained from the detection result and a positional shift amount calculated from a statistic of the detection result are used as the first positional shift amount. A position alignment method for aligning the position of the formwork and the substrate based on the detection result of the form-side mark formed on the formwork and the substrate-side mark formed on the substrate,
With respect to the first substrate,
In each of the plurality of shot regions, based on a detection result of detecting the plurality of form-side marks and the plurality of first substrate-side marks formed on the first substrate, the amount of first positional shift between the form and the first substrate The process of finding
an acquisition step of acquiring a shape correction amount of the mold or the first substrate for deforming the shape of the mold or the first substrate based on the first position shift amount;
With respect to a second substrate different from the first substrate,
In each of the plurality of shot regions, without using the detection results of the plurality of first substrate-side marks, the plurality of form-side marks and the plurality of second substrate-side marks formed on the second substrate are detected. a deforming step of deforming the formwork or the second substrate based on a second positional shift amount between the formwork and the second substrate obtained based on the second positional shift amount and the shape correction amount in the first substrate;
The position alignment method according to claim 1, wherein the number of the detected second substrate-side marks is smaller than the number of the first substrate-side marks. An imprint apparatus for forming a pattern on an imprint material supplied on a substrate using a mold,
a measuring unit for measuring the relative positions of the formwork and the substrate;
a mechanism for adjusting the relative position by deforming the formwork or the substrate;
A control unit for controlling the measurement unit and the instrument
have,
The control unit is
with respect to the first substrate, controlling the measurement unit to detect a plurality of form-side marks formed on the formwork and a plurality of first substrate-side marks formed on the first substrate in each of a plurality of shot regions;
Acquiring a shape correction amount of the mold or the first substrate for deforming the shape of the mold or the first substrate based on the first positional shift amount between the mold and the first substrate obtained from the detection result;
with respect to a second substrate different from the first substrate, controlling the mechanism to deform the formwork or the second substrate based on the shape correction amount in the first substrate;
In each of the plurality of shot regions on the second substrate, the plurality of form-side marks and the plurality of second substrate-side marks formed on the second substrate are obtained without using the detection results of the plurality of first substrate-side marks. control the measurement unit to detect,
controlling the mechanism based on a second amount of position shift between the formwork and the second substrate obtained from the detection result;
The imprint apparatus according to claim 1, wherein the number of the detected second substrate-side marks is smaller than the number of the first substrate-side marks. A computer program stored in a computer-readable recording medium, characterized in that the computer executes the method according to claim 1 or 10. A step of forming a pattern of an imprint material on a substrate using the imprint apparatus according to claim 11;
A method for manufacturing an article, comprising a processing step of processing the substrate on which the pattern is formed in the step, and manufacturing an article from the substrate processed by the processing step. delete delete delete

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