KR20180036421A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

Info

Publication number
KR20180036421A
KR20180036421A KR1020160127018A KR20160127018A KR20180036421A KR 20180036421 A KR20180036421 A KR 20180036421A KR 1020160127018 A KR1020160127018 A KR 1020160127018A KR 20160127018 A KR20160127018 A KR 20160127018A KR 20180036421 A KR20180036421 A KR 20180036421A
Authority
KR
South Korea
Prior art keywords
substrate
transfer unit
pin
supporting
support
Prior art date
Application number
KR1020160127018A
Other languages
Korean (ko)
Inventor
김정택
김명수
김형목
Original Assignee
주식회사 선익시스템
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 선익시스템 filed Critical 주식회사 선익시스템
Priority to KR1020160127018A priority Critical patent/KR20180036421A/en
Publication of KR20180036421A publication Critical patent/KR20180036421A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H01L51/56—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/203—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy using physical deposition, e.g. vacuum deposition, sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H01L51/001—

Abstract

The present invention provides a substrate processing apparatus which can sequentially and evenly attach a substrate from one side to the other side in a substrate loading region when the substrate is loaded onto a substrate support unit by making the substrate support unit approach a substrate transfer unit. To this end, the substrate transfer unit includes a plurality of support pins capable of ascending and a spring elastically supporting the support pins, wherein the available ascending height of the support pins gets lower toward the other side from the one side.

Description

기판 처리장치 {SUBSTRATE PROCESSING APPARATUS}[0001] SUBSTRATE PROCESSING APPARATUS [0002]

본 발명의 실시예는 챔버에서 기판의 표면을 처리하는 장치에 관한 것이다.An embodiment of the present invention relates to an apparatus for treating a surface of a substrate in a chamber.

유기발광다이오드(organic light emitting diode : OLED)는 형광성 유기화합물에 전류가 흐르면 발광하는 전계발광현상을 이용하여 빛을 내는 자체발광형 유기물질을 말한다. 이러한 유기발광다이오드에 의한 디스플레이는 낮은 전압에서 구동 가능하고 얇은 박형으로 제조할 수 있으며 넓은 시야각 및 신속한 응답속도를 가지므로 LCD(liquid crystal display)와 달리 바로 옆에서 보아도 화질이 변하지 않고 화면에 잔상이 남지 않는다. 그리고, 소형화면에서는 LCD 이상의 화질과 단순한 제조공정으로 인하여 유리한 가격 경쟁력을 가지므로 차세대 디스플레이소자로 큰 주목을 받고 있다.An organic light emitting diode (OLED) is a self-emitting organic material that emits light by using an electroluminescence phenomenon in which a fluorescent organic compound emits light when an electric current flows. Such a display using an organic light emitting diode can be driven at a low voltage and can be manufactured in a thin shape. Since it has a wide viewing angle and a quick response speed, unlike a liquid crystal display (LCD), the image quality does not change even if viewed from the side, Do not leave. In addition, in the case of a small-size screen, the display device has attracted a great deal of attention as a next-generation display device because of its superior price competitiveness owing to the image quality and simple manufacturing process of the LCD.

유기발광다이오드를 이용하여 이동통신단말기용 디스플레이나 텔레비전 등을 생산할 때 필요한 것이 바로 기판 처리장치의 한 종류인 박막증착장치인데, 박막증착장치는 기판에 유기물질을 증착하여 박막을 형성하는 것으로서 유기발광다이오드의 제조를 위한 중요한 장비 중 하나이다.A thin film deposition apparatus, which is a kind of a substrate processing apparatus, is required to produce a display or a television for a mobile communication terminal using an organic light emitting diode. A thin film deposition apparatus forms a thin film by depositing an organic material on a substrate, Is one of the important equipment for the manufacture of diodes.

일반적으로, 박막증착장치는, 챔버(chamber), 챔버의 내부에 배치된 기판 지지유닛 및 처리할 기판을 챔버의 내부에 반입하는 기판 이송유닛을 포함한다. 기판 이송유닛에 의하여 반입된 기판은 기판 지지유닛의 하부에 마련된 기판 로딩영역에 로딩된다. 기판을 로딩하는 과정에는 다음과 같은 문제점이 발생될 수 있다.Generally, a thin film deposition apparatus includes a chamber, a substrate support unit disposed inside the chamber, and a substrate transfer unit for transferring the substrate to be processed into the chamber. The substrate carried by the substrate transfer unit is loaded into a substrate loading area provided at the bottom of the substrate holding unit. The following problems may occur in the process of loading the substrate.

기판을 기판 이송유닛에 의하여 기판 로딩영역과 대향하도록 위치시킨 다음, 기판 지지유닛과 기판 이송유닛을 접근시켜 기판 로딩영역에 기판의 상면을 전체적으로 거의 동시에 밀착시키는 방식으로 기판을 로딩하는 구성을 가지기 때문에, 기판이 기판 로딩영역에 전체적으로 반반하게 밀착되지 않고 자칫 부분적으로 울면서 불안정하게 로딩될 수 있고, 이에 따라 박막 균일도 저하 등의 공정 불량이 야기될 수 있다.Since the substrate is placed in such a manner that the substrate is placed by the substrate transfer unit so as to face the substrate loading area and then the substrate supporting unit and the substrate transfer unit are approached and the top surface of the substrate is closely adhered to the substrate loading area, , The substrate may not be closely adhered to the substrate loading area as a whole, and may be unstably loaded while partially crying, thereby causing a process failure such as deterioration of uniformity of the thin film.

대한민국 공개특허공보 제10-2006-0064858호(2006.06.14)Korean Patent Publication No. 10-2006-0064858 (2006.06.14) 대한민국 등록특허공보 제10-1058748호(2011.08.24)Korean Registered Patent No. 10-1058748 (Aug. 24, 2011)

본 발명의 실시예는 기판의 로딩 안정성 향상 면에서 보다 유리한 기판 처리장치를 제공하는 데 목적이 있다.It is an object of the present invention to provide a substrate processing apparatus which is more advantageous from the viewpoint of improving the loading stability of the substrate.

해결하고자 하는 과제는 이에 제한되지 않고, 언급되지 않은 기타 과제는 통상의 기술자라면 이하의 기재로부터 명확히 이해할 수 있을 것이다.The problems to be solved are not limited thereto, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

본 발명의 실시예에 따르면, 기판 처리공간을 가진 챔버와; 상기 기판 처리공간에 배치되고 하부에 기판 로딩영역이 마련되며 상기 기판 로딩영역에 로딩된 기판을 지지하는 기판 지지유닛과; 기판을 상기 기판 로딩영역에 로딩시키기 위하여 기판을 이송하여 상기 기판 처리공간에 반입하는 기판 이송유닛을 포함하고, 상기 기판 이송유닛은, 상부에 기판이 배치되며 기판의 외곽을 지지하는 외곽 지지수단을 가진 이송유닛 본체와; 상기 이송유닛 본체의 상부에 각각 장착되어 기판을 하측에서 지지하며 서로 이격되도록 배치되고 각각 승강 가능한 지지핀 및 상기 지지핀이 상승되도록 상기 지지핀을 탄력적으로 지지하는 탄성지지수단을 가진 복수의 핀 모듈을 포함하며, 상기 복수의 핀 모듈은 상기 이송유닛 본체의 한쪽에서 다른 쪽 방향으로 배치된 순서에 따라 상승된 상기 지지핀의 높이가 점차적으로 낮아지도록 구성된, 기판 처리장치가 제공될 수 있다.According to an embodiment of the present invention, there is provided a plasma processing apparatus comprising: a chamber having a substrate processing space; A substrate supporting unit disposed in the substrate processing space and provided with a substrate loading area below the substrate loading unit and supporting the substrate loaded on the substrate loading area; And a substrate transferring unit for transferring the substrate into the substrate processing space in order to load the substrate into the substrate loading area, wherein the substrate transferring unit includes an outer supporting means for supporting the outer periphery of the substrate, A transfer unit main body; A plurality of pin modules mounted on the upper portion of the transfer unit body and having elastic support means for supporting the substrate from below and spaced apart from each other and capable of being lifted and lowered, Wherein the plurality of pin modules are configured such that the height of the raised support pins is gradually lowered in the order in which they are arranged in the other direction from one side of the transfer unit body.

본 발명의 실시예에 따른 기판 처리장치가 박막증착장치인 경우, 상기 기판 처리공간은 증착공간일 수 있다.When the substrate processing apparatus according to the embodiment of the present invention is a thin film deposition apparatus, the substrate processing space may be a deposition space.

상기 복수의 핀 모듈은 상기 이송유닛 본체의 한쪽에서 다른 쪽 방향으로 배치된 순서에 따라 상기 지지핀의 상하 길이가 상대적으로 짧을 수 있다.The support pin may have a relatively long vertical length according to a sequence of arranging the plurality of pin modules from one side to the other side of the transfer unit body.

상기 복수의 핀 모듈은 상기 지지핀이 서로 동일한 높이로 하강 가능하게 구성될 수 있다.The plurality of pin modules may be configured such that the support pins can be lowered to the same height.

상기 복수의 핀 모듈은 상기 지지핀이 기판의 패턴영역을 제외한 더미영역에 접촉하도록 배치될 수 있다.The plurality of pin modules may be arranged such that the support pins contact the dummy area except the pattern area of the substrate.

상기 복수의 핀 모듈의 탄성지지수단은 상기 지지핀들을 통하여 기판의 하중을 초과하는 힘이 작용하면 압축되는 스프링일 수 있다.The elastic support means of the plurality of pin modules may be a spring that is compressed when a force exceeding the load of the substrate is applied through the support pins.

과제의 해결 수단은 이하에서 설명하는 실시예, 도면 등을 통하여 보다 구체적이고 명확하게 될 것이다. 또한, 이하에서는 언급한 해결 수단 이외의 다양한 해결 수단이 추가로 제시될 수 있다.Means for solving the problems will be more specifically and clarified through the embodiments, drawings, and the like described below. In addition, various solution means other than the above-mentioned solution means may be further proposed.

본 발명의 실시예에 따르면, 기판 지지유닛이 어느 한쪽에서 다른 쪽 방향으로 배치된 순서에 따라 상승된 지지핀의 높이가 점차적으로 낮은 핀 모듈들을 포함하기 때문에, 증착공간에서 기판 지지유닛과 기판 이송유닛을 접근시켜 기판 지지유닛에 기판을 로딩 시, 기판 로딩영역에 기판을 한쪽부터 다른 쪽까지 순차적으로 반반하게 밀착시킬 수 있고, 이로써 기판이 불안정하게 로딩됨에 따른 공정 불량을 방지할 수 있다.According to the embodiment of the present invention, since the height of the raised support pin gradually decreases in accordance with the order in which the substrate support units are arranged in the other direction from one another, When the substrate is loaded into the substrate supporting unit by approaching the unit, the substrate can be brought into close contact with the substrate loading region in a progressively sequential manner from one side to the other side, thereby preventing a process failure due to unstable loading of the substrate.

도 1은 본 발명의 실시예에 따른 기판 처리장치를 나타내는 구성도이다.
도 2는 도 1에 도시된 기판 이송유닛을 나타내는 평면도이다.
도 3은 도 2의 A-A선 단면도이다.
도 4 및 도 5는 본 발명의 실시예에 따른 기판 처리장치를 구성하는 핀 모듈들의 작동을 개념적으로 나타내는 단면도이다.1 is a configuration diagram showing a substrate processing apparatus according to an embodiment of the present invention.
2 is a plan view showing the substrate transfer unit shown in Fig.
3 is a sectional view taken along the line AA in Fig.
4 and 5 are sectional views conceptually showing the operation of the pin modules constituting the substrate processing apparatus according to the embodiment of the present invention.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 설명한다. 참고로, 본 발명의 실시예를 설명하기 위하여 참조하는 도면에서 구성요소의 크기나 선의 두께 등은 이해의 편의상 다소 과장되게 표현되어 있을 수 있다. 또한, 본 발명의 실시예를 설명하는 데 사용되는 용어는 주로 본 발명에서의 기능을 고려하여 정의한 것이므로 사용자, 운용자의 의도, 관례 등에 따라 달라질 수 있다. 그러므로, 용어에 대해서는 본 명세서의 전반에 걸친 내용을 토대로 하여 해석하는 것이 마땅하겠다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For a better understanding of the invention, it is to be understood that the size of elements and the thickness of lines may be exaggerated for clarity of understanding. Further, the terms used to describe the embodiments of the present invention are mainly defined in consideration of the functions of the present invention, and thus may be changed depending on the intentions and customs of the user and the operator. Therefore, the terminology should be interpreted based on the contents of the present specification throughout.

본 발명에 따른 기판 처리장치는 박막증착(thin film deposition), 포토리소그래피(photolithography) 또는 식각(etching) 등의 기판 처리공정에 이용될 수 있는 것이나, 본 발명의 실시예는 기판 처리장치가 기판에 유기물질을 증착하여 박막을 형성하는 박막증착장치인 것을 중심으로 살펴보기로 한다.The substrate processing apparatus according to the present invention may be used in a substrate processing process such as thin film deposition, photolithography, or etching. However, in the embodiment of the present invention, And a thin film deposition apparatus for depositing an organic material to form a thin film.

본 발명의 실시예에 따른 기판 처리장치가 도 1 내지 도 5에 도시되어 있다.A substrate processing apparatus according to an embodiment of the present invention is shown in Figs.

도 1을 참조하면, 본 발명의 실시예에 따른 기판 처리장치는, 내부에 증착공간(12)이 마련된 챔버(10), 증착공간(12)의 상부영역에 배치된 기판 지지유닛(20), 증착공간(12)의 하부영역에 배치된 도가니(증발원, 30) 및 기판(S)을 증착공간(12)에 반입하거나 증착공간(12)으로부터 반출하는 기판 이송유닛(40)을 포함한다.Referring to FIG. 1, a substrate processing apparatus according to an embodiment of the present invention includes a chamber 10 having an evaporation space 12 therein, a substrate support unit 20 disposed in an upper region of the evaporation space 12, And a substrate transfer unit 40 for transferring or discharging the crucible (evaporation source) 30 and the substrate S placed in the lower region of the deposition space 12 into or out of the deposition space 12.

챔버(10)의 벽체에는 기판(S)(이하, 도면부호의 병기는 생략한다)의 반입 및 반출을 위한 기판 출입구(14)가 마련된다. 도시된 바는 없으나, 증착공간(12)은 배기유닛에 의하여 진공분위기로 조성될 수 있다. 그리고, 기판 출입구(14)는 개폐유닛에 의하여 개폐될 수 있다.In the wall of the chamber 10, there is provided a substrate entry / exit port 14 for loading / unloading the substrate S (hereinafter referred to as "the apparatus"). Although not shown, the deposition space 12 can be formed in a vacuum atmosphere by an exhaust unit. The substrate entrance 14 can be opened and closed by the opening and closing unit.

기판 지지유닛(20)은 척킹수단(22)을 포함한다. 기판 지지유닛(20)의 하부에는 기판 이송유닛(40)에 의하여 증착공간(12)에 반입된 기판이 로딩되는 기판 로딩영역(24)이 마련된다. 기판 로딩영역(24)은 평편하도록 형성하는 것이 바람직하다. 기판 로딩영역(24)에 로딩된 기판은 척킹수단(22)에 의하여 위치가 고정된다. 척킹수단(22)으로는 정전척(electrostatic chuck)을 적용하는 것이 바람직하다. 도시된 바는 없으나, 이러한 기판 지지유닛(20)은 승강유닛에 의하여 상하방향으로 이동될 수 있다.The substrate support unit (20) includes a chucking means (22). A substrate loading region 24 is provided under the substrate supporting unit 20 in which the substrate loaded into the deposition space 12 is loaded by the substrate transfer unit 40. The substrate loading region 24 is preferably formed to be flat. The substrate loaded in the substrate loading area 24 is fixed in position by the chucking means 22. As the chucking means 22, it is preferable to apply an electrostatic chuck. Although not shown, such a substrate supporting unit 20 can be moved up and down by an elevating unit.

도가니(30)는, 내부에 유기물질(증착물질)이 담긴 도가니 본체 및 도가니 본체 내 유기물질을 증발시키기 위한 고온의 열을 제공하는 가열수단을 포함한다. 이러한 도가니(30)는 기판 지지유닛(20)에 의하여 위치가 고정된 기판에 박막 증착을 위한 유기물질을 제공한다.The crucible 30 includes a crucible body containing an organic material (evaporation material) therein and a heating means for providing high-temperature heat for evaporating organic substances in the crucible body. This crucible 30 provides an organic material for thin film deposition on a substrate that is fixed in position by the substrate support unit 20.

도 2 등을 참조하면, 기판 이송유닛(40)은, 이송하고자 하는 기판이 상부에 배치되는 이송유닛 본체(100) 및 이송유닛 본체(100)를 이동시키는 본체 구동수단(200)을 포함한다.2 and the like, the substrate transfer unit 40 includes a transfer unit main body 100 on which a substrate to be transferred is disposed, and a main body drive unit 200 for moving the transfer unit main body 100.

이송유닛 본체(100)는, 가로방향으로 배치되고 세로방향으로 서로 이격된 복수의 가로부재(110), 가장 외측에 위치한 양쪽의 두 가로부재로부터 각각 세로방향으로 돌출되고 가로방향으로 서로 이격된 복수의 세로부재(120), 그리고 이들 가로부재(110)와 세로부재(120) 상에 배치된 기판의 외곽을 지지하여 기판의 가로방향 및 세로방향 이동을 제한하는 외곽 지지수단(132, 134)을 포함한다.The transfer unit body 100 includes a plurality of transverse members 110 arranged in the transverse direction and spaced apart from each other in the longitudinal direction, a plurality of transverse members 110 projecting longitudinally from the two transverse members located on the outermost side, And outer supporting means 132 and 134 for supporting the lateral members 110 and the outer periphery of the substrate disposed on the longitudinal members 120 to limit the horizontal and vertical movement of the substrate, .

도 2, 3을 참조하면, 외곽 지지수단(132, 134)은, 가로부재(110)들의 양단으로부터 상방으로 돌출된 제1지지부재(132) 및 세로부재(120)들의 선단으로부터 상방으로 돌출된 제2지지부재(134)로 구성된다.2 and 3, the outer supporting means 132 and 134 include a first supporting member 132 protruding upward from both ends of the transverse members 110 and a second supporting member 132 protruding upward from the front end of the longitudinal members 120 And a second support member 134.

본체 구동수단(200)은 이송유닛 본체(100)의 상부에 배치된 기판을 증착공간(12)에 반입하여 기판 로딩영역(24)과 대향하는 위치로 이송할 수 있게 구성된다.The main body driving means 200 is configured to transport the substrate placed on the upper portion of the transfer unit body 100 to the deposition space 12 and to be opposed to the substrate loading region 24. [

이송유닛 본체(100)의 상부에는 복수의 핀 모듈(300)이 구비된다. 복수의 핀 모듈(300)은 이송유닛 본체(100)의 상부에서 서로 이격된 위치에 각각 장착되어 기판을 하측에서 지지한다.A plurality of pin modules 300 are provided on the transfer unit main body 100. The plurality of pin modules 300 are respectively mounted at positions spaced apart from each other at an upper portion of the transfer unit body 100 to support the substrate from the lower side.

각각의 핀 모듈(300)은, 이송유닛 본체(100)의 상부에 장착된 마운팅 하우징(310), 마운팅 하우징(310)에 승강(상하 이동) 가능하게 결합된 지지핀(320) 및 지지핀(320)이 상승되도록 마운팅 하우징(310)의 내부에서 지지핀(320)을 탄력적으로 지지하는 탄성지지수단(330)을 포함한다.Each of the pin modules 300 includes a mounting housing 310 mounted on the upper portion of the transfer unit body 100, a support pin 320 coupled to the mounting housing 310 such that the support pin 320 can be moved up and down, And an elastic support means 330 for elastically supporting the support pins 320 inside the mounting housing 310 such that the support pins 320 are lifted.

이와 같은 핀 모듈(300)들은 이송유닛 본체(100)의 한쪽에서 다른 쪽 방향(Y방향 참조)으로 배치된 순서에 따라 상승된 지지핀(320)의 높이가 점차 낮아지도록 구성된다. 즉, 도 4를 기준으로 할 때, 핀 모듈(300)들 중 가장 좌측에 배치된 핀 모듈은 상승된 지지핀의 높이가 가장 높고 가장 우측에 배치된 핀 모듈은 상승된 지지핀의 높이가 가장 낮은 구성을 가지는 것이다.The pin modules 300 are configured such that the height of the raised support pins 320 gradually decreases according to the order of the transfer unit body 100 from one side to the other side (see Y direction). 4, the pin module disposed at the leftmost one of the pin modules 300 has the highest height of the raised support pin and the pin module disposed at the rightmost position has the height of the raised support pin It has a low configuration.

이를 위하여, 핀 모듈(300)들은 이송유닛 본체(100)의 한쪽에서 다른 쪽 방향(Y방향 참조)으로 배치된 순서에 따라 상하 길이가 상대적으로 짧은 지지핀(320)이 적용된다. 즉, 도 4를 기준으로 할 때, 핀 모듈(300)들 중 가장 좌측에 배치된 핀 모듈은 지지핀의 상하 길이가 가장 길고 가장 우측에 배치된 핀 모듈은 지지핀의 상하 길이가 가장 짧은 것이다.For this purpose, the support pins 320 having relatively short vertical lengths are applied according to the order of the pin modules 300 arranged in the other direction (see Y direction) from one side of the transfer unit main body 100. 4, the pin module disposed at the leftmost one of the pin modules 300 has the longest vertical length of the support pin and the shortest length of the support pin of the pin module disposed at the rightmost end .

핀 모듈(300)들은 지지핀(320)이 서로 동일한 높이로 하강 가능하게 구성된다. 즉, 상하 길이가 가장 짧은 지지핀의 하강 높이만큼 다른 상하 길이를 가진 지지핀도 하강시킬 수 있는 하강 거리가 확보된 구성을 가지는 것이다.The pin modules 300 are configured such that the support pins 320 can be lowered to the same height. That is, a downward distance that can lower the support pins having different upper and lower lengths by the fall height of the support pin having the shortest vertical length is ensured.

기판은 이송유닛 본체(100)와 대향하는 하부에 패턴영역(S11)이 마련되는데, 패턴영역(S11)이 손상되는 것을 방지하기 위하여, 핀 모듈(300)들은 지지핀(320)이 기판의 패턴영역(S11)을 제외한 더미영역(S12)에 접촉하도록 배치된다.The substrate is provided with a pattern region S11 at a lower portion opposed to the transfer unit main body 100. In order to prevent the pattern region S11 from being damaged, Are arranged to contact the dummy area S12 except for the area S11.

핀 모듈(300)의 탄성지지수단(330)은 지지핀(320)들을 통하여 기판의 하중을 초과하는 힘이 작용하면 압축되는 스프링을 포함한다.The elastic support means 330 of the pin module 300 includes a spring that is compressed when a force exceeding the load of the substrate is applied through the support pins 320. [

이송유닛 본체(100)의 한쪽에서 다른 쪽 방향(Y방향 참조)으로 배치된 순서에 따라 상승된 지지핀(320)의 높이가 점차 낮은 핀 모듈(300)들에 의하면, 본 발명의 실시예에 따른 기판 처리장치는, 증착공간(12)에서 기판 지지유닛(20)과 기판 이송유닛(40)을 접근시켜 기판 지지유닛(20)에 기판을 로딩 시, 기판 로딩영역(24)에 기판을 한쪽부터 다른 쪽까지 순차적으로 반반하게 밀착시킬 수 있다. 즉, 도 4를 기준으로 기판을 좌측부터 우측까지 순차적으로 밀착시켜 도 5와 같이 반반하게 로딩할 수 있는 것이다.According to the embodiments of the present invention, the height of the raised support pins 320 gradually decreases in accordance with the order of the transfer unit body 100 arranged in the other direction (see Y direction) When the substrate is loaded on the substrate supporting unit 20 by approaching the substrate supporting unit 20 and the substrate transferring unit 40 in the vapor deposition space 12 to the substrate loading area 24, To the other side. That is, the substrate can be closely adhered sequentially from left to right with reference to FIG. 4, so that it can be loaded uniformly as shown in FIG.

이상에서는 본 발명을 설명하였으나, 본 발명은 개시된 실시예 및 첨부된 도면에 의하여 한정되지 않으며 본 발명의 기술적 사상을 벗어나지 않는 범위 이내에서 통상의 기술자에 의하여 다양하게 변형될 수 있다.While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

또한, 본 발명의 실시예에서 설명한 기술적 사상은, 각각 독립적으로 실시될 수도 있고, 둘 이상이 서로 조합되어 실시될 수도 있다.Further, the technical ideas described in the embodiments of the present invention may be performed independently of each other, or two or more may be implemented in combination with each other.

10 : 챔버
12 : 증착공간(기판 처리공간)
20 : 기판 지지유닛
24 : 기판 로딩영역
40 : 기판 이송유닛
100 : 이송유닛 본체
132, 134 : 외곽 지지수단
300 : 핀 모듈
310 : 마운팅 하우징
320 : 지지핀
330 : 탄성지지수단(스프링)10: chamber
12: Deposition space (substrate processing space)
20:
24: substrate loading area
40: substrate transfer unit
100:
132, 134: outer supporting means
300: Pin module
310: Mounting housing
320: Support pin
330: elastic support means (spring)

Claims (5)

기판 처리공간을 가진 챔버와;
상기 기판 처리공간에 배치되고 하부에 기판 로딩영역이 마련되며 상기 기판 로딩영역에 로딩된 기판을 지지하는 기판 지지유닛과;
기판을 상기 기판 로딩영역에 로딩시키기 위하여 기판을 이송하여 상기 기판 처리공간에 반입하는 기판 이송유닛을 포함하고,
상기 기판 이송유닛은,
상부에 기판이 배치되며 기판의 외곽을 지지하는 외곽 지지수단을 가진 이송유닛 본체와;
상기 이송유닛 본체의 상부에 각각 장착되어 기판을 하측에서 지지하며 서로 이격되도록 배치되고, 각각 승강 가능한 지지핀 및 상기 지지핀이 상승되도록 상기 지지핀을 탄력적으로 지지하는 탄성지지수단을 가진 복수의 핀 모듈을 포함하며,
상기 복수의 핀 모듈은 상기 이송유닛 본체의 한쪽에서 다른 쪽 방향으로 배치된 순서에 따라 상승된 상기 지지핀의 높이가 점차적으로 낮아지도록 구성된,
기판 처리장치.A chamber having a substrate processing space;
A substrate supporting unit disposed in the substrate processing space and provided with a substrate loading area below the substrate loading unit and supporting the substrate loaded on the substrate loading area;
And a substrate transferring unit for transferring the substrate into the substrate processing space for loading the substrate into the substrate loading area,
Wherein the substrate transfer unit comprises:
A transfer unit body having an upper supporting member disposed on the upper portion and supporting the outer periphery of the substrate;
A plurality of pins each having a support pin mounted on an upper portion of the transfer unit main body and supporting the substrate from below and spaced apart from each other and having elastic supporting means for elastically supporting the support pin so as to raise the support pin, Module,
Wherein the plurality of pin modules are configured such that the height of the raised support pins gradually decreases in the order of arrangement from one side of the transfer unit body to the other side,
/ RTI > 청구항 1에 있어서,
상기 복수의 핀 모듈은 상기 이송유닛 본체의 한쪽에서 다른 쪽 방향으로 배치된 순서에 따라 상기 지지핀의 상하 길이가 상대적으로 짧은,
기판 처리장치.The method according to claim 1,
Wherein the plurality of pin modules have a relatively long vertical length of the support pins in order of being arranged in one direction to the other direction of the transfer unit body,
/ RTI > 청구항 2에 있어서,
상기 복수의 핀 모듈은 상기 지지핀이 서로 동일한 높이로 하강 가능하게 구성된,
기판 처리장치.The method of claim 2,
Wherein the plurality of pin modules are configured such that the support pins can be lowered to the same height,
/ RTI > 청구항 1 내지 청구항 3 중 어느 하나에 있어서,
상기 복수의 핀 모듈은 상기 지지핀이 기판의 패턴영역을 제외한 더미영역에 접촉하도록 배치된,
기판 처리장치.The method according to any one of claims 1 to 3,
Wherein the plurality of pin modules are arranged such that the support pins contact the dummy area except the pattern area of the substrate,
/ RTI > 청구항 1 내지 청구항 3 중 어느 하나에 있어서,
상기 복수의 핀 모듈의 탄성지지수단은 상기 지지핀들을 통하여 기판의 하중을 초과하는 힘이 작용하면 압축되는 스프링인,
기판 처리장치.The method according to any one of claims 1 to 3,
Wherein the elastic supporting means of the plurality of pin modules is a spring which is compressed when a force exceeding the load of the substrate is applied through the support pins,
/ RTI >
KR1020160127018A 2016-09-30 2016-09-30 Substrate processing apparatus KR20180036421A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160127018A KR20180036421A (en) 2016-09-30 2016-09-30 Substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160127018A KR20180036421A (en) 2016-09-30 2016-09-30 Substrate processing apparatus

Publications (1)

Publication Number Publication Date
KR20180036421A true KR20180036421A (en) 2018-04-09

Family

ID=61978362

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160127018A KR20180036421A (en) 2016-09-30 2016-09-30 Substrate processing apparatus

Country Status (1)

Country Link
KR (1) KR20180036421A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111180373A (en) * 2018-11-13 2020-05-19 科美仪器 Substrate moving apparatus and method for manufacturing organic light emitting device panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111180373A (en) * 2018-11-13 2020-05-19 科美仪器 Substrate moving apparatus and method for manufacturing organic light emitting device panel
CN111180373B (en) * 2018-11-13 2023-10-03 恒邦解决方案有限公司 Substrate moving apparatus and method for manufacturing organic light emitting element panel

Similar Documents

Publication Publication Date Title
JP6990643B2 (en) Electrostatic chuck, film forming equipment, film forming method, and manufacturing method of electronic devices
KR102520693B1 (en) Deposition Apparatus
KR101960194B1 (en) Film forming apparatus, film forming method and manufacturing method of organic el display device
CN109837510B (en) Film forming apparatus and method for manufacturing organic EL display device using the same
KR101954539B1 (en) Film forming apparatus, film forming method and manufacturing method of organic el display device using the same
JP7138757B2 (en) Film forming apparatus and method for manufacturing electronic device
US20150114297A1 (en) Vapor deposition device
KR101963982B1 (en) Film forming apparatus, film forming method and manufacturing method of electronic device
WO2017118084A1 (en) Conveying apparatus, conveying method, and evaporation device
KR101209654B1 (en) Tilt apparatus for a tray
CN109837519B (en) Film forming apparatus, film forming method, and method for manufacturing organic EL display device
CN111218660A (en) Film forming apparatus, film forming method, and electronic device manufacturing method
KR101953038B1 (en) Electrostatic chuck device, mask attaching device, film-forming apparatus, film-forming method, and method for manufacturing electronic device
KR20180036421A (en) Substrate processing apparatus
KR101473833B1 (en) Substrate deposition system
KR102459872B1 (en) Electrostatic chuk system, film formation apparatus, suction method, film formation method, and manufacturing method of electronic device
KR101407421B1 (en) Substrate deposition system
KR20220112236A (en) Adsorption apparatus, position adjusting method, and method for forming film
KR20190078439A (en) Electrostatic chuck, film forming apparatus including electrostatic chuck, substrate holding and separating method, film forming method including the same, and manufacturing method of electronic device using the same
JP7127765B2 (en) Electrostatic chuck, film forming apparatus, substrate adsorption method, film forming method, and electronic device manufacturing method
KR102430370B1 (en) Electrostatic chuk system, film formation apparatus, suction method, film formation method, and manufacturing method of electronic device
JP2021042467A (en) Adsorber, film deposition apparatus, adsorption method, film deposition method and method for manufacturing electronic device
KR20120060588A (en) Substrate processing apparatus
KR102099658B1 (en) Apparatus and method of detaching substrate
KR20150144104A (en) Substrate holder and apparatus for depostion having the same