KR20180036270A - Display device with reliable signal transmission circuit, and signal transmission method - Google Patents

Abstract

Embodiments of the present invention relate to a display device having a reliable signal transmission circuit and a signal transmission method. More specifically, when a first bonding area in an area where a printed circuit board and a circuit film are connected is electrically connected, a signal is transmitted between the printed circuit board and the circuit film through the first bonding area. When the first bonding area is electrically opened, the signal is transmitted between the printed circuit board and the circuit film through a second bonding area different from the first bonding area in the area where the printed circuit board and the circuit film are connected. According to the embodiments of the present invention, signal transmission between the printed circuit board and the circuit film is reliable, thereby enabling the display device to normally operate.

Description

TECHNICAL FIELD [0001] The present invention relates to a display device having a reliable signal transmission circuit and a signal transmission method.

The embodiments relate to a display device having a reliable signal transmission circuit and a signal transmission method.

2. Description of the Related Art [0002] With the development of an information society, demands for a display device for displaying an image have increased in various forms. Recently, a liquid crystal display device (LCD), a plasma display panel (PDP) Various display devices such as an organic light emitting display device (OLED) and the like are being utilized.

In such a display device, a driver for panel driving is implemented as a chip on film type. Here, the chip-on film type driver is implemented by mounting a driver integrated circuit on a circuit film.

A supply source for supplying various signals to a display panel, a driver, or the like is present on a printed circuit board, and the printed circuit board or another printed circuit board connected thereto can be electrically connected to a display panel or a driver through a circuit film.

Accordingly, various signals output from the printed circuit board can be transmitted to the display panel or the driver through the circuit film.

For this reason, in order for the display device to operate normally, there is no problem in electrical connection between the printed circuit board and the circuit film.

However, due to errors in the manufacturing process, there is a problem in the bonding state of the printed circuit board and the circuit film, or in the bonding state of the printed circuit board and the circuit film due to the high temperature or high humidity environment before or after shipping .

In such a case, the driver or the display panel may not operate normally, resulting in a screen abnormality or a serious problem of the quality of the product.

It is an object of these embodiments to provide a display device having a reliable signal transfer circuit between a printed circuit board and a circuit film and a signal transfer method thereof.

Another object of these embodiments is to provide a display device and a signal transmission method having a reliable signal transmission circuit that enables normal driving of the display panel.

It is still another object of the present embodiments to provide a display device and a signal transmission method having a reliable signal transfer circuit that enables normal operation of the driver.

It is still another object of the present embodiments to provide a display device and a signal transmission method having a reliable signal transmission circuit capable of providing an alternative path for signal transmission.

In one aspect, the present embodiments include a display panel, a printed circuit board, a circuit film for electrically connecting the display panel and the printed circuit board, and a signal necessary for driving the panel is transferred from the printed circuit board to the circuit film A display device can be provided.

Such a display device can provide a reliable signal transfer circuit.

In such a display device, in a region where the circuit film and the printed circuit board are electrically connected, a plurality of circuit film pads existing on the circuit film and a plurality of printed circuit board pads existing on the printed circuit board can be bonded to each other .

The plurality of circuit film pads includes a first circuit film pad, a second circuit film pad, and a third circuit film pad, wherein the plurality of printed circuit board pads includes a first printed circuit board pad, a second printed circuit board pad, And may include printed circuit board pads.

The first circuit film pad and the first printed circuit board pad correspond to each other, the second circuit film pad and the second printed circuit board pad correspond to each other, and the third circuit film pad and the third printed circuit board pad correspond to each other .

In such a display device, when the bonding state of the first circuit film pad and the first printed circuit board pad is normal, a signal can be transmitted from the first printed circuit board pad to the first circuit film pad.

In such a display device, when the bonding state of the first circuit film pad and the first printed circuit board pad is abnormal, a signal can be transmitted from the second printed circuit board pad to the second circuit film pad.

In another aspect, the present embodiments can provide a display device having a reliable signal transfer circuit including a display panel, a printed circuit board, and a circuit film for electrically connecting the display panel and the printed circuit board.

In such a display device, when the first bonding area in the area where the printed circuit board and the circuit film are connected is electrically connected, a signal can be transmitted between the printed circuit board and the circuit film through the first bonding area.

In such a display device, when the first bonding area is electrically opened, a signal is transmitted between the printed circuit board and the circuit film through the second bonding area different from the first bonding area in the area where the printed circuit board and the circuit film are connected, Lt; / RTI >

According to another aspect of the present invention, there is provided a display device including a display panel, a printed circuit board, and a circuit film for electrically connecting the display panel and the printed circuit board, A signal transmission method can be provided.

The signal transmission method of a display device according to the present invention is a method of transmitting signals between a printed circuit board and a circuit film through a first bonding area when a first bonding area in a region where a printed circuit board and a circuit film are connected is electrically connected A signal is transmitted between the printed circuit board and the circuit film through the second bonding area different from the first bonding area in the area where the printed circuit board and the circuit film are connected when the first bonding area is electrically opened .

According to the embodiments as described above, it is possible to provide a display device having a reliable signal transmission circuit between a printed circuit board and a circuit film and a signal transmission method therefor.

Further, according to the embodiments, it is possible to provide a display device and a signal transmission method having a reliable signal transmission circuit that enables normal driving of the display panel.

Further, according to the embodiments, it is possible to provide a display device and a signal transmission method having a reliable signal transmission circuit that enables normal operation of the driver.

In addition, according to the embodiments, it is possible to provide a display device and a signal transmission method having a reliable signal transmission circuit capable of providing an alternative path for signal transmission.

1 is a schematic system configuration diagram of a display apparatus according to the present embodiments.
2 is a system implementation example of a display device according to the present embodiments.
3 is a diagram showing a region where a COF type data driver exists in the display device according to the present embodiments.
4 is a view showing a pad portion of a circuit film and a pad portion of a printed circuit board in a bonding region of a circuit film and a printed circuit board in the display device according to the present embodiments.
5 is a cross-sectional view of a bonded region of a circuit film and a printed circuit board in a display device according to the present embodiments.
FIG. 6 is a cross-sectional view showing the bonding state of the main bonding region in the bonding region of the circuit film and the printed circuit board in the display device according to the present embodiments. FIG.
7 is a view showing a reliable signal transmission structure in contrast to the bonding error of the main bonding region in the bonding region of the circuit film and the printed circuit board in the display device according to the present embodiments.
Fig. 8 is a view showing a reliable signal transfer circuit in the bonding area of the circuit film and the printed circuit board in the display device according to the present embodiments.
9 is a view showing an operation table of a signal propagation enhancing circuit in a reliable signal transmitting circuit in a bonding region of a circuit film and a printed circuit board in a display device according to the present embodiments.
FIGS. 10 and 11 are diagrams showing a signal transmission flow when the bonding state of the main bonding region is normal in the bonding region of the circuit film and the printed circuit board in the display device according to the present embodiments.
12 and 13 are diagrams illustrating a signal transmission flow when the bonding state of the main bonding region is abnormal in the bonding region of the circuit film and the printed circuit board in the display device according to the present embodiments.
Fig. 14 is another view showing a reliable signal transfer circuit in the bonding area of the circuit film and the printed circuit board in the display device according to the present embodiments. Fig.
15 to 18 are diagrams showing the types of signals transmitted through the signal transfer circuit of the display device according to the present embodiments.
19 is a flowchart of a signal transmission method of a display device according to the present embodiments.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In the drawings, like reference numerals are used to denote like elements throughout the drawings, even if they are shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the components from other components, and the terms do not limit the nature, order, order, or number of the components. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; intervening "or that each component may be" connected, "" coupled, "or " connected" through other components.

1 is a schematic system configuration diagram of a display apparatus 100 according to the present embodiments.

Referring to FIG. 1, the display device 100 according to the present embodiment includes a plurality of data lines DL and a plurality of gate lines GL, and a plurality of data lines DL and a plurality of gate lines GL. A display panel 110 in which a plurality of sub pixels (SP) defined by a plurality of gate lines GL (GL) are arranged, a data driver 120 driving a plurality of data lines DL, A gate driver 130 for driving the data driver 120 and a controller 140 for controlling the data driver 120 and the gate driver 130, and the like.

The controller 140 supplies various control signals to the data driver 120 and the gate driver 130 to control the data driver 120 and the gate driver 130.

The controller 140 starts scanning according to the timing implemented in each frame, switches the input image data input from the outside according to the data signal format used by the data driver 120, and outputs the converted image data , And controls the data driving at a suitable time according to the scan.

The controller 140 may be a timing controller used in a conventional display technology or a control device including a timing controller to perform other control functions.

The controller 140 may be implemented as a separate component from the data driver 120, or may be implemented as an integrated circuit together with the data driver 120.

The data driver 120 drives the plurality of data lines DL by supplying data voltages to the plurality of data lines DL. Here, the data driver 120 is also referred to as a 'source driver'.

The data driver 120 may drive a plurality of data lines including at least one source driver integrated circuit (SDIC).

Each source driver integrated circuit (SDIC) may include a shift register, a latch circuit, a digital to analog converter (DAC), an output buffer, and the like.

Each source driver integrated circuit (SDIC) may further include an analog to digital converter (ADC), as the case may be.

The gate driver 130 sequentially supplies the scan signals to the plurality of gate lines GL to sequentially drive the plurality of gate lines GL. Here, the gate driver 130 is also referred to as a " scan driver ".

The gate driver 130 may include at least one gate driver integrated circuit (GDIC).

Each gate driver IC (GDIC) may include a shift register, a level shifter, and the like.

The gate driver 130 sequentially supplies a scan signal of an On voltage or an Off voltage to the plurality of gate lines GL under the control of the controller 140.

When a specific gate line is opened by the gate driver 130, the data driver 120 converts the image data received from the controller 140 into an analog data voltage and supplies the data voltage to a plurality of data lines DL.

1, the data driver 120 may be located only on one side (e.g., on the upper side or the lower side) of the display panel 110, and in some cases, on the display panel 110 (E.g., the upper side and the lower side).

1, the gate driver 130 may be located only on one side (e.g., the left side or the right side) of the display panel 110, and in some cases, depending on the driving method, (E.g., the left side and the right side).

The controller 140 described above is capable of outputting various kinds of signals including the vertical synchronization signal Vsync, the horizontal synchronization signal Hsync, the input data enable signal (DE), and the clock signal (CLK) Timing signals from the outside (e.g., the host system).

The controller 140 receives a timing signal such as a vertical synchronization signal Vsync, a horizontal synchronization signal Hsync, an input DE signal, and a clock signal to control the data driver 120 and the gate driver 130, And generates various control signals and outputs them to the data driver 120 and the gate driver 130.

For example, in order to control the gate driver 130, the controller 140 generates a gate start pulse (GSP), a gate shift clock (GSC), a gate output enable signal GOE Gate Output Enable (GCS), and the like.

Here, the gate start pulse GSP controls the operation start timing of one or more gate driver integrated circuits constituting the gate driver 130. The gate shift clock GSC is a clock signal commonly input to one or more gate driver integrated circuits, and controls the shift timing of the scan signal (gate pulse). The gate output enable signal GOE specifies the timing information of one or more gate driver ICs.

In order to control the data driver 120, the controller 140 may further include a source start pulse (SSP), a source sampling clock (SSC), a source output enable signal (SOE) And outputs various data driving control signals (DCS: Data Driving Control Signals).

Here, the source start pulse SSP controls the data sampling start timing of one or more source driver integrated circuits constituting the data driver 120. The source sampling clock SSC is a clock signal for controlling sampling timing of data in each of the source driver integrated circuits. The source output enable signal SOE controls the output timing of the data driver 120.

2 is a system implementation example of the display apparatus 100 according to the present embodiments.

Referring to FIG. 2, the data driver 120 may include at least one source driver integrated circuit (SDIC).

Each source driver integrated circuit (SDIC) is connected to a bonding pad of the display panel 110 by a tape automated bonding (TAB) method or a chip on glass (COG) method , And may be directly disposed on the display panel 110, or may be integrated and disposed on the display panel 110 as occasion demands.

Each source driver integrated circuit (SDIC) may be implemented by a chip on film (COF) method, which is mounted on a source circuit film SF connected to the display panel 110, as shown in FIG. .

The gate driver 130 may be implemented by including at least one gate driver integrated circuit (GDIC).

Each gate driver integrated circuit GDIC is connected to a bonding pad of the display panel 110 by a tape automated bonding (TAB) method or a chip on glass (COG) And may be directly disposed on the display panel 110 or integrated on the display panel 110 as the case may be.

Each gate driver IC (GDIC) may be implemented in a chip-on-film (COF) manner, which is mounted on the gate circuit film GF connected to the display panel 110, as shown in FIG.

The display device 100 according to the present embodiments includes at least one source printed circuit board (SPCB) necessary for circuit connection to at least one source driver integrated circuit (SDIC) And a control printed circuit board (CPCB) for mounting various electric devices.

At least one source printed circuit board (SPCB) may be connected to a source circuit film (SF) on which at least one source driver integrated circuit (SDIC) is mounted.

The control printed circuit board CPCB includes a controller 140 for outputting various drive control signals or supplying image data to the data driver 120 in order to control operations of the data driver 120 and the gate driver 130, A power supply controller for controlling various voltages or currents to supply or supply various voltages or currents to the display panel 110, the data driver 120, the gate driver 130, or the like.

The at least one source printed circuit board (SPCB) and the control printed circuit board (CPCB) may be circuitly connected via at least one connection member.

Here, the connecting member may be a flexible printed circuit (FPC), a flexible flat cable (FFC), or the like.

At least one source printed circuit board (SPCB) and a control printed circuit board (CPCB) may be integrated into one printed circuit board.

In addition, the controller 140 may be implemented integrally with a source driver integrated circuit (SDIC).

On the other hand, the source printed circuit board SPCB is electrically connected to the source driver IC (SDIC) through the source circuit film SF and is electrically connected to the display panel 110 through the source circuit film SF And a gate driver integrated circuit (GDIC) electrically connected to the display panel 110 through the source circuit film SF.

That is, signals output from the source printed circuit board SPCB can be transmitted to the source driver IC (SDIC), the display panel 110, and the gate driver IC (GDIC) through the source circuit film SF .

Therefore, the bonding state of the source printed circuit board (SPCB) and the source circuit film (SF) for electrical connection between the source printed circuit board (SPCB) and the source circuit film (SF) must be satisfactory.

The display device 1000 according to the present embodiments may be various types of devices such as a liquid crystal display device, an organic light emitting display device, or a plasma display device, provided that only a printed circuit board and a circuit film exist on the signal transmission path.

3 is a diagram showing a part of a region where the COF type data driver 120 exists in the display device 100 according to the present embodiments.

Referring to FIG. 3, a signal necessary for driving the panel is supplied from the source printed circuit board (SPCB) to the display panel 110 via the source circuit film SF.

The signal supplied to the display panel 110 is supplied to the gate driver 130 when a signal necessary for driving the panel is a gate drive control signal (e.g., GSP) used for performing gate drive .

Accordingly, the gate driver integrated circuit (GDIC) implementing the gate driver 130 generates a scan signal using the supplied signal (e.g., GSP) and outputs it to the corresponding gate line.

Referring to FIG. 3, the source circuit film SF electrically connects the source printed circuit board SPCB and the display panel 110.

One end of the source circuit film SF is bonded to the source printed circuit board SPCB and the other end of the source circuit film SF is bonded to the display panel 110. [

A pad portion (a plurality of circuit film pads present) and a source printed circuit board SPCB in the source circuit film SF are formed in a region BA to which the source circuit film SF and the source printed circuit board SPCB are bonded, The pad portions (in the presence of a plurality of printed circuit board pads) are bonded.

In this bonding structure, a plurality of circuit film pads existing in the pad portion of the source circuit film (SF) and at least one of a plurality of printed circuit board pads existing in the pad portion of the source printed circuit board (SPCB) A pad-printed circuit board pad) can not be bonded due to high temperature, high humidity, or the like after the manufacturing process step or shipment, and a bonding error condition that is electrically opened may occur.

In this case, a signal to be transmitted can not be transmitted through a pair of bonding portions that are electrically opened and a bonding error occurs. Accordingly, panel driving can not be normally performed and a screen abnormal phenomenon may occur have.

This occurs not only in the bonding area between the source printed circuit board (SPCB) and the source circuit film (SF), but also in the bonded area between the gate printed circuit board and the gate circuit film (GF) .

In the following, the source printed circuit board SPCB and the source circuit film SF are simply described as a printed circuit board SPCB and a circuit film SF.

In the following description, even if a bonding error situation occurs between the printed circuit board SPCB and the circuit film SF, signals are normally supplied to the display panel 110 through the printed circuit board SPCB and the circuit film SF Describe the circuit and the method that allows it to become.

Hereinafter, for convenience of explanation, a signal supplied to the display panel 110 through the printed circuit board SPCB and the circuit film SF will be described as a GSP (Gate Start Pulse) signal, for example. The present invention is not limited to this, and the signal supplied to the display panel 110 may be any kind of signal other than the GSP signal.

4 is a side view showing a state in which the pad portion FPA of the circuit film SF and the printed circuit board SPCB of the printed circuit board SPCB in the bonding area of the circuit film SF and the printed circuit board SPCB in the display device 100 according to the present embodiments, (PPA) of FIG.

4 is a view showing the pad portion FPA of the circuit film SF to be bonded and the pad portion PPA of the printed circuit board SPCB separately in the BA region of Fig.

Referring to FIG. 4, a plurality of circuit film pads FP1B, FP1A, FP1C, FP2, FP3, FP4,... Are present in the pad portion FPA of the circuit film SF.

A plurality of printed circuit board pads PP1B, PP1A, PP1C, PP2, PP3, PP4, ... are present in the pad portion PPA of the printed circuit board SPCB.

A plurality of circuit film pads FP1B, FP1A, FP1C, FP2, FP3, FP4, ... and a plurality of printed circuit board pads PP1B, PP1A, PP1C, PP2, PP3, PP4, do.

That is, the circuit film pad FP1B and the printed circuit board pad PP1B are bonded, the circuit film pad FP1A and the printed circuit board pad PP1A are bonded, the circuit film pad FP1C and the printed circuit board pad PP1C are bonded, The circuit board pad PP2 is bonded, the circuit film pad FP3 and the printed circuit board pad PP3 are bonded, and the circuit film pad FP4 and the printed circuit board pad PP4 are bonded.

Hereinafter, it is assumed that a certain signal GSP is transferred from the printed circuit board SPCB to the circuit film SF through the circuit film pad FP1A and the printed circuit board pad PP1A and supplied to the display panel 100. FIG.

Therefore, in the following, the circuit film pad FP1A is referred to as a first circuit film pad, and the printed circuit board pad PP1A is referred to as a first printed circuit board pad. The circuit film pad FP1B located around the circuit film pad FP1B is referred to as a second circuit film pad, and the printed circuit board pad PP1B is referred to as a second printed circuit board pad. The circuit film pad FP1C is referred to as a third circuit film pad, and the printed circuit board pad PP1C is referred to as a third printed circuit board pad.

5 is a sectional view of a bonding region of the circuit film SF and the printed circuit board SPCB in the display device 100 according to the present embodiments.

5, the first printed circuit board pad PP1A existing on the pad portion PPA of the printed circuit board SPCB and the first printed circuit board pad PPA existing on the pad portion FPA of the circuit film SF The region to which the first signal FP1A is bonded corresponds to the main bonding region MBA which is a main path of signal transmission from the viewpoint of the signal GSP.

A region DBA to which the second printed circuit board pad PP1B and the second circuit film pad FP1B are bonded and a region DBA to which the third printed circuit board pad PP1C and the third circuit film pad FP1C are bonded FBA) is located around the main bonding area MBA.

5, the area DBA where the printed circuit board pad PP1B and the second circuit film pad FP1B are bonded and the area DBA where the third printed circuit board pad PP1C and the third circuit film pad FP1C are bonded Area FBA is shown as being on the left and right sides of the main bonding area MBA.

This is for the sake of convenience of description only and it is not limited to the area DBA in which the printed circuit board pad PP1B and the second circuit film pad FP1B are bonded and the area in which the third printed circuit board pad PP1C and the third circuit film pad FP1C-bonded areas FBA may be all present on the left side of the main bonding area MBA or all of them may be on the right side of the main bonding area MBA and may be located on the right and left sides of the main bonding area MBA. It may exist.

6 is a graph showing the bonding state of the main bonding area MBA of the display device 100 according to the present embodiment in terms of the signal GSP in the bonding area of the circuit film SF and the printed circuit board SPCB Fig.

Referring to FIG. 6, the first circuit film pad FP1A and the first printed circuit board pad PP1A in the main bonding area MBA located at the second leftmost position in the drawing may not be structurally bonded properly, It is likely to be in an open state in which it is not electrically connected.

That is, there is a high possibility that a bonding error occurs in the main bonding area MBA located at the second leftmost position.

Particularly, a main bonding area MBA (second inter-pad bonding area) which is the second inter-pad bonding area in the left or right side of the bonding area between the circuit film SF located at the leftmost or rightmost position of the display panel 110 and the printed circuit board SPCB, ) Is likely to occur.

Bonding errors in the main bonding area MBA may be mis-assembled at the pre-shipment stage, or may occur frequently at high temperature or at high humidity before and after shipment.

When a bonding error occurs in the main bonding area MBA, the signal GSP is not transferred from the printed circuit board SPCB to the circuit film SF through the main bonding area MBA, The signal GSP can not be supplied to the panel, and panel driving is not normally performed.

If the gate driver 120 is present on only one side of the display panel 110 and the signal that can not be delivered through the main bonding area MBA is a gate drive control signal such as a GSP signal, Lt; / RTI >

If the gate driver 120 is present on both sides of the display panel 110 and the signal that can not be transmitted through the main bonding area MBA is a gate drive control signal such as a GSP signal, .

In the present embodiments, even if a bonding error occurs, a signal (for example, a gate drive control signal such as a GSP signal) necessary for panel driving is transmitted from the printed circuit board SPCB to the circuit Even if it can not be delivered to the display panel 110 due to the inability to transfer the film SF to the display panel 110, the signal is made to create an "alternative path" between the printed circuit board SPCB and the circuit film SF, Quot; Reliable Signal Transmission Circuit "that allows the signal to be transmitted from the substrate SPCB to the circuit film SF so that the signal can be normally supplied to the display panel 110. [

Hereinafter, a reliable signal transfer circuit according to the present embodiments will be described in more detail with reference to FIGS. 7 to 14. FIG.

7 and 8 are diagrams showing the reliability of the display device 100 according to the present embodiments in the bonding area of the circuit film SF and the printed circuit board SPCB in comparison with the bonding error of the main bonding area MBA, And Fig.

Referring to FIGS. 7 and 8, the display panel 110 and the printed circuit board SPCB are electrically connected by a circuit film SF.

A signal (for example, a gate drive control signal such as a GSP signal) necessary for driving the panel is supplied from the printed circuit board SPCB to the display panel 110 through the circuit film SF.

A plurality of circuit film pads FP1B, FP1A, FP1C, and FP2 (hereinafter referred to as " FP1B ") that are present in the pad portion FPA of the circuit film SF in an area (bonding area) where the circuit film SF and the printed circuit board SPCB are electrically connected And the plurality of printed circuit board pads PP1B, PP1A, PP1C, PP2, PP3, PP4, ... existing in the pad portion PPA of the printed circuit board SPCB correspond to each other, do.

7, the plurality of circuit film pads FP1B, FP1A, FP1C, FP2, FP3 and FP4 are connected to the first circuit film pad FP1A, the second circuit film pad FP1B and the third circuit film pad FP1C ).

Referring to FIG. 7, a plurality of printed circuit board pads PP1B, PP1A, PP1C, PP2, PP3 and PP4 are connected to a first printed circuit board pad PP1A, a second printed circuit board pad PP1B, And a substrate pad PP1C.

Referring to FIG. 7, the first circuit film pad FP1A and the first printed circuit board pad PP1A correspond to each other. The second circuit film pads FP1B and the second printed circuit board pads PP1B correspond to each other. The third circuit film pad FP1C and the third printed circuit board pad PP1C correspond to each other.

7, when a bonding state of the first circuit film pad FP1A and the first printed circuit board pad PP1A is normal, a signal (for example, a gate drive control signal such as a GSP signal) May be transferred from the first printed circuit board pad PP1A to the first circuit film pad FP1A and supplied to the display panel 110. [

Referring to FIGS. 7 and 8, the area where the first circuit film pad FP1A and the first printed circuit board pad PP1A are bonded corresponds to the main bonding area MBA.

7, when the bonding state of the first circuit film pad FP1A and the first printed circuit board pad PP1A is normal, the first path PATH 1 to which the signal is transmitted is connected to the printed circuit board SPCB, A first printed circuit board pad PP1A of a printed circuit board SPCB, a first circuit film pad FP1A of a circuit film SF, a circuit film SF and the like, .

7, when a bonding state of the first circuit film pad FP1A and the first printed circuit board pad PP1A is abnormal, a signal (for example, a gate driving control signal such as a GSP signal) necessary for driving the panel is Can be transferred from the second printed circuit board pad PP1B to the second circuit film pad FP1B and supplied to the display panel 110. [

Referring to FIGS. 7 and 8, the area where the second circuit film pad FP1B and the second printed circuit board pad PP1B are bonded corresponds to the dummy bonding area DBA.

The second path PATH 2 to which the signal is transmitted is connected to the printed circuit board SPCB and the printed circuit board PSP1A when the bonding state between the first circuit film pad FP1A and the first printed circuit board pad PP1A is abnormal. A second printed circuit board pad PP1B of the circuit film SF, a second circuit film pad FP1AB of the circuit film SF and a circuit film SF and corresponds to an alternative path for signal transmission.

As described above, due to the bonding error in the main bonding area MBA, there is a situation where the corresponding signal can not be transmitted to the circuit film SF through the main path PATH 1 for transmitting signals necessary for panel driving (SPCB) and the circuit film (SF) on the path of signal transmission by allowing the signal to be transmitted to the circuit film (SF) through the alternative path (PATH 2) for signal transmission Regardless of the bonding state, reliable and stable signal transmission can be achieved. Thus, normal and stable panel driving can be performed irrespective of the bonding state of the printed circuit board (SPCB) and the circuit film (SF) on the path of signal transmission.

Referring to FIGS. 7 and 8, for reliable signal transmission utilizing the alternative path PATH 2, the display device 100 according to the present embodiments may include a signal transmission path control circuit 700 have.

The signal transmission path control circuit 700 includes a connection line 720 for electrically connecting the first circuit film pad FP1A, the second circuit film pad FP1B and the third circuit film pad FP1C, A signal propagation enhancing circuit 710 for changing the path, and the like.

The signal propagation enhancement circuit 710 includes an output stage O electrically connected to the second printed circuit board pad PP1B, a main input stage MI electrically connected to the first printed circuit board pad PP1A, And a feedback input terminal FI electrically connected to the printed circuit board pad PP1C.

As described above, a simple circuit configuration can enable reliable and stable signal transmission regardless of the bonding state of the printed circuit board (SPCB) and the circuit film (SF) on the path of signal transmission.

9 shows the operation table (truth table) of the signal propagation enhancing circuit 710 in the reliable signal transfer circuit in the bonding area of the circuit film SF and the printed circuit board SPCB in the display device 100 according to the present embodiments. FIGS. 10 and 11 are views showing a state in which the main bonding area MBA is formed in the bonding area of the circuit film SF and the printed circuit board SPCB in the display device 100 according to the present embodiments. And a signal (GSP) transmission flow when the bonding state is normal. 12 and 13 illustrate that the bonding state of the main bonding area MBA in the bonding area of the circuit film SF and the printed circuit board SPCB in the display device 100 according to the present embodiments is abnormal (GSP) transmission flow in the case of FIG.

9, 10 and 11, when the bonding state of the main bonding area MBA is normal in the bonding area of the circuit film SF and the printed circuit board SPCB, that is, The signal transferring reinforcement circuit 710 is connected to the first input terminal MI of the first printed circuit board pad PP1A at the main input terminal MI1 when the bonding state of the first printed circuit board pad PP1A and the first printed circuit board pad PP1A is normal The input signal GSP is input (input = 1), the signal GSP_F is input to the feedback input terminal FI (input = 1), and the signal GSP is not output from the output terminal O 0).

10 and 11, the signal GSP input to the first printed circuit board pad PP1A is directly transmitted from the first printed circuit board pad PP1A to the first circuit film pad FP1A And is supplied to the display panel 110.

That is, the signal GSP does not pass through the signal propagation enhancing circuit 710 but passes through the main path including the main bonding area MBA to which the first printed circuit board pad PP1A and the first circuit film pad FP1A are bonded (PATH 1).

10 and 11, the first circuit film pad FP1A, the second circuit film pad FP1B and the third circuit film pad FP1C are electrically connected to each other through a connection line 720 The signal GSP transferred from the first printed circuit board pad PP1A to the first circuit film pad FP1A is electrically connected to the first circuit film pad FP1A through the connection line 720 And fed back from the connected third circuit film pad FP1C to the third printed circuit board pad PP1C.

The feedback signal GSP_F is input to the feedback input terminal FI of the signal propagation enhancing circuit 710. [

9, 12 and 13, when the bonding state of the main bonding area MBA is abnormal in the bonding area of the circuit film SF and the printed circuit board SPCB, the first circuit film pad FP1A The signal GSP is input (input = 1) to the main input MI of the signal transmission enhancing circuit 710 and the feedback input terminal The signal GSP_F is not inputted (un-input = 0) and the signal GSP is outputted at the output terminal O (output = 1).

The signal GSP output from the output terminal O of the signal transferring reinforcement circuit 710 is transferred from the second printed circuit board pad PP1B to the second circuit film pad FP1B and supplied to the display panel 110 have.

Thus, an alternative path PATH 2 is formed.

This alternative path PATH 2 includes a dummy bonding area DBA to which the signal propagation enhancing circuit 710, the second printed circuit board pad PP1B and the second circuit film pad FP1B are bonded.

According to the above-described signal transmission path control circuit 700, the signal transmission path can be automatically switched according to the presence or absence of a bonding error through a simple circuit configuration.

That is, when there is no bonding error, the signal transmission path control circuit 700 includes the main bonding area MBA in which the first printed circuit board pad PP1A and the first circuit film pad FP1A are bonded The signal propagation enhancing circuit 710 and the second printed circuit board pad PP1B and the second circuit film pad FP1B are bonded to each other via the main path PATH 1, Can be signaled via an alternate path (PATH 2) that includes a dummy bonding area (DBA).

10 and 11, when the first circuit film pad FP1A and the first printed circuit board pad PP1A are in a normal bonding state, the first printed circuit board pad PP1A is electrically connected to the first circuit film pad PP1A, The signal GSP transferred to the pad FP1A is fed back as the feedback signal GSP_B from the third circuit film pad FP1C to the third printed circuit board SPCB.

According to such signal feedback, when the bonding state of the first circuit film pad FP1A and the first printed circuit board pad PP1A is normal, signal transmission along the main path PATH 1, not the alternative path PATH 2, . Signal feedback can also distinguish between bonding error and non-bonding situations.

Described signal propagation enhancing circuit 710 may be located on a printed circuit board (SPCB) or another printed circuit board (CPCB) electrically connected to a printed circuit board (SPCB).

Then, the connection line 720 may be located on the circuit film SF.

Optionally, the connection line 720 may be located on the display panel 110.

According to the above description, since the signal transfer control circuit 700 can be configured in the existing parts SPCB and SF, there is an advantage that no additional parts are added.

As described above, in one example, the circuit film SF may be the source circuit film SF on which the source driver IC (SDIC) is mounted, and the printed circuit board SPCB is connected to the source circuit film SF Source printed circuit board (SPCB).

According to the above description, when a bonding error occurs between a source printed circuit board (SPCB) and a source circuit film (SF) through which many types of signals pass, reliable signal transmission is enabled, It can stabilize the system.

Fig. 14 is another diagram showing a reliable signal transfer circuit in the bonding area of the circuit film SF and the printed circuit board SPCB in the display device 100 according to the present embodiments.

As shown in FIG. 14, the signal propagation enhancing circuit 710 may be implemented including an exclusive OR circuit.

As described above, by implementing the signal transferring reinforcement circuit 720, which is the core structure of the signal transfer path control circuit 700, as an exclusive OR circuit, which is a simple logic circuit (logic gate), circuit implementation can be easily and simply There is an advantage that can be done.

15 to 18 are diagrams showing the types of signals transmitted through the signal transfer circuit of the display device 100 according to the present embodiments.

Referring to FIG. 15, the signal to be transmitted may be, for example, a gate drive control signal necessary for the gate driver 130 to generate a scan signal.

For example, the gate drive control signal may include various gates including gate start pulse (GSP), gate shift clock (GSC), gate output enable (GOE) A gate driving control signal (GCS), or the like.

The gate drive control signal may be supplied from the printed circuit board SPCB to the display panel 110 via the circuit film SF and supplied to the gate driver 130 electrically connected to the display panel 110. [

The gate driver 130 can generate a scan signal using the gate drive control signal GCS and output it as a gate line.

15, the signal to be transmitted may be, for example, various gate voltage signals (e.g., a high level gate voltage VGH, a low level gate voltage VGL) supplied to the gate driver 130 .

As described above, even if a bonding error occurs on the transfer path of the gate drive control signal GCS or the gate voltage signal VGH / VGL, the gate drive control signal GCS or the gate voltage signal VGH / Thereby making it possible to perform normal gate driving.

16, the signal to be transmitted is not a signal to be transmitted to the gate driver 130 but another voltage signal VSP applied to each subpixel SP in the display panel 110, (E.g., a data voltage, a pixel voltage), or a common voltage VCOM (e.g., a drive voltage EVDD, a base voltage EVSS, and a reference voltage Vref) applied to all the subpixels SP.

By ensuring the reliability of such signal transmission, normal sub-pixel driving can be enabled.

17, the signal to be transmitted may be, for example, a video data signal DATA or various voltage signals (VSDIC) transmitted to a source driver integrated circuit (SDIC) mounted on a circuit film SF It is possible.

By ensuring the reliability of such signal transmission, normal source driving (data driving) can be enabled.

Referring to FIG. 18, the signal to be transmitted may be a signal (RDATA) transmitted from the circuit film SF to the printed circuit board SPCB.

In the foregoing, a reliable signal transmission method has been described in the case where a signal is transmitted from the printed circuit board (SPCB) to the circuit film (SF).

This can be applied equally to a case where a signal is transferred from the circuit film SF to the printed circuit board SPCB.

In the following, a reliable signal transmission in both directions of the circuit film SF and the printed circuit board SPCB will be briefly described.

The parts not described below can be equally applied to the parts described above. However, the connection line 710 is connected to the printed circuit board pads and is disposed on the printed circuit board SPCB. The signal propagation enhancing circuit 720 is connected to the circuit film pads and is disposed on the circuit film SF, May be included in the driver integrated circuit (SDIC).

The display device 100 according to the present embodiment includes a display panel 110, a printed circuit board SPCB, a circuit film SF for electrically connecting the display panel 110 and the printed circuit board SPCB, And the like.

When the first bonding area in the area where the printed circuit board SPCB and the circuit film SF are connected is electrically connected, a signal is transmitted between the printed circuit board SPCB and the circuit film SF through the first bonding area.

When the first bonding area is electrically opened, a signal is transmitted to the printed circuit board (SPCB) through the second bonding area different from the first bonding area in the area where the printed circuit board (SPCB) and the circuit film (SF) And the circuit film (SF).

As described above, it is possible to provide reliable signal transmission between the printed circuit board (SPCB) and the circuit film (SF).

In the display device 100 according to the present embodiment, when the first bonding area (which may be the main bonding area) is electrically opened, the second bonding area And a signal propagation enhancing circuit 710 for controlling the signal GSP to be transmitted between the printed circuit board SPCB and the circuit film SF through the signal line GSP.

The signal transmission path can be controlled according to the bonding state of the first bonding region using the signal propagation enhancing circuit 710 described above so that the signal propagation path can be controlled without passing through the first bonding region which is the electrically opened main bonding region, 2 < / RTI > bonding area.

The signal to be transmitted may be a signal transmitted from the printed circuit board SPCB to the circuit film SF.

These signals may be the signals illustrated in Figs. 15-17.

A signal propagation enhancing circuit 710 for reliable delivery of such signals may be disposed on a printed circuit board (SPCB).

By reliably ensuring the transmission of such a signal, normal gate driving, source driving, and sub-pixel driving can be enabled.

The signal to be transmitted may be a signal transmitted from the circuit film SF to the printed circuit board SPCB.

This signal may be the signal illustrated in Fig.

Such a signal may be, for example, sensing data generated in an analog-to-digital converter (ADC) in a source driver integrated circuit (SDIC) and transmitted to the controller 140.

This signal may, in another example, represent the status information of the source driver integrated circuit (SDIC) and may be an IC status signal sent from the source driver integrated circuit (SDIC) to the controller 140.

The signal carrying enhancement circuitry 710 for reliable delivery of such signals may be included in the source driver integrated circuit (SDIC) or disposed on the circuit film SF.

By reliably ensuring the delivery of such signals, the source driver integrated circuit (SDIC) can provide normal signaling to the controller 140.

19 is a flowchart of a signal transmission method of the display apparatus 100 according to the present embodiments.

19, the display device 100 according to the present embodiment includes a display panel 110, a printed circuit board SPCB, a display panel 110, and a printed circuit board SPCB electrically connected to each other (SF), and can provide a reliable signal transmission method between the printed circuit board (SPCB) and the circuit film (SF).

Referring to FIG. 19, in the signal transmission method of the display device 100 according to the present embodiments, when the first bonding area in the area where the printed circuit board SPCB and the circuit film SF are connected is electrically connected, (S1910) of transferring signals between the printed circuit board (SPCB) and the circuit film (SF) through the first bonding area and the printed circuit board (SPCB) (S1920) of transferring signals between the printed circuit board (SPCB) and the circuit film (SF) through the second bonding area, which is different from the first bonding area, in the area where the connection part SF is connected.

According to the embodiments as described above, it is possible to provide a display device 100 having a reliable signal transfer circuit between a printed circuit board and a circuit film and a signal transfer method.

Furthermore, according to the embodiments, it is possible to provide a display device 100 having a reliable signal transfer circuit that enables normal driving of the display panel and a signal transmission method.

Further, according to the embodiments, it is possible to provide the display device 100 and the signal transmission method having the reliable signal transfer circuit that enables the normal operation of the driver.

In addition, according to the embodiments, it is possible to provide a display device 100 having a reliable signal transmission circuit capable of generating an alternative path for signal transmission, and a signal transmission method.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. , Separation, substitution, and alteration of the invention will be apparent to those skilled in the art. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: display device
110: Display panel
120: Data driver
130: gate driver
140: controller
SF, GF: Circuit film
SPCB, CPCB: printed circuit board

Claims (15)

Display panel;
Printed circuit board; And
And a circuit film electrically connecting the display panel and the printed circuit board,
A signal necessary for driving the panel is transmitted from the printed circuit board to the circuit film,
In a region where the circuit film and the printed circuit board are electrically connected,
A plurality of circuit film pads existing on the circuit film and a plurality of printed circuit board pads existing on the printed circuit board are bonded to each other,
Wherein the plurality of circuit film pads include a first circuit film pad, a second circuit film pad, and a third circuit film pad,
Wherein the plurality of printed circuit board pads includes a first printed circuit board pad, a second printed circuit board pad, and a third printed circuit board pad,
The first circuit film pad and the first printed circuit board pad correspond to each other,
The second circuit film pads and the second printed circuit board pads correspond to each other,
The third circuit film pad and the third printed circuit board pad correspond to each other,
When the bonding state of the first circuit film pad and the first printed circuit board pad is normal,
The signal is transferred from the first printed circuit board pad to the first circuit film pad,
If the bonding state of the first circuit film pad and the first printed circuit board pad is abnormal,
Wherein the signal is transferred from the second printed circuit board pad to the second circuit film pad. The method according to claim 1,
When the bonding state of the first circuit film pad and the first printed circuit board pad is normal,
Wherein the signal transmitted from the first printed circuit board pad to the first circuit film pad comprises:
And a reliable signal transfer circuit fed back from the third circuit film pad to the third printed circuit board. The method according to claim 1,
A connection line for electrically connecting the first circuit film pad, the second circuit film pad, and the third circuit film pad; And
A signal transmission reinforcing circuit having an output terminal electrically coupled to the second printed circuit board pad, a main input terminal electrically coupled to the first printed circuit board pad, and a feedback input electrically coupled to the third printed circuit board pad,
And a signal transmission circuit having a reliable signal. The method of claim 3,
When the bonding state of the first circuit film pad and the first printed circuit board pad is normal,
In the signal propagation enhancing circuit,
Wherein the signal input to the first printed circuit board pad is input to the main input terminal,
The signal is input to the feedback input,
The feedback signal of the signal is not output at the output terminal,
Wherein the signal input to the first printed circuit board pad is directly transmitted from the first printed circuit board pad to the first circuit film pad,
Wherein the signal transferred to the first circuit film pad is fed back from the third circuit film pad electrically connected to the first circuit film pad through the connection line to the third printed circuit board pad,
If the bonding state of the first circuit film pad and the first printed circuit board pad is abnormal,
In the signal propagation enhancing circuit,
The signal is input to the main input terminal,
Wherein the feedback input has no signal input,
The signal is output at the output terminal,
Wherein the signal output from the output terminal includes:
And a reliable signal transfer circuit that is transferred from the second printed circuit board pad to the second circuit film pad. The method of claim 3,
Wherein the signal propagation enhancing circuit includes an exclusive OR circuit. The method of claim 3,
Wherein the signal propagation enhancing circuit is located on the printed circuit board or another printed circuit board electrically connected to the printed circuit board,
Said connection line having a reliable signal transfer circuit located in said circuit film. The method according to claim 1,
Wherein the circuit film is a source circuit film on which a source driver integrated circuit is mounted,
Wherein the printed circuit board is a source printed circuit board connected to the source circuit film. The method according to claim 1,
The signal,
As a gate drive control signal or a gate voltage signal necessary for a gate driver to generate a scan signal,
And a control circuit which is supplied to the display panel through the circuit film on the printed circuit board,
And a reliable signal transfer circuit supplied to a gate driver electrically connected to the display panel. The method according to claim 1,
The signal,
And a signal transfer circuit that is a common voltage applied to all the subpixels or various voltage signals applied to the subpixels in the display panel. The method according to claim 1,
The signal,
And a signal transfer circuit which is an image data signal or various voltage signals transmitted to the source driver integrated circuit mounted on the circuit film. Display panel;
Printed circuit board; And
And a circuit film electrically connecting the display panel and the printed circuit board,
A signal is transmitted between the printed circuit board and the circuit film through the first bonding area when the first bonding area in the area where the printed circuit board and the circuit film are connected is electrically connected,
Wherein when the first bonding area is in an electrically open state, the signal is transmitted to the printed circuit board and the circuit film through a second bonding area different from the first bonding area in the area where the printed circuit board and the circuit film are connected, And a signal transmission circuit which is reliable. 12. The method of claim 11,
And a signal propagation enhancing circuit for controlling a signal propagation path in accordance with the bonding state of the first bonding region. 12. The method of claim 11,
The signal,
And a signal transfer circuit that is a signal transferred from the printed circuit board to the circuit film. 12. The method of claim 11,
The signal,
And a signal transfer circuit that is a signal transferred from the circuit film to the printed circuit board. A signal transmitting method of a display device including a display panel, a printed circuit board, and a circuit film for electrically connecting the display panel and the printed circuit board,
Transferring a signal between the printed circuit board and the circuit film through the first bonding area when the printed circuit board and the first bonding area in the area where the circuit film is connected are electrically connected; And
Wherein the first bonding area is electrically opened and the second bonding area is different from the first bonding area in the area where the printed circuit board and the circuit film are connected, ≪ / RTI >

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