KR20180034148A - Conductive film and manufacturing method of the same - Google Patents

Abstract

A conductive film comprising a thermoplastic resin, and at least 65 wt% or more of a conductive material, and a manufacturing method thereof are provided. In one embodiment of the present invention, provided is the conductive film capable of realizing excellent and uniform electrical conductivity and excellent elongation while being re-molded.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a conductive film,

Conductive film and a method of manufacturing the same.

These properties can easily be imparted by attaching conductive films to components or products that generally require conductive properties. Conductive property is a so-called electric conductivity, which means that heat or electricity can move through a predetermined substance or object, which can be used to give various performances such as, for example, antistatic performance, heat radiation performance and the like.

In general, a film having conductive properties is molded into a film by extruding a polymer resin and a conductive material into an extruder.

However, when a product such as a film is molded by using the extruder, the viscosity of the molten polymer resin including the conductive material increases during extrusion processing, so that a high pressure is generated in the discharging portion, In addition, there is a problem that the viscoelasticity increases and processing is not smoothly performed in a desired form, or the defect rate increases.

In one embodiment of the present invention, there is provided a conductive film capable of realizing excellent yet uniform electrical conductivity and excellent elongation while re-forming.

In another embodiment of the present invention, there is provided a method of producing a conductive film which is capable of realizing excellent yet uniform electrical conductivity and excellent elongation while re-forming.

However, the technical problem to be solved by the present invention is not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

In one embodiment of the present invention, there is provided a conductive film comprising a thermoplastic resin and at least 65% by weight or more of a conductive material and having a density of 1.8 g / cm ³ to 8.0 g / cm ³ .

The conductive film can be re-formed by using a thermoplastic resin, and at the same time, as described in another embodiment of the present invention, the conductive film can be applied to one side of the release film and dried, The conductive material can be contained in a higher amount, and there is no fear of aggregation or agglomeration, so that the dispersibility of the conductive material can be realized at an excellent level.

As described above, since the conductive film is finally formed by applying a predetermined pressure after drying, the density is increased, and excellent electrical conductivity, excellent elongation, and excellent tensile strength can be realized.

The conductive film may include a conductive material in an amount of at least 65 wt% or more.

Specifically, the conductive material may be contained in an amount of about 70% by weight to about 95% by weight, thereby effectively improving the electrical conductivity, and exhibiting excellent antistatic performance and excellent heat radiation performance.

The conductive film may have an average electrical conductivity of about 0.1 X ¹⁰ S / cm to about 5 X 10 ² S / cm.

Also, the relative standard deviation (RSD) of the electrical conductivity for the conductive film can be, for example, about 15% or less, and specifically about 0% to about 10%.

The conductive film may have a density of, for example, from about 1.5 g / cm ³ to about 8.0 g / cm ³ , and specifically from about 1.7 g / cm ³ to about 2.0 g / cm ³ .

By having a density within the above range, excellent electrical conductivity and excellent elongation can be realized. Specifically, when the density is less than about 1.7 g / cm ³ , the electrical conductivity is weak. When the density is more than about 2.0 g / cm ³ , the elongation may be lowered.

In another embodiment of the present invention, there is provided a method for preparing a conductive composition, comprising: preparing a conductive composition by mixing a thermoplastic resin, a conductive material, and a solvent on a particle; Applying and drying the conductive composition on one side of the release film; Applying a pressure to the applied and dried conductive composition to produce a conductive film, wherein the conductive film comprises at least 65 wt% or more of a conductive material, wherein the conductive film has a density of about 1.5 g / cm before being made to be from ³ to about 8.0g / cm ³ provides a method for preparing a c-conductive film.

The particulate thermoplastic resin may have an average diameter of, for example, from about 1 탆 to about 500 탆, and specifically about 10 탆 to about 50 탆.

The density of the conductive film may be, for example, from about 1.5 g / cm ³ to about 8.0 g / cm ³ , specifically about 1.7 g / cm ³ to about 2.0 g / cm ³ .

By having such a density within the above range, excellent electrical conductivity and excellent elongation can be realized.

The electrically conductive film and the method of manufacturing the same can achieve excellent electrical conductivity, excellent elongation, and re-molding while being excellent.

1 is a schematic process flow diagram of a method for manufacturing an electrically conductive film according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. In the drawings, for the convenience of explanation, the thicknesses of some layers and regions are exaggerated.

Hereinafter, formation of an arbitrary structure in the upper part (or lower part) or the upper part (or lower part) of the substrate means not only that an arbitrary constitution is formed in contact with the upper surface (or lower surface) of the substrate, And any configuration formed on (or under) the substrate.

In one embodiment of the present invention, a thermoplastic resin and at least 65 wt% or more of conductive material are provided and a density of about 1.8 g / cm ³ to about 8.0 g / cm ³ is provided.

Typically, a film having conductive properties is produced as a film by extruding a raw material in the form of a pellet formed from a thermoplastic resin and a conductive material into an extruder, or by thermally curing a conductive composition containing a thermosetting resin and a conductive material.

When the film is produced using an extruder, if the content of the conductive material is high, the molten raw material is stuck to the extruder during the extrusion process and the processing is not smoothly performed or the defective ratio is increased. Therefore, the conductive material can not be contained in a high content When a thermosetting resin is used, there is a problem in that it can not be melted again after the molding is completed, so that it is impossible to re-mold.

Accordingly, in one embodiment of the present invention, the conductive film can be remolded using a thermoplastic resin, and at the same time, as described in another embodiment of the present invention, the conductive film can be applied to one surface of the release film, Dried, and then subjected to a predetermined pressure, there is an advantage that the conductive material can be contained in a higher content, and there is less fear of aggregation or aggregation, and the dispersibility of the conductive material can be realized at a superior level.

As described above, since the conductive film is finally formed by applying a predetermined pressure after drying, the density is increased, and excellent electrical conductivity, excellent elongation, and excellent tensile strength can be realized.

The conductive film may include a thermoplastic resin.

Accordingly, the conductive film not only realizes excellent flexibility but also can be re-molded according to a predetermined case, so that the conductive film can be recycled for various purposes without increasing the cost.

The thermoplastic resin may be, for example, a polyurethane resin, a polyester resin, a phenol resin, an acrylic resin, a polysiloxane resin, a polystyrene resin, a polyvinyl resin, a polyether amide resin, a cellulose acetate resin, a styrene acrylonitrile resin, Nitrile resin, ethylene vinyl acetate resin, ethylene acrylate resin, and combinations thereof, and may specifically include a polyurethane resin.

The polyurethane resin in the thermoplastic resin can be made by, for example, conducting a polymerization reaction on a composition comprising a diisocyanate compound, a polyol, and optionally a chain extender.

Examples of the diisocyanate compound include 1,4-butylene diisocyanate, 1,6-hexamethylene diisocyanate, cyclopentylene 1,3-diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, Isophorone diisocyanate, cyclohexylene 1,4-diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate. A mixture of isomers of 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate, 4,4'-methylenebis (phenyldiisocyanate), 2,2-diphenylpropane, 4,4'-diisocyanate , p-phenylene diisocyanate, m-phenylene diisocyanate, xylene diisocyanate, 1,4-naphthylene diisocyanate, and combinations thereof, but is not limited thereto No.

Examples of the polyol include polyols such as 1,2-ethanediol, 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, But are not limited to, at least one selected from the group consisting of 1,4-cyclohexanediol, ethylene glycol, propylene glycol, glycerol, and combinations thereof.

The chain extender may be of any kind known in the art without any particular limitation.

The thermoplastic resin may, for example, comprise less than about 35 weight percent, and may also include, for example, less than about 5 weight percent to less than about 30 weight percent.

The conductive film may include a conductive material in an amount of at least 65 wt% or more.

Specifically, the conductive material may be included in an amount of about 70% by weight to about 95% by weight, thereby effectively improving the electrical conductivity. For example, when the conductive film is applied as an antistatic film, It is possible to realize excellent antistatic performance, and furthermore, when it is applied to, for example, a heat radiation film, it is possible to realize a better heat radiation performance.

The conductive material may be, for example, in the form of particles, and the average diameter thereof may be about 1 [mu] m to about 100 [mu] m.

In addition, the conductive material may include at least one selected from the group consisting of, for example, a metal, graphite, graphene, carbon nanotube, and combinations thereof, and specifically includes graphite, Can be implemented.

The conductive film may further include at least one additive selected from the group consisting of a pigment, an antioxidant, a UV stabilizer, a defoamer, a thickener, a flame retardant, a coupling agent, a foaming agent, It is not limited.

The conductive film may have a thickness of about 50 탆 to about 2000 탆. By having the thickness within the above range, the mechanical properties such as durability required for the conductive film can be sufficiently realized without increasing the total thickness thereof excessively.

In the present specification, each electric conductivity described below can be measured by, for example, a 4 minute probe method, but is not limited thereto.

The conductive film may have an average electrical conductivity of about 0.1 X ¹⁰ S / cm to about 5 X 10 ² S / cm.

By having a high electrical conductivity within the above-mentioned range, the performance of the antistatic film or the heat-radiating film, for example, as described above can be further improved.

In one embodiment, the relative standard deviation (RSD) of the electrical conductivity for the conductive film can be, for example, about 15% or less, and specifically about 0% to about 10%.

The relative standard deviation (RSD,%) can be calculated, for example, according to the following equation:

[Equation 1]

) Ⅹ 100Relative standard deviation (RSD) = standard deviation (S) / average (

) Ⅹ 100

The relative standard deviation may be a difference between electrical conductivities measured at two points selected from two arbitrary points on the entire surface of the conductive film, and as the relative standard deviation is smaller, The conductivity can be shown to be more uniform.

) 및 상기 표준편차(S)은 이 기술분야에서 공지된 방법에 따라 계산될 수 있고, 예를 들어, 하기 계산식 2 및 3에 따라 각각 계산될 수 있다:The average (

) And the standard deviation S may be calculated according to methods known in the art and may be calculated respectively according to the following equations 2 and 3, for example:

[Equation 2]

, S/cm) = (x₁+x₂+ +X_n)/nAverage(

, S / cm) = (x 1 + x 2 + + X n) / n

[Equation 3]

In the above equations, x ₁ , x ₂ , and X _n mean electrical conductivity at a predetermined point arbitrarily selected from the entire one surface of the conductive film, and n can mean the number of points.

 As described above, the relative standard deviation is calculated to the small range, as described above, so that the conductive film has an advantage that it can realize a more uniform level of electrical conductivity as a whole on one side thereof.

In one embodiment, the conductive film has a density, for example, it may be about 1.5g / cm ³ to about 8.0g / cm ^3, particularly from about 1.7g / cm ³ to about 2.0g / cm ³ can be have.

By having a density within the above range, excellent electrical conductivity can be realized. Specifically, when the density is less than about 1.7 g / cm ³ , the electrical conductivity is weak. When the density is more than about 2.0 g / cm ³ , the elongation may be lowered.

Fig. 1 schematically shows a process flow chart of a method for producing a conductive film according to another embodiment of the present invention.

(S1) of preparing a conductive composition by mixing particulate thermoplastic resin, a conductive material, and a solvent; Applying and drying the conductive composition on one side of the release film (S2); (S3) applying pressure to the coated and dried conductive composition to form a conductive film, wherein the conductive film comprises at least 65% by weight or more of a conductive material, and the density of the conductive film is about 1.5 g / cm ³ to be made to be approximately 8.0g / cm ^3.

The conductive film described above in one embodiment can be produced by the above production method.

In the above manufacturing method, the conductive composition is coated and dried, and then the pressure is applied to produce a conductive film having a high density, so that the conductive material is contained in a high content to realize excellent electrical conductivity, and an excellent elongation and excellent tensile strength can be realized There is an advantage that the conductive composition can be reshaped including a particulate thermoplastic resin.

When a conductive film is formed by using a conventional extruder, if a molten raw material containing a high content of conductive material is used, the viscosity of the molten raw material is high, which causes sticking to the extruder, .

In the above production method, a conductive composition may be prepared by mixing a particulate thermoplastic resin, a conductive material, and a solvent. The particulate thermoplastic resin and the conductive material are as described above for each of these kinds in one embodiment.

The particulate thermoplastic resin may be prepared by a method known in the art and may be prepared by any method known in the art including, for example, powder slush molding method, spray drying method, hydrogrinding method, ball mill method, cryogenic grinding, and the like.

The particulate thermoplastic resin may have an average diameter of, for example, from about 1 탆 to about 500 탆, and specifically about 10 탆 to about 50 탆.

In the present specification, the average diameter of the particles can be measured using a TEM / SEM apparatus or a particle size analyzer, but is not limited thereto.

By having a small diameter within the above range, it is possible to realize more excellent dispersibility by more uniformly mixing without aggregation or aggregation in the conductive composition.

For example, about 185 parts by weight to about 600 parts by weight of the conductive material may be included relative to about 100 parts by weight of the particulate thermoplastic resin.

Also, about 400 parts by weight to about 4500 parts by weight of the solvent may be included relative to about 100 parts by weight of the particulate thermoplastic resin.

The solvent may include at least one selected from the group consisting of, for example, an ester compound, an aromatic hydrocarbon compound, an ether compound, a ketone compound and a combination thereof, and specifically, n-propyl acetate and n- But are not limited to, butyl acetate, benzene, toluene, xylene, dibutyl ether, isopropyl ether, dioxane, tetrahydrofuran, acetone, diethyl ketone, methyl ethyl ketone, methyl isobutyl ketone, methyl propyl ketone, And combinations thereof. However, the present invention is not limited thereto.

The conductive composition may be prepared by further mixing additives including at least one selected from the group consisting of a pigment, an antioxidant, a UV stabilizer, a defoaming agent, a thickener, a flame retardant, a coupling agent, a foaming agent, , But not limited to.

In the above production method, the conductive composition can be applied and dried on one side of the release film.

The conductive composition may be applied by, for example, a gravure coating method, a slot die coating method, a comma coating method, a spin coating method, a spray coating method, a bar coating method, Methods may be used, but are not limited thereto.

Also, the drying of the conductive composition may be performed at a temperature of about 40 DEG C to about 70 DEG C and a time period of about 10 minutes to about 120 minutes.

The release film may be a plastic film such as polyethylene terephthalate (PET), polycarbonate (PC) or the like, and the surface of the release film may be coated with silicone or an alkyd type release agent.

The conductive film can be produced by applying pressure to the applied and dried conductive composition.

In the step of producing the conductive film, a pressure of about 1 MPa to about 300 MPa can be applied to the applied and dried conductive composition.

As described above, by applying a pressure in the range, it is possible to form a high degree of density of the conductive film of about 1.5g / cm ³ to 8.0g / cm ^3.

In addition, the pressure can be applied, for example, by using a hot press apparatus, but is not limited thereto.

Specifically, the pressure of about 1 MPa to about 300 MPa can be applied under a temperature condition of about 160 캜 to about 190 캜.

As described above, unlike the conventional method of producing a conductive film by an extruder using a raw material in the form of a pellet, the method comprises applying and drying the conductive composition, and then applying the pressure to produce the conductive film, It can be easily formed into a film and does not aggregate or aggregate, so that a superior electrical conductivity can be realized at a more uniform level.

As described above, the conductive film includes at least 65% by weight or more of the conductive material, and specifically, the conductive film may include about 70% by weight to about 95% by weight of the conductive material.

The conductive film may be made to include, for example, less than about 35 weight percent thermoplastic resin and may also be fabricated to include, for example, from about 5 weight percent to less than about 30 weight percent, No.

When the conductive film is used as an antistatic film, for example, it is possible to realize a more excellent antistatic property by manufacturing the conductive material so as to have a high content within the above range. In addition, for example, A better heat dissipation performance can be realized.

In addition, the conductive film may be manufactured to have a density of, for example, about 1.5 g / cm ³ to about 8.0 g / cm ³ , specifically about 1.7 g / cm ³ to about 2.0 g / cm ³ .

In the above manufacturing method, the conductive film may be manufactured to have an average electric conductivity of about 0.1 X ¹⁰ S / cm to about 5 X 10 ² S / cm.

By having such a high electrical conductivity within the above range, the performance of the antistatic film or the heat dissipation film, for example, as described above can be further improved.

In this manufacturing method, the relative standard deviation (RSD) of the electrical conductivity for the conductive film may be made to be, for example, about 15% or less, and specifically about 0% to about 10% have.

)은 일 구현예에서 전술한 바와 같다. The relative standard deviation (RSD,%), the standard deviation (S) and the average (

) Are as described above in one embodiment.

The relative standard deviation is calculated to be in the small range, so that the conductive film has an advantage that it can realize a more uniform level of electrical conductivity as a whole on one surface.

The conductive film may be manufactured to have a thickness of about 50 탆 to about 2000 탆. By making the thickness within the above range, it is possible to sufficiently realize the mechanical properties such as durability required for the conductive film without increasing the total thickness thereof excessively.

Hereinafter, specific embodiments of the present invention will be described. However, the embodiments described below are only intended to illustrate or explain the present invention, and the present invention should not be limited thereto.

Example

Example 1 (content of graphite: 70% by weight)

Powders containing thermoplastic polyurethane resin particles having an average diameter of 1 to 500 mu m were prepared by the melt spray method.

Then, the conductive composition was prepared by mixing the powder, graphite having an average diameter of 10 mu m to 50 mu m, and a solvent.

The conductive composition was applied on one side of a PET film coated with a silicone based release agent and dried at a temperature of about 50 DEG C and for about 2 hours.

Subsequently, a conductive film having a thickness of 500 mu m was prepared by applying a pressure of about 90 MPa to the dried conductive composition, that is, the conductive composition on the film under a temperature condition of about 180 DEG C by a hot press apparatus.

Specifically, the conductive film contained 70% by weight of graphite.

Example 2 (Content of graphite: 80% by weight)

A conductive film was prepared under the same conditions and in the same manner as in Example 1, except that the conductive film had a graphite content of 80% by weight.

Example 3 (content of graphite: 85% by weight)

A conductive film was prepared under the same conditions and in the same manner as in Example 1, except that the conductive film contained 85 wt% of graphite.

Comparative Example 1 (press working, graphite content: 10% by weight)

A mixture prepared by mixing 90 weight% of a thermoplastic polyurethane resin and 10 weight% of graphite in a stirrer (Brabender Mixer W 50EHT) was prepared, and the mixture was heat-pressured in a press mold at 180 ^° C and 200 MPa A conductive film having a thickness of 1000 mu m was produced.

Comparative Example 2 (extrusion processing, graphite content: 65% by weight)

The conductive film was tried to be produced under the same conditions and the same method as those of Comparative Example 1 except that the pellet raw material containing 35% by weight of the thermoplastic polyurethane resin and 65% by weight of the graphite was used, .

Comparative Example 3 (content of thermosetting polyepoxy resin and graphite: 80% by weight)

A conductive film having a thickness of 2,000 탆 was prepared by applying a resin composition containing 18.8% by weight of a thermosetting polyepoxy resin, 80% by weight of graphite and an organic solvent, applying a temperature of 150 캜 and a pressure of 200 MPa to thermoset.

Comparative Example 4 (when pressure was not applied by the hot press apparatus as compared with Example 1)

Powders containing thermoplastic polyurethane resin particles having an average diameter of 1 to 500 mu m were prepared by the melt spray method.

Then, the conductive composition was prepared by mixing the powder, graphite having an average diameter of 10 mu m to 50 mu m, and a solvent.

The conductive composition was applied on one side of a PET film coated with a silicone type release agent and dried at a temperature of about 50 캜 for about 2 hours to prepare a conductive film.

Specifically, the conductive film contained 80% by weight of graphite.

Experimental Example

Various properties of the conductive films according to Examples 1-3 and Comparative Examples 1-4 were evaluated and described in Table 1 below.

Assessment Methods

Experimental Example  1: Electrical conductivity and its uniformity

Measurement methods: The electrical conductivities of all the conductive films according to Examples 1-3 and Comparative Examples 1-4 were measured on the entire one surface, and the mean, standard deviation, and relative standard deviation of the electrical conductivity were measured Lt; RTI ID = 0.0 > formula. ≪ / RTI >

The electrical conductivity was measured by a 4 minute probe method using a sheet resistance meter (Loresta-GP, MCP-T610).

Experimental Example  2: Reformation

Measurement method: The conductive films according to Examples 1-3 and Comparative Examples 1-4 were subjected to 180 ° C and 200 MPa pressure to observe whether they were fused to form a single film, The case where the film was formed as a single film was evaluated as being capable of re-molding and indicated as "? &Quot;, and the case of burning was evaluated as being impossible to re-mold and evaluated as " X ".

Experimental Example  3: Density

Measurement methods: Each of the conductive films according to Examples 1-3 and Comparative Examples 1-4 was prepared as a sample having a size of 30 x 10 x 1 mm, and the density of each of the conductive films was measured using a densitometer (ALFA Mirage, SD-200L).

(S/cm)Electrical conductivity

(S / cm) Relative standard deviation of electrical conductivity
(RSD,%) Reformation density
[g / cm ^3] Example 1 11 9 ○ 1.79 Example 2 83 7 ○ 1.90 Example 3 230 5 ○ 1.95 Comparative Example 1 6.3x10 ^-4 8 ○ 1.19 Comparative Example 2 - - - - Comparative Example 3 220 9 X 1.93 Comparative Example 4 - - - -

As shown in Table 1, each of the conductive films according to Examples 1-3 was realized at a level of excellent electrical conductivity and uniformity thereof, and was able to be re-formed. Also, the density was also sufficiently dense to be excellent in electrical conductivity, elongation, The physical properties of the strength are appropriately harmonized and both are realized at a superior level.

On the other hand, the conductive film according to Comparative Example 1 was significantly inferior in electrical conductivity. In Comparative Example 2, the film could not be manufactured. In the case of the conductive film according to Comparative Example 3, the re-molding was impossible.

In addition, in the case of the conductive film according to Comparative Example 4, a phenomenon such as phase separation occurs depending on the height in the drying process, so that the gap between the graphite becomes large, and thus the electric conductivity thereof varies greatly depending on the position, , It was impossible to measure the relative standard deviation, and it was clearly confirmed that an additional process of reworking was indispensably required to reduce this problem.

Claims (15)

Thermoplastic resin, and at least 65% by weight or more conductive materials, a density of 1.8g / cm ³ to 8.0g / cm ³ of the conductive films
The method according to claim 1,
Wherein the content of the conductive material is 70 wt% to 95 wt%
Conductive film.
The method according to claim 1,
Having an average electric conductivity of 0.1 X ¹⁰ S / cm to 5 X 10 ² S / cm
Conductive film.
The method according to claim 1,
The relative standard deviation (RSD) of the electric conductivity of the conductive film is not more than 15%
Conductive film.
The method according to claim 1,
A density of 1.7g / cm ³ to 2.0g / cm ³
Conductive film.
The method according to claim 1,
And at least one selected from the group consisting of a pigment, an antioxidant, an ultraviolet stabilizer, a defoaming agent, a thickener, a flame retardant, a coupling agent, a foaming agent,
Conductive film.
The method according to claim 1,
Having a thickness of 50 탆 to 2000 탆
Conductive film.
Mixing a particulate thermoplastic resin, a conductive material, and a solvent to prepare a conductive composition;
Applying and drying the conductive composition on one side of the release film; And
(S3) applying pressure to the coated and dried conductive composition to produce a conductive film,
The conductive film includes at least 65% by weight or more of the conductive material, the density of the conductive film to be produced so that the 1.5g / cm ³ to 8.0g / cm ³
A method for producing a conductive film.
9. The method of claim 8,
The particulate thermoplastic resin has an average diameter of 1 to 500 mu m
A method for producing a conductive film.
9. The method of claim 8,
In the step of producing the conductive film, a pressure of 1 MPa to 300 MPa is applied to the applied and dried conductive composition
A method for producing a conductive film.
11. The method of claim 10,
A pressure of 1 MPa to 300 MPa is applied under a temperature condition of 160 DEG C to 190 DEG C
A method for producing a conductive film.
9. The method of claim 8,
Wherein the conductive film comprises 70 wt% to 95 wt% of the conductive material
A method for producing a conductive film.
9. The method of claim 8,
The density of the conductive film which is made to be 1.7g / cm ³ to 2.0g / cm ³
A method for producing a conductive film.
9. The method of claim 8,
The conductive film is manufactured to have an average electric conductivity of 0.1 X ¹⁰ S / cm to 5 X 10 ² S / cm
A method for producing a conductive film.
9. The method of claim 8,
And the relative standard deviation (RSD) of the electrical conductivity for the conductive film is 15% or less
A method for producing a conductive film.

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