KR20180025670A - apparatus with direct cooling pathway for cooling both sides of stack type power semiconductor - Google Patents

Abstract

The present invention relates to a device for cooling both surfaces of a stack type power semiconductor with a direct cooling pathway which directly contacts power semiconductors arranged between cooling pathway portions in a stack type to cool the power semiconductors. The device comprises one or more units mutually connected by stacking to form direct cooing pathways for allowing a fluid to flow so as to allow the fluid such as any one of coolant, cooling water and a heat exchange medium to directly contact surfaces of power semiconductors. The unit comprises: cooling pathway portions formed in a hollow plate member shape through which input, discharge and flow of the fluid are made and arranged along a thickness direction of the unit to be arranged between the power semiconductors wherein internal spaces of the cooling pathway portions are connected to each other, the cooling pathway portions have spaces for accommodating the fluid or allowing the fluid to flow, and the spaces correspond to the direct cooing pathways; and the power semiconductors coupled to the cooling pathway portions to water-tightly cover a plurality of openings of the cooling pathway portions.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a stacked power semiconductor double-side cooling apparatus having a direct cooling flow path,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stacked power semiconductor double-sided cooling apparatus having a direct cooling flow path, and more particularly to a multi-layer power semiconductor double- To a stacked power semiconductor double-sided cooling device having a direct cooling flow path that allows each of the power semiconductor to directly contact both sides thereof (e.g., upper and lower surfaces) of the power semiconductor.

Generally, there are automobiles such as gasoline and diesel that use fossil fuel as a power source, and Environmentally Friendly Vehicle (EFV) which is good for the environment and uses natural energy, water (hydrogen) or electric energy as a power source.

For example, plug-in hybrids (PHEVs), which combine the advantages of hybrid vehicles (HEVs) and electric vehicles (EVs), are being actively developed in eco-friendly vehicles.

These eco-cars require an AC three-phase voltage to drive the motor. Accordingly, a first device for converting a direct current (DC) voltage of a high-voltage battery, which is a power source, into an AC (alternating current) three-phase voltage for driving the motor is needed. A second device for conversion is also needed with the 12V low voltage used in vehicles.

The first device is commonly referred to as an inverter, and the second device is referred to as an LDC (Low DC DC Converter). The first device and the second device may be collectively referred to as a power conversion device.

For example, according to the configuration of a hybrid vehicle, a typical hybrid vehicle includes a high-voltage battery, a low-voltage battery, a power converter, a motor, a generator, and an engine. In the case of a plug-in hybrid, a charger is further included. In the case of electric cars, there is no generator or engine compared to hybrid vehicles, and chargers are added.

Power converters in eco-friendly cars are the most important component in a drive system. Since the voltage needs to be changed, the internal parts are equipped with heat generating parts.

For example, a PCU (Power Control Unit) that uses a high voltage (for example, 300 V) of the driving battery and electric power of current and controls the power to be supplied to the motor in a desired state Power modules (for example, insulated gate bipolar transistor (IGBT) modules) are provided.

The power module includes an electric device such as an inverter, a smoothing capacitor and a converter, or a power semiconductor as a power conversion device. Since the electric element or the power semiconductor generates heat according to the supply of electric power, a separate cooling means is necessarily required. Particularly in the design of components such as power semiconductors for power conversion devices, cooling performance can be an important factor. That is, if such a component receives heat continuously, the performance will be degraded and the component will be damaged. If the cooling performance is lowered, the durability life of the part is reduced accordingly.

The structure of the indirect cooling type cooling flow path of the prior art is simple, but its fabrication and assemblability are inferior. This means that profitability is deteriorated by lowering productivity and increasing C / T (cycle time).

As a related art, cooling means for a power module in an automobile field have used means for cooling only the end face of the electric element or means for cooling both faces of the electric element.

For example, a conventional heat exchanger for cooling an electric device has a pair of plates facing each other to allow a fluid such as a coolant, a cooling water, or a heat exchange medium to flow, and a space portion is formed therein. A first tube, a second tube disposed on the other side, an inlet portion communicating with a portion of the first tube at one side in the longitudinal direction, and an inlet portion communicating with a portion of the second tube at one side in the longitudinal direction And a connection part for connecting the first tube and the second tube so as to communicate with each other.

However, in the prior art, the fluid flows along the inner space of the first tube and the second tube, and at this time, the heat of the fluid or heat of the electric element exchanges heat indirectly through the walls of the first tube or the second tube .

That is, the prior art heat exchanger for cooling an electric device has a disadvantage in that productivity is very low because a thermal grease coating process is required on the outer surface of the tube in contact with the electric element.

Also, since the heat exchanger for cooling an electric device of the prior art has two tube walls (upper wall and lower wall) for each of the first tube and the second tube formed on the upper and lower surfaces of the electric element, .

In addition, in the conventional art heat exchanger for cooling an electric device, the heat exchange efficiency is relatively lowered due to the indirect cooling method, and in the technology of packaging a plurality of electric elements into a single body, not only the cooling performance of each electric element, The cooling efficiency of the entire package is relatively low.

In the conventional heat exchanger for cooling an electric device, an electric element such as a power semiconductor is sandwiched between the first tube and the second tube, and then the first tube or the second tube is deformed because the electric element is pressed or pressed against each other. Therefore, the possibility of quality problems is very high.

Further, in the heat exchanger for cooling an electric device of the related art, it is difficult to pin the pin of the power semiconductor, which is an electric element, in the assembling process between the heat exchanger and the electric device, There is a relatively low productivity due to an increase in the cycle time of the printed circuit board assembling process such as the assembly process, the quality problem solving process and the separate pin aligning process according to the position.

Since the tube length corresponding to the number of electric devices or power semiconductors is predetermined, the heat exchanger for cooling electric devices according to the prior art has to be manufactured in accordance with the decrease or increase in the number of electric devices or power semiconductors, There is a downside.

Therefore, in the present invention, it is urgently required to develop a technique for simultaneously cooling the both surfaces of a power semiconductor while forming a stacked direct cooling channel that can be manufactured and assembled in a smaller size.

The object of the present invention has been achieved in view of the above circumstances, and it is an object of the present invention to reduce the size and weight of the cooling device by stacking the stacked cooling channel portions between the two-sided cooling type power modules (hereinafter referred to as power modules) There is provided a stacked power semiconductor double-sided cooling apparatus having a direct cooling channel that can improve cooling performance and maximize device scalability and versatility.

In order to achieve the above object, a stacked type power semiconductor double-sided cooling apparatus having a direct cooling channel according to the present invention is connected to each other by stacking, so that a fluid such as any one of a refrigerant, And at least one unit for respectively forming a direct cooling channel for flowing the fluid so as to be in contact with each other, wherein the unit is in the form of a hollow plate member in which the fluid flows, A cooling passage portion having a space for accommodating or flowing the fluid corresponding to the direct cooling passage, the cooling passage portion being stacked along the thickness direction of the unit so as to be disposed in the unit; And the power semiconductor coupled to the cooling channel portion so as to air-tightly cover a plurality of openings of the cooling channel portion.

The unit is stacked along the thickness direction of the unit to become a unit assembly.

The unit assembly includes a tubular plug portion of one of the cooling flow passage portions facing each other or mutually oppositely arranged in accordance with the stacking of the units and the tubular socket portion of the other cooling flow passage portion are connected to each other, Can be supplied or recovered to each of the cooling passage portions.

Wherein the unit assembly includes an inflow path formed at one side of the unit such that fluid is introduced into the direct cooling flow passage with reference to one side position where the plug portion and the socket portion are connected to each other; And an outflow path formed on the other side of the unit such that the fluid flows out from the direct cooling flow passage on the basis of the other side position where the plug portion and the socket portion are connected to each other, wherein the inflow path or the outflow path is a thickness Direction or the stacking direction of the unit.

The unit assembly further includes a cover that closes or closes the plurality of final-end socket portions of the cooling channel portion and the through-holes of the opening portion.

Wherein the cover includes: a cover plate having an area relatively larger than a plane of the cooling channel portion; A first finishing portion formed at both side ends of the bottom surface of the cover plate to block an inner diameter of a final-end socket portion of the cooling channel portions; A second finishing portion formed at a central portion of a bottom surface of the cover plate and covering a final end opening of the cooling channel portions; A fourth ring seating groove portion formed in the second finishing portion and on which a third O-ring for water tightness of the final end opening is seated; And a fastening hole formed at a corner position of the cover so as to penetrate in a thickness direction of the cover.

The power semiconductor includes: an AC (AC) three-phase terminal protruding from any one of an upper end or a lower end of the power semiconductor; A circuit terminal protruded to the other of the upper and lower ends of the power semiconductor; A semiconductor body connected between the AC three-phase terminal and the circuit terminal; A mold part made of a synthetic resin material or a plastic material formed on a rim of the semiconductor body; And a heat transfer portion of a metal material formed on a surface of the semiconductor body based on a center position of the semiconductor body surrounded by the mold portion, wherein a size or an open area of the opening formed in the cooling passage portion is a size As shown in FIG.

The cooling channel portion includes a lower casing and an upper casing fused or coupled to face each other so that a fluid receiving space may be formed inside the cooling channel portion.

Wherein the lower casing of the cooling passage portion has a bottom surface of a flat plate-like casing; A lower wall protruding from an edge of the casing bottom surface; One or more openings opened relative to an intermediate position of the casing bottom surface; A tubular plug portion for integrally protruding from one side and the other side of the bottom surface of the casing in a direction opposite to the bottom wall with respect to an outer position of the opening portion and forming a fluid inflow path or an outflow path, ; A first ring seating groove portion formed to extend along a circumferential direction on an outer circumferential surface of the plug portion; A first ring of a circular ring shape fitted in the first ring seating groove; A second ring seating groove portion formed at an outer position of the bottom surface of the casing with respect to a rim of the opening portion; And a second O-ring in the form of a square ring fitted in the second ring seating groove.

Wherein the upper casing of the cooling channel portion has the same planar shape and the same shape as the lower casing; An upper wall protruding from the rim of the casing ceiling toward the lower wall of the lower casing; One or more openings opened to coincide with openings of the lower casing relative to an intermediate position of the casing ceiling; The upper casing is formed so as to integrally protrude from one side and the other side of the casing ceiling in a direction opposite to the upper wall with respect to an outer position of the opening of the upper casing, A tubular socket portion having an inner diameter for forming the inflow path or the outflow path; A third ring seating groove formed at a position outside the casing ceiling with respect to an edge of the opening of the upper casing; And a third O-ring fitted in the third ring seating groove.

A stacked type power semiconductor double-sided cooling apparatus having a direct cooling channel according to the present invention has an opening portion opened toward an upper portion or a lower portion of a power semiconductor and has a stacked type cooling By arranging the flow path portion between the power semiconductors along the stacking direction of the power semiconductors, the entire size of the cooling device can be relatively reduced, and the heat of the cool heat of the fluid or the heat of the power semiconductor can be mutually heat- Can be relatively maximized.

Further, in the stacked type power semiconductor double-sided cooling apparatus having the direct cooling flow path of the present invention, the plurality of cooling flow path portions may be stacked and bonded to each other with the same shape, and either one of the cooling flow path portions is brought into close contact with the upper portion of the power semiconductor And the other of the cooling flow path portions is brought into close contact with the bottom portion of the power semiconductor in the stacking direction so that the plug portions and the socket portions of the mutually opposing tubular members provided in the cooling flow path portion are fitted and penetrated to each other, There is an advantage that the path and the outflow path can be made or extended.

Further, in the stacked-type power semiconductor double-sided cooling apparatus having the direct cooling channel of the present invention, the power semiconductor is attached to the cooling channel portion with an adhesive or an adhesive film with reference to the opening portion of the cooling channel portion, Ring-shaped O-ring is provided so that the airtightness can be maintained so that the fluid is prevented from leaking to the outside of the cooling channel portion by the O-ring.

Further, in the stacked type power semiconductor double-sided cooling apparatus having the direct cooling flow path of the present invention, the plug portion or the socket portion of the cooling flow path portion forms and extends the inflow path and the outflow path, So that even if the power semiconductor is disposed between the cooling channel portions, the power semiconductor is not pressed or pressed as in the prior art, so that the possibility of the quality problem of the power semiconductor is not known Can be blocked.

In addition, since the stacked type power semiconductor double-sided cooling apparatus having the direct cooling channel of the present invention has a structure in which the direct cooling type relatively high heat exchange is performed, and the stacked structure is along the thickness direction of the power semiconductor, There is an advantage that the total size of one package module can be relatively reduced.

In addition, since the cooling flow path portion is stacked and connected to each other, it is possible to remove the existing cooling channel portion or add the cooling channel portion additionally as the number of power semiconductors decreases or increases. There is an advantage that the expandability and general versatility of the cooling device are very excellent.

Further, in the stacked type power semiconductor double-sided cooling apparatus having the direct cooling flow path of the present invention, as in the case where the sockets of the cooling passage portion at the final stage are directly coupled to the connecting tube portion such as the nipple of the power semiconductor housing, There is an easy advantage.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view for explaining a unit in which a cooling channel portion of a stacked type power semiconductor double-sided cooling device having a direct cooling channel according to an embodiment of the present invention is combined with a power semiconductor. FIG.
Fig. 2 is an exploded perspective view of the unit shown in Fig. 1; Fig.
3 is a perspective view for explaining a stacking method of a plurality of units shown in FIG.
Fig. 4 is a perspective view of a unit assembly made by laminating a plurality of units shown in Fig. 3; Fig.
5 is a cross-sectional view taken along line AA of FIG. 4;
6 is a perspective view for explaining a state where a cover is coupled to the unit assembly of FIG.
7 is an exploded perspective view of the unit assembly and cover shown in Fig.
8 is a side view showing a section of the housing for explaining a state in which the unit assembly and the cover shown in FIG. 6 are installed in a housing for mounting a power semiconductor.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. And is provided to fully illustrate the scope of the invention to those skilled in the art, and the invention is defined by the claims.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. &Quot; comprises " and / or "comprising" when used in this specification is taken to specify the presence or absence of one or more other components, steps, operations and / Or add-ons. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Also, the O-ring mentioned in the description of the present invention may have various outer shapes such as a circle, a round square and the like, and its cross-section may be selectively used in accordance with the required performance of the airtightness or watertightness. But may not be limited to O-rings. Also, the O-ring may be a sealing member having an airtight or watertight performance, a quad-ring, a gasket, or other sealing or watertight means. In addition, O-rings are natural or synthetic rubbers, fluoro elastomers, epichlorohydrin polymers, ethylene propylene monomer (EPM), ethylene propylene diene monomer (EPDM), isobutylene sioprene rubber (IIR) (hydrogenated nitrile butadiene rubber).

FIG. 1 is a perspective view for explaining a unit in which a cooling channel portion and a power semiconductor of a stacked type power semiconductor double-side cooling apparatus having a direct cooling channel according to an embodiment of the present invention are combined, and FIG. 2 is a cross- Fig. FIG. 3 is a perspective view illustrating a method of stacking a plurality of units shown in FIG. 1, and FIG. 4 is a perspective view of a unit assembly made by stacking a plurality of units shown in FIG.

1 or 3, a stacked power semiconductor double-sided cooling apparatus having a direct cooling flow path of the present embodiment is interconnected by lamination so that a fluid such as any one of refrigerant, cooling water, (100, 100a, 100b) for respectively forming a direct cooling channel (C2) for flowing the fluid so as to be in direct contact with the surface of the unit (100).

The units 100, 100a and 100b are stacked along the thickness direction (for example, the Z axis direction or the stacking direction) of the units 100, 100a and 100b, May be connected to each other.

1 or 2, the cooling channel part 200 is formed of any one material selected from the group consisting of a material resistant to cold heat or heat and made of a plastic material, an engineering plastic material, or a synthetic resin material, And may serve as a function of providing a space for accommodating or flowing the corresponding fluid therein or as a heat insulating material.

The inflow path C1 through which the fluid flows into the direct cooling flow path C2 is formed at one side of the unit 100 and the outflow path C3 through which the fluid flows out from the direct cooling flow path C2 is connected to the unit 100, respectively.

The inflow path C1 or the outflow path C3 may extend in the thickness direction of the unit 100 or in the same direction as the stacking direction of the unit 100. [

The inflow path C1 and the outflow path C3 may be connection tubes made by a plurality of mutually connected plug portions 215 and socket portions 225. [

Each of the units 100 includes a cooling channel portion 200 in the form of a hollow plate member through which the fluid flows, flows, and flows. The cooling channel portion 200 is spaced apart along the longitudinal direction of the cooling channel portion 200, (For example, two) of power semiconductors 300 and 301 which are coupled to or mounted on the cooling channel unit 200 so as to cover the openings 211 and 212 of the power semiconductor module 200, respectively.

2, the AC three-phase terminals 310 protrude from one of the upper and lower ends of the power semiconductors 300 and 301 and the other one of the upper and lower ends of the power semiconductors 300 and 301 A plurality of circuit terminals 311 are projected to be connected to a circuit device (not shown) of a housing for housing a power semiconductor.

Each of the power semiconductors 300 and 301 includes a semiconductor body connected between the AC three-phase terminal 310 and the circuit terminal 311. Here, the semiconductor body may include a mold part 312 made of a synthetic resin material or a plastic material formed at a rim of the semiconductor body, and a surface of the semiconductor body surrounded by the mold part 312 And a heat transfer portion 313 made of a metal material.

The heat transfer portion 313 is a portion where heat is directly exchanged by being in direct contact with the fluid.

The mold part 312 is further provided with an adhesive or an adhesive film (not shown) on the surface of the mold part 312 and is bonded to the surface around the openings 211 and 212 facing the power semiconductors 300 and 301 It may be fixed. With this bonding method, each of the power semiconductors 300 and 301 can be easily fixed to the cooling passage portion 200.

The sizes or the open areas of the openings 211, 212, 221 and 222 of the cooling channel unit 200 can be determined to correspond to the sizes of the heat transfer parts 313 of the power semiconductors 300 and 301.

3, each of the units 100, 100a and 100b is formed in the same shape and arranged in a plurality of directions along the stacking direction (for example, the thickness direction of the Z axis unit) of the power semiconductors 300 and 301 Are stacked one upon another and made into a unit assembly (M) by lamination, as shown in Fig. The unit assembly M may be referred to as a cooling module or a cooling device. The unit assembly M may have a unit laminated structure.

For example, the units 100, 100a, and 100b may be configured to connect the fluid to the units 100, 100a, and 100b in accordance with the mutual connection of the tubular plug portion 215 and the socket portion 225, The unit assembly M having the unit laminated structure stacked along the thickness direction of the units 100, 100a and 100b can be formed so as to be supplied or recovered to each of the cooling channel portions 200 of the unit 100. [

The outer diameter of the socket portion 225 can be determined based on a value obtained by subtracting the assembly tolerance from the inner diameter of the plug portion 215. For example, most of the socket portion 225 can be fully inserted into the inner diameter of the plug portion 215. [ At this time, an end of the plug portion 215 is brought into contact with or not in contact with a surface (for example, the casing bottom surface 213) corresponding to the periphery of the socket portion 225 in the cooling channel portion 200 stacked at the opposed positions .

Referring again to FIG. 2, the cooling channel portion 200 includes a lower casing 210 and an upper casing 220.

The lower casing 210 and the upper casing 220 are coupled (for example, by fusion or fusion) so as to face each other so that a fluid receiving space can be formed inside the cooling channel portion 200.

The lower casing 210 of the cooling channel unit 200 has a plate shape, a disk shape, a plate shape having a round corner, a shape having a plane between the one side end and the other side end, And a casing bottom surface 213 in the form of a flat plate as shown in Fig.

If the casing bottom surface 213 has a plane between one end and the other end, each of which has a semicircular rim shape, fluid hydrodynamic diffusion and transmission are smoothly induced, The heat transfer performance and the fluid flow performance can be relatively increased as compared with the shape.

 The lower casing 210 includes a lower wall 214 protruding in the Z-axis direction from the rim of the casing bottom surface 213.

The lower casing 210 includes one or more openings 211 and 212 that are opened in the Z-axis direction with respect to the intermediate position of the casing bottom surface 213 and are spaced apart along the X-axis direction.

The lower casing 210 is integrally formed to protrude from one side and the other side of the casing bottom surface 213 along the opposite direction of the lower wall 214 with respect to an outer position of the openings 211 and 212, And a tubular plug portion 215 for forming the inflow path C1 or the outflow path C3.

On the outer circumferential surface of the plug portion 215, a first ring seating groove portion 216 extending along the circumferential direction is formed.

The first ring seating groove portion 216 of each plug portion 215 is fitted with a circular ring-shaped first O-ring 400 for water tightness.

The lower casing 210 includes a second ring seating groove 217 formed at an outer position of the casing bottom surface 213 with respect to the rim of each of the openings 211 and 212.

Each of the second ring seating grooves 217 is fitted with a second O-ring 500 having a square ring shape for water tightness.

The upper casing 220 of the cooling channel unit 200 includes a casing ceiling 223 having the same planar shape as the lower casing 210.

The upper casing 220 includes a top wall 224 protruding from the rim of the casing ceiling surface 223 toward the lower wall 214 of the lower casing 210.

The upper casing 220 is opened in the Z axis direction corresponding to the openings 211 and 212 of the lower casing 210 with respect to the intermediate position of the casing ceiling surface 223, (Not shown).

The upper casing 220 integrally protrudes from one side and the other side of the casing ceiling surface 223 in the direction opposite to the upper wall 224 with respect to the outer positions of the openings 221 and 222, A socket portion 225 having a tubular shape for forming the inflow path C1 or the outflow path C3 has an inner diameter that is large enough to fit the plug portion 215 of the lower casing 210, .

The inner circumferential surface or the outer circumferential surface of the socket portion 225 is a simple circumferential surface and contacts the first O-ring 400 provided in the plug portion 215 to maintain a water tightness (e.g., air tightness performance).

The protruding height of the socket portion 225 is determined corresponding to the thickness of the power semiconductors 300 and 301. 3 or FIG. 4, the socket unit 225 includes the units 100 and 100a covering the power semiconductors 300 and 301 when one or more units 100, 100a and 100b are stacked It is possible to perform a function as a gap maintaining member which prevents excessive power semiconductors 300 and 301 from being squeezed or pressed.

The upper casing 220 includes a third ring seating groove portion 227 formed at an outer position of the casing ceiling surface 223 with respect to the rim of each of the openings 221 and 222.

Each third ring seating groove portion 227 is fitted with a third O-ring 501 having a square ring shape for water tightness.

The lower casing 210 and the upper casing 220 are fused or joined to each other so that the lower wall 214 and the upper wall 224 are in contact with each other to form a cooling channel unit 200 as shown in FIG. .

The power semiconductors 300 and 301 are provided in the openings 211 and 212 of the cooling channel unit 200 with the second O-ring 500 interposed therebetween and eventually become one unit 100.

The plurality of units 100, 100a, and 100b shown in FIG. 3 are respectively fitted to the upper socket portions 225 with respect to the direction in which the lower plug portions 215 are opposed to each other when stacked, State. The first O-ring 400, the second O-ring 500 and the third O-ring 501 described in FIG. 2 are connected to an object (for example, an inner circumferential surface of the socket portion 225 or the power semiconductors 300 and 301) 4), while maintaining the watertightness with respect to the surface (e.g., the surface).

5 is a cross-sectional view taken along the line A-A in Fig.

The unit assembly M is assembled by stacking a plurality of units 100, 100a and 100b and is connected to the unit 100 through a fluid inlet (C / In) or a fluid outlet (C / And the heat of the power semiconductors 300 and 301 disposed between the heaters 100a and 100b and the heat and the heat of the cooling of the fluids of the plurality of direct cooling channels C2.

For example, the fluid flows into each of the cooling channel portions 200 through the final end plug portion 215a and the inlet path C1 of the units 100, 100a, and 100b, And then flows out through the outflow path C3 of the units 100, 100a, 100b and the final-end second-side plug portion 215b. Fluid inflow, light oil and outflow are effected by the pressure of an unillustrated fluid pump, at which time the fluid can circulate through a circulation line (not shown) between the unit assembly M and the cooling device (not shown).

Particularly, since the fluid of the direct cooling channel C2 directly contacts the power semiconductors 300 and 301 stacked on the lower and upper sides of the cooling channel unit 200, Both surfaces (e.g., upper and lower surfaces) of the power semiconductors 300 and 301 can be cooled at the same time, so that the cooling efficiency can be superior to that of the conventional indirect cooling method.

The unit assembly M further includes a cover 600 for airtight performance or watertightness of the fluid.

An unshown adhesive or an adhesive film may be further provided at a portion where the cover 600 and the unit assembly M are in contact with each other.

The cover 600 serves to close or close the through holes H1, H2, H3, and H4 of the plurality of final end socket portions 225a and 225b and the openings 221 and 222 of the cooling channel portion 200 do.

FIG. 6 is a perspective view for explaining a state where the cover is coupled to the unit assembly of FIG. 4, and FIG. 7 is an exploded perspective view of the unit assembly and the cover shown in FIG.

The cover 600 includes a cover plate 610 having a relatively larger area than the plan view of the cooling channel portion 200.

The cover 600 is formed at both side ends of the bottom surface of the cover plate 610 and includes first end portions 620 and 621 that block the inner diameters of the final end socket portions 225a and 225b of the cooling channel portions 200, .

The first closing portions 620 and 621 may be plug-type protruding structures inserted into the inner diameters of the socket portions 225a and 225b or a socket type groove structure in which the socket portions 225a and 225b are seated. In the case of FIG. 7 or FIG. 8, the first finishing portions 620 and 621 are illustratively fabricated in the form of a plug-type protruding structure, but the design of the groove structure may be changed.

The cover 600 includes a second finishing portion 630 formed at the center of the bottom surface of the cover plate 610 and covering the final end openings 221 and 222 of the cooling channel portions 200.

The second finishing portion 630 is formed with a fourth ring seating groove portion 637 shown in FIG. 2 and capable of seating a third O-ring 501 for water tightness of the final end openings 221 and 222 . Of course, the fourth finishing portions 620 and 621 are also fitted with a fourth O-ring 640, which is the same as the first O-ring 400 shown in FIG.

Therefore, when the unit assembly M is engaged with the cover 600, the cover 600 and the final stage cooling flow passage 600 are connected through the third O-ring 501 and the fourth O-ring 640 of the final- The watertightness between the portions 200 can be maintained.

8 is a side view showing a section of the housing for explaining a state where the unit assembly and the cover shown in FIG. 6 are installed in a housing for mounting a power semiconductor.

Referring to FIG. 7 or 8, a combination of the assembly M composed of the plurality of units 100, 100a, and 100b and the cover 600 may be installed in the power semiconductor housing 700. In the power semiconductor housing 700, supply and recovery of fluid as a coolant can be performed.

The cover 600 is formed with a plurality of fastening holes 650 for fastening the fastening bolts 800. Each of the fastening holes 650 is formed to pass through the cover 600 in the thickness direction of the cover 600 at the corner position of the cover 600.

The fastening bolt 800 and the fastening hole 650 serve to fix the assembly M and the cover 600.

The penetration position of the fastening hole 650 of the cover 600 coincides with the bolt hole 750 of the power semiconductor housing 700.

The unit assembly M corresponding to the power semiconductor double-sided cooling apparatus or cooling module of the present embodiment is configured such that the plug portion 215 of the final stage cooling channel portion 200 is connected to the connection tube portion 720 of the power semiconductor mounting housing 700 The installation can be easily completed in such a manner that it is simply fitted to an object (for example, a nipple) where the inflow or outflow of the fluid occurs.

The screw shaft portion of the fastening bolt 800 passes through the fastening hole 650 of the cover 600 and is screwed into the bolt hole 750 of the power semiconductor housing 700.

In this way, the unit assembly M includes the power semiconductor 300 and the cooling channel portion 200 which are alternately arranged and laminated along the stacking direction, and are arranged at the fluid inlet or outlet of the unit assembly M, The corresponding final end plug portion 215 is directly inserted into the connection tube portion 720 of the housing 700 so that the detachment of the unit assembly M can be prevented by the cover 600 and the fastening bolt 800 have.

The present embodiment is characterized in that each unit in which the power semiconductor is coupled to the cooling passage portion is arranged in a stacked manner so that the power semiconductor can be differentiated from the planar array type or the arrangement in the flow direction. This can solve the disadvantage that the space occupies a relatively large space in the conventional arrangement of the flow path and the space required for each power semiconductor increases. That is, the present embodiment can prevent a performance deterioration occurring in a power conversion apparatus mounted in a limited space due to an increase in size of a conventional cooling apparatus.

In this embodiment, when the same number of power semiconductors are used as compared with the conventional method, a volume reduction of about 50% due to the unit stacking structure, corresponding weight reduction and cost reduction can be achieved. That is, even if the amount of power semiconductor is increased, only the volume reduction can be minimized, and the entire cooling flow path including the inflow path, the direct cooling flow path and the outflow path can be simply constructed.

In addition, this embodiment has an advantage that the heat exchange efficiency is relatively high as compared with an indirect cooling method through a physical or thermodynamic obstacle (e.g., a tube wall) between a fluid and a cooling object. For example, the thermal resistance of the present embodiment can be improved by 50% as compared with indirect cooling by the same capacity.

In this embodiment, the fluid itself directly contacts the power semiconductor to maximize heat exchange performance, but the cooling channel portion through which the fluid flows is made of a plastic material or a synthetic resin material so that the cold heat of the fluid is not taken away from the heat of the outside air The heat exchanging performance can be maximized by performing the function as a heat insulating material, and it is also easy to manufacture a cooling channel portion such as a three dimensional object which is relatively lighter than a metal material.

The foregoing description is merely illustrative of the technical idea of the present invention and various changes and modifications may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments described in the present invention are not intended to limit the scope of the present invention, but are intended to be illustrative, and the scope of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas which are equivalent or equivalent thereto should be interpreted as being included in the scope of the present invention.

100, 100a, 100b: unit 200: cooling channel part
210: lower casing 220: upper casing
300, 301: power semiconductor 400: first o-ring
500: second o-ring 501: third o-ring
600: Cover M: Unit assembly

Claims (10)

And a direct cooling flow path for flowing the fluid such that a fluid such as any one of the refrigerant, the cooling water and the heat exchange medium is directly in contact with the surface of the power semiconductor, In a stacked power semiconductor double-sided cooling apparatus having a cooling channel
The unit includes:
A plurality of power semiconductors arranged in the thickness direction of the unit and connected to each other in the thickness direction so as to be disposed between the power semiconductors, A cooling passage portion having a space for accommodating or flowing therein; And
And the power semiconductor coupled to the cooling passage portion so as to air-tightly cover a plurality of openings of the cooling passage portion
And a direct cooling flow path.
The method according to claim 1,
The unit includes:
Being stacked along the thickness direction of the unit to be a unit assembly
And a direct cooling flow path.
3. The method of claim 2,
The unit assembly includes:
The tubular plug portion of any one of the cooling flow path portions facing each other or facing each other in accordance with the stacking of the units is connected to the socket portion of the tubular shape of the other cooling flow path portion, Which can be supplied or recovered to each
Layered power semiconductor double-sided cooling device having a direct cooling flow path
The method of claim 3,
The unit assembly includes:
An inflow path formed at one side of the unit so that fluid is introduced into the direct cooling flow passage based on one side position where the plug portion and the socket portion are connected to each other; And
And an outflow path formed on the other side of the unit so that the fluid flows out from the direct cooling flow passage based on the other position where the plug portion and the socket portion are connected to each other,
The inflow path or the outflow path extending in the thickness direction of the unit or the stacking direction of the unit
And a direct cooling flow path.
The method of claim 3,
The unit assembly includes:
And a cover which closes or closes the plurality of final-end socket portions of the cooling passage portion and the through-holes of the opening portion
And a direct cooling flow path.
6. The method of claim 5,
The cover
A cover plate having an area relatively larger than the plane of the cooling passage portion;
A first finishing portion formed at both side ends of the bottom surface of the cover plate to block an inner diameter of a final-end socket portion of the cooling channel portions;
A second finishing portion formed at a central portion of a bottom surface of the cover plate and covering a final end opening of the cooling channel portions;
A fourth ring seating groove portion formed in the second finishing portion and on which a third O-ring for water tightness of the final end opening is seated; And
And a fastening hole formed so as to penetrate in a thickness direction of the cover at a corner position of the cover
And a direct cooling flow path.
The method according to claim 1,
The power semiconductor includes:
An AC (AC) three-phase terminal protruding from any one of an upper end or a lower end of the power semiconductor;
A circuit terminal protruded to the other of the upper and lower ends of the power semiconductor;
A semiconductor body connected between the AC three-phase terminal and the circuit terminal;
A mold part made of a synthetic resin material or a plastic material formed on a rim of the semiconductor body; And
And a heat transfer portion of a metal material formed on a surface of the semiconductor body based on a center position of the semiconductor body surrounded by the mold portion,
The size or open area of the opening formed in the cooling passage portion is determined to correspond to the size of the heat transfer portion
And a direct cooling flow path.
The method according to claim 1,
The cooling channel portion
And a lower casing and an upper casing welded or coupled to face each other so that a fluid receiving space may be formed inside the cooling channel section
And a direct cooling flow path.
9. The method of claim 8,
Wherein the lower casing of the cooling passage portion includes:
A casing bottom surface in a flat plate shape;
A lower wall protruding from an edge of the casing bottom surface;
One or more openings opened relative to an intermediate position of the casing bottom surface;
A tubular plug portion for integrally protruding from one side and the other side of the bottom surface of the casing in a direction opposite to the bottom wall with respect to an outer position of the opening portion and forming a fluid inflow path or an outflow path, ;
A first ring seating groove portion formed to extend along a circumferential direction on an outer circumferential surface of the plug portion;
A first ring of a circular ring shape fitted in the first ring seating groove;
A second ring seating groove portion formed at an outer position of the bottom surface of the casing with respect to a rim of the opening portion; And
And a second ring-shaped second O-ring which is fitted in the second ring-seating groove portion
And a direct cooling flow path.
10. The method of claim 9,
Wherein the upper casing of the cooling passage portion includes:
A casing ceiling scene having the same planar shape and shape as the lower casing;
An upper wall protruding from the rim of the casing ceiling toward the lower wall of the lower casing;
One or more openings opened to coincide with openings of the lower casing relative to an intermediate position of the casing ceiling;
The upper casing is formed so as to integrally protrude from one side and the other side of the casing ceiling in a direction opposite to the upper wall with respect to an outer position of the opening of the upper casing, A tubular socket portion having an inner diameter for forming the inflow path or the outflow path;
A third ring seating groove formed at a position outside the casing ceiling with respect to an edge of the opening of the upper casing; And
And a third O-ring fitted in the third ring seating groove portion
And a direct cooling flow path.

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