CN206877979U - Stacked power semiconductor two sides cooling device with direct cooling channel - Google Patents
Stacked power semiconductor two sides cooling device with direct cooling channel Download PDFInfo
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- CN206877979U CN206877979U CN201720711807.5U CN201720711807U CN206877979U CN 206877979 U CN206877979 U CN 206877979U CN 201720711807 U CN201720711807 U CN 201720711807U CN 206877979 U CN206877979 U CN 206877979U
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of stacked power semiconductor two sides cooling device with direct cooling channel, for the two sides with the stacked power semiconductor being configured between cooling channel directly to be contacted and cooled down, including more than one unit, more than one unit is connected with each other by stacking, directly contacted with the surface of power semiconductor in order that obtaining any one fluid in refrigerant, cooling water, heat exchange medium, formed respectively includes for the direct cooling channel for flow of fluid, unit：Cooling channel portion, to realize the hollow board member form of the inflow of fluid, discharge, flowing, and it is laminated along the thickness direction of unit to be configured between power semiconductor, and inner space is interconnected with one another, and there is inner containment to have fluid corresponding with direct cooling channel or make the space of flow of fluid for cooling channel portion；And power semiconductor, cooling channel portion is incorporated into, to be covered respectively to multiple opening portions in cooling channel portion in a gas tight manner.
Description
Technical field
A kind of stacked power semiconductor two sides cooling device with direct cooling channel is the utility model is related to, more
In particular it relates to one kind make the fluids such as refrigerant, cooling water, heat exchange medium respectively with the thickness direction along unit (unit)
The upper surface and bottom surface of multiple power semiconductors of stacking directly contact, so as to the two sides (example to power semiconductor：Upper table
Face and bottom surface) the stacked power semiconductor two sides cooling device with direct cooling channel that is cooled down respectively.
Background technology
Generally, there is the automobile for being used as power source using fossil fuel such as gasoline (gasoline), diesel oil (diesel), and
There is the environmentally friendly vehicle (Environmentally for being used as power source using natural energy resources, water (hydrogen) or the electric energy of environmental sound
Friendly Vehicle, EFV).
For example, not only having hybrid vehicle (HEV), electric automobile (EV) in environmentally friendly vehicle, also energetically open
Send out the plug-in hybrid-power automobile (PHEV) being combined the advantages of by them.
Such environmentally friendly vehicle in order to drive engine need exchange (AC) three-phase voltage.Thus need as power supply
Direct current (DC) voltage conversion of high-voltage battery is for the first device of exchange (AC) three-phase voltage for driving engine.This
Outside, it is also necessary to for being converted to the second device of 12V low-voltages used in vehicle.
First device is generally referred to as inverter (inverter), second device is referred to as low direct current transducer (Low DC
DC Converter, LDC).First device and second device are combined and can be described as power conversion unit.
For example, according to the composition of hybrid electric vehicle, common hybrid vehicle includes high-voltage battery, low-voltage electricity
Pond, power conversion unit, motor, generator and engine.Plug-in hybrid-power automobile also includes charger.Electric vehicle
Construction does not have generator and engine compared with hybrid vehicle, and is additionally provided with charger.
In environmentally friendly vehicle, power conversion unit is most important part in drive system.Since it is desired that conversion voltage, institute
Can be generated heat while built-in component working.
For example, high voltage (the example of driving battery is used in the part of power conversion unit：300V) and electric current work(
Rate, and it is provided with PCU (Power Control Unit, power control unit) or power model (power module) (example：Absolutely
Edge grid bipolar transistor (IGBT；Insulated gate bipolar transistor) module), such power is adjusted
Save and be supplied to for required state in motor.
Power model includes the electric elements such as inverter, smoothing capacitor (condenser) and current transformer (converter)
Or the power semiconductor as power conversion unit.The electric elements or power semiconductor are due to supplying electric current
(electricity) generate heat, therefore single cooling device is needed in reality.Especially, in the power half of power conversion unit
In the design of the parts such as conductor, realize that cooling performance can be described as key factor.In other words, if such part persistently by
Heat, then performance can reduce, under serious situation can generation part damage.If cooling performance declines, the durability of part also can
Decrease.
Although the structure of the cooling channel of the indirect type of cooling of prior art is simple, manufacturing and assembleability compared with
It is low.It means that production efficiency can be reduced and increase cycle time (C/T, Cycle Time), so as to income be caused to reduce.
As prior art related to this, in the cooling device for power model of automotive field, using having only
Cool down the device in the section of electric elements or the device on cooling electric elements two sides.
For example, the heat exchanger for being used to cool down electric elements of prior art includes：First pipe (tube), be configured at towards
The one side of the short transverse of the electric elements so that a pair of plates (plate) relative to each other internally form spatial portion, with
Just for flow of fluid such as refrigerant, cooling water, heat exchange mediums；Second pipe, is configured at another side；Inlet portion, along length
Direction forms UNICOM in side and the subregion of first pipe；Export department, alongst in side and described second
The subregion of pipe forms UNICOM；And connecting portion so that first pipe and the second pipe are connected in a manner of mutual UNICOM.
But in the prior art, fluid along first pipe and the second pipe inner space flow, now, fluid it is cold
Heat or the warm of electric elements perform heat exchange the wall of the first pipe or the second pipe in a manner of cooling down indirectly.
In other words, prior art be used for cool down electric elements heat exchanger the shortcomings that be, due to need with
The tube outer surface of electric elements contact carries out thermal grease (thermal grease) coating process, hence in so that production efficiency is significantly
Decline.
In addition, prior art be used for cool down electric elements heat exchanger the shortcomings that be because so that first pipe or
Two tube walls (top wall, lower part wall) of second pipe be respectively formed above electric elements and below, so heat exchanger is whole
The thickness relative increase of body.
In addition, prior art is used to be the shortcomings that cooling down the heat exchanger of electric elements, due to by cooling down indirectly
Mode, so as to cause heat exchanger effectiveness relative drop, carried out causing multiple electric elements in a manner of being formed as a main body
In the technology for encapsulating (packaging), not only the respective cooling performance of electric elements can reduce, and by electric elements and outside
Cooling effectiveness also can relative drop in encapsulation (package) entirety that shell (housing) is formed.
In addition, prior art is used to be the shortcomings that cooling down the heat exchanger of electric elements, in the first pipe and the second pipe
Between insert the electric elements such as power semiconductor after, the first pipe or the second pipe is deformed due to mutually extruding or compressing,
Thus it is likely to that quality problems occur.
In addition, prior art is used to be the shortcomings that cooling down the heat exchanger of electric elements, in heat exchange and electrical equipment member
In assembling procedure between part so that pin (pin) the access printed circuit board (PCB) (PCB) as the power semiconductor of electric elements
When, due to being difficult the position correction for grasping pin, therefore increase other needle sort process, therefore such as assemble, solve quality
Other pin position correction process caused by problem and position correction etc., when can increase the cycle of printed circuit board (PCB) assembling procedure
Between, so as to relatively low production efficiency.
In addition, prior art be used for cool down electric elements heat exchanger the shortcomings that be, due to pair and electric elements
Or the corresponding length of tube of number of power semiconductor is provided in advance, therefore with of electric elements or power semiconductor
Number decreases or increases the manufacture pipe, it is necessary to other, so as to which versatility declines to a great extent.
Thus, in the utility model, in order to be improved to this, real need technological development so that structure can be real
It is now stacked direct cooling channel smaller and that assembling is more easily manufactured, and enables to the two sides of power semiconductor simultaneously cold
But.
Utility model content
Technical problems to be solved
The purpose of this utility model is to provide a kind of stacked power semiconductor two sides with direct cooling channel cold
But device, as above actual conditions is allowed for and are proposed, by two sides cooled power model (hereinafter referred to as power model)
Between the stacked cooling channel portion of laminated configuration, so as to reduce the size of cooling device and weight and improve cooling
Energy, the autgmentability and versatility of device can be maximized.
Solve the means of technical problem
According to the stacked power semiconductor of the present utility model with direct cooling channel for realizing the purpose
Two sides cooling device, the stacked power semiconductor two sides cooling device with direct cooling channel include more than one
Unit, one unit above are connected with each other by stacking, in order that obtaining in refrigerant, cooling water, heat exchange medium
Any one fluid directly contacts with the surface of power semiconductor, is formed lead to for the direct cooling for the flow of fluid respectively
Road, it is characterised in that the unit includes：Cooling channel portion, the cooling channel portion are inflow, the row for realizing the fluid
The hollow board member form go out, flowed, and along the unit thickness direction be laminated be configured at the power semiconductor it
Between, and inner space is interconnected with one another, and that there is inner containment to have is logical with the directly cooling in the cooling channel portion
The fluid corresponding to road or the space for making the flow of fluid；And the power semiconductor, the power semiconductor combine
In the cooling channel portion, to be covered respectively to multiple opening portions in the cooling channel portion in a gas tight manner.
Thickness direction of the unit along the unit is laminated and forms assembling components body.
The assembling components body is combined by the stacking of the unit so that is configured toward each other or opposite each other any
The interface portion of the connector portions of the tubular form in one cooling channel portion and the tubular form in another cooling channel portion is connected with each other,
So that the fluid is supplied or is recovered in each cooling channel portion.
The assembling components body includes：Inflow path, the side position being connected with each other with the connector portions and the interface portion
Benchmark is set to, is formed at the side of the unit, to realize inflow of the fluid to the directly cooling channel side；And outflow
Path, on the basis of the connector portions and another side position of interface portion interconnection, it is formed at the another of the unit
Side, to realize outflow of the fluid from the directly cooling channel, the inflow path or the outflow path with the list
The stacked direction identical direction extension of the thickness direction or the unit of member.
The assembling components body also includes lid, the lid to multiple least significant end interface portions in the cooling channel portion and
The through hole of opening portion side is covered or closed.
The lid includes：Lid plate, the area of the lid plate are relatively wider than the area in the cooling channel portion；The
One shielding part, the both-side ends portion of the lid plate bottom surface is respectively formed in, so as to be terminated to most end in the cooling channel portion
The internal diameter of oral area is covered；Second shielding part, the central portion of the bottom surface of the lid plate is respectively formed in, so as to described cold
But least significant end opening portion is covered in passage portion；Groove portion is installed at Fourth Ring, is formed at second shielding part, and be provided with
For carrying out the 3rd o-ring of water-stop to the least significant end opening portion；And fastener hole, be formed as the corner angle from the lid
Position penetrates to the thickness direction of lid.
The power semiconductor includes：AC three-phase terminal, it is any one from the upper end of the power semiconductor or lower end
Individual position protrusion；Circuit terminal, from another position protrusion in the upper end of the power semiconductor or lower end；Semiconductor master
Body, it is connected between the AC three-phase terminal and circuit terminal；Mold, it is formed at the edge part of the semiconductor body
Position, the mold is synthetic resin material or plastic material；And heat transmitting member, with surrounded by the mold described half
On the basis of the center of conductor main body, the surface of the semiconductor body is formed at, and is metal material, is formed at described
The size of the opening portion in cooling channel portion or the area opened are set to corresponding with the size of the heat transmitting member.
The cooling channel portion includes lower case and upper body, and the lower case and upper body are with relative to each other
Mode engage or combine, so as to be internally formed fluid containing space in the cooling channel portion.
The lower case in the cooling channel portion includes：Flat housing bottom surface；Lower part wall, from the housing bottom surface
Protrude at edge；More than one opening portion, opened on the basis of the centre position of the housing bottom surface；Connector portions, with institute
On the basis of the outer fix for stating opening portion, the opposite direction from the side of the housing bottom surface and opposite side along the lower part wall
Protrude to be formed with integral type respectively, and for forming the inflow path or outflow path of fluid, the connector portions are tubular shape
Shape；First ring installs groove portion, is formed as circumferentially extending from the outer peripheral face of the connector portions；First o-ring, is socketed on
First ring installs groove portion, and is circular annular form；Second ring installs groove portion, on the basis of the edge of the opening portion, is formed
In the outer fix of the housing bottom surface；And second o-ring, the second ring installation groove portion is socketed on, and be four side ring shapes.
The upper body of the cooling channel includes：Housing top surface, have and the lower case identical area
And shape；Top wall, protruded from the edge of the housing top surface to the direction of the lower part wall of the lower case；One with
On opening portion, on the basis of the centre position of the housing top surface, with consistent with the opening portion of the lower case respectively
Mode opens；Interface portion, on the basis of the outer fix of the opening portion of the upper body, from the side of the housing top surface and
Opposite direction of the opposite side along the top wall is protruded to be formed respectively with integral type, also, have can be for for the interface portion
The internal diameter for the size that the connector portions of the lower case are inserted respectively, and for forming the inflow path or the stream
Outbound path, the interface portion are tubular form；3rd ring installs groove portion, using the edge of the opening portion of the upper body as base
Standard, it is formed at the outer fix of the housing top surface；And the 3rd o-ring, it is socketed on the 3rd ring installation groove portion.
The effect of utility model
The advantages of stacked power semiconductor two sides cooling device of the present utility model with direct cooling channel is,
Configure stacked cooling channel portion between power semiconductor along the stacked direction of power semiconductor, it is described stacked cold
But passage portion has the opening portion opened towards the top of power semiconductor or bottom, and can be handed over for refrigerant, cooling water, heat
The fluids such as medium are changed internally to flow so that the overall dimensions relative decrease of cooling device, and cause the cold and hot of fluid or
The warm of power semiconductor can be able to mutual heat exchange by direct cooling mode, and then being capable of relative maximum heat exchange effect
Rate.
In addition, the advantages of stacked power semiconductor two sides cooling device of the present utility model with direct cooling channel
It is, multiple cooling channel portions are respectively identical shape, can be stacked on one another and be combined with each other, and make the cooling channel of any side
Portion repeats the top for being close to power semiconductor along stacked direction, the cooling channel portion of opposite side is close to power semiconductor
Bottom so that be arranged at the pipe component shape relative to each other in cooling channel portion connector portions and interface portion with inserting and
The form being mutually communicated is combined, and then can manufacture or extend the inflow path and outflow path of fluid.
In addition, the advantages of stacked power semiconductor two sides cooling device of the present utility model with direct cooling channel
It is, on the basis of the opening portion in cooling channel portion, it is logical that cooling is attached to by sticker or adhesive film power semiconductor
Road portion, the o-ring (O-ring) of four side ring shapes is set between power semiconductor and cooling channel portion, so as to pass through o-ring energy
Enough so that fluid keeps airtight in the form of the not outside leak to cooling channel portion.
In addition, the advantages of stacked power semiconductor two sides cooling device of the present utility model with direct cooling channel
It is, the joint or interface in cooling channel portion play a part of being formed or extend inflow path and outflow path, and connector portions
Play a part of according to the interval holding being spaced between the protrusion height of connector portions holding cooling channel, so as to logical even in cooling
Power semiconductor is configured between the portion of road, power semiconductor also will not be extruded or oppress as prior art, so as to prevent
The possibility of quality problem occurs for power semiconductor.
In addition, the advantages of stacked power semiconductor two sides cooling device of the present utility model with direct cooling channel
It is, when performing the relatively outstanding heat exchange of direct cooling mode, because with the thickness direction along power semiconductor
The structure of stacking, thus can relative decrease have multiple power semiconductors package module overall dimensions.
In addition, the advantages of stacked power semiconductor two sides cooling device of the present utility model with direct cooling channel
It is, cooling channel portion is the structure of stacking and interconnection, therefore can also be by decreasing or increasing the number of power semiconductor
To reduce existing cooling channel portion or extra increase cooling channel portion, so that the autgmentability and versatility of cooling device are enough
It is outstanding.
In addition, the advantages of stacked power semiconductor two sides cooling device of the present utility model with direct cooling channel
It is, the interface portion of the cooling channel of least significant end is to be directly socketed nipple of power semiconductor carrying housing (nipple) etc.
The mode of connecting section is connected, and is thus easily set.
Brief description of the drawings
Fig. 1 is that the stacked power for being used to illustrate to have direct cooling channel of one embodiment of the present utility model is partly led
The cooling channel portion of body two sides cooling device and be combined with power semiconductor a unit stereogram.
Fig. 2 is the exploded perspective view of the unit shown in Fig. 1.
Fig. 3 is the stereogram for illustrating the laminating method of multiple units shown in Fig. 1.
Fig. 4 is stereogram of the multiple units shown in Fig. 3 by the formed assembling components body of stacking combination.
Fig. 5 is the sectional view along Fig. 4 line A-A interceptions.
Fig. 6 is the stereogram for illustrating the state that lid is combined with Fig. 4 assembling components body.
Fig. 7 is the stereogram of the assembling components body and lid separation shown in Fig. 6.
Fig. 8 is to illustrate the assembling components body shown in Fig. 6 and lid being arranged at power semiconductor carrying housing
State and the side view for showing the section of shell.
The explanation of reference
100、100a、100b：Unit；200：Cooling channel portion；210：Lower case；220：Upper body；300、301：
Power semiconductor；400：First o-ring；500：Second o-ring；501：3rd o-ring；600：Lid；M：Assembling components body.
Embodiment
The advantages of the utility model, feature and realize their method by referring to accompanying drawing and detailed embodiment described later
It will be apparent.But the utility model is not limited to embodiments disclosed below, but can be by mutually different more
Kind form realizes that the present embodiment into the utility model art merely to have the personnel of usual knowledge intactly
Inform the scope of utility model and provide, intactly to disclose the utility model, the right that the utility model passes through record
It is required that to define.
In addition, term as used in this specification is for illustrating embodiment, and and non-limiting the utility model.
In this specification, as long as not referring to particularly in the text, then odd number type also includes complex number type.It is used in the description
" including (comprises) " and/or " including (comprising) " represents mentioned composed component, step, operation and/or member
In part, however not excluded that other more than one composed components, step, operation and/or the presence of element or addition.Hereinafter, with reference to attached
Embodiment of the present utility model is described in detail figure.
In addition, there can be circular, fillet quadrangle in the o-ring (O-ring) mentioned in explanation of the present utility model
Deng various shapes, its section is also able to selection use to meet the performance required by hermetic seal or water-stop, therefore can be with unlimited
Determine the o-ring of specific standard.In addition, o-ring can have hermetic seal or the sealing of water sealing property (sealing) part,
It can also be any one in star sealing ring (quad-ring), sealing gasket (gasket), other hermetic seals or water can be referred to
Sealing tool.In addition, o-ring can be formed by any one material in following material：Natural or synthetic rubber, fluorubber
(fluoro elastomers), epichlorohydrin rubber (epichlorohydrin polymer), EPM (ethylene
Propylene monomer, EPM), it is ethylene propylene diene rubber (ethylene propylene diene monomer, EPDM), different
Butene styrene rubber (isobutylene sioprene rubber, IIR), hydrogenated nitrile-butadiene rubber (hydrogenated
Nitrile butadiene rubber, HNBR).
Fig. 1 is that the stacked power for being used to illustrate to have direct cooling channel of one embodiment of the present utility model is partly led
The cooling channel portion of body two sides cooling device and be combined with power semiconductor a unit stereogram, Fig. 2 is shown in Fig. 1
The exploded perspective view of unit, Fig. 3 are the stereograms for illustrating the laminating method of multiple units shown in Fig. 1, and Fig. 4 is Fig. 3 institutes
The multiple units shown combine the stereogram of formed assembling components body by being laminated.
Reference picture 1 or Fig. 3, the stacked power semiconductor two sides cooling device with direct cooling channel of the present embodiment
Including more than one unit 100,100a, 100b, it is one more than unit 100,100a, 100b by stacking and mutual
Connection, in order that refrigerant, cooling water, any one such fluid and power semiconductor 300 in heat exchange medium,
301 surface directly contacts, and forms the direct cooling channel C2 for causing the flow of fluid respectively.
Thickness direction (the example of unit 100,100a, 100b along unit 100,100a, 100b：Z-direction or stacking side
To) stacking, unit 100,100a, 100b inner space in cooling channel portion 200 can be caused to be interconnected with one another, to flow
Body can flow.
Reference picture 1 or Fig. 2, cooling channel portion 200 be by selected from the material group of cold-hot or warm plastic material,
Any one in engineering plastics (engineering plastics) material and synthetic resin material, can play for it is direct
Fluid containment corresponding to cooling channel C2 internally, provide flowing space, the effect as heat-barrier material.
In addition, inflow path C1 is formed at the side of unit 100, realize that fluid flows into direct cooling channel C2 sides, flow
Outbound path C3 is formed at the opposite side of unit 100, realizes outflow of the fluid from direct cooling channel C2.
Stacked direction identicals of the inflow path C1 or outflow path C3 in the thickness direction or unit 100 with unit 100
Direction extends.
Inflow path C1 and outflow path C3 can be the connector portions (plug) 215 and interface portion by multiple interconnections
(socket) 225 connecting tube formed.
In addition, unit 100 includes：The cooling channel portion 200 of hollow board member form, realize inflow, the row of fluid
Go out and flow；Multiple (examples：2) power semiconductor 300,301, with reference to or be equipped on the cooling channel portion 200, and along cold
But the length direction configured separate of passage portion 200, to cover the opening portion 211,212 in cooling channel portion 200 respectively.
Reference picture 2, any one position in the upper end or lower end of each power semiconductor 300,301 are protruding with exchange
Three-phase terminal 310, another position in the upper end or lower end of power semiconductor 300,301 are protruding with multiple circuit terminals
311, the multiple circuit terminal 311 is used for the circuit arrangement (not shown) for connecting power semiconductor carrying housing.
Each power semiconductor 300,301 includes being connected to partly leading between AC three-phase terminal 310 and circuit terminal 311
Phosphor bodies.Here, semiconductor body includes：Mould (mold) portion 312, it is formed at the edge of semiconductor body, the mould
Tool portion 312 is synthetic resin material or plastic material；Heat transmitting member 313, with the semiconductor body that is surrounded by mold 312
Surface (the example of semiconductor body is formed on the basis of heart position：Upper surface and bottom surface), the heat transmitting member 313 is metal material
Matter.
Heat transmitting member 313 is directly to be contacted with fluid and directly form the position of heat exchange.
For mold 312, also include sticker or adhesive film (not shown) on the surface of mold 312, so as to
It can be fixed by way of adhesion with towards the surface on the opening portion 211 of corresponding power semiconductor 300,301,212 peripheries.
Each power semiconductor 300,301 is readily able to by such adhesion system and is fixed on cooling channel portion 200.
The size of opening portion 211,212,221,222 or the area of opening in cooling channel portion 200 can be set to
The size of the heat transmitting member 313 of the metal material of power semiconductor 300,301 is corresponding.
Reference picture 3, unit 100,100a, 100b are all fabricated to identical form, along power semiconductor 300,
301 stacked direction (example：The thickness direction of Z-direction or unit) it is configured to multiple or is layered on top of each other, as shown in figure 4, passing through
Stacking is combined to form as assembling components body M.Assembling components body M can be referred to as refrigerating module or cooling device etc..Assembling components
Body M can have unit stepped construction.
For example, unit 100,100a, 100b can form the assembling components body M of stepped construction, the group of the stepped construction
Thickness direction stackings of the part assembly M along the unit 100,100a, 100b, in order to by matching somebody with somebody toward each other in stacking
The connector portions 215 for the tubular form put and the interconnection of interface portion 225 and make it that the fluid is supplied or is recovered in described
Unit 100,100a, 100b each cooling channel portion 200 in.
The external diameter of interface portion 225 determines on the basis of the numerical value of assembling tolerance can be subtracted by the internal diameter from connector portions 215.
For example, the major part of interface portion 225 being capable of the fully-inserted internal diameter in connector portions 215.Now, the end of connector portions 215 is in phase
In the corresponding cooling channel portion 200 being laminated to position, surface (example corresponding with the periphery of interface portion 225：Housing (casing)
Bottom surface 213) contact or non-contact.
Referring again to Fig. 2, cooling channel portion 200 includes lower case 210 and upper body 220.
Lower case 210 and upper body 220 combine (example in a manner of relative to each other：By engagement or joint technology come
With reference to), so as to be internally formed fluid containing space in cooling channel portion 200.
The lower case 210 in cooling channel portion 200 includes housing bottom surface 213, and the housing bottom surface 213 is with X-Y plane
On the basis of any one following flat board shape：Writing board shape, elliptical shape, have fillet board member shape, respectively
Possess have between a side of semicircular edge shape and another side it is plane.
If the shape of housing bottom surface 213 is discussed further below situation：In the side for possessing the semicircular edge shape respectively
The shape for the plane having between end and another side, then it smooth can realize the hydrodynamics diffusion of fluid and transmit, therefore with
Simple quadrangular plate component shape is compared, and heat transfer performance and fluid flow performance are also able to relative lifted.
Lower case 210 includes the lower part wall 214 protruded from the edge of housing bottom surface 213 to Z-direction.
Lower case 210 includes more than one opening portion 211,212, it is one more than opening portion 211,212 with
Opened on the basis of the centre position of housing bottom surface 213 to Z-direction, and along X-direction configured separate.
Lower case 210 includes the connector portions 215 of tubular form, and the connector portions 215 are with each opening portion 211,212
On the basis of outer fix, in the side of housing bottom surface 213 and opposite side, the opposite direction along the lower part wall 214 is respectively with one
Body formula is protruded to be formed, and the connector portions 215 are used to form inflow path C1 or outflow path C3.
Groove portion 216 is installed formed with the first ring in the outer peripheral face of connector portions 215, first ring install groove portion 216 along
Circumferencial direction extends.
It is socketed with the first ring installation groove portion 216 of each connector portions 215 O-shaped for circular first of water-stop
Ring 400.
Lower case 210 includes the second ring installation groove portion 217, and second ring installs groove portion 217 with each opening portion
211st, on the basis of 212 edge, it is formed at the outer fix of housing bottom surface 213.
The second o-ring 500 of the four side ring shapes for water-stop is socketed with each second ring installation groove portion 217.
The upper body 220 in cooling channel portion 200 includes housing top surface 223, the housing top surface 223 have with it is described under
The identical area of portion's housing 210 and shape.
Upper body 220 includes top wall 224, and the top wall 224 is from the edge of housing top surface 223 to the lower case
The direction protrusion of the lower part wall 214 of body 210.
Upper body 220 includes more than one opening portion 221,222, it is one more than opening portion 221,222 with
On the basis of the centre position of housing top surface 223, towards 211, the 212 consistent Z axis of opening portion with the lower case 210 respectively
Direction opens, and along X-direction configured separate.
Upper body 220 includes the interface portion 225 of tubular form, and the interface portion 225 of the tubular form is with each opening
On the basis of the outer fix in portion 221,222, from the side of housing top surface 223 and opposite side along the opposite of the top wall 224
Direction protrudes to be formed with integral type respectively, and big with that can be inserted respectively for the connector portions 215 of the lower case 210
Small internal diameter, the interface portion 225 of the tubular form are also used for forming inflow path C1 or outflow path C3.
The inner peripheral surface or outer peripheral face of interface portion 225 are simple peripheries, so as to being arranged at the of the connector portions 215
One o-ring 400 is in contact and plays and keep water-stop (example：Air-tightness) effect.
The protrusion height of interface portion 225 is set to corresponding with the thickness of power semiconductor 300,301.Under such circumstances,
As shown in Figure 3 or Figure 4, interface portion 225 covers power semiconductor when being laminated more than one unit 100,100a, 100b
300th, 301 unit 100,100a can cause power semiconductor with the effect of execution interval holding area, the interval holding area
300th, 301 by excessive compression or compressing.
Upper body 220 includes the 3rd ring installation groove portion 227, and the 3rd ring installs groove portion 227 with each opening portion
221st, the outer fix of housing top surface 223 is formed on the basis of 222 edge.
The 3rd o-ring 501 of the four side ring shapes for water-stop is socketed with each 3rd ring installation groove portion 227.
Lower case 210 and upper body 220 are so that the joint portion that relative lower part wall 214 and top wall 224 is in contact
Position is engaged with each other or zoarium, so as to form the cooling channel portion 200 shown in Fig. 1.
It is provided with the opening portion 211,212 in such cooling channel portion 200 with accompanying the state of the second o-ring 500
Power semiconductor 300,301, as a result form a unit 100.
When multiple units 100,100a, 100b shown in Fig. 3 are laminated, on the basis of direction relative to each other so that each
Downside connector portions 215 insert upside interface portion 225 respectively, so as to form state shown in Fig. 4.Now, first be illustrated in Figure 2
O-ring 400, the second o-ring 500, the 3rd o-ring 501 and the object (example each contacted：The inner peripheral surface or power of interface portion 225
The surface of semiconductor 300,301) water-stop is kept, and form the assembling components body M shown in Fig. 4.
Fig. 5 is the sectional view along Fig. 4 line A-A interceptions.
Assembling components body M is combined and zoarium by multiple units 100,100a, 100b stacking, as previously described, is passed through
Fluid flow into C/In or fluid outflow C/Out so that be configured at unit 100, the power semiconductor 300 between 100a, 100b,
The cold and hot carry out heat exchange of 301 warm and multiple directly cooling channel C2 fluids.
For example, fluid by unit 100,100a, 100b least significant end side connector portions 215a and inflow path C1 to each
The inside in individual cooling channel portion 200 flows into, afterwards respectively after the direct cooling channel C2 in each cooling channel portion 200,
Flowed out by unit 100,100a, 100b outflow path C3 and least significant end opposite side connector portions 215b.Pass through unshowned stream
The pressure of body pump realizes the inflow of fluid, flowing and outflow, and now fluid (is not shown by assembling components body M and cooling device
Go out) between recycle circuit (not shown) circulate.
Especially, direct cooling channel C2 fluid is on the basis of each cooling channel portion 200, with being laminated in top and bottom
Corresponding power semiconductor 300,301 directly contact, therefore on the basis of corresponding power semiconductor 300,301, while cold
But two sides (the example of power semiconductor 300,301：Upper surface and bottom surface), so can have compared to the existing type of cooling indirectly
The cooling effectiveness of color.
For the gas sealing ability or water-stop of fluid, assembling components body M also includes lid 600.
Unshowned sticker or adhesive film are also provided with the position that lid 600 and assembling components body M are in contact with each other.
The effect of lid 600 is, to multiple least significant end interface portions 225a, 225b in cooling channel portion 200 and opening portion
221st, through hole H1, H2, H3, H4 of 222 sides are covered or closed.
Fig. 6 is that Fig. 7 is the group shown in Fig. 6 for illustrating that Fig. 4 assembling components body is combined with the stereogram of the state of lid
Part assembly and the stereogram of lid separation.
Lid 600 includes lid plate 610, and the area of the lid plate 610 is relative compared with the area in cooling channel portion 200
It is wider.
Lid 600 includes the first shielding part 620,621, and first shielding part 620,621 is respectively formed in lid plate 610
Bottom surface both-side ends portion, so as to be hidden to the internal diameter of interface portion 225a, 225b of least significant end in cooling channel portion 200
Lid.
Can be that the first shielding part 620,621 is inserted into the convex of the joint type of the internal diameter of interface portion 225a, 225b
Go out structure, or the slot structure of the interface type for interface portion 225a, 225b installation.In Fig. 7 or Fig. 8, although first
Shielding part 620,621 is illustratively fabricated to the form of the projective structure of joint type, but also can design alteration be the groove
Structural form.
In addition, lid 600 includes the second shielding part 630, second shielding part 630 is respectively formed in the bottom of lid plate 610
The central portion in face, so as to cover least significant end opening portion 221,222 in cooling channel portion 200.
Here, installing groove portion 637 formed with Fourth Ring in the second shielding part 630, the Fourth Ring installation groove portion 637 can
Install figure 2 illustrates and be used for the 3rd o-ring 501 that water-stop is carried out to the least significant end opening portion 221,222.Certainly,
First shielding part 620,621 is also provided with the 4th o-ring 640, the 4th o-ring 640 and the first o-ring 400 shown in Fig. 2
Specification it is identical.
Thus, when assembling components body M is combined with lid 600, the 3rd o-ring in least significant end cooling channel portion 200 is passed through
501 and the 4th o-ring 640, the water-stop between lid 600 and least significant end cooling channel portion 200 can be kept.
Fig. 8 is to illustrate the assembling components body shown in Fig. 6 and lid being arranged at power semiconductor carrying housing
State and the side view for showing the section of shell.
Reference picture 7 or Fig. 8, the sub-assembly being made up of assembly M and lid 600 can be arranged at power semiconductor and carry use
Housing 700, the assembly M are made up of multiple units 100,100a, 100b.In power semiconductor carrying energy in housing 700
Enough supplies and recovery for realizing the fluid as refrigerant.
Formed with multiple fastener holes 650 for combining fastening bolt 800 on lid 600.Each fastener hole 650 is formed
For the thickness direction insertion from the corner angle position of lid 600 to lid 600.
The effect of fastening bolt 800 and fastener hole 650 is fixing assembly M and lid 600.
Carried with power semiconductor consistent with the bolt hole 750 of housing 700 in the insertion position of the fastener hole 650 of lid 600.
Just assembling components corresponding with the power semiconductor two sides cooling device or refrigerating module (module) of the present embodiment
For body M, setting can be readily accomplished in the following way：By the connector portions 215 in least significant end cooling channel portion 200 easily
The connecting section 720 of power semiconductor carrying housing 700 is inserted in, or the object flowed in or out of fluid is realized in insertion
(example：Nipple (nipple)).
The screw axle portion of fastening bolt 800 is incorporated into power semiconductor by the screw of fastener hole 650 of lid 600 and carries use
The bolt hole 750 of housing 700.
In this way, in assembling components body M, replace (alternatively) configuration along stacked direction and be laminated each work(
Rate semiconductor 300 and cooling channel portion 200, the connector portions with the assembling components body M corresponding least significant end of fluid intake or outlet
215 are arranged to be inserted directly into the connection member 720 in housing 700, and can prevent group by lid 600 and fastening bolt 800
Part assembly M separation.
This embodiment is characterized in that in order to planar alignment mode or the mode arranged along path direction
Difference is formed, power semiconductor configures to the unit that cooling channel portion is incorporated into cascade type.This is to solve
The problem of relatively more spaces being occupied in the path configuration of existing way, and as the quantity of power semiconductor increases and needs
The problem of more spaces.In other words, the present embodiment can prevent from causing due to the increase of the size of existing cooling device
During the power conversion unit that the space of restriction is installed occur hydraulic performance decline the problem of.
In addition, the present embodiment is than existing, using identical quantity power semiconductor when, tied because unit is laminated
Structure and reduce by about 50% volume, and reduce corresponding weight, and cost can be reduced.In other words, the advantages of the present embodiment
It is, even if increase power semiconductor quantity, it is also possible that the volume occupied is minimum, and enables to include flowing into road
Being monolithically fabricated for the cooling channel in footpath, direct cooling channel and outflow path is simple.
In addition, advantage of this embodiment is that, heat exchanger effectiveness is relatively very high compared with the indirect type of cooling, described indirect
The type of cooling passes through physics or thermodynamics barrier (example between fluid and cooling object：Tube wall) realize.It is for example, hot
Resistance is that under the benchmark of identical capacity, 50% can be improved compared to the indirect type of cooling by experimental verification result.
In addition, advantage of this embodiment is that, although fluid directly contacts with power semiconductor and causes heat exchange in itself
Performance maximizes, but supplies the cooling channel portion of flow of fluid to be formed in itself by plastic material or synthetic resin material, so as to hold
The effect of row heat-barrier material, so that the cold and hot of fluid is not lost because of the heat of extraneous air, thus, it is possible to cause heat exchange
Performance maximizes, and cooling channel as relatively light compared with metal material and easily fabricated various three-dimensional shape
Portion.
Explanation above is exemplary illustration technical concept of the present utility model, in the technology neck belonging to the utility model
In domain, the personnel with usual knowledge can carry out a variety of modifications and change in the range of intrinsic propesties of the present utility model is not departed from
Shape.Thus, the embodiment that the utility model is showed is not intended to limit technical concept of the present utility model, but for illustrating
, and interest field of the present utility model is not limited by such embodiment.The scope of protection of the utility model should pass through
Following right explains, should be new by this practicality with whole technical concepts in its equal or impartial scope
The content that the interest field of type is included explains.
Claims (10)
1. a kind of stacked power semiconductor two sides cooling device with direct cooling channel, described to have direct cooling channel
Stacked power semiconductor two sides cooling device include more than one unit, it is one more than unit by stacking and
It is connected with each other, in order that it is direct to obtain the surface of any one fluid and power semiconductor in refrigerant, cooling water, heat exchange medium
Contact, formed respectively for the direct cooling channel for the flow of fluid, it is characterised in that
The unit includes：
Cooling channel portion, the cooling channel portion are the inflow, discharge, the hollow board member form of flowing for realizing the fluid,
And between being laminated to be configured at the power semiconductor along the thickness direction of the unit, and inner space connects each other
Connect, and there is inner containment to have the fluid corresponding with the directly cooling channel or make the stream in the cooling channel portion
The space of body flowing；And
The power semiconductor, the power semiconductor are incorporated into the cooling channel portion, so as to right respectively in a gas tight manner
Multiple opening portions in the cooling channel portion are covered.
2. the stacked power semiconductor two sides cooling device according to claim 1 with direct cooling channel, it is special
Sign is,
Thickness direction of the unit along the unit is laminated and forms assembling components body.
3. the stacked power semiconductor two sides cooling device according to claim 2 with direct cooling channel, it is special
Sign is,
The assembling components body is combined by the stacking of the unit so that any one configured toward each other or opposite each other
The interface portion of the connector portions of the tubular form in cooling channel portion and the tubular form in another cooling channel portion is connected with each other, so as to
So that the fluid is supplied or is recovered in each cooling channel portion.
4. the stacked power semiconductor two sides cooling device according to claim 3 with direct cooling channel, it is special
Sign is,
The assembling components body includes：
Inflow path, on the basis of the connector portions and a side position of interface portion interconnection, it is formed at the unit
Side, so as to realize fluid to it is described directly cooling channel side inflow；And
Outflow path, on the basis of the connector portions and another side position of interface portion interconnection, it is formed at the list
The opposite side of member, to realize outflow of the fluid from the directly cooling channel,
The inflow path or the outflow path are identical with the stacked direction of the thickness direction of the unit or the unit
Direction extension.
5. the stacked power semiconductor two sides cooling device according to claim 3 with direct cooling channel, it is special
Sign is,
The assembling components body also includes lid, multiple least significant end interface portions and opening of the lid to the cooling channel portion
The through hole of portion side is covered or closed.
6. the stacked power semiconductor two sides cooling device according to claim 5 with direct cooling channel, it is special
Sign is,
The lid includes：
Lid plate, the area of the lid plate are relatively wider than the area in the cooling channel portion；
First shielding part, be respectively formed in the both-side ends portion of the lid plate bottom surface, so as to in the cooling channel portion most
The internal diameter in end interface portion is covered；
Second shielding part, the central portion of the bottom surface of the lid plate is respectively formed in, so as to most end in the cooling channel portion
End opening portion is covered；
Groove portion is installed at Fourth Ring, is formed at second shielding part, and is provided with for being carried out to the least significant end opening portion
3rd o-ring of water-stop；And
Fastener hole, be formed as the thickness direction insertion from the corner angle position of the lid to lid.
7. the stacked power semiconductor two sides cooling device according to claim 1 with direct cooling channel, it is special
Sign is,
The power semiconductor includes：
AC three-phase terminal, the position protrusion of any one from the upper end of the power semiconductor or lower end；
Circuit terminal, from another position protrusion in the upper end of the power semiconductor or lower end；
Semiconductor body, it is connected between the AC three-phase terminal and circuit terminal；
Mold, is formed at the edge of the semiconductor body, and the mold is synthetic resin material or plastic material；
And
Heat transmitting member, on the basis of the center of the semiconductor body surrounded by the mold, it is formed at described half
The surface of conductor main body, and be metal material,
The area for being formed at the size of the opening portion in the cooling channel portion or being opened is set to and the heat transmitting member
Size is corresponding.
8. the stacked power semiconductor two sides cooling device according to claim 1 with direct cooling channel, it is special
Sign is,
The cooling channel portion includes lower case and upper body, and the lower case and upper body are with side relative to each other
Formula is engaged or combined, so as to be internally formed fluid containing space in the cooling channel portion.
9. the stacked power semiconductor two sides cooling device according to claim 8 with direct cooling channel, it is special
Sign is,
The lower case in the cooling channel portion includes：
Flat housing bottom surface；
Lower part wall, protruded from the edge of the housing bottom surface；
More than one opening portion, opened on the basis of the centre position of the housing bottom surface；
Connector portions, on the basis of the outer fix of the opening portion, from the side of the housing bottom surface and opposite side along described
The opposite direction of lower part wall is protruded to be formed with integral type respectively, and for forming the inflow path or outflow path of fluid, institute
It is tubular form to state connector portions；
First ring installs groove portion, is formed as circumferentially extending from the outer peripheral face of the connector portions；
First o-ring, the first ring installation groove portion is socketed on, and is circular annular form；
Second ring installs groove portion, on the basis of the edge of the opening portion, is formed at the outer fix of the housing bottom surface；And
Second o-ring, the second ring installation groove portion is socketed on, and is four side ring shapes.
10. the stacked power semiconductor two sides cooling device according to claim 9 with direct cooling channel, it is special
Sign is,
The upper body of the cooling channel includes：
Housing top surface, have and the lower case identical area and shape；
Top wall, protruded from the edge of the housing top surface to the direction of the lower part wall of the lower case；
More than one opening portion, on the basis of the centre position of the housing top surface, to be opened respectively with the lower case
The consistent mode of oral area opens；
Interface portion, on the basis of the outer fix of the opening portion of the upper body, from the side of the housing top surface and another
Opposite direction of the side along the top wall is protruded to be formed respectively with integral type, also, the interface portion have can be for described
The internal diameter for the size that the connector portions of lower case are inserted respectively, and for forming the inflow path or the outflow road
Footpath, the interface portion are tubular form；
3rd ring installs groove portion, on the basis of the edge of the opening portion of the upper body, is formed at the outer of the housing top surface
Side position；And
3rd o-ring, it is socketed on the 3rd ring installation groove portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160112647A KR102612584B1 (en) | 2016-09-01 | 2016-09-01 | apparatus with direct cooling pathway for cooling both sides of stack type power semiconductor |
| KR10-2016-0112647 | 2016-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206877979U true CN206877979U (en) | 2018-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720711807.5U Active CN206877979U (en) | 2016-09-01 | 2017-06-19 | Stacked power semiconductor two sides cooling device with direct cooling channel |
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| Country | Link |
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| KR (1) | KR102612584B1 (en) |
| CN (1) | CN206877979U (en) |
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| KR102651940B1 (en) | 2018-11-22 | 2024-03-27 | 현대자동차주식회사 | Water cooling appartus ans water cooling type power module assembly comprising the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4089595B2 (en) * | 2002-12-16 | 2008-05-28 | 株式会社デンソー | Refrigerant cooling type double-sided cooling semiconductor device |
| JP4552805B2 (en) * | 2005-08-19 | 2010-09-29 | 株式会社デンソー | Laminated heat exchanger and manufacturing method thereof |
| WO2008152876A1 (en) * | 2007-06-13 | 2008-12-18 | Kabushiki Kaisha Yaskawa Denki | Canned linear motor armature and canned linear motor |
| JP6135623B2 (en) * | 2014-09-02 | 2017-05-31 | トヨタ自動車株式会社 | Semiconductor device and manufacturing method thereof |
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| KR20180025670A (en) | 2018-03-09 |
| KR102612584B1 (en) | 2023-12-12 |
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