KR20180023722A - Method of manufacturing organic light emitting display device - Google Patents

Abstract

The present invention provides a method of manufacturing an organic light emitting display device. The method comprises the steps of: forming a first sacrificial layer on a lower mother substrate in which a plurality of cells including a display region, a non-display region surrounding the display region, and a pad region extending from one side of the non-display region are defined; forming a flexible substrate on the first sacrificial layer; forming a display unit including a circuit unit and an organic light emitting element in each of the plurality of cells on the flexible substrate; disposing a temporary protection film on the display unit; irradiating a laser to the lower mother substrate; removing the lower mother substrate; attaching a support film to the flexible substrate; irradiating the laser to a boundary between the non-display region and the pad region; irradiating the laser to a boundary of the plurality of cells; and removing the temporary protection film.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing an organic light-

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a method of manufacturing an organic light emitting display device, and more particularly, to a method of manufacturing an organic light emitting display device using a flexible substrate.

In recent years, as the information age has come to a full-fledged information age, a display field that visually expresses electrical information signals has been rapidly developed. In response to this demand, various flat display devices having excellent performance such as thinning, light- Devices have been developed and are rapidly replacing existing cathode ray tubes (CRTs).

Specific examples of such flat panel display devices include a liquid crystal display (LCD), an organic light emitting display (OLED), an electrophoretic display (EPD), a plasma display (PDP) have. Particularly, an organic light emitting display device is a next generation display device having self-emission characteristics, and has excellent characteristics in terms of a viewing angle, a contrast, a response speed, and a power consumption as compared with a liquid crystal display device.

In recent years, flexible display devices in which display portions, wirings, and the like are formed on a flexible substrate such as plastic, which is a flexible material, have attracted attention as a next generation display device. 2. Description of the Related Art Flexible display devices have been applied to not only monitors and televisions of computers but also personal portable devices. Researches have been made to apply flexible display devices to organic light emitting display devices.

A method of fabricating an organic light emitting display according to the present invention includes the steps of simultaneously manufacturing a plurality of organic light emitting display devices by using a manufacturing method of a cell unit of an organic light emitting display device, There is a method of manufacturing an organic light emitting display device for each of a plurality of LEDs. Among the two methods of manufacturing the organic light emitting display device, the method of manufacturing the organic light emitting display device per cell is that only one organic light emitting display device is manufactured in a single process. Therefore, in view of process time and cost, There is a drawback in comparison with the method of manufacturing the light emitting display device.

The inventors of the present invention have studied a manufacturing method of an organic light emitting diode display unit for a single substrate in the method of manufacturing the organic light emitting display device described above. In particular, a method of manufacturing an organic light emitting display using a flexible substrate has been studied. The inventors of the present invention used a flexible substrate and a flexible substrate to support components formed on the flexible substrate in the course of manufacturing an organic light emitting display using the flexible substrate. However, the inventors of the present invention have found that various problems arise in the process of separating the temporary substrate, which is temporarily used in the process of manufacturing the organic light emitting display, from the flexible substrate as described above.

Accordingly, it is an object of the present invention to provide a novel method of manufacturing an organic light emitting display device for solving the problems occurring in the process of manufacturing an organic light emitting display device on a per-substrate basis.

In particular, the present invention provides a method of manufacturing an organic light emitting display device capable of solving the problem of non-separation which may occur in the process of removing the main substrate from the flexible substrate, thereby improving the productivity and reducing the defective rate .

Further, a problem to be solved by the present invention is to use a temporary protective film which is removed after completion of the process, instead of the barrier film for moisture permeation prevention used in the conventional manufacturing process of an organic light emitting display device, thereby reducing the process cost and reducing the thickness And a method for manufacturing the organic light emitting display device.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method of fabricating an OLED display device. A method of manufacturing an organic light emitting display device includes forming a first sacrificial layer on a lower lasing substrate on which a plurality of cells including a display region, a non-display region surrounding the display region, and a pad region extending from one side of the non- Forming a flexible substrate on the first sacrificial layer, forming a display portion including a circuit portion and an organic light emitting element in each of a plurality of cells on a flexible substrate, disposing a temporary protective film on the display portion, A step of irradiating the substrate with a laser, a step of removing the lower raw substrate, a step of attaching a supporting film to the flexible substrate, a step of irradiating a laser to the boundary between the non-display area and the pad area, , And removing the temporary protective film.

According to another aspect of the present invention, there is provided a method of manufacturing an OLED display device. A method of manufacturing an organic light emitting display device includes forming a first sacrificial layer on a lower lasing substrate on which a plurality of cells including a display region, a non-display region surrounding the display region, and a pad region extending from one side of the non- Forming a flexible substrate on the first sacrificial layer, forming a display portion including a circuit portion and an organic light emitting element in each of a plurality of cells on the flexible substrate, placing the upper raw substrate on which the touch sensing portion is disposed on the display portion A step of irradiating a laser to the lower main substrate, a step of removing the lower main substrate, a step of attaching a supporting film to the flexible substrate, a step of irradiating the upper main substrate with a laser, a step of removing the upper main substrate, Disposing a temporary protective film on the sensing unit, irradiating a laser to the boundary between the non-display area and the pad area, It may include the step of removing the protective film and the temporary step of irradiating a laser at the boundary of the cell.

The details of other embodiments are included in the detailed description and drawings.

It is possible to prevent the flexible substrate from being damaged in the process of separating the flexible substrate from the flexible substrate by performing an additional cutting process on the area of the flexible substrate where the sacrificial layer or the flexible substrate may not be formed, .

In addition, the present invention can use a temporary protective film for temporarily protecting the components during the manufacturing process without using a barrier film for preventing water penetrating into the organic light emitting device, An organic light emitting display device can be manufactured.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a schematic flowchart for explaining a method of manufacturing an organic light emitting display according to an embodiment of the present invention.
2A to 2O are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.
3 is a schematic cross-sectional view illustrating a temporary protective film used in a method of manufacturing an organic light emitting display according to an embodiment of the present invention.
4 is a cross-sectional view illustrating a method of manufacturing an organic light emitting display according to a comparative example.
5 is a schematic flowchart illustrating a method of manufacturing an organic light emitting display according to another embodiment of the present invention.
6A to 6L are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

1 is a schematic flowchart for explaining a method of manufacturing an organic light emitting display according to an embodiment of the present invention. 2A to 2O are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention. FIG. 1 and FIG. 2A to FIG. 2O illustrate a method of manufacturing an organic light emitting display device having an on-cell touch sensing unit. The organic light emitting display device to which the on-cell structure touch sensing section is applied refers to an organic light emitting display device that is separately disposed on the display portion or the encapsulation portion on the display portion using an adhesive.

First, a plurality of cells CE including a display area DA, a non-display area NA surrounding the display area DA, and a pad area PA extending from one side of the non-display area NA are defined The first sacrificial layer 111 is formed on the lower sub-substrate 110 (S100).

The lower substrate 110 is a substrate for supporting components disposed on the flexible substrate 120 and the flexible substrate 120 in the process of manufacturing an organic light emitting display. The lower substrate 110 may be made of a rigid material, for example, but is not limited to, glass.

Referring to FIG. 2A, a lower substrate 110 is a substrate used for simultaneously manufacturing a plurality of OLEDs, and a plurality of cells CE are defined in a lower substrate 110. Each of the plurality of cells CE defined in the lower substrate 110 corresponds to one OLED display. In FIG. 2A, nine cells CE are defined on the lower substrate 110 for the sake of convenience, but the present invention is not limited thereto.

Each of the plurality of cells CE includes a display area DA, a non-display area NA, and a pad area PA. The display area DA is an area where an organic light emitting element is disposed and an image is displayed, and is located at the center in the cell CE. A circuit section including a thin film transistor, a capacitor, and the like may be disposed in the display region DA. The non-display area NA is an area where no image is displayed, and is an area surrounding the display area DA. A circuit section including a thin film transistor, a capacitor, and the like may also be disposed in the non-display area NA. The pad area PA is a region in which modules such as a flexible printed circuit board (FPCB), a chip on film (COF), and the like disposed in the organic light emitting display are disposed, and a pad electrode for electrically connecting to the module is disposed . The pad area PA is an area extending from one side of the non-display area NA. 2A, the pad region PA is shown as being a region separate from the non-display region NA, but the pad region PA is a region included in the non-display region NA and one side of the non-display region NA As shown in FIG.

A dummy area MA defined along the edge of the lower substrate 110 is defined in the lower substrate 110. The dummy area MA is an area removed by a laser process to be described later, and is an area surrounding a plurality of cells CE. The dummy area MA will be described in detail with reference to Figs. 2E to 2G.

2A, the boundaries of a plurality of cells CE are shown by dash-dotted lines, and the boundaries of the display area DA, the non-display area NA, and the pad area PA in the plurality of cells CE are indicated by dotted lines Respectively.

Referring to FIG. 2B, a first sacrificial layer 111 is formed on the lower substrate 110. The first sacrificial layer 111 may be made of a material capable of decomposing interfacial bonding force when irradiated with a laser so as to weaken the adhesive force with the flexible substrate 120, which will be described later. The first sacrificial layer 111 may have a structure in which, for example, a silicon nitride (SiNx) layer and a silicon oxide (SiOx) layer are stacked. The first sacrificial layer 111 may be formed by depositing silicon nitride and silicon oxide on the entire surface of the lower substrate 110.

Subsequently, a flexible substrate 120 is formed on the first sacrificial layer 111 (S105).

The flexible substrate 120 supports various components of the organic light emitting display. The flexible substrate 120 may be made of plastic material having flexibility, and may be made of, for example, polyimide or photo acryl. When the flexible substrate 120 is made of polyimide, the flexible substrate 120 may be formed in a squeeze manner.

Subsequently, a display unit 130 including circuit portions and organic light emitting elements is formed on each of the plurality of cells CE on the flexible substrate 120 (S110). In FIG. 2B, the display unit 130 including the circuit unit and the organic light emitting device is shown as one layer for convenience of explanation.

On the flexible substrate 120, thin film transistors and capacitors are formed in the display area DA of each cell CE. For example, a circuit section including various circuit elements for driving an organic light emitting element such as a driving thin film transistor, a switching thin film transistor, a storage capacitor, etc. may be formed in the display area DA.

The non-display area NA of each of the cells CE on the flexible substrate 120 is formed with a circuit portion for driving the organic light emitting element. For example, a gate driver such as a gate in panel (GIP) or the like may be formed in the non-display area NA.

On the flexible substrate 120, organic light emitting elements are formed in the display area DA of each of the cells CE. The organic light emitting device may be disposed on a circuit part such as a driving thin film transistor, a switching thin film transistor, a storage capacitor, or the like. The organic light emitting device may include an anode electrically connected to the driving thin film transistor, an organic layer on the anode, and a cathode on the organic layer. The organic layer may be composed of, for example, a hole transporting layer, a hole injecting layer, an organic light emitting layer, an electron injecting layer, and an electron transporting layer.

Although not shown in FIG. 2B, the sealing portion may be disposed on the display portion 130. FIG. The encapsulant is a component for protecting the organic light emitting device, which is vulnerable to moisture, from exposure to moisture. The sealing portion may be formed by alternately stacking an inorganic layer and an organic layer. For example, the sealing portion may include, but is not limited to, a first inorganic layer made of an inorganic material, an organic layer disposed on the first inorganic layer and an organic layer on the organic layer, and a second inorganic layer made of an inorganic material on the organic layer.

Then, the temporary protective film 140 is placed on the display unit 130 (S115).

The temporary protective film 140 includes a base film 142 and an adhesive layer 141 disposed on one side of the base film 142. See also FIG. 3 for a more detailed description of the temporary protective film 140. FIG.

3 is a schematic cross-sectional view illustrating a temporary protective film used in a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

Referring to FIG. 3, the temporary protective film 140 includes a base film 142 and an adhesive layer 141 disposed on one side of the base film 142. The base film 142 is a film made of a plastic material, and is a film for supporting the adhesive layer 141. The base film 142 may be made of, for example, polyethylene terephthalate (PET). The adhesive layer 141 may be made of a material having adhesiveness. As described later, the temporary protective film 140 should be removed during the manufacturing process of the organic light emitting display device but not peeled off when it is adsorbed by the adhering plate, so that the releasing force of the adhesive layer 141 selects the material of the adhesive layer 141 Lt; / RTI > The temporary protective film 140 is easily removed during the manufacturing process of the organic light emitting display device, and the releasing force of the adhesive layer 141 may be 10 gf / inch or less so as not to peel off when adsorbed by the adhering plate, gf / inch. It is preferable that the adhesive layer 141 is not exposed to the outside before the temporary protective film 140 is used in manufacturing the organic light emitting display device. The temporary protective film 140 can be transferred with the release film 343 attached to the adhesive layer 141 to protect the adhesive layer 141 of the temporary protective film 140. [ Thereafter, the temporary protective film 140 may be used by removing the release film 343 to expose the adhesive layer 141 of the temporary protective film 140. [

Referring again to FIG. 2B, a temporary protective film 140 is disposed on the display unit 130. The temporary protection film 140 is a protective film for protecting the display unit 130 in the process of manufacturing the organic light emitting display device, and is temporarily used after being used in the manufacturing process of the organic light emitting display device. The temporary protective film 140 is disposed so as to correspond to the front surface of the lower substrate 110. If the temporary protective film 140 is disposed only on a partial area other than the entire surface of the lower substrate 110, a problem may occur in the process of attaching the support film 160, which will be described later. For example, if each of the plurality of temporary protective films is arranged to correspond to each cell CE or each of the plurality of temporary protective films is arranged to correspond to each row in a stick type, A stepped structure may occur. Accordingly, the pressure for attaching the supporting film 160 is not uniformly applied due to the stepped structure at the time of attaching the supporting film 160. Therefore, bubbles or the like may be generated or adhered / defoaming defects may occur when the support film 160 is attached. In the method of manufacturing an organic light emitting display according to an embodiment of the present invention, a temporary protective film 140 may be disposed on the entire surface of the lower substrate 110, The problem can be solved.

The provisional protective film 140 is placed such that the base film 142 of the temporary protective film 140 and the adhesive layer 141 of the adhesive layer 141 are opposed to the display portion 130 . In addition, when the encapsulation portion is disposed on the display portion 130 as described above, the temporary protection film 140 may be disposed such that the adhesive layer 141 of the temporary protection film 140 is in contact with the encapsulation portion.

Subsequently, the back surface of the lower main substrate 110 is cleaned, which is the opposite surface of the lower sacrificial substrate 110 on which the first sacrificial layer 111 is disposed.

Referring to FIG. 2C, the backside of the lower substrate 110 can be cleaned using the brushes 810. In the manufacturing process of the OLED display device, stain foreign matter such as fingerprints, saliva, etc. may be disposed on the back surface of the lower substrate 110. In addition, threader and other floating foreign objects disposed on the rear surface of the lower substrate 110 may be disposed. Accordingly, in the method of fabricating an organic light emitting diode display according to an embodiment of the present invention, a process of cleaning the rear surface of the lower substrate 110 using a brush 810 may be employed to remove stained foreign matter and foreign matter And it is possible to suppress breakage caused by scratches or the like.

Subsequently, laser is irradiated to the lower substrate 110 (S120).

Referring to FIG. 2D, a laser beam is irradiated to the back surface of the lower substrate 110, that is, the surface opposite to the surface of the lower substrate 110 where the first sacrificial layer 111 is disposed. 2C, the first sacrificial layer 111, the flexible substrate 120, the display unit 130, and the temporary protective film 140 are turned upside down, The first laser source 820 is disposed so as to be spaced apart from the back surface of the main substrate 110 by a predetermined distance. The first laser source 820 may be a laser source for irradiating a UV laser. The adhesion between the first sacrificial layer 111 and the flexible substrate 120 can be weakened by irradiating a laser from the first laser source 820. [ Accordingly, as described later, the lower substrate 110 and the flexible substrate 120 can be separated from each other. However, if the first sacrificial layer 111 and / or the flexible substrate 120 are not formed normally during the manufacturing process of the organic light emitting display device, the separation between the lower substrate 110 and the flexible substrate 120 may occur have. Hereinafter, FIG. 4 will be referred to together to explain the above-described problems in more detail.

4 is a cross-sectional view illustrating a method of manufacturing an organic light emitting display according to a comparative example. 4 illustrates a problem that may occur during the process of separating the flexible substrate 420 and the lower substrate 110 because the first sacrificial layer 411 and the flexible substrate 420 are not formed on the entire surface of the lower substrate 110 Fig.

4, the first sacrificial layer 411 and the flexible substrate 420 may not be formed on the entire surface of the lower substrate 110, but may be formed only on a part of the lower substrate 110. Referring to FIG. The first sacrificial layer 411 is formed on the lower substrate 110 by a deposition process and the flexible substrate 420 is formed on the lower substrate 110 by a squeeze process. 411 and the flexible substrate 420 may not be formed in the area A adjacent to the edge of the lower main substrate 110 as shown in Fig. In addition, only one of the first sacrificial layer 411 and the flexible substrate 420 may not be formed in the region A adjacent to the edge of the lower substrate 110.

When at least one of the first sacrificial layer 411 and the flexible substrate 420 is not formed in the region A adjacent to the edge of the lower substrate 110 as described above, The lower substrate 110 and the flexible substrate 420 may not be separated from each other. 4, when both the first sacrificial layer 411 and the flexible substrate 420 are not formed in the area A adjacent to the edge of the lower main substrate 110, The display portion 430 and the lower substrate 110 may not be separated from each other in the region A even if a laser beam is irradiated from the lower portion of the substrate 110. Therefore, the sub-substrate 110 may not be separated in the process of separating the sub-substrate 110 and the flexible substrate 420 after the laser irradiation process. Thus, the defect rate in the production of the product increases and the productivity decreases.

Accordingly, in the method of manufacturing an organic light emitting display according to an embodiment of the present invention, after the laser is irradiated to the lower substrate 110, the inner circumference of the dummy area MA defined along the edge of the lower substrate 110 The temporary protective film 140 is irradiated with a laser.

2E and 2F, a temporary protective film 140 is formed along the inner circumference of the dummy area MA defined along the edge of the lower substrate 110 using the second laser source 830. [ Is irradiated with a laser. That is, the laser is irradiated along a line spaced inward by a predetermined distance d from the end of the lower substrate 110. The predetermined distance d, that is, the width of the dummy area MA can be determined in consideration of the deposition process of forming the first sacrificial layer 111 and the process error of the squeezing process of forming the flexible substrate 120. [ That is, when the process steps of the deposition process for forming the first sacrificial layer 111 and the squeezing process for forming the flexible substrate 120 are large, the width d of the dummy area MA is set to be large, The width d of the dummy area MA can be set small when the process errors of the deposition process for forming the layer 111 and the squeeze process for forming the flexible substrate 120 are small. The second laser source 830 used at this time may be a laser source for irradiating the UV laser.

2F, the temporary protective film 140, the display portion 130, the flexible substrate 120, and the first sacrificial layer (not shown) are formed along the inner circumference of the dummy region MA, 111 may be scribed.

Subsequently, the lower substrate 110 is removed (S125).

Referring to FIG. 2G, the flexible substrate 120 and the lower substrate 110 are separated by removing the lower substrate 110. Specifically, the first attachment stage 840 is attached to the upper portion of the portion of the temporary protective film 140 corresponding to the plurality of cells CE to fix the temporary protective film 140 to the first attachment stage 840 The flexible substrate 120 and the lower substrate 110 can be separated from each other by moving the first attachment stage 840 upward. However, the present invention is not limited to this, and the flexible substrate 120 and the lower substrate 110 may be separated from each other by means other than the first attachment stage 840. [

The temporary protective film 140, the display unit 130, and the flexible substrate 120 disposed in the dummy area MA in the process of separating the flexible substrate 120 and the lower substrate 110 from each other are separated from the lower substrate 110, (110). Only the temporary protective film 140, the display portion 130 and the flexible substrate 120 disposed in the plurality of cells CE can be fixed to the first attachment stage 840 and separated from the lower raw substrate 110 .

Then, the supporting film 160 is attached to the flexible substrate 120 (S130).

The support film 160 is attached to the lower surface of the flexible substrate 120 in a state where the temporary protective film 140, the display unit 130 and the flexible substrate 120 are attached to the first attachment stage 840 Respectively. The support film 160 is a film for protecting and supporting the flexible substrate 120 of the organic light emitting display device, and may be made of a plastic material, for example, made of polyethylene terephthalate (PET). The support film 160 may be attached to the lower surface of the flexible substrate 120 using the rollers 850 as shown in Fig. 2H. The support film 160 may be attached to the flexible substrate 120 in a state in which the components shown in FIG. 2H are inverted, that is, the roller 850 is disposed on the flexible substrate 120. However, .

Then, a laser is irradiated to the boundary between the non-display area NA and the pad area PA (S135).

2I and 2J, a laser is irradiated to the boundary between the non-display area NA and the pad area PA by using the third laser source 860. [ The third laser source 860 moves the laser beam along the boundary between the non-display area NA and the pad area PA on the temporary protective film 140 while applying a laser to the boundary between the non- You can investigate. 2I, the third laser source 860 moves the laser beam 860 from the right side to the left side of the temporary protective film 140 while moving a laser beam at the boundary between the non-display area NA and the pad area PA You can investigate. The third laser source 860 may be fixed while the third laser source 860 moves in the opposite direction and the temporary protective film 140, the display unit 130, The support film 120 and the support film 160 may move. The third laser source 860 may be a laser source for irradiating a CO ₂ laser or a laser source for irradiating a UV laser.

As described above, by irradiating the laser to the boundary between the non-display area NA and the pad area PA, temporary protection corresponding to the boundary between the non-display area NA and the pad area PA, The film 140 may be scribed. That is, only the temporary protective film 140 can be scribed by adjusting the intensity of the laser irradiated from the third laser source 860, the irradiation time, and the like

Subsequently, a laser is irradiated to the boundaries of the plurality of cells CE (S140).

Referring to Figs. 2K and 21, a laser is irradiated to the boundaries of a plurality of cells CE using a fourth laser source 870. Fig. The fourth laser source 870 can irradiate the laser on the boundary of the plurality of cells CE while moving along the boundary of the plurality of cells CE on the temporary protective film 140. [ That is, as shown in FIG. 2K, the fourth laser source 870 irradiates the laser beam to the boundaries of the plurality of cells CE while moving in the direction of the arrow from the upper side to the lower side of the temporary protective film 140, The laser beam can be irradiated to the boundaries of the plurality of cells CE while moving in the direction of the arrow from the right side to the left side of the cell 140. However, the present invention is not limited thereto, and the laser may be irradiated while moving the fourth laser source 870 in the opposite direction. The fourth laser source 870 may be a laser source for irradiating a UV laser or a laser source for irradiating a CO ₂ laser and a UV laser. In some embodiments, a plurality of laser sources may be used to irradiate the laser at the boundaries of the plurality of cells CE. That is, one laser source for irradiating the CO ₂ laser and another laser source for irradiating the UV laser may be used.

The temporary protection film 140, the display unit 130, the flexible substrate 120, and the flexible substrate 120 are formed in units of a plurality of cells (CE) as shown in FIG. And the support film 160 can be scribed. Accordingly, a plurality of organic light emitting display devices can be divided into organic light emitting display devices of a cell (CE) unit.

Then, the temporary protective film 140 is removed (S145).

Referring to FIG. 2M, the temporary protective film 140 corresponding to the pad region PA of the temporary protective film 140 is removed. In Fig. 2M, only the organic light emitting display corresponding to one of the plurality of cells CE is shown. As described above, the releasing force of the adhesive layer 141 of the temporary protective film 140 has a value that allows the adhesive layer 141 to be easily removed from the display portion 130 or the sealing portion. Therefore, it is easy to remove the temporary protective film 140 disposed in the pad area PA. An adhesive tape may be used to remove the temporary protective film 140 disposed in the pad area PA, but is not limited thereto.

Next, referring to FIG. 2N, dry cleaning is performed on the pad area PA. Specifically, the dry cleaning is performed by injecting air through the dry cleaner 880, so that foreign matters and the like disposed in the pad area PA can be easily removed. As described above, since the organic light emitting device of the display unit 130 is very vulnerable to moisture, it is possible to minimize the damage of the organic light emitting device due to moisture in the cleaning process by performing dry cleaning.

Then, a lighting test is performed through the pad electrode arranged in the pad area PA. That is, a lighting test may be performed using a probe or the like on the pad electrode disposed in the pad area PA from which the temporary protective film 140 is removed, and other tests may be performed if necessary.

Then, the temporary protective film 140 corresponding to the non-display area NA and the display area DA is removed. An adhesive tape may be used to remove the temporary protective film 140 corresponding to the non-display area NA and the display area DA, but the present invention is not limited thereto.

Next, the touch sensing unit 150 may be disposed on the display unit 130.

Referring to FIG. 20, a separately manufactured touch sensing unit 150 is disposed on the display unit 130. FIG. The touch sensing unit 150 may have various structures. For example, the touch sensing unit 150 may include a planarization layer disposed on a supporting member, a touch sensing electrode for touch sensing disposed on the planarization layer, a protection for protecting the touch sensing electrode on the touch sensing electrode, Layer may be disposed. However, the structure of the touch sensing unit 150 is not limited thereto. An adhesive layer or a resin may be used to dispose the touch sensing part 150 on the display part 130. [ The touch sensing unit 150 is disposed on the display unit 130 to manufacture the OLED display 100 according to an exemplary embodiment of the present invention.

In addition, an inspection process such as lighting inspection can be performed, and a module process for attaching the module to the pad electrode of the pad area PA can be performed.

In some embodiments, if the organic light emitting display 100 has a structure that does not include the touch sensing unit, the process of disposing the touch sensing unit may be omitted.

As described above, when the first sacrificial layer 111 and / or the flexible substrate 120 are not formed on the entire surface of the lower substrate 110 and are formed only on a part of the lower substrate 110, The lower substrate 110 and the flexible substrate 120 may not be separated even if laser is irradiated to the region of the lower substrate 110 where the substrate 111 and / or the flexible substrate 120 are not formed. Therefore, in the process of separating the lower substrate 110 and the flexible substrate 120 after the laser irradiation process, the lower substrate 110 may not be separated. The OLED display 100 or the lower substrate 110 and the flexible substrate 120 corresponding to the cells CE located in the regions where the lower substrate 110 and the flexible substrate 120 are not separated The organic light emitting display 100 corresponding to the cell CE adjacent to the non-separated region may be judged to be defective. If the organic light emitting display 100 corresponding to the plurality of cells CE is determined to be defective, the productivity of the OLED display device manufacturing method is reduced.

Accordingly, in the method of manufacturing an organic light emitting display according to an embodiment of the present invention, after the laser is irradiated to the lower substrate 110, the inner circumference of the dummy area MA defined along the edge of the lower substrate 110 And then irradiating the temporary protective film 140 with a laser. That is, in the process of forming the first sacrificial layer 111 and the flexible substrate 120, the piles of the lower protective layer 110, which are regions where the first sacrificial layer 111 and the flexible substrate 120 may not be formed, A laser is irradiated on the temporary protective film 140 along the inner periphery of the region MA. Thus, only the components corresponding to the plurality of cells CE can be separated from the sub-substrate 110 while leaving the components disposed in the dummy area MA on the sub-substrate 110. [ The components arranged in the regions corresponding to the plurality of cells CE, which are regions to be separated from the lower main substrate 110, can be easily separated from the lower main substrate 110, The defect rate of the OLED display 100 corresponding to the OLED display 100 can be reduced and the productivity can be improved.

In the conventional method of manufacturing an organic light emitting display device, a barrier film for preventing moisture permeation was used during the manufacturing process. However, since the barrier film for preventing moisture permeation is expensive, the manufacturing cost of the OLED display 100 is increased. Also, the barrier film for preventing moisture permeation used in the manufacturing process remains in the organic light emitting display 100 after manufacturing the organic light emitting display 100, and the thickness of the organic light emitting display 100 is increased.

Accordingly, in the method of fabricating an OLED display device according to an embodiment of the present invention, a low-priced temporary protective film (not shown) removed after completion of the process is used instead of the expensive barrier film for moisture permeation prevention used in the manufacturing process of the OLED display 100 140) is used, the process cost can be reduced. Further, in the final product state, since a protective film such as a barrier film is not present in the OLED display 100, the OLED display 100 having a reduced thickness can be provided. FIG. 3 is a schematic flowchart illustrating a method of manufacturing an organic light emitting display according to another embodiment of the present invention. 6A to 6L are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention. FIGS. 5 and 6A to 6L illustrate a method of manufacturing an OLED display using a touch sensing unit of an in-cell structure. Referring to FIGS. 1 to 4, Duplicate description is omitted for the same part. Here, the organic light emitting display having the touch sensing unit of an in-cell structure means an organic light emitting display in which the touch sensing electrode of the touch sensing unit is formed on the display unit or the encapsulation unit on the display unit.

First, a plurality of cells CE including a display area DA, a non-display area NA surrounding the display area DA, and a pad area PA extending from one side of the non-display area NA are defined A first sacrificial layer 611 is formed on the lower substrate 610 and a flexible substrate 620 is formed on the first sacrificial layer 611 in step S505. A display portion 630 including circuit portions and organic light emitting elements is formed in each of the plurality of cells CE (S510). A first sacrificial layer 611 is formed on the lower substrate 610 and a flexible substrate 620 is formed on the first sacrificial layer 611 and a display portion 630 is formed on the flexible substrate 620 A first sacrificial layer 111 is formed on the lower substrate 110 described with reference to FIGS. 1, 2A and 2B, a flexible substrate 120 is formed on the first sacrificial layer 111, And the display unit 130 is formed on the flexible substrate 120. [

Subsequently, the upper main substrate 615 on which the touch sensing unit 650 is disposed is placed on the display unit 630 (S515).

Referring to FIG. 6A, a touch sensing unit 650 separately manufactured on the upper main substrate 615 is disposed on the display unit 630. The touch sensing unit 650 is formed on the second sacrificial layer 612 and the touch sensing unit 650 is connected to the display unit 630 An upper main substrate 615 on which the touch sensing unit 650 is disposed is disposed on the display unit 630 so as to be opposed to each other. The touch sensing unit 650 may have a variety of structures and may be substantially the same as the touch sensing unit 150 described with reference to FIG. Although not shown in FIG. 6A, the sealing portion may be disposed on the display portion 630, and when the sealing portion is disposed, the touch sensing portion 650 may be disposed to face the sealing portion. In addition, the touch sensing unit 650 may function as an additional sealing unit.

Subsequently, the back surface of the lower raw substrate 610, which is the opposite surface of the lower sacrificial layer 610 on which the first sacrificial layer 611 is disposed, can be cleaned. For example, the back surface of the sub-director board 610 can be cleaned using a brush. In the manufacturing process of the OLED display device, a stain foreign matter such as fingerprints, saliva, etc. may be disposed on the back surface of the lower substrate 610. In addition, threader and other floating foreign matter disposed on the back surface of the lower raw paper substrate 610 may be disposed. Accordingly, in the method of manufacturing an OLED display device according to another embodiment of the present invention, a process of cleaning the rear surface of the lower substrate 610 by using a brush can be employed to remove stained foreign matter and floating foreign matter, It is possible to suppress the occurrence of breakage due to, for example,

Subsequently, a laser is irradiated onto the lower substrate 610 (S520).

Referring to FIG. 6B, a laser is irradiated on the back surface of the lower substrate 610, that is, the surface opposite to the surface on which the first sacrificial layer 611 is disposed on the lower substrate 610. 6A, the first sacrificial layer 611, the flexible substrate 620, the display unit 630, the touch sensing unit 650, the second sacrificial layer 612, The first laser source 920 is disposed so as to be spaced apart from the rear surface of the lower substrate 610 by a predetermined distance in a state in which the upper substrate 615 and the upper substrate 615 are vertically inverted. The adhesion between the first sacrificial layer 611 and the flexible substrate 620 can be weakened by irradiating a laser from the first laser source 920. [ The process of irradiating the laser to the lower substrate 1 610 is substantially the same as the process of irradiating the laser to the lower substrate 1 10 described with reference to FIG.

Next, referring to 6c, a laser is irradiated to the upper main substrate 615 along the inner periphery of the dummy area MA defined along the edge of the lower main substrate 610 using the second laser source 930 . That is, the laser is irradiated to the upper main substrate 615 along a line spaced inward by a predetermined distance from the end of the lower main substrate 610. The laser is irradiated onto the upper main substrate 615 by using the second laser source 930 to form a first sacrificial layer 611 along the inner circumference of the dummy area MA as shown in FIG. The display unit 630, the touch sensing unit 650, and the second sacrificial layer 612 may be scribed. Therefore, the flexible substrate 620, the display portion 630, and the touch sensing portion 650 disposed inside the line to which the laser beam is irradiated and the flexible substrate 620, the display portion 630, And the touch sensing unit 650 are separated from each other. The process of irradiating the laser using the second laser source 930 is substantially the same as the process of irradiating the laser using the second laser source 830 described with reference to Figures 2E and 2F, .

Subsequently, the lower substrate 610 is removed (S525).

Referring to FIG. 6D, the flexible substrate 620 and the lower substrate 610 are separated by removing the lower substrate 610. Specifically, the first attachment stage 940 is attached to the upper portion of the upper substrate 615 to fix the upper substrate 615 to the first attachment stage 940, and then the first attachment stage 940 is moved to the upper The flexible substrate 620 and the lower substrate 610 can be separated from each other.

The flexible substrate 620, the display unit 630, and the touch sensing unit 650 disposed in the dummy area MA in the process of separating the flexible substrate 620 and the lower substrate 610 from each other are separated from the lower substrate 100, (610). Only the flexible substrate 620, the display portion 630 and the touch sensing portion 650 disposed in the plurality of cells CE are fixed to the first attachment stage 940 to be connected to the lower main substrate 615 together with the upper main substrate 615, Gt; 610 < / RTI >

Subsequently, the supporting film 660 is attached to the flexible substrate 620 (S530).

6E, when the upper substrate 615, the touch sensing unit 650, the display unit 630, and the flexible substrate 620 are attached to the first attachment stage 940, the lower surface of the flexible substrate 620 A support film 660 is attached. The process of attaching the support film 660 is substantially the same as the process of attaching the support film 160 described with reference to Fig. 2H.

Subsequently, the upper surface of the upper raw substrate 615, which is the opposite side of the surface on which the second sacrificial layer 612 is disposed, can be cleaned. For example, the upper surface of the upper main substrate 615 can be cleaned using a brush. In the manufacturing process of the OLED display device, a stain foreign matter such as fingerprints, saliva, etc. may be disposed on the upper surface of the upper substrate 615. Further, threader and other floating foreign objects disposed on the upper surface of the upper main substrate 615 may be disposed. Accordingly, in the method of manufacturing an organic light emitting diode display according to another embodiment of the present invention, the upper surface of the upper substrate 615 is cleaned using a brush to remove stained foreign matter and foreign matter, It is possible to suppress the occurrence of breakage due to, for example,

Then, the upper main substrate 615 is irradiated with a laser (S535).

6F, a laser beam is irradiated onto the upper surface of the upper main substrate 615, that is, the surface opposite to the surface on which the second sacrificial layer 612 is disposed on the upper main substrate 615. Specifically, a fifth laser source 990 is disposed so as to be spaced apart from the upper surface of the upper substrate 615 by a predetermined distance, and a laser is irradiated from the fifth laser source 990 to touch the second sacrificial layer 612, Thereby weakening the adhesion between the sensing portions 650. Thus, as described later, the upper main substrate 615 and the touch sensing unit 650 can be separated from each other. The process of irradiating the laser on the upper substrate 615 is substantially the same as the process of irradiating the laser onto the lower substrate 110 described with reference to FIG. 2D.

Subsequently, the upper main substrate 615 is removed (S540).

6G, the upper substrate 615 is separated from the touch sensing unit 650, and the upper substrate 615 is removed. That is, when the attachment stage is attached to the support film 660 and the attachment stage is raised while the upper main substrate 615 is fixed to a specific stage, the second sacrificial layer 612 weakened by the laser irradiation process, The upper substrate 615 and the touch sensing unit 650 can be separated from each other by the adhesive force between the upper substrate 615 and the touch panel 650. Conversely, in order to separate the upper main substrate 615 and the touch sensing portion 650, the support film 660 is fixed to a specific stage, and the attachment stage is attached to the upper main substrate 615, Process may be used.

Then, the temporary protection film 640 is disposed on the touch sensing unit 650 (S545).

Referring to FIG. 6H, a temporary protective film 640 is disposed on the upper surface of the touch sensing unit 650. That is, the temporary protective film 640 is disposed on the upper surface of the touch sensing unit 650, which is the opposite side of one side of the touch sensing unit 650 facing the display unit 630. The temporary protective film 640 includes a base film 642 and an adhesive layer 641 disposed on one side of the base film 642. [ The temporary protective film 640 may be disposed using the roller 950 so that the adhesive layer 641 of the temporary protective film 640 faces the touch sensing unit 650. 6H may be reversed, that is, when the roller 950 is disposed on the touch sensing portion 650, the temporary protective film 640 may be provided on the touch sensing portion 650 ). ≪ / RTI > The temporary protective film 640 is substantially the same as the temporary protective film 140 described with reference to Fig.

Subsequently, a laser is irradiated to the boundary between the non-display area NA and the pad area PA (S550).

Referring to FIG. 6I, a laser is irradiated to the boundary between the non-display area NA and the pad area PA using the third laser source 960. The third laser source 960 moves the laser beam along the border between the non-display area NA and the pad area PA on the temporary protective film 640 and applies a laser beam to the boundary between the non-display area NA and the pad area PA You can investigate. The third laser source 960 may be a laser source for irradiating a CO ₂ laser. As described above, by irradiating the laser to the boundary between the non-display area NA and the pad area PA, temporary protection corresponding to the boundary between the non-display area NA and the pad area PA, The film 640 can be scribed. The step of irradiating the laser to the boundary between the non-display area NA and the pad area PA using the third laser source 960 is performed by using the third laser source 860 described with reference to Figs. 2I and 2J Is substantially the same as the step of irradiating the laser to the boundary between the non-display area (NA) and the pad area (PA).

Then, a laser is irradiated to the boundaries of the plurality of cells CE (S555).

Referring to FIG. 6J, a laser is irradiated to the boundaries of a plurality of cells CE using a fourth laser source 970. The fourth laser source 970 can irradiate the laser on the boundary of the plurality of cells CE while moving along the boundary of the plurality of cells CE on the temporary protective film 640. [ The fourth laser source 970 may be a laser source for irradiating a CO ₂ laser and a UV laser. In some embodiments, a plurality of laser sources may be used to irradiate the laser at the boundaries of the plurality of cells CE. That is, one laser source for irradiating the CO ₂ laser and another laser source for irradiating the UV laser may be used. 6J, the temporary protection film 640, the touch sensing unit 650, the display unit 630, and the display unit 630 are arranged in units of a plurality of cells CE by irradiating a laser on the boundary of the plurality of cells CE as described above. ), The flexible substrate 620 and the supporting film 660 can be scribed. Accordingly, a plurality of organic light emitting display devices can be divided into organic light emitting display devices of a cell (CE) unit. The step of irradiating the laser beam to the boundary of the plurality of cells CE using the fourth laser source 970 is performed by using the fourth laser source 870 described with reference to Figs. 2K and 2L, Is irradiated with a laser beam at a boundary between the laser beam and the laser beam.

Subsequently, the temporary protective film 640 is removed (S560).

Referring to FIG. 6K, the temporary protective film 640 corresponding to the pad region PA of the temporary protective film 640 is removed. In Fig. 6K, only the organic light emitting display corresponding to one of the plurality of cells CE is shown. The releasing force of the adhesive layer 641 of the temporary protective film 640 has a value that facilitates removal of the adhesive layer 641 from the display portion 630 or the sealing portion, The temporary protective film 640 is easily removed. The tape may be used to remove the temporary protective film 640 disposed in the pad area PA, but is not limited thereto.

Dry cleaning can then be performed on the pad area PA. Specifically, dry cleaning is performed by injecting air through a dry scrubber, so that foreign substances or the like disposed in the pad area PA can be easily removed. As described above, since the organic light emitting device of the display unit 630 is very vulnerable to moisture, dry cleaning can minimize the damage of the organic light emitting device due to moisture in the cleaning process.

Then, a lighting test is performed through the pad electrode arranged in the pad area PA. That is, a lighting test may be performed using a probe or the like on the pad electrode disposed in the pad area PA from which the temporary protective film 640 is removed, and other tests may be performed as necessary. The temporary protective film 640 corresponding to the non-display area NA and the display area DA is removed. A tape may be used to remove the temporary protective film 640 corresponding to the non-display area NA and the display area DA, but is not limited thereto.

In addition, an inspection process such as lighting inspection can be performed, and a module process for attaching the module to the pad electrode of the pad area PA can be performed.

The lower protective film 610 is removed and the supporting film 660 is attached to the flexible substrate 620. The upper protective film 615 is removed and the temporary protective film 640 is attached, The cell unit separation process may be performed, but the process sequence may be changed. For example, after the upper substrate 615 is removed, a temporary protective film 640 may be attached on the upper substrate 615. After the lower substrate 610 is removed and the supporting film 660 is attached, a cell-unit separation process can be performed. Alternatively, a process of attaching a supporting substrate such as a polarizing plate or the like instead of the temporary protective film 640 may be performed.

In the method of fabricating an organic light emitting display device according to another embodiment of the present invention, a first sacrificial layer 611 and a plurality of flexible And a step of irradiating the laser along the inner periphery of the dummy area MA of the lower raw paper substrate 610, which may not be formed. Thus, the components disposed in the dummy area MA can be separated from the sub-substrate 610 while leaving the components corresponding to the plurality of cells CE while remaining in the sub-substrate 610. [ The components arranged in the region corresponding to the plurality of cells CE, which is an area to be separated from the lower main substrate 610, can be easily separated from the lower main substrate 610. [ Therefore, the defect rate for the organic light emitting display 600 corresponding to the plurality of cells CE can be reduced and the productivity can be improved.

In the method of manufacturing an organic light emitting display according to another embodiment of the present invention, a low-priced temporary protective film 640 is used instead of the expensive barrier film for moisture permeation prevention used in a conventional OLED display . That is, in the method of manufacturing an OLED display device according to another embodiment of the present invention, the process cost can be reduced by using a low-cost temporary protective film 640 that is removed after the process is completed. Further, since the protective film such as the barrier film which takes up an unnecessary thickness is removed in the final product state, the thickness of the organic light emitting display 600 can be further reduced.

An organic light emitting display according to various embodiments of the present invention can be described as follows.

A method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention includes a step of forming a plurality of cells on a lower raw substrate substrate having a display area, a non-display area surrounding the display area, and a pad area extending from one side of the non- Forming a first sacrificial layer on the first sacrificial layer, forming a flexible substrate on the first sacrificial layer, forming a display portion including a circuit portion and an organic light emitting element in each of the plurality of cells on the flexible substrate, A step of disposing a film, a step of irradiating a laser to a lower substrate, a step of removing a lower substrate, a step of attaching a supporting film to a flexible substrate, a step of irradiating a laser to a boundary between the non- Irradiating a laser to the cell boundary, removing the temporary protective film, and disposing a touch sensing unit on the display unit can do.

Wherein the temporary protective film comprises a base film and an adhesive layer disposed on one side of the base film, and the step of disposing the temporary protective film comprises the steps of: And disposing the temporary protective film so as to contact with the sealing portion.

The releasing force of the adhesive layer may be 10 gf / inch or less.

The method of manufacturing an organic light emitting display may further include irradiating a temporary support film with a laser along an inner circumference of a dummy region defined along an edge of the lower luminescent substrate after irradiating the laser to the lower luminescent substrate .

The step of removing the sub-substrate may include removing the flexible substrate, the display, and the temporary protective film disposed in the dummy area of the sub-substrate together with the sub-substrate.

The step of removing the temporary protective film may include removing a portion of the temporary protective film corresponding to the pad region, and performing a dry cleaning on the pad region.

The step of removing the temporary protective film may include removing a portion of the temporary protective film corresponding to the display area and the non-display area.

The method of fabricating an organic light emitting display may further include disposing a touch sensing unit on the display unit after the step of removing the temporary protective film.

The step of irradiating a laser to the boundary between the non-display area and the pad area includes irradiating a first laser to the boundary between the non-display area and the pad area, and the step of irradiating the boundary of the plurality of cells with a laser And irradiating a second laser to the boundary of the cell of the second cell.

The method of manufacturing an organic light emitting display may further include cleaning the back surface of the lower raw paper substrate after the step of disposing the temporary protective film.

According to another aspect of the present invention, there is provided a method of fabricating an organic light emitting display device, the method comprising: forming a plurality of cells on a lower substrate, the plurality of cells including a display area, a non-display area surrounding the display area, Forming a first sacrificial layer on the first sacrificial layer, forming a flexible substrate on the first sacrificial layer, forming a display portion including a circuit portion and an organic light emitting element in each of the plurality of cells on the flexible substrate, A step of disposing the upper raw substrate on the display portion, a step of irradiating the lower raw substrate with a laser, a step of removing the lower raw substrate, a step of attaching a supporting film to the flexible substrate, Removing the temporary substrate, disposing a temporary protective film on the touch sensing unit, removing the temporary protective film on the border between the non-display area and the pad area Irradiating the laser, and may include the steps of removing the temporary protective film for a laser beam to the boundary of the plurality of cells.

The temporary protective film includes a base film and an adhesive layer disposed on the base film, and the step of disposing the temporary protective film includes the step of disposing the temporary protective film such that the adhesive layer of the temporary protective film faces the touch sensitive portion .

The releasing force of the adhesive layer may be 10 gf / inch or less.

The method of manufacturing an organic light emitting display further includes irradiating a laser to the upper main substrate along a line spaced inwardly from the edge of the lower main substrate by a predetermined distance after irradiating the lower main substrate with a laser, The step of removing the lower main substrate includes removing a portion of the flexible substrate separated from the touch sensing unit, the display unit, and the touch sensing unit together with the lower main substrate as the laser is irradiated onto the upper main substrate. .

The step of removing the temporary protective film may comprise removing a portion of the temporary protective film corresponding to the pad area and performing a dry cleaning on the exposed area with the temporary protective film removed.

The step of removing the temporary protective film may include removing a portion of the temporary protective film corresponding to the display area and the non-display area.

The step of irradiating the laser to the boundary between the non-display area and the pad area includes using a first laser, and the step of irradiating the laser to the boundary of the plurality of cells includes the step of using the second laser .

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

110, 610: Sub-
111, 411, 611: first sacrificial layer
612: second sacrificial layer
615: upper main substrate
120, 420, 620: Flexible substrate
130, 430, 630:
140, 640: Temporary protective film
141, 641: Adhesive layer
142, 642: base film
343: Release film
150, 650: Touch sensing unit
160, 660: Support film
100, 600: organic light emitting display
810: Brushes
820, 920: a first laser source
830, 930: a second laser source
840: first attachment stage
850, 950: rollers
860, 960: Third laser source
870, 970: Fourth laser source
880: Dry scrubber
990: fifth laser source
CE: Cell
PA: pad area
DA: Display area
NA: non-display area
MA: dummy area

Claims (17)

Forming a first sacrificial layer on a lower lattice substrate defining a plurality of cells including a display region, a non-display region surrounding the display region, and a pad region extending from one side of the non-display region;
Forming a flexible substrate on the first sacrificial layer;
Forming a display portion including a circuit portion and an organic light emitting element in each of the plurality of cells on the flexible substrate;
Disposing a temporary protective film on the display unit;
Irradiating the lower substrate with a laser;
Removing the lower substrate;
Attaching a supporting film to the flexible substrate;
Irradiating a laser to a boundary between the non-display area and the pad area;
Irradiating a boundary of the plurality of cells with a laser; And
And removing the temporary protective film. The method according to claim 1,
Further comprising the step of disposing an encapsulating portion covering the display portion,
Wherein the temporary protective film comprises a base film and an adhesive layer disposed on one side of the base film,
Wherein the step of disposing the temporary protective film includes disposing the temporary protective film such that the adhesive layer is in contact with the encapsulating portion. 3. The method of claim 2,
And the releasing force of the adhesive layer is 10 gf / inch or less. The method according to claim 1,
Further comprising irradiating the temporary protective film with a laser along an inner perimeter of a dummy region defined along an edge of the lower luminescent substrate after irradiating the lower luminescent substrate with a laser, Way. 5. The method of claim 4,
Wherein the step of removing the lower raw substrate includes removing the flexible substrate, the display, and the temporary protective film disposed in the dummy area of the lower raw substrate together with the lower raw substrate. . The method according to claim 1,
Wherein the step of removing the temporary protective film comprises:
Removing a portion of the temporary protective film corresponding to the pad region; And
And performing dry cleaning on the pad region. The method according to claim 6,
Wherein the step of removing the temporary protective film comprises:
And removing the portion of the temporary protective film corresponding to the display region and the non-display region. 8. The method of claim 7,
And disposing a touch sensing unit on the display unit after the step of removing the temporary protective film. The method according to claim 1,
Wherein the step of irradiating a laser to the boundary between the non-display area and the pad area includes the step of irradiating a first laser to a boundary between the non-display area and the pad area,
Wherein irradiating the boundary of the plurality of cells with a laser includes irradiating a boundary of the plurality of cells with a second laser. The method according to claim 1,
Further comprising the step of cleaning the back surface of the lower luminescent substrate after the step of disposing the temporary protective film. Forming a first sacrificial layer on a lower lattice substrate defining a plurality of cells including a display region, a non-display region surrounding the display region, and a pad region extending from one side of the non-display region;
Forming a flexible substrate on the first sacrificial layer;
Forming a display portion including a circuit portion and an organic light emitting element in each of the plurality of cells on the flexible substrate;
Disposing an upper ledge board on which the touch sensing unit is disposed on the display unit;
Irradiating the lower substrate with a laser;
Removing the lower substrate;
Attaching a supporting film to the flexible substrate;
Irradiating the upper main substrate with a laser;
Removing the upper ledge board;
Disposing a temporary protective film on the touch sensing unit;
Irradiating a laser to a boundary between the non-display area and the pad area;
Irradiating a boundary of the plurality of cells with a laser; And
And removing the temporary protective film. 12. The method of claim 11,
Wherein the temporary protective film comprises a base film and an adhesive layer disposed on the base film,
Wherein the step of disposing the temporary protective film comprises disposing the temporary protective film such that the adhesive layer of the temporary protective film faces the touch sensing part. 13. The method of claim 12,
And the releasing force of the adhesive layer is 10 gf / inch or less. 12. The method of claim 11,
Further comprising the step of irradiating a laser beam to the upper main substrate along a line spaced inward by a predetermined distance from an edge of the lower main substrate after irradiating the lower main substrate with a laser,
Wherein the step of removing the lower main substrate includes: a step of removing the flexible substrate, the flexible substrate, the display unit, and the touch sensing unit, which are separated from the flexible substrate, the display unit, and the touch sensing unit, And removing the portion of the first sub-substrate with the sub-substrate. 12. The method of claim 11,
Wherein the step of removing the temporary protective film comprises:
Removing a portion of the temporary protective film corresponding to the pad region; And
And removing the temporary protective film to perform dry cleaning on the exposed region. 16. The method of claim 15,
Wherein the step of removing the temporary protective film comprises:
And removing the portion of the temporary protective film corresponding to the display region and the non-display region. 12. The method of claim 11,
Wherein the step of irradiating a laser to the boundary between the non-display area and the pad area comprises using a first laser,
Wherein the step of irradiating the boundary of the plurality of cells with a laser comprises using a second laser.

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