KR20180007331A - Imprint apparatus, and article manufacturing method - Google Patents

Abstract

Provided is an imprint device capable of preventing introduction of foreign substances into a space between a substrate and a shape. To this end, the imprint device molds an imprinting material on the substrate using the shape. The imprint device comprises: a substrate stage supporting and moving the substrate; a shape retention part supporting the shape; and a peripheral member disposed around the shape retention part. A release part which is to release gas into a space where the substrate stage faces is installed on a lateral side of the peripheral member.

Description

[0001] IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD [0002]

The present invention relates to an imprint apparatus and a method of manufacturing an article.

There has been a growing demand for miniaturization of semiconductor devices, MEMS, and the like. In addition to the conventional photolithography technology, a microfabrication technique for forming an imprint material pattern on a substrate by molding an imprint material into a mold It is collecting. This technique is referred to as an imprint technique. According to the imprint technique, a minute structure of several nanometers order can be formed on a substrate. For example, as one of the imprint techniques, there is a photocuring method. In the imprint apparatus employing this light curing method, first, the imprint material is applied to the imprint area on the substrate. Next, the mold is pressed against the imprint material to fill the concave portion of the pattern region of the mold with the imprint material. Next, the imprint material is irradiated with ultraviolet rays to cure the imprint material, thereby forming a pattern corresponding to the concave portion. Next, by removing the mold from the cured imprint material, a pattern of the imprint material remains on the substrate.

In the imprint apparatus, a pattern is formed by pushing a mold against an imprint material on a substrate. Therefore, pattern defects are likely to occur as compared with a reduction projection type exposure apparatus, and reduction of the defects is a problem. Among the causes of the defect, defects that are generated by the foreign substances (particles) being pushed against the imprint material while sandwiched between the mold and the substrate are particularly problematic. If the foreign object is adhered to the pattern area of the mold, defects are generated in the same position in the pattern formed thereafter. In addition, if the foreign object is harder than the material of the mold, there is a possibility of damaging the mold. In the imprint process, since the manufacturing cost of the mold is relatively high, the breakage of the mold becomes a large factor of cost increase of the product.

Thus, in the conventional imprint apparatus, a technique of making the imprint region surrounded by the gas barrier makes it difficult for the impurity from the outside to enter between the mold and the substrate is adopted (Patent Document 1).

Japanese Patent Application Laid-Open No. 2014-56854

In order to form the gas barrier so as to effectively prevent the foreign matter from entering the space between the substrate and the mold, it is preferable that the volume of the space between the substrate and the mold is made small and the flow rate of the gas constituting the gas barrier is kept high. However, it is necessary to form a space or the like for maintenance on the periphery of the mold, and on the part of the area where the substrate or the substrate stage can move, a large space may exist. In such a large space, the flow velocity of the gas constituting the gas barrier is lowered, and the effect of the gas barrier is reduced.

An object of the present invention is to provide an imprint apparatus which is advantageous for preventing intrusion of foreign objects into a space between a substrate and a mold.

According to an aspect of the present invention, there is provided an imprint apparatus for forming an imprint material on a substrate using a mold, the imprint apparatus comprising: a substrate stage for holding and moving the substrate; And a peripheral member disposed in the periphery of the mold holding portion, and a spout portion for spraying gas into a space in which the substrate stage can face is provided on a side surface of the peripheral member.

According to the present invention, it is possible to provide an imprint apparatus which is advantageous for preventing intrusion of foreign matter into, for example, a space between a substrate and a mold.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an imprint apparatus according to an embodiment of the present invention. Fig.
2 is a view showing a first configuration example of an ejection section in an imprint apparatus according to an embodiment of the present invention;
3 is a view showing a second configuration example of an ejection section in an imprint apparatus according to an embodiment of the present invention.
4 is a view showing a third configuration example of the ejection portion in the imprint apparatus according to the embodiment of the present invention.
5 is a view showing an example of the operation of the ejection unit in the imprint apparatus according to the embodiment of the present invention.
6 is a view illustrating an article manufacturing method;

Hereinafter, the present invention will be described with reference to the accompanying drawings.

Fig. 1 shows a configuration of an imprint apparatus 1 according to an embodiment of the present invention. The imprint apparatus 1 forms the imprint material 8 on the substrate 2 by using the mold 4 to form a pattern of the imprint material 8 on the substrate 2. [ More specifically, the imprint apparatus 1 contacts the mold 4 with the imprint material 8 disposed on the substrate 2, and imparts curing energy to the imprint material 8, Of the imprint pattern of the imprint material is transferred. In the present specification and the accompanying drawings, a direction is shown in an XYZ coordinate system in which the direction parallel to the surface of the substrate 2 is an XY plane. The directions around the X axis, the rotation around the Y axis, and the rotation about the Z axis are set to be θX, Yaxis, and Zaxis directions parallel to the X axis, Yaxis, and Zaxis in the XYZ coordinate system, ,? Y,? Z. Control or drive with respect to the X-axis, Y-axis, and Z-axis means control or driving in the directions parallel to the X-axis, parallel to the Y-axis, and directions parallel to the Z-axis, respectively. The control or drive relating to the [theta] X axis, the [theta] Y axis, and the [theta] Z axis is controlled by the rotation about the axis parallel to the X axis, the rotation about the axis parallel to the Y axis, and the rotation about the axis parallel to the Z axis Or driving. The position is information that can be specified based on the coordinates of the X axis, the Y axis, and the Z axis, and the attitude is information that can be specified by the values of the? X axis,? Y axis, and? Z axis. Positioning means controlling position and / or posture.

As the imprint material, a curable composition that is cured by imparting curing energy (sometimes referred to as a resin in an uncured state) is used. As the curing energy, electromagnetic wave, heat, or the like can be used. The electromagnetic wave may be, for example, light whose wavelength is selected from the range of 10 nm or more and 1 mm or less, for example, infrared light, visible light, ultraviolet light, or the like. The curable composition may be a composition which is cured by irradiation of light or by heating. Among them, the photo-curable composition to be cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as required. The non-polymer compound is at least one member selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component. The imprint material can be placed on the substrate in the form of a droplet or a plurality of droplets in the shape of a lead or a film formed by the supply unit 7. The viscosity (viscosity at 25 캜) of the imprint material can be, for example, 1 mPa s s or more and 100 mPa s or less. As a material of the substrate, for example, glass, ceramics, metal, semiconductor, resin and the like can be used. If necessary, a member including a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

The imprint apparatus 1 includes a mold holding portion 6, a mold driving mechanism 24, a mold deforming mechanism 19, a substrate stage 3, a substrate driving mechanism 23, a supplying portion 7, and a hardening portion 20 ). Type retaining portion 6 retains the die 4. The mold retaining portion 6 may include a first portion 61 having a chuck portion for chucking the upper surface of the mold 4 and a second portion 62 facing the side surface of the mold 4 have. Type drive mechanism 24 can be configured to drive the mold 4 to a plurality of axes (for example, six axes of X axis, Y axis, Z axis,? X axis,? Y axis, and? Z axis). The mold-deforming mechanism 19 deforms the mold 4 by applying a force to the side surface of the mold 4, thereby deforming the shape of the pattern region 41. [ The substrate stage 3 has a chuck for holding a substrate 2, and holds and moves the substrate 2. [ The substrate driving mechanism 23 moves the substrate stage 3 to move the substrate 2 relative to a plurality of axes (for example, three axes of the X axis, Y axis, and? Z axis). Type driving mechanism 24 and the substrate driving mechanism 23 constitute a relative moving mechanism for moving the mold 4 and the substrate 2 relative to a plurality of axes. The relative movement of the mold 4 and the substrate 2 by the relative movement mechanism causes movement for bringing the imprint material 8 and mold 4 on the substrate 2 into contact with each other and movement of the cured imprint material 8, (4). ≪ / RTI > The relative movement of the mold 4 and the substrate 2 by the relative movement mechanism may also include movement for relative positioning of the mold 4 and the substrate 2. [

The supply section 7 supplies or arranges the imprint material 8 on the substrate 2. [ The hardening unit 20 applies an energy (for example, light such as ultraviolet light) 21 to the imprint material 8 to harden the imprint material 8 supplied or disposed on the substrate 2, The ash (8) is cured. The imprint material 8 is supplied onto the substrate 2 by the supply part 7 and the imprint areas of the mold 4 and the substrate 2 are aligned with each other, (6) can be driven in the -Z direction. Thereby, the pattern area 41 of the die 4 comes into contact with the imprint material 8 on the substrate 2. Thereafter, the imprint material 8 is filled in the depression constituting the pattern of the pattern area 41, and the hardening energy is given to the imprint material 8 by the hardening unit 20, Whereby the imprint material 8 is cured. The imprint apparatus 1 is provided with a first gas (for example, helium) 17 for promoting the filling of the imprint material 8 with respect to the concave portion constituting the pattern of the pattern region 41, And a first gas supply unit 16 for supplying the gas to the processing space SP between the mold and the mold. The first gas supply unit 16 may be supplied with the first gas by the first gas supply source 18. The gas supply port of the first gas supply part 16 may be disposed, for example, in the mold-holding part 6. [ The gas supply port of the first gas supply part 16 may be arranged so as to surround the mold 4.

A foreign matter such as a particle is transferred between the imprint area of the substrate 2 and the pattern area 41 of the mold 4 when the pattern area 41 of the mold 4 contacts the imprint material 8 on the substrate 2 The pattern region 41 may be damaged. Although the imprint apparatus 1 is placed in a clean environment for manufacturing an article such as a semiconductor device, it is very difficult to completely eliminate the generation of foreign matter. The foreign object may be generated from the components constituting the imprint apparatus 1 or may be carried in from the outside of the imprint apparatus 1. There is a possibility that a defect of the pattern occurs if there is foreign matter having a size larger than the half pitch dimension of the pattern although it depends on the dimension and depth of the pattern formed in the pattern region 41. [

Thus, the peripheral member 9 is disposed in the periphery of the mold retaining portion 6, and the volume of the space above the substrate 2 can be limited by the peripheral member 9. The peripheral member 9 may typically be arranged to surround the mold retaining portion 6 and the mold-deforming mechanism 19. The peripheral member 9 is also configured such that the second portion 62 of the die retainer 6 is disposed between the first side 91 of the peripheral member 9 and the region where the die 4 is disposed . The imprint apparatus 1 is provided with a second gas for forming a gas barrier (for example, a clean dry film) for forming a gas barrier in a peripheral space SS (a space between the peripheral member 9 and the substrate stage 3) And a second gas supply unit 10 for supplying air (air) 11. The second gas supply unit 10 may be supplied with the second gas by the second gas supply source 12. The gas supply port of the second gas supply part 10 can be arranged, for example, in the mold holding part 6 and / or the peripheral member 9. In the example shown in Fig. 1, the gas supply port of the second gas supply part 10 is disposed on both sides of the mold holding part 6 and the peripheral member 9, for example. The gas supply port of the second gas supply unit 10 may be disposed in another member. The gas supply port of the second gas supply part 10 may be arranged so as to surround the processing space SP.

The peripheral member 9 is arranged in such a manner that the peripheral member 9 is opposed to the substrate stage 3 in the entire region in which the substrate stage 3 is movable from the viewpoint of preventing foreign matter from intruding into the processing space SP . The range in which the substrate stage 3 can be moved is an acceptance area for the substrate transport mechanism to receive the substrate 2 from the substrate stage 3 or to pass the substrate 2 to the substrate stage 3, And a maintenance area for performing maintenance of the battery 3. In this region, since the peripheral member 9 can not be disposed, there may be a space S1 in which the substrate stage 3 can face. In one example, the space S1 is a space in which the substrate stage 3 is brought into a state in which the substrate stage 3 faces the space S1 by the movement of the substrate stage 3, and a case in which the substrate stage 3 is in a state of not facing the space S1. In another example, the space S1 is a space in which the substrate stage 3 always faces.

The peripheral member 9 includes a lower surface 90 including a portion facing the substrate stage 3, a first side surface 91 on the mold retaining portion 6 side, The second side 92 faces the space S1 in which the substrate stage 3 can be faced. The first side face 91 of the peripheral member 9 may be arranged so as to surround the mold retaining portion 6 and the mold deforming mechanism 19. [ In other words, the mold-deforming mechanism 19 can be disposed between the area where the mold 4 is disposed and the first side 91 of the peripheral member 9.

The distance between the lower surface 90 of the peripheral member 9 and the upper surface of the substrate stage 3 is preferably larger than 0 mm and not larger than 10 mm. Further, the distance is more preferably 0.5 mm or more from the viewpoint of ease of manufacture, and more preferably 2 mm or less from the viewpoint of the effect of gas barrier. The substrate stage 3 may have a substrate peripheral portion 31 surrounding the periphery of the substrate 2. [ The upper surface of the substrate stage 3 may be the upper surface of the substrate peripheral portion 31. [

The substrate stage 3 and the substrate 2 are covered by the gas barrier formed by the second gas 11 in the situation where the substrate stage 3 faces the space S1. The foreign matter can be adhered to the substrate stage 3 and the substrate 2. In this case, Therefore, in the present embodiment, the spraying portion 13 for spraying the clean gas (for example, clean dry air) 14 is provided on the second side surface 92 of the peripheral member 9. The cleanliness of the space S1 is improved by the clean gas ejected from the ejection portion 13. [ This makes it possible to reduce the possibility that foreign matter adheres to the substrate stage 3 and the substrate 2 in a situation where the substrate stage 3 faces the space S1. Thus, it is possible to reduce the possibility that the foreign matter intrudes into the processing space SP due to the movement of the substrate stage 3 and the substrate 2.

2, the jetting section 13 includes an jetting port 131 formed in the second side surface 92 and a flow passage 25 connected to the jetting port 131 through the inside of the peripheral member 9 ). A clean gas can be supplied to the spray portion 13 by the gas supply source 15. Or the jetting portion 13 may include an jetting port 131 formed in the second side surface 92. [ The jetting portion 13 may be configured to jet the gas into the space S1 where the second side surface 92 faces. As illustrated in FIG. 2, the jetting portion 13 may be configured to jet the gas horizontally. Alternatively, as illustrated in Fig. 3, the jetting section 13 may be configured to jet the gas downward at an angle. Alternatively, as illustrated in Fig. 4, the jetting section 13 may be configured to eject the gas horizontally while jetting the gas obliquely downward. 5, a gas flow along the moving direction of the substrate stage 3 (rightward direction of the arrow A) is formed so as to have a plurality of spouts 13 facing the space S1 , The gas may be ejected from the selected ejection portion 13 of the plurality of ejection portions 13. It is preferable that the clean gas supplied from the spouting section 13 to the space S1 is continuously blown out in order to improve the cleanliness of the space S1. However, at least when the substrate 2 is disposed below the space S1, it is only necessary to receive the clean gas from the spouting part 13. [

The pattern of the cured product formed by using the imprint apparatus is used either permanently on at least a part of various articles or temporarily when manufacturing various articles. An article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include a volatile or nonvolatile semiconductor memory such as a DRAM, an SRAM, a flash memory, and an MRAM, and a semiconductor element such as an LSI, a CCD, an image sensor, and an FPGA. Examples of molds include imprint molds and the like.

The pattern of the cured product is used as it is as a constituent member of at least part of the article, or temporarily used as a resist mask. After etching or ion implantation is performed in the processing step of the substrate, the resist mask is removed.

Next, specific examples of the method for producing an article of the present invention will be described. A substrate 1z such as a silicon wafer having a surface to be processed 2z such as an insulator is prepared and then the surface of the material 2z to be processed is processed by an ink jet method or the like, And the imprint material 3z is applied to the surface. Here, a plurality of droplet-shaped imprint materials 3z are provided on the substrate.

As shown in Fig. 6 (b), the imprint mold 4z is opposed to the imprint material 3z on the substrate side where the concavo-convex pattern is formed. As shown in Fig. 6 (c), the substrate 1z provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the material to be processed 2z. In this state, the imprint material 3z is cured when light is transmitted through the mold 4z as curing energy.

6 (d), when the mold 4z and the substrate 1z are separated after the imprint material 3z is cured, the pattern of the cured product of the imprint material 3z on the substrate 1z . In this pattern of the cured product, the concave portion of the mold has a shape corresponding to the convex portion of the cured product, and the concave portion of the mold has a shape corresponding to the convex portion of the cured product, that is, the concavo-convex pattern of the mold 4z is transferred to the imprint material 3z do.

As shown in FIG. 6E, etching is performed using the pattern of the cured product as an inner etching mask to remove portions of the surface of the material to be processed 2z from which no cured product is present or remaining thinly, ). As shown in Fig. 6 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the material to be processed 2z can be obtained. Although the pattern of the cured product is removed here, it may be used as an interlayer insulating film, that is, a constituent member of an article, for example, contained in a semiconductor element or the like without being removed after processing.

1: Imprint device
2: substrate
3: substrate stage
4: Type
6:
9: Peripheral member
90: when
91: First aspect
92: second side
13:

Claims (12)

An imprint apparatus for forming an imprint material on a substrate using a mold,
A substrate stage for holding and moving the substrate,
A mold holding portion for holding the mold,
And a peripheral member disposed in the periphery of the die holding member,
And an ejection portion for ejecting gas is provided on a side surface of the peripheral member in a space in which the substrate stage can face
And the imprint apparatus. The method according to claim 1,
Wherein the peripheral member has a lower surface including a portion facing the substrate stage, a first side surface on the mold holding portion side, and a second side surface different from the first side surface,
And an ejection portion for ejecting the gas is provided on the second side surface
And the imprint apparatus. The method according to claim 1,
Further comprising a mold-deforming mechanism for deforming the mold by applying a force to the side surface of the mold, wherein the mold-deforming mechanism is disposed between a region where the mold is disposed and the first side face
And the imprint apparatus. 3. The method of claim 2,
Wherein the mold retaining portion includes a first portion having a chuck portion for chucking an upper surface of the mold and a second portion opposed to the side surface of the mold, Wherein the second portion is arranged between the regions
And the imprint apparatus. The method according to claim 1,
A first gas supply unit for supplying a first gas to a process space between the mold and the substrate, and a second supply unit for supplying a second gas to a peripheral space surrounding the process space
And the imprint apparatus. The method according to claim 1,
The distance between the lower surface of the peripheral member and the upper surface of the substrate stage is larger than 0 mm and smaller than 10 mm
And the imprint apparatus. 3. The method of claim 2,
Wherein the jetting portion includes an jet port formed on the second side surface and a flow path connected to the jet port through the inside of the peripheral member
And the imprint apparatus. 3. The method of claim 2,
Wherein the jetting portion includes an ejection port formed in the second side surface
And the imprint apparatus. 3. The method of claim 2,
Wherein the jetting portion ejects gas into the space facing the second side
And the imprint apparatus. The method according to claim 1,
The spraying unit is a spraying unit for spraying the gas horizontally
And the imprint apparatus. The method according to claim 1,
The jetting portion is a jetting portion for jetting gas toward the obliquely downward direction
And the imprint apparatus. A method for manufacturing a semiconductor device, comprising the steps of: forming a pattern on a substrate by the imprint apparatus according to any one of claims 1 to 11;
A step of processing the substrate on which the pattern is formed
Wherein the article is manufactured from the substrate on which the processing has been performed.

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