KR20180003374U - Chip package circuit board module - Google Patents

Abstract

The chip package circuit board module includes a circuit board and an original chip. The circuit board includes a first pad and a second pad disposed next to the first pad and remote from the first pad. The original chip is connected to the first pad and the second pad. The total width P1 of the first pad is larger than twice the width W1 of the original chip, and the width of the first pad is W1, the total width of the first pad is P1, the total width of the second pad is P2, , The overall width P2 of the second pad is larger than twice the width W1 of the original chip.

Description

[0001] CHIP PACKAGE CIRCUIT BOARD MODULE [0002]

The present invention relates to circuit board modules, and more particularly to chip package circuit board modules.

Generally, a circuit board module of a light emitting diode (LED) chip is to package an LED chip on a circuit board. However, if the LED chip is damaged, the package is broken, or for some other reason the LED chip can not emit light, the LED chip must be disassembled to clean the pad on the circuit board, sometimes requiring re-soldering, A new LED chip is packaged.

However, the reworking process described above has a problem that the copper wire on the surface of the circuit board may peel off together when the LED chip is peeled off; Unexpected expansion or contraction of the circuit board under a high temperature environment may cause damage to the circuit board, thereby lowering the reliability of the circuit board. However, there is a possibility that a high temperature may be applied in the process of peeling the LED chip; When the LED chip is peeled off, the pad on the circuit board may be damaged, and a new LED chip packaged in the same position may face a problem of yield reduction.

The present invention relates to a chip package circuit board module adapted to quickly and easily configure a replacement chip on a circuit board to achieve a high yield.

The present invention provides a chip package circuit board module comprising a circuit board and an original chip. The circuit board includes a first pad and a second pad. The second pad is disposed next to the first pad and away from the first pad. The original chip is connected to the first pad and the second pad. The width of the original chip is W1, the overall width of the first pad is P1, and the overall width of the second pad is P2. The overall width P1 of the first pad is greater than twice the width W1 of the original chip and the overall width P2 of the second pad is greater than twice the width W1 of the original chip.

In one embodiment of the present invention, the total width P1 of the first pad and the total width P2 of the second pad are 2.1 to 2.5 times the width W1 of the original chip, respectively.

In one embodiment of the present invention, the chip package circuit board module further comprises N replacement chips connected to the first pad and the second pad in parallel with the original chip, wherein N > = 1, (W2 + D) and P2 > = W1 + N (W2 + D), where D is the distance between the original chip and the latest replacement chip.

In one embodiment of the present invention, the distance D between the orientation chip and the last die replacement chip is 0.1 to 0.5 times the width W1 of the original chip.

In one embodiment of the present invention, the first pad includes a plurality of first branch portions connected to each other, the second pad includes a plurality of second branch portions connected to each other, and a position where the original chip is connected to the first pad, Wherein the first chip is one of the first branch portions and the original chip is connected to the second pad is one of the second branch portions, the entire width (P1) of the first pad is the sum of the widths of the first branch portions, (P2) is the sum of the widths of the second branch portions.

In an embodiment of the present invention, the chip package circuit module further comprises a replacement chip coupled to the other of the first branch and to the other of the second branch.

In one embodiment of the present invention, the second pad comprises a plurality of second branches connected to each other, the location where the original chip is connected to the second pad is one of the second branches, and the overall width of the second pad, P2 ) Is the sum of the widths of the second branch portions.

In one embodiment of the present invention, the chip package circuit module further comprises a replacement chip coupled to the other of the first pad and the second branch.

According to the above description, in the chip package circuit board module of the present invention, the entire width P1 of the first pad of the circuit board is designed to be larger than twice the width W1 of the original chip, (P2) is designed to be larger than twice the width (W1) of the original chip, when the original chip can not be operated, the replacement chip can be arranged next to the original chip to connect the first pad and the second pad. That is, the first pad and the second pad maintain a width for connecting the replacement chip, respectively. In this way, there is no need to disassemble the original chip during rework, and the rework work procedure is effectively simplified.

BRIEF DESCRIPTION OF THE DRAWINGS Some illustrative embodiments involving the drawings are described in detail below in order to provide a better understanding of the above and other features and advantages of the present invention.

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present invention, together with the description, together with the principles of the present invention.
1 is a schematic diagram of a chip package circuit board module according to an embodiment of the present invention;
2 is a schematic view of a chip package circuit board module according to another embodiment of the present invention;
3 is a schematic view of a chip package circuit board module according to another embodiment of the present invention;
4 is a schematic view of a chip package circuit board module according to another embodiment of the present invention.

1 is a schematic diagram of a chip package circuit board module according to an embodiment of the present invention; Referring to FIG. 1, a chip package circuit board module 100 according to the present embodiment includes a circuit board 110 and a plurality of original chips 120. The circuit board 110 includes a plurality of first pads 112 and a plurality of second pads 115. In the present embodiment, the original chip 120 is, for example, a light emitting diode (LED) chip, but the form of the original chip 120 is not limited to this. In this embodiment, the number of the original chip 120, the first pad 112, and the second pad 115 are three, for example. However, the number of the original chip 120, the first pad 112 And the number of the second pads 115 are not limited to this. According to FIG. 1, the first pads 112 are connected through the connecting portion 111, but in other embodiments, the first pads 112 may be spaced apart from each other as needed.

The second pads 115 are disposed next to the first pads 112 and away from the first pads 112, respectively. As shown in Figure 1, each original chip 120 is connected to a corresponding first pad 112 and a corresponding second pad 115, wherein the width of the original chip 120 is W1, The width of one pad 112 is P1 and the width of the second pad 115 is P2. 1, the width P1 of the first pad 112 is larger than twice the width W1 of the original chip 120, and the width P2 of the second pad 115 is larger than the width W1 of the original chip 120, Is larger than twice the width W1 of the electrode terminal portion.

In some situations, if the original chip 120 can not operate, then the chip package circuit module 100 needs to be repaired. In this embodiment, the first pad 112 and the second pad 115 maintain a width for connecting the replacement chip 130, respectively. Therefore, the replacement chip 130 is disposed immediately beside the original chip 120 for connecting the first pad 112 and the second pad 115 to each other without requiring the original chip 120 to be disassembled at the time of maintenance So that the work procedure of the reworking can be effectively simplified.

The chip package circuit board module 100 may include a replacement chip 130 connected to the first pad 112 and the second pad 115 in parallel with the original chip 120. In this case, 1, the original chip 120 is shown by a solid line in order to schematically show the width relationship between the first pad 112, the second pad 115, and the original chip 120, Is represented by a dotted line. Therefore, in FIG. 1, the number of replacement chips 130 may be equal to the number of original chips 120. That is, each of the first pads 112 and each second pad 115 used for electrically connecting the original chip 120 maintains a position for connecting the replacement chip 130.

In addition, there may be more than one position held by the first pad 112 and the second pad 115 for connecting the alternative chip 130 in the future. For example, there may be two or more positions held by the first pad 112 and the second pad 115 for connecting the replacement chip 130 in the future. The width P1 of the first pad 112 and the width P2 of the second pad 115 may be adjusted according to the number of the replacement chips 130 to be connected to the first pad 112 and the second pad 115 have.

Assuming that the number of replacement chips 130 to be connected to the first pad 112 and the second pad 115 is N, N > = 1, and the width of each of the replacement chips 130 is W2. Assuming that the chip insertion interval should be maintained between all two adjacent chips to facilitate operation and prevent friction between the two chips and that the spacing between the original chip 120 and the recent replacement chip 130 is D , P1? W1 + N (W2 + D) and P2? W1 + N (W2 + D). That is, the width P1 of the first pad 112 corresponds to the width W1 of the original chip 120, the width W2 of the replacement chip 130 that can be connected in the future, D) plus N times the sum. The width P2 of the second pad 115 corresponds to the width W1 of the original chip 120 and the width W2 of the replacement chip 130 that can be connected in the future and the interval W2 between the two adjacent chips D) plus N times the sum.

The distance D between the original chip 120 and the recent replacement chip 130 is 0.1 to 0.5 times the width W1 of the original chip or the width W2 of the replacement chip 130 . The width P1 of the first pad 112 and the width P2 of the second pad 115 that are suitable for connecting only one replacement chip 130 and the width P1 of the first pad 112 And the width P2 of the second pad 115 are 2.1 to 2.5 times the width W1 of the original chip 120, respectively. Of course, the designer may adjust the size of the space D and the spatial configuration on the circuit board 110 according to actual needs, and the size of the space D is not limited to this.

1, the circuit board 110 has three sets of first pad 112 and second pad 115 located at the top, bottom and middle, respectively, but with a different set of first pads 112, The widths of the different sets of second pads 115 are the same and in other embodiments the widths of the different sets of first pads 112 may be different and the different sets of second pads 115 ) May vary in width.

The chip package circuit board module of another pattern will be described below, and in the following embodiments, the same or similar components as those of the above-described embodiment are denoted by the same reference numerals, and the details thereof are omitted and only differences between the different embodiments .

2 is a schematic view of a chip package circuit board module according to another embodiment of the present invention; 2, the main difference between the chip package circuit module 100a of FIG. 2 and the chip package circuit module 100 of FIG. 1 is that the first pad 112a and the second pad 115a ) Are different in shape and arrangement position. Similarly, in the chip package circuit board module 100a of the present embodiment, the first pad 112a of the circuit board 110 has a width P1 larger than twice the width W1 of the original chip 120 And the second pad 115a employs a width P2 larger than twice the width W1 of the original chip 120 and the original chip 120 can not operate. It is not necessary to disassemble the replacement chip 130 with the first pad 112a and the second pad 115a so long as the first pad 112a and the second pad 115a hold sufficient widths P1 and P2, 115a to replace and operate the original chip 120. The shapes and arrangement positions of the first pad 112a and the second pad 115a are not limited thereto.

3 is a schematic view of a chip package circuit board module according to another embodiment of the present invention; 3, three sets of the first pad 212 and the second pad 215 located at the upper, lower and middle portions are shown, and the chip package circuit module 200 The first difference between chip package circuit board modules 100 is that in this embodiment each first pad 212 includes a plurality of first branch portions 213 connected to each other, (215) includes a plurality of second branch portions (216) connected to each other. The total width of the first pad 212 is the sum of the width B1 of the first branch 213 and the total width of the second pad 215 is the sum of the width B2 of the second branch 216 to be. The width B1 of each first branch 213 and the width B2 of each second branch 216 are greater than or equal to the width W1 of the original chip 120, Is equal to or greater than the width W2.

More specifically, in the three sets of first pads 212 of FIG. 3, each first pad 212 includes two first branches 213 connected to each other, and each second pad 212 215 includes two second branches 216 connected to each other. The position where the original chip 120 is connected to the first pad 212 is one of the first branch portions 213 and the position where the original chip 120 is connected to the second pad 215 is the second branch portion It is not necessary to disassemble the original chip 120 when the original chip 120 can not operate, but the replacement chip 130 may be replaced with another first branch 213 and another second branch 213. In this case, (216). Of course, the number of the first branch portions 213 of each first pad 212 is not limited to two, and the number of the second branch portions 216 of each second pad 215 is not limited to two The number of first branch portions 213 of each first pad 212 and the number of second branch portions 216 of each second pad 215 may be three or more in another embodiment, This is determined by the space on the circuit board 110 and the number of replacement chips 130 to be maintained.

4 is a schematic view of a chip package circuit board module according to another embodiment of the present invention. 4, the configuration of the first pad 212a and the second pad 215a of the chip package circuit board module 200a of FIG. 4 is the same as that of the first pad 212a of the chip package circuit module 100a of FIG. 112a and the second pad 115a. The main difference between the chip package circuit module 200a of FIG. 4 and the chip package circuit module 100a of FIG. 2 is that the second pad 215a includes a plurality of second branch portions 216a connected to each other The original chip 120 is connected to the first pad 212a and the position where the original chip 120 is connected to the second pad 215a is one of the second branch portions 216a and the second pad 215a Is the total of the width B2 of the second branch portion 216a. Likewise, when the original chip 120 can not operate, it is not necessary to disassemble the original chip 120, but the alternative chip 130 may be connected directly to the first pad 212a and the other second branch 216a And the replacement chip 130 can operate by replacing the original chip 120.

3, the first pad 212a does not have any branch portion, and in the other embodiment, the first package substrate 200a is not provided with any branch portion, A combination in which one pad 212 has a first branch 213 similar to the embodiment of Fig. 3 and the second pad 115a does not have any branch similar to the embodiment of Fig. 2 may be employed, The first pad 212a and the second pad 215a may be formed so that the entire width of the first pad 212a is greater than twice the width W1 of the original chip 120, Is greater than twice the width W1 of the original chip 120 and the first and second pads 212a and 215a are suitable for connecting the original chip 120 and the replacement chip 130, It is not limited to one explanation.

In summary, in the chip package circuit board module according to the present invention, the entire width P1 of the first pad of the circuit board is designed to be larger than twice the width W1 of the original chip, Is designed to be larger than twice the width W1 of the original chip, the replacement chip can be arranged next to the original chip so that the first pad and the second pad can be connected. That is, the first pad and the second pad maintain a width for connecting the replacement chip, respectively. In this way, since it is not necessary to disassemble the original chip at the time of rework, the rework work procedure can be effectively simplified.

It will be apparent to those skilled in the art that various modifications and variations can be made in the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, this invention is intended to cover modifications and variations of the present invention within the scope of the following claims and their equivalents.

Claims (8)

A first pad; And
A circuit board disposed next to the first pad and including a second pad spaced from the first pad,
A chip package circuit board module comprising an original chip connected to a first pad and a second pad, the module comprising:
Wherein the width of the original chip is W1, the overall width of the first pad is P1, the overall width of the second pad is P2, the overall width of the first pad is the width W1 of the original chip, And the overall width (P2) of the second pad is greater than twice the width (W1) of the original chip. The method according to claim 1,
Wherein a total width (P1) of the first pad and a total width (P2) of the second pad are 2.1 to 2.5 times the width (W1) of the original chip, respectively. The method according to claim 1,
Further comprising N alternative chips connected to the first pad and the second pad in parallel with the original chip, wherein N > = 1, the width of each of the alternative chips being W2, (W2 + D) and P2 > = W1 + N (W2 + D). The method of claim 3,
Wherein an interval (D) between the original chip and the latest flash replacement chip is 0.1 to 0.5 times the width (W1) of the original chip. The method according to claim 1,
The first pad includes a plurality of first branch portions connected to each other, and the second pad includes a plurality of second branch portions connected to each other, and a position where the original chip is connected to the first pad, Wherein a position at which the original chip is connected to the second pad is one of the second branch portions, the entire width (P1) of the first pad is a total of the widths of the first branch portions, Wherein a total width (P2) of the pad is a sum of the widths of the second branch portions. 6. The method of claim 5,
Further comprising a replacement chip coupled to the other of the first branch and to the other of the second branch. The method according to claim 1,
Wherein the second pad comprises a plurality of second branches connected to each other, a position where the original chip is connected to the second pad is one of the second branches, and an overall width (P2) Chip package circuit board module that is the sum of the widths of the two branches. 8. The method of claim 7,
Further comprising a replacement chip coupled to the other of the first pad and the second branch.

Images