KR20170135099A - Fingerprint sensing apparatus and electric device including the apparatus - Google Patents

Abstract

The present invention provides a fingerprint sensing device having an excellent response property and improved reliability and an electronic device including the same. According to an embodiment of the present invention, the fingerprint sensing device comprises: a base substrate; a fingerprint sensor part located on the base substrate; an upper adhesive part located on the fingerprint sensor part; and a function layer located on the adhesive part.

Description

Technical Field [0001] The present invention relates to a fingerprint sensing apparatus and an electronic apparatus including the fingerprint sensing apparatus.

The embodiment relates to a fingerprint sensing device and an electronic device including the fingerprint sensing device.

Fingerprint sensing technology is widely used in biometrics or authentication processes. For example, a fingerprint sensor (or a fingerprint recognition sensor) included in a fingerprint sensing device used in an electronic device such as a smartphone is used to detect fingerprints of a person. A fingerprint sensing device including such a fingerprint sensor generally includes a substrate (not shown), a sensing portion (not shown), and a functional layer (not shown). Here, the functional layer may include a color layer (not shown) and a protective layer (not shown) sequentially disposed on the sensing portion.

The color layer used for matching the structure and color of the fingerprint sensing device mounted on the electronic device with the parts around the fingerprint sensing device can achieve a desired color only when a certain thickness is secured. That is, if the thickness of the color layer coating is not sufficiently thick, it may be difficult to realize a desired color, and if the thickness of the protective layer coating is not sufficiently thick, physical damage such as surface scratches and scratches may occur. Such physical damage may affect the sensed image, which may reduce the sensed sensitivity of the fingerprint sensing device or prevent the device from functioning properly.

As described above, when the thickness of the functional layer is thickened in order to prevent the desired color and physical damage, the response characteristic of the fingerprint sensing device deteriorates.

The embodiment provides a fingerprint sensing device having excellent response characteristics and improved reliability and an electronic device including the fingerprint sensing device.

A fingerprint sensing apparatus according to an embodiment includes a base substrate; A fingerprint sensor unit disposed on the base substrate; An upper adhesive portion disposed on the fingerprint sensor portion; And a functional layer disposed on the upper adhesive portion.

For example, the fingerprint sensor unit may include a fingerprint sensor disposed on the base substrate; And a wire electrically connecting the fingerprint sensor to the base substrate.

For example, the upper adhesive portion may be disposed between the functional layer and the base substrate while surrounding the fingerprint sensor and the wire. Alternatively, the fingerprint sensor unit may further include a molding unit disposed between the upper adhesive unit and the base substrate, and between the upper adhesive unit and the fingerprint sensor while surrounding the fingerprint sensor and the wire.

For example, the fingerprint sensor unit may further include a protective film disposed between the upper surface of the fingerprint sensor and the upper adhesive.

For example, the fingerprint sensor unit may further include a lower adhesive portion disposed between the base substrate and the lower surface of the fingerprint sensor.

For example, the functional layer may include a color layer disposed over the top adhesive portion; Or a protective layer disposed on the color layer.

For example, the thickness of the upper adhesive portion may be between 5 탆 and 20 탆. The upper adhesive portion may have a moisture absorption of 2% or less. Wherein the upper adhesive has a coefficient of thermal expansion below 80 x ^10-6 m / (mK) below the glass transition temperature and a coefficient of thermal expansion (CTE) below 171 x ^10-6 m / (mK) above the glass transition temperature. Coefficient of Thermal Expansion). The upper adhesive portion may have a tensile modulus of 2500 MPa or less at room temperature.

For example, the fingerprint sensor unit may include a sensor substrate having a first surface bonded to the upper adhesive portion and having a second surface facing the base substrate; A fingerprint sensor disposed between the second surface of the sensor substrate and the base substrate; A pad electrically connecting the fingerprint sensor to the second surface of the sensor substrate; And a solder portion disposed between the second surface of the sensor substrate and the base substrate and electrically connecting the sensor substrate and the base substrate to each other.

For example, the fingerprint sensor unit may include a first lower layer disposed to surround a connection portion between the fingerprint sensor and the sensor substrate; And a second lower layer disposed between the second surface of the sensor substrate and the base substrate and disposed to surround the solder portion, the fingerprint sensor, and the first lower layer.

For example, the maximum value of the thickness of the upper adhesive portion located between the upper surface of the fingerprint sensor and the lower surface of the functional layer may be 50 [mu] m.

The electronic device according to another embodiment may include the fingerprint sensing device.

The fingerprint sensing device and the electronic device including the fingerprint sensing device according to the embodiments can enhance the role of the protective layer and the color layer while enhancing the role of the protective layer or color layer while preserving the sensitivity characteristics.

1 is a plan view of an embodiment of an electronic device including a fingerprint sensing device according to an embodiment.
FIG. 2 is a cross-sectional view of the fingerprint sensing device shown in FIG. 1, taken along line I-I '.
FIG. 3 is a cross-sectional view of another embodiment of the fingerprint sensing device shown in FIG. 1 taken along line I-I '.
FIG. 4 is a cross-sectional view of another embodiment of the fingerprint sensing device shown in FIG. 1 taken along line I-I '.
5A to 5D are process sectional views illustrating a method of manufacturing the fingerprint sensing device shown in FIG.
FIGS. 6A to 6C are process sectional views illustrating a method of manufacturing the fingerprint sensing device shown in FIG.
Figs. 7A to 7E show process cross-sectional views for explaining a manufacturing method of the fingerprint sensing device shown in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to facilitate understanding of the present invention. However, the embodiments according to the present invention can be modified into various other forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the invention are provided to more fully describe the present invention to those skilled in the art.

In the description of the present embodiment, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) on or under includes both the two elements being directly in contact with each other or one or more other elements being indirectly formed between the two elements.

Also, when expressed as "on" or "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

It is also to be understood that the terms "first" and "second," "upper / upper / upper," and "lower / lower / lower" But may be used to distinguish one entity or element from another entity or element, without necessarily requiring or implying an order.

Hereinafter, a fingerprint sensing apparatus 200, 200A, 200B, 200C according to an embodiment and an electronic apparatus 1000 including the apparatus 200, 200A, 200B, 200C will be described with reference to the accompanying drawings . For convenience, the fingerprint sensing devices 200, 200A, 200B, 2000C and the electronic device 1000 including the fingerprint sensing devices (x-axis, y-axis, and z-axis) are described using the Cartesian coordinate system Of course it is. In the Cartesian coordinate system, the x-axis, the y-axis and the z-axis are orthogonal to each other, but the embodiment is not limited to this. That is, the x-axis, the y-axis, and the z-axis may not intersect at right angles with each other.

The fingerprint sensing devices 200, 200A, 200B and 200C described below include fingerprint sensors 235 and 243 and include a functional layer 250 on the upper surface of the fingerprint sensors 235 and 243, Any device including top adhesive portions 260A, 260B, and 260C between the layer 250 and the base substrates 210A and 210B may be applicable. Although the fingerprint sensing devices 200, 200A, 200B, and 200C are described as sensing the fingerprint of the user's finger, the fingerprint sensing device 200 may sense the touch of the stylus pen instead of the fingerprint of the user, It does not.

Also, the fingerprint sensing devices 200, 200A, 200B, and 200C can be applied to various electronic devices. For example, the fingerprint sensing devices 200, 200A, 200B, and 200C may be used in fields requiring user authentication. When user authentication is required, for example, unlocking, acknowledging online transactions, non-repudiation, access to device systems and services including websites and email, passwords and PINs Physical access such as door locks, various proofs in time and attendance management systems, finger-based input devices / navigation for mobile phones and gaming, or the use of finger-based shortcuts . As described above, the fingerprint sensing devices 200, 200A, 200B and 200C can be used in various fields such as user authentication, registration, payment or security.

The electronic devices including the fingerprint sensing devices 200, 200A, 200B, and 200C that can be applied to various fields as described above include, for example, a mobile phone, a smart phone, a personal digital assistant (PDA), a portable multimedia player Such as a portable multimedia player (PMP), a notebook computer or a tablet personal computer (PC), but the embodiment is not limited to a specific electronic device.

The fingerprint sensing devices 200, 200A, 200B, and 200C according to the embodiments may be included in the electronic device 1000 by being packaged or modularized, But is not limited to the specific form included in the device 1000. [

In order to facilitate understanding of the fingerprint sensing devices 200, 200A, 200B, and 200C according to the embodiments, an electronic device 1000 as shown in FIG. 1 will be described as an example, but the embodiments are not limited thereto . In other words, the fingerprint sensing devices 200, 200A, 200B, and 200C according to the embodiments may be included in various electronic devices other than the electronic device 1000 shown in FIG.

1 shows a top view of an embodiment of an electronic device 1000 including a fingerprint sensing device 200 according to an embodiment.

Referring to FIG. 1, an electronic device 1000 according to an embodiment may include a cover glass 100, a fingerprint sensing device 200, and a display unit 300.

The cover glass 100 protects the display unit 300 and can be disposed on the front surface of the electronic device 1000. The display unit 300 may serve as a touch screen.

The fingerprint sensing device 200 can sense the fingerprint of the user, sense the motion of the user's finger, or sense the touch of the stylus to manipulate the pointer. In the case of FIG. 1, the fingerprint sensing device 200 is illustrated as being disposed below the display unit 300 in the electronic device 1000, but the embodiment is not limited thereto. 1, the fingerprint sensing device 200 may be disposed on the upper side or the side of the display unit 300. In addition, That is, the embodiment is not limited to the position where the fingerprint sensing device 200 is disposed in the electronic device 1000.

FIG. 2 is a cross-sectional view of the fingerprint sensing device 200 shown in FIG. 1 taken along line I-I ', FIG. 3 is a cross-sectional view of the fingerprint sensing device 200 shown in FIG. FIG. 4 is a cross-sectional view taken along line I-I 'of FIG. 1, and FIG. 4 is a cross-sectional view of another embodiment 200B taken along line I-I' Sectional view taken along line 200C of Fig.

The fingerprint sensing devices 200A, 200B and 200C shown in FIGS. 2 to 4 include base substrates 210A and 210B, fingerprint sensor units 230A and 230B and 240, a functional layer 250 and upper adhesive portions 260A and 260B , 260C).

The fingerprint sensing device 200B shown in FIG. 3 is the same as the fingerprint sensing device 200A shown in FIG. 2 except that the shape of the fingerprint sensor 230A shown in FIG. 2 and the shape of the upper adhesive portion 260A are different. can do. The fingerprint sensing device 200C shown in FIG. 4 is different from the fingerprint sensor 240 in the configuration of the base substrate 210B and the fingerprint sensor 240, Are the same as the fingerprint sensing devices 200A and 200B.

The base substrates 210A and 210B may be a printed circuit board (PCB), for example a flexible PCB or a rigid PCB having a flexible characteristic as a whole, but the embodiments are not limited thereto.

The base boards 210A and 210B may serve to connect or communicate the fingerprint sensor units 230A, 230B, and 240 with external devices. In addition, the base boards 210A and 210B can perform the role of driving the fingerprint sensor units 230A, 230B and 240. Accordingly, the base boards 210A and 210B may be electrically connected to the fingerprint sensor units 230A, 230B, and 240 to transmit the electrical signals and information related thereto to the fingerprint sensor units 230A, 230B, and 240. [

2 and 3, the fingerprint sensor units 230A and 230B may be electrically connected by the base substrate 210A and the guard 239, but embodiments are not limited thereto Do not. That is, without using the wire 239, the fingerprint sensor units 230A and 230B can be electrically connected to the base substrate 210A in various ways. According to another embodiment, the fingerprint sensor unit 240 may be electrically connected to the base substrate 210B by a solder portion 247 as shown in FIG. The embodiment is not limited to a specific form in which the fingerprint sensor units 230A, 230B, and 240 and the base substrates 210A and 210B are electrically connected to each other.

Further, although not shown, a lead frame (not shown) may be further disposed below the base substrates 210A and 210B. The lead frame may be attached to the bottom of the base boards 210A and 210B based on Surface Mounting Technology (SMT).

Meanwhile, the fingerprint sensor units 230A, 230B, and 240 are disposed on the base substrates 210A and 210B in the form of a semiconductor chip to sense fingerprints. For example, as shown in FIGS. 2 and 3, the fingerprint sensor units 230A and 230B may be disposed on the base substrate 210A by Surface Mount Technology (SMT).

In addition, the fingerprint sensor units 230A, 230B, and 240 may include fingerprint sensors 235 and 243 having sensing areas in which pixels are arrayed. The fingerprint sensor units 230A, 230B and 240 can find the difference in capacitance due to the difference in height according to the shapes of ridges and valleys of the fingerprint fingerprint. For this purpose, So that a fingerprint image can be generated. For example, the fingerprint sensor units 230A, 230B, and 240 may read a fingerprint image by sensing a fingerprint image, and then integrate the fingerprint image into a single image to implement a complete fingerprint image.

In addition, the fingerprint sensor units 230A, 230B, and 240 may previously store information about feature points of the fingerprint (e.g., the fingerprint fragments such as the Y point) in advance and store the feature points acquired from the fingerprint image It is possible to detect whether or not the fingerprint matches with the stored information.

In addition, the fingerprint sensor units 230A, 230B, and 240 can track not only the function of fingerprint detection but also the existence of a finger or the movement of a finger, thereby moving a pointer such as a cursor, You can get it.

The fingerprint sensor units 230A, 230B, and 240 may include a driving electrode (not shown) for sending a driving signal toward the fingerprint of the user and a receiving electrode (not shown) for receiving a signal through the fingerprint of the user . The driving electrode is made of a conductive polymer, and can be realized in various shapes and colors while achieving a role of sending driving signals.

The embodiment is not limited to the method of sensing fingerprints in the fingerprint sensor units 230A, 230B, and 240. [ That is, the fingerprint sensor units 230A, 230B, and 240 may be classified into an ultrasonic system, an infrared system, or an electrostatic capacity type fingerprint sensor.

Further, the embodiment is not limited to the specific structure of the fingerprint sensor units 230A, 230B, and 240. [ An exemplary configuration of the fingerprint sensor units 230A, 230B, and 240 will be described below.

2, the fingerprint sensor portion 230A includes a molding portion 231, a lower adhesive portion 233, a fingerprint sensor 235, a protective film 237, and a wire 239 can do.

The lower adhesive portion 233 may be disposed between the lower surface 235B of the fingerprint sensor 235 and the base substrate 210A. The lower adhesive portion 233 may be an epoxy adhesive for adhering and fixing the fingerprint sensor 235 to the base substrate 210A. However, the embodiment is not limited to this. That is, according to another embodiment, the fingerprint sensor portion 230A may not include the lower adhesive portion 233. In this case, for example, the fingerprint sensor 235 and the base substrate 210A may be coupled to each other It may be concluded.

The fingerprint sensor 235 may be disposed on the base substrate 210A to receive signals from the user's fingerprint and may include pixels arranged in an array form. The fingerprint sensor 235 can detect the difference in capacitance due to the height difference according to the shape of the peak of the finger of the user and the difference in height according to the shape of the mountain and receives the difference of the electric signal of the fingerprint as the finger moves. Electrode and a receiving electrode. Further, the fingerprint sensor 235 serves to sense and process the fingerprint image, and may be an integrated IC.

The protective film 237 may be disposed between the upper surface 235T of the fingerprint sensor 235 and the upper adhesive portion 260A to serve to protect the fingerprint sensor 235 from external moisture.

For example, when the fingerprint sensor portion 230A includes the molding portion 231, the protective film 237 may contact the upper surface 235T of the fingerprint sensor 235 and the molding portion 231 As shown in FIG.

The first thickness T1 of the protective film 237 may be 0 탆 to 10 탆, but the embodiment is not limited to the specific first thickness T1 of the protective film 237. Here, when the first thickness T1 of the protective film 237 is 0 占 퐉, it means that the protective film 237 can be omitted. For example, the protective film 237 may be formed by coating a material such as polyimide or by laminating the film, but the embodiment is not limited to the specific material and shape of the protective film 237.

The wire 239 may serve to electrically connect the fingerprint sensor 235 to the base substrate 210A. For example, the wire 239 may comprise gold (Au).

2, the molding unit 231 may be disposed on the base substrate 210A while enclosing the fingerprint sensor 235 and the wire 239. In addition,

That is, the molding part 231 is disposed between the base substrate 210A and the upper adhesive part 260A, and may be disposed between the upper surface 235T of the fingerprint sensor 235 and the upper adhesive part 260A. 2, the maximum value of the second thickness T2 of the molding portion 231 disposed between the upper surface of the protective film 237 and the upper adhesive portion 260A may be 50 μm, It is not limited. If the protective film 237 is omitted, the second thickness T2 corresponds to the distance between the upper surface 235T of the fingerprint sensor 235 and the upper adhesive portion 260A.

The molding part 231 may be made of injection molding or mold. The molding part 231 may be implemented using a liquid polymer. For example, the molding part 231 may include at least one of an epoxy mold compound (EMC), an epoxy resin, a putty, or a polyphthalamide (PPA) resin. In order to reduce or eliminate the plastic shrinkage upon thermal curing when manufacturing the molding part 231, the molding part 231 may include silica gel. The EMC used as the molding part 231 is harder than the PC series formed by the general injection so that the tolerance can be prevented in advance and the flatness can be further improved and the chip exhibited in the general injection even after the high- The chip mark can be reduced. The molding part 231 may contribute to enhance the reliability of the fingerprint sensor part 230A by closely contacting the fingerprint sensor part 230A to the bottom surface of the base substrate 210A.

3, the fingerprint sensor portion 230B may include a lower adhesive portion 233, a fingerprint sensor 235, a protective film 237, and a wire 239. As shown in FIG. Since the fingerprint sensor unit 230B shown in FIG. 3 is the same as the fingerprint sensor unit 230A shown in FIG. 2, except that the molding unit 231 is not included, the same reference numerals are used, Description will be omitted. In addition, the description of the protective film 237 described below can also be applied to the protective film 237 shown in Fig.

The fingerprint sensor unit 230B may not include the molding unit 231 as shown in FIG. This is because the upper adhesive portion 260B can perform the role of the molding portion 231 instead. In this case, the protective film 237 may be disposed between the upper surface 235T of the fingerprint sensor 235 and the upper adhesive portion 260B.

Alternatively, the protective film 237 may be omitted in the fingerprint sensor units 230A and 230B shown in FIGS. 2 and 3, respectively. This is because the upper adhesive portion 260B can perform the role of the protective film 237 as described later. Here, the upper adhesive portion 260B, which replaces the role of the molding portion 231, will be described later.

4, the fingerprint sensor unit 240 includes a sensor substrate 241, a fingerprint sensor 243, a pad 245, a solder portion 247, (Or an underfill layer 248, 249).

The sensor substrate 241 may include first and second surfaces 241A and 241B. The first surface 241A of the sensor substrate 241 corresponds to the surface bonded to the upper adhesive portion 260C and the second surface 241B of the sensor substrate 241 corresponds to the surface opposite to the first surface 241A, Corresponds to the surface facing the substrate 210B. For example, the sensor substrate 241 may be a PCB, but embodiments are not limited thereto.

The sensor substrate 241 may include a driving electrode and a receiving electrode, which receive the difference between the peak of the fingerprint of the user and the electric signal of the peak, but the embodiment is not limited thereto. That is, the driving electrode and the receiving electrode may not necessarily be included in the sensor substrate 241 at the same time.

The fingerprint sensor 243 is disposed between the second surface 241B of the sensor substrate 241 and the base substrate 210B to sense and process the fingerprint image and may be an integrated IC.

The fingerprint sensor 235 of the fingerprint sensor units 230A and 230B shown in FIGS. 2 and 3 can perform both the functions of the sensor substrate 241 and the fingerprint sensor 243 shown in FIG. On the other hand, the sensor substrate 241 and the fingerprint sensor 243 shown in Fig. 4 can perform the roles of the fingerprint sensor 235 shown in Figs. 2 and 3 in a shared manner. Accordingly, the fingerprint sensing devices 200A and 200B shown in FIGS. 2 and 3 may be referred to as an 'integrated fingerprint sensing device', and the fingerprint sensing device 200C shown in FIG. 4 may be referred to as a 'removable fingerprint sensing device' .

The pad 245 serves to electrically connect the fingerprint sensor 243 to the second surface 241B of the sensor substrate 241. [ To this end, the pad 245 may be disposed between the fingerprint sensor 243 and the second surface 241B of the sensor substrate 241. The pad 245 may be embodied as a conductive material, and the embodiment is not limited to a particular material of the pad 245.

The solder portion 247 is disposed between the second surface 241B of the sensor substrate 241 and the base substrate 210B and functions to electrically connect the sensor substrate 241 and the base substrate 210B . Thus, the solder portion 247 may be embodied as a conductive material, and embodiments are not limited to the specific material of the solder portion 247.

The first lower layer 248 may be disposed around the connection portion between the fingerprint sensor 243 and the sensor substrate 241. Thus, the pad 245 may be enclosed by the first lower layer 248 and protected from the outside.

The second lower layer 249 is disposed between the second surface 241A of the sensor substrate 241 and the base substrate 210B and surrounds the solder portion 247, the fingerprint sensor 243 and the first lower layer 248 .

The materials of the first and second lower layers 248 and 249 may be the same or different. Each of the first and second bottom layers 248 and 249 may be fabricated by curing the liquid phase EMC, but the embodiment is not limited to any particular material of the first and second bottom layers 248 and 249, respectively. Also, at least one of the first or second lower layers 248, 249 may be omitted.

The upper adhesive portions 260A, 260B and 260C may be disposed on the fingerprint sensor portions 230A and 230B and the functional layer 250 may be disposed on the upper adhesive portions 260A, 260B and 260C.

3 and 4, the functional layer 250 is bonded to the molding portion 231 by the upper adhesive portion 260A by the upper adhesive portions 260B and 260C, And can be adhered to the portions 230B and 240. [

Before describing the upper adhesive portions 260A, 260B and 260C, the functional layer 250 will be described as follows.

The functional layer 250 may include at least one of a color layer 254 or a protective layer 256. 2 to 4, the functional layer 250 may include both a color layer 254 and a protective layer 256, and may be formed of a color layer (not shown) Only the protective layer 254 or only the protective layer 256 may be included.

The color layer 254 may be disposed on the upper adhesive portions 260A, 260B, and 260C. The color layer 254 may be disposed between the protective layer 256 and the top adhering portions 230A, 230B, 240 if the functional layer 250 includes both the color layer 254 and the protective layer 256 .

The color layer 254 serves to match or approximate the hue of the fingerprint sensing devices 200A, 200B, 200C with the periphery of the sensors 200A, 200B, 200C. For example, referring to FIG. 2, since the color of the molding part 231 is usually black, the color layer 254 may play a role of reproducing a separate color in order to conceal it.

The color layer 254 may comprise a pigment and a color pigment that have been ground with a nanomolecule. The nano-molecular-weight paint constituting the color layer 254 may be a silicone-based material, but the embodiment is not limited thereto. The color layer 254 can be colored by incorporating nano-molecular-weight paints and nano-sized color pigments and coloring them. Here, the color pigments may include at least one of titanium oxide (TiO ₂ ) or nickel oxide (NiO ₂ ), but the embodiment is not limited thereto. The color pigment 254 can be appropriately selected according to the color to be implemented.

If the third thickness T3 of the color layer 254 is less than 10 mu m, it may not be possible to block the color of the underlying member or it may be difficult to realize the desired color. Alternatively, if the third thickness T3 of the color layer 254 is greater than 20 mu m, the response characteristics of the fingerprint sensor units 230A, 230B, and 240 may deteriorate to affect the sensing performance. Thus, the third thickness T3 of the color layer 254 may be between 10 microns and 20 microns, although embodiments are not limited in this respect.

The protective layer 256 may be disposed over the color layer 254 and serve to protect the color layer 254 if the functional layer 250 includes both the color layer 254 and the protective layer 256 . Alternatively, when the functional layer 250 does not include the color layer 254, the protective layer 256 is disposed on the upper adhesive portions 260A, 260B, and 260C to protect the upper adhesive portions 260A, 260B, and 260C Can be performed.

In addition, the protective layer 256 may be formed in various shapes depending on the texture to be implemented. For example, the protective layer 256 may be patterned with a hairline. The hair lines may be in the form of thin solid lines and may be patterned at regular intervals. In addition, the protective layer 256 may have various patterns.

In addition, the protective layer 256 may be formed of glass or ceramic, or may be in the form of a hard-coated film. When the protective layer 256 is coated, a separate material may be added to provide a texture such as a pearl material.

The protective layer may be formed using an ultraviolet (UV) curing coating. UV curing paints are not thermally cured but are cured by UV. They consist of resin or oligomer as main skeleton resin, UV curable monomer (mainly acrylic), photoinitiator and other additives. Here, the photoinitiator takes a role of converting ultraviolet light into a state capable of polymerization. When pigments are added, most of them are transparent because they are difficult to pass through UV. When pigments are added, they are limited to very thin coatings. UV curing paints are cured in a short time, which is economical in all respects and enables low temperature curing. In addition, since the UV curing paint is adjusted at a temperature higher by about 10 ° C than the room temperature, it is suitable for a product with low heat, has a high hardness and excellent friction resistance. UV curing paints are available in both solvent-free and solvent-free form and are suitable for flat coatings due to their high gloss.

If the fourth thickness T4 of the protective layer 256 is less than 30 mu m, the surface of the color layer 254 (or the top adhesive layer 260A, 260B, 260C when the color layer 254 is omitted) It can not be protected and can break or scratch. Alternatively, when the fourth thickness T4 of the protective layer 256 is larger than 100 mu m, the response characteristic may be deteriorated and affect the sensing performance. Therefore, the fourth thickness T4 of the protective layer 256 may be 30 [mu] m to 100 [mu] m, but the embodiment is not limited thereto.

Further, the functional layer 250 may have a coated form, but the embodiment is not limited to a specific form of the functional layer.

Hereinafter, the upper adhesive portions 260A, 260B and 260C according to the embodiments shown in FIGS. 2 to 4 will be described with reference to the accompanying drawings.

When the functional layer 250 includes only the color layer 254 or both the color layer 254 and the protection layer 256, the upper adhesive portions 260A, 260B, (230A, 230B, 240).

Alternatively, when the functional layer 250 does not include the color layer 254 but includes only the protective layer 256, the upper adhesive portions 260A, 260B, and 260C may include the protective layer 256 and the fingerprint sensor portions 230A and 230B , 240).

The upper adhesive portions 260A, 260B, and 260C perform various functions as described below, and may have characteristics for performing respective functions. The upper adhesive portions 260A, 260B and 260C described below can have high adhesion, low thermal stress, low warpage characteristics, low moisture absorption, low coefficient of thermal expansion (CTE) have.

The upper adhesive portion 260A adheres the functional layer 250 to the molding portion 231 as shown in Figure 2 or the upper adhesive portions 260B and 260C attach the functional layer 250 to the molding portion 231 as shown in Figures 3 and 4 The fingerprint sensor units 230B and 240 may be bonded to each other. Thus, the functional layer 250 can be stably applied to the upper portions of the fingerprint sensor portions 230A, 230B, and 240 by performing the adhesive function of the upper adhesive portions 260A, 260B, and 260C.

Also, the upper adhesive portions 260A and 260B may perform the role of the protective film 237 shown in FIGS. In this case, the protective film 237 can be omitted as described above. The upper adhesive portions 260A and 260B may have a moisture absorption of not more than 2% in order to perform the role of the protective film 237 that protects the fingerprint sensor 235 from moisture, The embodiment is not limited to this.

Also, the upper adhesive portion 260B may perform the role of the molding portion 231 as shown in FIG. In this case, the fingerprint sensor unit 230B may not include the molding unit 231 as shown in FIG. The upper adhesive portion 260B may be disposed between the functional layer 250 and the base substrate 210A while covering the fingerprint sensor 235 and the wire 239. [ 3, the maximum value of the fifth thickness T5 of the upper adhesive portion 260B disposed between the upper surface of the protective film 237 and the functional layer 250 may be 50 μm, Is not limited to this. 3, if the protective film 237 is omitted, the fifth thickness T5 corresponds to the distance from the upper surface 235T of the fingerprint sensor 235 to the lower surface 250B of the functional layer 250 can do.

Also, the upper adhesive portions 260A, 260B, and 260C may include a reflective material or reflective particles. For example, the upper adhesive portions 260A, 260B, and 260C may be embodied with nanomolecule-coated paints and silver (Ag) particles. In this case, the upper adhesive portions 260A, 260B, and 260C can reflect light from the upper portions of the fingerprint sensor portions 230A, 230B, and 240 to prevent the colors of the fingerprint sensor portions 230A, 230B, have. For example, referring to FIG. 2, the upper adhesive portion 260A may prevent the hue of the molding portion 231 from being exposed to the outside. As described above, the upper adhesive portion 260A can improve the hiding power against the molding portion 231. [ In addition, the upper adhesive portion 260A can prevent the chip mark, which may be occasionally generated due to the tolerance of the mold metal or the like, from being visually displayed at the time of manufacturing the molding portion 231, can do.

The sixth thickness T6 of the upper adhesive portions 260A and 260C may be 5 mu m to 20 mu m, but the embodiments are not limited thereto.

The upper adhesive portions 260A, 260B and 260C have a glass transition temperature Tg of less than (or less than) 80 x ^10-6 m / (mK) or less, for example, 61 x ^10-6 m / (CTE) of less than or equal to 171 x ^10-6 m / (mK), for example, 157 x ^10-6 m / (mK) when the thermal expansion coefficient (CTE) But the embodiment is not limited thereto.

The upper adhesive portions 260A, 260B and 260C may have a tensile modulus of 2500 MPa or less, for example, 875 MPa or less at room temperature (25 DEG C), but the embodiments are not limited thereto.

Meanwhile, in the above-described fingerprint sensing devices 200A, 200B, and 200C, a portion to which a fingerprint is touched may have a concave shape similar to the shape of a finger. As described above, in the case of having a concave shape, the area of the fingerprint and the area to be touched is widened, so that a large amount of data for the fingerprint image can be obtained. For example, when the functional layer 250 is omitted, the upper bonding portion 260A and the molding portion 231 shown in FIG. 2, or the upper face of the upper bonding portion 260B shown in FIG. 3, The upper adhesive portion 260C and the upper portion of the sensor substrate 241 may have a concave shape so that the area of contact with the finger is widened. Or the functional layer 250 and the upper adhesive portion 260A or 260B or 260C or the functional layer 250 and the upper adhesive portion 260A only when the functional layer 250 is omitted, And the molding part 231 or both the functional layer 250, the upper adhesive part 260C and the sensor substrate 241 may have a concave shape. However, the embodiment is not limited to the specific cross-sectional shape of the functional layer 250, the molding portion 231, the upper adhesive portions 260A, 260B, 260C, and the sensor substrate 241. [

Hereinafter, the fingerprint sensing apparatus according to the comparative example and the embodiment will be described as follows.

Unlike the fingerprint sensing devices 200A, 200B and 200C according to the embodiment, the fingerprint sensing device (not shown) according to the comparative example does not include the upper adhesive portions 260A, 260B and 260C. Except for this, it is assumed that the fingerprint sensing device according to the comparative example is the same as the fingerprint sensing devices 200A, 200B and 200C according to the embodiment. That is, the fingerprint sensing device according to the comparative example corresponds to the case where the upper adhesive portions 260A, 260B, and 260C are omitted in FIGS. 2 to 4. Therefore, the fingerprint sensing device according to the comparative example is not shown in FIGS. 4.

In the case of the fingerprint sensing device according to the comparative example, since the upper adhesive portions 200A, 200B and 200C are not disposed, when the second thickness T2 shown in FIG. 2 is 50 μm or less, the fingerprint sensor portion 230A is not sufficiently protected The reliability can be deteriorated by exposing the wire 239. If it is larger than 100 mu m, the response characteristic may be deteriorated and the sensing performance may deteriorate. Therefore, in the case of the fingerprint sensing device according to the comparative example, the second thickness T2 shown in FIG. 2 is 50 占 퐉 to 100 占 퐉. On the other hand, in the case of the fingerprint sensing device 200A according to the embodiment, the maximum value of the second thickness T2 is 50 mu m which is much thinner than the second thickness T2 of the fingerprint sensing device according to the comparative example. This is because the upper adhesive portion 260A is present. Therefore, the first total distance TT1 from the surface 250T of the fingerprint sensor 250 to the upper surface 235T of the fingerprint sensor 235 is reduced, so that the response characteristic is improved and the sensing performance can be improved .

3, the second total distance TT2 shown in FIG. 3 is smaller than the first total distance TT2 shown in FIG. 2, Can be reduced by a sixth thickness T6 than the first thickness TT1. Since the second total distance TT2 from the upper surface 250T of the functional layer 250 to which the fingerprint is touched to the upper surface 235T of the fingerprint sensor 235 is further reduced, The sensing performance can be further improved.

2 and 3, when the upper adhesive portions 260A and 260B perform the role of the protective film 237, the first and second total distances TT1 and TT2 shown in FIGS. 2 and 3, TT1) is further reduced by the first thickness T1, so that the sensing performance can be further improved.

4, the functional layer 250 may be detached from the sensor substrate 241 when the upper adhesive portion 260C is not disposed, whereas the fingerprint sensing device 200C according to the embodiment may include the upper adhesive portion 260C, It is possible to prevent the functional layer 250 from being separated by bonding the functional layer 250 and the sensor substrate 241 to each other.

The first and second total distances TT1 and TT2 may be equal to or greater than the first thickness T1 and the sixth thickness T5 or between the first thickness T1 and the sixth thickness 6, Can be reduced by the total sum. At this time, if the fourth thickness T4 of the protective layer 256 is increased as the first and second total distances TT1 and TT2 are decreased, it is possible to prevent the protective layer 256 from being damaged due to physical damage such as surface scratches, The role of the color layer 254 or the protective layer 256 for protecting the upper adhesive portions 260A and 260B is enhanced to improve reliability and can be ensured without deteriorating the sensitivity characteristic. Or increasing the third thickness T3 of the color layer 254 as the first and second total distances TT1 and TT2 are decreased results in the role of the color layer 254, It is ensured that the colors of the members disposed at the lower portion of the fingerprint sensing devices 200A and 200B are not visible from the outside so that the colors of the parts around the fingerprint sensing devices 200A and 200B can match the colors of the fingerprint sensing devices 200A and 200B. In other words, compared with the fingerprint sensing device according to the comparative example, the first and second total distances TT1 and TT2 are not increased in the case of the fingerprint sensing devices 200A and 200B according to the embodiment, The function of at least one of the color layer 254 or the protective layer 256 can be further increased.

Hereinafter, a manufacturing method of each of the fingerprint sensing devices 200A, 200B, 200C shown in FIGS. 2 to 4 will be described with reference to the accompanying drawings.

5A to 5D are process sectional views illustrating a method of manufacturing the fingerprint sensing device 200A shown in FIG.

Referring to FIG. 5A, some members of the fingerprint sensor unit 230A are formed on the base substrate 210A. Specifically, the fingerprint sensor 235 can be fixed to the base substrate 210A by using the lower adhesive portion 233. FIG. The lower adhesive portion 233 may be an epoxy adhesive, but the embodiment is not limited to the specific material of the lower adhesive portion 233.

The fingerprint sensor 235 may be formed on the base substrate 210A in the form of a semiconductor chip. Then, the protective film 237 can be formed on the fingerprint sensor 235. The formation of the protective film 237 may be omitted. Then, the fingerprint sensor 235 and the base substrate 210A are electrically connected to each other by a wire 239. [

At this time, the protective film 237 may be formed after the wire 239 is formed, and the formation of the protective film 237 may be omitted as described above.

5B, the molding unit 231 is formed on the base substrate 210A while the fingerprint sensor 235 and the wire 239 are enclosed. The molding part 231 may be made of injection molding or mold. The molding part 231 may be formed using a liquid polymer. For example, the molding part 231 may be formed using at least one of an epoxy mold compound (EMC), an epoxy resin, a putty, or a PPA resin. In order to reduce or eliminate the plastic shrinkage upon thermal curing when manufacturing the molding part 231, the molding part 231 may include silica gel.

Referring to FIG. 5C, an upper adhesive portion 260A is formed on the molding portion 231. FIG. The upper adhesive portion 260A may be formed of a material having high adhesion, low thermal stress, low warpage characteristics, low moisture absorption, low coefficient of thermal expansion (CTE), and the like. For example, the upper adhesive portion 260A may be formed of a material having the following characteristics, but the embodiment is not limited thereto.

The upper adhesive portion 260A may have a moisture absorption of 2% or less and may have a water absorption of less than 80 x ^10-6 m / (mK), for example, 61 x ^10-6 m / (mK) (CTE) of less than or equal to 171 x ^10-6 m / (mK), for example, of 157 x ^10-6 m / (mK) when having a thermal expansion coefficient of less than or equal to Tg . In addition, the upper adhesive portion 260A may have a tensile modulus of 2500 MPa or less, for example, 875 MPa or less at room temperature (25 DEG C).

Then, as shown in FIG. 5D, the functional layer 250 may be formed on the upper adhesive portion 260A. Specifically, a color layer 254 may be formed on the upper adhesive portion 260A, and a protective layer 256 may be formed on the color layer 254. [ The coating of the functional layer 250 may be realized by a method such as painting and printing, but the embodiment is not limited to the specific method of forming the functional layer 250.

According to the embodiment, the protective layer 256 can be formed in a thermosetting manner using a heat drying type paint (or a baking dry type paint) or a urethane paint.

6A to 6C are process sectional views illustrating a method of manufacturing the fingerprint sensing device 200B shown in FIG.

Referring to FIG. 6A, some members of the fingerprint sensor unit 230B are formed on the base substrate 210A. Since this is the same as the process shown in FIG. 5A, the description of FIG. 5A will be omitted, and redundant description will be omitted.

6B, an upper adhesive portion 260B is formed on the upper portion of the base substrate 210A while the fingerprint sensor 235 and the wire 239 are wrapped. That is, the upper adhesive portion 260B is formed in the space where the molding portion 231 shown in FIG. 5B is formed. Since the upper adhesive portion 260B shown in FIG. 6B is different from the upper adhesive portion 260A shown in FIG. 5C only in terms of the characteristics, the contents of the upper adhesive portion 260A mentioned in the description of FIG. And can be applied to the illustrated upper adhesive portion 260B.

Referring to FIG. 6C, the functional layer 250 is formed on the upper adhesive portion 260B. This is the same as the process shown in FIG. 5D, so that the description of the functional layer 250 will be omitted with reference to FIG. 5D, and redundant description will be omitted.

Figs. 7A to 7E show process cross-sectional views for explaining a manufacturing method of the fingerprint sensing device 200C shown in Fig.

Referring to FIG. 7A, a fingerprint sensor 243 is formed on the second surface 241B of the sensor substrate 241. FIG. At this time, a pad 245 for electrically connecting the fingerprint sensor 243 to the second surface 241B of the sensor substrate 241 may be formed between the sensor substrate 241 and the fingerprint sensor 243. The fingerprint sensor 243 may be formed on the sensor substrate 241 in the form of a semiconductor chip. Thereafter, a first lower layer 248 is formed at a connection portion between the fingerprint sensor 243 and the sensor substrate 241.

7A, the second surface 241B of the sensor substrate 241 is electrically connected to the base substrate 210B by using a solder portion 247 as shown in FIG. 7B . For example, the solder portion 247 may be formed on the base substrate 210B using SMT.

7C, a second bottom layer 249 is formed to surround the first bottom layer 248, the fingerprint sensor 243, and the solder portion 247 between the sensor substrate 241 and the base substrate 210B. do.

Each of the first and second lower layers 248 and 249 may be made by curing a liquid phase EMC. Also, the first and second lower layers 248 and 249 may be formed of different materials or the same material.

7D, an upper adhesive portion 260C is formed on the first surface 241A of the sensor substrate 241. Then, as shown in FIG. Here, the method of forming the upper adhesive portion 260C is the same as the forming method of the upper adhesive layer 260A shown in FIG. 5C, and therefore, a duplicate description will be omitted.

Referring to FIG. 7E, the functional layer 250 is formed on the upper adhesive portion 260C. Here, since the formation of the functional layer 250 is the same as the formation of the functional layer 250 shown in FIG. 5D, the duplicated description will be omitted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: cover glass 200, 200A, 200B, 200C: fingerprint sensing device
210A, 210B: base substrate 230A, 230B, 240: fingerprint sensor unit
231: Molding part 233: Lower adhesive part
235, 243: fingerprint sensor 237: protective film
239: wire 241: sensor substrate
245: Pad 247: Solder part
248, 249: lower layer 250: functional layer
254: color layer 256: protective layer
260A, 260B, and 260C:
300: display unit 1000: electronic device

Claims (15)

A base substrate;
A fingerprint sensor unit disposed on the base substrate;
An upper adhesive portion disposed on the fingerprint sensor portion; And
And a functional layer disposed on the upper adhesive portion. The apparatus of claim 1, wherein the fingerprint sensor unit
A fingerprint sensor disposed on the base substrate; And
And a wire electrically connecting the fingerprint sensor to the base substrate. 3. The apparatus of claim 2, wherein the upper adhesive portion
Wherein the fingerprint sensor is disposed between the functional layer and the base substrate while surrounding the fingerprint sensor and the wire. The fingerprint sensor according to claim 2, wherein the fingerprint sensor unit
And a molding unit disposed between the upper adhesive unit and the base substrate and between the upper adhesive unit and the fingerprint sensor while surrounding the fingerprint sensor and the wire. 5. The fingerprint sensor according to claim 3 or 4, wherein the fingerprint sensor unit
And a protective film disposed between the upper surface of the fingerprint sensor and the upper adhesive portion. The fingerprint sensor according to claim 2, wherein the fingerprint sensor unit
And a lower adhesive portion disposed between the base substrate and the lower surface of the fingerprint sensor. 2. The device according to claim 1, wherein the functional layer
A color layer disposed on the upper adhesive portion; or
And a protective layer disposed over the color layer. The fingerprint sensing device according to claim 1, wherein the thickness of the upper adhesive portion is 5 占 퐉 to 20 占 퐉. The fingerprint sensing device of claim 1, wherein the upper adhesive portion has a moisture absorption of 2% or less. The method of claim 1, wherein the upper adhesive has a coefficient of thermal expansion below 80 x ^10-6 m / (mK) below the glass transition temperature and below 171 x ^10-6 m / (mK) above the glass transition temperature. A fingerprint sensing device having a coefficient of thermal expansion (CTE). The fingerprint sensing device of claim 1, wherein the upper adhesive portion has a tensile modulus of 2500 MPa or less at room temperature. The apparatus of claim 1, wherein the fingerprint sensor unit
A sensor substrate having a first surface bonded to the upper adhesive portion and having a second surface facing the base substrate;
A fingerprint sensor disposed between the second surface of the sensor substrate and the base substrate;
A pad electrically connecting the fingerprint sensor to the second surface of the sensor substrate; And
And a solder portion disposed between the second surface of the sensor substrate and the base substrate and electrically connecting the sensor substrate and the base substrate to each other. 13. The fingerprint sensor according to claim 12, wherein the fingerprint sensor unit
A first lower layer disposed around the connection portion between the fingerprint sensor and the sensor substrate; And
And a second lower layer disposed between the second surface of the sensor substrate and the base substrate and disposed to surround the solder portion, the fingerprint sensor, and the first underlayer. The fingerprint sensing device according to claim 3, wherein the maximum value of the thickness of the upper adhesive portion located between the upper surface of the fingerprint sensor and the lower surface of the functional layer is 50 占 퐉. An electronic device comprising the fingerprint sensing device according to any one of claims 1 to 14.

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