KR20170112370A - Electrophoresis display apparatus and method of fabricating the same - Google Patents

Abstract

An electrophoretic display device and a method of manufacturing the same according to an embodiment of the present invention are disclosed. Wherein the electrophoretic display device includes a first base substrate on which a display region and an edge region surrounding the display region are defined, a plurality of pixel electrodes arranged on the display region of the first base substrate, A second base substrate, a common electrode on the second base substrate, an area corresponding to the display area of the common electrode, and a display layer between the pixel electrodes, the edge of the common electrode, A contact portion disposed between the region corresponding to the region and the connection electrode, and a peeling layer between the contact portion and the common electrode.

Description

[0001] Electrophoresis display apparatus and method for fabricating the same [0002]

The present invention relates to an electrophoretic display device and a method of manufacturing the same.

The electrophoretic display device displays an image using a display layer that displays different colors according to an electric field applied between the pixel electrode and the common electrode. The electrophoretic display device includes a lower substrate on which pixel electrodes are formed, an upper substrate on which a common electrode is formed, and a display layer between the lower substrate and the upper substrate. In order to form an electric field between the pixel electrode and the common electrode, the common electrode must be electrically connected to the connection electrode of the lower substrate and sealed to protect the display layer sensitive to moisture or contamination.

In order to electrically connect the common electrode of the upper substrate and the connection electrode of the lower substrate, an opening for exposing the common electrode must be formed. For this, the display layer and the adhesive layer must be removed. During the removal process, the microcapsules may be destroyed, and the dispersion solvent or particles may contaminate the peripheral display layer or adhere to the common electrode surface, resulting in poor contact. In addition, there is a problem that it is not easy to remove only a part of the area due to the adhesive force of the adhesive layer. Further, since the display layer exists outside the opening portion, an encapsulating layer should be formed on the side surface in order to protect the display layer. As a result, there is a problem that the manufacturing process is increased and the total volume is increased.

An object of the present invention is to provide an electrophoretic display device in which a display layer is formed only in a display area and a method of manufacturing the same.

An electrophoretic display device according to an aspect of the present invention includes a first base substrate on which a display region and an edge region surrounding the display region are defined, a plurality of pixel electrodes arranged on the display region of the first base substrate, A second base substrate, a common electrode on the second base substrate, a region corresponding to the display region of the common electrode, and a display layer between the pixel electrodes, the common electrode being disposed on the edge region of the first base substrate, A contact portion disposed between the connection electrode and a region corresponding to the edge region of the common electrode; and a peeling layer between the contact portion and the common electrode.

The adhesive force between the display layer and the peeling layer may be weaker than the adhesive force between the display layer and the common electrode.

The peeling layer may have conductivity to electrically connect the contact portion to the common electrode.

The connection electrode may be arranged to surround the pixel electrodes on the edge region of the first base substrate.

Wherein the electrophoretic display device includes a plurality of connection pads disposed on the first base substrate and a plurality of connection pads disposed on the first base substrate and electrically connecting the plurality of connection pads to the connection electrodes and the pixel electrodes, As shown in FIG.

A reference voltage may be applied to the connection electrode through the connection pads, and independent voltages may be applied to the pixel electrodes.

The electrophoretic display device may further include an adhesive layer between the display layer and the pixel electrodes.

The electrophoretic display device may further include a sealing portion surrounding the outer periphery of the contact portion between the first base substrate and the second base substrate.

The contact portion may include a sealing member sealing the display layer and conductive particles in the sealing member.

The display layer may include a dispersion solvent and first particles charged in the dispersion solvent and charged in a first polarity so as to move in the direction of an electric field applied.

The display layer may include microcapsules each containing the dispersion solvent and the first particles in a capsule form and displaying different colors depending on at least one of the direction and intensity of the applied electric field.

According to an aspect of the present invention, a plurality of pixel electrodes are formed on a display region of a first base substrate, and a connection electrode is formed on an edge region surrounding the display region. A common electrode is formed on the second base substrate. And a peeling layer is formed on the first region corresponding to the edge region of the common electrode. And a display layer and an adhesive layer are formed on a second region corresponding to the display region of the common electrode. A contact portion is formed on the release layer. The pixel electrodes are bonded to the adhesive layer so that the connection electrode and the contact portion are electrically connected to each other.

The display layer is formed only on the second region of the common electrode which is not covered by the release layer due to the surface repulsion between the release layer and the display layer in the step of forming the display layer and the adhesive layer . The adhesive layer may be formed on the display layer so that the release layer is exposed.

In the step of forming the adhesive layer, a release film having the adhesive layer on one surface thereof may be adhered on the display layer so that the display layer and the adhesive layer are in contact with each other. The release film can be peeled off. A portion of the adhesive layer which is not in contact with the display layer due to the empty space on the release layer may be removed together with the release film when the release film is peeled off.

The connection electrode may be arranged to surround the pixel electrodes on the edge region of the first base substrate.

The peeling layer may have conductivity to electrically connect the contact portion and the common electrode to each other.

A sealing portion surrounding the outer periphery of the contact portion may be formed between the first base substrate and the second base substrate.

Wherein the contact portion includes a sealing member for sealing the display layer and conductive particles in the sealing member.

According to another aspect of the present invention, there is provided a method of manufacturing an electrophoretic display device, comprising: forming a first base substrate, a plurality of pixel electrodes on a display region of the first base substrate, A lower substrate including a connection electrode on an edge region is prepared. A common electrode is formed on a second base substrate on which a first region and second regions existing in an island form in the first region are defined. And a peeling layer is formed on the first region of the common electrode. And a display layer is formed on the second region of the common electrode. The peeling layer and the second base substrate on which the display layer is formed are cut along the cut line in the first region to prepare an upper substrate. A contact portion is formed on the release layer of the upper substrate. The lower substrate and the upper substrate are bonded so that the connection electrode and the contact portion are electrically connected to each other.

An adhesive layer for bonding the lower substrate and the upper substrate may be formed on the display layer. Wherein the upper substrate corresponds to the display region on the second base substrate, the common electrode on the second base substrate, the display region of the common electrode on the display region, the adhesive layer, and the edge region of the common electrode And a release layer on the region where the film is formed.

In the electrophoretic display device of the present invention, since the display layer is partially formed only on the display region where the pixel electrodes are arranged using the separation layer, it is easy to form the contact portion connecting the connection electrode and the common electrode. In addition, since it is not necessary to remove a part of the display layer, the microcapsules are destroyed and contamination by the dispersion solvents in the microcapsules does not occur. In addition, since the sealing layer can be formed between the first base substrate and the second base substrate, the width of the edge region can be reduced. Therefore, the process becomes simple, so that the manufacturing time and the manufacturing cost can be reduced, and the defect rate can be reduced.

Figure 1 shows a schematic top view of an electrophoretic display device.
2 is a cross-sectional view of an electrophoretic display device according to an embodiment of the present invention.
3 is a cross-sectional view of an exemplary enlarged view of the display layer of FIG.
Fig. 4 is a cross-sectional view of another example in which the display layer of Fig. 2 is enlarged.
FIGS. 5 to 11 are cross-sectional views of the electrophoretic display device according to the second embodiment of the present invention.
12 is a plan view for explaining another method of manufacturing the electrophoretic display device 100 shown in FIG.
13 is a cross-sectional view of an electrophoretic display device according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the following embodiments. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an," and "the" include plural forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, regions and / or regions, it should be understood that these elements, components, regions, layers and / Do. These terms are not intended to be in any particular order, up or down, or top-down, and are used only to distinguish one member, region or region from another member, region or region. Thus, the first member, region or region described below may refer to a second member, region or region without departing from the teachings of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the present invention should not be construed as limited to any particular shape of the regions illustrated herein, including, for example, variations in shape resulting from manufacturing.

Figure 1 shows a schematic top view of an electrophoretic display device. 2 is a cross-sectional view of an electrophoretic display device according to an embodiment of the present invention. The sectional view of FIG. 2 is taken along the perforated line (II-II) of FIG.

1 and 2, the electrophoretic display device 100 includes a first base substrate 110 on which an edge region ER surrounding a display region DR and a display region DR is defined, A plurality of pixel electrodes 124 arranged on the display region DR of the substrate 110, a connection electrode 122 arranged in the edge region ER of the first base substrate 110, A common electrode 140 on the second base substrate 130 and a display region 150 between the pixel electrodes 124 and a region corresponding to the display region DR of the common electrode 140, A contact portion 180 disposed between the region corresponding to the edge region ER of the contact portion 180 and the connection electrode 122 and a peeling layer 170 between the contact portion 180 and the common electrode 140 . The electrophoretic display device 100 may further include a sealing portion 190 surrounding the outer portion of the contact portion 180 between the first base substrate 110 and the second base substrate 130. The edge region ER may include a contact region CR and a sealing region SR. The contact region CR is a region where the contact portion 180 is formed, and may be located between the display region DR and the sealing region SR. The sealing region SR is a region in which the sealing portion 190 is formed and can be positioned so as to surround the display region DR and the contact region CR.

The first base substrate 110 may be a substrate made of various materials such as plastic, metal, and the like. For example, the first base substrate 110 may be made of an insulating organic material, and may be formed of a material such as polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI), polyetherimide (PEN), polyethyelenene napthalate (PEN), polyethyeleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC) or the like, but the present invention is not limited thereto. As another example, the first base substrate 110 may comprise a metal foil comprising a metal such as silver, aluminum, or a plastic film coated with a metal layer.

The first base substrate 110 may be a flexible substrate that can be bent, warped, or curled. According to another example, the first base substrate 110 may be a rigid substrate made of phenol-based or epoxy-based synthetic resin.

The electrode layer 120 including the connection electrode 122 and the pixel electrodes 124 may be disposed on the first surface of the first base substrate 110. The electrode layer 120 includes a connection electrode 122 and pixel electrodes 124 which are spaced apart from each other. The pixel electrodes 124 are disposed on the display region DR and the connection electrode 122 is disposed on the edge region ER and specifically on the contact region CR.

The connection electrode 122 is disposed on the contact region CR of the first base substrate 110 and may be disposed so as to surround the pixel electrodes 124. [ The connection electrode 122 is electrically connected to the common electrode 140 through the contact portion 180 and can transmit the reference voltage to the common electrode 140. The connection electrode 122 is isolated from the pixel electrodes 124. [

The pixel electrodes 124 are arranged on the display area DR of the first base substrate 110 with various plan shapes according to the design of the designer. The pixel electrodes 124 may have different planar shapes and sizes depending on the design. The pixel electrodes 124 are disposed apart from each other on the first surface of the first base substrate 110. The same voltage is applied to some of the pixel electrodes 124 in order that the display layer 150 on some of the pixel electrodes 124 of the pixel electrodes 124 displays the same color according to the design, And the pixel electrodes 124 may be electrically connected to each other through wirings formed on the first base substrate 110.

The connection electrode 122 and the pixel electrodes 124 may be formed of a single layer structure of copper, aluminum, indium tin oxide (ITO), indium zinc oxide (IZO), or a single layer structure of copper, aluminum, ITO, or IZO Layer structure in which a second material layer such as nickel or gold is further laminated on the first material layer,

The pad portion 101 and the wirings 103 including the connection pads 102 may be disposed on the first base substrate 110 as shown in FIG. The connection pads 102 may be connected to the connection electrode 122 and the pixel electrodes 124 via wirings 103, respectively. A reference voltage may be applied to the connection electrode 122 through the connection pads 102 and independent voltages may be applied to the respective pixel electrodes 124. [ For this, the number of the connection pads 102 may be greater than the number of the pixel electrodes 124 at least.

When the connection electrodes 122 and the pixel electrodes 124 are disposed on the first surface of the first base substrate 110, the wirings 103 are formed on the first surface of the first base substrate 110 And may be arranged on the second side. According to another example, the wirings 103 may be disposed inside the first base substrate 110. The wirings 103 may be electrically connected through the via plug formed along the through hole passing through the connection electrode 122 and the pixel electrodes 124 and the first base substrate 110.

The connection pads 102 may be disposed on the first surface of the first base substrate 110 together with the connection electrodes 122 and the pixel electrodes 124. [ According to another example, the connection pads 102 are disposed on the second side of the first base substrate 110, and the driving chip for driving the electrophoretic display device 100 is connected to the connection pads 102 As shown in FIG.

The first base substrate 110, the connection electrode 122, the pixel electrodes 124, the connection pads 102 and the wirings 103 may constitute a lower substrate . The lower substrate may be a printed circuit board. For example, after a through hole is formed in the first base substrate 110, a conductive material such as metal is plated, and then the connection electrode 122, the pixel electrode 124, And the wirings 103 and 103 may be formed on the first base substrate 110. According to another example, the connection electrode 122, the pixel electrode 124, the connection pads 102 and the wirings 103 are formed on the first base substrate 110 in a printing manner and the first base substrate 110, A through hole is formed in a place where electrical connection is required, and then a through hole is filled with a conductive material, so that a lower substrate can be formed. Such a lower substrate may be formed using a roll-to-roll process. The connection electrode 122, the pixel electrode 124, the connection pads 102 and the wirings 103 are formed by laminating a conductive material layer and an insulating material layer on the first base substrate 110 according to a predetermined order And may not be formed by a semiconductor process technology for forming a conductive pattern and an insulating pattern through a photolithographic process and an etching process. Therefore, an active switching device using a semiconductor material, for example, a thin film transistor, may not be directly formed on the first base substrate 110.

The second base substrate 130 may be a transparent transparent material having a high transmittance and may be a film formed of a material having a high transmittance of 80% or more. For example, the second base substrate 130 may be a transparent polymer film having excellent light transmittance, such as a polyether sulfone (PES), a polyacrylate (PAR), a polyetherimide (PEI), a polyetherimide (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC), cellulose triacetate Acetate (TAC) or the like, but is not limited thereto.

The common electrode 140 may be disposed entirely on the second base substrate 130 and is electrically connected to the connection electrode 122 through the contact portion 180. When the electrophoretic display device 100 is operated, a reference voltage is applied to the common electrode 140. The common electrode 140 may be formed of a transparent conductive material such as ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), AZO (aluminum zinc oxide) and a transparent conductive oxide (ITO). The common electrode 140 may be formed entirely on the second base substrate 130 through a sputtering process. According to another example, the common electrode 140 may be formed entirely on the second base substrate 130 through a coating process or a plating process.

The display layer 150 is positioned between the common electrode 140 and the pixel electrodes 124 on the display region DR and is not disposed on the edge region ER. The display layer 150 may display different colors depending on the direction of the electric field generated by the common electrode 140 and the pixel electrodes 124. [ The display layer 150 may include a dispersion solvent and first particles dispersed in a dispersion solvent. The first particles may be charged with a first polarity to move in the direction of the applied electric field. The color of the dispersing solvent and the color of the first particle may be different. According to another example, the display layer 150 may further include second particles charged in a dispersion solvent and charged with a second polarity opposite in polarity to the first polarity. In this case, the first particles and the second particles may have different colors from each other. The dispersing solvent may be transparent or may be a different color than the colors of the first and second particles.

According to one example, the display layer 150 may comprise microcapsules comprising a dispersion solvent and first particles. The display layer 150 may further include a binder to fix the microcapsules on the common electrode 140. According to another example, the display layer 150 may have a mesh-shaped partition formed on the common electrode 140 so that the first particles do not coalesce with each other. The dispersion solvent and the first particles may be partitioned by the partition walls.

According to one example, the display layer 150 may display two colors depending on the direction of the electric field. For example, when a positive voltage higher than the reference voltage is applied to the pixel electrode 124, a first color is displayed, and when a negative voltage lower than the reference voltage is applied to the pixel electrode 124, have. In this case, when a reference voltage is applied to the pixel electrode 124 or the pixel electrode 124 and the common electrode 140 are floated, the previous color can be displayed as it is. According to another example, the display layer 150 may display three or more colors depending on the direction and intensity of the electric field. For example, when a positive voltage is applied to the pixel electrode 124, a first color is displayed. When a negative voltage is applied, a second color is displayed. When a reference voltage is applied, a third color is displayed.

A portion of the display layer 150 located on each pixel electrode 124 may display the same color depending on the voltage applied to the pixel electrode 124. [ That is, the first portion of the display layer 150 positioned on the first pixel electrode 124 to which a positive voltage is applied displays a first color, and the second portion of the display layer 150 on the second pixel electrode 124 to which a negative voltage is applied The second portion of the indicating layer 150 that is positioned may display the second color. For example, when the first pixel electrode 124 has a planar shape corresponding to a subject and the second pixel electrode 124 has a planar shape corresponding to the background, the first and second pixel electrodes 124 By applying a voltage, the subject and the background can be distinguished from each other by making the color of the background different from that of the subject.

The display layer 150 will be described in more detail below with reference to FIGS. 3 and 4. FIG.

The adhesive layer 160 may be disposed on the display layer 150 to bond the display layer 150 and the pixel electrodes 124. [ The adhesive layer 160 may be adhered to the upper surface of the first base substrate 110 under the pixel electrodes 124 under pressure. The adhesive layer 160 may be formed using Pressure Sensitive Adhesive (PSA). The pressure-sensitive adhesive can use a material that does not require a change in the optical properties of the constituent members and does not require a high-temperature process during curing and drying at the time of adhesion treatment. For example, the adhesive layer 160 may be made of an appropriate polymer such as an acrylic polymer, a silicone polymer, polyester, polyurethane, polyether, or synthetic rubber. The adhesive layer 160 can be melted by heat, and if it is melted by heat, it can have adhesiveness. The adhesive layer 160 can be cured by energy (e.g., heat or UV, etc.). According to another example, the adhesive layer 160 may not be cured according to the design.

The contact portion 180 is disposed between the connection electrode 122 and the region corresponding to the contact region CR of the common electrode 140 to provide an electrical connection path between the connection electrode 122 and the common electrode 140 . The contact portion 180 may have a shape of a partition wall surrounding the outer surface of the display layer 150. The contact portion 180 may be formed of a liquid conductive material having a high viscosity. For example, the contact portion 180 may be formed using a silver paste, a carbon paste, or an electrically conductive liquid phase OCA (optically clear adhesive). According to another example, the contact portion 180 may be formed of a conductive adhesive film.

According to another example, the contact portion 180 may be formed of a metal. The contact portion 180 may include conductive particles distributed in the synthetic resin. The conductive particles may physically contact each other to provide an electrical path between the connecting electrode 122 and the common electrode 140. The conductive particles may be made of a metal such as copper, silver, aluminum, and the like, and may have a diameter of several tens to several hundreds of microns. The conductive particles can be formed by coating a core material with a conductive material such as gold or silver.

The peeling layer 170 is disposed between the contact portion 180 and the common electrode 140. The peeling layer 170 may be disposed on a region corresponding to the edge region ER of the common electrode 140. [ In this case, the display layer 150 is disposed on the region corresponding to the display region DR of the common electrode 140, and the peeling layer 170 is formed on the region corresponding to the edge region ER of the common electrode 140 .

The material of the release layer 170 may have a surface repulsive force with the substance of the display layer 150. That is, the adhesive force between the peeling layer 170 and the display layer 150 may be weaker than the adhesive force between the common electrode 140 and the display layer 150. The display layer 150 is formed only on the region corresponding to the display region DR of the common electrode 140 not covered with the peeling layer 170 and may not be formed on the peeling layer 170. [ Also, the adhesive layer 160 may be formed only on the display layer 150. Accordingly, the display layer 150 and the adhesive layer 160 may not be present on the peeling layer 170. Therefore, in order to form the contact portion 180 and the sealing portion 190, it is not necessary to separately remove the display layer 150 and a part of the adhesive layer 160.

The contact portion 180 may be formed directly on the release layer 170. [ The contact portion 180 may be electrically connected to the common electrode 140 through the peeling layer 170. To this end, the release layer 170 may comprise a transparent metal filler to have conductivity. Examples of the transparent metal filler include inorganic salts such as lithium chloride and magnesium chloride, silicon compounds such as chlorosilane, hydrolysis products of silicon tetrachloride, metal oxide powders, glass beads surface-treated with indium oxide (tin) . The content of the transparent metal filler in the release layer 170 may be 5 [wt%] to 50 [wt%] (weight percentage). According to another example, the release layer 170 may have a very thin thickness so as not to have insulating properties.

The contact portion 180 can directly contact the common electrode 140 through the peeling layer 170. [ The release layer 170 may have a soft characteristic such that the shape changes when the pressure is applied. The contact portion 180 may be in contact with the common electrode 140 through the peeling layer 170 under pressure from the outside.

The sealing portion 190 may be disposed between the first base substrate 110 and the second base substrate 130 so as to surround the outer portion of the contact portion 180. The sealing portion 190 can function as a main blocking film for preventing deformation of the display portion 150 from external oxygen and impurities such as moisture. According to one embodiment, the seal 190 may comprise a photo-curable material that can be cured by irradiating light. The seal 190 may comprise a mixture of an organic material and a photocurable material. The sealing portion 190 can be formed by irradiating ultraviolet (UV) light, laser light, visible light, or the like and curing it. Examples of the photocurable material included in the sealing portion 190 include epoxy acrylate based resin, polyester acrylate based resin, urethane acrylate based resin, polybutadiene acrylate a polybutadiene acrylate resin, a silicon acrylate resin, an alkyl acrylate resin, and the like. According to another embodiment, the sealing portion 190 may be composed of a frit or the like.

Since the sealing portion 190 is disposed between the first base substrate 110 and the second base substrate 130, a separate sealing process may not be performed on the side surface of the second base substrate 130. Therefore, the area of the electrophoretic display device 100 may be substantially the same as the area of the second base substrate 130.

3 is a cross-sectional view of an exemplary enlarged view of the display layer of FIG.

Referring to FIG. 3, the display layer 150 may include microcapsules 151, and the microcapsules 151 may be fixed by a binder 154.

In the microcapsule 151, a dispersion solvent 152 and first particles 153 may be included. Although the microcapsules 151 are shown as being arranged in a single layer in Fig. 3, they may be arranged in a plurality of layers. Although the microcapsules 151 are all shown to have the same size, they may have different sizes depending on the manufacturing process. According to one example, the microcapsules 151 may be of a soft type that can be deformed by external pressure. According to another example, the microcapsules 151 may be of a hard type whose shape is not deformed.

The first particles 153 are dispersed in the dispersion solvent 152. The first particles 153 can be charged with a first polarity (e.g., (+) polarity) or a second polarity (e.g., (-) polarity) so that they can move along the direction of the applied electric field. The first particles 153 may be organic or inorganic compounds and may absorb light or scatter light. The first particles 153 may be reflective materials such as metal particles. The first particles 153 may have a first color, and the first color may be selected from among various colors, for example, white, black, red, blue, or yellow.

The dispersion solvent 152 is a solvent that allows the first particles 153 to disperse and flow, and includes water, methanol, ethanol, propanol, butanol, propylene But are not limited to, propylene carbonate, toluene, benzene, hexane, chloroform, isoparaffin oil, silicone oil, ester oil, , Dimethicone, cetyl octanoate, dicaprylate, isopropyl myristate, tocophenol acetate, and the like. The dispersion solvent 152 may include a fluorescent material, a phosphorescent material, a light emitting material, or the like, or may include a color-changing material (for example, a sion pigment material, a sion dye material, etc.) whose color characteristic changes as energy is applied have.

The binder 154 may comprise an at least partially transparent material in the visible region of 380 nm to 750 nm. The binder 154 may include at least one transparent polymeric material selected from the group consisting of an acrylic polymer, a silicone polymer, an ester polymer, a urethane polymer, an amide polymer, an ether polymer, a fluorine polymer and rubber. In addition, the binder 350 may include a fluorescent material, a phosphorescent material, a light emitting material, or the like (for example, a zeotropic pigment material, a zeotropic dye material, or the like) whose color characteristics change as energy is applied. The binder 350 may be in a cured state.

When the first particles 153 are charged with the first polarity (+), when the positive voltage is applied to the pixel electrode 124, the first particles 153 move toward the common electrode 140 . Since the first particles 153 move toward the common electrode 140 in the microcapsule 151, the colors of the first particles 153 are displayed on the outside. In contrast, when a negative voltage is applied to the pixel electrode 124, the first particles 153 move toward the pixel electrode 140, and the color of the dispersion solvent 152 is displayed outside.

Although not shown in FIG. 3, in the microcapsules 151, the second particles 153 having a color different from that of the first particles 153 in addition to the dispersion solvent 152 and the first particles 153 City) may be included. When the first particles 153 have a first color and are charged to the first polarity (+) and the second particles have the second color and are charged to the second polarity (-), The first particles 153 move toward the common electrode 140 and the second particles move toward the pixel electrode 124. As a result, Is displayed. In contrast, when a negative voltage is applied to the pixel electrode 124, the first particles 153 move toward the pixel electrode 140 and the second particles move toward the common electrode 140, A second color of the particles is displayed.

Fig. 4 is a cross-sectional view of another example in which the display layer of Fig. 2 is enlarged.

Referring to FIG. 4, the display layer 150a is disposed between the common electrode 140 and the adhesive layer 160 as shown in FIG. A partition 151a for physically partitioning the dispersion solvent 152a and the first particles 153a may be disposed on the common electrode 140. [ The barrier ribs 151a may be arranged on a plane in a mesh form or a lattice form. The barrier ribs 151a may be formed of a sealing material, for example, an acrylic resin of UV curing type or an epoxy resin of a thermosetting type. The barrier ribs 151a may be formed of a resin such as an organic compound or an inorganic compound, or a combination thereof. The barrier ribs 151a may be formed by a stamper method for imprinting the resin layer after forming the resin layer. According to another example, the partition 151a may be formed using a photolithographic process. For example, after the photosensitive resin layer is coated on the common electrode 140, a light is irradiated to a position where the partition 151a is to be formed or a position to be removed for forming the partition 151a using a photomask, The barrier ribs 151a may be formed through the process. The dispersion solvent 152a and the first particles 153a can be embedded in the space defined by the partition 151a.

The dispersion solvent 152a corresponds to the dispersion solvent 152 in Fig. 3, and the first particles 153a may correspond to the first particles 153 in Fig. Between the barrier ribs 151a, there may be second particles charged with different polarities from the first particles 153a, and the second particles may have a different color from the first particles 153a.

FIGS. 5 to 11 are cross-sectional views of the electrophoretic display device 100 of FIG.

5, a connection electrode 122 is formed on the edge region ER of the first base substrate 110 and a plurality of pixel electrodes (not shown) are formed on the display region DR of the first base substrate 110 124 are formed. The connection electrode 122 and the pixel electrodes 124 are included in the electrode layer 120.

The connection electrode 122 and the pixel electrodes 124 may be formed on the first base substrate 110 by a method of manufacturing a printed circuit board, for example, a printing method. The first base substrate 110 having the connection electrodes 122 and the pixel electrodes 124 may be referred to as a printed circuit board. The connection electrodes 122 and the pixel electrodes 124 are arranged on the first base substrate 110 so as to be spaced apart from each other. The pixel electrodes 124 may be arranged on the display region DR so as to be spaced apart from each other and the connection electrode 122 may be arranged to surround the pixel electrodes 124 on the edge region ER.

A pad portion 101 including connection pads 102 of FIG. 1 may be further formed on the first base substrate 110. The connection pads 102 may include a connection electrode 122 and a pixel electrode 124 (103 in Fig. 1), respectively. The wirings 103 may be located in a different layer from the connection electrode 122 and the pixel electrodes 124. [ For example, the connection electrodes 122 and the pixel electrodes 124 are disposed on the first surface of the first base substrate 110, and the wirings 103 are disposed on the first surface of the first base substrate 110 Plane, or may be disposed inside the first base substrate 110. The first base substrate 110 may be disposed on the second surface. The connection pads 102 may be disposed on the first side of the first base substrate 110 or on the second side.

A through hole is formed in the first base substrate 110 and then a conductive material such as metal is plated and then a portion of the plating layer is removed. The electrodes 124, the connection pads 102, and the wirings 103 may be formed. The first base substrate 110 may be a flexible or rigid substrate of various materials such as plastic, metal, and the like.

Referring to FIG. 6, the common electrode 140 and the peeling layer 170 may be formed on the second base substrate 110. The peeling layer 170 may be disposed on the edge region ER of the common electrode 140. [

The second base substrate 130 may be a transparent transparent material having a high transmittance and may be a film formed of a material having a high transmittance of 80% or more.

The common electrode 140 may be formed of a transparent conductive material over the entire surface of the second base substrate 130. The common electrode 140 may be formed on the second base substrate 130 by a sputtering method. According to another example, the common electrode 140 may be formed on the second base substrate 130 in a coating method or a plating method.

The peeling layer 170 is formed on the edge region ER of the common electrode 140. [ The material of the release layer 170 may have a surface repulsive force with the substance of the display layer 150. According to one example, the release layer 170 may have conductivity. The release layer 170 may include a transparent metal filler to have conductivity. According to another example, the release layer 170 may have soft properties such that the shape changes when the pressure is applied. According to another example, the release layer 170 may have a very thin thickness so as not to have insulating properties. The release layer 170 may be coated or coated only on the edge region ER using a mask disposed on the display region DR. According to another example, the peeling layer 170 may be printed only on the edge area ER in a printing manner.

Referring to FIG. 7, the display layer 150 may be formed on the display region ER of the common electrode 140. Since the material of the peeling layer 170 has a surface repulsive force with the substance of the display layer 150, the display layer 170 is not formed on the peeling layer 170. That is, the display layer 170 may not be formed on the edge region ER. For this, the adhesive force between the peeling layer 170 and the display layer 150 may be weaker than the adhesive force between the common electrode 140 and the display layer 150.

The display layer 150 shown in FIG. 3 is obtained by mixing the binder 154 with the dispersion solvent 152 and the microcapsules 151 containing the first particles 153, and the binder 154 and the microcapsules The paste mixed with the conductive paste 151 is coated on the common electrode 140 and the paste applied on the common electrode 140 is cured by applying heat or UV irradiation to form a paste that is locally coated on the common electrode 140 . The paste may not be applied on the peeling layer 170 due to the surface repulsive force with the peeling layer 170. [ The display layer 150 existing on the peeling layer 170 after the curing is not adhered to the peeling layer 170 and the peeling layer 170 is not adhered to the peeling layer 170 by suction or mechanical vibration, 170).

The coating may be performed by patch die coating, slot or extrusion coating, slide or cascade coating, curtain coating, roll coating, gravure coating, dip coating, spray coating, meniscus coating, spin coating, brush coating, have. Printing can be performed by silk screen printing, electrostatic printing, thermal printing, ink jet printing, or the like.

Referring to FIG. 8, a release film 162 to which an adhesive layer 160 is attached is attached on the display layer 150. The release film 162 may be adhered to the display layer 150 using the adhesive force of the adhesive layer 160a. The adhesive force between the release film 162 and the adhesive layer 160 may be lower than the adhesive force between the adhesive layer 160 and the display layer 150. [ To this end, the release film 162 may be subjected to a surface treatment for lowering the adhesion with the adhesive layer 160.

9, the release film 162 is peeled from the adhesive layer 160 so that only a part of the adhesive layer 160 remains on the display layer 150. As shown in FIG. Due to the adhesive force between the release film 162 and the adhesive layer 160, the rim portion of the adhesive layer 160 located on the edge region ER is torn off when the release film 162 is peeled off. As shown, the rim portion of the adhesive layer 160 is attached to the release film 162 and removed together with the release film 162 when the release film 162 is peeled off. The adhesive layer 160 has adhesiveness and can be cured by heat or UV. According to another example, the adhesive layer 160 does not have adhesiveness at room temperature, and can have adhesiveness after heat is applied.

Referring to FIG. 10, the contact portion 180 may be formed on the peeling layer 170 at a position corresponding to the connection electrode 122. The contact portion 180 may have a shape of a partition wall surrounding the outer surface of the display layer 150. The contact portion 180 may be formed of a liquid conductive material having a high viscosity and may be formed along an outer periphery of the display layer 150 using a syringe. The contact portion 180 may be formed of a conductive adhesive film. The conductive adhesive film may be cut in a quadrangular annular shape corresponding to the connection electrode 122, or may be formed on the release layer 170 after being cut into four straight lines. The contact portion 180 may be pressed to penetrate the flexible peeling layer 180 and directly contact the connection electrode 122. The contact portion 180 may include conductive particles distributed in the synthetic resin and may provide an electrical path due to conductive particles physically contacting each other.

Referring to FIG. 11, the first base substrate 110 is disposed on the second base substrate 130 such that the contact portion 180 and the connection electrode 122 are in contact with each other. The first base substrate 110 is pressed toward the second base substrate 130 so that the connection electrode 122 is electrically connected to the contact unit 180. At this time, the pixel electrodes 124 are bonded to the adhesive layer 160. Depending on the material of the adhesive layer 160, heat may be applied to the adhesive layer 160, or UV may be irradiated. The adhesive layer 160 may be bonded to the first base substrate 110 not covered with the pixel electrodes 124. [

12 is a plan view for explaining another method of manufacturing the electrophoretic display device 100 shown in FIG.

Referring to FIG. 12 together with FIG. 7, the second base substrate 130 includes a first region corresponding to the edge region ER and a second region existing in island form in the first region. And the second area corresponds to the display area DR. As shown in FIG. 7, a common electrode 140 is formed on the entire surface of the second base substrate 130.

The peeling layer 170 is formed on the first region corresponding to the edge region ER. The display layer 150 is formed in an island shape on the second area corresponding to the display area DR. 12, the portion where the release layer 170 is formed corresponds to the first region, and the portion where the display layer 150 is formed corresponds to the second region. The display layer 150 is not formed on the peeling layer 170 due to the surface repulsive force with the peeling layer 170 but only on the common electrode 140 on which the peeling layer 170 is not covered, That is, only on the second region of the common electrode 140.

12, the peeling layer 170 is formed in a lattice form, and the cut line CUT is present along the peeling layer 170. As shown in Fig. When cutting the second base substrate 130 covered with the release layer 170 along the cut line CUT, the upper substrate having the second base substrate 130 having the sectional structure as shown in FIG. 7 is formed do. The upper substrate includes a second base substrate 130, a common electrode 140 on the second base substrate 130, a display layer 150 on a region corresponding to the display region DR of the common electrode 140, And a release layer on the region corresponding to the edge region ER of the protective film 140. Thereafter, the method described above with reference to Figs. 8 to 11 can be performed.

According to another embodiment, the cutting process performed along the cut line CUT may be performed after the adhesive layer 160 is formed on the display layer 150. [ The release film 162 to which the adhesive layer 160 is attached may be adhered to the second base substrate 130 on which the release layer 170 and the display layer 150 are formed. Thereafter, when the release film 162 is peeled off, the portion of the adhesive layer 160 which is not adhered to the display layer 150 is removed together with the release film 162. Then, the second base substrate 130 may be cut along the cut line CUT. An upper substrate may be formed which further includes an adhesive layer 160 on the structure shown in FIG. Thereafter, the method described with reference to Figs. 10 to 11 can be performed.

13 is a cross-sectional view of an electrophoretic display device according to another embodiment of the present invention. The sectional view of FIG. 13 is taken along the perforated line (II-II) of FIG.

1 and 13, the electrophoretic display device 100a includes a first base substrate 110 on which an edge region ER surrounding a display region DR and a display region DR is defined, A plurality of pixel electrodes 124 arranged on the display region DR of the substrate 110, a connection electrode 122 arranged in the edge region ER of the first base substrate 110, A common electrode 140 on the second base substrate 130 and a display region 150 between the pixel electrodes 124 and a region corresponding to the display region DR of the common electrode 140, A contact portion 180a disposed between the region corresponding to the edge region ER of the contact portion 180 and the connection electrode 122 and a peeling layer 170 between the contact portion 180a and the common electrode 140 . The electrophoretic display device 100a is substantially the same as the electrophoretic display device 100 shown in Figs. 1 and 2 except for the contact portion 180a, and the same components are not repeatedly described.

The contact portion 180a is disposed between the edge region ER of the common electrode 140 and the connection electrode 122 to provide an electrical connection path between the connection electrode 122 and the common electrode 140. [ The contact portion 180a has a shape of a partition wall that completely seals the outer periphery of the display layer 150. [

The contact portion 180a includes a sealing member 182a for sealing the display layer 150 and shielding contaminants such as oxygen and moisture from the outside and conductive particles 181a in the sealing member 182a. According to one example, the contact portion 180a may be a frit or sealant comprising conductive balls. The contact portion 180a may be formed of a conductive film having an adhesive force.

The sealing member 182a may comprise a mixture of an organic material and a photocurable material. The sealing member 182a may be formed by irradiating ultraviolet (UV) light, laser light, visible light, or the like and curing it. Examples of the photocurable material included in the sealing member 182a include epoxy acrylate based resin, polyester acrylate based resin, urethane acrylate based resin, polybutadiene acrylate a polybutadiene acrylate resin, a silicon acrylate resin, an alkyl acrylate resin, and the like. According to another embodiment, the sealing member 182a may be composed of a frit or the like.

The conductive particles 181a may be distributed in physical contact with each other within the sealing member 182a. The conductive particles may be made of a spherical metal such as copper, silver, aluminum, etc., and may have a diameter of several tens to several hundreds of microns. The conductive particles can be formed by coating a core material with a conductive material such as gold or silver.

13, the contact portion 180a disposed outside the display portion 150 has a sealing function for protecting the display layer 150 while providing an electrical path between the common electrode 140 and the connection electrode 122 . Therefore, the structure of the electrophoretic display device 100a can be further simplified. The manufacturing process is further simplified, and the production time and the defective ratio can be reduced.

If each step constituting the manufacturing method according to the present invention is not explicitly described or contradicted, each step can be performed in an appropriate order. The present invention is not limited to the above-described embodiments. The use of all examples or exemplary terms (e.g., etc.) in the present invention is for the purpose of describing the present invention only in detail, and is not intended to limit the scope of the present invention by the use of the above examples or exemplary terms, The range is not limited. In addition, those skilled in the art will recognize that design criteria and factors can be modified within the scope of the claims or equivalents thereof.

Accordingly, the spirit of the present invention should not be limited to the above-described embodiments, and all ranges equivalent to or equivalent to the claims of the present invention as well as the claims of the following claims Category.

100, 100a: electrophoretic display device 110: first base substrate
122: connecting electrode 124: pixel electrode
130: second base substrate 140: common electrode
150: Display layer 160: Adhesive layer
170: peeling layer 180, 180a:
181a: sealing member 182a: conductive particle

Claims (20)

A first base substrate on which a display region and an edge region surrounding the display region are defined;
A plurality of pixel electrodes arranged on the display region of the first base substrate;
A connection electrode disposed in the edge region of the first base substrate;
A second base substrate;
A common electrode on the second base substrate;
A display layer between the pixel electrode and a region corresponding to the display region of the common electrode;
A contact portion disposed between the connection electrode and a region corresponding to the edge region of the common electrode; And
And a peeling layer between the contact portion and the common electrode. The method according to claim 1,
Wherein an adhesion force between the display layer and the peeling layer is weaker than an adhesion force between the display layer and the common electrode. The method according to claim 1,
Wherein the peeling layer is electrically conductive to electrically connect the contact portion to the common electrode. The method according to claim 1,
And the connection electrode is arranged to surround the pixel electrodes on the edge region of the first base substrate. The method according to claim 1,
A plurality of connection pads disposed on the first base substrate; And
Further comprising wirings disposed on the first base substrate and connecting the plurality of connection pads to the connection electrode and the pixel electrodes, respectively. 6. The method of claim 5,
Wherein a reference voltage is applied to the connection electrode through the connection pads and independent voltages are applied to the pixel electrodes. The method according to claim 1,
And an adhesive layer between the display layer and the pixel electrodes. The method according to claim 1,
And a sealing portion surrounding the outer periphery of the contact portion between the first base substrate and the second base substrate. The method according to claim 1,
Wherein the contact portion includes a sealing member for sealing the display layer and conductive particles in the sealing member. The method according to claim 1,
Wherein the display layer comprises a dispersion solvent and first particles charged in a first polarity so as to move in the direction of an electric field dispersed and applied in the dispersion solvent. 11. The method of claim 10,
Wherein the display layer includes microcapsules each containing the dispersion solvent and the first particles in a capsule form and displaying different colors according to at least one of the direction and the intensity of the applied electric field. Forming a plurality of pixel electrodes on a display region of the first base substrate and forming connection electrodes on edge regions surrounding the display region;
Forming a common electrode on the second base substrate;
Forming a peeling layer on a first region corresponding to the edge region of the common electrode;
Forming a display layer and an adhesive layer on a second region corresponding to the display region of the common electrode;
Forming a contact portion on the release layer;
And bonding the pixel electrodes to the adhesive layer so that the connection electrode and the contact portion are electrically connected to each other. 13. The method of claim 12,
Wherein the step of forming the display layer and the adhesive layer comprises:
Forming the display layer only on the second region of the common electrode that is not covered by the release layer due to the surface repulsive force between the release layer and the display layer; And
And forming the adhesive layer on the display layer so that the release layer is exposed. 14. The method of claim 13,
The step of forming the adhesive layer
Attaching a release film having the adhesive layer on one surface of the display layer so that the display layer and the adhesive layer are in contact with each other; And
And peeling the release film,
Wherein a portion of the adhesive layer that is not in contact with the display layer due to the void space on the release layer is removed together with the release film when the release film is peeled off. 13. The method of claim 12,
Wherein the connection electrode is arranged to surround the pixel electrodes on the edge region of the first base substrate. 13. The method of claim 12,
Wherein the peeling layer is electrically conductive to electrically connect the contact portion and the common electrode to each other. 13. The method of claim 12,
Further comprising the step of forming a sealing portion between the first base substrate and the second base substrate to surround the outer periphery of the contact portion. 13. The method of claim 12,
Wherein the contact portion includes a sealing member for sealing the display layer and conductive particles in the sealing member. Preparing a lower substrate including a first base substrate, a plurality of pixel electrodes on a display region of the first base substrate, and a connection electrode on an edge region surrounding the display region of the first base substrate;
Forming a common electrode on a second base substrate on which a first region and second regions existing in an island form in the first region are defined;
Forming a peeling layer on the first region of the common electrode;
Forming a display layer on the second region of the common electrode;
Cutting the second base substrate on which the separation layer and the display layer are formed along a cut line in the first region to prepare an upper substrate;
Forming a contact portion on the release layer of the upper substrate; And
And bonding the lower substrate and the upper substrate such that the connection electrode and the contact portion are electrically connected to each other. 20. The method of claim 19,
Further comprising the step of forming an adhesive layer on the display layer to bond the lower substrate and the upper substrate,
The upper substrate
The second base substrate;
The common electrode on the second base substrate;
The display layer and the adhesive layer on the region corresponding to the display region of the common electrode; And
And a peeling layer on a region corresponding to the edge region of the common electrode.

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