KR20170112415A - Display apparatus - Google Patents

Abstract

A display device and a method of manufacturing the same according to an embodiment of the present invention are disclosed. The display device includes a first base substrate, a connection electrode arranged on the first base substrate, a plurality of pixel electrodes, a second base substrate, a common electrode on the base substrate, a display between the pixel electrodes and the common electrode An adhesive layer between the pixel electrodes and the display layer, a contact plug electrically connecting the connection electrode and the common electrode through the display layer and the adhesive layer, and a contact plug electrically connecting the common electrode and the display layer, And a peel pattern that at least partially surrounds the contact plug.

Description

[0001]

The present invention relates to an electrophoretic display device and a method of manufacturing the same.

The electrophoretic display device displays an image using a display layer that displays different colors according to an electric field applied between the pixel electrode and the common electrode. The electrophoretic display device includes a lower substrate on which pixel electrodes are formed, an upper substrate on which a common electrode is formed, and a display layer between the lower substrate and the upper substrate. In order to form an electric field between the pixel electrode and the common electrode, the common electrode must be electrically connected to the connection electrode of the lower substrate.

In order to electrically connect the common electrode of the upper substrate and the connection electrode of the lower substrate, an opening for exposing the common electrode must be formed. For this, the display layer and the adhesive layer must be removed. During the removal process, the microcapsules may be destroyed, and the dispersion solvent or particles may contaminate the peripheral display layer or adhere to the common electrode surface, resulting in poor contact. In addition, there is a problem that it is not easy to remove only a part of the area due to the adhesive force of the adhesive layer.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an electrophoretic display device including a method of forming an opening on an upper substrate exposing a common electrode without contamination at a low cost.

An electrophoretic display device according to an aspect of the present invention includes a first base substrate, a connection electrode arranged on the first base substrate, a plurality of pixel electrodes, a second base substrate, a common electrode on the base substrate, A display layer between the common electrode and the common electrode, a contact plug disposed between the connection electrode and the common electrode through the display layer, and a peeling pattern between the contact plug and the common electrode.

The adhesive force between the display layer and the peeling pattern may be weaker than the adhesive force between the display layer and the common electrode.

The peeling pattern may have conductivity to electrically connect the contact plug to the common electrode.

Wherein the electrophoretic display device includes a plurality of connection pads disposed on the first base substrate and a plurality of connection pads disposed on the first base substrate and electrically connecting the plurality of connection pads to the connection electrodes and the pixel electrodes, As shown in FIG.

A reference voltage may be applied to the connection electrode through the connection pads, and independent voltages may be applied to the pixel electrodes.

The electrophoretic display device may further include an adhesive layer disposed between the display layer and the pixel electrodes to bond the display layer on the pixel electrodes.

The display layer may include a dispersion solvent and first particles charged in the dispersion solvent and charged in a first polarity so as to move in the direction of an electric field applied.

The display layer may include microcapsules each containing the dispersion solvent and the first particles in a capsule form and displaying different colors depending on at least one of the direction and intensity of the applied electric field.

According to the method of manufacturing an electrophoretic display device according to an aspect of the present invention, a connection electrode and a plurality of pixel electrodes are formed on a first base substrate. A common electrode is formed on the second base substrate. And a peeling pattern is formed at a position corresponding to the connection electrode on the common electrode. The display layer and the adhesive layer are formed on a part of the common electrode which is not covered by the peeling pattern. A contact plug is formed on the peeling pattern. The pixel electrodes are bonded to the adhesive layer so that the connection electrode and the contact plug are electrically connected to each other.

The display layer may be formed only on a part of the common electrode which is not covered by the peeling pattern due to the surface repulsion between the peeling pattern and the display layer in the step of forming the display layer and the adhesive layer . The adhesive layer may be formed on the display layer so that the peeling pattern is exposed.

In the step of forming the adhesive layer, a release film having the adhesive layer on one surface thereof may be attached on the display layer so that the display layer and the adhesive layer are in contact with each other. The release film can be peeled off. A portion of the adhesive layer that is not in contact with the display layer due to the space on the peeling pattern may be removed together with the release film when peeling off the release film.

The peeling pattern may have conductivity to electrically connect the contact plug and the common electrode to each other.

According to another aspect of the present invention, there is provided an electrophoretic display device including a first base substrate, a connection electrode arranged on the first base substrate, a plurality of pixel electrodes, a second base substrate, a common electrode on the base substrate, An adhesive layer between the pixel electrodes and the display layer, a contact plug electrically connecting the connection electrode and the common electrode through the display layer and the adhesive layer, and a contact plug electrically connecting the display electrode and the common electrode, And a peeling pattern located between the common electrode and the display layer and at least partially surrounding the contact plug.

The adhesion force between the common electrode and the peeling pattern may be weaker than the adhesion force between the common electrode and the display layer.

The peeling pattern may be penetrated by the contact plug.

Wherein the electrophoretic display device includes a plurality of connection pads disposed on the first base substrate and a plurality of connection pads disposed on the first base substrate and electrically connecting the plurality of connection pads to the connection electrodes and the pixel electrodes, As shown in FIG. A reference voltage may be applied to the connection electrode through the connection pads, and independent voltages may be applied to the pixel electrodes.

The display layer may include a dispersion solvent and first particles charged in the dispersion solvent and charged in a first polarity so as to move in the direction of an electric field applied.

The display layer may include microcapsules each containing the dispersion solvent and the first particles in a capsule form and displaying different colors depending on at least one of the direction and intensity of the applied electric field.

According to another aspect of the present invention, a method of manufacturing an electrophoretic display device includes forming a connection electrode and a plurality of pixel electrodes on a first base substrate. A common electrode is formed on the second base substrate. And a peeling pattern is formed at a position corresponding to the connection electrode on the common electrode. And a display layer and an adhesive layer are formed on the common electrode so as to cover the peeling pattern. An opening is formed through the adhesive layer, the display layer and the peeling pattern so as to expose a part of the common electrode at a position corresponding to the connection electrode. A contact plug electrically connected to the common electrode is formed in the opening. The pixel electrodes are bonded to the adhesive layer so that the connection electrode and the contact plug are electrically connected to each other.

The adhesion force between the common electrode and the peeling pattern may be weaker than the adhesion force between the common electrode and the display layer.

In the electrophoretic display device of the present invention, the display layer is not formed in the predetermined area by using the release film, so that the microcapsules in the display layer are not destroyed. In addition, the display layer and the adhesive layer can be easily removed using such a release film. Therefore, the process becomes simple, so that the manufacturing time and the manufacturing cost can be reduced, and the defect rate can be reduced.

Figure 1 shows a schematic top view of an electrophoretic display device.
2 is a cross-sectional view of an electrophoretic display device according to an embodiment of the present invention.
3 is a cross-sectional view of an exemplary enlarged view of the display layer of FIG.
Fig. 4 is a cross-sectional view of another example in which the display layer of Fig. 2 is enlarged.
FIGS. 5 to 11 are cross-sectional views of the electrophoretic display device according to the second embodiment of the present invention.
12 is a cross-sectional view of an electrophoretic display device according to another embodiment of the present invention.
FIGS. 13 to 16 are cross-sectional views of the electrophoretic display device of FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the following embodiments. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an," and "the" include plural forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, regions and / or regions, it should be understood that these elements, components, regions, layers and / Do. These terms are not intended to be in any particular order, up or down, or top-down, and are used only to distinguish one member, region or region from another member, region or region. Thus, the first member, region or region described below may refer to a second member, region or region without departing from the teachings of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the present invention should not be construed as limited to any particular shape of the regions illustrated herein, including, for example, variations in shape resulting from manufacturing.

Figure 1 shows a schematic top view of an electrophoretic display device. 2 is a cross-sectional view of an electrophoretic display device according to an embodiment of the present invention. The sectional view of FIG. 2 is taken along the perforated line (II-II) of FIG.

1 and 2, the electrophoretic display device 100 includes a first base substrate 110, a connection electrode 122 arranged on the first base substrate 110, a plurality of pixel electrodes 124, The common electrode 140 on the second base substrate 130 and the base substrate 130 and the display layer 150 between the pixel electrodes 124 and the common electrode 140 and the display layer 150, A contact plug 180 disposed between the electrode 122 and the common electrode 140 and a peeling pattern 170 between the contact plug 180 and the common electrode 140. The connection electrode 122 and the common electrode 140 are electrically connected to each other through the contact plug 180. The electrophoretic display device 100 may further include an adhesive layer 160 for bonding the pixel electrodes 124 and the display layer 150 to each other.

The first base substrate 110 may be a substrate made of various materials such as plastic, metal, and the like. For example, the first base substrate 110 may be made of an insulating organic material, and may be formed of a material such as polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI), polyetherimide (PEN), polyethyelenene napthalate (PEN), polyethyeleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC) or the like, but the present invention is not limited thereto. As another example, the first base substrate 110 may comprise a metal foil comprising a metal such as silver, aluminum, or a plastic film coated with a metal layer.

The first base substrate 110 may be a flexible substrate that can be bent, warped, or curled. According to another example, the first base substrate 110 may be a rigid substrate made of phenol-based or epoxy-based synthetic resin.

The electrode layer 120 including the connection electrode 122 and the pixel electrodes 124 may be disposed on the first surface of the first base substrate 110. The electrode layer 120 includes a connection electrode 122 and pixel electrodes 124 which are spaced apart from each other.

The connection electrode 122 may be electrically connected to the common electrode 140 through the contact plug 180 to transmit the reference voltage to the common electrode 140. The connection electrode 122 is isolated from the pixel electrodes 124. [

The pixel electrodes 124 are arranged in the display area (DR in FIG. 1) with various plan shapes according to the designer's design. The pixel electrodes 124 may have different planar shapes and sizes depending on the design. The pixel electrodes 124 are disposed apart from each other on the first surface of the first base substrate 110. Some of the pixel electrodes 124 may be electrically connected to each other through wirings formed on the first base substrate 110 when the same voltage is applied according to the design. Since the same voltage is applied to the pixel electrodes 124 electrically connected to each other through the wiring, the display layer 150 on the pixel electrodes 124 displays the same color.

The connection electrode 122 and the pixel electrodes 124 may be formed of a single layer structure of copper, aluminum, indium tin oxide (ITO), indium zinc oxide (IZO), or a single layer structure of copper, aluminum, ITO, or IZO Layer structure in which a second material layer such as nickel or gold is further laminated on the first material layer,

The pad portion 101 and the wirings 103 including the connection pads 102 may be disposed on the first base substrate 110 as shown in FIG. The connection pads 102 may be connected to the connection electrode 122 and the pixel electrodes 124 via wirings 103, respectively. A reference voltage may be applied to the connection electrode 122 through the connection pads 102 and independent voltages may be applied to the respective pixel electrodes 124. [ For this, the number of the connection pads 102 may be greater than the number of the pixel electrodes 124 at least.

When the connection electrodes 122 and the pixel electrodes 124 are disposed on the first surface of the first base substrate 110, the wirings 103 are formed on the first surface of the first base substrate 110 And may be arranged on the second side. According to another example, the wirings 103 may be disposed inside the first base substrate 110. The wirings 103 may be electrically connected through the via plug formed along the through hole passing through the connection electrode 122 and the pixel electrodes 124 and the first base substrate 110.

The connection pads 102 may be disposed on the first surface of the first base substrate 110 together with the connection electrodes 122 and the pixel electrodes 124. [ According to another example, the connection pads 102 are disposed on the second side of the first base substrate 110, and the driving chip for driving the electrophoretic display device 100 is connected to the connection pads 102 As shown in FIG.

The connection electrodes 122, the pixel electrodes 124, the connection pads 102 and the wirings 103 formed on the first base substrate 110 and the first base substrate 110 are prepared in the form of a printed circuit board . For example, the connection electrode 122, the pixel electrode 124, the connection pads 102, and the wirings 103 may be formed by forming a through hole in the first base substrate 110, After plating, some regions may be removed. According to another example, the connection electrode 122, the pixel electrode 124, the connection pads 102, and the wirings 103 may be formed on the first base substrate 110 by a printing method. A through hole may be formed in the first base substrate 110 where electrical connection is required, and then the through hole may be filled with a conductive material. Such a preparation can be achieved using a roll-to-roll process. The connection electrode 122, the pixel electrode 124, the connection pads 102 and the wirings 103 are formed by laminating a conductive material layer and an insulating material layer on the first base substrate 110 according to a predetermined order And may not be formed by a semiconductor process technology for forming a conductive pattern and an insulating pattern through a photolithographic process and an etching process. Therefore, an active switching device using a semiconductor material, for example, a thin film transistor, is not formed directly on the first base substrate 110.

The second base substrate 130 may be a transparent transparent material having a high transmittance and may be a film formed of a material having a high transmittance of 80% or more. For example, the second base substrate 130 may be a transparent polymer film having excellent light transmittance, such as a polyether sulfone (PES), a polyacrylate (PAR), a polyetherimide (PEI), a polyetherimide (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC), cellulose triacetate Acetate (TAC) or the like, but is not limited thereto.

The common electrode 140 may be disposed entirely on the second base substrate 130 and is electrically connected to the connection electrode 122 through the contact plug 180. When the electrophoretic display device 100 is operated, a reference voltage is applied to the common electrode 140. The common electrode 140 may be formed of a transparent conductive material such as ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), AZO (aluminum zinc oxide) and a transparent conductive oxide (ITO). The common electrode 140 may be formed entirely on the second base substrate 130 through a sputtering process . According to another example, the common electrode 140 may be formed entirely on the second base substrate 130 through a coating process or a plating process.

The display layer 150 is positioned between the common electrode 140 and the pixel electrodes 124 and may display different colors depending on the direction of the electric field generated by the common electrode 140 and the pixel electrodes 124 have. The display layer 150 may include a dispersion solvent and first particles dispersed in a dispersion solvent. The first particles may be charged with a first polarity to move in the direction of the applied electric field. The color of the dispersing solvent and the color of the first particle may be different. According to another example, the display layer 150 may further include second particles charged in a dispersion solvent and charged with a second polarity opposite in polarity to the first polarity. In this case, the first particles and the second particles may have different colors from each other. The dispersing solvent may be transparent or may be a different color than the colors of the first and second particles.

According to one example, the display layer 150 may comprise microcapsules comprising a dispersion solvent and first particles. The display layer 150 may further include a binder to fix the microcapsules on the common electrode 140. According to another example, the display layer 150 may have a mesh-shaped partition formed on the common electrode 140 so that the first particles do not coalesce with each other. The dispersion solvent and the first particles may be partitioned by the partition walls.

According to one example, the display layer 150 may display two colors depending on the direction of the electric field. For example, when a positive voltage higher than the reference voltage is applied to the pixel electrode 124, a first color is displayed, and when a negative voltage lower than the reference voltage is applied to the pixel electrode 124, have. In this case, when a reference voltage is applied to the pixel electrode 124 or the pixel electrode 124 and the common electrode 140 are floated, the previous color can be displayed as it is. According to another example, the display layer 150 may display three or more colors depending on the direction and intensity of the electric field. For example, when a positive voltage is applied to the pixel electrode 124, a first color is displayed. When a negative voltage is applied, a second color is displayed. When a reference voltage is applied, a third color can be displayed .

A portion of the display layer 150 located on each pixel electrode 124 may display the same color depending on the voltage applied to the pixel electrode 124. [ That is, the first portion of the display layer 150 positioned on the first pixel electrode 124 to which a positive voltage is applied displays a first color, and the second portion of the display layer 150 on the second pixel electrode 124 to which a negative voltage is applied The second portion of the indicating layer 150 that is positioned may display the second color. For example, when the first pixel electrode 124 has a planar shape corresponding to a subject and the second pixel electrode 124 has a planar shape corresponding to the background, the first and second pixel electrodes 124 By applying a voltage, the subject and the background can be distinguished from each other by making the color of the background different from that of the subject.

The display layer 150 will be described in more detail below with reference to FIGS. 3 and 4. FIG.

The adhesive layer 160 may be disposed on the display layer 150 to bond the display layer 150 and the pixel electrodes 124. [ The adhesive layer 160 may be formed using Pressure Sensitive Adhesive (PSA). The pressure-sensitive adhesive can use a material that does not require a change in the optical properties of the constituent members and does not require a high-temperature process during curing and drying at the time of adhesion treatment. For example, the adhesive layer 160 may be made of an appropriate polymer such as an acrylic polymer, a silicone polymer, polyester, polyurethane, polyether, or synthetic rubber. The adhesive layer 160 can be melted by heat, and if it is melted by heat, it can have adhesiveness. The adhesive layer 160 can be cured by energy (e.g., heat or UV, etc.). According to another example, the adhesive layer 160 may not be cured according to the design.

The contact plug 180 is disposed on the connection electrode 122 to provide an electrical connection path with the common electrode 140. The contact plug 180 may be formed of a liquid conductive material having a high viscosity. For example, the contact plug 180 may be formed using a silver paste, a carbon paste, or an electrically conductive liquid phase OCA (optically clear adhesive). According to another example, the contact plug 180 may be formed of a conductive adhesive film.

According to another example, the contact plug 180 may be a spherical or columnar conductor comprising a metal. The contact plug 180 may include conductive particles distributed in the synthetic resin. The conductive particles may physically contact each other to provide an electrical path between the connecting electrode 122 and the common electrode 140. The conductive particles may be made of a metal such as copper, silver, aluminum, and the like, and may have a diameter of several tens to several hundreds of microns. The conductive particles can be formed by coating a core material with a conductive material such as gold or silver.

The peeling pattern 170 is disposed between the contact plug 180 and the common electrode 140. The peeling pattern 170 may be formed on the common electrode 140 at a position corresponding to the connecting electrode 122. The material of the peeling pattern 170 may have a surface repulsive force with the material of the display layer 150. That is, the adhesive force between the peeling pattern 170 and the display layer 150 may be weaker than the adhesive force between the common electrode 140 and the display layer 150. The display layer 150 is formed only on the common electrode 140 not covered with the peeling pattern 170 and may not be formed on the peeling pattern 170. [ The adhesive layer 160 is formed only on the display layer 150 so that the display layer 150 and the adhesive layer 160 do not exist on the peeling pattern 170. [ Therefore, it is not necessary to remove the display layer 150 at the position corresponding to the connection electrode 122 and a part of the adhesive layer. The contact plug 180 may be formed directly on the exposed peeling pattern 170.

The contact plug 180 may be electrically connected to the common electrode 140 through the peeling pattern 170. For this, the peeling pattern 170 may include a transparent metal filler to have conductivity. Examples of the transparent metal filler include inorganic salts such as lithium chloride and magnesium chloride, silicon compounds such as chlorosilane, hydrolysis products of silicon tetrachloride, metal oxide powders, glass beads surface-treated with indium oxide (tin) . The content of the transparent metal filler in the peeling pattern 170 may be 5 [wt%] to 50 [wt%] (weight percentage). According to another example, the peeling pattern 170 may have a very thin thickness so as not to have an insulating property.

The contact plug 180 may penetrate the peeling pattern 170 and directly contact the common electrode 140. The peeling pattern 170 may have a soft characteristic such that the shape changes when the pressure is applied. The contact plug 180 may be pressed from the outside to penetrate the peeling pattern 170 and directly contact the common electrode 140.

Although not shown in FIG. 1, the electrophoretic display device 100 may include a sealing material at the rim portion. The sealing material is disposed on the rim of the first base substrate 110 and the second base substrate 130 so that the first base substrate 110 and the second base substrate 130 are bonded to each other, Can be prevented.

3 is a cross-sectional view of an exemplary enlarged view of the display layer of FIG.

Referring to FIG. 3, the display layer 150 may include microcapsules 151 whose positions are fixed by a binder 154.

In the microcapsule 151, a dispersion solvent 152 and first particles 153 may be included. Although the microcapsules 151 are shown as being arranged in a single layer in Fig. 3, they may be arranged in a plurality of layers. Also, although the microcapsules 151 are all shown to have the same size, they may have different sizes depending on the manufacturing process. The microcapsules 151 may be of a soft type that can be deformed by external pressure. According to another example, the microcapsules 151 may be of a hard type whose shape is not deformed.

The first particles 153 are dispersed in the dispersion solvent 152. The first particles 153 can be charged with a first polarity (e.g., (+) polarity) or a second polarity (e.g., (-) polarity) so that they can move along the direction of the applied electric field. The first particles 153 may be organic or inorganic compounds and may absorb light or scatter light. The first particles 153 may be reflective materials such as metal particles. The first particles 153 may have a first color, and the first color may be selected from among various colors, for example, white, black, red, blue, or yellow.

The dispersing solvent 152 may be any solvent selected from the group consisting of water, methanol, ethanol, propanol, butanol, propylene carbonate, toluene, benzene, Hexane, dimethicone, cetyl octanoate, dicaprylate, isopropyl myristate, isopropyl myristate, isopropyl myristate, isopropyl myristate, isoparaffin oil, Tocopherol acetate, and the like. The dispersion solvent 152 may include a fluorescent material, a phosphorescent material, a light emitting material, or the like, or may include a color-changing material (for example, a sion pigment material, a sion dye material, etc.) whose color characteristic changes as energy is applied have.

The binder 154 may comprise an at least partially transparent material in the visible region of 380 nm to 750 nm. The binder 154 may include at least one transparent polymeric material selected from the group consisting of an acrylic polymer, a silicone polymer, an ester polymer, a urethane polymer, an amide polymer, an ether polymer, a fluorine polymer and rubber. In addition, the binder 350 may include a fluorescent material, a phosphorescent material, a light emitting material, or the like (for example, a zeotropic pigment material, a zeotropic dye material, or the like) whose color characteristics change as energy is applied. The binder 350 may be in a cured state.

When the first particles 153 are charged with the first polarity (+), when the positive voltage is applied to the pixel electrode 124, the first particles 153 move toward the common electrode 140 . Since the first particles 153 move toward the common electrode 140 in the microcapsule 151, the colors of the first particles 153 are displayed on the outside. In contrast, when a negative voltage is applied to the pixel electrode 124, the first particles 153 move toward the pixel electrode 140, and the color of the dispersion solvent 152 is displayed outside.

Although not shown in FIG. 3, in the microcapsules 151, the second particles 153 having a color different from that of the first particles 153 in addition to the dispersion solvent 152 and the first particles 153 City) may be included. When the first particles 153 have a first color and are charged to the first polarity (+) and the second particles have the second color and are charged to the second polarity (-), The first particles 153 move toward the common electrode 140 and the second particles move toward the pixel electrode 124. As a result, Is displayed. In contrast, when a negative voltage is applied to the pixel electrode 124, the first particles 153 move toward the pixel electrode 140 and the second particles move toward the common electrode 140, A second color of the particles is displayed.

Fig. 4 is a cross-sectional view of another example in which the display layer of Fig. 2 is enlarged.

Referring to FIG. 4, the display layer 150a is disposed between the common electrode 140 and the adhesive layer 160 as shown in FIG. A partition 151a for physically partitioning the dispersion solvent 152a and the first particles 153a may be disposed on the common electrode 140. [ The barrier ribs 151a may be arranged on a plane in a mesh form or a lattice form. The barrier ribs 151a may be formed of a sealing material, for example, an acrylic resin of UV curing type or an epoxy resin of a thermosetting type. The barrier ribs 151a may be formed of a resin such as an organic compound or an inorganic compound, or a combination thereof. The barrier ribs 151a may be formed by a stamper method for imprinting the resin layer after forming the resin layer. According to another example, the partition 151a may be formed using a photolithographic process. For example, after the photosensitive resin layer is coated on the common electrode 140, a light is irradiated to a position where the partition 151a is to be formed or a position to be removed for forming the partition 151a using a photomask, The barrier ribs 151a may be formed through the process. The dispersion solvent 152a and the first particles 153a can be embedded in the space defined by the partition 151a.

The dispersion solvent 152a corresponds to the dispersion solvent 152 in Fig. 3, and the first particles 153a may correspond to the first particles 153 in Fig. Between the barrier ribs 151a, there may be second particles charged with different polarities from the first particles 153a, and the second particles may have a different color from the first particles 153a.

FIGS. 5 to 11 are cross-sectional views of the electrophoretic display device 100 of FIG.

Referring to FIG. 5, an electrode layer 120 including a connection electrode 122 and a plurality of pixel electrodes 124 is formed on a first base substrate 110.

The connection electrode 122 and the plurality of pixel electrodes 124 may be formed on the first base substrate 110 by a method of manufacturing a printed circuit board such as a printing method. The first base substrate 110 on which the pixel electrodes 124 are formed may be referred to as a printed circuit board. The connection electrodes 122 and the pixel electrodes 124 are arranged on the first base substrate 110 so as to be spaced apart from each other. The connection electrodes 122 may be located outside the display area DR and the pixel electrodes 124 may be spaced apart from each other in the display area DR.

A pad portion 101 including connection pads 102 of FIG. 1 may be further formed on the first base substrate 110. The connection pads 102 may include a connection electrode 122 and a pixel electrode 124 (103 in Fig. 1), respectively. The wirings 103 may be located in a different layer from the connection electrode 122 and the pixel electrodes 124. [ For example, the connection electrodes 122 and the pixel electrodes 124 are disposed on the first surface of the first base substrate 110, and the wirings 103 are disposed on the first surface of the first base substrate 110 Plane, or may be disposed inside the first base substrate 110. The first base substrate 110 may be disposed on the second surface. The connection pads 102 may be disposed on the first side of the first base substrate 110 or on the second side.

A through hole is formed in the first base substrate 110 and then a conductive material such as metal is plated and then a portion of the plating layer is removed. The electrodes 124, the connection pads 102, and the wirings 103 may be formed. The first base substrate 110 may be a flexible or rigid substrate of various materials such as plastic, metal, and the like. The first base substrate 110 may be a soft synthetic resin substrate.

Referring to FIG. 6, the common electrode 140 and the peeling pattern 170 may be formed on the second base substrate 110. The peeling pattern 170 may be disposed on the common electrode 140 at a position corresponding to the connecting electrode 122. [

The second base substrate 130 may be a transparent transparent material having a high transmittance and may be a film formed of a material having a high transmittance of 80% or more.

The common electrode 140 may be formed of a transparent conductive material over the entire surface of the second base substrate 130. The common electrode 140 may be formed on the second base substrate 130 by a sputtering method. According to another example, the common electrode 140 may be formed on the second base substrate 130 in a coating method or a plating method.

A peeling pattern 170 may be formed at a position corresponding to the connection electrode 122 on the common electrode 140. [ The material of the peeling pattern 170 may have a surface repulsive force with the material of the display layer 150. According to one example, the peeling pattern 170 may have conductivity. The peeling pattern 170 may include a transparent metal filler to have conductivity. According to another example, the peeling pattern 170 may have a soft characteristic such that the shape changes when the pressure is applied. According to another example, the peeling pattern 170 may have a very thin thickness so as not to have insulating properties.

Referring to FIG. 7, the display layer 150 may be formed on the common electrode 140 on the second base substrate 110. Since the material of the peeling pattern 170 has a surface repulsive force with the substance of the display layer 150, the display layer 170 is not formed on the peeling pattern 170. The adhesive force between the peeling pattern 170 and the display layer 150 may be weaker than the adhesive force between the common electrode 140 and the display layer 150. [

The display layer 150 shown in FIG. 3 is obtained by mixing the binder 154 with the dispersion solvent 152 and the microcapsules 151 containing the first particles 153, and the binder 154 and the microcapsules The paste mixed with the conductive paste 151 is coated on the common electrode 140 and the paste applied on the common electrode 140 is cured by applying heat or UV irradiation to form a paste that is locally coated on the common electrode 140 . The paste may not be applied on the peeling pattern 170 due to the surface repulsive force. The display layer 150 existing on the peeling pattern 170 after the curing is not adhered to the peeling pattern 170 and the peeling pattern 170 is not adhered to the peeling pattern 170 by suction or mechanical vibration, 170).

The coating may be performed by patch die coating, slot or extrusion coating, slide or cascade coating, curtain coating, roll coating, gravure coating, dip coating, spray coating, meniscus coating, spin coating, brush coating, have. Printing can be performed by silk screen printing, electrostatic printing, thermal printing, ink jet printing, or the like.

8, a release film 162 having an adhesive layer 160a is attached on a second base substrate 130 on which a common electrode 140 and a display layer 150 are formed. The adhesive layer 160a can be attached on the display layer 150 using the adhesive force of the adhesive layer 160a. The adhesive force between the release film 162 and the adhesive layer 160a may be lower than the adhesive force between the adhesive layer 160a and the display layer 150. [ To this end, the release film 162 may be subjected to a surface treatment for lowering the adhesion with the adhesive layer 160a.

9, the release film 162 is peeled off from the adhesive layer 160a, leaving only a part of the adhesive layer 160b on the display layer 150. [ A part of the adhesive layer 160c located on the empty space on the peeling pattern 170 is torn off when the releasing film 162 is peeled off due to the adhesive force between the releasing film 162 and the adhesive layer 160a. As shown, a part of the adhesive layer 160c is attached to the release film 162 and removed together with the release film 162 when the release film 162 is peeled off.

The adhesive layer 160 has adhesiveness and can be cured by heat or UV. According to another example, the adhesive layer 160 does not have adhesiveness at room temperature, and can have adhesiveness after heat is applied.

As a result, an opening for exposing the peeling pattern 170 is formed. The position of the opening may correspond to the position of the connection electrode 122.

Referring to FIG. 10, a contact plug 180 that contacts the peeling pattern 170 can be formed in an opening exposing the peeling pattern 170. The contact plug 180 may be formed of a liquid conductive material having a high viscosity and may be filled in the opening using a syringe. The contact plug 180 may be formed of a conductive adhesive film, and the conductive adhesive film may be cut into a size smaller than the opening, and then inserted into the opening. The contact plug 180 may be a spherical or columnar conductor, such as a solder ball, and may be pressed into contact with the connecting electrode 122 after being inserted into the opening. The contact plug 180 may include conductive particles distributed in the synthetic resin and may provide an electrical path due to the conductive particles physically contacting each other.

Referring to FIG. 11, the first base substrate 110 is disposed on the second base substrate 130 such that the contact plugs 180 and the connection electrodes 122 are in contact with each other. The first base substrate 110 is pressed toward the second base substrate 130 so that the connection electrode 122 is electrically connected to the contact plug 180. At this time, the pixel electrodes 124 are bonded to the adhesive layer 160. Depending on the material of the adhesive layer 160, heat may be applied to the adhesive layer 160, or UV may be irradiated. The adhesive layer 160 may be bonded to the first base substrate 110 not covered with the pixel electrodes 124. [

12 is a cross-sectional view of an electrophoretic display device according to another embodiment of the present invention. The sectional view of FIG. 12 is taken along the perforated line (II-II) of FIG.

12, the electrophoretic display device 200 includes a first base substrate 210, a connection electrode 222 arranged on the first base substrate 210, and a plurality of pixel electrodes 224 A common electrode 240 on the base substrate 230; a display layer 250 between the pixel electrodes 224 and the common electrode 240; pixel electrodes 224; A contact plug 280 that electrically connects the connection electrode 222 and the common electrode 240 through the display layer 250 and the adhesive layer 260 and a contact plug 280 that electrically connects the common electrode 240 and the common electrode 240, And includes a peel pattern 270 located between the electrode 240 and the display layer 250 and at least partially surrounding the contact plug 280. The peeling pattern 270 may be penetrated by the contact plug 280 as shown in Fig.

The electrophoretic display device 200 is substantially the same as the electrophoretic display device 100 shown in Fig. 2 except for the peeling pattern 270 and the contact plug 280. Fig. The same components are not repeatedly described in detail. More specifically, the first base substrate 210, the connection electrode 222 and the pixel electrodes 224, the third base substrate 230, the common electrode 240, the display layer 250, and the adhesive layer 260 The pixel electrode 124, the third base substrate 130, the common electrode 140, the display layer 150, the adhesive layer 160 (see FIG. 2), the first base substrate 110, the connection electrode 122 and the pixel electrodes 124, Respectively, and these will not be described repeatedly.

The first base substrate 210 may be a substrate made of various materials such as plastic, metal, and the like. As another example, the first base substrate 210 may include a metal foil comprising a metal such as silver, aluminum, or a plastic film coated with a metal layer. The first base substrate 210 may be a flexible substrate which may be bent, warped, or curled. According to another example, the first base substrate 210 may be a rigid substrate made of a phenol-based or epoxy-based synthetic resin.

An electrode layer 220 including a connection electrode 222 and pixel electrodes 224 may be disposed on a first surface of the first base substrate 210. The electrode layer 220 includes a connection electrode 222 and pixel electrodes 224 which are spaced apart from each other. The connection electrode 222 may be electrically connected to the common electrode 240 through the contact plug 280 to transmit the reference voltage to the common electrode 240. The connection electrode 222 is isolated from the pixel electrodes 224. [ The pixel electrodes 224 are arranged in the display area (DR in Fig. 1) with various plan shapes according to the designer's design.

The pad portion 201 and the wirings 203 including the connection pads 202 may be disposed on the first base substrate 210. The connection pads 202 may be connected to the connection electrode 222 and the pixel electrodes 224 via wirings 203, respectively. A reference voltage may be applied to the connection electrode 222 through the connection pads 202 and voltages independent of the pixel electrodes 224 may be applied.

The second base substrate 230 may be a transparent transparent material having a high transmittance and may be a film formed of a material having a high transmittance of 80% or more. The common electrode 240 may be disposed entirely on the second base substrate 230 and may be electrically connected to the connection electrode 222 through the contact plug 280. When the electrophoretic display device 200 operates, a reference voltage is applied to the common electrode 240. The common electrode 240 may be formed of a transparent conductive material.

The display layer 250 may be disposed between the common electrode 240 and the pixel electrodes 224 and may display different colors depending on the direction of the electric field generated by the common electrode 240 and the pixel electrodes 224. [ have. The display layer 250 may include a dispersion solvent and first particles dispersed in a dispersion solvent. The display layer 250 may include microcapsules containing a dispersion solvent and first particles as shown in Fig.

The adhesive layer 260 may be disposed on the display layer 250 to bond the display layer 250 and the pixel electrodes 224. [ The adhesive layer 260 may be formed using a pressure sensitive adhesive (PSA). The pressure-sensitive adhesive can use a material that does not require a change in the optical properties of the constituent members and does not require a high-temperature process during curing and drying at the time of adhesion treatment.

The contact plug 280 is disposed between the connection electrode 222 and the common electrode 240 and electrically connects them to each other. The contact plug 280 may be formed of a liquid conductive material having a high viscosity. According to another example, the contact plug 280 may be formed of a conductive adhesive film. According to another example, the contact plug 280 may be a spherical or columnar conductor comprising a metal. Another contact plug 280 may include conductive particles distributed in a synthetic resin.

The peeling pattern 270 may be located between the common electrode 240 and the display layer 250 as shown in FIG. 12 and may at least partially surround the contact plug 280. The peel pattern 270 may completely surround the contact plug 280. [ That is, the contact plug 280 can penetrate the peeling pattern 270. The adhesion force between the peeling pattern 270 and the common electrode 240 may be weaker than the adhesion force between the common electrode 240 and the display layer 250. The peeling pattern 270 can be selected as a material having a low adhesive force between the common electrodes 240. The adhesion force between the display layer 250 and the peeling pattern 270 may be stronger than the adhesion force between the peeling pattern 270 and the common electrode 240. A portion of the adhesive layer 260 and the display layer 250 and the peeling pattern 270 may be separated from the peeling pattern 270 and the common electrode 240, Can be easily removed due to the weak adhesive force between them.

The electrophoretic display device 200 may include a sealing material at the rim portion. The sealing material is disposed on the rim of the first base substrate 210 and the second base substrate 230 to bond the first base substrate 210 and the second base substrate 230 together, Can be prevented.

13 to 16 are cross-sectional views of the electrophoretic display device 200 of FIG.

An electrode layer 220 including a connection electrode 222 and a plurality of pixel electrodes 224 is formed on a first base substrate 210 as shown in FIG.

Referring to FIG. 13, a common electrode 240 and a peeling pattern 270 are formed on a second base substrate 210. The peeling pattern 270 may be disposed on the common electrode 240 at a position corresponding to the connecting electrode 222. [

The adhesion force between the peeling pattern 270 and the common electrode 240 may not be strong. For example, the adhesive force between the peeling pattern 270 and the common electrode 240 may be weaker than the adhesive force between the common electrode 240 and the display layer 250. The peeling pattern 270 can be formed on the common electrode 240 in a printing method using a material having a low adhesion to the common electrode 240. The peeling pattern 270 may be formed at a position corresponding to the connection electrode 222 using a material having a low adhesion to the common electrode 240 using a mask.

Referring to FIG. 14, the display layer 250 and the adhesive layer 260 may be formed on the common electrode 240 on which the peeling pattern 270 is formed. The adhesive layer 160 may be formed by applying an adhesive material on the display layer 150. The adhesive material is adhesive and can be cured by heat or UV. The adhesive material does not have adhesiveness at room temperature and can have adhesiveness after heat is applied. The adhesive material is adhesive and can be cured when UV is irradiated. The adhesive layer 160 may be formed by attaching a release film coated with an adhesive material on the display layer 250 and then removing only the release film and leaving an adhesive material on the display layer 250. [

Referring to FIG. 15, an opening OP exposing a part of the common electrode 240 is formed. The position of the opening OP may correspond to the position of the connection electrode 122. The position of the opening OP may be the same as the position where the peeling pattern 270 is formed.

A portion of the adhesive layer 260, the display layer 250 and the peeling pattern 270 may be removed to form the opening OP. According to one example, an opening OP for exposing the common electrode 240 can be formed by removing a part of the adhesive layer 260, the display layer 250, and the peeling pattern 270 using a partial punching process . The partial punching process is a process of punching a hole, that is, an opening OP, in the adhesive layer 260, the display layer 250, and the peeling pattern 270 before the common electrode 240. For example, holes can be formed up to the common electrode 240 on the peeling pattern 270 using a hole punch. The adhesive layer 260, the display layer 250, and a part of the peeling pattern 270, which are to be removed due to the weak adhesive force between the peeling pattern 270 and the common electrode 240 when the hole punch is pulled out, Are discharged together with the hole punch.

According to another example, a laser may be used to form the opening OP. The adhesive layer 260 inside the opening OP, the display layer 250, and the peeling pattern 270 (see FIG. 4) are formed by irradiating a laser to the position at which the opening OP is to be formed and separating the inside and the outside of the opening OP. Can be removed by suction or the like. The adhesive layer 260, the display layer 250 and the peeling pattern 270 inside the opening OP can be easily removed because the adhesive force between the peeling pattern 270 and the common electrode 240 is weak.

Referring to FIG. 16, a contact plug 280 that contacts the common electrode 240 may be formed in the opening OP. The contact plug 280 may be formed of a liquid conductive material having a high viscosity, and may be embedded in the opening OP using a syringe. The contact plug 280 may be formed of a conductive adhesive film, and the conductive adhesive film may be cut into a size smaller than the opening OP and then inserted into the opening OP. The contact plug 280 may be a spherical or columnar conductor, such as a solder ball, and may be inserted into the opening OP. The contact plug 280 may include conductive particles distributed in the synthetic resin and may provide an electrical path due to the conductive particles physically contacting each other.

The first base substrate 210 is disposed on the second base substrate 230 so that the contact plug 280 and the connection electrode 222 are in contact with each other. The first base substrate 210 is pressed toward the second base substrate 230 so that the connection electrode 222 is electrically connected to the contact plug 280. At this time, the pixel electrodes 224 are bonded to the adhesive layer 260. Depending on the material of the adhesive layer 260, heat may be applied to the adhesive layer 260, or UV may be irradiated.

If each step constituting the manufacturing method according to the present invention is not explicitly described or contradicted, each step can be performed in an appropriate order. The present invention is not limited to the above-described embodiments. The use of all examples or exemplary terms (e.g., etc.) in the present invention is for the purpose of describing the present invention only in detail, and is not intended to limit the scope of the present invention by the use of the above examples or exemplary terms, The range is not limited. In addition, those skilled in the art will recognize that design criteria and factors can be modified within the scope of the claims or equivalents thereof.

Accordingly, the spirit of the present invention should not be limited to the above-described embodiments, and all ranges equivalent to or equivalent to the claims of the present invention as well as the claims of the following claims Category.

100, 200: electrophoretic display device 110, 210: first base substrate
122 and 222: connection electrodes 124 and 224: pixel electrodes
130, 230: second base substrate 140, 240: common electrode
150, 250: display layer 160, 260: adhesive layer
170, 270: peeling pattern 180, 280: contact plug

Claims (1)

A first base substrate;
A connection electrode and a plurality of pixel electrodes arranged on the first base substrate;
A second base substrate;
A common electrode on the base substrate;
A display layer between the pixel electrodes and the common electrode;
An adhesive layer between the pixel electrodes and the display layer;
A contact plug electrically connecting the connection electrode and the common electrode through the display layer and the adhesive layer; And
And a peeling pattern located between the common electrode and the display layer, the peeling pattern at least partially surrounding the contact plug.

Images