KR20170104681A

KR20170104681A - The LED lamp factory production technology integrated a combination of high brightness LED and waterproof device package monolithic aluminum heatsink luminaire case.

Info

Publication number: KR20170104681A
Application number: KR1020160026986A
Authority: KR
Inventors: 김현량; 이광순
Original assignee: 주식회사 에스트로닉엘에스
Priority date: 2016-03-07
Filing date: 2016-03-07
Publication date: 2017-09-18

Abstract

The present invention relates to a factory lamp using a high bright and high output LED element integrated with a die chip, and more particularly to a factory lamp which includes an illumination module for emitting light, a support plate for supporting the illumination module, and a heat sink part including a plurality of heat radiation fins around the support plate. The illumination module forms a block on which the LED die chip is to be mounted on the first PCB substrate. After Ag is coated on the opposite side of the first PCB substrate on which the LED die chip is to be mounted, the first PCB substrate is compressed and combined with a second PCB substrate. After conductive pads made of copper (Cu) materials are alternatively formed on both sides of left and right sides of the surface of the first PCB substrate, graphene is sprayed into the block. After the LED die chip is arranged on the upper side of the graphene, the LED die chip is cured. At least one element connected in parallel with the conductive pads of both sides of the LED die chip through two wires respectively is formed. A diffusion cover is mounted on the support plate formed with an arc shape to diffuse the light from the LED, thereby widening a working range in a factory. Accordingly, the present invention can increase the life of the illumination module and obtain high heat dissipation properties.

Description

(LED lamp factory production technology combined with high brightness integrated LED waterproof package device with integrated structure aluminum heat sink luminaire case). {The LED lamp factory production technology is integrated in a combination of high brightness LED and waterproof device package monolithic aluminum heatsink luminaire case.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a factory using a high-intensity, high-output LED element integrated with a die chip, in which a diffusion cover is mounted on a support plate on which an LED lighting module is inserted to integrate a die chip A factory using a high-brightness, high-output LED element, and the like.

The light used at night or indoors is used as a lamp for converting electric energy into light energy by receiving power, and incandescent lamps and fluorescent lamps are generally used. Among them, the incandescent lamps are warm in color, do not need an accessory device for lighting, and can easily be combined with a lighting device, so that despite the spread of fluorescent lamps, the demand ratio is still large. These incandescent lamps and fluorescent lamps have a short life span and high power consumption .

On the other hand, fluorescent lamps are more popular than incandescent lamps that use filament because of their high efficiency and long life.

In recent years, an iodine bulb using a halogen cycle, a high-efficiency metal halide lamp, a luminescent lamp, and the like have been developed and put into practical use. EL lamps, which are a crystal light emitter, have been spotlighted as a next generation light source as a surface light source. However, But it has not reached the practical stage yet.

On the other hand, a light emitting diode (LED) is smaller in size than a conventional light source, has a long life, and is known to have low power and high efficiency because electric energy is directly converted into light energy. However, It is not suitable for general interior lighting which requires a large area to be uniformly irradiated. Therefore, a small lantern such as a portable lantern has been developed and used. However, there has not been developed a product suitable for use as a lighting for a factory .

In order to solve the above problems, a conventional utility model registration No. 0426103 (Application No. 2006-0016111) (name: an indoor lighting apparatus using LED as a light source) has been registered.

The above-described conventional technical structure includes a power supply conversion circuit for converting a general AC power supply into a DC power supply suitable for supplying an LED, a lighting apparatus main body having a plurality of LEDs connected to the power supply conversion circuit and emitting light, Wherein a lens portion protruding in a predetermined pattern is formed on a front surface exposed to the outside and a rear surface contacting the inside of the lighting device body is formed with a groove in which an LED is received to correspond to the lens portion, A cover made of an acrylic material; A reflection plate attached to the back surface of the cover and having perforations formed at positions corresponding to the lens unit with the same diameter as the lens unit; .

That is, since the LED is used as a light source, the power consumption is relatively lower than that of a conventional incandescent lamp or a fluorescent lamp, and the reflector is integrally attached to the back of the cover. And the reflective effect of light has an excellent illuminance as an indoor lighting device, and the reflector also has a function of preventing deformation and breakage of the cover, so that the durability of the lighting device can be improved.

However, the above-described conventional techniques have not been used in practice because of the following problems.

That is, since only the hole is formed on the reflection plate, there arises a great problem that the light emitted from the LED lamp can not be emitted more effectively.

In addition, the conventional technique has a problem that the shape of the lens is simply formed, and the efficiency is deteriorated because the light can not be transmitted evenly.

Especially, it is pointed out that the structure of grooves for gathering or scattering light is formed only by semicircular grooves, which also fails to transmit light efficiently.

In addition, a socket protection cap and an LED factory light fixture having a variable angle, which are disclosed in Korean Patent No. 10-1351981, have been disclosed, but the above configuration has a socket protection cap which can be adjusted only at a socket of a factory lamp and a mother glass , Since the LED modules are connected in series, there is a problem that the LED can not be illuminated as a whole when the connection terminal is disconnected.

A problem to be solved by the present invention is that a flexible PCB substrate is coated and mounted on a brass PCB substrate by silver so that chip pads and LED die chips are connected in parallel on both sides of a wire made of gold, The die chips are energized and illuminated, and a mixture of a liquid epoxy and a phospho (fluorescent material) is first applied to the die chip, the second is coated on the entire flexible PCB substrate to waterproof the lighting module So that the life of the lighting module can be prolonged for a long time.

In addition, in order to dissipate the heat generated from the lighting module, the heat dissipating part is communicated with the lighting module with the heat dissipating fin so that external air can be convected to the inside of the heat dissipating fin to the space between the heat dissipating fins, .

In addition, by mounting a diffusion cover on the convex surface of the support plate, it is possible to increase the diffusion efficiency of the LED light and widen the working range in the workplace.

Further, it is an object of the present invention to form a convex surface of a support plate for supporting an illumination module, insert an illumination module on a surface thereof, and mount a diffusion cover, thereby illuminating the interior of the factory as a whole.

According to an aspect of the present invention, A support plate coupled to one side of the housing and having a convex surface; A plurality of illumination modules mounted on a convexly formed surface of the support plate to emit light; A heat dissipation unit having a plurality of heat dissipation fins around the support plate; Wherein the lighting module forms a block on which the LED die chip is to be mounted on the first PCB substrate and Ag is coated on the opposite surface of the first PCB substrate on which the LED die chip is to be mounted, (2) a first PCB substrate is press-coupled to a second PCB substrate, and conductive pads made of copper (Cu) are staggered on both sides of a surface of the first PCB substrate, graphenes are injected into the block, The LED die chips are arranged on top of the pins and cured, and the lighting module formed by connecting the conductive pads on both sides of the LED die chip with two wires in parallel is inserted and fixed in the insertion groove of the support plate formed in an arc shape And a heat dissipating portion formed of heat dissipation fins is formed as an outer circumferential surface of the lighting module, the factory lighting using the high-intensity, high-output LED element integrated with the die chip can be manufactured.

The heat dissipating unit is configured to communicate with the lighting module so that external air can be radiated into the space between the heat dissipation fins to the inside of the heat dissipation fin, thereby dissipating heat generated in the lighting module.

The heat dissipation unit may be coupled to the housing of the synthetic resin material.

The first PCB substrate may be a flexible PCB substrate of a soft material, and the second PCB substrate may be a copper (Cu) coated PCB substrate.

The graphene is sprayed with 2 mg, and the LED die chips can be cured by arranging them in units of ten.

The wire may include gold, and the wire may be bonded to the edge of the LED die chip.

In order to prevent oxidation of the surface of the LED die chip, a mixture of a liquid epoxy and a phospho is applied to the LED die chip, and then the mixture is added to the entire first PCB substrate.

A diffusion cover for diffusing light of the illumination module may be formed on the convex surface of the support plate.

In the present invention having the above-described features, since the chip pads are connected in parallel to the die chip and the two gold wires, only one die is disconnected, only the disconnected die chips are electrically charged, and the remaining die chips are energized, There is an effect that the illumination can be maintained.

In addition, since the present invention is applied to a die chip firstly by mixing a mixture of a liquid epoxy and a phospho, and secondly, by applying the entire flexible PCB substrate, the mixture of the application of the lighting module is prevented from cracking, It is effective.

In addition, the present invention has the effect of widening the illumination range by the diffusion cover combined with the support plate.

1 is a perspective view schematically showing a factory or the like according to an embodiment of the present invention.
FIG. 2 is a flowchart sequentially showing a process for manufacturing the LED element shown in FIG. 1; FIG.
FIGS. 3A to 3C are cross-sectional views illustrating LED devices manufactured according to the LED device manufacturing method shown in FIG. 2;
4 is a perspective view showing a state in which a diffusion cover according to the present invention is mounted on a lighting module;
5 is a perspective view showing a factory lighting lamp according to a second embodiment of the present invention;

Hereinafter, the description of the present invention with reference to the drawings is not limited to a specific embodiment, and various transformations can be applied and various embodiments can be made. It is to be understood that the following description covers all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In the following description, the terms first, second, and the like are used to describe various components and are not limited to their own meaning, and are used only for the purpose of distinguishing one component from another component.

Like reference numerals used throughout the specification denote like elements.

As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It is also to be understood that the terms " comprising, "" comprising, "or" having ", and the like are intended to designate the presence of stated features, integers, And should not be construed to preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 5 attached herewith.

FIG. 1 is a perspective view illustrating an LED factory lighting according to an exemplary embodiment of the present invention. FIG. 2 is a flowchart sequentially illustrating a process for manufacturing an LED device according to an embodiment of the present invention. FIGS. 4 is a perspective view illustrating a state in which a diffusion cover according to the present invention is mounted on an illumination module, and FIG. 5 is a cross-sectional view of a LED according to a second embodiment of the present invention. And the like.

1 to 5, an LED factory or the like according to an embodiment of the present invention is provided with a fastening part embedded in a ceiling or descending to a predetermined length to illuminate downward. A factory or the like according to an embodiment of the present invention may include a lighting module 20, a support plate 10, a housing 40, a diffusion cover 50,

Specifically, the housing 40 is coupled to the fastening portion in the ceiling of the factory.

The lighting module 20 may emit light and may include a plurality of LED elements integrated with a plurality of LED die chips.

The lighting module 20 may be fabricated in the following manner: block forming step S100; silver application step S200; PCB board bonding step S300; energizing pad forming step S400; die chip hardening step S500; And a light emitting diode (LED).

In manufacturing the LED device, a block 210 on which the LED die chip 300 is to be mounted is formed on the first PCB substrate 200 (S100). Next, Ag (silver) is applied on the opposite side of the first PCB substrate 200 on which the LED die chip 300 is to be mounted (S200).

Next, the first PCB substrate 200 is press-coupled to the second PCB substrate 100 (S300). Subsequently, conductive pads 500 made of copper (Cu) are staggered on both sides of the surface of the first PCB substrate 200 (S400). Next, the graphenes 220 are injected into the block 210, the LED die chips 300 are arranged on the graphenes 220, and then cured (S500). Then, the wires are connected in parallel to the conductive pads 500 on both sides of the LED die chip 300 with two wires 600 (S600).

Here, the first PCB substrate 200 is a flexible PCB substrate, and the second PCB substrate 100 is a substrate coated with copper (Cu).

As shown in FIG. 3A, a first PCB substrate 200 made of a flexible material is seated on the second PCB substrate 100 made of copper (Cu) and then attached. At this time, a block 210 is formed on the second PCB substrate 100 so that the LED die chip 300 can be inserted into the first PCB substrate 100 made of copper and then the first PCB substrate 100 (Ag) bond 400 is applied to the back surface of the second PCB substrate 100 and is then pressed onto the second PCB substrate 100 with a hydraulic press (10 kg / sec).

Then, as shown in FIG. 3B, the thin plate conductive pad 500 made of copper is pressed on the upper surface of the first PCB 200 to be cured.

3C, 2 mg of graphene 220 is sprayed on the block 210 formed on the first PCB substrate 200 to attach and cure the 1W LED die chip 300. FIG. The method for spraying the graphene 220 and attaching the die chip 300 is for coating with a good thermal conductivity.

And the conductive pads 500 are formed on both sides between the die chip 300 and the die chip 300, and the conductive pads 500 are formed on both sides of the die pads 300, 500 are staggered from each other on both sides of the die chip 300.

The conductive pad 500 is formed by connecting the die chip 300 and the die chip 300 in parallel with each other using a wire 600 made of gold. Therefore, even if one wire connecting the die chip 300 is disconnected, the die chips 300 connected by the remaining wires 600 are not disconnected, so that they can be energized and illuminated.

The thickness of the wire 600 made of gold is 0.03 mm and the wire 600 is bonded and bonded to the edge of the die chip 300.

In order to protect the surface of the DIE CHIP 300 from physical and chemical oxidation, a mixture of a liquid epoxy and a phospho (phosphor material) is first applied to the die chip 300 And the secondary is formed by applying the entire first PCB substrate 200.

In order to realize white light integrated package type light through the surface of the first PCB substrate 200, a blue 1W LED CHIP is bonded to the first PCB substrate 200, and 2 mg of a phosphor material and 8 mg of a liquid epoxy Are mixed with each other to form a 1.2 mm-thick primer.

In consideration of the shrinkage volume upon curing of the liquid epoxy, about 1 to 4 mg is applied at the time of the secondary coating.

In addition, in order to realize the integrated package type light of the daylight color (orange color) through the surface of the first PCB substrate 200, a red 1W LED chip (CHIP) is bonded to the integrated PCB substrate, And 7.3 mg of liquid epoxy was mixed with the liquid silicone and the first coating was performed to a thickness of 1.4 mm.

In consideration of the shrinkage volume upon curing of the liquid epoxy, about 1.7 mg is applied at the time of the secondary coating.

In the molding operation, a mixture of a liquid epoxy and a phospho is applied to the first die and the second die. The thickness after curing of the mixture for protecting the die chip 300 and the conductive pad 500 is about 2.0 mm It should not be over.

After the wire bonding is completed, the epoxy layer that is cured by injecting liquid into the upper part uses liquid epoxy containing a fluorescent material and a curing agent. Since liquid epoxy is injected in a state in which wire bonding is completed, And after the curing, the entire constituent portion can be made to be in an insulated state from the outside, thereby completing the entire packing for the high-brightness white LED die integrated semiconductor package device 20.

The LED elements manufactured as described above are integrated to form the lighting module 20 shown in FIG.

The support plate 10 can attach the lighting module 20. The support plate 10 may be formed with a plurality of insertion grooves (not shown) to which the illumination module 20 can be attached. The support plate 10 may be formed convexly. The support plate 10 is coupled to one side of the housing 40.

Here, the convex shape of the support plate 10 may have the effect of diffusing the LED light since the illumination module 20 is mounted at different angles.

The support plate 10 may be made of metal or plastic. The support plate 10 is preferably formed of a metal material having a high thermal conductivity so as to easily discharge the heat generated from the lighting module 20 to the outside. The support plate 10 may be replaced by a metal panel 26 of the lighting module 20.

The diffusion cover 50 can diffuse the light emitted from the LED to the outside. The diffusion cover 50 is formed in front of the lighting module 20 because the angle at which the light of the LED is diffused is small, thereby enlarging the angle at which the light is illuminated, thereby increasing the illuminated area to obtain a more efficient lighting effect. The diffusion cover (50) can be coupled to the convex surface of the support plate (10). The diffusion cover 50 may be formed in a shape corresponding to the support plate 10. The diffusion cover 50 may have a heat radiation hole so that the inner heat of the illumination module 20 can be externally applied to the outer circumferential surface or the lower surface. The diffusion cover 50 may be made of semitransparent glass, acrylic, polycarbonate, or the like, which can increase the light transmittance. In order to exhibit various lighting effects, , Polycarbonate may be used.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. In addition, it is a matter of course that various modifications and variations are possible without departing from the scope of the technical idea of the present invention by anyone having ordinary skill in the art.

10: Support plate
20: Lighting module
30:
31: Radiating pin
40: Housing
50: diffusion cover
200: first PCB substrate
100: second PCB substrate
210: block
220: graphene
300: LED die chip
400: Ag (silver) bond
500: energizing pad
600: wire

Claims

A housing installed in a ceiling within a factory;
A support plate coupled to one side of the housing and having a convex surface;
A plurality of LED integrated package illumination modules mounted on a convexly formed surface of the support plate to emit light;
A heat dissipation unit having a plurality of heat dissipation fins around the support plate; , &Lt; / RTI &
The lighting module
A method of forming a block on which a LED die chip is to be mounted on a first PCB substrate, applying silver (Ag) to a surface of the first PCB substrate on which the LED die chip is to be mounted, The method of manufacturing a semiconductor device according to any one of claims 1 to 3, wherein the first and second conductive patterns are formed on the first and second PCB substrates, And the lighting module is connected to the conductive pads on both sides of the LED die chip in parallel by two wires. The lighting module is inserted into the insertion groove of the arc-shaped support plate and fixed to the outer circumferential surface of the lighting module, And a factory using the high-intensity, high-output LED element integrated with the die chip.

The method according to claim 1,
The heat-
And the heat generated by the lighting module is dissipated while external air is convected to the inside of the heat radiating fins to the space between the heat radiating fins by communicating with the lighting module. Factories, etc.

The method according to claim 1,
Wherein the heat dissipating unit is coupled to a housing of a synthetic resin material. The factory includes a high-intensity, high-output LED device integrated with a die chip.

The method according to claim 1,
The first PCB substrate is a flexible PCB substrate of a flexible material,
And the second PCB substrate is a copper (Cu) -coated PCB substrate. The factory using the high-intensity, high-output LED device integrating the die chip.

The method according to claim 1,
Wherein the graphenes are sprayed in an amount of 2 mg, and the LED die chips are arranged in a unit of 10 to cure, and a plant using the high-intensity, high-output LED element integrated with the die chip.

The method according to claim 1,
Wherein the wire includes gold, and the wire is bonded to the edge of the LED die chip and is wire-bonded. The factory using the high-intensity, high-output LED element integrating the die chip.

The method according to claim 1,
Characterized in that a mixture of a liquid epoxy and a phospho is applied to the LED die chip to prevent oxidation on the surface of the LED die chip and then the mixture is further applied to the entire first PCB substrate And high-brightness, high-output LED devices.

The method according to claim 1,
Further comprising a diffusion cover for diffusing light of the illumination module,
Wherein the diffusion cover is formed so as to cover the support plate, the factory using the high-intensity, high-output LED element integrated with the die chip.