CN202302928U

CN202302928U - LED (light emitting diode) lamp bulb

Info

Publication number: CN202302928U
Application number: CN2011204340625U
Authority: CN
Inventors: 伊垣胜; 清水裕刚; 冈﨑智一; 大泽英治
Original assignee: Rohm Co Ltd
Current assignee: Rohm Co Ltd
Priority date: 2010-11-02
Filing date: 2011-11-02
Publication date: 2012-07-04
Anticipated expiration: 2021-11-02

Abstract

The utility model provides an LED (light emitting diode) lamp bulb capable of promoting heat dissipation of LED chips while realizing high brightness or illuminating homogenization simultaneously. The LED lamp bulb (A) comprises a substrate (1), a plurality of LED chips, a heat dissipation component (5), a spherical cover (3) and a lamp cap (7), wherein the substrate (1) comprises a main surface (1c) which is made of ceramic; the plurality of LED chips are arranged on the main surface of the substrate (1); the heat dissipation component (5) is used for bearing the substrate (1); heat from the LED chips is transferred through the substrate; the spherical cover (3) is used for covering the plurality of LED chips and enabling the light from the plurality of LED chips to transmit; and the lamp cap (7) is arranged on the opposite side of the spherical cover (3) relative to the heat dissipation component (5).

Description

The LED bulb

Technical field

The utility model relates to and possesses the LED bulb of led chip as light source.

Background technology

As the substitute products of so-called incandescent lamp bulb, the LED bulb that led chip is installed begin general with.The LED bulb has long advantage of power saving and life-span with respect to incandescent lamp bulb.

Figure 27 representes an example (for example with reference to patent documentation 1) of present LED bulb.LED bulb X shown in this figure possesses led module 91, cover 92, thermal component 93 and lamp holder 95.Led module 91 is luminescence units of LED bulb X, is built-in with led chip (diagram slightly).The light transmission that cover 92 makes from led module 91, shape roughly spherical in shape.Thermal component 93 is used to make the heat from led module 91 to shed, and for example is made up of aluminium.Be formed with a plurality of lugs 94 that are used to improve radiating effect at thermal component 93.Lamp holder 95 is the positions that are used for LED bulb X is installed on the ligthing paraphernalia that incandescent lamp bulb uses.

But led module 91 possesses lead or the substrate (all omitting diagram) that is equipped with above-mentioned led chip.Therefore, the size of led module 91 is obviously big than above-mentioned led chip.In the time will improving the packing density of a plurality of led modules 91, led module 91 is interfering with each other.Therefore, there are the high brightnessization of obstruction LED bulb X or the problem of luminenscence homogenization.

In addition, Figure 43 representes that also the same example of present LED bulb (with reference to patent documentation 1, in order to distinguish, to have added the different drawings mark and described.)。LED bulb 900 shown in this figure possesses a plurality of led module 901, spherical cover 902, LED substrate 903, thermal component 904 and lamp holder 905.Led module 901 is luminescence units of LED bulb 900, is built-in with led chip (diagram slightly).Spherical cover 902 makes the light transmission from led module 901, shape roughly spherical in shape.For example be at LED substrate 903 a plurality of led modules 901 are installed rectangularly, LED substrate 903 is installed on thermal component 904.Thermal component 904 is used to make the heat from led module 901 to shed, and for example is made up of aluminium.Lamp holder 905 is the positions that are used for LED bulb 900 is installed on the ligthing paraphernalia that incandescent lamp bulb uses.

When LED bulb 900 is luminous, be passed to thermal component 904 via LED substrate 903 from the heat of a plurality of led modules 901.At LED substrate 903, for example middle body is that the heat transfer efficiency of thermal component 904 is low more under the significant high temperature equitemperature situation pockety.In addition, owing to heat from a plurality of led modules 901, the air heating in the spherical cover 902.Heat radiation major part from this air is the heat radiation via spherical cover 902.Spherical cover 902 is owing to be made up of glass or resin, and pyroconductivity is not too high.Like this, LED bulb 900 is pursued the heat radiation when further raising is luminous.

Patent documentation 1: TOHKEMY 2010-56059 communique

Summary of the invention

The utility model is based on above-mentioned situation and accomplishes, and its purpose is to provide a kind of can realize high brightnessization or luminenscence homogenization, and promotes the LED bulb from the heat radiation of led chip.

First embodiment of the utility model provides a kind of LED bulb, it is characterized in that, comprising: comprising: substrate, and it has interarea, and is made up of pottery; A plurality of led chips, it is installed on the above-mentioned interarea of aforesaid substrate; Thermal component, it supports aforesaid substrate, and will be from the heat of above-mentioned led chip via the aforesaid substrate transmission; Spherical cover, it covers above-mentioned a plurality of led chip, and makes the light transmission from above-mentioned a plurality of led chips; And lamp holder, it is installed in a side opposite with above-mentioned spherical cover with respect to above-mentioned thermal component.

In the preferred implementation of first embodiment of the utility model, be formed with the Wiring pattern with above-mentioned a plurality of led chip conductings at aforesaid substrate, possess the reflecting layer of at least a portion that covers above-mentioned Wiring pattern.

In the preferred implementation of first embodiment of the utility model, above-mentioned reflecting layer is a white.

In the preferred implementation of first embodiment of the utility model, above-mentioned led chip has: the sub-installation base plate that is made up of Si; With the semiconductor layer that is installed on this sub-installation base plate; And; The mode that above-mentioned led chip is positioned at the aforesaid substrate side with above-mentioned sub-installation base plate is installed on the above-mentioned interarea of aforesaid substrate; Above-mentioned reflecting layer will cover towards at least a portion of the side of the above-mentioned sub-installation base plate of the direction vertical with the normal direction of above-mentioned interarea, and constitutes by comparing the higher material of reflectivity with above-mentioned sub-installation base plate.

In the preferred implementation of first embodiment of the utility model, above-mentioned reflecting layer covers the whole above-mentioned side of above-mentioned sub-installation base plate.

In the preferred implementation of first embodiment of the utility model, above-mentioned reflecting layer is all exposed above-mentioned semiconductor layer.

In the preferred implementation of first embodiment of the utility model, be manufactured with the Zener diode that is used to avoid above-mentioned semiconductor layer is applied excessive backward voltage at above-mentioned sub-installation base plate.

In the preferred implementation of first embodiment of the utility model, possess above-mentioned a plurality of led chips of covering, and make light-transmissive resin from the light transmission of above-mentioned a plurality of led chips.

In the preferred implementation of first embodiment of the utility model; Above-mentioned light-transmissive resin contains fluorescent material; This fluorescent material is through by the light stimulus from above-mentioned a plurality of led chips, send wavelength with from the different light of the light wavelength of above-mentioned a plurality of led chips.

In the preferred implementation of first embodiment of the utility model, possess the reflector that is formed with a plurality of openings, this reflector is installed on aforesaid substrate, and above-mentioned a plurality of openings have the inner surface that surrounds the above-mentioned led chip more than 1 separately.

In the preferred implementation of first embodiment of the utility model, above-mentioned inner surface is with on the normal direction of above-mentioned interarea, more away from above-mentioned interarea, in the face of above-mentioned interarea, tilts away from the mode of above-mentioned led chip more on the direction.

In the preferred implementation of first embodiment of the utility model, above-mentioned a plurality of openings comprise the part of accommodating above-mentioned a plurality of led chips.

In the preferred implementation of first embodiment of the utility model, above-mentioned a plurality of openings contain above-mentioned a plurality of led chip all.

In the preferred implementation of first embodiment of the utility model, above-mentioned a plurality of openings are watched rectangular shape from the normal direction of above-mentioned interarea.

In the preferred implementation of first embodiment of the utility model, above-mentioned a plurality of openings are watched from the normal direction of above-mentioned interarea and are the hexagon shape.

In the preferred implementation of first embodiment of the utility model, above-mentioned a plurality of openings are watched from the normal direction of above-mentioned interarea and are the circular of concentric circles.

In the preferred implementation of first embodiment of the utility model, the packing density of above-mentioned a plurality of led chips is more and more closeer towards periphery from the central authorities of aforesaid substrate.

In the preferred implementation of first embodiment of the utility model; The normal direction that above-mentioned thermal component has with above-mentioned interarea is axial cylindrical portion; Possess and be contained in above-mentioned cylindrical portion; And to the power supply unit of above-mentioned a plurality of led chip supply capabilities, be formed with 2 through holes at aforesaid substrate, above-mentioned power supply unit comprises having 2 cables inserting the heart yearn of logical above-mentioned through hole from the opposition side of above-mentioned interarea.

In the preferred implementation of first embodiment of the utility model; Be formed with Wiring pattern at aforesaid substrate; This Wiring pattern comprises 2 terminal pads that surround above-mentioned each through hole respectively; In the above-mentioned heart yearn from aforesaid substrate to the side-prominent part of above-mentioned interarea, engage with above-mentioned terminal pad through soft solder.

In the preferred implementation of first embodiment of the utility model, possess the light-transmissive resin that covers above-mentioned a plurality of led chips, above-mentioned 2 through holes are configured to clip above-mentioned light-transmissive resin.

In the preferred implementation of first embodiment of the utility model; Aforesaid substrate is for long rectangular-shaped; And comprise the light-emitting zone that is formed with above-mentioned light-transmissive resin and the non-luminous region adjacent with this light-emitting zone, above-mentioned 2 through holes are disposed at above-mentioned non-luminous region.

In the preferred implementation of first embodiment of the utility model, become to have chamfered section at the quadrangle of aforesaid substrate.

In the preferred implementation of first embodiment of the utility model, the rectangular shape of above-mentioned light-emitting zone, four limits of above-mentioned light-emitting zone and four limits of aforesaid substrate tilt each other.

In the preferred implementation of first embodiment of the utility model, possess clip, this clip fixes aforesaid substrate through aforesaid substrate being applied the elastic force of pushing to the direction opposite with the normal direction of above-mentioned interarea.

In the preferred implementation of first embodiment of the utility model, be formed with the heat transfer layer that contacts with above-mentioned clip at the above-mentioned interarea of aforesaid substrate.

In the preferred implementation of first embodiment of the utility model, above-mentioned heat transfer layer is made up of metal, and separates with above-mentioned Wiring pattern.

In the preferred implementation of first embodiment of the utility model, above-mentioned heat transfer layer is made up of the high thermal conductivity resin, and contacts with above-mentioned Wiring pattern.

In the preferred implementation of first embodiment of the utility model, above-mentioned thermal component comprises: cylindrical portion, and it is identical perpendicular to the cross sectional shape on the axial face consistent with the normal direction of above-mentioned interarea; With a plurality of lugs, each extends these a plurality of lugs laterally and extends on axially above-mentioned since above-mentioned cylindrical portion, and from above-mentioned when axially watching the thickness of slab of the identical part in position be certain.

In the preferred implementation of first embodiment of the utility model, above-mentioned cylindrical portion is a drum.

In the preferred implementation of first embodiment of the utility model, above-mentioned a plurality of lugs are that the center is configuration radially with the central shaft of above-mentioned cylindrical portion.

In the preferred implementation of first embodiment of the utility model, the more approaching above-mentioned led chip of size that makes progress with respect to above-mentioned axial footpath of above-mentioned each lug is big more.

In the preferred implementation of first embodiment of the utility model, above-mentioned thermal component is made up of aluminium.

According to such structure, dwindle above-mentioned led chip interval each other easily.Thus, can improve the packing density of above-mentioned a plurality of led chips.Therefore, can realize the high brightnessization of above-mentioned LED bulb.In addition, through improving packing density, be difficult to look and think that above-mentioned a plurality of led chip is separately as point light source light-emitting.Thus, above-mentioned LED bulb can be luminous more equably.

Second embodiment of the utility model provides a kind of LED bulb, it is characterized in that, comprising: a plurality of led chips; With the LED substrate of installed surface with the above-mentioned a plurality of led chips of supporting, wherein, the configuration density of above-mentioned a plurality of led chips on above-mentioned LED substrate do, and be higher than the configuration density in the center side of above-mentioned LED substrate in the configuration density of the peripheral side of above-mentioned LED substrate.

In the preferred implementation of second embodiment of the utility model, above-mentioned a plurality of led chips dispose along the periphery of above-mentioned LED substrate in the form of a ring.

In the preferred implementation of second embodiment of the utility model, the heat transfer bracket of above-mentioned LED substrate is installed; Support the thermal component of above-mentioned heat transfer bracket; With the lamp holder that is installed in the opposition side of above-mentioned heat transfer bracket with respect to above-mentioned thermal component.

In the preferred implementation of second embodiment of the utility model, possess the power supply unit that is used for above-mentioned led chip power supply, above-mentioned thermal component has the power supply of at least a portion of accommodating above-mentioned power supply unit and accommodates recess.

In the preferred implementation of second embodiment of the utility model, above-mentioned thermal component has a plurality of lugs.

In the preferred implementation of second embodiment of the utility model, in above-mentioned LED substrate by above-mentioned a plurality of led chip area surrounded, be formed with and be used for making the distribution that passes through at the distribution that uses from the power supply of above-mentioned power supply unit to use through hole.

In the preferred implementation of second embodiment of the utility model, above-mentioned heat transfer bracket have with above-mentioned LED substrate in the relative support plate in the back side of the opposition side that is positioned at above-mentioned installed surface.

In the preferred implementation of second embodiment of the utility model, above-mentioned heat transfer bracket has the side plate that extends to above-mentioned thermal component one side from the periphery of above-mentioned support plate.

In the preferred implementation of second embodiment of the utility model, be formed with the heat transmission through hole more than 1 at above-mentioned side plate.

In the preferred implementation of second embodiment of the utility model; Be formed with the recess more than 1 that forms towards the inboard part of above-mentioned support plate from above-mentioned surface of side plate through excision at above-mentioned heat transfer bracket; Through making this recess connect above-mentioned side plate, form above-mentioned heat transmission through hole.

In the preferred implementation of second embodiment of the utility model, above-mentioned heat transfer bracket has the flange that is connected with the opposition side periphery of the above-mentioned support plate of above-mentioned side plate.

In the preferred implementation of second embodiment of the utility model; Form to be useful on to make at above-mentioned flange and above-mentioned heat transfer bracket is installed on the bolt that the bolt of above-mentioned thermal component passes through use through hole, be configured for making the counterbore of the head sinking of above-mentioned bolt by the part of above-mentioned recess.

In the preferred implementation of second embodiment of the utility model, above-mentioned LED substrate and above-mentioned support plate are rounded, the cylindrical shape of above-mentioned side plate.

In the preferred implementation of second embodiment of the utility model, above-mentioned power supply unit possesses the power supply board that a part is clipped by above-mentioned heat transfer bracket and above-mentioned thermal component.

In the preferred implementation of second embodiment of the utility model, be formed with the heat transmission through hole at above-mentioned power supply board.

In the preferred implementation of second embodiment of the utility model, the above-mentioned heat transmission through hole of above-mentioned heat transfer bracket and the above-mentioned through hole of above-mentioned power supply board are arranged at position overlapped on the periphery direction of above-mentioned LED substrate.

In the preferred implementation of second embodiment of the utility model, above-mentioned power supply board has laterally and stretches out, and the extension more than 1 that is clipped by above-mentioned heat transfer bracket and above-mentioned thermal component.

In the preferred implementation of second embodiment of the utility model, be formed with solder layer on the surface of above-mentioned extension.

In the preferred implementation of second embodiment of the utility model, above-mentioned heat transfer bracket is made up of aluminium.

In the preferred implementation of second embodiment of the utility model, above-mentioned thermal component is made up of aluminium.

In the preferred implementation of second embodiment of the utility model, possess a plurality of led modules, these a plurality of led modules comprise separately: above-mentioned led chip; Cover above-mentioned led chip and make sealing resin from the light transmission of above-mentioned led chip; Be used to be installed in the mounting terminal on the above-mentioned LED substrate.

In the preferred implementation of second embodiment of the utility model, possess and contain above-mentioned LED substrate, make from the light diffusion of above-mentioned led chip and the spherical cover that sees through.

According to such structure, if above-mentioned a plurality of led module heat release, then through above-mentioned LED substrate transmit more heat near the part of periphery, the heat near the part of central authorities that is passed to above-mentioned LED substrate is less relatively.The part near central authorities that therefore, can the prevent above-mentioned LED substrate excessively high heat that can become.

Second embodiment of the utility model provides a kind of LED bulb, it is characterized in that, comprising: a plurality of led chips; LED substrate with installed surface of the above-mentioned a plurality of led chips of supporting; With the heat transfer bracket that above-mentioned LED substrate is installed, wherein,, be formed with the heat transmission through hole more than 1 in the zone that above-mentioned LED substrate is not installed at above-mentioned heat transfer bracket.

In the preferred implementation of second embodiment of the utility model, support the thermal component of above-mentioned heat transfer bracket; With the lamp holder that is installed in an opposite side with respect to above-mentioned thermal component with above-mentioned heat transfer bracket.

In the preferred implementation of second embodiment of the utility model, above-mentioned heat transfer bracket has the side plate that extends to above-mentioned thermal component side from the periphery of above-mentioned support plate.

In the preferred implementation of second embodiment of the utility model, above-mentioned heat transmission through hole more than 1 is formed at above-mentioned side plate.

In the preferred implementation of second embodiment of the utility model; Form to be useful at above-mentioned flange and make that above-mentioned heat transfer bracket is installed on the bolt that the bolt of above-mentioned thermal component passes through use through hole, be configured for making the counterbore of the head sinking of above-mentioned bolt by the part of above-mentioned recess.

In the preferred implementation of second embodiment of the utility model, above-mentioned power supply unit possesses power supply board, and the part of this power supply board is clipped by above-mentioned heat transfer bracket and above-mentioned thermal component.

In the preferred implementation of second embodiment of the utility model, the above-mentioned heat transmission through hole of above-mentioned heat transfer bracket and the above-mentioned through hole of above-mentioned power supply board are arranged on position overlapped on the periphery direction of above-mentioned LED substrate.

In the preferred implementation of second embodiment of the utility model, the configuration density of above-mentioned a plurality of led chips on above-mentioned LED substrate do, and be higher than the configuration density in the center side of above-mentioned LED substrate in the configuration density of the peripheral side of above-mentioned LED substrate.

In the preferred implementation of second embodiment of the utility model, in above-mentioned LED substrate by above-mentioned a plurality of led chip area surrounded, be formed with the distribution that is used for making the distribution that uses from the power supply of above-mentioned power supply unit to pass through and use through hole.

In the preferred implementation of second embodiment of the utility model, possess a plurality of led modules, these a plurality of led modules comprise separately: above-mentioned led chip; Cover above-mentioned led chip, and make sealing resin from the light transmission of above-mentioned led chip; Be used to be installed in the mounting terminal on the above-mentioned LED substrate.

According to such structure, above-mentioned a plurality of led module ambient airs can flow into the inboard of heat transfer bracket.Thus, the above-mentioned a plurality of led module ambient air heat that can shed.

The detailed description of other feature and advantage through carrying out with reference to the accompanying drawings of the utility model becomes clearer.

Description of drawings

Fig. 1 be the expression the utility model first embodiment the LED bulb one the example front elevation.

Fig. 2 is the sectional view along the II-II line of Fig. 1.

Fig. 3 is along the sectional view of the III-III line of Fig. 1 and major part amplification sectional view.

Fig. 4 is the major part sectional view along the IV-IV line of Fig. 3.

Fig. 5 be presentation graphs 1 the employed led chip of LED bulb one the example the major part sectional view.

Fig. 6 be presentation graphs 1 the LED bulb substrate fixture construction one the example the major part sectional view.

Fig. 7 be presentation graphs 1 the employed thermal component of LED bulb one the example plane.

Fig. 8 be presentation graphs 1 the employed thermal component of LED bulb one the example front elevation.

Fig. 9 be presentation graphs 1 the employed thermal component of LED bulb one the example ground plan.

Figure 10 is the sectional view along the X-X line of Fig. 8.

Figure 11 is substrate and the front elevation of electronic unit of the employed power supply unit of LED bulb of presentation graphs 1.

Figure 12 is substrate and the back view of electronic unit of the employed power supply unit of LED bulb of presentation graphs 1.

Figure 13 is the LED bulb for Fig. 1, is illustrated in the example of manufacturing approach of LED bulb, cuts off the stereogram of the operation of long size (microscler shape) parts.

Figure 14 is the LED bulb for Fig. 1, is illustrated in the example of manufacturing approach of LED bulb, cuts off the front elevation of the operation of short size parts.

Figure 15 is the LED bulb for Fig. 1, the front elevation of the assembling procedure in the example of the manufacturing approach of expression LED bulb.

Figure 16 is the sectional view of variation of LED bulb of first embodiment of expression the utility model.

Figure 17 is the sectional view of other variation of LED bulb of first embodiment of expression the utility model.

Figure 18 is the major part sectional view along the XVIII-XVIII line of Figure 17.

Figure 19 is the major part sectional view of other variation of LED bulb of first embodiment of expression the utility model.

Figure 20 is the sectional view of other variation of LED bulb of first embodiment of expression the utility model.

Figure 21 is the sectional view of other variation of LED bulb of first embodiment of expression the utility model.

Figure 22 is the major part sectional view along the XXII-XXII line of Figure 21.

Figure 23 is the sectional view of other variation of LED bulb of first embodiment of expression the utility model.

Figure 24 is the sectional view of other variation of LED bulb of first embodiment of expression the utility model.

Figure 25 is the sectional view of other variation of LED bulb of first embodiment of expression the utility model.

Figure 26 is the sectional view of other variation of LED bulb of first embodiment of expression the utility model.

Figure 27 is the front elevation of an example of the present LED bulb of expression.

Figure 28 is the front elevation of expression based on an example of the LED bulb of the embodiment 1 of second embodiment of the utility model.

Figure 29 is the sectional view along the II-II line of Figure 28.

Figure 30 is the stereogram of heat transfer bracket of the LED bulb of expression Figure 28.

Figure 31 is the plane of heat transfer bracket of the LED bulb of expression Figure 28.

Figure 32 is the major part sectional view along the V-V line of Figure 31.

Figure 33 is power supply board and the plane of thermal component of the LED bulb of expression Figure 28.

Figure 34 is the major part sectional view along the VII-VII line of Figure 31.

Figure 35 is the major part sectional view along the VIII-VIII line of Figure 31.

Figure 36 is the major part sectional view along the lX-IX line of Figure 31.

Figure 37 is the major part plane of variation of LED bulb of second embodiment of expression the utility model.

Figure 38 is the major part plane of other variation of LED bulb of second embodiment of expression the utility model.

Figure 39 is the major part plane of other variation of LED bulb of second embodiment of expression the utility model.

Figure 40 is the major part sectional view along the XIII-XIII line of Figure 39.

Figure 41 is the major part plane of other variation of LED bulb of second embodiment of expression the utility model.

Figure 42 is the sectional view of expression based on an example of the LED bulb of the embodiment 2 of second embodiment of the utility model.

Figure 43 is partial cross section's front elevation of an example of the present LED bulb of expression.

Description of reference numerals

A LED bulb

The Cp section

Cl cuts off line

Na is axial

Nd radially

1 substrate

The 1a chamfered section

The 1b non-luminous region

The 1c interarea

10 glassy layers

11 through holes

12 Wiring patterns

13 terminal pads

14 open-works (through hole, through hole) metal level

15 white resin layers (reflecting layer)

16 heat transfer layers

17 clips

18 bolts

The 2LED chip

21 sub-installation base plates (sub mount)

22 semiconductor layers

23 electric wires (wire)

24 light-transmissive resins

25 reflectors

26 openings

3 spherical covers

31 inner surfaces

32 outer surfaces

4 carriages

41 edge parts

42 pedestal part

43 through holes

44 bonding agents

5 thermal components

51 cylindrical portion

52 lugs

53 pedestal part

The long size parts (long parts) of 5A

The 51A cylindrical portion

The 52A lug

The short size parts of 5B (short parts)

The 51B cylindrical portion

The 52B lug

6 power supply units

61 substrates

62 electronic units

63 shells

The 63a cylindrical portion

The 63b threaded portion

The 63c projection

64 cables

The 64a heart yearn

64b coating portion

65 soft solders (scolding tin)

7 lamp holders

101,102 LED bulbs

200 led modules

201 led chips

202 leads

203 mounting terminal

204 shells

205 sealing resins

206 electric wires

300 LED substrates

301 installed surfaces

302 back sides

303 distributions are used through hole

304 soft solders

310 bolts

311 fixtures (fixing metal spare)

320 Wiring patterns

400 heat transfer brackets

410 support plates

411 distributions are used through hole

420 side plates

421 heat transmission through holes

422 recesses

430 flanges (ring flange)

431 bolts are used through hole

432 counterbores

441 bolts

442 fixing resins

500 thermal components

510 main bodys

511 lugs

512 power supplys are accommodated recess

513 cylindrical portion

514 flanges

520 septs

521 openings

522 bolts are used through hole

523 recesses

600 power supply units

610 power supply boards

611 heat transmission through holes

612 extensions (extension)

613 solder layer

620,621 electronic units

630 distributions

631 heart yearns

632 coating portions

710 lamp holders

720 spherical covers

The specific embodiment

(first embodiment)

Below, specify the preferred implementation of first embodiment of the utility model with reference to Fig. 1～Figure 27.

Fig. 1～Fig. 3 representes an example of the LED bulb of the utility model.The LED bulb A of this embodiment comprises: substrate 1, a plurality of led chip 2, spherical cover 3, carriage 4, thermal component 5, power supply unit 6 and lamp holder 7.LED bulb A is installed on incandescent lamp bulb as the substitute products of incandescent lamp bulb and uses with light fixture.

Substrate 1 is used to support a plurality of led chips 2, for example is made up of potteries such as aluminium oxide.As the structure of substrate 1, as shown in Figure 3, in this embodiment, substrate 1 roughly has a rectangular shape.As shown in Figures 2 and 3, be formed with 2 through holes 11 at substrate 1.

Fig. 5 is the major part amplification sectional view of expression substrate 1 and led chip 2.As shown in the drawing, be formed with Wiring pattern 12 at substrate 1.Wiring pattern 12 for example is made up of Ag, becomes the path to a plurality of led chip 2 supply capabilities.In this embodiment, as shown in Figure 3, Wiring pattern 12 comprises 2 terminal pads 13.Each terminal pad 13 surrounds each through hole 11.In this embodiment, 2 through

holes

11 and 2 terminal pads 13 dispose with the both sides of substrate 1 respectively discretely.In addition, as shown in Figure 5, also can be formed with glassy layer 10 at substrate 1.Glassy layer 10 is provided with in order to constitute the level and smooth face that is suitable for forming Wiring pattern 12.

Led chip 2 is as shown in Figure 5, is the structure that for example has the sub-installation base plate 21 that is made up of Si and the semiconductor layer 22 of range upon range of n type semiconductor layer, active layer and the p type semiconductor layer that is made up of GaN, sends for example blue light.Be formed with the electrode pad (diagram slightly) that forms in sub-installation base plate 21 1 sides at semiconductor layer 22.These electrode pads engage with the Wiring pattern that is formed at sub-installation base plate 21 (diagram slightly).Be formed with 2 electrodes (diagram slightly) at led chip 2, these electrodes are connected with Wiring pattern 12 through electric wire 23.The x direction of the led chip 2 of this embodiment is of a size of about 1.9mm, and the y direction is of a size of about 1.3mm.The joint of led chip 2 and Wiring pattern 12 (or substrate 1) uses has sneaked into the epoxy resin of filler that for example comprises Ag cream, epoxy resin or have the material of high conductance.From the promotion of the radiating effect of led chip 2, preferably these grafting materials are manufactured with the Zener diode that is used to prevent semiconductor layer 22 is applied excessive backward voltage at sub-installation base plate 21.

The led chip 2 of this embodiment is a so-called pair of electric wire type; But different therewith, also can use the led chip 2 of the so-called monofilament cords type that can install through a wire 23 or can not use the led chip 2 of the so-called flip-chip type that electric wire 23 installs.

Like Fig. 4 and shown in Figure 5, Wiring pattern 12 is covered by white resin layer 15.White resin layer 15 is equivalent to an example in said reflecting layer in the utility model.White resin layer 15 for example is the epoxy resin etc. of white, only opaque for from led chip 2, and constitute by the sub-installation base plate 21 high materials of luminance factor.White resin layer 15 covers side whole of sub-installation base plate 21.In addition, different with this embodiment, also can be the structure of a part that covers the side of sub-installation base plate 21 by white resin layer 15.

A plurality of led chips 2 are covered by light-transmissive resin 24.Light-transmissive resin 24 for example is made up of the material of in transparent epoxy resin or silicones, having sneaked into fluorescent material.This fluorescent material is through sending sodium yellow by the blue light excitation of for example sending from led chip 2.This sodium yellow and from the blue light colour mixture of led chip 2, thus white light obtained.In addition, as the material of light-transmissive resin 24, also can use and in transparent epoxy resin or silicones, sneak into through send the fluorescent material and the material that sends the fluorescent material of green light of red light by the blue light excitation.In this embodiment, a plurality of led chips 2 are the matrix shape ground configuration of 8 row * 8 row.The plan view that covers the light-transmissive resin 24 of these led chips 2 has a rectangular shape.

Spherical cover 3 is used to protect a plurality of led chips 2, for example is made up of transparent or semitransparent resin.In this embodiment, it is the semiellipsoid of long axis direction that the profile of spherical cover 3 is with axial Na.As shown in Figure 3, the outer surface 32 of spherical cover 3 is the face of dead smooth.Relative therewith, the inner surface 31 of spherical cover 3 is carried out asperities handle, it is for example to carry out through bead is implemented at the position that is used to form inner surface 31 in the mould that is used to form spherical cover 3 that this asperities is handled.In addition, except inner surface 31, also can outer surface 32 also implement identical asperities processing.

Carriage 4 for example is made up of aluminium, and is as shown in Figure 2, has edge part 41, pedestal part 42.Edge part 41 is a ring-type, occupies the outer peripheral portion of carriage 4.The bottom that edge part 41 is spherical cover 3 is contained in its inboard state, makes the installation of spherical cover 3 and thermal component 5 become easy.Pedestal part 42 is the positions that are positioned at the central authorities of carriage 4, in this embodiment, for discoideus.In pedestal part 42 substrate 1 is installed.In addition, be formed with 2 through holes 43 in pedestal part 42.As shown in Figure 6, substrate 1 is installed to pedestal part 42, carry out through bonding agent 44.In addition, also can use bonded adhesives to bring and replace bonding agent 44.

Thermal component 5 is used to make the heat from led chip 2 to shed, and is formed with cylindrical portion 51, a plurality of lug 52 and pedestal part 53.The thermal component 5 of this embodiment for example is made up of aluminium, is described below, and utilizes extrusion process to form.

Cylindrical portion 51 is the tubulars with the central shaft that on axial Na, extends, and in this embodiment, is drum.Cylindrical portion 51 is set at the length in the whole zone on the axial Na that spreads all over thermal component 5.Cylindrical portion 51 and the cross sectional shape vertical plane of axial Na are all identical at any part of axial Na.

A plurality of lugs 52 are the center with the central shaft of cylindrical portion 51, are radially from cylindrical portion 51 along Nd radially to form.As Fig. 7, Fig. 9 and Figure 10 clearly shown in, the thickness of slab of the part that the position in axially Na looks of each lug 52 is identical, all identical at any part of axial Na.In addition, adjacent lug 52 gap each other spreads all over a plurality of lugs 52 on axial Na ground, two ends exists, and the position that for example seals these gaps is not formed at thermal component 5.As Fig. 2 and Fig. 8 clearly shown in, the size of each lug 52 on Nd radially is on axial Na, and be big more near led chip 2 more.

Pedestal part 53 is arranged at axial Na one end of thermal component 5, is axially giving prominence to some from a plurality of lugs 52 on the Na.Like Fig. 7～shown in Figure 9, pedestal part 53 forms with the mode of on axial Na, stretching out (extending) near the part of the central shaft on the Nd radially in cylindrical portion 51 and a plurality of lugs 52.Pedestal part 53 contacts with the pedestal part 42 of carriage 4.Thus, be delivered to thermal component 5 from the heat of led chip 2 via the pedestal part 42 of substrate 1, carriage 4.

Power supply unit 6 is used for possessing substrate 61, a plurality of electronic unit 62,

shell

63 and 2 cables 64 to a plurality of led chip 2 supply powers.Substrate 61 for example is made up of glass epoxy resin, in this embodiment, for being that the length of length direction is rectangular-shaped with axial Na.A plurality of electronic units 62 are used to realize the function to a plurality of led chip 2 supply powers, like Figure 11 and shown in Figure 12, are installed on 2 faces of substrate 61.A plurality of electronic units 62 comprise electronic unit 62a～62i.Electronic unit 62a is a capacitor, and electronic unit 62b is a diode, and electronic unit 62c is the MOSFET element; Electronic unit 62d is a capacitor; Electronic unit 62e is a coil, and electronic unit 62f is a resistor, and electronic unit 62g is IC; Electronic unit 62h is a diode, and electronic unit 62i is a bridge diode.

Shell 63 for example is made up of translucent resin, has cylindrical portion 63a and threaded portion 63b.Cylindrical portion 63a be axially along axial Na the round-ended cylinder shape arranged, contain substrate 61 and a plurality of electronic units 62.Threaded portion 63b is formed at axial Na below with respect to cylindrical portion 63a, is the male thread shape with lamp holder 7 threaded engagement.

The external diameter of the cylindrical portion 63a of shell 63 is slightly littler than the internal diameter of the cylindrical portion 51 of thermal component 5.Thus, the cylindrical portion 63a of the shell 63 in the power supply unit 6 and the part of accommodating thereof are contained in the cylindrical portion 51 of thermal component 5.

2 cables 64 have heart yearn 64a and the 64b of coating portion.The end of each heart yearn 64a is installed on substrate 61.Like Fig. 4 and shown in Figure 6, the other end of each heart yearn 64a exposes in the interarea 1c of substrate 1 side through the through hole 43 of carriage 4 and the through hole 11 of substrate 1.The head portion of the heart yearn 64a that exposes from substrate 1 engages with terminal pad 13 through soft solder 65.The upper end is positioned at the upper portion of through hole 43 among the figure of the 64b of coating portion.Bonding agent 44 is between substrate 1 and pedestal part 42, and the more than half parts of upside among the figure of landfill through hole 43.Thus, in through hole 43, heart yearn 64a does not expose.

Lamp holder 7 is the parts that for example are used to be installed in the ligthing paraphernalia of using based on the common bulb of JIS specification.Lamp holder 7 is structures of specifications such as satisfied E17 by the JIS specification specifies, E26.Lamp holder 7 is through installing with the threaded portion 63b threaded engagement of the shell 63 of power supply unit 6.

One example of the manufacturing approach of LED bulb A is described then, below.

At first, form long size parts 5A shown in Figure 13.Long size parts 5A has cylindrical portion 51A and a plurality of lug 52A, and is identical about axial Na with the cross sectional shape on the vertical plane of axial Na.Cylindrical portion 51A is the drum with the central shaft that on axial Na, extends, and a plurality of lug 52A are that the center is configuration radially with the central shaft of cylindrical portion 51A.The formation of long size parts 5A utilizes extrusion process.Through pushing the steel billet (billet) that for example constitutes with high pressure, form long size parts 5A continuously with identical cross-sectional shape by aluminium at the mould (dies) of the above-mentioned cross sectional shape of formation of growing size parts 5A.

Then, should grow size parts 5A cuts off along illustrated a plurality of section Cp.A plurality of section Cp are with axially Na is vertical, and equally spaced configuration.Thus, grow size parts 5A and be divided into a plurality of short size parts 5B shown in Figure 14.

Then, along cut-out line Cl shown in Figure 12, cut off cylindrical portion 51B and a plurality of lug 52B of short size parts 5B.This cut-out is for example used, and electric wire carries out.Circumferentially carrying out in all directions of short size parts 5B along the cut-out of illustrated cut-out line Cl.Thus, obtain Fig. 7～thermal component 5 shown in Figure 10.

Then, shown in figure 15, power supply unit 6 is inserted into thermal component 5.In addition, substrate 1 is installed on the pedestal part 42 of carriage 4.And, 2 cables 64 are engaged with substrate 1.In addition, via carriage 4, spherical cover 3 is installed on thermal component 5.On the other hand, lamp holder 7 is installed on the threaded portion 63b of power supply unit 6.Through through above-mentioned operation, obtain Fig. 1～LED bulb A shown in Figure 3.

The effect of LED bulb A is described then.

According to this embodiment, led chip 2 is installed on the substrate 1 that is made up of pottery.Therefore, dwindle led chip 2 interval each other easily.Thus, can improve the packing density of a plurality of led chips 2.Therefore, can realize the high brightnessization of LED bulb A.In addition, through improving packing density, be difficult to look and recognize a plurality of led chips 2 separately as the situation of point light source light-emitting.Thus, LED bulb A can be luminous more equably.

White resin layer 15 as the reflecting layer suitably reflects the light from the semiconductor layer 22 of led chip 2.Thus, can prevent to absorb from the light quilt installation base plate 21 of semiconductor layer 22.Thus, can further promote the high brightnessization of LED bulb A.Particularly, white resin layer 15 covers the whole side of sub-installation base plate 21.This is suitable for preventing that the light from semiconductor layer 22 is absorbed.In addition, white resin layer 15 covers the major part of Wiring pattern 12.The Wiring pattern 12 that is made up of Ag is vulnerable to be called as the corrosion of migration (migration).White resin layer 15 is suitable for preventing the corrosion of this Wiring pattern 12.

The heart yearn 64a of cable 64 is surrounded by soft solder 65, is fixed in substrate 1 through this soft solder 65.Therefore, be difficult to that effect has excessive moment of flexure to heart yearn 64a.Therefore, can suppress cable 64 breaks away from from substrate 1.In addition, the part of the substrate 61 that is arranged at substrate 1 and power supply unit 6 in the cable 64 can appropriateness be out of shape.Therefore, even substrate 61 is mobile slightly with respect to substrate 1, also can prevent the excessive power of bonding part effect through the appropriateness distortion of cable 64 to heart yearn 64a and substrate 1.Different with this embodiment, if under the state that fell along substrate 1, heart yearn 64a is engaged with Wiring pattern 12, then through acting on the moment of cable 64, the possibility that Wiring pattern 12 peels off is bigger.According to this embodiment, even moment loading in cable 64, also is difficult to produce the power that Wiring pattern 12 is peeled off.Therefore, the protection of Wiring pattern 12 is excellent.

According to this embodiment, thermal component 5 does not have on axial Na, axially local the and outstanding significantly position of shape in the Na view.Therefore, can easily make a plurality of thermal components 5 from the long size parts 5A that uses extrusion molding to form.Use the manufacturing of extrusion molding to compare, can reduce manufacturing cost with the method for for example using die casting.Therefore, can reduce the manufacturing cost of LED bulb A.

Use under the situation of die casting, owing to need make founding materials spread all over each corner, therefore the sheet number of a plurality of lugs 52 is restricted.Relative therewith, in this embodiment,, there is not the not enough worry that spreads all over of material basically owing to use extrusion molding.Therefore, can set the sheet number of a plurality of lugs 52 more, be suitable for improving the radiating effect of thermal component 5.In addition, use the situation of extrusion process, compare, can improve the density of thermal component 5 with the situation of using die casting.The pyroconductivity that this helps to improve thermal component 5 helps improving the radiating effect of thermal component 5.

Because the size of lug 52 on Nd radially is on axial Na, big more near led chip 2 more, therefore, the position that can become high temperature because of the heat from led chip 2 increases the surface area that is used to dispel the heat more.Thus, can reasonably improve the radiating effect of thermal component 5.

Through substrate 1 is installed in pedestal part 53, can be easy to the heat from led chip 2 is passed to thermal component 5.

Through power supply unit 6 is contained in cylindrical portion 51, the private part that for example on axial Na, only is used to dispose power supply unit 6 is not set.This is for the miniaturization of LED bulb A, particularly the axially downsizing of Na size and preferred.

Inner surface 31 through with spherical cover 3 is an asperities, can make the light diffusion from led chip 2, and from outer surface 32 outgoing.Thus, outside LED bulb A, be difficult to each led chip 2 looked and think so-called spot light.Therefore, can LED bulb A be looked and think the same, perhaps steep further to look and think that whole spherical cover 3 is luminous than ordinary incandescent lamp with ordinary incandescent lamp bubble.If also outer surface 32 is carried out the asperities processing except inner surface 31, then can expect stronger diffusion effect.

Even under following situation; Also can easily tackle through the setting of change section Cp, cut-out line Cl: through form short size parts 5B and thermal component 5 from the formed long size parts 5A of the extrusion process that utilizes aluminium, the radially Nd that makes axial Na size different radiating parts 5 or lug 52 looks variform thermal component 5.

Figure 16～Figure 26 representes the different variation of structure of the each several part of LED bulb A.In these variation,, omit explanation for the key element additional phase identical Reference numeral together with said structure.

In the variation shown in Figure 16, the configuration of the shape of substrate 1 and through hole 11, terminal pad 13 and heart yearn 64a is different with above-mentioned LED bulb A.In this variation, substrate 1 is long rectangular shape as a whole.Quadrangle at substrate 1 becomes to have chamfered section 1a.The zone that is formed with light-transmissive resin 24 is to have a rectangular shape the luminous light-emitting zone in ground.On the other hand, the zone from light-transmissive resin 24 departs from the substrate 1 is non-luminous non-luminous region 1b.2 through holes 11 form at non-luminous region 1b side by side.

According to such structure, through chamfered section 1a is set, can enlarge light-transmissive resin 24, and prevent that substrate 1 from increasing undeservedly as light-emitting zone.

Figure 17 and variation shown in Figure 180 possess clip 17 and heat transfer layer 16.Heat transfer layer 16 forms through the higher resin of thermal conductivity ratio.Heat transfer layer 16 disposes with the mode of surrounding light-transmissive resin 24, and is partly overlapping with Wiring pattern 12 separately.The part near an end of clip 17 is fixed in carriage 4 through bolt 18.The other end of clip 17 is bending, pushes substrate 1 via heat transfer layer 16.

According to such structure, can be substrate 1 is fixing more firmly through clip 17.In addition, can the heat from led chip 2 be delivered to carriage 4 via Wiring pattern 12, heat transfer layer 16 and clip 17.The heat of transmitting to carriage 4 suitably is delivered to thermal component 5, is shed.

Figure 19 representes to form through metals such as Ag the example of heat transfer layer 16.In this case, heat transfer layer 16 separates with Wiring pattern 12 slightly.Through such structure, also transmit from the heat of Wiring pattern 12 to heat transfer layer 16, also can suitably shed from the heat of led chip 2.

Figure 20 representes the variation that the configuration of light-transmissive resin 24 is different.In this variation, light-transmissive resin 24 is with the posture setting of four limits with respect to the four limits inclination of substrate 1.In addition, heat transfer layer 16 is formed on four jiaos of peripheries of substrate 1.In such variation, also can realize high brightnessization, the luminenscence homogenization of LED bulb A, can promote the heat radiation of led chip 2.

Figure 21～Figure 26 representes to possess the variation of reflector 25.In Figure 21 and variation shown in Figure 22, reflector 25 roughly has a rectangular shape, and is installed on substrate 1.Reflector 25 for example is made up of white resin, is formed with a plurality of openings 26.A plurality of openings 26 are 4 * 4 dispose rectangularly.Each opening 26 roughly has a rectangular shape.Each opening 26 respectively surrounds 4 led chips 2.Shown in figure 22, the inner surface of opening 26, tilts away from the big more mode of substrate 1 on the normal direction of the interarea 1c of substrate 1 with mutual interior surface opposing distance each other more.

According to such structure,, can further promote the high brightnessization of LED bulb A through reflecting light from led chip 2 by reflector 25.Can avoid hindering the high-density installationization of led chip 2 through a plurality of led chips 2 being contained in opening 26 with reflector 25 adjacent opening 26 parts each other.

In variation shown in Figure 23, each opening 26 is the hexagon shape, and reflector 25 is the structures that are called as ojosa.Respectively contain a led chip 2 at each opening 26.According to such structure, can make from led chip 2 to opening 26 inner surface apart from homogenising.This high brightnessization, luminenscence homogenization and preferred for LED bulb A.In addition, the high-density installationization that also helps a plurality of led chips 2.

In variation shown in Figure 24, each opening 26 has a rectangular shape.The opening 26 that is positioned at central authorities contains 1 LED.8 openings 26 that surround central opening 26 are less relatively, contain 1 led chip 2 separately.In addition, it is relatively large to be disposed at outermost 12 openings 26, contains 4 led chips 2 separately.And the packing density of a plurality of led chips 2 is more and more closeer towards periphery from the central authorities of substrate 1.

According to such structure, in the part near central authorities of substrate 1, little as the density of the led chip 2 of heat releasing source, exothermic phase is to little.On the other hand, in the part near periphery of substrate 1, the density of led chip 2 is big, and exothermic phase is to greatly.Dispel the heat easily via clip 17 from this part near periphery.The arbitrary portion that therefore, can prevent substrate 1 becomes high heat partly.

In variation shown in Figure 25, reflector 25 is ojosas.Opening 26 in central authorities contains 1 led chip 2.6 openings 26 at the opening 26 that surrounds central authorities respectively contain 2 led chips 2.Respectively contain 3 led chips 2 being disposed at outermost 12 openings 26.Through such structure, can prevent that also the arbitrary portion of substrate 1 from becoming high heat partly.

In variation shown in Figure 26, a plurality of openings 26 are the circular or circular of concentric circles.The opening 26 of central authorities is rounded, contains 1 led chip 2.The opening 26 that surrounds the opening 26 of central authorities is circular, contains 12 led chips 2.Be disposed at outermost opening 26 and be circular, contain a plurality of led chips 2 of comparing with the opening 26 adjacent openings 26 of central authorities with higher density configuration.Through such structure, can prevent that also the arbitrary portion of substrate 1 from becoming high heat partly.

(second embodiment)

Below, specify the preferred implementation of second embodiment of the utility model with reference to Figure 28～Figure 42.In addition, in order to be different from first embodiment, additional different drawings mark is explained.

Figure 28 and Figure 29 represent the example of LED bulb of second embodiment of the utility model.The LED bulb 101 of this embodiment possesses a plurality of led module 200, LED substrate 300, heat transfer bracket 400, thermal component 500, power supply unit 600, lamp holder 710 and spherical cover 720.LED bulb 101 is as the substitute products of incandescent lamp bulb, is installed in the ligthing paraphernalia that incandescent lamp bulb uses to use.LED bulb 101 is and the suitable size of bulb of for example 60W type that diameter directly is about 60mm, about highly about 123mm.

LED substrate 300 is used to support a plurality of led modules 200, and the path to they supply powers is provided.In this embodiment, LED substrate 300 constitutes rounded shape by the higher compound copper-clad laminated board of glass of heat conduction.Installed surface 301 at LED substrate 300 is equipped with a plurality of led modules 200.The back side 302 of LED substrate 300 is installed on heat transfer bracket 400 through for example bonding agent or tacky on two sides band.Near the central authorities of LED substrate 300, be formed with distribution with through hole 303.The Wiring pattern of after the suitable position of LED substrate 300 is formed with, stating 320 (in Figure 28 and Figure 29, diagram slightly).

A plurality of led modules 200 are installed on the installed surface 301 of LED substrate 300.Like Figure 30 and shown in Figure 31, a plurality of led modules 200 are circularly along the periphery of LED substrate 300 and dispose.In this embodiment, the installation direction of a plurality of led modules 200 all unification is a direction (left and right directions among Figure 31).

Shown in figure 32, led module 200 possesses 201,1 pair of lead 202 of led chip, shell 204, sealing

resin

205 and 1 pair of electric wire 206.1 pair of lead 202 for example is made up of the Cu alloy, and one is equipped with led chip 201 therein.The face of the opposition side of the face that is equipped with led chip 201 in the lead 202 is for 200 of led modules are installed and the mounting terminal 203 of use.Led chip 201 is light sources of led module 200, can send for example blue light.Led chip 201 is connected through 1 pair of electric wire 206 with 1 pair of lead 202.Sealing resin 205 is used to protect led chip 201.Sealing resin 205 uses and comprises through being formed by the light-transmissive resin that sends the fluorescent material of sodium yellow from the light stimulus of led chip 201.As above-mentioned fluorescent material, also can the material that send red light be mixed use with the material that sends green light, replace sending the material of sodium yellow.Shell 204 for example is made up of white resin, is used for the light that sends to the side from led chip 201 is reflexed to the top.

In addition, different with this embodiment, also can be the structure that led chip 201 directly is installed on LED substrate 300.

Heat transfer bracket 400 is used to support LED substrate 300, and will be from the heat of LED substrate 300 to the thermal component transmission.Like Figure 29～shown in Figure 31, in this embodiment, heat transfer bracket 400 has support plate 410, side plate 420 and flange 430.As the material of heat transfer bracket 400, the preferred high material of pyroconductivity is for example used metals such as aluminium.

Support plate 410 is relative with the back side 302 of LED substrate 300, and for example install through bonding agent or tacky on two sides band at this back side 302.In this embodiment, support plate 410 rounded shapes, its diameter is bigger slightly than the diameter of LED substrate 300.Shown in figure 36, near the central authorities of support plate 410, be formed with distribution with through hole 411.

Like Figure 30, Figure 31 and shown in Figure 34, side plate 420 extends to thermal component 500 1 sides from the periphery of support plate 420, in this embodiment, is than diameter the drum that highly significant is low.Flange 430 extends in the direction of support plate 420 expansions from the following ora terminalis of side plate 420, in this embodiment, is circular.

Be formed with 4 heat transfers with through hole 421 at side plate 420.Through conducting heat with through hole 421, the outer space of heat transfer bracket 400 is connected with inner space.Be formed with 4 bolts with through hole 431 and 4 counterbores (countersunk) 432 at flange 430.Bolt is used to make bolt 441 to pass through with through hole 431, and bolt 441 is fixed in thermal component 500 with heat transfer bracket 400.In this embodiment, 4 bolts dispose with 90 ° of pitch-rows (picth, spacing) with through hole 431.Counterbore 432 is used to make the head of bolt 441 to sink in the flange 430, is that diameter is than the recess of bolt with the big circle of the diameter of through hole 431.In this embodiment, add man-hour in the boring of implementing to be used to form counterbore 432, not only cut flange 430, also cut fraction and the part of side plate 420 near the periphery of support plate 410.Thus, be formed with 4 recesses 422 at heat transfer bracket 400.The part that recess 422 connects on the thickness direction of side plate 420 becomes above-mentioned heat transfer with through hole 421.As the result of this formation method, be the state that constitutes counterbore 432 by the part of recess 422.Be filled with fixing resin 442 at counterbore 432.Fixing resin 442 is used to prevent the loosening of bolt 441, in this embodiment, is filled in the half the zone of pact of the opposition side of the side plate 420 in the counterbore 432.In addition, in Figure 30,, omit fixing resin 442 in order to understand conveniently.

Like Figure 28 and shown in Figure 29, thermal component 500 is equipped with heat transfer bracket 400, in this embodiment, comprises main body 510 and sept 520.As the material of thermal component 500, the preferred high material of pyroconductivity is for example used metals such as aluminium.In addition, different with this embodiment, also can thermal component 500 be formed as one-body molded article.

Main body 510 is semiellipsoid as a whole, has a plurality of lugs 511.A plurality of lugs 511 are formation radially towards the outside.Be formed with power supply in main body 510 and accommodate recess 512.It is the positions of accommodating at least a portion of power supply unit 600 that power supply is accommodated recess 512, in this embodiment, accommodates the major part of power supply unit 600.

Sept 520 is discoideus, is installed on upper end among the figure of main body 510.Be formed with opening 521 at sept 520.Opening 521 is provided with for fear of the interference with power supply unit 600.In addition, shown in figure 33, be formed with 4 bolts with through

hole

522 and 3 recesses 523 at sept 520.4 bolts are used to make bolt 411 to pass through with through hole 522, in this embodiment, dispose with 90 ° of spacings with the mode of surrounding opening 521.3 recesses 523 are to form to the mode of radially extending from opening 5212, and the thickness of depth ratio sept 520 is little.3 recesses 523 are arranged on to be avoided on 4 positions of bolt with through hole 522.

Power supply unit 600 is used for producing from for example commercial interchange 100V power supply and is suitable for direct current power that led module 200 (led chip 201) is lighted; And this direct current power supplied to led module 200 (led chip 201), possess power supply board 610, a plurality of electronic unit 620 and distribution 630.

Power supply board 610 for example is made up of the compound copper-clad laminated board of glass, rounded as a whole shape.Shown in figure 29, lower surface is equipped with a plurality of electronic units 620 in the figure of power supply board 610.Power supply board 610 disposes with the mode of the opening 521 of the sept 520 of sealing thermal component 500.

Shown in figure 33, be formed with 4 heat transmission through holes 611 at power supply board 610.Each heat transmission through hole 611 is formed at the zone near periphery of power supply board 610, in this embodiment, is the circular-arc slit along the periphery of power supply board 610.4 heat transmission through holes 611 dispose with 90 ° of spacings, on circumferentially (with the LED substrate 300 circumferential consistent) of power supply board 610, be arranged on 4 bolts with on the identical position of through hole 441.That is, shown in figure 34, above-mentioned circumferentially on heat transmission through hole 421 and the heat transmission through hole 611 of power supply board 610 of heat transfer bracket 400 be arranged on identical position.

Be provided with 3 extensions 612 at power supply board 610.Extension 612 upwards stretches out in the footpath of power supply board 610.The position of 3 extensions 612 is consistent with 3 recesses 523 of sept 520, and each extension 612 is contained in each recess 523.In this embodiment, be formed with solder layer 613 at an extension 612.In solder layer 613 and the electronic unit 620 should ground connection utmost point conducting.Shown in figure 35, extension 612 is clipped by the sept 520 of the flange 430 of heat transfer bracket 400 and thermal component 500.Thus, power supply board 610 is fixed.Solder layer 613 becomes the state between extension 612 and flange 430 and sept 520.

A plurality of electronic units 620 realize will for example commercial interchange 100V power supply converting to the function that is suitable for making the direct current power that led module 200 (led chip 201) lights.A plurality of electronic units 620 comprise for example capacitor, resistance, coil, diode, IC etc.For example, in Figure 29, accommodate the substantial middle of recess 512 at power supply, the outstanding electronic unit 620 in below is capacitors in figure more.

Like Figure 33 and shown in Figure 35, a plurality of electronic units 620 comprise electronic unit 621.Electronic unit 621 constitutes as three terminal type transistors with heat sink.Above-mentioned heat sink is disposed at power supply board 610 sides.Electronic unit 621 is configured in the position nearest with respect to solder layer 613 in a plurality of electronic units 620.In addition, in Figure 33 and Figure 35,, omit a plurality of electronic units 620 beyond the electronic unit 621 in order to understand conveniently.

Distribution 630 is used for the direct current power guiding LED substrate 300 from a plurality of electronic units 620, and is shown in figure 36, has heart yearn 631 and coating portion 632.Distribution 630 distribution through support plate 410 with the distribution of through hole 411 and LED substrate 300 with through hole 303, to the installed surface 301 sides extension of LED substrate 300.The upper end of coating portion 632 is stuck in support plate 410 or the LED substrate 300 on the thickness direction of support plate 410 or LED substrate 300.Thus, in the distribution 630 only heart yearn 631 be exposed to installed surface 301 sides of LED substrate 300.Heart yearn 631 bends with through hole 303 from distribution laterally, and its top engages through the part of soft solder 304 with the Wiring pattern that is formed at LED substrate 300 320.

Lamp holder 710 is the parts that for example are used to be installed in the ligthing paraphernalia of using based on the common bulb of JIS specification.Lamp holder 710 is structures of specifications such as satisfied E17 by the JIS specification specifies, E26.Lamp holder 710 is connected with power supply unit 600 through distribution.

Spherical cover 720 is used to protect led module 200, for example is made up of transparent or semitransparent glass or resin.Spherical cover 720 is fixed in thermal component 500 or heat transfer bracket 400.Can make the outer surface of spherical cover 720 and any one side or two faces of inner surface is asperities.As the method that constitutes this asperities, for example can enumerate bead.

The effect of LED bulb 101 is described then.

According to this embodiment, a plurality of led modules 200 are along the periphery configuration of LED substrate 300.Therefore, if 200 heat releases of a plurality of led module, then more heat is passed to the part near periphery of LED substrate 300, and the heat near the part of central authorities that is passed to LED substrate 300 is few relatively.The part near central authorities that therefore, can prevent LED substrate 300 exceedingly becomes high heat.

Heat transfer bracket 400 has the side plate 420 that is connected with the periphery of support plate 410.The heat that is passed to the periphery of LED substrate 300 is easy to transmit to side plate 420 via support plate 410.Thus, can efficiently the heat from a plurality of led modules 200 be transmitted to heat transfer bracket 400 from LED substrate 300.

Be formed with flange 430 in the lower end of side plate 420.This flange 430 is installed on thermal component 500.Thus, the heat that can suitably transmit from led module 200 to thermal component 500 via flange 430 from side plate 420.

Be arranged near the central authorities of LED substrate 300 distribution with through hole 303, avoid making the path of the distribution 630 of the part of from the Wiring pattern 320 of power supply unit 600 to LED substrates 300, accepting electric power to make a circulation irrelevantly.Through the periphery ground configuration of a plurality of led modules 200 near LED substrate 300, distribution does not almost have with through hole 303 and the possibility that led module 200 disturbs.

Shown in figure 34, through being formed at the heat transmission through hole 422 of heat transfer bracket 400, the air in the spherical cover 720 can flow into the inboard of heat transfer bracket 400.In addition, this air can flow into thermal component 500 sides through being formed at the heat transmission through hole 611 of power supply board 610.Thus, formed the ventilation path of leading to thermal component 500 in the spherical cover 720.Can efficiently the heat in the spherical cover 720 be transmitted to thermal component 500 through this ventilation path.

Heat transmission through hole 422 is formed at the side plate 420 of heat transfer bracket 400.Thus, through heat transmission through hole 422 is set, the area of support plate 410 dwindles hardly.Thus, can bring into play above-mentioned radiating effect, and suitably guarantee the configuration space of LED substrate 300.

In this embodiment,, can form counterbore 432 and heat transmission through hole 422 in the lump through being used to form the boring processing of the counterbore 432 that can make bolt 411 sinkings.

Through with 4 heat transmission through holes 422 with 90 degree spacings configurations, the ventilation path that can suppress to lead to from the heat transfer bracket 400 in the spherical cover 720 is inhomogeneous.Make the position consistency of heat transmission through hole 422 and heat transmission through hole 611, be suitable for avoiding ventilation path to become inhomogeneous, or become circuitous undeservedly form.

Shown in figure 35, through clip the extension 612 of power supply board 610, suitably fixed power source portion 600 by heat transfer bracket 400 and thermal component 500.As understanding based on Figure 31 and Figure 33, extension 612 be arranged at week of LED substrate 300 upwards and heat transmission through hole 422 nonoverlapping positions.Thus, can avoid making circuitous undeservedly, the obstruction of the ventilation path that forms by heat transmission through hole 422 and heat transmission through hole 611.For the solder layer that is formed at extension 612 613, can expect to improve the effect that clips the power of power supply board 610 by heat transfer bracket 400 and thermal component 500.In addition, can efficiently the heat from the more electronic unit 621 of thermal discharge be transmitted to thermal component 500 via solder layer 613.

Figure 37～Figure 41 representes the different variation of structure of each several part of the LED bulb 101 of second embodiment.In these variation, for the key element identical with said structure, additional phase Reference numeral together omits explanation.

The configuration of a plurality of led modules of variation shown in Figure 37 is with different with reference to the LED bulb 101 of Figure 28～Figure 36 explanation.In this variation, a plurality of led modules 200, length direction separately (direction that links anode electrode and negative electrode) along LED substrate 300 radially is configuration radially.The length direction of led module 200 can be with above-mentioned radially strictly not consistent, so long as get final product with the circumferential direction of intersecting of LED substrate 300.Each led module 200 is with in the couple of conductor shown in Figure 32 202, and the lead that is equipped with led chip 201 is positioned at the mode of the radial outside of LED substrate 300 and installs.

Through such variation, also can promote heat radiation from a plurality of led modules 200.In addition, be and dispose a plurality of led modules 200 radially, help making luminous intensity distribution more even from LED bulb 101.In addition, be disposed at LED substrate 300 in the outer part, have to be easy to the advantage of heat radiation carriage 400 transmission from the heat of led chip 201 through the lead 202 that will be equipped with led chip 201.

The fixing means of the LED substrate of variation shown in Figure 38 is with different with reference to the LED bulb 101 of Figure 28～Figure 36 explanation.In this variation, LED substrate 300 is fixed in heat transfer bracket 400 through bolt 310.

The fixing means of the LED substrate of Figure 39 and variation shown in Figure 40 is with different with reference to the LED bulb 101 of Figure 28～Figure 36 explanation.In this variation, LED substrate 300 is fixed in heat transfer bracket 400 through bolt 310 and fixture 311.Fixture 311 is made up of the alloy that contains Cu, Ni or Fe etc., is the band shape with sweep.One end of fixture 311 is fixed in heat transfer bracket 400 through bolt 311.The other end of fixture 311 is shown in figure 40, pushes LED substrate 300 with respect to heat transfer bracket 400 from installed surface 301 sides.The part that in LED substrate 300, contacts with fixture 311, as shown in the figure, can form the part of Wiring pattern 320.This part be should ground connection in the Wiring pattern 320 part.

In the variation shown in Figure 41, the structure of the counterbore 432 of heat transfer bracket 400 is with different with reference to the illustrated LED bulb 101 of Figure 28～Figure 36.In this variation, counterbore 432 is the Elliptical toroidal when the plane is watched.The major axis of counterbore 432 along heat transfer bracket 400 radially.Counterbore 432 is with respect to bolt 441, near the radial outside ground configuration of heat transfer bracket 400.The major part of fixing resin 442 is arranged on and is positioned at above-mentioned part near radial outside with respect to bolt 441 in the counterbore 432.According to such structure, can suitably suppress the loosening of bolt 441 through fixing resin 442, and the resin material of avoiding in the formation of fixing resin 442, being used to form fixing resin 442 gets into heat transmission through hole 421.

(embodiment 2)

Figure 42 representes the LED bulb based on the embodiment 2 of second embodiment of the utility model.The heat radiation carriage 400 of the LED bulb 102 of this embodiment is different with above-mentioned embodiment with the structure of thermal component 500.In this embodiment, the side plate 420 of heat radiation carriage 400 is from support plate 410 gets over towards flange 430 cone-shaped that diameter of section is big more.Thermal component 500 only is made up of main body 510, and main body 510 has a plurality of lug 511, cylindrical portion 513 and flange 514.Cylindrical portion 513 is compared with lug 511 in main body 510, is positioned at radially inner side.Cylindrical portion 513 is its upper end and the almost consistent shape and size in lower end of the side plate 420 of the carriage 400 that dispels the heat.Flange 514 is expanded to radial outside from the upper end of cylindrical portion 513.Flange 514 is roughly the same shape, to contact with flange 430 overlapping modes with respect to the flange 430 of heat radiation carriage 400.

According to such embodiment, the heat of in side plate 420, transmitting directly is passed to the cylindrical portion 513 of the main body 510 of thermal component 500.Therefore, can improve, can further promote heat radiation from led chip 201 from the heat transfer efficiency of heat radiation carriage 400 to thermal component 500.

The LED bulb of the utility model is not limited to above-mentioned embodiment.The concrete structure of the each several part of the LED bulb of the utility model can freely carry out various design alterations.

Claims

1. a LED bulb is characterized in that, comprising:

Substrate, it has interarea, and is made up of pottery;

A plurality of led chips, it is installed on the said interarea of said substrate;

Thermal component, it supports said substrate, and will be from the heat of said led chip via said substrate transmission;

Spherical cover, it covers said a plurality of led chip, and makes the light transmission from said a plurality of led chips; With

Lamp holder, it is installed in a side opposite with said spherical cover with respect to said thermal component.

2. LED bulb as claimed in claim 1 is characterized in that:

Be formed with the Wiring pattern with said a plurality of led chip conductings at said substrate,

The reflecting layer that possesses at least a portion that covers said Wiring pattern.

3. LED bulb as claimed in claim 2 is characterized in that:

Said reflecting layer is a white.

4. like claim 2 or 3 described LED bulbs, it is characterized in that:

Said led chip has: the sub-installation base plate that is made up of Si; With the semiconductor layer that is installed on this sub-installation base plate, and the mode that said led chip is positioned at said substrate-side with said sub-installation base plate is installed on the said interarea of said substrate,

Said reflecting layer will cover towards at least a portion of the side of the said sub-installation base plate of the direction vertical with the normal direction of said interarea, and constitutes by comparing the higher material of reflectivity with said sub-installation base plate.

5. LED bulb as claimed in claim 4 is characterized in that:

Said reflecting layer covers the whole said side of said sub-installation base plate.

6. LED bulb as claimed in claim 4 is characterized in that:

Said reflecting layer is all exposed said semiconductor layer.

7. LED bulb as claimed in claim 4 is characterized in that:

Be manufactured with the Zener diode that is used to avoid said semiconductor layer is applied excessive backward voltage at said sub-installation base plate.

8. like each described LED bulb in the claim 1～3, it is characterized in that:

Possess said a plurality of led chips of covering, and make light-transmissive resin from the light transmission of said a plurality of led chips.

9. LED bulb as claimed in claim 8 is characterized in that:

Said light-transmissive resin contains fluorescent material, and this fluorescent material is through by from the light stimulus of said a plurality of led chips, send wavelength with from the different light of the light wavelength of said a plurality of led chips.

10. like each described LED bulb in the claim 1～3, it is characterized in that:

Possess the reflector that is formed with a plurality of openings, this reflector is installed on said substrate, and said a plurality of openings have the inner surface that surrounds the said led chip more than 1 separately.

11. LED bulb as claimed in claim 10 is characterized in that:

Said inner surface is with on the normal direction of said interarea, and more away from said interarea, the mode of in the face of said interarea, getting over away from said led chip on the direction tilts.

12. LED bulb as claimed in claim 10 is characterized in that:

Said a plurality of opening comprises the part of accommodating said a plurality of led chips.

13. LED bulb as claimed in claim 10 is characterized in that:

Said a plurality of opening contains said a plurality of led chip all.

14. LED bulb as claimed in claim 10 is characterized in that:

Said a plurality of opening is watched rectangular shape from the normal direction of said interarea.

15. LED bulb as claimed in claim 10 is characterized in that:

Said a plurality of opening is watched from the normal direction of said interarea and is the hexagon shape.

16. LED bulb as claimed in claim 10 is characterized in that:

Said a plurality of opening is watched from the normal direction of said interarea and is the circular of concentric circles.

17., it is characterized in that like each described LED bulb in the claim 1～3:

The packing density of said a plurality of led chips is more and more closeer towards periphery from the central authorities of said substrate.

18., it is characterized in that like each described LED bulb in the claim 1～3:

The normal direction that said thermal component has with said interarea is axial cylindrical portion,

Possess and be contained in said cylindrical portion, and to the power supply unit of said a plurality of led chip supply capabilities,

Be formed with 2 through holes at said substrate,

Said power supply unit comprises having 2 cables inserting the heart yearn of logical said through hole from the opposition side of said interarea.

19. LED bulb as claimed in claim 18 is characterized in that:

Be formed with Wiring pattern at said substrate, this Wiring pattern comprises 2 terminal pads that surround said each through hole respectively,

In the said heart yearn from said substrate to the side-prominent part of said interarea, engage with said terminal pad through soft solder.

20. LED bulb as claimed in claim 18 is characterized in that:

Possess the light-transmissive resin that covers said a plurality of led chips,

Said 2 through holes are configured to clip said light-transmissive resin.

21. LED bulb as claimed in claim 20 is characterized in that:

Said substrate is for long rectangular-shaped, and comprises the light-emitting zone that is formed with said light-transmissive resin and the non-luminous region adjacent with this light-emitting zone,

Said 2 through holes are disposed at said non-luminous region.

22. LED bulb as claimed in claim 21 is characterized in that:

Quadrangle at said substrate becomes to have chamfered section.

23. LED bulb as claimed in claim 22 is characterized in that:

The rectangular shape of said light-emitting zone, four limits of said light-emitting zone and four limits of said substrate tilt each other.

24., it is characterized in that like each described LED bulb in the claim 1～3:

Possess clip, this clip fixes said substrate through said substrate being applied the elastic force of pushing to the direction opposite with the normal direction of said interarea.

25. LED bulb as claimed in claim 24 is characterized in that:

Said interarea at said substrate is formed with the heat transfer layer that contacts with said clip.

26. LED bulb as claimed in claim 25 is characterized in that:

Said heat transfer layer is made up of metal, and separates with said Wiring pattern.

27. LED bulb as claimed in claim 25 is characterized in that:

Said heat transfer layer is made up of the high thermal conductivity resin, and contacts with said Wiring pattern.

28., it is characterized in that like each described LED bulb in the claim 1～3:

Said thermal component comprises:

Cylindrical portion, it is identical perpendicular to the cross sectional shape on the axial face consistent with the normal direction of said interarea; With

A plurality of lugs, each extends these a plurality of lugs laterally and extends on axially said since said cylindrical portion, and from said when axially watching the thickness of slab of the identical part in position be certain.

29. LED bulb as claimed in claim 28 is characterized in that:

Said cylindrical portion is a drum.

30. LED bulb as claimed in claim 28 is characterized in that:

Said a plurality of lug is that the center is configuration radially with the central shaft of said cylindrical portion.

31. LED bulb as claimed in claim 30 is characterized in that:

Said each lug make progress with respect to said axial footpath that to be of a size of more approaching said led chip big more.

32., it is characterized in that like each described LED bulb in the claim 1～3:

Said thermal component is made up of aluminium.

33. a LED bulb is characterized in that, comprising:

A plurality of led chips; With

LED substrate with installed surface of the said a plurality of led chips of supporting, wherein

The configuration density of said a plurality of led chip on said LED substrate do, and be higher than the configuration density in the center side of said LED substrate in the configuration density of the peripheral side of said LED substrate.

34. LED bulb as claimed in claim 33 is characterized in that:

Said a plurality of led chip disposes along the periphery of said LED substrate in the form of a ring.

35., it is characterized in that: possess like claim 33 or 34 described LED bulbs:

The heat transfer bracket of said LED substrate is installed;

Support the thermal component of said heat transfer bracket; With

Be installed in the lamp holder of a side opposite with said heat transfer bracket with respect to said thermal component.

36. LED bulb as claimed in claim 35 is characterized in that:

Possess the power supply unit that is used for said led chip power supply,

Said thermal component has the power supply of at least a portion of accommodating said power supply unit and accommodates recess.

37. LED bulb as claimed in claim 36 is characterized in that:

Said thermal component has a plurality of lugs.

38., it is characterized in that like claim 36 or 37 described LED bulbs:

In said LED substrate by said a plurality of led chip area surrounded, be formed with and be used for making the distribution that passes through at the distribution that uses from the power supply of said power supply unit to use through hole.

39., it is characterized in that like claim 36 or 37 described LED bulbs:

Said heat transfer bracket have with said LED substrate in the relative support plate in the back side of the opposition side that is positioned at said installed surface.

40. LED bulb as claimed in claim 39 is characterized in that:

Said heat transfer bracket has the side plate that extends to said thermal component one side from the periphery of said support plate.

41. LED bulb as claimed in claim 40 is characterized in that:

Be formed with the heat transmission through hole more than 1 at said side plate.

42. LED bulb as claimed in claim 41 is characterized in that:

Be formed with the recess more than 1 that forms towards the inboard part of said support plate from said surface of side plate through excision at said heat transfer bracket,

Through making this recess connect said side plate, form said heat transmission through hole.

43. LED bulb as claimed in claim 42 is characterized in that:

Said heat transfer bracket has the flange that is connected with the opposition side periphery of the said support plate of said side plate.

44. LED bulb as claimed in claim 43 is characterized in that:

Form to be useful at said flange and make that said heat transfer bracket is installed on the bolt that the bolt of said thermal component passes through uses through hole,

The counterbore that is configured for making the head of said bolt to sink by the part of said recess.

45., it is characterized in that like each described LED bulb in the claim 40～44:

Said LED substrate and said support plate are rounded, the cylindrical shape of said side plate.

46., it is characterized in that like each described LED bulb in the claim 41～44:

Said power supply unit possesses power supply board, and the part of this power supply board is clipped by said heat transfer bracket and said thermal component.

47. LED bulb as claimed in claim 46 is characterized in that:

Be formed with the heat transmission through hole at said power supply board.

48. LED bulb as claimed in claim 47 is characterized in that:

The said heat transmission through hole of said heat transfer bracket and the said through hole of said power supply board are arranged on position overlapped on the periphery direction of said LED substrate.

49. LED bulb as claimed in claim 46 is characterized in that:

Said power supply board has laterally and stretches out, and the extension more than 1 that is clipped by said heat transfer bracket and said thermal component.

50. LED bulb as claimed in claim 49 is characterized in that:

Surface at said extension is formed with solder layer.

51. LED bulb as claimed in claim 35 is characterized in that:

Said heat transfer bracket is made up of aluminium.

52. LED bulb as claimed in claim 35 is characterized in that:

Said thermal component is made up of aluminium.

53., it is characterized in that like claim 33 or 34 described LED bulbs:

Possess a plurality of led modules, these a plurality of led modules comprise separately: said led chip; Cover said led chip and make sealing resin from the light transmission of said led chip; Be used to be installed in the mounting terminal on the said LED substrate.

54., it is characterized in that like claim 33 or 34 described LED bulbs:

Possess and contain said LED substrate, make from the light diffusion of said led chip and the spherical cover that sees through.

55. a LED bulb is characterized in that, comprising:

A plurality of led chips;

LED substrate with installed surface of the said a plurality of led chips of supporting; With

The heat transfer bracket of said LED substrate is installed, wherein

At said heat transfer bracket, be formed with the heat transmission through hole more than 1 in the zone that said LED substrate is not installed.

56. LED bulb as claimed in claim 55 is characterized in that, comprising:

Support the thermal component of said heat transfer bracket; With

57. LED bulb as claimed in claim 56 is characterized in that:

Said thermal component has a plurality of lugs.

58., it is characterized in that like each described LED bulb in the claim 55～57:

59. LED bulb as claimed in claim 58 is characterized in that:

Said heat transfer bracket has the side plate that extends to said thermal component side from the periphery of said support plate.

60. LED bulb as claimed in claim 59 is characterized in that:

Said heat transmission through hole more than 1 is formed at said side plate.

61. LED bulb as claimed in claim 60 is characterized in that:

62. LED bulb as claimed in claim 61 is characterized in that:

63. LED bulb as claimed in claim 62 is characterized in that:

64., it is characterized in that like each described LED bulb in the claim 60～63:

65., it is characterized in that like each described LED bulb in the claim 60～63:

Possess the power supply unit that is used for said led chip power supply,

66., it is characterized in that like the described LED bulb of claim 65:

67., it is characterized in that like the described LED bulb of claim 66:

Be formed with the heat transmission through hole at said power supply board.

68., it is characterized in that like the described LED bulb of claim 67:

69., it is characterized in that like the described LED bulb of claim 65:

70., it is characterized in that like the described LED bulb of claim 69:

71., it is characterized in that like claim 69 or 70 described LED bulbs:

In said LED substrate by said a plurality of led chip area surrounded, be formed with the distribution that is used for making the distribution that uses from the power supply of said power supply unit to pass through and use through hole.

72., it is characterized in that like each described LED bulb in the claim 66～70:

73., it is characterized in that like the described LED bulb of claim 72:

Surface at said extension is formed with solder layer.

74., it is characterized in that like claim 56 or 57 described LED bulbs:

Said thermal component is made up of aluminium.

75., it is characterized in that like each described LED bulb in the claim 55～57:

Said heat transfer bracket is made up of aluminium.

76., it is characterized in that like each described LED bulb in the claim 55～57:

Possess a plurality of led modules, these a plurality of led modules comprise separately: said led chip; Cover said led chip, and make sealing resin from the light transmission of said led chip; Be used to be installed in the mounting terminal on the said LED substrate.

77., it is characterized in that like each described LED bulb in the claim 55～57: