KR20170099221A - Test socket - Google Patents
Test socket Download PDFInfo
- Publication number
- KR20170099221A KR20170099221A KR1020160021324A KR20160021324A KR20170099221A KR 20170099221 A KR20170099221 A KR 20170099221A KR 1020160021324 A KR1020160021324 A KR 1020160021324A KR 20160021324 A KR20160021324 A KR 20160021324A KR 20170099221 A KR20170099221 A KR 20170099221A
- Authority
- KR
- South Korea
- Prior art keywords
- clip
- semiconductor chip
- hole
- shaft
- head
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a semiconductor chip test socket, and more particularly, to a semiconductor chip test socket having a heat dissipation cover, wherein the heat dissipation cover can easily be brought into close contact with the semiconductor chip, And a semiconductor chip test socket.
Description
The present invention relates to a semiconductor chip test socket, and more particularly, to a semiconductor chip test socket having a heat dissipation cover, wherein the heat dissipation cover can easily be brought into close contact with the semiconductor chip, And a semiconductor chip test socket.
The semiconductor device is subjected to a manufacturing process and then an inspection for determining the electrical performance is performed. The performance test of the semiconductor device is carried out with a semiconductor test socket formed so as to be in electrical contact with a terminal of the semiconductor device inserted between the semiconductor device and the test circuit board. In addition to the inspection of semiconductor devices, semiconductor test sockets are also used in a burn-in test process during the manufacturing process of semiconductor devices.
In the test process of such a semiconductor, considerable heat is generated. Failure to adequately dissipate such heat can result in failure of the test socket as well as the semiconductor.
In the past, a predetermined heat radiation cover was used. However, such a heat radiation cover can not be widely applied to semiconductors of various thicknesses, so that there is a disadvantage in the process of changing the heat radiation cover or a problem in which adhesion between the semiconductor and the heat radiation cover is not achieved .
SUMMARY OF THE INVENTION The present invention is conceived to solve the above problems, and an object of the present invention is to provide a test socket body, And it is an object of the present invention to provide a semiconductor chip test socket in which the heat dissipation effect of the semiconductor chip test socket can be further improved.
A semiconductor chip test socket according to an embodiment of the present invention includes: a test socket body on which a semiconductor chip is mounted; And a heat radiating cover disposed on the test socket body, wherein the heat radiating cover is in direct contact with the semiconductor chip mounted in the test socket body to dissipate heat generated during a test process,
The test socket body includes a main body portion on which a semiconductor chip is mounted, a socket hole disposed on the main body portion and vertically penetrating the semiconductor chip so as to be mounted on the main body portion, And a latch system for supporting the semiconductor chip mounted on the main body portion in accordance with the vertical displacement of the main cover,
Wherein the heat radiating cover has a lower heat radiating member whose lower surface is inserted into the socket hole and whose lower surface is in direct contact with the upper surface of the semiconductor chip, a lower heat radiating member which is located on the upper surface of the lower heat radiating member, An upper heat radiating member covering the body cover, a connection portion located between the lower heat radiator and the upper heat radiator, an elastic member disposed between the connection portion and the lower heat radiator, and a clip portion disposed at a side of the connection portion,
The lower heat discharging body is configured to be displaceable up and down by a predetermined distance with respect to the connecting portion, and the elastic member is disposed between the connecting portion and the lower heat emitting body to elastically bias the lower heat emitting body and the connecting portion in the vertical direction And the clip portion clips the main cover so that the heat radiating cover is fixed in position with respect to the socket body, and the elastic member urges the lower heat radiating member downward against the connecting portion, Is in close contact with the semiconductor chip.
Preferably, the lower heat sink includes a lower head having a predetermined area and thickness and inserted into the socket hole in a vertical direction, the lower surface being in close contact with an upper surface of the semiconductor chip, and a lower neck portion located on the lower head Wherein the upper heat discharging body includes an upper head having a predetermined area and thickness, an upper neck portion located below the upper head and having an area smaller than that of the upper head and closely connected to the lower neck portion, , A connecting body having a predetermined area and thickness, and a through hole vertically penetrating the center of the connecting body, wherein the upper neck portion is located in the through hole so that the connecting body surrounds the upper portion of the upper neck portion Wherein the thickness of the connecting body is less than the thickness of the upper neck portion, The connection body is vertically displaceable between the extension head and the upper head, the elastic member is disposed between the lower surface of the connection body and the upper surface of the lower neck portion, and is disposed between the connection portion and the lower heat sink And the elastic member applies elastic force in a downward direction with respect to the lower heat radiating member in a state in which the clip portion clips the main cover and the connection portion connected to the clip portion is fixed in position, Is brought into close contact with the semiconductor chip.
Preferably, the clip portion includes: a clip bar symmetrically disposed on both sides of the connection portion, the clip bar extending vertically; a clip jig provided at an intermediate portion of the clip bar and having a clip hole; And a clip spring for applying elasticity to the clip bar, wherein the connection body includes a second depression that is located on both sides corresponding to the position where the clip is disposed, the depression being recessed inward, Wherein the clip shaft passes through the clip hole and the shaft hole so that the clip bar is hinged with respect to the connection body, and the clip shaft passes through the clip hole and the shaft hole, And the upper head is disposed on both sides corresponding to the positions where the clip portions are disposed, And a spring insertion groove formed in the first depression and partially recessed inward in the inner direction so that the clip spring is arranged to apply elasticity to the clip bar in an outward direction The clip spring is disposed at a position higher than the clip jig and elastically biases the upper portion of the clip bar outwardly so that the clip bar is pivoted about the clip shaft and the lower end of the clip bar is deflected inward, And clips the socket body.
Preferably, the upper portion of the lower neck portion is provided with a spring beam extending in the vertical direction and having a predetermined length. The lower portion of the connection body has a predetermined length corresponding to the position of the spring beam, And the elastic member is disposed around the spring beam and inserted into the spring receiving groove.
Preferably, the connection portion includes a guide body extending a predetermined length to a lower portion of the connection body and having a guide hole formed on an inner side thereof so as to surround the lower neck portion, and a connection shaft passing through the guide body in a lateral direction, Wherein the connecting shaft has a shaft beam having a predetermined length and diameter and a shaft head provided at a longitudinal end of the shaft beam, the lower neck portion having a through hole penetrating laterally to penetrate the shaft beam, And the inner diameter of the through hole is larger than the diameter of the shaft beam.
Preferably, the difference between the thickness of the connecting body and the thickness of the upper neck portion, and the difference between the inner diameter of the through hole and the diameter of the shaft beam have the same configuration.
According to the present invention, since the heat radiating cover and the semiconductor chip are easily brought into close contact with each other, the heat radiation effect of the semiconductor chip testing socket can be further improved.
That is, since the lower heat dissipating body and the upper heat dissipating body can be appropriately displaced in the vertical direction with the heat dissipation cover fixed to the body portion by the clip portion, even when the semiconductor chip has various thicknesses, And it is also possible to achieve close contact between the heat radiating cover and the semiconductor chip without changing the structure of the heat radiating cover with respect to the semiconductor chips of various thicknesses.
1 is a view showing a semiconductor chip test socket according to the present invention.
2 is a view showing a test socket body of a semiconductor chip test socket according to the present invention.
3 and 4 are views showing a structure of a heat dissipation cover of a semiconductor chip test socket according to the present invention.
5 and 6 are views showing a structure of a lower heat sink of a semiconductor chip test socket according to the present invention.
7 and 8 are views showing a structure of an upper heat sink of a semiconductor chip test socket according to the present invention.
9 and 10 are views showing the structure of a connection portion of a semiconductor chip test socket according to the present invention.
11 and 12 are views showing the structure of a clip portion of a semiconductor chip test socket according to the present invention.
13 to 15 are views showing connection structures of respective parts of the heat dissipation cover of the semiconductor chip test socket according to the present invention.
16 is a view showing the size relation and the positional displacement between the connection shaft and the through hole of the heat dissipation cover of the semiconductor chip test socket according to the present invention.
17 is a view showing a connection between a test socket body and a heat radiation cover of a semiconductor chip test socket according to the present invention.
18 is a view showing the operation of the heat radiation cover according to the connection between the test socket body and the heat radiation cover of the semiconductor chip test socket according to the present invention.
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
Referring to FIG. 1, a semiconductor chip test socket according to an embodiment of the present invention includes a
2, the
3 and 4, the
First, the
The
The lower
The
The
At least one through
The upper surface of the
Next, the
The upper
The upper
The
On both sides of the
The
The
Next, the
The
The
The
As the
In addition, a predetermined
The
The shape and area of the
On the surfaces of the
The
Hereinafter, the
The
The
The
The
The
Hereinafter, the coupling relationship of each part of the
12, when the
The upper
Next, the combination of the
At this time, the
When the
Accordingly, the
15 and 16, FIG. 15 is a view illustrating a configuration in which the
Hereinafter, the operation of the
As shown in Fig. 17, the
First, when no external force is applied to the
18 (b), if the semiconductor chip or the like is positioned below the
Accordingly, the elastic force of the
According to the present invention, since the
That is, since the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary,
It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention.
10: Test socket body
11:
12: Body cover
13: Socket hole
14: Latch system
20: Heat-radiating cover
100: Lower heat sink
110: Lower neck portion
112: Through hole
114: receiving groove
116: spring beam
118: Lower contact surface
119: Second coupling hole
120: Lower head
122: Lower discharge surface
124: first coupling hole
130: Elastic spring
140:
200: upper heat sink
210: upper head
212: first depression
214: Spring internally inserted groove
220: upper neck
222: upper contact surface
224: third coupling hole
300: connection
310: connection body
312: second depression portion
314: extrusion head
316: Shaft hole
318: Spring receiving groove
319: Breaker
320: Guide body
322: Connection hole
332: Insertion hole
334: Guide hole
340: connecting shaft
342: Shaft Beam
344: Shaft head
400: clip portion
410: Clip bar
412: Clip jig
414: clip hole
416: clip home
420: Clip shaft
430: clip spring
Claims (6)
A test socket body on which a semiconductor chip is mounted;
And a heat radiating cover disposed on the test socket body,
Wherein the heat radiating cover is configured to directly heat the semiconductor chip mounted in the test socket body to dissipate heat generated during the test process,
The test socket body includes:
A main body portion on which the semiconductor chip is mounted,
A main cover disposed on the main body and having a socket hole vertically penetrating the semiconductor chip so as to be mounted on the main body, the main cover being vertically displaceable on the main body;
And a latch system which is opened and closed in accordance with the vertical displacement of the main cover to support the semiconductor chip mounted on the main body portion
The heat-
And a lower surface inserting body having a lower surface inserted into the socket hole and having a lower surface in direct contact with an upper surface of the semiconductor chip,
An upper heat radiator disposed at an upper portion of the lower heat radiator and connected to the lower heat radiator in close contact with the upper portion to cover the main cover,
A connection portion positioned between the lower heat sink and the upper heat sink,
An elastic member disposed between the connection portion and the lower heat sink,
And a clip portion disposed on a side of the connection portion
The lower heat discharging body is configured to be displaceable up and down by a predetermined distance with respect to the connecting portion, and the elastic member is disposed between the connecting portion and the lower heat emitting body to elastically bias the lower heat emitting body and the connecting portion in the vertical direction ,
The clip portion clips the main cover so that the heat radiating cover is positioned with respect to the socket body so that the lower heat radiating member applies elastic force downward to the connection portion by the elastic member, And is configured to be in close contact with the semiconductor chip.
The lower heat-
A lower head having a predetermined area and thickness and inserted into the socket hole in a vertical direction, the lower surface being in close contact with the upper surface of the semiconductor chip,
And a lower neck portion located on the lower head,
The upper heat-
An upper head having a predetermined area and thickness,
And an upper neck portion located below the upper head and having an area smaller than that of the upper head and closely connected to the lower neck portion,
The connecting portion
A connecting body having a predetermined area and thickness, and
And a through hole penetrating through the center of the connecting body in a vertical direction,
Wherein the upper neck portion is located in the through hole so that the connecting body is positioned between the upper head and the lower neck portion with the outer side of the upper neck portion,
Wherein the connecting body has a thickness smaller than the thickness of the upper neck portion so that the connecting body is vertically displaceable between the expansion head and the upper head, the elastic member is disposed between the lower surface of the connection body and the upper surface of the lower neck portion, And applying elasticity between the connection portion and the lower heat sink,
The elastic member urges the elastic member in a downward direction with respect to the semiconductor chip so that the lower surface of the lower head contacts the semiconductor chip, Close-coupled semiconductor chip test socket.
The clip portion includes:
Wherein the connecting portion is symmetrically disposed on both sides of the connecting portion,
A clip bar extending long in the vertical direction,
A clip jig provided at an intermediate portion of the clip bar and having a clip hole,
A clip shaft passing through the clip hole,
And a clip spring for applying elasticity to the clip bar,
The connection body includes:
A second depressed portion located on both sides corresponding to a position at which the clip portion is disposed,
A protruding head located on both sides of the second depression,
And a shaft hole penetrating the protruding head and provided so as to penetrate the clip shaft,
The clip shaft passes through the clip hole and the shaft hole so that the clip bar is hingedly connected to the connection body,
Wherein the upper head comprises:
A first depressed portion located on both sides corresponding to a position at which the clip portion is disposed, the first depressed portion being recessed inward;
And a spring insertion groove formed in the first depression and partially recessed inwardly,
The clip spring is disposed in the spring insertion groove so as to apply elastic force to the clip bar in the outward direction,
The clip spring is disposed at an upper position than the clip jig and elastically biases the upper portion of the clip bar outwardly so that the clip bar is rotated about the clip shaft to deflect the lower end of the clip bar inward, Semiconductor chip test socket to clip the body.
A spring beam extending in a vertical direction and having a predetermined length is provided on an upper portion of the lower neck portion,
A spring receiving groove having a predetermined length corresponding to the position of the spring beam and into which the spring beam is inserted is provided in a lower portion of the connecting body,
And the elastic member is disposed around the spring beam and inserted into the spring receiving groove.
The connecting portion
A guide body having a guide hole formed on an inner side thereof so as to surround an outer side of the lower neck portion,
And a connecting shaft which penetrates the guide body laterally,
The connecting shaft having a shaft beam having a predetermined length and diameter, and a shaft head provided at the longitudinal end of the shaft beam,
Wherein the lower neck portion has a through hole penetrating laterally to penetrate the shaft beam,
Wherein an inner diameter of the through hole is larger than a diameter of the shaft beam.
A difference between a thickness of the connection body and a thickness of the upper neck portion,
Wherein a difference between an inner diameter of the through hole in the vertical direction and a diameter of the shaft beam is equal to each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160021324A KR101809218B1 (en) | 2016-02-23 | 2016-02-23 | Test socket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160021324A KR101809218B1 (en) | 2016-02-23 | 2016-02-23 | Test socket |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170099221A true KR20170099221A (en) | 2017-08-31 |
KR101809218B1 KR101809218B1 (en) | 2017-12-14 |
Family
ID=59761183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160021324A KR101809218B1 (en) | 2016-02-23 | 2016-02-23 | Test socket |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101809218B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102081807B1 (en) * | 2019-11-06 | 2020-02-26 | 주식회사 에이디엔티 | Test socket for semiconductor chip |
CN112415359A (en) * | 2020-09-30 | 2021-02-26 | 深圳瑞波光电子有限公司 | Chip testing jig |
CN112437581A (en) * | 2019-08-21 | 2021-03-02 | 美光科技公司 | Heat sink for semiconductor device testing, such as pot machine testing |
KR20230040618A (en) * | 2021-09-16 | 2023-03-23 | 주식회사 티에프이 | Zig for seperating fixing pin in semiconductor package test socket |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003167021A (en) | 2001-12-03 | 2003-06-13 | Hitachi Ltd | Manufacturing method and shell for semiconductor device |
US7123037B2 (en) | 2004-02-27 | 2006-10-17 | Wells-Cti, Llc | Integrated circuit temperature sensing device and method |
JP2011060496A (en) | 2009-09-08 | 2011-03-24 | Yamaichi Electronics Co Ltd | Electric connection device |
-
2016
- 2016-02-23 KR KR1020160021324A patent/KR101809218B1/en active IP Right Grant
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112437581A (en) * | 2019-08-21 | 2021-03-02 | 美光科技公司 | Heat sink for semiconductor device testing, such as pot machine testing |
KR102081807B1 (en) * | 2019-11-06 | 2020-02-26 | 주식회사 에이디엔티 | Test socket for semiconductor chip |
CN112415359A (en) * | 2020-09-30 | 2021-02-26 | 深圳瑞波光电子有限公司 | Chip testing jig |
KR20230040618A (en) * | 2021-09-16 | 2023-03-23 | 주식회사 티에프이 | Zig for seperating fixing pin in semiconductor package test socket |
Also Published As
Publication number | Publication date |
---|---|
KR101809218B1 (en) | 2017-12-14 |
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