KR20170097318A - Fingerprint sensor module assembly integrated and fingerprint sensor module assembly integrated light guide with coverglass of electronic device - Google Patents

Fingerprint sensor module assembly integrated and fingerprint sensor module assembly integrated light guide with coverglass of electronic device Download PDF

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Publication number
KR20170097318A
KR20170097318A KR1020160018917A KR20160018917A KR20170097318A KR 20170097318 A KR20170097318 A KR 20170097318A KR 1020160018917 A KR1020160018917 A KR 1020160018917A KR 20160018917 A KR20160018917 A KR 20160018917A KR 20170097318 A KR20170097318 A KR 20170097318A
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KR
South Korea
Prior art keywords
cover window
fingerprint sensor
electronic device
sensor module
seating
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KR1020160018917A
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Korean (ko)
Inventor
김종욱
최우영
윤주안
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크루셜텍 (주)
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Priority to KR1020160018917A priority Critical patent/KR20170097318A/en
Publication of KR20170097318A publication Critical patent/KR20170097318A/en

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    • G06K9/0002
    • G06K9/00053
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142Sealing arrangements between parts, e.g. adhesion promotors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

The present invention relates to an electronic device cover window integral type fingerprint sensor module assembly and a fingerprint sensor module assembly guiding method which are simple in appearance and can enhance aesthetic sense in design and have improved waterproofness. An electronic device cover window integral type fingerprint sensor module assembly according to an embodiment of the present invention includes a cover window, a fingerprint sensor module, and an adhesive portion. Here, the cover window is provided in the electronic device, the image by the display module is displayed, and the seating portion is formed on the lower surface facing the inside of the electronic device. The fingerprint sensor module includes a fingerprint sensor having a sensing unit for sensing a fingerprint, and a substrate electrically connected to the fingerprint sensor, and is positioned at the seat. The bonding portion is provided between the seating portion and the fingerprint sensor module to fix the fingerprint sensor module to the seating portion. Further, the position of the fingerprint sensor can be guided to the user by using the light emitting portion formed on the edge of the seat portion.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a fingerprint sensor module assembly and a fingerprint sensor module assembly, and more particularly, to a fingerprint sensor module assembly and a fingerprint sensor module assembly,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device cover window integral type fingerprint sensor module assembly and a fingerprint sensor module assembly light guide. More particularly, the present invention relates to an electronic device cover window integral type fingerprint sensor module having a simple appearance and aesthetically pleasing appearance, And a light guide device and mode for identifying the assembly and the fingerprint sensor module assembly.

BACKGROUND ART [0002] Recently, with the public's attention focused on portable electronic devices including smartphones and tablet PCs, research and development on related technical fields are being actively conducted.

In many cases, a portable electronic device incorporates a touch screen integrated with a display as a display device as one of input devices for receiving a specific command from a user. In addition, portable electronic devices may be equipped with various function keys or soft keys as input devices other than a touch screen.

These function keys or soft keys may act as home keys, for example, to exit a running application and return to the home screen, or to return the user interface to a previous layer, And can operate as a menu key for calling up a write menu. Such a function key or a soft key may be realized by a method of sensing the capacitance of the conductor, a method of sensing the electromagnetic wave of the electromagnetic pen, or a hybrid method in which both methods are implemented, and may be implemented as a physical button.

In recent years, as the use of portable electronic devices has rapidly expanded to services requiring security, there has been an increasing tendency to install biometric sensors having functions of measuring biometric information on portable electronic devices for reasons of high security.

Biometric information includes fingerprints, veins of the hand, voices, irises, and fingerprint sensors are widely used as biometric sensors.

The fingerprint sensor is a sensor for detecting the fingerprint of a human being. By performing a user registration or authentication procedure through a fingerprint sensor, data stored in the portable electronic device can be protected and a security accident can be prevented in advance.

The fingerprint sensor can be manufactured in the form of a module including peripheral parts or structures, and can be effectively integrated in various electronic devices since it can be integrated in a physical function key.

In recent years, a navigation function for performing operations of a pointer, such as a cursor, has been integrated into a fingerprint sensor. The fingerprint sensor of this type is called a biometric track pad (BTP) .

There are capacitive type, optical type, ultrasonic type, thermal type, non-contact type, and so on. However, capacitive type fingerprint sensor which is excellent in sensitivity, robust against external environmental change and excellent in compatibility with portable electronic devices, It is widely used.

FIG. 1 is an exemplary view showing an electronic device to which a fingerprint sensor module is conventionally mounted, and FIG. 2 is a cross-sectional view taken along the line A-A of FIG.

1 and 2, a button hole 21 is formed in a cover window 20 of a conventional electronic device 10, and a fingerprint sensor module 30 is installed in a button hole 21. As shown in FIG.

The fingerprint sensor module 30 includes a fingerprint sensor 32 having a sensing unit 31 and a substrate 33 on which the fingerprint sensor 32 is mounted and on the upper surface of the fingerprint sensor 32, And the like are provided. Generally the fingerprint sensor module 30 coupled to the buttonhole 21 is mounted such that the top surface 35 of the layer 34 is at a height similar to the top surface 22 of the cover window 20.

On the other hand, electronic devices with various thicknesses are manufactured for each maker, and accordingly fingerprint sensor modules of various heights are required. In order to increase the height of the fingerprint sensor 32 or the thickness of the substrate 33, a method of adjusting the height of the fingerprint sensor 32 or adjusting the thickness of the substrate 33 is used. However, And there is a difficulty in management due to the presence of substrates of various thicknesses.

Since the button hole 21 is formed in the cover window 20 so that the fingerprint sensor module 30 can be mounted on the cover window 20, the gap between the button hole 21 and the fingerprint sensor module 30 is filled with moisture Or moisture in the air can be penetrated. The infiltration of moisture in the outside or moisture in the air may cause a short circuit in the fingerprint sensor module 30 and may cause malfunction or breakage of the fingerprint sensor 32 do. In the past, such external moisture or moisture in the air may additionally provide a sealing agent 40 for preventing penetration, which leads to an increase in cost and an additional process.

Such a problem can be commonly seen in fingerprint sensor modules formed through various packaging methods such as chip on board (COB), quad flat package (QFP), ball grid array (BGA), and wafer level package (WLP).

Further, in order to solve such a problem, when the fingerprint sensor is coupled to the seating part formed on the lower surface of the cover window, the user can not correctly recognize the position of the fingerprint sensor on the upper surface of the cover window.

In order to solve the above problems, an object of the present invention is to provide an electronic device cover window integral type fingerprint sensor module assembly and a cover window integral type fingerprint sensor which are simple in appearance and can be aesthetically enhanced in design, Emitting device and a mode for the light-emitting device.

According to an aspect of the present invention, there is provided a display device comprising: a cover window provided in an electronic device and displaying an image by a display module and having a seating portion formed on a lower surface facing the inside of the electronic device; A fingerprint sensor module including a fingerprint sensor having a sensing unit for sensing a fingerprint and a substrate electrically connected to the fingerprint sensor, the fingerprint sensor module being located in the seating unit; And a bonding part provided between the seating part and the fingerprint sensor module to fix the fingerprint sensor module to the seating part.

In one embodiment of the present invention, the seat portion may be provided on a surface of a lower surface of the cover window.

According to an embodiment of the present invention, the seat part may be formed in a groove shape corresponding to the shape of the fingerprint sensor, and the fingerprint sensor may be seated on the seat part.

In an embodiment of the present invention, the seating part may be formed by etching or cutting.

In one embodiment of the present invention, at least a part of the sensing unit and the fingerprint sensor may be located in the seating part.

In one embodiment of the present invention, at least a portion of the substrate may be further positioned within the seating portion.

In one embodiment of the present invention, the thickness of the cover window between the upper surface of the cover window and the upper surface of the sensing portion may be 200 to 300 um.

In an exemplary embodiment of the present invention, the cover window may include a display area for displaying an image and a bezel area where a print layer is provided and an image is not displayed, and the seating part may be formed in the bezel area.

In an exemplary embodiment of the present invention, a pattern of an engraved or embossed pattern may be further formed on an area of the upper surface of the cover window exposed to the user and corresponding to an upper side of the fingerprint sensor.

According to an embodiment of the present invention, an open area of a predetermined width is formed along a rim of the seating part on a lower surface of the cover window, and light is emitted to an upper surface of the cover window through the open area below the cover window And a light emitting unit for providing light.

In one embodiment of the present invention, the light emitting unit may include at least one main board on which the substrate or the fingerprint sensor module is electrically connected.

In one embodiment of the present invention, the cover window may have a display area in which an image is displayed, a bezel area in which a print layer is provided and an image is not displayed, and the seating part may be formed in the display area.

In one embodiment of the present invention, the cover window may be made of a material selected from glass, sapphire, zirconium and transparent resin.

In one embodiment of the present invention, the cover window may further include a non-display portion provided independently of the cover window, and the seating portion may be formed on the non-display portion.

In one embodiment of the present invention, the non-display portion may be made of resin or metal.

According to an embodiment of the present invention, the cover window may include a first cover window in which an upper surface is exposed to a user, an adhesive layer provided in a lower surface of the first cover window, And a second cover window joined to the lower surface, wherein the seating portion can be formed through the second cover window.

In one embodiment of the present invention, the thickness of the second cover window may correspond to the height of the fingerprint sensor.

In an embodiment of the present invention, a color layer may be provided on the surface of the seat portion, and the adhesion portion may be filled on the color layer.

According to an embodiment of the present invention, since the fingerprint sensor is coupled to the seating portion formed on the lower surface of the cover window, a continuous surface can be formed when viewed from the upper surface of the cover window, .

Further, according to an embodiment of the present invention, since the cover window has no continuous buttonhole like a conventional cover window and has a continuous surface, the penetration of external moisture or moisture in the air can be structurally blocked, Water resistance can also be improved.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

FIG. 1 is an exemplary view showing an electronic device in which a fingerprint sensor module is mounted.
Fig. 2 is an exemplary cross-sectional view taken along the line AA of Fig.
3 is an exemplary view showing an electronic device having an electronic device cover window integral type fingerprint sensor module assembly according to a first embodiment of the present invention.
FIG. 4 is a plan view of an electronic device cover window integral type fingerprint sensor module assembly according to a first embodiment of the present invention.
5 is a bottom view of an electronic device cover window integral type fingerprint sensor module assembly according to a first embodiment of the present invention.
6 is an exploded perspective view of an electronic device cover window integral type fingerprint sensor module assembly according to a first embodiment of the present invention.
Fig. 7 is an exemplary cross-sectional view taken along line BB in Fig. 4; Fig.
FIG. 8 is a cross-sectional view illustrating an example in which the fingerprint sensor module and the seating part are combined in the electronic device cover window integral type fingerprint sensor module assembly according to the first embodiment of the present invention.
FIG. 9 and FIG. 10 are cross-sectional views showing an example of the installation of an electronic device cover window integral type fingerprint sensor module assembly according to the first embodiment of the present invention.
FIG. 11 is an enlarged plan view of a part of an electronic device having an electronic device cover window integral type fingerprint sensor module assembly according to a first embodiment of the present invention.
Fig. 12 is a cross-sectional view showing an example of the installation of the light emitting portion along the CC line in Fig. 11. Fig.
13 to 15 are views showing examples of forming the surface of the cover window corresponding to the upper side of the fingerprint sensor in the electronic device cover window integral type fingerprint sensor module assembly according to the first embodiment of the present invention.
16 is a cross-sectional view illustrating an example of installation of an electronic device cover window integral type fingerprint sensor module assembly and an electronic device according to a second embodiment of the present invention.
17 is a plan view illustrating a cover window of an electronic device cover window integral type fingerprint sensor module assembly according to a third embodiment of the present invention.
18 is a plan view illustrating a cover window of an electronic device cover window integral type fingerprint sensor module assembly according to a fourth embodiment of the present invention.
19 is a perspective view illustrating an electronic device cover window integral type fingerprint sensor module assembly according to a fifth embodiment of the present invention.
20 is a perspective view showing a fingerprint sensor module of an electronic device cover window integral type fingerprint sensor module assembly according to a fifth embodiment of the present invention.
FIG. 21 is a cross-sectional exemplary view taken along the line GG in FIG. 19; FIG.
22 is an exploded perspective view illustrating an electronic device cover window integral type fingerprint sensor module assembly according to a fifth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is an exemplary view showing an electronic device having an electronic device cover window integral type fingerprint sensor module assembly according to a first embodiment of the present invention, FIG. 4 is a perspective view of the electronic device cover window integral fingerprint sensor according to the first embodiment of the present invention, 5 is a bottom view of an electronic device cover window integral type fingerprint sensor module assembly according to a first embodiment of the present invention, and FIG. 6 is a plan view of the electronic device cover window according to the first embodiment of the present invention. 7 is an exploded perspective view of the integral type fingerprint sensor module assembly.

3 to 7, the electronic device cover window integral type fingerprint sensor module assembly 100 according to the first embodiment of the present invention includes a cover window 110, a fingerprint sensor module 140, and a bonding portion 170 .

Here, the cover window 110 is provided on the front surface of the electronic device 200 and allows an image of the display module 210 (see FIG. 9) to be transmitted and displayed.

The cover window 110 may be made of a material selected from glass, sapphire, zirconium and transparent resin. When the cover window 110 is made of a glass material, various glass substrates such as a soda lime glass substrate, a non-alkali glass substrate, or a tempered glass substrate can be applied. As the transparent resin, acrylic or the like can be applied.

The cover window 110 may have a display area 111 in which an image is displayed and a bezel area 112 in which no image is displayed.

The bezel region 112 may be formed by providing a printing layer 113. The print layer 113 may be provided on the lower surface 114 of the cover window 110 facing the inside of the electronic device 200 when the cover window 110 is mounted on the electronic device 200, 110, respectively.

The fingerprint sensor module 140 may include a fingerprint sensor 141 and a substrate 145.

Various types of fingerprint sensor 141 according to the present invention can be applied. For example, the fingerprint sensor 141 may be a capacitive type, an optical type, an ultrasonic type, a heat sensing type, or a non-contact type. Hereinafter, for convenience of explanation, the fingerprint sensor 141 will be described in a capacitive manner.

The fingerprint sensor 141 may have a sensing unit 142 for sensing fingerprints. For example, the sensing unit 142 may be an array of sensing pixels having a sensing area. In addition, the sensing unit 142 may include a plurality of line-type driving electrodes and receiving electrodes. Also, the sensing unit 142 may be an AREA type having a plurality of image receiving units.

The sensing unit 142 can find the difference in capacitance due to the difference in height between the finger and the finger of the user, and can scan the image of the fingerprint to produce a fingerprint image. The sensing unit 142 can scan the image of the fingerprint not only when the user's finger is touched but also when the user's finger is in contact with the finger, thereby generating a fingerprint image.

In addition, the sensing unit 142 may have a fingerprint sensing function and a pointer manipulation function for sensing a fingerprint, and the fingerprint sensor 141 may be implemented as a biometric trackpad (BTP).

In addition, the sensing unit 142 may have a function of tracking the position of the user's finger. That is, the sensing unit 142 can detect input information or static electricity according to whether the user's finger is approaching or moving, and can have a pointer manipulation function for moving a pointer such as a cursor based on the movement.

In addition, the fingerprint sensor 141 may be electrically connected to the substrate 145. The electrical connection between the fingerprint sensor 141 and the substrate 145 can be achieved in various ways, for example, surface mount technology SMT; Surface Mount Technology) or the like.

The fingerprint sensor 141 may be mounted on various packaging such as a chip on board (COB), a quad flat package (QFP), a ball grid array (BGA), a wafer level package (WLP), a through silicon via ≪ / RTI >

The substrate 145 may have a mounting portion 146 on which the fingerprint sensor 141 is mounted and an extending portion 147 extending from the mounting portion 146. The extended portion 147 may be connected to a connector 230 (see FIG. 9) provided on the main board 220 (see FIG. 9) of the electronic apparatus 200. The board 145 may be a flexible printed circuit board (FPCB) .

The cover window 110 may have a seating part 115 formed on the lower surface 114 facing the inside of the electronic device 200. In this embodiment, the seating portion 115 may be formed in the bezel region 112.

The seating portion 115 may be formed on the surface of the lower surface 114 of the cover window 110 or may be formed in the shape of a groove in the cover window 110. [

When the seating part 115 is formed in the shape of a groove, the seating part 115 may be formed to correspond to the shape of the fingerprint sensor 141. Hereinafter, for convenience of explanation, it is assumed that the seat portion 115 is formed in the shape of a groove.

In the case where the seating part 115 is formed in a groove shape, the seating part 115 may be formed by a method of etching or cutting, and such a method may be appropriately selected according to the material of the cover window 110. For example, when the cover window 110 is made of a glass material, the seating part 115 may be formed by an etching or a computer numerical control (CNC) processing method. As the etching method, dry etching or wet etching may be used respectively, or alternatively, a method in which dry etching and wet etching are alternately performed can be used. Further, when the cover window 110 is made of a synthetic resin such as plastic or the like, the seating portion 115 may be molded at the time of molding of the cover window.

The fingerprint sensor module 140 may be coupled to the seating part 115 and the adhesive part 170 may be provided on the seating part 115 so that the fingerprint sensor module 140 is firmly coupled to the seating part 115 .

Here, the color layer 180 may be provided on the surface of the seating part 115. The color layer 180 may represent a color on the upper surface 116 of the cover window 110 together with the print layer 113 provided on the bezel area 112 of the cover window 110. [

The color layer 180 may be provided only on the bottom surface 117 of the seating part 115 or may be further provided on the side surface 118 of the seating part 115. [ In addition, the color layer 180 may have the same or different color as the printing layer 113.

The adhesion portion 170 may be provided on the color layer 180. That is, the color layer 180 may be provided first on the seating part 115, and the adhesion part 170 may be provided on the color layer 180.

The adhesive portion 170 may be formed in various forms such as a film form, a liquid form, and a powder form. For example, when the fingerprint sensor 141 is of a capacitive type, it is preferable that the adhesive portion 170 has a high dielectric constant and adhesion and a low viscosity, And the fingerprint sensor 141 is of the ultrasonic type, it is preferable that the fingerprint sensor 141 is non-conductive so as not to affect the sound waves.

The adhesive portion 170 may be formed entirely on the bottom surface 117 and the side surface 118 of the mounting portion 115 or may be provided on the bottom surface 117 of the mounting portion 115 for fixing the position of the fingerprint sensor 141 The side surface 118 of the seating part 115, that is, the outer surface of the fingerprint sensor 141 and the seating part 115 are fixed to the seating part 115 to mold and fix the fingerprint sensor 141, Or further filled in the space between the side surfaces 118 of the substrate 110. [

At least a part of the sensing part 142 and the fingerprint sensor 141 may be positioned in the seating part 115.

The thickness D1 of the cover window 110 between the upper surface 116 of the cover window 110 and the upper surface of the sensing portion 142 may be 200-300 um. The thickness D1 is derived in consideration of the strength of the cover window 110 and the sensing sensitivity of the fingerprint sensor 141. When the thickness D1 is less than 200 um, the cover window 110 can not provide sufficient strength If it exceeds 300 mu m, the sensing sensitivity of the sensing portion 142 may be lowered.

FIG. 8 is a cross-sectional view illustrating an example in which the fingerprint sensor module and the seating part are combined in the electronic device cover window integral type fingerprint sensor module assembly according to the first embodiment of the present invention.

Referring to FIG. 8A, the seating part 115 may be formed to correspond to the shape of the fingerprint sensor 141, and the fingerprint sensor 141 may be seated and fixed to the seating part 115. That is, both the sensing unit 142 and the fingerprint sensor 141 can be seated in the seating unit 115. The mounting portion 146 and the extending portion 147 of the substrate 145 may be provided on the outer side of the seating portion 115. [

8 (b), at least a part of the substrate 145 may be further placed in the seating part 115a. Here, a part of the substrate 145 positioned in the seating portion 115a may be the mounting portion 146. [ That is, the fingerprint sensor 141 including the sensing unit 142 and the mounting unit 146 of the substrate 145 can be seated together in the seating unit 115a.

8 (c), the mounting portion 146b of the substrate 145b may be formed to have a wider area than the fingerprint sensor 141. As shown in FIG. The portion 149 of the mounting portion 146b can be extended to the outside of the fingerprint sensor 141 when the fingerprint sensor 141 is fully seated in the seating portion 115. [ At this time, the length L of the mounting portion 146b extending to the outside of the fingerprint sensor 141 is not particularly limited.

8 (d), the upper part of the sensing unit 142 and the fingerprint sensor 141 may be positioned on the seating unit 115c. That is, according to the present embodiment, at least a part of the sensing unit 142 and the fingerprint sensor 141 may be positioned on the seating unit 115c.

As described above, according to the present invention, since the fingerprint sensor 141 is coupled to the seating portion 115 formed on the lower surface 114 of the cover window 110, the upper surface 116 of the cover window 110 is continuously formed It is possible to increase the aesthetic sense by simple appearance and design. Further, according to the present invention, since the cover window 110 has no continuous buttonhole like a conventional cover window, it can be structurally blocked from moisture or moisture in the air, Can also be improved.

FIG. 9 and FIG. 10 are cross-sectional views showing an example of the installation of an electronic device cover window integral type fingerprint sensor module assembly according to the first embodiment of the present invention.

First, as shown in FIG. 9, the fingerprint sensor 141 may be seated and fixed to the seating part 115 of the cover window 110. FIG. The mounting portion 146 of the substrate 145 may be provided so as to be in close contact with the lower surface 114 of the cover window 110. At this time, since the thickness of the substrate 145 may be sufficiently thin, the display module 210 may be provided closely or closely to the lower side of the electronic device cover window integrated fingerprint sensor module assembly 100. The cover window 110 and the display module 210 may be adhered by an adhesive (not shown) or the like.

Here, the display module 210 may include a touch screen panel (not shown), and a main board 220 of an electronic device may be provided below the display module 210. A connector 230 may be provided on the main board 220.

The fingerprint sensor 141 is coupled to the seating part 115 and the extended part 147 of the board 145 is coupled to the display module 210. In this case, And may be connected to the connector 230 of the main board 220. Such a connection method can be applied to a structure in which the touch screen panel is provided inside the display module 210, or in a structure provided above the display module 210, and the like.

10, a part of the fingerprint sensor 141 may be protruded to the outside of the seating part 115d. In this case, the display module 210d is not located up to the lower part of the fingerprint sensor 141 . For example, the length of the display module 210d may be shorter than the length of the display module 210 described with reference to FIG. 9, so that overlapping occurs between the display module 210d and the fingerprint sensor 141 I can not.

FIG. 11 is an enlarged plan view of a part of an electronic apparatus having an electronic device cover window integral type fingerprint sensor module assembly according to a first embodiment of the present invention. FIG. 12 is a cross- Fig.

11 and 12, an open area 119 having a predetermined width may be formed on the lower surface 114 of the cover window 110 along the rim of the seating part 115. As shown in FIG. The open area 119 may be a surface on which the print layer 113 provided on the lower surface 114 of the cover window 110 is not provided along the edge of the seating part 115.

A light emitting unit 250 may be provided under the cover window 110.

12A, one or more light emitting units 250 may be provided on the main board 220 of the electronic device 200, and the light emitting units 250 may be mounted on the periphery of the fingerprint sensor 141 To be mounted on the main board 220. The light emitting unit 250 may use a light emitting diode (LED) as a light source, and may include a plurality of light sources, such as a white LED, a red LED, and a green LED, .

The light emitting unit 250 may suitably use a light source having an upward direction directivity for irradiating light upward or a light source having a lateral directivity for emitting light in a lateral direction.

The light emitted from the light emitting unit 250 may be emitted to the upper surface 116 of the cover window 110 through the open area 119. Light emitted through the open area 119 and emitted to the upper surface 116 of the cover window 110 may represent the shape of the open area 119. This shape may be represented by an indicator that indicates the location of the fingerprint sensor 141 ) Function.

That is, in the present invention, since the upper side of the fingerprint sensor 141 is covered with the cover window 110, it may be difficult for the user to recognize the position of the fingerprint sensor 141. The light emitted through the open area 119 can inform the position of the fingerprint sensor 141 and can effectively inform the position of the fingerprint sensor 141 at night.

For example, the light emitting unit 250 may emit light in various colors when the user senses the fingerprint sensed through the fingerprint sensor 141 or the fingerprint is authenticated, It is possible to judge that the fingerprint of the fingerprint has been properly detected or authenticated as a luminescent color. In this case, when the fingerprint of the user is sensed or authenticated, the electronic device may notify the user that the fingerprint of the user has been properly sensed or authenticated in conjunction with the haptic function such as pattern change or vibration.

In addition, the light emitting unit 250 may emit light in conjunction with an application program of the electronic apparatus. For example, the electronic device may require the user to authenticate the user when the user executes an application program stored in the electronic device for financial transactions.

At this time, the light emitting unit 250 disposed in the vicinity of the fingerprint sensor 141 is converted from the standby mode to the active mode, so that light emitted from the periphery of the fingerprint sensor 141 can be provided to the user, 250 may emit light to inform the user of the position of the fingerprint sensor 141.

Also, when the electronic device is in the standby mode, the light emitting unit 250 may not provide the light to the user or may provide the light to the user that is weaker than the predetermined brightness. At this time, the fingerprint sensor 141 may be switched to the standby mode so as not to detect the fingerprint.

Thereafter, when the user switches the state of the electronic apparatus from the standby mode to the active mode, the light emitting unit 250 may provide the user with the preset lightness of the emitted light to inform the user of the position of the fingerprint sensor 141 have. At this time, the fingerprint sensor 141 can be switched to an active state for detecting the fingerprint of the user.

In addition, the light emitting unit 250 may be switched to a standby mode in which the user's fingerprint is detected or authenticated, or the light emitting unit 250 does not emit light after the user's fingerprint is detected or provides weak light to the user, .

Although the open area 119 is shown as a track shape in Fig. 11, this is for illustrative purposes only. The open area 119 is not limited to being formed along the rim of the seating part 115, .

In addition, the light emitting unit 250 may emit light of various colors by a combination of light sources, and may emit lights of different colors according to the functions, so that the user may recognize the functions, states, and the like in the color of light.

In addition, the open area 119 can be used in combination with various patterns to be described later with reference to Figs.

Referring to FIG. 12 (b), one or more light emitting units 250 may be provided on the substrate 145e. The light emitting unit 250 may be provided on the mounting portion 146e of the substrate 145e and the mounting portion 146e may extend to the outside of the fingerprint sensor 141. [

In addition, at least one of the substrate 145e and the main substrate 220 may include a vibrating unit (not shown). The vibrating unit may interlock with the light emitting unit 250 to generate a specific vibration, Function, status, and so on.

13 to 15 are views showing examples of forming the surface of the cover window corresponding to the upper side of the fingerprint sensor in the electronic device cover window integral type fingerprint sensor module assembly according to the first embodiment of the present invention.

13 to 15, an engraved or embossed pattern may be further formed on the upper surface 116 of the cover window 110 exposed to the user, corresponding to the upper side of the fingerprint sensor 141.

13A is a plan view of a cover window, and FIG. 13B is a cross-sectional view taken along a line D-D. 13, an engraved pattern 120 may be formed in an area of the upper surface 116 of the cover window 110 corresponding to the upper side of the fingerprint sensor 141. [ The engraved pattern 120 may have a geometric shape or the like.

Fig. 14 (a) is a plan view of the cover window, and Fig. 14 (b) is a cross-sectional view taken along the line E-E. Referring to FIG. 14, the engraved patterns 121 may be formed in a groove shape.

15A is a plan view of the cover window, and FIG. 15B is a cross-sectional view taken along the line F-F. 15, an embossed pattern 122 may be formed on the upper surface 116 of the cover window 110 in a region corresponding to the upper side of the fingerprint sensor 141. Here, the embossed pattern 122 may be formed by avoiding the fingerprint sensing area. FIG. 15 shows a ring shape protruding along the rim of the fingerprint sensor 141 with the embossed pattern 122, but this is illustrative and is not necessarily limited to such a shape.

On the other hand, the embossed pattern 122 can be made to protrude in a specific state, for example, when a user's finger is touched, in a state where the embossed pattern 122 is not normally projected. For this purpose, the embossed pattern 122 may be embodied as a separate component on the top surface of the cover window 110, and the component may comprise a polymeric material structure . ≪ / RTI >

16 is a cross-sectional view illustrating an example of installation of an electronic device cover window integral type fingerprint sensor module assembly and an electronic device according to a second embodiment of the present invention. In this embodiment, the configuration of the cover window may be different, and the other configuration is the same as that of the first embodiment described above, so the description is omitted.

As shown in FIG. 16, the cover window 310 may include a first cover window 320, an adhesive layer 330, and a second cover window 340.

The upper surface 321 of the first cover window 320 may be a surface exposed to the user and the adhesive layer 330 may be provided on the lower surface of the first cover window 320. [

The adhesive layer 330 may be applied or attached in the form of a film, for example, optically clear resin (OCR) or optically clear adhesive (OCA) may be used.

The second cover window 340 may be bonded to the lower surface of the first cover window 320 such that the upper surface thereof is attached to the adhesive layer 330 and the second cover window 340 and the first cover window 320 are formed of the same material ≪ / RTI >

The seating portion 341 may be formed in the second cover window 340 and the seating portion 341 may be formed through the second cover window 340. [

The color layer 350 may be provided at a position corresponding to the upper portion of the fingerprint sensor 141 in the lower surface of the first cover window 320 and may be provided on the side surface of the seating portion 341 of the second cover window 340 More can be provided.

The adhesive portion 370 may be further provided between the side surface of the seating portion 341 of the second cover window 340 and the side surface of the fingerprint sensor 141.

The thickness of the second cover window 340 may correspond to the thickness of the fingerprint sensor 141. In this case, since the seating portion 341 has to be formed through the second cover window 340, There is an advantage that the process for matching the depth of the recess 341 can be omitted.

The extended portion 347 of the substrate 345 on which the fingerprint sensor 141 mounted on the seating portion 341 is mounted may extend outside the display module 210 and may be connected to the connector 230 of the main substrate 220 Such a connection method may be applied to a structure in which a touch screen panel (not shown) is provided inside the display module 210, or a structure provided above the display module 210, and the like.

17 is a plan view illustrating a cover window of an electronic device cover window integral type fingerprint sensor module assembly according to a third embodiment of the present invention.

As shown in FIG. 17, the cover window 510 according to the present embodiment may further include a non-display portion 550 provided independently of the cover window 510. The seating portion 551 may be formed on the non-display portion 550. [

In this embodiment, the non-display portion 550 may be made of synthetic resin or metal such as plastic.

The seating portion 551 may be formed through processing after the non-display portion 550 is formed, or may be formed at the time of molding the non-display portion 550. [

In this embodiment, since the non-display portion 550 can be formed opaque due to the characteristics of the material forming the non-display portion 550, the print layer 113 (see FIG. 7) used in the first embodiment described above is omitted .

18 is a plan view illustrating a cover window of an electronic device cover window integral type fingerprint sensor module assembly according to a fourth embodiment of the present invention.

18, the bezel region 611 of the cover window 610 according to the present embodiment has a cover window 610 (see FIG. 4) as compared with the bezel region 112 (see FIG. 4) The area of the lower bezel region 611 may be smaller. That is, when the cover window of the same size is used as a reference, the display area 612 of the cover window 610 according to the present embodiment can be formed wider than the display area 111 (see Fig. 4) have.

The seating portion 651 may be formed in the display region 612. [

A fingerprint sensor (not shown) can be provided in the display area 612 because the seating part 651 is formed in the display area 612. Therefore, even in the both side areas 613 of the fingerprint sensor, Images can be displayed, so that it is possible to produce more various screens.

9, the image of the display module 210 is displayed in a lower portion of the cover window 110 (i.e., the display area 612) except for a portion where the fingerprint sensor 141 is provided .

FIG. 19 is a perspective view of an electronic device cover window integral type fingerprint sensor module assembly according to a fifth embodiment of the present invention, FIG. 20 is a perspective view of the fingerprint sensor module assembly of the electronic device cover window integral fingerprint sensor module assembly according to the fifth embodiment of the present invention, FIG. 21 is a cross-sectional view taken along a line GG in FIG. 19, and FIG. 22 is an exploded perspective view showing an electronic device cover window integral type fingerprint sensor module assembly according to a fifth embodiment of the present invention. In this embodiment, the configuration of the fingerprint sensor module may be different, and the other configuration is the same as that of the first embodiment described above, so the description is omitted.

19 to 22, the fingerprint sensor module 710 of the cover window integral type fingerprint sensor module assembly 700 according to the present embodiment includes a fingerprint sensor 711, a substrate 712, a base 720, (730).

Here, the fingerprint sensor 711 can be applied to the fingerprint sensor of the first embodiment.

The fingerprint sensor 711 may be mounted on the substrate 712, and in this embodiment, the substrate 712 may be a rigid PCB.

The base 720 may include a groove 721, a reflecting portion 724, and a penetrating portion 725.

The groove 721 may be recessed on the upper surface 722 of the base 720. A support portion 723 may be formed at the center of the groove portion 721 and a substrate 712 on which the fingerprint sensor 711 is mounted may be supported by the support portion 723. [ The support portions 723 may be provided in a pair to stably support the substrate 712.

A light emitting portion 714 may be provided on a lower surface 713 of the substrate 712. The light emitting unit 714 may be applied to all the light emitting units of the first embodiment.

The reflective portion 724 may be provided on the inner surface of the groove 721. The reflective portion 724 may be provided by vapor deposition, printing, spraying, plating, or the like. For example, the reflection portion 724 may be formed by coating a solution having a reflection function, or may be formed by coating a reflection film. Accordingly, the light emitted from the light emitting portion 714 provided on the lower surface 713 of the substrate 712 can be reflected by the reflecting portion 724. In addition, the reflecting portion 724 may cause the light to be totally reflected.

A penetrating portion 725 may be formed at the center of the base 720 and a connector portion 715 may be mounted at the center of the lower surface 713 of the substrate 712. The connector portion 715 may be exposed to the outside of the fingerprint sensor module 710 through the penetration portion 725 and may be electrically connected to a main board (not shown) provided in the electronic device.

The cover 730 covers the upper surface of the base 720 and fixes the fingerprint sensor 711.

The cover 730 may have an opening 731 formed therethrough. The fingerprint sensor 711 may be coupled to the opening 731 and the sensing unit (not shown) may be exposed through the opening 731.

The fixing portion 733 may protrude from the lower surface 732 of the cover 730 and the substrate 712 may be positioned inside the fixing portion 733. [

The cover 730 may be made of a light transmitting material, so that the light emitted from the light emitting portion 714 can be transmitted through the cover 730.

Meanwhile, the upper surface of the cover 730 may be provided with a light shielding portion 734, and the light shielding portion 734 may shield light. The light shielding portion 734 may not be provided in a part of the upper surface of the cover 730. [ Here, the partial area may be a band-shaped open area 735 spaced apart from the fingerprint sensor 711 by a predetermined interval and having a predetermined width along the rim of the fingerprint sensor 711.

The light shielding portion 734 may be provided by vapor deposition, printing, spraying, plating, or the like. For example, the light-shielding portion 734 may be formed by coating a solution having a function of blocking light, or by coating a film having a function of blocking light.

Therefore, the light traveling through the cover 730 can be emitted through the open area 735 provided on the upper surface of the cover 730. The open area 735 may function as an indicator as described above.

In the open area 735, a thin coating layer (not shown) may be further provided, and the coating layer may have a color.

In addition, the coating layer may be formed thin enough to allow light transmitted through the cover 730 to be emitted. The color layer can represent a color even when the light emitting portion 714 does not emit light, and can realize the function of the indicator even when the light emitting portion 714 does not emit light.

An adhesive 740 for bonding the base 720 and the cover 730 may be provided between the upper surface 722 of the base 720 and the lower surface 732 of the cover 730. There is no particular limitation on the type and shape of the adhesive 740, and for example, a double-sided adhesive tape can be used.

In addition, the fingerprint sensor module 710 may be coupled to the seating portion 751 of the cover window 750. In the present embodiment, the case where the seating portion 751 is formed in the shape of a groove will be described as an example. However, the following description is also applicable to the case where the seating portion 751 is formed by the lower surface of the cover window 750, .

A bonding portion 755 may be provided between the fingerprint sensor module 710 and the seating portion 751 for coupling the fingerprint sensor module 710 and the seating portion 751. [

The adhesive portion 755 may be provided entirely in the seating portion 751 and may have light transmittance so that light emitted from the open region 735 of the cover 730 may enter the cover window 750. [ It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims . It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100,700: Electronic cover window integral fingerprint sensor module assembly
110, 310, 510, 610, 750:
111: display area
112: Bezel area
113: Printed layer
115, 515, 651, 751:
119,735: Open area
120, 121,
140,710: Fingerprint sensor module
141,711: Fingerprint sensor
145,712: substrate
170, 755:
180: color layer
200: Electronic device
210: display module
220: main substrate
230: Connector
250:
320: first cover window
330: adhesive layer
340: second cover window
550: Non-
720: Base
730: cover

Claims (21)

A cover window provided on the electronic device and displaying an image by the display module and having a seating portion formed on the lower surface facing the inside of the electronic device;
A fingerprint sensor module including a fingerprint sensor having a sensing unit for sensing a fingerprint and a substrate electrically connected to the fingerprint sensor, the fingerprint sensor module being located in the seating unit; And
And a bonding part provided between the seating part and the fingerprint sensor module to fix the fingerprint sensor module to the seating part.
The method according to claim 1,
Wherein the seating portion is provided on a surface of a lower surface of the cover window.
The method according to claim 1,
Wherein the seating portion is formed in a groove shape corresponding to the shape of the fingerprint sensor, and the fingerprint sensor is seated and fixed to the seating portion.
The method of claim 3,
Wherein the seating portion is formed by etching or cutting.
The method of claim 3,
Wherein at least a portion of the sensing unit and the fingerprint sensor are located within the seating portion.
6. The method of claim 5,
Wherein at least a portion of the substrate is further positioned within the seating portion.
The method of claim 3,
Wherein the thickness of the cover window between the top surface of the cover window and the top surface of the sensing portion is 200-300 um.
The method according to claim 1,
Wherein the cover window has a display area in which an image is displayed and a bezel area in which a print layer is provided and an image is not displayed, and the seating part is formed in the bezel area.
The method according to claim 1,
Wherein an engraved or embossed pattern is further formed in an area of the upper surface of the cover window exposed to the user and corresponding to an upper side of the fingerprint sensor.
The method according to claim 1,
And a light emitting portion provided on a lower side of the cover window to provide light emitted to the upper surface of the cover window through the open region is formed on a lower surface of the cover window in a predetermined opening width along a rim of the seating portion Electronic device cover window integral fingerprint sensor module assembly.
11. The method of claim 10,
Wherein at least one of the light emitting units is provided on a main board to which the substrate or the fingerprint sensor module is electrically connected.
The method according to claim 1,
Wherein the cover window has a display area in which an image is displayed and a bezel area in which a print layer is provided and an image is not displayed, and the seating part is formed in the display area.
The method according to claim 1,
Wherein the cover window is made of a material selected from glass, sapphire, zirconium and transparent resin.
The method according to claim 1,
Wherein the cover window further comprises a non-display portion provided independently of the cover window, and the seating portion is formed on the non-display portion.
15. The method of claim 14,
And the non-display portion is made of a resin or a metal material.
The method according to claim 1,
The cover window
A first cover window in which an upper surface is exposed to a user,
An adhesive layer provided on a lower surface of the first cover window,
And a second cover window in which an upper surface is joined to a lower surface of the first cover window by the adhesive layer,
Wherein the seating portion is formed through the second cover window. ≪ Desc / Clms Page number 20 >
17. The method of claim 16,
Wherein the thickness of the second cover window corresponds to the height of the fingerprint sensor.
The method according to claim 1,
Wherein a color layer is provided on a surface of the seating portion, and the bonding portion is filled on the color layer.
11. The method of claim 10,
The light-
Wherein the cover window is integrally formed with the upper surface of the cover window and the upper surface of the cover window when the fingerprint is detected by the sensing unit.
A cover window provided on the electronic device and displaying an image by the display module, a cover window on which a seating part is formed on a lower surface facing the inside of the electronic device, and a sensing part for sensing a fingerprint formed on the seating part, An electronic device cover window integral fingerprint sensor module assembly guide method,
(a) detecting a fingerprint from a user using the sensing unit; And
(b) when the fingerprint of the user is sensed in the sensing unit, the light emitting unit formed in the periphery of the fingerprint sensor provides light emitted to the upper surface of the cover window;
And an electronic device cover window integral fingerprint sensor module assembly guiding method.
A cover window provided on the electronic device and displaying an image by the display module, a cover window on which a seating part is formed on a lower surface facing the inside of the electronic device, and a sensing part for sensing a fingerprint formed on the seating part, An electronic device cover window integral fingerprint sensor module assembly guide method,
(a) switching the standby mode of the electronic device to an active mode; And
(b) when the electronic device is switched to the active mode, the light emitting portion formed in the periphery of the fingerprint sensor provides light emitted to the upper surface of the cover window;
And an electronic device cover window integral fingerprint sensor module assembly guiding method.
KR1020160018917A 2016-02-18 2016-02-18 Fingerprint sensor module assembly integrated and fingerprint sensor module assembly integrated light guide with coverglass of electronic device KR20170097318A (en)

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KR1020160018917A KR20170097318A (en) 2016-02-18 2016-02-18 Fingerprint sensor module assembly integrated and fingerprint sensor module assembly integrated light guide with coverglass of electronic device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102103994B1 (en) * 2019-11-11 2020-04-23 (주)드림텍 Vehicle start switch device using fingerprint sensor
US11579664B2 (en) 2019-03-19 2023-02-14 Samsung Display Co., Ltd. Electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11579664B2 (en) 2019-03-19 2023-02-14 Samsung Display Co., Ltd. Electronic apparatus
KR102103994B1 (en) * 2019-11-11 2020-04-23 (주)드림텍 Vehicle start switch device using fingerprint sensor

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