KR20170079527A

KR20170079527A - Heat radiation device

Info

Publication number: KR20170079527A
Application number: KR1020150190208A
Authority: KR
Inventors: 이문호; 한창우; 정승붕; 문유림
Original assignee: 주식회사 효성
Priority date: 2015-12-30
Filing date: 2015-12-30
Publication date: 2017-07-10
Also published as: WO2017116085A1

Abstract

In the heat dissipating device of the present invention, a first flow path groove and a second flow path groove which are parallel to each other are formed on the upper surface, and a third flow path groove and a fourth flow path groove which are parallel to each other are formed on a lower surface, An intermediate structure for establishing a parallel relationship with the first flow path groove and the second flow path groove; An upper plate closely attached to an upper surface of the intermediate structure to form a first flow path by blocking an opening surface of the first flow path groove and forming a second flow path by covering an opening surface of the second flow path groove; A lower plate closely adhered to the lower surface of the intermediate structure to form a third flow path by blocking an opening surface of the third flow path groove and forming a fourth flow path by blocking an opening surface of the fourth flow path groove; And pumping means for simultaneously inputting the cooling fluid to the first flow path, the second flow path, the third flow path and the fourth flow path.

Description

[0001] HEAT RADIATION DEVICE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, and more particularly, to a heat dissipating device attached to a power device such as a CPU, an LSI, and a power semiconductor and capable of effectively dissipating heat emitted from the power device using a cooling fluid.

In recent years, the heat density of heat generating elements such as a CPU, an LSI, and a power semiconductor among electronic / electric parts constituting personal, home, and business electronic devices has increased, and the cooling performance required for the heat dissipating means for electronic devices has been increased.

In view of this situation, a heat-dissipating device of a type having a plate-like body provided with a cooling water supply passage and a cooling water discharge passage and directly attached to each of the heat-generating elements is applied.

However, in the heat dissipating device of the above-described direct heating type, it is not easy to secure a sufficient heat dissipating effect and mechanical strength against the production cost by employing a water-cooling type using a cooling fluid with a relatively small size. This also causes a problem of lowering the cooling efficiency and continuously increases the capacity of the pump for inputting / outputting the cooling fluid to / from the heat dissipating device.

Japanese Patent Laid-Open No. 2001-035981

The heat dissipating device of the present invention is intended to secure sufficient mechanical strength while increasing the cooling fluid circulation efficiency.

The heat dissipating device of the present invention intends to reduce the resistance of the flow path for the cooling fluid therein.

The heat dissipating device of the present invention is intended to efficiently and stably remove heat energy generated in a power device module, which is one of the core parts of various personal / household appliances such as a power conversion device.

The heat dissipating device according to one aspect of the present invention includes a first flow path groove and a second flow path groove which are parallel to each other on an upper surface thereof and a third flow path groove and a fourth flow path groove which are parallel to each other, Wherein the flow path and the fourth flow path groove have a parallel relationship with the first flow path groove and the second flow path groove; An upper plate closely attached to an upper surface of the intermediate structure to form a first flow path by blocking an opening surface of the first flow path groove and forming a second flow path by covering an opening surface of the second flow path groove; A lower plate closely adhered to the lower surface of the intermediate structure to form a third flow path by blocking an opening surface of the third flow path groove and forming a fourth flow path by blocking an opening surface of the fourth flow path groove; And pumping means for simultaneously inputting the cooling fluid to the first flow path, the second flow path, the third flow path and the fourth flow path.

Here, the intermediate structure may include an intermediate plate disposed between the upper plate and the lower plate in parallel with the upper plate and the lower plate; A first channel plate positioned between the upper plate and the intermediate plate and forming side walls of the first channel and the second channel; And a second channel plate disposed between the lower plate and the intermediate plate and forming side walls of the third and fourth flow channels.

Here, the upper plate has a first upper plate groove corresponding to the first flow channel groove and a second upper plate groove corresponding to the second flow channel groove, and the lower plate includes a first lower plate groove corresponding to the third flow channel groove and And a fourth upper plate groove corresponding to the fourth flow path groove may be formed.

Here, the first to fourth flow paths, which are located on one side surface of the heat dissipating device, are combined into one flow path to switch the flow direction, and then the first to fourth flow paths, A first flow path switching / And a second flow path which is located on the other side of the heat dissipation device and which converts the flow direction by combining the first flow path to the fourth flow path constituting a pair into one flow path, And a second channel switching / integration unit for distributing the second channel.

Here, the first to fourth flow paths may penetrate the thickness of the body in a single linearly curved shape so as to evenly cross the entire area of the intermediate structure.

According to an aspect of the present invention, there is provided a heat dissipating device comprising: a flat body that can be closely attached to a surface of an object to be cooled; A first flow path through the thickness of the body in a single linearly curved shape so as to evenly cover the entire area of the body; A second flow path passing through the thickness of the body in a shape parallel to the first flow path in the direction of the area; A third flow path passing through the thickness of the body in a shape parallel with the first flow path in the thickness direction; A fourth flow path passing through the thickness of the body in a shape parallel to the thickness direction of the second flow path; And pumping means for simultaneously inputting the cooling fluid to the first flow path, the second flow path, the third flow path and the fourth flow path.

The heat dissipating device of the present invention according to the above-described configuration has an advantage that sufficient mechanical strength can be secured while increasing the cooling fluid circulation efficiency of the heat dissipating device.

The heat dissipating device of the present invention is advantageous in that the flow path inside the heat dissipating device is formed in parallel to reduce the flow path resistance.

The heat dissipating device of the present invention has an advantage of reducing the increase of the surface area and the pressure rise due to the reduction of the channel width through the parallel channel structure for the cooling fluid.

The heat dissipating device of the present invention has an advantage of improving the heat transfer efficiency by increasing the surface area compared to the channel formed in the heat sink of the related art and improving the flow unbalance of each channel portion which is a disadvantage of the prior art.

The heat dissipation device of the present invention has an advantage that the system can be stably operated for a long time by effectively controlling the heat generation performance of the dispersed elements through a uniform flow distribution and keeping the temperature of the power element low.

The heat dissipation device of the present invention has an advantage that the system can be operated at a larger output power in the same size as the existing product by ultimately improving the performance of the power device cooling device.

When the heat dissipating device of the present invention is used, there is an advantage that a cooling fluid (for example, cooling water) can be circulated inside the heat sink by applying a pump having a lower pumping pressure and / or capacity.

By implementing the heat dissipating device of the present invention, it is possible to secure the strength of the heat sink having the parallel channel structure at a low cost.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view and plan view showing a heat dissipating device having a single flow path through a thickness of the body in a single linearly curved shape to evenly distribute the entire area of the body. FIG.
FIG. 2 is a cross-sectional view illustrating a heat dissipating device in which a plurality of parallel flow paths parallel to an area direction of a body are formed. FIG.
3 is a cross-sectional view of a heat sink according to an embodiment of the present invention;
FIGS. 4A and 4B are plan views showing the heat sink of the structure of FIG. 3 in such a manner that a plurality of separated parts are combined.
5 to 7 are cross-sectional views illustrating heat sinks according to another embodiment of the present invention, which may be fabricated in a form in which a plurality of discrete components are combined.
8 is a conceptual diagram showing an embodiment of a pumping means that can be applied to the heat sink of Figs. 3 to 7 described above.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

In describing the present invention, the terms first, second, etc. may be used to describe various elements, but the elements may not be limited by terms. Terms are for the sole purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being connected or connected to another element, it may be directly connected or connected to the other element, but it may be understood that other elements may be present in between .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

It is to be understood that the term " comprising, " or " comprising " as used herein is intended to specify the presence of stated features, integers, But do not preclude the presence or addition of steps, operations, elements, components, or combinations thereof.

In addition, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

Figure 1 shows a heat sink with a single flow path through the thickness t of the body in a single linearly curved shape to evenly pass the entire area of the body (U x W).

The illustrated single flow path structure has the advantage of increasing the cooling performance by circulating the cooling water evenly inside the heat sink by zigzag. However, since the cooling water is input to the single flow path by a large pressure, the capacity of the pump is increased have.

FIG. 2 illustrates a heat sink having a plurality of parallel flow paths (two parallel flow paths in FIG. 2) formed parallel to the area of the heat sink body in order to compensate for the disadvantage of a single flow path requiring a large pump capacity.

That is, in the figure, three flow paths constitute one set, and one set of flow paths has a shape passing through the thickness t of the body in a linearly bent shape so as to uniformly pass the entire area of the heat radiating plate body.

The heat sink structure of FIG. 2 has an advantage that a cooling fluid (for example, cooling water) can be circulated inside the heat sink by applying a pump having a lower pumping pressure than that of FIG. 1, There is a disadvantage in that it is difficult to secure sufficient mechanical strength of the body. On the other hand, if a high-strength material is used for sufficient mechanical strength, the process may become complicated or the manufacturing cost may increase.

3 shows a heat sink as a heat dissipating device according to an embodiment of the present invention.

The illustrated heat sink includes a planar body that can be closely attached to a surface of an object to be cooled; A first flow path (P1) passing through the thickness of the body in a single linearly curved shape so as to uniformly pass the entire area (UxW) of the body; A second flow path (P2) passing through the thickness of the body in a shape parallel to the first flow path (P1) in the area direction; A third flow path (P3) passing through the thickness of the body in a shape parallel to the first flow path (P1) in the thickness direction; A fourth flow path (P4) passing through the thickness of the body in a shape parallel with the second flow path (P2) in the thickness direction; And pumping means for simultaneously inputting the cooling fluid to the first flow path P1, the second flow path P2, the third flow path P3 and the fourth flow path P4.

Fig. 3 is a structure for compensating for the disadvantage of a single flow path which requires a large capacity of a pump. A plurality of parallel flow paths parallel to the area (U x W) direction and the thickness t direction of the heat sink body And a heat-radiating plate formed on the heat-radiating plate. It can be seen that one set of four flow paths arranged two-dimensionally in parallel constitutes a flow path having an inlet and a cross-sectional area of the cooling fluid formed in a row shape.

That is, in the figure, the four flow paths constitute one pair of flow paths so that two flow paths are parallel to each other in the area direction and the thickness direction, and one pair of flow paths forms a linear body bent in a straight line to cross the entire area of the heat radiating plate body t.

In other words, the first to fourth flow paths (P1 to P4) constituting one set are formed in such a manner as to penetrate through the thickness of the body in a single linearly curved shape so as to evenly cross the entire area of the intermediate structure The cooling fluid (cooling water) can be distributed to the heat dissipation device.

The heat sink structure of FIG. 3 has an advantage that a cooling fluid (for example, cooling water) can be circulated inside the heat sink by applying a pump having a lower pumping pressure than the case of FIG. 1, and at the same time, Is sufficiently thick, so that sufficient mechanical strength of the body can be secured. On the other hand, the manufacturing process is not significantly complicated as compared with the case of FIG.

The cross-sectional view in Fig. 3 is for the A-B line in the plan view. The area between the CD line and the EF line in the plan view has a shape in which four channels are formed in a column shape in accordance with the spirit of the present invention. However, the area above the CD line and the area below the EF line in the plan view show the above- And the four flow paths formed may be combined into one flow path again. According to this structure, the cooling fluid is collected at both ends and then redistributed to the four flow paths of the rectilinear section, which is more advantageous in resolving the flow unbalance.

The graph is for comparison of the cooling performance of heat sinks according to the structures of FIGS. As can be seen from the graph, the cooling temperature characteristics and the pressure drop characteristics with respect to the flow rate of the cooling water in the flow channel all show that the heat sink according to the structure of FIG. 3 is superior.

Particularly, it can be seen that the pressure drop characteristic against the flow rate of the cooling water in the flow path has a remarkably excellent characteristic in the heat sink according to the structure of FIG.

Various manufacturing methods such as extrusion or milling (brazing) can be applied to the heat sink having the structure shown in Fig.

FIG. 4A is a plan view in which the heat sink of the structure of FIG. 3 is formed by coupling three separate parts based on the CD line and the EF line, FIG. 4B is a plan view of the heat sink of the first side plate 80 of FIG. FIG.

The illustrated heat sink includes an intermediate body 100 having a plurality of linear parallel flow paths (four parallel flow paths in FIG. A first side plate 80 attached to one side of the intermediate body 100 to form a side surface of the heat sink; And a second side plate 90 attached to the other side of the intermediate body 100 to form another side surface of the heat sink.

The first side plate 80 is divided into a first flow path switching unit 80 and a second flow path switching unit 80. The first side flow switching unit 80 includes four flow paths, / Integration unit 84; And a flow passage inlet (82) arranged in the longitudinal direction of the first side plate (80).

The second side plate 90 is divided into a first flow path and a second flow path which are divided into four flow paths constituting one set of the intermediate body 100 after four flow paths constituting one set are combined into one flow path, / Integration unit 94; And a flow path outlet 92 disposed in the longitudinal direction of the second side plate 90.

FIGS. 5-7 illustrate heat sinks according to another embodiment of the present invention in which the intermediate body 100 of FIG. 4A can be fabricated in the form of a plurality of discrete components joined together.

The heat sinks shown in Figs. 5 to 7 also have a structure in which the four flow channels constitute one set such that the two flow channels are parallel to each other in the area direction and the thickness direction as in the case of Fig. 3, And has a shape that passes through the thickness of the body in a linear shape bent to evenly pass the entire area of the body.

The heat sink according to the embodiment shown in FIG. 5 has a first flow channel groove and a second flow channel groove which are parallel to each other on the upper face, a third flow channel groove and a fourth flow channel groove which are parallel to each other are formed on the lower face, An intermediate structure 140 in which the three-channel grooves and the fourth-channel grooves have a parallel relationship with the first and second flow grooves; An upper plate 120 adhered to the upper surface of the intermediate structure 140 to form a first flow path by covering an opening surface of the first flow path groove and forming a second flow path by covering an opening surface of the second flow path groove; A lower plate 160 closely attached to the upper surface of the intermediate structure 140 to form a third flow path by covering the opening surface of the third flow path groove and forming a fourth flow path by covering the opening surface of the fourth flow path groove; And pumping means for simultaneously inputting the cooling fluid to the first flow path, the second flow path, the third flow path and the fourth flow path.

5, the intermediate structure 140 is manufactured by an extrusion (or casting) process and / or a milling process. The upper plate 120 is attached to the upper surface of the manufactured intermediate structure 140, And the lower plate 120 is attached to the lower surface of the manufactured intermediate structure 140.

In this case, convenience and precision of the extrusion (or casting) process can be enhanced, and the precision of the final product can be increased.

The heat sink according to the embodiment shown in FIG. 6 has a first flow channel groove and a second flow channel groove which are parallel to each other on the upper face, and a third flow channel groove and a fourth flow channel groove which are parallel to each other are formed on the lower face, An intermediate structure 140 in which the three-channel grooves and the fourth-channel grooves have a parallel relationship with the first and second flow grooves; An upper plate 120 adhered to the upper surface of the intermediate structure 140 to form a first flow path by covering an opening surface of the first flow path groove and forming a second flow path by covering an opening surface of the second flow path groove; A lower plate 160 closely attached to the upper surface of the intermediate structure 140 to form a third flow path by covering the opening surface of the third flow path groove and forming a fourth flow path by covering the opening surface of the fourth flow path groove; And pumping means for simultaneously inputting the cooling fluid to the first flow path, the second flow path, the third flow path and the fourth flow path,

The intermediate structure includes an intermediate plate 145 disposed between the upper plate 120 and the lower plate 160 and parallel to the upper plate 120 and the lower plate 160; A first channel plate 142 positioned between the upper plate 120 and the intermediate plate 145 to form side walls of the first channel and the second channel; And a second channel plate 147 disposed between the lower plate 160 and the intermediate plate 145 to form side walls of the third and fourth flow paths.

The heat sink having the structure shown in Fig. 6 has a structure in which all or a part of the upper plate 120 and the lower plate 160, the intermediate plate 145, the first channel plate 142, and the second channel plate 147 are secured Or a forging process, and then joining the respective components together. In this case, there is an advantage that the mechanical strength of the completed heat sink can be sufficiently secured.

The heat sink according to the embodiment shown in FIG. 7 has a first flow channel groove and a second flow channel groove which are parallel to each other on the upper face, and a third flow channel groove and a fourth flow channel groove which are parallel to each other are formed on the lower face, An intermediate structure (240) for establishing a parallel relationship with the first flow path groove and the second flow path groove; A first flow path formed in close contact with an upper surface of the intermediate structure 240 to form a first flow path by blocking an opening surface of the first flow path groove and a second flow path formed by closing an opening surface of the second flow path groove, An upper plate 220 having a first upper plate groove corresponding to the first channel groove and a second upper plate groove corresponding to the second channel groove; A third flow path is formed by closing the opening surface of the third flow path groove and a fourth flow path is formed by closing the opening surface of the fourth flow path groove, A lower plate 260 having a first lower plate groove corresponding to the first channel groove and a fourth upper plate groove corresponding to the fourth channel groove; And pumping means for simultaneously inputting the cooling fluid to the first flow path, the second flow path, the third flow path and the fourth flow path.

The heat sink having the structure shown in FIG. 7 is manufactured by forming the upper plate 220, the lower plate 260 and the intermediate structure 240 by an extrusion (or casting) process, a milling process, a forging process, &Lt; / RTI > In this case, a suitable manufacturing process can be used for each constituent element, which is advantageous in that sufficient precision can be ensured while using a relatively inexpensive process.

Fig. 8 shows an embodiment of a pumping means that can be applied to the heat sink of Figs. 3 to 7 described above. The four flow paths P1 to P4 of the heat sinks of Figs. But is shown as a single plane in FIG. 8 for ease of understanding.

The pumping means shown in Fig. 8 inputs cooling water as a cooling fluid at the same time to the four flow paths P1 to P4 by using one pump 10. The pumping means of Figure 8 can minimize the pump cost.

It should be noted that the above-described embodiments are intended to be illustrative, not limiting. In addition, it will be understood by those of ordinary skill in the art that various embodiments are possible within the scope of the technical idea of the present invention.

120: top plate
140: intermediate structure
142: first channel plate
145: Middle plate
147: Second channel plate
160: lower plate

Claims

Wherein a first flow path groove and a second flow path groove parallel to each other are formed on an upper surface thereof and a third flow path groove and a fourth flow path groove which are parallel to each other are formed on a lower surface thereof, An intermediate structure for establishing a parallel relationship with the flow grooves and the second flow grooves;
An upper plate closely attached to an upper surface of the intermediate structure to form a first flow path by blocking an opening surface of the first flow path groove and forming a second flow path by covering an opening surface of the second flow path groove;
A lower plate closely adhered to the lower surface of the intermediate structure to form a third flow path by blocking an opening surface of the third flow path groove and forming a fourth flow path by blocking an opening surface of the fourth flow path groove; And
A pumping means for simultaneously inputting the cooling fluid to the first flow path, the second flow path, the third flow path,
.

The method according to claim 1,
Wherein the intermediate structure comprises:
An intermediate plate disposed between the upper plate and the lower plate in parallel with the upper plate and the lower plate;
A first channel plate positioned between the upper plate and the intermediate plate and forming side walls of the first channel and the second channel; And
A second channel plate disposed between the lower plate and the intermediate plate and forming side walls of the third channel and the fourth channel,
.

The method according to claim 1,
Wherein the upper plate has a first upper plate groove corresponding to the first flow channel groove and a second upper plate groove corresponding to the second flow channel groove,
Wherein the lower plate has a first lower plate groove corresponding to the third flow path groove and a fourth upper plate groove corresponding to the fourth flow path groove.

The method according to claim 1,
Wherein the first to fourth flow paths include:
And penetrates the thickness of the body in a single linearly curved multiple times so as to evenly pass the entire area of the intermediate structure.

The method according to claim 1,
The first flow path is divided into a first flow path and the fourth flow path is divided into a first flow path and a fourth flow path, A first flow path switching / integration unit; And
And the first flow path to the fourth flow path, which are located on the other side of the heat dissipation device, are combined into one flow path to switch the flow direction, and then distributed to the first to fourth flow paths, The second flow path switching /
Further comprising:

A planar body which can be adhered to a surface of an object to be cooled;
A first flow path through the thickness of the body in a single linearly curved shape so as to evenly cover the entire area of the body;
A second flow path passing through the thickness of the body in a shape parallel to the first flow path in the direction of the area;
A third flow path passing through the thickness of the body in a shape parallel with the first flow path in the thickness direction;
A fourth flow path passing through the thickness of the body in a shape parallel to the thickness direction of the second flow path; And
A pumping means for simultaneously inputting the cooling fluid to the first flow path, the second flow path, the third flow path,
.