KR20170068378A - Heat element including nano-material filler - Google Patents

Abstract

A heating element including a nanomaterial filler, a method of manufacturing the same, and an apparatus including the heating element. The disclosed heating element includes a matrix material and a filler in the form of a nanomaterial. The nanomaterial-type filler may be a nanosheet filler or a nanorod filler. The nanosheet filler may be a nanosheet having an electrical conductivity of at least a given value, for example 1,250 S / m. The filler may include at least one or at least two of oxide, boride, carbide, chalcogenide. The matrix material may be a glass water frit. The free glass frit may be, for example, silicon oxide or an additive to silicon oxide.

Description

A heat element including a nanomaterial filler (heat element including nano-material filler)

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating element, and more particularly, to a device including a heating element including a nanomaterial filler and a heating element, and a manufacturing method thereof.

The heating element includes an organic heating element having carbon as its main element, such as graphite, carbon nanotube, and carbon black, a metal heating element made of a metal such as Ag, Ni-Cr, Mo, W, Ceramics such as silicon carbide, molybdenum silicide, and the like. The shape of the heating element is a rod-like heating element in which the heating element is in the shape of a rod, and a plane heating element which is used by raising the heating element on the backing layer on a specific substrate. The organic heating element has advantages of easy production and low cost, but it may be deteriorated in high temperature durability because it reacts with oxygen at high temperature. The metal heating element has high electrical conductivity and easy control, so it has good heat generating property, but it may be oxidized at high temperature and its characteristics may be deteriorated. Ceramic heating elements are excellent in high temperature durability because they are low in reactivity with oxygen, but their electric conductivity is relatively low as compared with metal heating elements, and sintering is performed at a high temperature. The rod-shaped heating element is easy to manufacture, but it is difficult to uniformly adjust the temperature in the cavity. On the other hand, the surface heating element can uniformly adjust the temperature in the cavity as the whole surface is heated.

The present disclosure provides a heating element that can improve the electrical conductivity and enhance the heating property.

The present disclosure provides a method of manufacturing a heating element capable of relatively lowering the sintering temperature and improving the processability.

The present disclosure provides an apparatus including the heating element and capable of increasing the heating efficiency.

In the present disclosure, a heating element according to an embodiment includes a matrix material and a nanomaterial type filler. Here, the nanomaterial form is a nanosheet or a nanorod.

In such a heating element, the matrix material may include a glass frit or an organic material.

The free-water frit may be selected from the group consisting of silicon oxide, lithium oxide, nickel oxide, cobalt oxide, boron oxide, potassium oxide, aluminum oxide Aluminum oxide, titanium oxide, manganese oxide, copper oxide, zirconium oxide, phosphorus oxide, zinc oxide, bismuth oxide, ), Lead oxide, and sodium oxide.

Wherein the additive is one or more selected from the group consisting of lithium (Li), nickel (Ni), cobalt (Co), boron (B), potassium (K), aluminum (Al), titanium ), Manganese (Mn), copper (Cu), zirconium (Zr), phosphorus (P), zinc (Zn), bismuth (Bi), lead (Pb) and sodium (Na).

The organic material may be an organic polymer.

The organic polymer may be any one of polyimide (PI), polyphenylenesulfide (PPS), polybutylene terephthalate (PBT), polyamideimide (PAI), liquid crystalline polymer (LCP), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), and polyetheretherketone It can be one.

The filler may comprise at least one or at least two of oxide, boride, carbide and chalcogenide.

The filler may have a thickness of about 1 nm to about 1,000 nm, the filler may have a length of about 0.1 to 500 μm, and the filler may have a filler content of about 0.1 to 100 vol%. The upper limit of the content of the filler may not be 100 vol%.

The filler may comprise a nanomaterial having an electrical conductivity of at least 1,250 S / m.

In the method of manufacturing a heating element according to one embodiment of the present disclosure, a filler in the form of a nanomaterial is manufactured, and the filler and the matrix material are mixed. Thereafter, a mixture comprising the filler and the matrix material is coated on the substrate, and the coating on the substrate is heat treated. The nanomaterial form is nanosheet or nanorod.

In this manufacturing method, the filler can be produced as follows.

That is, an aqueous solution containing the nanomaterial is formed and the concentration (g / L) of the nanomaterial in the aqueous solution of the nanomaterial is calculated. Then, the volume of the nanomaterial aqueous solution is measured so that the desired weight of nanomaterial is included. The solvent is removed from the measured aqueous nanomaterial solution.

The heat treatment of the coating on the substrate can be carried out as follows.

After drying the coating on the substrate, the dried product can be sintered.

The substrate may be a substrate having the same composition as the matrix material or having a different composition.

The substrate may be a silicon wafer or a metal substrate.

The coating may be performed by screen printing, ink jet, dip coating, spin coating, or spray coating.

An apparatus according to one embodiment in this disclosure comprises a heating element comprising a nanomaterial filler. At this time, the heating element included in the apparatus may be a heating element according to the embodiment described above.

In such an apparatus, one of the heat insulating member and the heat reflecting member may be further provided on one side of the heat generating member. The heating element may be provided as a heat source for supplying heat to a given area inside the apparatus. The heating element may be a heat source for supplying heat to a given area outside the apparatus.

The disclosed heating elements include matrix materials and nanomaterials (e.g., nanosheets, nanorods, nanosheets, or nanorods) fillers. Therefore, percolation can occur more easily than with conventional fillers. In addition, when the disclosed nanomaterial-type filler is used, the surface of the matrix material can be covered with a smaller amount than the existing filler, and the electric conductivity can be higher than that of the conventional case when the same amount of filler is used . In addition, in the case of the disclosed nanomaterial type filler, since the surface contact between the nanomaterials is improved, the sintering property is improved, and the sintering temperature may be lowered. Therefore, the manufacturing process of the disclosed heating element can be performed at a relatively lower temperature than the conventional one.

1 is a schematic cross-sectional view of a heating element including a nanomaterial filler according to an embodiment.
FIG. 2 is a cross-sectional view illustrating a case where an insulating layer is disposed between a substrate and a heating element in the heating element of FIG. 1. FIG.
3 is a flowchart illustrating a method of manufacturing a heating element including a nanomaterial filler according to an embodiment.
4 shows a scanning electron microscope (SEM) photograph of the exfoliated RuO _{(2 + x)} nanosheet (x = 0) in the method of manufacturing a heating element according to an embodiment.
5 is a SEM photograph of a heating element formed by a method of manufacturing a heating element according to an embodiment.
6 is a SEM photograph of a comparative heating element for comparison with a heating element formed by a method of manufacturing a heating element according to an embodiment.
7 is a graph showing a correlation between electrical conductivity and electric conductivity of a filler when the filler dispersion and filler sintering degree are 1 (100%) and the filler volume fraction is 10 vol% in a heating body according to an embodiment .
8 is a cross-sectional view showing an apparatus including a heating element according to an embodiment.
9 is an enlarged cross-sectional view of a portion of FIG.
10 is a sectional view showing an apparatus including a heating element according to another embodiment.

In the case of producing a planar heating element, a glass frit constituting a matrix is mixed with a heatable filler to form a composite. In this case, the fillers must be connected to each other to generate heat through electricity . In the case of a heating element using a ceramic material as a filler, a spherical or polyhedral three-dimensional structure is conventionally used. For example, spherical or polyhedral RuO ₂ particles are used as a filler. Using this type of RuO _2, the theory water glass frit entire surface of the particles be covered with a RuO ₂ particles are peokeol illustration (percolation) between RuO ₂ consists of heat can take place reliably. However, when spherical or polyhedral RuO ₂ particles are used as a filler, the contact surface between RuO ₂ is small, so a high temperature is required for sintering, and the RuO ₂ content for the peracation may be increased.

The disclosed heating element is a planar heating element, and a filler of a nanomaterial is used. Therefore, the pelletization can be performed more easily than the conventional filler, and the sintering temperature can be lowered. An example of a nanomaterial is a nanosheet, which can cover the surface of the matrix material with a small amount of nanosheets, and adjoining nanosheets are surface-contacted to improve sinterability. Due to these properties, the electrical conductivity can be higher at the same content when the nanomaterial is used as a filler than when the existing RuO ₂ particles are used as a filler.

Hereinafter, an apparatus including a heating element including a nanomaterial filler and a heating element and a method of manufacturing the same will be described in detail with reference to the accompanying drawings. In this process, the thicknesses of the layers or regions shown in the figures are exaggerated for clarity of the description.

FIG. 1 shows a planar heating element according to an embodiment.

Referring to FIG. 1, a heating element 40 is present on a substrate 30. The substrate 30 may be a single layer or may comprise a plurality of layers. The heating element 40 may be formed on the substrate 30 through a series of processes, for example, coating and drying processes. The heat generating element (40) emits heat by energy applied from the outside. The external energy may be electric energy, but may be used as external energy if it can be applied to the heating element 40 to generate heat. The entirety including the substrate 30 and the heating element 40 may be referred to as a heating element.

The heating element 40 may include a matrix material 42 and a plurality of fillers 44. For example, the heating element 40 may include a matrix material 42 and a plurality of fillers 44, but may also include other components. Of the plurality of pillars 44, horizontally or vertically adjacent pillars can be in direct contact with each other, at least a part of the areas of adjacent pillars can be in surface contact with each other. Thus, the pillars 44 uniformly distributed in the matrix material 42 can be electrically connected, and the heat generating element 40 has electric conductivity. Adjacent fillers 44 are in surface contact, which may be advantageous to increase electrical conductivity as compared to using conventional particle fillers. Therefore, when the content of the filler 44 dispersed in the matrix material 42 is the same as the content of the existing particle filler, the electric conductivity of the heating element 40 may be larger than that of the heating element in which the conventional particle filler is used.

The matrix material 42 and the plurality of fillers 44 may be mixed to form a single-layer heating element. An upper layer 48 may be further provided on the heating body 40, and the upper layer 48 may be a single layer or a plurality of layers. The entire body including the substrate 30, the heating body 40, and the upper layer 48 may be referred to as a heating body.

In one embodiment, the matrix material 42 may comprise a glass frit. The glass wool frit may be, for example, silicon oxide, lithium oxide, nickel oxide, cobalt oxide, boron oxide, potassium oxide, Aluminum oxide, titanium oxide, manganese oxide, copper oxide, zirconium oxide, phosphorus oxide, zinc oxide, bismuth oxide, A bismuth oxide, a lead oxide, and an oxide of sodium oxide. The free water frit may be one in which an additive is added to the silicon oxide. The additive is selected from the group consisting of Li, Ni, C, Boron, K, Al, Ti, Mn, Cu, Zr ), Phosphorus (P), zinc (Zn), bismuth (Bi), lead (Pb) and sodium (Na). Additives are not limited to the listed elements.

In another embodiment, the matrix material 42 may comprise an organic material having heat resistance, for example, an organic polymer. The organic polymer may have a melting temperature (Tm) of, for example, 200 DEG C or higher. The organic polymer may be any one of polyimide (PI), polyphenylenesulfide (PPS), polybutylene terephthalate (PBT), polyamideimide (PAI), liquid crystalline polymer (LCP), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), and polyetheretherketone Lt; / RTI >

The substrate 30 may have the same composition or different composition as the matrix material 42. [ For example, the substrate 30 can be a silicon oxide, lithium oxide, nickel oxide, cobalt oxide, boron oxide, potassium oxide, aluminum oxide, titanium oxide, manganese oxide, copper oxide, zirconium oxide, phosphorous oxide, zinc oxide, And an oxide of at least one of sodium oxide. As another example, the substrate 30 may be a substrate of a material different from the material used for the matrix material 42. For example, the substrate 30 may be a silicon wafer, a metal substrate, or another conductive substrate.

When the substrate 30 is a conductive substrate, an insulating layer 24 may be further provided between the substrate 30 and the heating element 40 as shown in FIG. In addition, an insulating layer 20 may be further provided on the bottom surface of the substrate 30. The insulating layers 20 and 24 may be, for example, the same or different oxide glass layers. The oxide glass layer may comprise one or more materials selected from the group consisting of silicon oxides, lithium oxides, nickel oxides, cobalt oxides, boron oxides, potassium oxides, aluminum oxides, titanium oxides, manganese oxides, copper oxides, zirconium oxides, phosphorous oxides, zinc oxides, bismuth, lead oxides and sodium oxides Or the like. The oxide glass layer may comprise an enamel layer.

2, reference numerals 40A and 40B denote first and second electrodes respectively attached to both ends of the heating element 40. In FIG. Electricity may be supplied to the heating element 40 from the power source through the first and second electrodes 40A and 40B. The entire structure shown in Fig. 2 may be referred to as a heating body, as well as the layer represented by the reference numeral 40. [

The plurality of fillers 44 may be fillers comprising nanomaterials. For example, the plurality of fillers 44 may be a filler in the form of a nano-sheet or a filler in the form of a nano-rod. The nanosheet-shaped filler and the nanorod-shaped filler may include nanosheets or nanorods of various materials. The nanosheets or nanorods may be of a composition having a given electrical conductivity (e.g., 1250 S / m), but may be somewhat smaller or somewhat larger in some cases.

The nanosheet-shaped filler or the nanorod-shaped filler may include at least one or at least two of oxide, boride, carbide and chalcogenide.

The oxide used as the filler 44 may be selected from the group consisting of RuO ₂ , MnO ₂ , ReO ₂ , VO ₂ , OsO ₂ , TaO ₂ , IrO ₂ , NbO ₂ , WO ₂ , GaO ₂ , MoO ₂ , InO ₂ , CrO _2, or may RhO _two days.

Boride is used as a filler (44) may be, for _{example, Ta 3 B 4, Nb 3} B 4, TaB, NbB, V 3 B 4, or VB.

The carbide used as the filler 44 may be, for example, Dy ₂ C or Ho ₂ C.

The chalcogenide used as the filler 44 is, for example, AuTe ₂ , PdTe ₂ , PtTe ₂ , YTe ₃ , CuTe ₂ , NiTe ₂ , IrTe ₂ , PrTe ₃ , NdTe ₃ , SmTe ₃ , GdTe ₃ , TbTe _{3, DyTe 3, HoTe 3,} ErTe 3, CeTe 3, LaTe 3, TiSe 2, TiTe 2, ZrTe 2, HfTe 2, TaSe 2, TaTe 2, TiS 2, NbS 2, TaS 2, Hf 3 Te 2, VSe _2, VTe _2, NbTe _2, may be a ₂ or LaTe CeTe _2.

The thickness of the filler 44 may be about 1 nm to 1,000 nm. The size of the filler 44 may be about 0.1 탆 to about 500 탆. The content of the filler 44 in the heating element 40 may be less than 0.1 vol% and less than 100 vol%.

Next, a method of manufacturing a heating element including a nanomaterial according to an embodiment will be described with reference to FIG. For example, the heating element includes 10 wt% (wt%) filler.

1) Preparation of filler containing nanomaterial (S1)

A RuO _{(2 + x)} nanosheet (0? _X <0.1) is prepared with a filler containing nanomaterials. Fillers formed from other nanomaterials may also be fabricated in a similar or identical process to RuO _{(2 + x)} nanosheets (0 <x <0.1).

To prepare the RuO _{2 (2 + x)} nanosheets, K ₂ CO ₃ and RuO ₂ were first mixed in a molar ratio of 5: 8 and then pelletized into an alumina crucible. A tube furnace at 850 ° C. furnace for 12 hours. This heat treatment can be performed in a nitrogen atmosphere. The weight of the pellets may be from about 1 g to about 20 g, but may vary as needed. The form of the pellets may be in the form of a disc.

After the heat treatment, when the temperature of the furnace is cooled to room temperature, the alumina crucible is taken out of the furnace, and the pellet in the alumina crucible is taken out and pulverized to make a powder.

Next, these powders are washed with about 100 mL to 4 L of water for 24 hours, and then filtered to remove only the powder. The composition of the powder is made _{K 0. 2 RuO 2 .1 · nH} 2 O.

Next, K _{2 0. .1} RuO ₂ · nH ₂ O into the powder in a HCl solution of 1M, the mixture was stirred (stirring) a, powders obtained only through the filter and then for three days. The composition of the powder obtained by this process is H _0.2 RuO _2.1 .

Next, the interconnect Slant aqueous mixture of 250mL (intercalant) such as TMAOH and TBAOH by inserting a H _{2 0. .1} RuO ₂ powder 1g is stirred for more than 10 days. At this time, the concentrations of TMAOH and TBAOH may be about TMA + / H + and TBA + / H + = 0.1 to 50. After this stirring process is completed, the obtained solution is centrifuged. This centrifugation can proceed for 30 minutes at 2000 rpm. By this centrifugation, the aqueous solution containing the RuO _{(2 + x)} nanosheet peeled off and the precipitate containing the non-peeled powder are separated. Figure 4 shows a scanning electron microscope (SEM) photograph of the exfoliated RuO _{(2 + x)} nanosheet (x = 0.1). 4, reference numeral 50 denotes a substrate, and reference numeral 52 denotes a RuO ₂ nanosheet.

The concentration of the aqueous solution containing the peeled RuO ₂ nanosheets obtained by centrifugation is measured by UVS (Ultraviolet-Visible Spectrophotometer).

Next, RuO of RuO ₂ nanosheets for RuO ₂ nanosheets aqueous solution using an absorption coefficient (7400 L / mol · cm) of ₂ nm with respect to the seat solution measuring light absorbance of the 350nm wavelength, and RuO ₂ nanosheets Calculate the concentration (g / L).

Next, the volume of the RuO ₂ nanosheet aqueous solution is measured so that the desired weight of RuO ₂ nanosheets is included, and the solvent is removed from the RuO ₂ nanosheet aqueous solution measured using a centrifuge. At this time, the centrifuge can operate at 10,000 rpm or more for 15 minutes or more.

2) Manufacture of heating element

The matrix material is mixed with the resultant product of the aqueous solution of RuO ₂ nanosheet solution (S2). The matrix material may be added so that the weight content of the RuO ₂ nanosheets is a set value (e.g., 10 wt%). The addition amount of the matrix material may be varied depending on the weight content of the RuO ₂ nanosheet set.

Experimental examples of the present manufacturing method include an oxide glass in which silicon oxide, lithium oxide, nickel oxide, cobalt oxide, boron oxide, potassium oxide, aluminum oxide, titanium oxide, manganese oxide, copper oxide, zirconium oxide and sodium oxide are mixed as a matrix material use.

Next, a mixture of a RuO ₂ nanosheet and a matrix material is coated on the substrate (S3).

The substrate may have the same composition or composition as the matrix material, or may be a silicon wafer or a metal substrate. The coating of the mixture may be screen printing, ink jet, dip coating, spin coating or spray coating.

Next, after the coating is completed, the coating is dried at 100 ° C to 200 ° C to remove the solvent from the coating (S4).

Next, the solvent-free coating is heat-treated at 500 ° C to 900 ° C for 1 minute to 20 minutes (S5). For example, it can be heat-treated at 600 ° C for 2 minutes. As a result, RuO ₂ nanosheets are sintered.

Thus, a heating element including a nanomaterial is formed.

5 shows a SEM photograph of the formed heating element. In FIG. 5, reference numeral 60 denotes a matrix material (for example, glass water frit) and 62 denotes a nanomaterial filler (for example, RuO ₂ nanosheet).

Referring to FIG. 5, it can be seen that the nanomaterial filler 62 is uniformly distributed in the matrix material 60.

On the other hand, chalcogenide nanosheets, boride and carbide nanosheets can be prepared as follows.

First, chalcogenide nanosheets can be prepared as follows.

Prepare raw materials in solid phase powder form. At this time, the raw materials are prepared by measuring the weight so as to meet the atomic ratio. Subsequently, the prepared raw materials are homogeneously mixed and then pelletized. The resulting pellets are placed in a quartz tube, and the quartz tube is filled with argon (Ar) gas and sealed. The quartz tube containing the pellets is placed in a furnace and heat treated at 500 to 1300 for 12 to 72 hours. After the heat treatment, the heat-treated product is cooled to room temperature, and the pellets in the quartz tube are taken out and pulverized into a powder form. Then, lithium (Li) ions are added between the chalcogenide layers formed in powder form. Such lithium ions can be introduced using a lithium ion source, for example, by using a lithium ion source such as n-butyllithium to inject lithium ions between powder chalcogenide layers . In another embodiment, instead of using a lithium ion source, lithium ions may be injected directly between powder chalcogenide layers through an electrochemical process.

When lithium ions are injected between the chalcogenide layers in powder form, the gap between the chalcogenide layers spreads, so that the chalcogenide layer, that is, the chalcogenide nanosheet, can easily peel off. When replacing lithium ions with larger molecules (such as water molecules or organic molecules), the interlayer spacing of the chalcogenide is further increased. As a result, chalcogenide nanosheets can be more easily peeled off.

Another method for facilitating separation of chalcogenide nanosheets is to place lithium ions between powder chalcogenide layers and then ultrasonicate the chalcogenide.

Boride nanosheets can be prepared by the following two methods.

The first method can be produced in the same manner as the preparation of chalcogenide nanosheet.

The second method is as follows.

Prepare raw materials in solid phase powder form. At this time, the raw materials can be prepared by measuring the weight to fit the atomic ratio. Subsequently, the prepared raw materials are uniformly mixed and pelletized. The resulting pellets are placed in an arc melting machine and melted at high temperature using an arc. This process using an arc can be repeated several times until the pellets are evenly mixed and become single-phase. Thereafter, the resultant is cooled to room temperature, taken out of the equipment and pulverized into a powder form. Then, lithium (Li) ions are added between the boride layers formed in powder form. Such lithium ions can be introduced using a lithium ion source, for example, lithium ions can be injected between powdered boride layers using a lithium ion source such as n-butyllithium have. Instead of using a lithium ion source, lithium ions may be injected directly between the boride layers in the powder form by an electrochemical method. When the lithium ions are injected between the boride layers in powder form, the boride layer, that is, the boride nanosheet can easily peel off because the gap between the boride layers spreads. When replacing lithium ions with larger molecules (eg, water molecules or organic molecules), the interlayer spacing of the boride can be further increased. As a result, the boride nanosheets can be more easily peeled off.

The boride nanosheets may also be peeled off by placing lithium ions between the boride layers in the form of powders, followed by sonication of the borides.

The carbide nanosheet can be produced by following the boride nanosheet production process described above.

3) Electrical Conductivity Measurement

Ag paste is applied to both ends of the formed heating element and dried to form an electrode. The resistance between the two electrodes is measured, and the electrical conductivity of the heating element is measured by measuring the width, length and thickness of the heating element. In the case of the heating element formed by the above-described manufacturing method, the measured electric conductivity is about 1,358 S / m.

Next, a comparative example of the disclosed heating element will be described.

Specifically, a heating element was manufactured using a RuO ₂ particle (average size: 200 nm) having an aspect ratio of 2 or less with a heating element for comparison with the disclosed heating element (hereinafter referred to as a comparative heating element). For comparison with the case where the disclosed heating element includes RuO ₂ nanosheet, the comparative heating body was prepared by mixing 10 wt% RuO ₂ particles and glass water frit, and heat treatment for sintering was performed at 700 ° C for 5 minutes. The electrical conductivity of the comparative heating element was measured to be about 2.93 S / m.

In general, when the sintering temperature is high and the heat treatment time is long, the sintering of RuO ₂ is performed more easily, so the electric conductivity should be high. However, the electric conductivity of the disclosed heating element is 300 times higher than that of the comparative heating element, even though the heat treatment temperature is lower and the sintering time is shorter than that of the comparative heating element.

One of the reasons for this result is that the RuO ₂ nanosheets included in the disclosed heating element are more likely to be percolated than the RuO ₂ particles included in the comparative heating element.

6 shows a SEM photograph of the comparative heating element.

6 (b) and 6 (c) are enlarged photographs of the first and second regions A1 and A2, respectively, in (a). In Fig. 6, reference numeral 70 denotes a glass wool frit (for example, enamel), and 72 denotes RuO ₂ particles.

Referring to FIGS. 6 (b) and 6 (c), there is a part of the glass wool frit 70 in which the RuO ₂ particles 72 are not present, and the RuO ₂ percation is weakened by this part, The electrical conductivity may be lowered.

These results show that when the nanomaterial (eg, nanosheets or nanorods) is used as a filler like the disclosed heating element, the sintering temperature can be lowered compared to the conventional heating element, and the electrical conductivity is increased when the filler content is the same .

Next, the relationship between the electrical conductivity of the disclosed heating element and the electrical conductivity of the filler (nanomaterial) included in the heating element will be described. In order to obtain the required heat through it, it is possible to select the electrical conductivity condition of the filler required for the disclosed heating element, that is, the nanomaterial which can be used as a filler.

Specifically, in order to calculate the required properties of the nanomaterial (e.g., nanosheet) usable as a filler in the disclosed heating element, the electrical conductivity required for the disclosed heating element was calculated.

When the external power supplied for heating the disclosed heating element, for example, the electric power is about 500 W to 1,000 W, the area of the surface heating element is 0.01 m ² to 1 m ² , and the thickness is 10 μm to 1000 μm, The electric conductivity required is about 50 S / m to 500 S / m.

The electric conductivity required for a nanomaterial (e.g., a nanosheet) used as a filler in the disclosed heating element can be calculated by the following equation (1).

[Equation 1]

σ _c = σ _f x V _f x (A _f / A _m ) x (S _f / L _f )

In Equation (1),? _C Is the electric conductivity of the heating element, and? _F is the electric conductivity of the filler. V _f is the volume fraction of the filler, A _f is the dispersed area of the filler, and A _m is the area of the organic frit (matrix). And S _f is the sintered area (or length of the sintered part) of the filler, and L _f is the total area of the filler (or the total length of the filler). A _f / A _m represents the dispersion degree of the filler. When the filler is dispersed over the entire area of the organic frit, the dispersion degree (A _f / A _m ) of the filler is 1. S _f / L _f represents the degree of sintering of the filler.

Assuming that the filler volume fraction (V _f ) is 10 vol%, assuming that the dispersion degree (A _f / A _m ) of the filler and the sintering degree (S _f / L _f ) The correlation between the electric conductivity of the heating element and the electric conductivity of the filler can be represented by the graph of FIG.

Referring to the graph of FIG. 7, when the electric conductivity required for a heating element is about 50 S / m, the electric conductivity required for a nanomaterial used as a filler is about 1,250 S / m. When the electric conductivity required for the heating element is about 500 S / m, the electric conductivity required for the nanomaterial used as the filler is about 12,500 S / m.

The material that can be used as the filler of the disclosed heating element may be, for example, an oxide, boride, carbide or chalcogenide. Of these, the material having an electric conductivity of more than 1,250 S / m is shown in the following Tables 1 to 3 Same as. Table 1 shows the oxide filler material, Table 2 shows the boride and carbide filler materials, and Table 3 shows the chalcogenide filler material.

Furtherance S / m Furtherance S / m RuO ₂ 3.55 x 10 ⁶ NbO ₂ 3.82 x 10 ⁶ MnO ₂ 1.95 x 10 ⁶ WO ₂ 5.32 x 10 ⁶ ReO ₂ 1.00 x 10 ⁷ GaO ₂ 2.11 x 10 ⁶ VO ₂ 3.07 x 10 ⁶ MoO ₂ 4.42 x 10 ⁶ OsO ₂ 6.70 x 10 ⁶ InO ₂ 2.24 x 10 ⁶ TaO ₂ 4.85 x 10 ⁶ CrO ₂ 1.51 x 10 ⁶ IrO ₂ 3.85 x 10 ⁶ RhO ₂ 3.10 x 10 ⁶

division Furtherance σ (S / m) Boride Ta ₃ B ₄ 2335000 Nb ₃ B ₄ 3402000 TaB 1528800 NbB 5425100 V ₃ B ₄ 2495900 VB 3183200 Carbide Dy ₂ C 180000 Ho ₂ C 72000

Furtherance σ (S / m) Furtherance σ (S / m) AuTe ₂ 433000 TiSe ₂ 114200 PdTe ₂ 3436700 TiTe ₂ 1055600 PtTe ₂ 2098000 ZrTe ₂ 350500 YTe ₃ 985100 HfTe ₂ 268500 CuTe ₂ 523300 TaSe ₂ 299900 NiTe ₂ 2353500 TaTe ₂ 444700 IrTe ₂ 1386200 TiS ₂ 72300 PrTe ₃ 669000 NbS ₂ 159100 NdTe ₃ 680400 TaS ₂ 81000 SmTe ₃ 917900 Hf ₃ Te ₂ 962400 GdTe ₃ 731700 VSe ₂ 364100 TbTe ₃ 350000 VTe ₂ 238000 DyTe ₃ 844700 NbTe ₂ 600200 HoTe ₃ 842000 LaTe ₂ 116000 ErTe ₃ 980100 LaTe ₃ 354600 CeTe ₃ 729800 CeTe ₂ 55200

Next, an apparatus including the disclosed heating element will be described with reference to the accompanying drawings.

Since the disclosed heating element can be used as a heat source for emitting heat, it can be used in a device requiring a heat source, and can be used as a heat generating component or an electronic component. For example, the disclosed heating element can be applied to a printer, which can be applied to a fuse of a printer as an example. In addition, the disclosed heating element may be applied to a thin film resistor or a thick film resistor.

FIG. 8 shows an example of a device including a heating element according to an embodiment as a heat source.

Referring to FIG. 8, the apparatus 80 includes a body 82 and a first heating element 84 included in the body 82. The device 80 may be an electrical device or an electronic device, for example, an oven. The body 82 of the device 80 may include an interior space 92 in which objects, e.g., food, may be placed. Energy may be supplied to heat the object in the interior space 92 or to increase the temperature of the interior space 92 (e.g., heat) when the apparatus 80 is operated. The first heat generating element 84 may be arranged such that heat generated from the first heat generating element 84 is directed to the inner space 92. The first heating element 84 may be the heating element described with reference to FIGS. 1 and 2, or may be a heating element manufactured according to the manufacturing method of FIG. The second heating element 86 may be further disposed on the body 82 so as to face the first heating element 84. Heat emitted from the second heating element 86, like the first heating element 84, As shown in FIG. The second heating element 86 may be the heating element described with reference to Figs. 1 and 2, or may be a heating element manufactured according to the manufacturing method of Fig. The first and second heating elements 84 and 86 may be the same or different heating elements. The third heating element 88 and the fourth heating element 90 may be further disposed on the body 82 as shown by the dotted line. Alternatively, only one of the third heating element 88 and the fourth heating element 90 .

In another embodiment, the body 82 may be provided with only the third and fourth heating elements 88, 90. Either an insulating member or a heat reflecting member may be disposed between the external interface of the body 82 and each of the heating elements 84, 86, 88, and 90.

The first to fourth heating elements 84, 86, 88, and 90 may be planar heating elements having a two-dimensional area.

Fig. 9 shows an enlarged cross-sectional view of the first region 80A of Fig.

Referring to FIG. 9, in the body 82, a heat insulating material 82D and a case 82E are sequentially disposed between the third heating element 88 and the outer region. The case 82E may be the outer case of the device 80. [ The heat insulating material 82D disposed between the case 82E and the third heating element 88 can be extended to the area of the other heating elements 84, 86, and 90 disposed in the body 82. [ The heat insulating material 82D is disposed to prevent heat emitted from the third heating element 88 from being discharged to the outside of the apparatus 80. [

A second insulating layer 82C, a substrate 82B and a first insulating layer 82A are present between the third heating element 88 and the inner space 92. [ The first insulating layer 82A, the substrate 82B, the second insulating layer 82C and the third heating element 88 are sequentially stacked in the inner space 92 to the outside of the apparatus 80. [ This layer configuration can be applied to the portion where the first, second and fourth heat generating elements 84, 86, and 90 are disposed.

The first and second insulating layers 82A and 82C may be formed of the same insulating material or may be formed of different insulating materials. At least one of the first and second insulating layers 82A and 82C may be an enamel layer, but is not limited thereto, and the thicknesses thereof may be the same or different from each other. The substrate 82B may be a supporting member that supports the structure of the body 82 of the apparatus 80 while supporting the first to fourth heating elements 84, 86, 88, The substrate 82B may be, for example, a metal plate, but is not limited thereto. As shown in Fig. 9, the lamination structure including the heating element 88 may be applied not only to the apparatus shown in Fig. 8 but also to another apparatus (for example, an electric pot) for heating a substance (e.g., water) . The heat insulating material 82D may be disposed under the heating body 88 when the heat generating body 88 is disposed on the bottom side of the apparatus and the substance to absorb heat is disposed above the heating body 88. [

Figure 10 shows another example of a device comprising the disclosed heating element. The apparatus of Fig. 10 may be a heating device.

Referring to Figure 10 (a), the first device 102 is disposed within the wall 100. The first device 102 may be a heating device that emits heat to the outside (outside) of the first side of the wall 100. When the wall 100 is one of the walls defining the chamber, the first device 102 may be a heating device that emits heat to raise the temperature in the room or to heat it. As shown in FIG. 10 (b), the first device 102 may be provided on the surface of the wall 100.

Although not shown, the first device 102 may be installed separately from the wall 100. When the first device 102 is disposed separately from the wall 100, the first device 102 may be an independently moveable device. Thus, the user can move the first device 102 to a desired location in the room.

The first device 102 may include a heating element (not shown) therein to emit heat. The heating element may be the heating element described with reference to Figs. 1 and 2, or may be a heating element manufactured according to the manufacturing method of Fig. The first device 102 may be entirely embedded within the wall 100 while a panel for operation of the first device 102 may be disposed on the wall 100 surface. A second device 104 may further be provided within the wall 100. The second device 104 may be a heating device arranged to emit heat to the outside (outside) of the second side of the wall 100. If the wall 100 is one of the walls that partition the chamber, the second device 104 may be a device that emits heat to heat another neighboring room or other area across the wall 100. The second device 104 may also be installed on the surface of the wall 100 as shown in FIG. 10 (b). Although not shown in the drawing, the second device 104 can be operated separately from the wall 100, like the first device 102. The second surface may be the opposite surface of the first surface or a surface facing the first surface. The second device 104 may include a heating element (not shown) that emits heat. The heating element may be a heat source for increasing the temperature of the outside of the second surface of the wall 100. In this case, the heating element may be the heating element described with reference to FIGS. 1 and 2, or may be a heating element manufactured according to the manufacturing method of FIG. The second device 104 may be largely embedded within the wall 100 while a panel for the operation of the second device 104 may be disposed on the wall 100 surface. The arrows in FIG. 10 indicate the heat emitted from the first and second devices 102, 104.

On the other hand, the first and second devices 102 and 104 may be of a detachable structure. In this case, the first device 102 or the second device 104 may be mounted inside the window. For example, in FIG. 10 (b), when the reference numeral 100 denotes a window, not a wall, the first device 102 may be a heating device mounted inside the window 100. In this case, the second device 104 is not required. When the first device 102 is mounted on a window, the first device 102 may be mounted on the entire inner surface of the window, but may be mounted on only a part of the inner surface.

In another embodiment, the disclosed heating element may be applied to a device or device that provides warmth to the user. For example, the disclosed heating element may be applied to a hot pack, and may be provided with clothes (such as a jacket or a vest), a glove, a shoe, etc. that a user can wear on the body. At this time, the disclosed heating element may be provided inside the clothes or inside the clothes.

In yet another embodiment, the disclosed heating element may be applied to a wearable device. The disclosed heating element may also be applied to outdoor equipment, which may be applied to devices that emit heat in cold environments.

Many specific technical details of the above description should not be construed as limiting the scope of the invention, but rather should be construed as preferred embodiments. Therefore, the scope of the invention is not to be determined by the described embodiments but should be determined by the technical idea described in the claims.

20, 24: insulating layer 30, 50: substrate
40: heating element 40A, 40B: first and second electrodes
42, 60, 70: matrix 44, 52: filler (nanomaterial)
52, 62: RuO2 nanosheet 72: RuO2 particles
80A: first region 82: body
82A and 82C: first and second insulating layers 82B:
82D: Insulation material 82E: Case
84, 86, 88, 90: first to fourth heating elements 92: inner space
100: walls 102, 104: first and second devices
A1, A2: first and second regions A11: first region

Claims (30)

Matrix material; And
A filler in the form of nanomaterials,
The nanomaterial form may be,
A heating element that is a nanosheet or nanorod. The method according to claim 1,
Wherein the matrix material comprises one of glass frit and organic polymer. 3. The method of claim 2,
The free-water frit may be selected from the group consisting of silicon oxide, lithium oxide, nickel oxide, cobalt oxide, boron oxide, potassium oxide, aluminum oxide Aluminum oxide, titanium oxide, manganese oxide, copper oxide, zirconium oxide, phosphorus oxide, zinc oxide, bismuth oxide, ), A lead oxide, and a sodium oxide. 3. The method of claim 2,
Wherein the additive is at least one of Li, Ni, Co, B, K, Al, Ti, Mn, Cu, Zr, P, Zn, Bi, Pb and Na. Included heating element. 3. The method of claim 2,
The organic polymer may be any one of polyimide (PI), polyphenylenesulfide (PPS), polybutylene terephthalate (PBT), polyamideimide (PAI), liquid crystalline polymer (LCP), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), and polyetheretherketone A heating element containing one. The method according to claim 1,
The filler
A heating element comprising at least one or at least two of oxide, boride, carbide and chalcogenide. The method according to claim 1,
Wherein the filler has a thickness of about 1 nm to 1,000 nm. The method according to claim 1,
Wherein the filler has a length of about 0.1 mu m to about 500 mu m. The method according to claim 1,
Wherein the filler content is less than 0.1 vol% to less than 100 vol%. The method according to claim 1,
Wherein the filler comprises a nanomaterial having an electrical conductivity of at least 1,250 S / m. The method according to claim 1,
Wherein the heating element is an area heating element having a two-dimensional area. The method according to claim 6,
Preferably,
A heating element comprising RuO ₂ , MnO ₂ , ReO ₂ , VO ₂ , OsO ₂ , TaO ₂ , IrO ₂ , NbO ₂ , WO ₂ , GaO ₂ , MoO ₂ , InO ₂ , CrO ₂ or RhO ₂ . The method according to claim 6,
The boride may be,
Ta ₃ B ₄ , Nb ₃ B ₄ , TaB, NbB, V ₃ B ₄ or VB. The method according to claim 6,
Heating said carbide comprises a Dy or Ho ₂ C ₂ C. The method according to claim 6,
The chalcogenide,
_{AuTe 2, PdTe 2, PtTe 2} , YTe 3, CuTe 2, NiTe 2, IrTe 2, PrTe 3, NdTe 3, SmTe 3, GdTe 3, TbTe 3, DyTe 3, HoTe 3, ErTe 3, CeTe 3, LaTe 3 , containing _{TiSe 2, TiTe 2, ZrTe 2} , HfTe 2, TaSe 2, TaTe 2, TiS 2, NbS 2, TaS 2, Hf 3 Te 2, VSe 2, VTe 2, NbTe 2, LaTe 2 or CeTe ₂ Heating element. Preparing a filler in nanomaterial form;
Mixing the filler and the matrix material;
Coating a mixture comprising the filler and the matrix material on a substrate; And
Heat treating the coating on the substrate,
The nanomaterial form may be,
A method of manufacturing a heating element which is a nanosheet or a nanorod. 17. The method of claim 16,
The step of producing the filler comprises:
Forming an aqueous solution containing the nanomaterial;
Calculating a concentration (g / L) of the nanomaterial to the nanomaterial aqueous solution;
Measuring an aqueous solution volume of the nanomaterial to include a nanomaterial of a desired weight; And
And removing the solvent from the measured aqueous nanomaterial solution. 17. The method of claim 16,
Wherein the step of heat treating the coating on the substrate comprises:
Drying the coating on the substrate; And
And sintering the dried resultant. 17. The method of claim 16,
Wherein the substrate has the same composition as the matrix material or has a different composition. 17. The method of claim 16,
Wherein the substrate is a silicon wafer or a metal substrate. 17. The method of claim 16,
Wherein the coating is performed by screen printing, ink jet, dip coating, spin coating, or spray coating. 17. The method of claim 16,
The filler
A method of manufacturing a heating element comprising at least one or at least two of oxide, boride, carbide, and chalcogenide. 17. The method of claim 16,
Wherein the thickness of the filler is about 1 nm to 1,000 nm. 17. The method of claim 16,
Wherein the content of the filler is 0.1 vol% or more and less than 100 vol%. In an apparatus including a heating element,
Wherein said heating element comprises a heating element according to any one of claims 1 to 15. [ 26. The method of claim 25,
Further comprising one of a heat insulating member and a heat reflecting member on one side of the heat generating element. 26. The method of claim 25,
Wherein the heating element is provided as a heat source for supplying heat to a given area inside the apparatus. 26. The method of claim 25,
Wherein the heating element is provided as a heat source for supplying heat to a given area outside the apparatus. 26. The method of claim 25,
Wherein the device is an oven having a space for placing food therein. 26. The method of claim 25,
Wherein the heating element is an area heating element having a two-dimensional area.

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