KR20170066370A - Method for manufacturing electronic circuit substrate, and electronic circuit substrate obtained thereby - Google Patents

Abstract

A method of manufacturing an electronic circuit substrate of the present invention is a method of manufacturing an electronic circuit substrate on which an electronic circuit of a predetermined pattern made of a nano ink composition containing metal particles is fixed on a substrate, A step of holding the nano-ink composition containing metal particles in a state in which the surface of the substrate is brought into close contact with the printing plate and transferring the nano-ink composition held on the ink holding portion onto a substrate (work (W) And a step of drying and fixing the transferred nano ink composition after the transfer in an environment of 40 ° C or lower in the atmosphere to form an electronic circuit of a predetermined pattern. By this method, a uniform nano ink composition layer can be quickly and efficiently applied under ordinary temperature and pressure.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing an electronic circuit board,

The present invention relates to an electronic circuit substrate manufacturing method for forming an electronic circuit on a substrate at room temperature using a conductive ink, and an electronic circuit substrate obtained thereby.

BACKGROUND ART Printed electronics that form electronic devices and electronic circuits using printing technology are formed by applying (printing or transferring) a functional material (metal or semiconductor material, etc.) in the form of ink to a surface of a substrate (substrate) . This method has recently attracted attention as a technology capable of forming large-sized devices and device substrates at a low cost because a large-scale and expensive manufacturing apparatus such as a vacuum apparatus is not required. However, conventional printed electronics has a disadvantage in that it is impossible to use a base material that is stretched or shrunk by heating, such as a resin film, as a substrate because the baking of the functional material passes through a heating process of 100 to 200 DEG C or more.

On the contrary, the present inventors have already developed a conductive ink (nano ink composition) which does not need to be baked after application, and has already filed a patent application (refer to Patent Document 1). This nano ink composition uses specific " aromatic aromatic molecules " as ligands of metal nanoparticles. By using the nano ink composition, all coating processes are carried out under air and at room temperature, A device, an electronic circuit, or the like can be formed. In addition, even when an electronic circuit or the like is printed on a flexible substrate such as a resin film, if the above nano ink composition which does not need to pass through a heating and firing process is used, all the manufacturing steps are performed at room temperature, And a fine circuit can be transferred with high accuracy.

WO2011 / 114713

However, in the present situation, as a coating method for mass-producing a fine electronic circuit with high precision and reproducibility on a flexible substrate using the nano ink composition, there has been established only a printing method using an ink jet method, It is desired to develop an ink applying method with high production efficiency using the nano ink composition.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic circuit board manufacturing method capable of quickly and efficiently applying a uniform nano ink composition layer under normal temperature and pressure and an electronic circuit board obtained thereby .

In order to achieve the above object, the present invention provides a method of manufacturing an electronic circuit substrate, which fixes an electronic circuit of a predetermined pattern made of a nano ink composition containing metal particles on a substrate, Comprising the steps of: maintaining a nano ink composition containing metal particles on a surface of a base material; transferring the nano ink composition held on the ink holding portion to the base material by bringing the surface of the base material into close contact with the printing plate; And a step of drying and fixing the transferred nano ink composition in an atmosphere at 40 캜 or less in the atmosphere to form an electronic circuit of a predetermined pattern. The method of manufacturing an electronic circuit substrate according to the first aspect is characterized in that, The electronic circuit board is the second essential element.

In other words, the present inventors have repeatedly thought that the above-mentioned problem can not be solved by an easy method other than the ink jet method in place of the method requiring a large-scale apparatus such as the vacuum apparatus, and can realize this by transfer printing using a plate I conceived not. As a result of repeating trial and error with respect to the characteristics of the printing plate and the printed chain base material, it was found that the nano-ink composition of the water system was held on the printing plate having the ink holding portion patterned on the surface of the plate, And by transferring the nano ink composition, it is possible to efficiently apply the nano ink composition layer having a relatively large thickness on the base material in a predetermined pattern in a non-uniform manner, thereby reaching the present invention.

The printing plate having the ink holding portion patterned on the surface of the plate may be a convex plate, a concave plate, or a flat plate. The printing method capable of " transferring the nano ink composition " ), Flat printing such as concave printing such as letterpress printing, flexographic printing such as letterpress printing, gravure printing such as gravure printing, offset printing, and gravure offset printing can be used.

The method for producing an electronic circuit board of the present invention comprises the steps of holding a nano ink composition on a printing plate, transferring the nano ink composition held on the printing plate to a substrate, and transferring the transferred nano ink composition to a substrate And drying and immobilizing. As a result, even when a "weakly heat-resistant" substrate is used, a uniform layer made of the nano-ink composition can be formed on the surface of the base material without causing excessive heat to cause elongation and shrinkage, It can be formed efficiently and stably.

The method of manufacturing an electronic circuit substrate of the present invention includes a case where the nano ink composition of the required pattern is not only transferred once but also is laminated on the same area of the substrate several times . In this case, it is appropriately determined depending on the surface condition of the substrate after transfer that drying (immobilization) is carried out once for each transfer, or whether the nano ink composition for multiple transfers is dried collectively.

Among the methods for producing an electronic circuit substrate of the present invention, when a paper or resin film is used as the substrate, it is also possible to use a nano ink composition A uniform electronic circuit (layer) can be accurately formed according to a required pattern.

In addition, in the method of manufacturing the electronic circuit substrate of the present invention, when the contact angle of water on the surface of the base material is 30 or less, absorption and drying of the transferred nano ink composition is accelerated, Can be precisely formed.

In the method for producing an electronic circuit substrate of the present invention, when the content of the metal particles in the nano ink composition is 0.1 to 20 wt%, an electronic circuit (layer) having uniform, smooth surface, Can be formed. When the content of the metal particles in the nano ink composition is less than 0.1 wt% or vice versa, when the content of the metal particles in the nano ink composition exceeds 20 wt%, the surface of the electronic circuit layer is rough, uniform There is a possibility that a smooth nano ink composition layer can not be formed.

Among the methods for producing electronic circuit boards of the present invention, particularly when the metal particles in the nano ink composition are nanometer-sized silver particles, since the storage stability of the organs in the ink state is excellent, Can be manufactured with good reproducibility at low cost.

In the method of manufacturing the electronic circuit substrate of the present invention, when the printing plate is a flexographic printing plate, the amount of ink (the amount of ink transfer per one time) that can be held on the printing plate is large, The electronic circuit can be efficiently manufactured.

The electronic circuit substrate obtained by the method for producing an electronic circuit substrate is characterized in that an electronic circuit having practically sufficient thickness and conductivity on the surface thereof is used without requiring a heating and firing step that causes elongation and contraction on a flexible substrate As shown in FIG. In addition, since the electronic circuit substrate does not require a large-scale apparatus such as the vacuum apparatus or the oven for heating and firing, the electronic circuit substrate can be manufactured with a low initial investment and a low running cost.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic configuration diagram of a flexographic printing apparatus used in a method for manufacturing an electronic circuit substrate according to an embodiment of the present invention, and shows a state before transfer of ink starts. FIG.
2 is a view showing a state in which ink is held on a flexographic printing plate of a flexographic printing press according to an embodiment of the present invention.
3 is a diagram showing a state in which ink is transferred from the flexographic printing plate to an object (work W) in the embodiment of the present invention.
4 is a diagram showing a state in which transfer of ink to an object (workpiece W) is repeated several times in the embodiment of the present invention.
FIG. 5A is an enlarged plan view of an ink holding portion of a flexographic printing plate used in a method of manufacturing an electronic circuit substrate according to an embodiment of the present invention, and FIG. 5B is a view showing a cross section taken along the line XX 'in FIG.

Next, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the printing plate or the ink (layer) in each drawing is shown with its thickness emphasized.

First, the flexographic printing apparatus used in the method of manufacturing the electronic circuit substrate of the present embodiment will be briefly described. Fig. 1 is a schematic configuration diagram of a flexographic printing machine used in the present embodiment. In Fig. 1, reference numeral 1 denotes a plate cylinder, 2 denotes anilox roll, 3 denotes a squeegee ), "4" is an ink tank, and "S" is a moving stage for placing an object (work W). A flexographic printing plate 11 (hereinafter simply referred to as a "printing plate") having an ink holding portion is attached to the outer periphery (peripheral surface) of the driving rod 1 (FIGS. 2 to 4 are also the same).

Also, as will be described later, the anilox roll 2 and the platen 1 are configured to rotate synchronously when the ink is held. In addition, the moving stage S is configured to move (slide) in synchronization with the rotation of the driving rod 1 at the time of transfer of the ink.

As shown in Figs. 1 to 4, the electronic circuit substrate manufacturing method according to the present embodiment using the flexographic printing machine can be applied to an electronic circuit composed of a nano ink composition ("ink" painted in black in the drawing) (A) a nano-ink composition containing metal particles is formed on one surface of a film-like substrate (workpiece W as an object to be printed) (Fig. 1 - Fig. 2) and Fig. 2 (B) show the steps of bringing the surface of the work W into close contact with the printing plate 11 , The step of transferring the nano ink composition held in the ink holding portion onto the work W (Figs. 2 to 3), and (C) after the transfer, A step of drying and immobilizing in an environment to obtain an electronic circuit of a predetermined pattern Sound].

More specifically, a printing plate 11 on which an ink holding portion of a predetermined pattern (see FIG. 5) is formed on the front surface (upper surface) as a preparation process before printing (transfer) And a predetermined nano ink composition (nano silver colloidal ink, trade name: Drycure®, manufactured by Nippon Unicar Co., Ltd.) was wound and fixed at a predetermined position on the outer circumferential surface of the anilox roll 2 provided with the squeegee 3, , Manufactured by Colloidal Inc.). Then, a film substrate (workpiece W) made of paper or resin or the like, which has been subjected to a surface treatment for enhancing the water absorbency in advance on the surface (printing surface), is prepared and placed at a predetermined position on the moving stage S .

In addition, since the nano silver and silver colloidal inks have excellent storage stability, they may be stored in the ink tank 4 at all times. Further, in order to prevent unintentional drying of the nano silver colloidal ink on the printing plate 11, the periphery of the flexographic printing press including the periphery of the printing plate 1 is cleaned using a humidifier or an air conditioner, It is preferable to adjust the humidity to a humidifying atmosphere of 60% RH or more before starting.

Next, the step of (A) holding the nano ink composition on the printing plate 11 will be described. 1, the nano silver / silver colloidal ink is supplied from the ink tank 4 at a predetermined time interval while the anilox roll 2 is rotated, and the squeegee 3 ) Is used to form a liquid film of nano silver colloidal ink of a predetermined film thickness on the outer circumferential surface of the anilox roll 2. In this state, the platen 1 is synchronously rotated to bring the printing plate 11 into contact with the ink so that the ink holding portion of the printing plate 11 (the minute concave portion 11b on the top face) The nano silver colloidal ink is retained in the convex portion 11a.

Next, the step of transferring (B) the nano ink composition onto the work W will be described. In the step (B), while the printing plate 11 is rotated together with the platen 1, the work W, which is an object to be printed, is slid in synchronization with the moving stage S, 3 is held in the concave portion 11b of the top surface of the convex portion 11a by kiss-touching the surface (printing surface) of the work W as shown in Fig. 3, The ink for the month is transferred onto the surface of the work W in a predetermined pattern.

Next, (C) a step of drying and immobilizing the transferred nano ink composition in an atmosphere at 40 ° C or lower in the atmosphere will be described. In the step (C), the work (W) to which the nano-colored colloidal ink is transferred onto the surface as described above is dried (dried) on the moving stage (S) (The work W with the electronic circuit) can be obtained if the drying of the electronic circuit substrate (immobilization or film formation) can be confirmed and the drying can be confirmed.

In addition, if the temperature of the blowing air or the like does not exceed 40 占 폚, the drying can be shortened by using a blower, a hot air dryer or the like. Similarly, if the temperature of the work W does not exceed 40 占 폚, an indirect irradiation heating method such as an infrared lamp, a high-frequency heating such as a heat ray such as a heat ray or solar ray, an ultrasonic wave or a high- .

When the film thickness of the coating made of the nano silver or colloidal ink does not reach the original set film thickness even after drying, the transfer is repeated under the same processing conditions and the same mechanical setting, Nano coatings made of colloidal ink may be laminated in the same pattern in the same position (the film thickness is further emphasized in the drawings). Whether the drying step is carried out once for every transfer or if the drying of the nano-ink composition for a plurality of times is carried out at a time can be suitably changed in accordance with the dry state or roughness of the substrate surface after transfer have.

According to the above-described method for producing an electronic circuit substrate, even when a flexible substrate such as paper or resin, which is weak in heat, is used as the object (workpiece W), an excessive heat A uniform layer made of the nano ink composition (nano silver colloidal ink) can be stably formed on the surface thereof accurately and efficiently in accordance with a required pattern.

The nano ink composition used in the method for producing an electronic circuit substrate of the present invention includes metal nanoparticles (metal particles of nanometer size), an organic? -Conjugate ligand, and a solvent. Wherein the organic? -Conjugate ligand is? Bonded, and has strong conductivity due to strong? Bonding and intergranular approach.

As the metal used for the metal nanoparticles, any one or two or more metals selected from gold, silver, copper, platinum, palladium, nickel, ruthenium, indium and rhodium are mixed and used. The content of the metal nanoparticles in the nano ink composition is preferably 0.1 to 20 wt%, more preferably 0.5 to 10 wt%. When the content of the metal nanoparticles in the nano ink composition is less than 0.1 wt% or conversely, when the content of the metal nanoparticles in the nano ink composition exceeds 20 wt%, the surface of the electronic circuit (layer) , There is a possibility that a uniform and smooth nano ink composition layer can not be formed.

Examples of the organic? -Conjugate ligand constituting the nano ink composition include an amino group, a mercapto group, a hydroxyl group, a carboxyl group, a phosphine group, a phosphonic acid group, a halogen group, a selenol group, An amino group, an alkylamino group, an amide group, an imide group, a phosphonic acid group, a sulfonic acid group, a cyano group, a nitro group (a metal having a substituent group which binds to the surface of the metal nanoparticle) A substituent which makes the nanoparticles soluble in a solvent and an alcohol solvent) and salts thereof, and those having any one or more substituents. Among them, 2, 3, 9, 10, 16, 17, 23 and 24-octakis [(2-N, N-dimethylaminoethyl) thio] phthalocyanine (OTAP) and 2,3,11,12,20,21 , 29,30-octakis [(2-N, N-dimethylaminoethyl) thio] naphthalocyanine (OTAN) are preferably used.

As a preferable solvent constituting the nano ink composition, a water or water mixed solvent or an alcohol or alcohol mixed solvent can be mentioned. As the components other than water, alcohols, ethers, esters, ketones, amides and the like can be mentioned, but alcohols are more preferable, and alcohols having 1 to 10 carbon atoms are more preferable. Of these solvents, methanol, ethanol, 2-ethoxyethanol, ethylene glycol and propylene glycol can be particularly preferably used as the solvent.

In addition, the viscosity of the nano ink composition is preferably about 0.001 to 5 Pa · s (1 to 5000 cP), more preferably 0.01 to 4 Pa · s. If the viscosity exceeds or falls below the viscosity range, it tends to be difficult to precisely apply the ink (circuit pattern). The viscosity was measured at 20 ° C, standard rotor (1 ° 34 '× R24) and 0.5 to 100 rpm using a viscoelasticity meter TVE-22HT manufactured by Toki Sans.

As a specific example of the nano ink composition, a nano silver colloidal ink (trade name: Dry Cure, manufactured by Colloidal Inc.) as described above is preferably employed in consideration of cost, ease of handling and storage stability.

In addition, as the substrate (printed body) used in the method for producing an electronic circuit substrate of the present invention, a paper substrate made of paper or resin having a surface (printed surface) as described above is used. As the treatment for enhancing the absorbency of the surface of these substrates, any of surface treatment processing methods for improving the hydrophilicity of the substrate surface such as plasma treatment, corona discharge treatment, soft X-ray irradiation, ultraviolet irradiation, etc. may be used.

The base material may be provided with an absorbent ink-receiving layer by coating the surface to be printed. The ink receiving layer can be formed by coating a resin layer (film) containing at least one kind of fine particles selected from silica, kaolin (clay) and alumina by a suitable coating method. As the resin used for the ink receiving layer, an acrylic resin, a polyester resin, a polyurethane resin, or the like can be preferably used. The thickness of the ink receiving layer is preferably about 10 nm to 100 탆.

As a performance target of the hydrophilicity of the substrate surface after the surface treatment or the substrate provided with the ink-receiving layer on the surface, the water-repellency is used as a reference, and the contact angle of water on the surface of the substrate is 30 ° or less Respectively. If the contact angle of the water exceeds 30 °, the nano ink composition does not penetrate the substrate surface or the ink receiving layer, but diffuses laterally, making it difficult to draw a fine circuit pattern.

The contact angle of water was measured by a droplet method (θ / 2 method, dropping amount 2 μl) using an image analysis using an automatic contact angle meter DropMaster (DM) 300 manufactured by Kyowa Kai Mengagaku Co., Ltd. .

As the material (material) of the substrate main body, in addition to soft resin such as polyester resin, polyimide resin and polyamide resin, flexibility of the base material is impaired, but hard resin such as epoxy resin or phenol resin may be used. When the surface is modified to be absorbent, glass, metal, or the like may be used. In addition, it is also possible to use a film which is particularly susceptible to heat, such as a leather, a skin or an artificial skin, a film made of vegetable fiber or cellulose nanofiber, an animal-derived film produced from microorganisms or bacteria, or a film derived from plants such as trees and vegetables Even if it is a material or a material deteriorated in a special atmosphere, it can be used as a substrate of a method of manufacturing an electronic circuit substrate of the present invention if it is a material capable of absorbing the surface and maintaining a constant film shape.

Next, as the flexographic printing plate 11 used in the flexographic printing method of the present embodiment, for example, a mixture of a urethane acrylate prepolymer, an acrylate oligomer, an acrylate monomer, a photopolymerization inhibitor and a photopolymerization initiator Can be used as a convex printing plate formed by curing by ultraviolet irradiation through a negative film.

1 to 4) of the ink holding surface of the printing plate 11 is subjected to ultraviolet ray irradiation (photolithography) through the negative film to follow a predetermined circuit pattern (See an enlarged plan view of Fig. 5 (a) and a cross-sectional view (b) thereof), and the nano ink composition is held in the fine recesses 11b formed therebetween. The ink holding amount per unit area held in the ink holding portion on the printing plate 11 is set to about 1 to 50 ml / m < 2 >.

Further, as the flexographic printing plate 11, a convex printing plate made of " polyester rubber " obtained by curing a mixture of a resin composition and a photopolymerization initiator or the like by curing by ultraviolet irradiation through a negative film may be used. 5 (a) and 5 (b), and the ink holding amount per unit area held in the ink holding portion is also about 1 to 50 ml / m < 2 > .

Next, examples will be described together with comparative examples. However, the present invention is not limited to the following examples.

Example

In this example, an electronic circuit board was fabricated by flexographic printing using a nano ink composition (nano silver colloidal ink), and the conductivity (electric resistance value:?) Was compared. Electronic components were mounted on the electronic circuit board on which electric conduction was obtained, and it was confirmed whether or not the circuit was operating normally.

Prior to printing the nano ink composition, a substrate having surface characteristics suitable for transfer was selected.

[Selection of substrate]

The compatibility of the substrate was judged by " contact angle of water " of the surface. The measurement of the contact angle was carried out by a droplet method (? / 2 method, dropping amount 2 占 퐇) using an image analysis using an automatic contact angle meter DropMaster (DM) 300 manufactured by Kyoe Keimengagaku Co., The static contact angle was measured.

<Type of substrate>

The substrate used for the determination of suitability is a photographic paper for ink jet printers (two kinds of thick paper type that are commercially available as coated paper or glossy paper) and two kinds of paper made of polyethylene terephthalate (PET) Two kinds were prepared.

[Measurement of contact angle of water]

The above photographic paper sheets a and b, the PET film c (coating oil) and the PET film d (non-coated paper) were put on a measuring stand (horizontal) of the automatic contact angle meter in a no- The contact angle of water was measured immediately after dropping (0 second), after 10 seconds, after 60 seconds (1 minute), and after 300 seconds (5 minutes). The test was carried out twice for each sample, and the average was obtained. The results are shown in Table 1 below.

From the results of Table 1, photo paper a (manufactured by Epson Corporation) and PET film c (coating oil of ink receiving layer) were selected as substrates suitable for the embodiment of the present invention. The ink receiving layer is a layer (film) made of an acrylic resin containing cations and is uniformly coated on one surface of the film by a bar coater or the like to a thickness of about 17 占 퐉.

Next, electronic circuit boards of Examples 1 and 2 and Comparative Examples 1 to 3 were produced by flexographic printing. In addition, the nano ink composition, the flexographic printing machine, the printing conditions, and the like used for the production of each prototype are as follows.

&Lt; Nano ink composition > (nano silver colloidal ink)

Nano ink DryCure (dry cure) Ag-J by Colloidal Inc.

Component: silver particle-particle diameter 1 to 100 nm (average particle diameter: 15 nm)

      Organic? -Conjugate ligand

      Solvent based on water

Solid content: 10 to 20 wt%

Viscosity: 5 ~ 1155 mPa · s

<Description>

The photographic paper a (manufactured by Epson Inc., thickness: 0.3 mm) and the photographic paper b (manufactured by Kokuyo Co., thickness: 0.3 mm) were used as paper.

And a PET film d (Toyobo Co., thickness 0.25 mm, without coating) as the resin, the above-mentioned PET film c [film part: made by Dores Co., thickness 0.1 mm, surface coated with ink receiving layer (17 탆 thickness)

The flexographic printing presses used in the production of the examples and comparative examples were used under the following processing conditions (see also Fig. 1 and the like for the schematic structure of the flexographic printing).

[Flexo printing machine]

Smart Labo-III (registered trademark) manufactured by Gomarate Tech Co.,

[Flexo printing plate]

Made by Gomarate Co., Ltd. Polyester rubber Resin Typeface: T-YP400V

Plate thickness: 2.84 mm 600 lines / inch

Hardness: 40 to 70 degrees (Shore A hardness)

Amount of ink retained in the printing ink holding portion: 4 ml / m &lt; 2 &gt; (adjusted width: 1 to 5 ml /

An ink holding portion of an electronic circuit pattern having a width of 1 mm is formed on the surface of the printing plate.

[Anilox roll]

200 lines / inch (100 ~ 600 lines / inch)

Cell capacity (cell volume): 8 ml / m &lt; 2 &gt; (adjustment range: 1.5 to 50 ml /

<Flexographic printing conditions>

· Printing speed (printing stage movement): 18 m / min

· Anilox roll speed: 25 m / min (peripheral speed)

· Nip width between anilox roll and printing plate: 8 ㎜ (adjustment width: 4 ~ 8 ㎜)

Nip width between printing plate and substrate: 10 mm (adjustment width: 8 to 12 mm)

· Print Chamber's environment (atmosphere)

    Temperature: 15 ~ 30 ℃ Humidity: 40 ~ 70% RH

· Drying conditions after printing

   Wind drying: temperature 23 ℃ (natural drying under atmospheric pressure): 30 seconds ~ 60 minutes

Further, in the case of promoting drying by spraying warm air, the temperature of the warm air and the temperature of the substrate were adjusted so as to be kept at 40 캜 or lower.

[Example 1]

Under the above processing conditions, the nano-ink composition was applied to the same position of the printed surface (coating surface) of the base material (photo paper a) continuously by the flexographic printing machine one time or three times and six times, respectively, Left for 60 minutes in a room temperature (23 ° C) atmosphere, and air dried to obtain an electronic circuit substrate of "Example 1" in which an electronic circuit was transferred onto a substrate.

[Example 2]

The nano ink composition was applied to the same position of the substrate surface by a flexographic printing machine in the same manner as in Example 1 except that the PET film c (coating the ink receiving layer) was used as the substrate, Respectively, and left for 60 minutes in an atmospheric (23 DEG C) atmosphere at room temperature to obtain an electronic circuit board of &quot; Example 2 &quot;.

[Comparative Example 1]

In the same manner as in Example 1 except that the photographic paper b (having a large water contact angle) was used as the base material, the nano ink composition was applied once or three times, six times Respectively, and left for 60 minutes in an atmosphere at room temperature (23 ° C) to obtain an electronic circuit board of "Comparative Example 1".

[Comparative Example 2]

In the same manner as in Example 1, except that the PET film d (having no ink receiving layer) was used as the substrate, the nano ink composition was applied to the same position of the substrate surface by a flexographic printing machine once or three times, six times And left standing at room temperature (23 캜) for 60 minutes to obtain an electronic circuit board of "Comparative Example 2".

[Comparative Example 3]

A nano ink composition was applied to the same position of the substrate surface by a flexographic printing machine in the same manner as in Example 2 except that the nano-ink composition was applied six times in succession using PET film c (coating of ink receiving layer, commercial heat resistance temperature 40 to 60 占 폚) The electronic circuit substrate was placed in an oven set at a holding temperature of 50 占 폚 or 60 占 폚 for 60 minutes, and the circuit wiring (laminated ink pattern: 1 mm width) was placed in an oven And dried to obtain an electronic circuit substrate of &quot; Comparative Example 3 &quot;.

Further, since the electronic circuit substrate of Comparative Example 3 was dried at 50 캜 or 60 캜, the substrate (substrate) was shrunk by heat elongation and shrinkage, and the circuit wiring was peeled and intermittently stopped. No other tests are conducted.

(Appearance) &quot; and &quot; thickness &quot; of the circuit wiring (dry ink pattern: 1 mm width) formed on the surface of the electronic circuit board (tentative article) of Examples 1 and 2 and Comparative Examples 1 and 2 Performance &quot; (conductivity).

[Appearance of circuit wiring]

Defects such as cracks and defects on the surface of the circuit wiring were observed by visual observation. In the evaluation, "F" is a large defect, "B" is a defect with a crack on the surface, and "A" is a defect.

[Thickness of circuit wiring portion]

The circuit wiring was cut for each substrate at the same position near the center of the circuit wiring pattern and the cross section was observed with a microscope (JSM-5500, manufactured by JEOL Ltd.) to determine the thickness of the circuit wiring : Unit 탆) was measured.

[Electrical resistance value of circuit wiring]

(Unit: Ω) of two points (distance: 10 mm) of the circuit wiring having a width of 1 mm formed by using a digital tester <Castamuse> at the same position near the center of the circuit wiring pattern, .

[Operation test of electronic circuit]

(Conductive electroconductive paint, PTP-1202G, silver coated copper + silver paste) was applied to a predetermined position (bump or the like) of the circuit wiring by using the electronic circuit board whose conductivity was confirmed in the above " (One-pack type polyester resin binder, room temperature drying room temperature-curing organic solvent type) was used to mount an electronic component such as an IC or an LED and connect the power supply to check whether it operates as an electronic circuit. The result is indicated by "A" for operation, and "F" for non-operation.

The results of the above tests are summarized in Table 2 below. In the table, &quot; - &quot; indicates that the test is not conducted (the trial product can not be produced).

In Table 2, when a nano-ink composition is applied over several times by using a hydrophilic base material having a surface contact angle of water of 30 DEG or less, a circuit board suitable for constituting an electronic circuit having a low electric resistance value, It can be efficiently obtained without using the heating step of FIG.

Although the embodiment has been described with reference to a specific form in the present invention, the embodiment is merely an example and is not to be construed as being limited. Various modifications that are obvious to those skilled in the art are also within the scope of the present invention.

(Industrial availability)

The method for manufacturing an electronic circuit board of the present invention and the electronic circuit board obtained therefrom can quickly and efficiently manufacture an electronic circuit board composed of a uniform nano ink composition layer under normal temperature and pressure. Therefore, the production method of the present invention can be applied not only to a flexible substrate which is "weak to heat" such as paper or resin, but also to a film made of leather, skin or artificial skin, plant fiber or cellulose nanofiber, microorganisms, It is possible to form an electronic circuit composed of a nano ink composition on the surface of the substrate even if the substrate is deteriorated in a specific atmosphere such as a film derived from a plant derived from a plant or a plant or a plant.

1: Barn Two: Anilox Roll
3: squeegee 4: ink tank
11: printing plate 11a:
11b: concave portion S: moving stage
W: Walk

Claims (7)

1. A method of manufacturing an electronic circuit substrate for immobilizing an electronic circuit of a predetermined pattern made of a nano ink composition containing metal particles on a substrate,
Comprising the steps of: holding a nano-ink composition containing metal particles on a printing plate having a predetermined pattern of ink holding portions on a surface thereof; and adhering the nano-ink composition held on the ink- And a step of drying and fixing the transferred nano ink composition after the transfer in an environment of 40 ° C or lower in the atmosphere to form an electronic circuit of a predetermined pattern. The method according to claim 1,
Wherein the substrate is paper or a resin film. 3. The method of claim 2,
Wherein the contact angle of water on the surface of the substrate is 30 DEG or less. 4. The method according to any one of claims 1 to 3,
Wherein the content of the metal particles in the nano ink composition is 0.1 to 20 wt%. 5. The method of claim 4,
Wherein the metal particles in the nano ink composition are nanometer-sized silver particles. 6. The method according to any one of claims 1 to 5,
Wherein the printing plate is a flexographic printing plate. An electronic circuit board obtained by the manufacturing method according to any one of claims 1 to 6.

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