KR20170061917A - Surface-Mount Typed Connecting Terminal - Google Patents

Surface-Mount Typed Connecting Terminal Download PDF

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Publication number
KR20170061917A
KR20170061917A KR1020150167090A KR20150167090A KR20170061917A KR 20170061917 A KR20170061917 A KR 20170061917A KR 1020150167090 A KR1020150167090 A KR 1020150167090A KR 20150167090 A KR20150167090 A KR 20150167090A KR 20170061917 A KR20170061917 A KR 20170061917A
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KR
South Korea
Prior art keywords
upper plate
opening
downward
convex portion
upward
Prior art date
Application number
KR1020150167090A
Other languages
Korean (ko)
Inventor
이지연
이재운
홍승교
박진우
Original Assignee
협진커넥터(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 협진커넥터(주) filed Critical 협진커넥터(주)
Priority to KR1020150167090A priority Critical patent/KR20170061917A/en
Publication of KR20170061917A publication Critical patent/KR20170061917A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/245—Contacts for co-operating by abutting resilient; resiliently-mounted by stamped-out resilient contact arm

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type connection terminal, and more particularly, to a surface mount type connection terminal having a solder portion soldered to a surface of a substrate; A first upper plate formed at a position higher than the solder portion by being bent at one end of the solder portion and having a first opening formed along a longitudinal direction at a central portion thereof; A second upper plate formed at a position higher than the solder portion by being bent at the other end of the solder portion and having a second opening formed along the longitudinal direction at a central portion thereof; A first side wall formed to be bent downward from both ends in the width direction of the first upper plate; A second side wall bent downward from both ends in the width direction of the second upper plate; A first movable terminal formed at an inner end of the first opening of the first upper plate to extend in the longitudinal direction; A second movable terminal formed at an inner end of the second opening of the second upper plate to extend in the longitudinal direction; A first support leg bent downward from an end of the first upper plate; And a second support leg bent downward from an end of the second upper plate to reduce the area of the solder portion, thereby reducing manufacturing cost.

Description

[0001] Surface-Mount Typed Connecting Terminal [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type connection terminal, and more particularly, to a surface mount type connection terminal used for electrically connecting two or more electronic components to transmit a signal or for EMI (Electro Magnetic Interference)

In general, the surface mount type connection terminal is used for various purposes such as electrically connecting two or more electronic components to each other and transmitting signals therebetween, or EMI (Electro Magnetic Interference) It is applicable to various parts including charging terminal.

In recent years, surface mount type connection terminals have become more and more important, and usage and number of use are increasing. As a result, many efforts have been made to develop and improve various types of surface mount type connection terminals .

Among them, the technology of Patent Application No. 10-2014-0061540 (registration number: 10-1449613, name of invention: spring finger) is superior in electromagnetic wave shielding efficiency and excellent in elasticity, However, this technique has a problem that since the area of the base portion 10 to be soldered is large, the manufacturing cost is large and the elastic contact portion 30 is affected by lead or heat during soldering, There is a risk of degradation.

Application No. 10-2014-0061540 (registration number: 10-1449613, title of the invention: spring finger)

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems of the prior art described above, and it is an object of the present invention to provide a surface mount type connection terminal capable of reducing an area of a solder portion to reduce manufacturing cost, .

According to an aspect of the present invention, there is provided a surface mount type connection terminal comprising: a solder portion soldered to a surface of a substrate; A first upper plate formed at a position higher than the solder portion by being bent at one end of the solder portion and having a first opening formed along a longitudinal direction at a central portion thereof; A second upper plate formed at a position higher than the solder portion by being bent at the other end of the solder portion and having a second opening formed along the longitudinal direction at a central portion thereof; A first side wall formed to be bent downward from both ends in the width direction of the first upper plate; A second side wall bent downward from both ends in the width direction of the second upper plate; A first movable terminal formed at an inner end of the first opening of the first upper plate to extend in the longitudinal direction; A second movable terminal formed at an inner end of the second opening of the second upper plate to extend in the longitudinal direction; A first support leg bent downward from an end of the first upper plate; And a second support leg bent downward from an end of the second upper plate.

Here, the first movable terminal may include a first horizontal portion connected in the horizontal direction at an inner end of the first opening; A first upward convex portion protruding upward from an end of the first horizontal portion; A first downward convex portion protruding downward from an end of the first upward convex portion; And a first connecting portion formed to be convex upward from an end of the first downward convex portion,

The second movable terminal includes a second horizontal portion connected in the horizontal direction at an inner end of the second opening; A second upward convex portion protruding upward from an end of the second horizontal portion; A second downward convex portion convex downward from an end of the second upward convex portion; And a second connecting portion formed to be convex upward from an end of the second downward convex portion.

The upper end of the first upward convex portion is exposed to the upper side of the first opening and the lower end of the first downward convex portion is exposed to the lower side of the first opening. And is positioned higher than the first upward convex portion,

Wherein the second upward convex portion is exposed to the upper side of the second opening and the lower end of the second downward convex portion is exposed to the lower side of the second opening and the upper end of the second upward convex portion is exposed to the upper side of the second opening, And is located higher than the second upward convex portion.

On the other hand, the bottom surface of the solder portion, the lower ends of the first side wall and the second side surface, and the lower ends of the first and second support legs are located on the same plane.

In the surface-mount type connection terminal of the present invention configured as described above, one solder portion located at the center is attached to the substrate to enable both of the two movable terminals to be operated, thereby reducing the area of the solder portion to be soldered, .

In addition, since the first movable terminal and the second movable terminal are positioned higher than the solder portion, the first and second movable portions are not affected by lead and heat at the time of soldering of the solder portion, .

1 is a perspective view of a surface mount type connection terminal according to the present invention;
2 is a view showing a cut-away view of a surface mount type connection terminal according to the present invention;
3 is a front view of a surface mount type connection terminal according to the present invention.
4 is a plan view of a surface mount type connection terminal according to the present invention;
5A and 5B are views showing a state in which the contact member contacts the surface-mounted connection terminal according to the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a surface mount type connection terminal according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a surface mount type connection terminal according to the present invention, and FIG. 2 is a view showing a cut surface of a surface mount type connection terminal according to the present invention.

3 is a front view of the surface-mounted connection terminal according to the present invention, and Fig. 4 is a plan view of the surface-mounted connection terminal according to the present invention.

5A and 5B are views showing a state in which the contact member contacts the surface-mounted connection terminal according to the present invention.

The surface mount type connection terminal according to the present invention is attached to the surface of a PCB of an electronic device such as a mobile phone and contacts with a contact member such as a cover on which an antenna is mounted or contacts with another contact member to perform various functions including EMI (Electro Magnetic Interference) And is made by bending or cutting a strip-shaped metal plate made of a conductive material such as metal. It is preferable that the metal plate used for manufacturing the surface mount type connection terminal is made of a material excellent in elastic restoring force against external pressure.

The surface mount type connection terminal includes a solder portion 10, a first upper plate 20 and a second upper plate 30 integrally formed at both ends of the solder portion 10, A second sidewall 50 integrally formed at a widthwise end of the second upper plate 30 and a second sidewall 50 integrally formed at a widthwise end of the first upper plate 20, A second movable terminal 70 formed integrally with the second upper plate 30 and a second movable terminal 70 formed integrally with the first upper plate 20 in the longitudinal direction, 1 support leg 80 and a second support leg 90 integrally formed at the longitudinal end of the second upper plate 30. [

The solder portion 10 is a flat metal plate having a flat bottom surface and is attached to the surface of a substrate such as a PCB by soldering.

The first upper plate 20 is bent upward from one end of the solder part 10 and bent in a horizontal direction. The first upper plate 20 is formed at a higher position than the solder part 10. Since the first upper plate 20 is located at a higher position than the solder portion 10, the influence of the first upper plate 20 due to the heat generated when the solder is soldered to the solder portion 10 is minimized .

The first upper plate 20 is formed in the shape of a quadrilateral panel whose approximate shape is long in the left and right direction, and a first opening 20a is formed.

The first opening 20a is elongated in the central portion of the first upper plate 20 in the left-right direction along the longitudinal direction of the first upper plate 20. [ The first movable terminal 60 is rotated through the first opening 20a to move up and down.

The second upper plate 30 is formed at a position higher than the solder portion 10 by being bent upward from the other end of the solder portion 10 and then bent in the horizontal direction. More precisely, the second upper plate (30) is formed at the same height as the first upper plate (20). Since the second upper plate 30 is positioned higher than the solder portion 10 in this manner, when the solder portion 10 is soldered to the solder portion 10, the second upper plate 30 ) Can be minimized.

The second upper plate 30 is formed in the same shape as the first upper plate 20 in the form of a quadrangular panel having a rough shape in the left and right direction, and a second opening 30a is formed.

The second opening 30a is formed in a central portion of the second upper plate 30 so as to be long in the lateral direction along the longitudinal direction of the second upper plate 30. The second movable terminal 70 is rotated through the second opening 30a to move up and down.

The first side wall 40 is bent downward at both ends in the width direction of the first upper plate 20 to have a constant height. The lower end of the first sidewall 40 is located on the same plane as the bottom surface of the solder portion 10. As a result, the first upper plate 20 located at a higher position than the solder portion 10 is prevented from striking downward, and the first upper plate 20 can be stably supported.

The second side wall 50 is bent downward at both ends in the width direction of the second upper plate 30 to have a constant height. The lower end of the second sidewall 50 is located on the same plane as the bottom surface of the solder portion 10. This prevents the second upper plate 30, which is positioned higher than the solder portion 10, from striking the lower side and stably supports the second upper plate 30. [

The first movable terminal 60 is formed along the longitudinal direction at an inner end of the first opening 20a of the first upper plate 20.

The first movable terminal 60 includes a first horizontal portion 61, a first upward convex portion 62 integrally formed at an end of the first horizontal portion 61 and a second upward convex portion 62 formed integrally with the first upward convex portion 62 A first downward convex portion 63 integrally formed at an end of the first downward convex portion 63 and a first connecting portion 64 integrally formed at an end of the first downward convex portion 63.

The first horizontal portion 61 is horizontally connected to an inner end of the first opening 20a. That is, the first horizontal portion 61 is connected to the first upper plate 20 and extends toward the center of the first opening 20a.

The first upward convex portion 62 is formed to be convex upward from the end of the first horizontal portion 61. The upper end of the first upward convex portion 62 is positioned higher than the upper surface of the first upper plate 20 because the upper end of the first upward convex portion 62 is exposed above the first opening 20a.

The first downward convex portion 63 is formed to be convex downward from an end of the first upward convex portion 62. Since the lower end of the first downward convex portion 63 is exposed to the lower side of the first opening 20a, the lower end of the first downward convex portion 63 is positioned lower than the bottom surface of the first upper plate 20. [

The first connecting portion 64 is formed to be convex upward from the end of the first downward convex portion 63. Since the upper end of the first connecting portion 64 is exposed above the first opening 20a, the upper end of the first upward convex portion 62 is positioned higher than the upper surface of the first upper plate 20. In addition, since the upper end of the first connecting portion 64 is positioned higher than the upper end of the first upward convex portion 62, when the cover of the cellular phone or other contact member descends downward, And is pressed downward in contact with the first connecting portion 64. When the first connecting portion 64 is pushed in contact with the contact member, the first movable terminal 60 rotates downward about the first horizontal portion 61. At this time, the first movable terminal 60 contacts the first And is pressed downward through the opening 20a.

The second movable terminal 70 is formed long in the longitudinal direction at an inner end of the second opening 30a of the second upper plate 30.

The second movable terminal 70 includes a second horizontal portion 71, a second upward convex portion 72 integrally formed at an end of the second horizontal portion 71, and a second upward convex portion 72 A second downward convex portion 73 integrally formed at an end of the first downward convex portion 73 and a second connection portion 74 integrally formed at an end of the second downward convex portion 73.

The second horizontal portion 71 is horizontally connected to an inner end of the second opening 30a. That is, the second horizontal portion 71 is connected to the second upper plate 30 and extends toward the center of the second opening 30a.

The second upward convex portion 72 is formed to be convex upward from the end of the second horizontal portion 71. Since the upper end of the second upward convex portion 72 is exposed above the second opening 30a, the upper end of the second upward convex portion 72 is positioned higher than the upper surface of the second upper plate 30.

The second downward convex portion 73 is formed to be convex downward from an end of the second upward convex portion 72. Since the lower end of the second downward convex portion 73 is exposed to the lower side of the second opening 30a, the lower end of the second downward convex portion 73 is positioned lower than the bottom surface of the second upper plate 30.

The second connecting portion 74 is formed to be convex upward from the end of the second downward convex portion 73. The upper end of the second upward convex portion 72 is positioned higher than the upper surface of the second upper plate 30 because the upper end of the second connecting portion 74 is exposed above the second opening 30a. In addition, since the upper end of the second connecting portion 74 is positioned higher than the upper end of the second upward convex portion 72, when the cover of the cellular phone or other contact member descends downward, And is pressed downward while being in contact with the second connecting portion 74. When the second connecting portion 74 is pushed in contact with the contact member, the second movable terminal 70 rotates downward about the second horizontal portion 71. At this time, the second movable terminal 70 contacts the second And is pushed downward through the opening 30a.

The first movable terminal 60 and the second movable terminal 70 are formed on the first upper plate 20 and the second upper plate 30 respectively and the first upper plate 20 and the second upper plate 30 The first movable terminal 60 and the second movable terminal 70 are positioned higher than the solder portion 10 because the first movable terminal 60 and the second movable terminal 70 are formed at positions higher than the solder portion 10.

If the first movable terminal 60 and the second movable terminal 70 are formed at the same position as the solder portion 10, the lead and the heat are transferred to the first movable terminal 60 and the second movable terminal 70 ), Which may reduce contact force, decrease reliability, and deteriorate function. This problem is solved by placing the first movable terminal 60 and the second movable terminal 70 at a higher position than the solder portion 10. [

The first movable terminal 60 and the second movable terminal 70 are positioned on both sides of the solder portion 10, that is, one solder portion 10 is attached to the substrate, So that the area of the solder part 10 is reduced as much as the cost.

The first support leg 80 is bent downward from an end of the first upper plate 20 to have a constant height. The lower end of the first support leg 80 is positioned on the same plane as the bottom surface of the solder portion 10. [ As a result, the first support legs 80 together with the first side wall 40 prevent the first upper plate 20 from striking the lower side and stably support the first upper plate 20.

The second support legs 90 are bent downward from an end of the second upper plate 30 to have a constant height. The lower end of the second support leg 90 is positioned on the same plane as the bottom surface of the solder portion 10. [ Thus, the second support leg 90 prevents the second upper plate 30 from hitting downward together with the second side wall 50, and stably supports the second upper plate 30.

10: solder portion 20: first top plate
20a: first opening 30: second top plate
30a: second opening 40: first side wall
50: second side wall 60: first movable terminal
61: first horizontal part 62: first upward convex part
63: first downward convex portion 64: first connection portion
70: second movable terminal 71: second horizontal part
72: second upward convex portion 73: second downward convex portion
74: second connecting portion 80: first supporting leg
90: second supporting leg

Claims (6)

A solder portion (10) soldered to the substrate surface;
A first upper plate 20 bent at one end of the solder portion 10 and formed at a position higher than the solder portion 10 and having a first opening 20a formed at a central portion thereof along the longitudinal direction;
A second upper plate 30 bent at the other end of the solder portion 10 and formed at a position higher than the solder portion 10 and having a second opening 30a formed along the longitudinal direction at a central portion thereof;
A first sidewall 40 formed to be bent downward at both ends in the width direction of the first upper plate 20;
A second side wall (50) bent downward from both ends in the width direction of the second upper plate (30);
A first movable terminal (60) formed at an inner end of the first opening (20a) of the first upper plate (20) along the longitudinal direction;
And a second movable terminal (70) extending along the longitudinal direction at an inner end of the second opening (30a) of the second upper plate (30).
The method according to claim 1,
The first movable terminal 60 includes a first horizontal portion 61 connected in the horizontal direction at an inner end of the first opening 20a,
A first upward convex portion 62 convex upward from an end of the first horizontal portion 61;
A first downward convex portion 63 convex downward from an end of the first upward convex portion 62;
And a first connection part (64) formed to be convex upward from an end of the first downward convex part (63).
The method of claim 2,
The upper end of the first upward convex portion 62 is exposed above the first opening 20a,
The lower end of the first downward convex portion 63 is exposed downwardly of the first opening 20a,
Wherein the first connection portion (64) is exposed above the first opening (20a) and positioned higher than the first upward convex portion (62).
The method according to claim 1,
The second movable terminal 70 includes a second horizontal portion 71 connected in the horizontal direction at an inner end of the second opening 30a;
A second upward convex portion 72 convex upward from the end of the second horizontal portion 71;
A second downward convex portion 73 convex downward from an end of the second upward convex portion 72;
And a second connection portion (74) formed to be convex upward from an end of the second downward convex portion (73).
The method of claim 5,
The upper end of the second upward convex portion 72 is exposed above the second opening 30a,
The lower end of the second downward convex portion 73 is exposed to the lower side of the second opening 30a,
Wherein the second connection portion (74) is exposed at an upper portion of the second opening (30a) and higher than the second upward convex portion (72).
The method according to claim 1,
A first support leg 80 bent downward from an end of the first upper plate 20;
And a second support leg (90) bent downward from an end of the second upper plate (30).

[Claim 7]
The method of claim 6,
The lower end of the first side wall 40 and the lower end of the second side wall 50 and the lower ends of the first and second support legs 80 and 90 are on the same plane Surface mount type connection terminal.
KR1020150167090A 2015-11-27 2015-11-27 Surface-Mount Typed Connecting Terminal KR20170061917A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150167090A KR20170061917A (en) 2015-11-27 2015-11-27 Surface-Mount Typed Connecting Terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150167090A KR20170061917A (en) 2015-11-27 2015-11-27 Surface-Mount Typed Connecting Terminal

Publications (1)

Publication Number Publication Date
KR20170061917A true KR20170061917A (en) 2017-06-07

Family

ID=59223590

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150167090A KR20170061917A (en) 2015-11-27 2015-11-27 Surface-Mount Typed Connecting Terminal

Country Status (1)

Country Link
KR (1) KR20170061917A (en)

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