KR20170059024A - Circulated Ozonate Water Generator - Google Patents

Circulated Ozonate Water Generator Download PDF

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Publication number
KR20170059024A
KR20170059024A KR1020150162225A KR20150162225A KR20170059024A KR 20170059024 A KR20170059024 A KR 20170059024A KR 1020150162225 A KR1020150162225 A KR 1020150162225A KR 20150162225 A KR20150162225 A KR 20150162225A KR 20170059024 A KR20170059024 A KR 20170059024A
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KR
South Korea
Prior art keywords
water
ozone
buffer tank
ozonated water
ozonated
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Application number
KR1020150162225A
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Korean (ko)
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KR101818048B1 (en
Inventor
김혜신
김성인
배성희
황두철
Original Assignee
에스케이하이닉스 주식회사
에이치제이에스이엔지(주)
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Priority to KR1020150162225A priority Critical patent/KR101818048B1/en
Publication of KR20170059024A publication Critical patent/KR20170059024A/en
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Publication of KR101818048B1 publication Critical patent/KR101818048B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/72—Treatment of water, waste water, or sewage by oxidation
    • C02F1/78—Treatment of water, waste water, or sewage by oxidation with ozone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02079—Cleaning for reclaiming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/78—Details relating to ozone treatment devices
    • C02F2201/782—Ozone generators

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to an apparatus and a method for supplying ozonated water, recycling ozone gas used in ozonated water production and recycling ozonated water discharged from a semiconductor process equipment by bypass, thereby efficiently supplying ozonated water and supplying ozonated water An ozonated water supply apparatus and method capable of minimizing the cost are provided.

Description

Circulated Ozonate Water Generator

The present invention relates to an ozonated water supply device used in a semiconductor manufacturing process, and more particularly, to an ozonated water supply device for recycling an ozonated water discharged into a bypass in a semiconductor manufacturing process, Supply device.

BACKGROUND ART Ozone water has been widely used for removing organic compounds and metal impurities adhered to the surface of a semiconductor substrate in semiconductor manufacturing processes, or for oxidizing the surface of a semiconductor substrate.

Ozone water is widely used because of its strong oxidation reaction, its decomposition product is oxygen, and it is easy to treat the wastewater after substrate cleaning.

1 is a schematic view showing a conventional ozonated water supply device.

1, the conventional ozone generating apparatus is a cooling water (PCW: process cooling water), and oxygen (O 2) and nitrogen (N 2) the supplied received ozone (0 3), a discharge tube for generating a gas discharge (Ozonizer And a dissolution module 20 for generating ozone water by supplying ozone (O 3 ) gas, carbon dioxide (CO 2 ), and ultrapure water DIW discharged from the discharge tube 10 .

Here, ozone water (DO3) discharged through the dissolution module (20) is supplied to the semiconductor process chamber.

However, when the conventional ozonated water supply apparatus is operated and the ozonated water (DO3) starts to be supplied to the semiconductor process chamber, the supplied ozonated water (D03) is discharged to the bypass and unnecessarily consumed . Even when the ozonated water supply device normally supplies the ozonated water, the ozonated water is discharged to the bypass and unnecessarily consumed even if the process is not progressed in the chamber. That is, there is a problem that ozonated water is wasted.

Further, even when the generated ozone water (DO3) is generated in excess of the supply amount required for the semiconductor process, the remaining ozone water not supplied to the semiconductor process chamber is discharged as it is, resulting in waste of ozone water, Which increases the production cost due to an increase in ozonated water supply cost.

Also, ozone gas supplied to the dissolution module through the discharge tube is also wasted.

It is an object of the present invention to provide an ozonated water supply device capable of maximizing resource utilization efficiency by recycling ozone gas and ozonated water.

Another object of the present invention is to provide an ozonated water supply device capable of improving the semiconductor manufacturing process by appropriately controlling the concentration of supplied ozonated water.

According to an aspect of the present invention, there is provided an ozonated water supply apparatus comprising:

An ozonizer for generating ozone gas (O 3 gas); A dissolution module that receives ozone gas from the ozone generator to generate ozone water (DIO 3 ); A buffer tank which is bypassed from the external equipment and supplies the recovered ozonated water to the dissolution module; And an excess ozone gas recovery unit for recovering surplus ozone gas from the dissolution module and supplying the surplus ozone gas to the buffer tank.

Preferably, the ozonated water supply device according to an embodiment of the present invention may further include a temperature adjusting unit for adjusting the temperature of the ozonated water supplied from the buffer tank to the dissolution module.

Preferably, the surplus ozone gas recovery unit includes an aspirator for supplying ozone gas to the buffer tank due to a pressure difference between the first ozone gas recovered from one end of the dissolution module and the second ozone gas recovered from the other end of the dissolution module, Lt; / RTI >

Preferably, the ozonated water supply device according to an embodiment of the present invention includes: a first regulator for supplying ultrapure water to the buffer tank; And a second regulator for supplying recovered ozonated water to the buffer tank.

Preferably, the ozonated water supply device according to an embodiment of the present invention further includes means for monitoring the concentration of the ozonated water in the ozonated water discharge pipe of the dissolution module.

Preferably, the buffer tank is capable of discharging ozone water having the ozone concentration adjusted by receiving the ultrapure water, the recovered ozone water, and the excess ozone gas.

Preferably, the ozonated water supply device according to an embodiment of the present invention further includes a pump for supplying ozone water from the buffer tank to the dissolution module, and the temperature control unit may include a heat exchanger disposed at a rear end of the pump .

Preferably, the buffer tank may include a plurality of sensors for sensing the flow rate in the tank.

According to an embodiment of the present invention, there is provided a method of supplying ozonated water to a semiconductor process equipment, the method comprising: generating ozone gas; Mixing ozone gas and ultrapure water through a dissolution module to produce ozone water; Recovering surplus ozone gas when generating the ozonated water; Supplying the ozonated water to the process equipment; Recovering ozonated water bypassed in the process equipment; Mixing the ultrapure water, the recovered ozone water, and the recovered ozone gas in a buffer tank to produce ozone water for re-supply having a controlled concentration; And supplying the re-supply ozonated water to the process equipment through the dissolution module.

Preferably, the ozonated water supply method according to an embodiment of the present invention may further include adjusting a temperature of the ozonated water supplied from the buffer tank to the dissolution module.

 Preferably, the ozonated water supply method according to an embodiment of the present invention includes: adjusting the flow rate of the ultrapure water flowing into the buffer tank; And adjusting the flow rate of the recovered ozonated water flowing into the buffer tank.

The ozonated water supply device according to the embodiments of the present invention has an excellent effect of maximizing utilization of ozone gas and ozone water resources and improving the semiconductor manufacturing process environment and drastically lowering the manufacturing cost.

1 is a block diagram schematically showing a conventional ozonated water generating apparatus.
FIG. 2 is a configuration diagram showing an ozonated water supply apparatus according to a preferred embodiment of the present invention.
FIG. 3 is a schematic view of an ozonated water supply apparatus according to another embodiment of the present invention. FIG. 3 shows that a coolant pipe is further provided in the buffer tank for controlling the temperature of the ozonated water supplied from the buffer tank.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

2 is a configuration diagram showing an ozonated water supply apparatus according to a preferred embodiment of the present invention.

2, the ozonated water supply apparatus according to the invention ozone gas (O 3 Gas) the generated ozone generating unit for (Ozonizer, 110) and the ozone water when supplied to the ozone gas from the ozone generator (110) (DIO 3 And a buffer tank 150 for circulating the ozonated water recovered by bypassing from the external equipment to the dissolution module 120 and supplying the ozonated water to the dissolution module 120. The ozonated water supply apparatus according to the present invention may further include an excess ozone gas recovery unit 170 for recovering surplus ozone gas from the dissolution module 150 and supplying the surplus ozone gas to the buffer tank 150.

Ozone generator 110 receives the cooling water supply (PCW), the supply of oxygen (O 2) and reacts with nitrogen (N 2) is discharged by generating ozone (O 3) gas. The ozonated water generating unit 110 may generate ozonated water by a discharge method or an electrolytic method.

The dissolving module 120 receives ozone (O 3) gas, carbon dioxide (CO 2 ), and ozone water (or ultrapure water) supplied to the buffer tank 150 from the ozone generator 110 to generate ozone water Of process equipment.

The ozonated water supplied from the dissolving module 120 can be bypassed in an external process equipment, and the bypassed ozonated water can be recovered to the buffer tank 150. The recovered ozonated water may be supplied to the buffer tank 150 through a pressure regulator 140. That is, the pressure of the ozonated water recovered by the pressure regulator 140 can be controlled.

Buffer tank 150 when supplied with the recovered ozone pure water (DIW), and supplies the ozone water or pure water to dissolve module 120. The ozonated water or ultra pure water supplied from the buffer tank 150 may be supplied to the dissolution module 120 through the circulation pump 180. The buffer tank 150 functions to supply the ultra-pure water and the recovered ozonated water to re-supply the ozonated water. Since the ultrapure water and the recovered ozonated water are mixed, the ozonated water having a low concentration of ozone (O 3 ) is discharged. The ultrapure water supplied to the buffer tank 150 is regulated in flow rate through the regulator 160 and flows into the buffer tank 150. By regulating the amount of ultrapure water through the regulator 160, the concentration of the ozone water re-supplied can be adjusted. Further, the buffer tank 150 can receive ozone gas through the excess ozone gas recovery unit 170, whereby the ozone water concentration in the buffer tank 150 can be more easily adjusted.

On the other hand, when ozone gas and ozone water recovered into the buffer tank 150 are not introduced, only ultrapure water can be discharged from the buffer tank 150. Therefore, ultra pure water or ozonated water can be discharged from the buffer tank 150.

The buffer tank 150 may include a plurality of flow sensors. When the amount of the ozone water recovered through the flow sensors exceeds the set capacity, the inflow of ultrapure water is blocked, and when it is less than the set capacity, the ultrapure water can be supplied. In addition, the buffer tank overflow can be detected through the flow sensors to stop the start-up of the apparatus.

The circulation pump 180 serves to supply the ultrapure water or ozonated water discharged from the buffer tank 150 to the dissolution module 120 and adjust the pumping amount of the ultrapure water or the ozonated water according to the capacity of the ozonated water to be generated.

The ozonated water (ultrapure water) discharged from the buffer tank 150 and supplied to the dissolution module 120 may be supplied after being adjusted to a predetermined temperature through a temperature adjusting means. 2, the ultrapure water or ozonated water discharged through the circulation pump 180 is adjusted to a predetermined temperature through the heat exchanger 190 and then supplied to the dissolution module 120 have.

The ozone water discharged from the dissolution module 120 is analyzed for ozone water concentration through the concentration monitor 130 and the dissolution module 120 calculates the amount of supplied carbon dioxide (CO 2 ) and ozone (O 3 ) So that the desired concentration of ozonated water can be supplied to the process equipment.

Basically, the concentration and the temperature of the ozonated water can be set differently according to the purpose of the semiconductor process, and the concentration and temperature control of the ozonated water are very important for the zero treatment of the semiconductor process such as cleaning or etching.

FIG. 3 is a schematic view illustrating an ozonated water supply apparatus according to another embodiment of the present invention. In FIG. 3, a coolant pipe is further provided in the buffer tank for controlling the temperature of the ozonated water supplied from the buffer tank 150.

3, a cooling water pipe 610 for supplying cooling water is formed in the buffer tank 150. When the cooling water is supplied through the cooling water pipe 610, the buffer tank 150 removes the heat amount of the ozonated water, which is higher than the cooling water temperature, Can be lowered.

( 5 ° C to 20 ° C ) lower than the temperature ( 20 ° C to 30 ° C ) of the ultrapure water supplied to the buffer tank for cooling the ozonated water in the buffer tank (150) 610). The cooling water pipe 610 may be composed of a small-diameter coil-shaped pipe (for example, a pipe diameter of 1/4, a pipe length of 6 m or more) in order to maximize the area contacted with the ozonated water to enhance the cooling effect.

A flow rate control valve 631 for adjusting the flow rate of the cooling water, that is, the flow rate of the cooling water flowing into the buffer tank 150, is provided in the cooling water pipe protruding outside the buffer tank 150, And the flow meter 632 can be mounted on the cooling water inflow pipe so that the flow rate of the cooling water can be confirmed.

Whether or not the cooling water flows into the buffer tank 150 can be determined through the temperature sensor 620 and the control unit 640 formed at the outlet end of the buffer tank 150. That is, it is checked whether the temperature of the ozone water or the ultrapure water re-supplied to the dissolving module is equal to or higher than the reference temperature, and if the temperature of the ozone water is equal to or higher than the existing temperature, the flow control valve 631 may be operated to flow the cooling water into the cooling water pipe 610 .

FIG. 4 is a diagram showing the extra ozone recovery unit (reference numeral 170 'in FIG. 2) according to the present embodiment in more detail.

Referring to FIG. 4, excess ozone gas can be recovered from one end and the other end of the dissolution module 120. The recovered excess ozone gas may be introduced into the buffer tank 150 through the ozone gas input unit 410. In the buffer tank 150, ultrapure water and ozone gas can be mixed. More specifically, the ozone gas input unit 410 may be constituted by an aspirator. That is, the ozone gas recovered by the pressure difference between the first ozone gas recovered from the one end A of the dissolution module 120 and the second ozone gas recovered from the other end B of the dissolution module 120 is supplied to the buffer tank 150 can be turned on / off. for example. If the atmospheric pressure of the first stage A is relatively high and the atmospheric pressure of the second stage B is relatively low, the ozone gas flows into the buffer tank 150 through the aspirator.

Hereinafter, the driving of the ozonated water supply apparatus according to the preferred embodiment of the present invention will be described with reference to FIG.

The DIW is supplied to the dissolution module 120 through the buffer tank 150 and the O 3 gas is generated through the ozone generation unit 110 to be supplied to the dissolution module 120 . Thereby, ozone water is generated in the dissolution module 120.

Here, when the ozonated water supply device is started for the first time, since there is no ozonated water to be recovered, only ultra-pure water is supplied to the dissolution module to generate ozonated water.

The dissolving module 120 dissolves ozone (O 3 ) gas in ultrapure water in accordance with the concentration condition of the target to be applied to the semiconductor process to produce ozone water.

When the ozonated water is generated as described above, the ozonated water is supplied to the semiconductor process chamber through the supply line, and excess ozonated water is bypassed and introduced into the buffer tank 150.

On the other hand, surplus ozone gas is recovered from the dissolution module 120 through the surplus ozone gas recovery unit 170.

The recovered ozonated water, DIW, and recovered ozone gas are mixed in the buffer tank 150 to form a predetermined concentration of ozone water, which is supplied to the dissolution module 120 through the circulation pump 180.

Here, when the ozone water recovered to the buffer tank 150 is equal to or higher than the set capacity, the supply of ultrapure water can be interrupted, and ozone water can be generated in the buffer tank only by the recovered ozone water.

If only the re-supplied ozonated water is supplied to the dissolution module through the circulation tank, it is not necessary to control the concentration of the ozonated water, so that the ozone (O 3 ) gas and carbon dioxide (CO 2 ) supply can be stopped and only the ozonated water can be recirculated .

By repeating the above process, ozonated water bypassed in the process equipment is recycled, and ozonated water circulation is possible without ozone water. In addition, surplus ozone gas is recovered from the dissolving module and recycled to produce ozone water, whereby the working environment can be improved and the amount of gas (oxygen, CO2, etc.) of the apparatus to be introduced can be reduced, and the concentration of ozone water can be easily controlled.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

110: ozone generator 120: dissolution module
150: Buffer tank 170: Surplus ozone gas recovery unit

Claims (11)

An ozonizer for generating ozone gas (O 3 gas);
A dissolution module that receives ozone gas from the ozone generator to generate ozone water (DIO 3 );
A buffer tank which is bypassed from the external equipment and supplies the recovered ozonated water to the dissolution module; And
And a surplus ozone gas recovery section for recovering surplus ozone gas from the dissolution module and supplying it to the buffer tank
Ozone water supply.
The method according to claim 1,
And a temperature controller for controlling the temperature of the ozonated water supplied from the buffer tank to the dissolution module.
3. The method of claim 2,
The surplus ozone gas recovery unit includes:
And an aspirator for supplying ozone gas to the buffer tank by a pressure difference between the first ozone gas recovered from one end of the dissolution module and the second ozone gas recovered from the other end of the dissolution module.
The method according to claim 1,
A first regulator for supplying ultrapure water to the buffer tank; And
And a second regulator for supplying recovered ozonated water to the buffer tank
Ozone water supply.
The method according to claim 1,
Further comprising means for monitoring the concentration of the ozonated water in the ozonated water discharge pipe of the dissolution module.
5. The method of claim 4,
The buffer tank
Wherein the ozone water is supplied with the ultrapure water, the recovered ozone water, and the excess ozone gas to discharge the ozone water whose ozone concentration is adjusted. 3. The method of claim 2,
Further comprising a pump for supplying ozonated water from the buffer tank to the dissolution module,
Wherein the temperature control unit includes a heat exchanger disposed at a downstream end of the pump
Ozone water supply.
The method according to claim 1,
Wherein the buffer tank comprises a plurality of sensors for sensing a flow rate in the tank.
A method for supplying ozonated water to a semiconductor process equipment,
Generating ozone gas;
Mixing ozone gas and ultrapure water through a dissolution module to produce ozone water;
Recovering surplus ozone gas when generating the ozonated water;
Supplying the ozonated water to the process equipment;
Recovering ozonated water bypassed in the process equipment;
Mixing the ultrapure water, the recovered ozone water, and the recovered ozone gas in a buffer tank to produce ozone water for re-supply having a controlled concentration; And
And supplying the re-supply ozonated water to the process equipment through the dissolution module
Ozone water supply method.
10. The method of claim 9,
And adjusting the temperature of the ozonated water supplied from the buffer tank to the dissolution module.
10. The method of claim 9,
Adjusting a flow rate of the ultrapure water flowing into the buffer tank; And
And adjusting the flow rate of the recovered ozone water flowing into the buffer tank
Ozone water supply method.
KR1020150162225A 2015-11-19 2015-11-19 Circulated Ozonate Water Generator KR101818048B1 (en)

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KR101818048B1 KR101818048B1 (en) 2018-02-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102229940B1 (en) * 2020-07-01 2021-03-18 전원구 Ozone water supplying system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3680726B2 (en) 2000-10-31 2005-08-10 トヨタ車体株式会社 Ozone water production equipment
JP5412135B2 (en) * 2009-02-23 2014-02-12 野村マイクロ・サイエンス株式会社 Ozone water supply device
JP6734621B2 (en) * 2014-02-20 2020-08-05 オルガノ株式会社 Ozone water supply method and ozone water supply device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102229940B1 (en) * 2020-07-01 2021-03-18 전원구 Ozone water supplying system

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