KR20170048119A - Multilayer system by deposition - Google Patents
Multilayer system by deposition Download PDFInfo
- Publication number
- KR20170048119A KR20170048119A KR1020160021284A KR20160021284A KR20170048119A KR 20170048119 A KR20170048119 A KR 20170048119A KR 1020160021284 A KR1020160021284 A KR 1020160021284A KR 20160021284 A KR20160021284 A KR 20160021284A KR 20170048119 A KR20170048119 A KR 20170048119A
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- KR
- South Korea
- Prior art keywords
- layer
- deposition
- refraction
- thickness
- substrate
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/308—Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Surface Treatment Of Optical Elements (AREA)
Abstract
The present invention relates to a multilayer deposition system, comprising: a substrate; An antireflection layer disposed on the substrate and having a first refraction layer and a second refraction layer stacked with a material having a different refractive index; And a hydrophilic layer deposited on the antireflection layer, the hydrophilic layer comprising a material in which nitrogen (N) is added to titanium dioxide (TiO 2 ).
Description
The present invention relates to a multilayer deposition system, and more particularly, to a multilayer deposition system for enhancing antireflection and antifogging effects in the visible light region.
The multi-layer coating system is a system in which a high refractive index layer and a low refractive index layer are alternately laminated. Using a different progressive characteristic of light traveling in the high refractive index layer and a traveling light characteristic in the low refractive index layer, And the low refractive index layer, which is caused by the interference of light.
Such a multi-layer coating system is an anti-reflective coating of a spectacle lens, an optical splitter that transmits and reflects a certain amount of light, a short wavelength blocking filter that blocks short wavelengths, a long wavelength blocking filter that blocks long wavelengths, Or a reflective band pass / cut filter, a polarization splitter that transmits or reflects in accordance with the polarization state, a phase retarder, a 1.3 / 1.55 μm wavelength multiplexing / demultiplexing filter of optical communication components, a coarse wavelength division a multiplexer (CWDM), and a dense wavelength division multiplexer (DWDM) having a wavelength interval of 0.4 nm, 0.8 nm, and 1.6 nm.
However, the substrate used in the multilayer coating system according to the prior art was generally free from the risk of breakage due to impact, as compared with the polycarbonate substrate, in which a glass substrate was generally used.
In addition, most processes for depositing a high refractive index layer and a low refractive index layer on a substrate used in a multilayer coating system according to the prior art are performed by physical vapor deposition or chemical vapor deposition to realize deposition thickness of several nm There is a problem in that the thickness of the total deposition must be thick in order to obtain a desired antireflection effect.
In addition, the outermost layer of the multilayer coating system according to the prior art has a problem that a contact angle with water in a visible light region is large, foreign substances including moisture are formed, and the coating is vulnerable to contamination.
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and its object is to provide a multi-layer deposition system capable of simultaneously realizing antireflection effect and anti-fogging effect in a visible light region.
In order to achieve the above object, a multilayer deposition system according to the present invention comprises:
Board;
An antireflection layer disposed on the substrate and having a first refraction layer and a second refraction layer stacked with a material having a different refractive index; And
A hydrophilic layer deposited on the antireflective layer and comprising a material in which nitrogen (N) is added to titanium dioxide (TiO 2 );
And a control unit.
Here, the substrate preferably includes polycarbonate.
Here, the anti-reflection layer and the hydrophilic layer are preferably deposited by atomic layer deposition.
The first material forming the first refraction layer and the second material forming the second refraction layer preferably have a thermal expansion coefficient difference of 1.0 x 10 -6 / K or less.
The deposition thickness between the lower surface of the antireflection layer and the upper surface of the hydrophilic layer is preferably 200 nm or less.
Here, the deposition material of the antireflection layer may include,
It is preferably at least one selected from TiO 2 , SiO 2 , CeO 2 , MgF 2 , MgF 2 , ZrO 2 , Al 2 O 3 and ITO.
According to the multilayered deposition system of the present invention, an antireflective layer deposited on the substrate, and a hydrophilic layer deposited on the antireflective layer and comprising a material in which nitrogen (N) is added to titanium dioxide (TiO 2 ) The antireflection effect and the anti-fog effect in the light ray region can be implemented semi-permanently at the same time.
1 is a schematic cross-sectional view of a multilayer deposition system in accordance with an embodiment of the present invention.
Figure 2 is a schematic cross-sectional view of a multi-layer deposition system in which the deposition thickness of each layer is optimized in accordance with one embodiment of the present invention.
The terms used in this specification will be briefly described and the present invention will be described in detail.
While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. Also, in certain cases, there may be a term selected arbitrarily by the applicant, in which case the meaning thereof will be described in detail in the description of the corresponding invention. Therefore, the term used in the present invention should be defined based on the meaning of the term, not on the name of a simple term, but on the entire contents of the present invention.
The singular expressions include plural expressions unless the context clearly dictates otherwise. When an element is referred to as "including" an element throughout the specification, it is to be understood that the element may include other elements, without departing from the spirit or scope of the present invention.
In the drawings, the thickness is enlarged to clearly represent the layers and regions. In the drawings, for the convenience of explanation, the thicknesses of some layers and regions are exaggerated. Whenever a portion such as a layer, film, region, plate, or the like is referred to as being "on" or "on" another portion, it includes not only the case where it is "directly on" another portion but also the case where there is another portion in between.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
1 is a schematic cross-sectional view of a multilayer deposition system in accordance with an embodiment of the present invention.
Referring to FIG. 1, the
The
The
The
Here, the
The
The second
The
Here, the material to be deposited for forming the
In other words, each of the first material forming the
Here, the difference in thermal expansion coefficient between the first material forming the first
The residual stress between the
Accordingly, the first material / second material is TiO 2, respectively (Thermal expansion coefficient: 9.4 x 10 -6 / K) / Al 2 O 3 (thermal expansion coefficient: 9.6 x 10 -6 / K), CeO 2 (thermal expansion coefficient: 13 x 10 -6 / K) / MgF 2 : 13.7 x 10 -6 / K), CeO 2 (thermal expansion coefficient: 13 x 10 -6 / K) / MgO (thermal expansion coefficient: 12.8 x 10 -6 / K)
In this embodiment, the
The
Here, when a thin film containing a titanium dioxide (TiO 2 ) material absorbs light including a predetermined light energy or more, electrons are transferred from the valence band region to the conduction band region. Electrons transferred to the conduction band region form Active Oxygen Species on the surface of the thin film and Active Oxygen Species react to the hydrophilicity of the thin film surface including TiO 2 The contact angle is in the range of about 1 deg. When exposed to the ultraviolet ray region.
However, when a thin film surface containing a titanium dioxide (TiO 2 ) material is exposed to a visible light region, the contact angle reaches 30 °, and an anti-fog effect in the visible light region, that is, I do not.
However, when the
Meanwhile, as a method of depositing a layer on a substrate, a method such as electron-beam evaporation deposition, thermal evaporation deposition, laser molecular beam epitaxy (L-MBE) A physical vapor deposition method which can be classified into a pulsed laser deposition (PLD) method and a sputtering method; A chemical vapor deposition (CVD) method, a thermal chemical vapor deposition (TCVD) method, a rapid thermal chemical vapor deposition (RTCVD) method, an inductively coupled plasma chemical vapor deposition method Vapor Deposition (ICP-CVD); and the like; Atomic Layer Deposition (ALD).
In this embodiment, the
In this embodiment, the polycarbonate material used as the
Here, it is preferable that the deposition thickness between the lower surface of the
In other words, the thicknesses of the respective layers (the first
In the case of the Atomic Layer Deposition used in the present embodiment, since the deposition is performed in atomic layer units as compared with the physical vapor deposition method and the chemical vapor deposition method, the processing time may take a relatively long time. However, the thickness of each layer (the
Hereinafter, a method of optimizing the thickness of each layer (the first
Figure 2 is a schematic cross-sectional view of a multi-layer deposition system in which the deposition thickness of each layer is optimized in accordance with one embodiment of the present invention.
First, the evaporation material of the
In this embodiment, the input variable is set to 5% of the target reflectance limit in the entire range of the visible light range (400 to 700 nm), the total deposition thickness (d tot ) limit of the
An output variable that is input to the simulation function by inputting fixed variables and input variables defined in the present embodiment may be as follows.
The number of unit regions in which the first
The
In addition, the
The
In the
It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.
The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.
[Description of Reference Numerals]
100: multilayer deposition system 10: substrate
30: antireflection layer 31: first refraction layer
32: second refraction layer 50: hydrophilic layer
Claims (6)
An antireflection layer disposed on the substrate and having a first refraction layer and a second refraction layer stacked with a material having a different refractive index; And
A hydrophilic layer deposited on the antireflective layer and comprising a material in which nitrogen (N) is added to titanium dioxide (TiO 2 );
≪ / RTI >
Wherein the substrate comprises a polycarbonate. ≪ Desc / Clms Page number 13 >
Wherein the antireflection layer and the hydrophilic layer are deposited by atomic layer deposition.
Wherein the difference in thermal expansion coefficient between the first material forming the first refractive layer and the second material forming the second refractive layer is 1.0 x 10 < -6 > / K or less.
Wherein the deposition thickness between the lower surface of the antireflection layer and the upper surface of the hydrophilic layer is 200 nm or less.
The deposition material of the anti-
TiO 2 , Al 2 O 3 , CeO 2 , MgF 2 and MgO.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020160021284A KR20170048119A (en) | 2016-02-23 | 2016-02-23 | Multilayer system by deposition |
Applications Claiming Priority (1)
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KR1020160021284A KR20170048119A (en) | 2016-02-23 | 2016-02-23 | Multilayer system by deposition |
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KR20170048119A true KR20170048119A (en) | 2017-05-08 |
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KR1020160021284A KR20170048119A (en) | 2016-02-23 | 2016-02-23 | Multilayer system by deposition |
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2016
- 2016-02-23 KR KR1020160021284A patent/KR20170048119A/en not_active Application Discontinuation
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