KR20170048119A - Multilayer system by deposition - Google Patents

Multilayer system by deposition Download PDF

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Publication number
KR20170048119A
KR20170048119A KR1020160021284A KR20160021284A KR20170048119A KR 20170048119 A KR20170048119 A KR 20170048119A KR 1020160021284 A KR1020160021284 A KR 1020160021284A KR 20160021284 A KR20160021284 A KR 20160021284A KR 20170048119 A KR20170048119 A KR 20170048119A
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South Korea
Prior art keywords
layer
deposition
refraction
thickness
substrate
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KR1020160021284A
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Korean (ko)
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장영문
권대훈
정희준
이두원
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장영문
권대훈
이두원
정희준
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Priority to KR1020160021284A priority Critical patent/KR20170048119A/en
Publication of KR20170048119A publication Critical patent/KR20170048119A/en

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/308Oxynitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/403Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45527Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Surface Treatment Of Optical Elements (AREA)

Abstract

The present invention relates to a multilayer deposition system, comprising: a substrate; An antireflection layer disposed on the substrate and having a first refraction layer and a second refraction layer stacked with a material having a different refractive index; And a hydrophilic layer deposited on the antireflection layer, the hydrophilic layer comprising a material in which nitrogen (N) is added to titanium dioxide (TiO 2 ).

Description

[0001] MULTILAYER SYSTEM BY DEPOSITION [0002]

The present invention relates to a multilayer deposition system, and more particularly, to a multilayer deposition system for enhancing antireflection and antifogging effects in the visible light region.

The multi-layer coating system is a system in which a high refractive index layer and a low refractive index layer are alternately laminated. Using a different progressive characteristic of light traveling in the high refractive index layer and a traveling light characteristic in the low refractive index layer, And the low refractive index layer, which is caused by the interference of light.

Such a multi-layer coating system is an anti-reflective coating of a spectacle lens, an optical splitter that transmits and reflects a certain amount of light, a short wavelength blocking filter that blocks short wavelengths, a long wavelength blocking filter that blocks long wavelengths, Or a reflective band pass / cut filter, a polarization splitter that transmits or reflects in accordance with the polarization state, a phase retarder, a 1.3 / 1.55 μm wavelength multiplexing / demultiplexing filter of optical communication components, a coarse wavelength division a multiplexer (CWDM), and a dense wavelength division multiplexer (DWDM) having a wavelength interval of 0.4 nm, 0.8 nm, and 1.6 nm.

However, the substrate used in the multilayer coating system according to the prior art was generally free from the risk of breakage due to impact, as compared with the polycarbonate substrate, in which a glass substrate was generally used.

In addition, most processes for depositing a high refractive index layer and a low refractive index layer on a substrate used in a multilayer coating system according to the prior art are performed by physical vapor deposition or chemical vapor deposition to realize deposition thickness of several nm There is a problem in that the thickness of the total deposition must be thick in order to obtain a desired antireflection effect.

In addition, the outermost layer of the multilayer coating system according to the prior art has a problem that a contact angle with water in a visible light region is large, foreign substances including moisture are formed, and the coating is vulnerable to contamination.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and its object is to provide a multi-layer deposition system capable of simultaneously realizing antireflection effect and anti-fogging effect in a visible light region.

In order to achieve the above object, a multilayer deposition system according to the present invention comprises:

Board;

An antireflection layer disposed on the substrate and having a first refraction layer and a second refraction layer stacked with a material having a different refractive index; And

A hydrophilic layer deposited on the antireflective layer and comprising a material in which nitrogen (N) is added to titanium dioxide (TiO 2 );

And a control unit.

Here, the substrate preferably includes polycarbonate.

Here, the anti-reflection layer and the hydrophilic layer are preferably deposited by atomic layer deposition.

The first material forming the first refraction layer and the second material forming the second refraction layer preferably have a thermal expansion coefficient difference of 1.0 x 10 -6 / K or less.

The deposition thickness between the lower surface of the antireflection layer and the upper surface of the hydrophilic layer is preferably 200 nm or less.

Here, the deposition material of the antireflection layer may include,

It is preferably at least one selected from TiO 2 , SiO 2 , CeO 2 , MgF 2 , MgF 2 , ZrO 2 , Al 2 O 3 and ITO.

According to the multilayered deposition system of the present invention, an antireflective layer deposited on the substrate, and a hydrophilic layer deposited on the antireflective layer and comprising a material in which nitrogen (N) is added to titanium dioxide (TiO 2 ) The antireflection effect and the anti-fog effect in the light ray region can be implemented semi-permanently at the same time.

1 is a schematic cross-sectional view of a multilayer deposition system in accordance with an embodiment of the present invention.
Figure 2 is a schematic cross-sectional view of a multi-layer deposition system in which the deposition thickness of each layer is optimized in accordance with one embodiment of the present invention.

The terms used in this specification will be briefly described and the present invention will be described in detail.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. Also, in certain cases, there may be a term selected arbitrarily by the applicant, in which case the meaning thereof will be described in detail in the description of the corresponding invention. Therefore, the term used in the present invention should be defined based on the meaning of the term, not on the name of a simple term, but on the entire contents of the present invention.

The singular expressions include plural expressions unless the context clearly dictates otherwise. When an element is referred to as "including" an element throughout the specification, it is to be understood that the element may include other elements, without departing from the spirit or scope of the present invention.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. In the drawings, for the convenience of explanation, the thicknesses of some layers and regions are exaggerated. Whenever a portion such as a layer, film, region, plate, or the like is referred to as being "on" or "on" another portion, it includes not only the case where it is "directly on" another portion but also the case where there is another portion in between.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a multilayer deposition system in accordance with an embodiment of the present invention.

Referring to FIG. 1, the multi-layer deposition system 100 according to an exemplary embodiment of the present invention is configured to prevent reflection of incident light, particularly visible light, and to spread the thin film in contact with water droplets, A substrate 10, an antireflection layer 30, and a hydrophilic layer 50, as shown in FIG.

The substrate 10 may be a layer that provides a structure on which an antireflection layer 30 and a hydrophilic layer 50 can be deposited on one side. Here, the substrate 10 is preferably made of a material including polycarbonate which is lighter than glass and has excellent impact resistance. In the present embodiment, it is assumed that the substrate 10 is formed of a material containing polycarbonate. Here, the substrate 10 can be utilized as an outdoor display, a solar panel, a liquid crystal display panel, or the like installed in a building other than a building requiring reduction of reflectivity and anti-fogging.

The antireflection layer 30 is a layer in which a first refraction layer 31 and a second refraction layer 32 which are deposited with materials having different refractive indexes are laminated, and a layer in which incident light has a different refractive index is repeatedly The transmittance is improved by the interference of light and the reflection of the transmitted light can be minimized.

The antireflective layer 30 may have a desired reflectance in the entire range of the top light ray (400 to 700 nm) among the incident light incident through air, which is the medium above the hydrophilic layer 50, which is the outermost layer of the multilayer deposition system 100, The number of layers of the first refraction layer 31 and the second refraction layer 32 alternately stacked and the thickness of each layer may be optimized so that the thickness of the first refraction layer 31 and the second refraction layer 32 may be 7% or less, preferably 5% or less.

Here, the first refraction layer 31 may be a layer deposited on the substrate 10, and the second refraction layer 32 may be a layer deposited on the first refraction layer 31.

The first refraction layer 31 is deposited with a relatively high refractive index material as compared to the second refraction layer 32 and has a refractive index of 1.90 to 2.70 when considering the desired level of durability and the range of available high- Lt; / RTI >

The second refractive layer 32 is deposited with a relatively low refractive material as compared with the first refractive layer 31 and has a refractive index of 1.3 to 1.89 in consideration of a desired level of durability and a range of available low refractive materials Refractive index.

The first refraction layer 31 and the second refraction layer 32 which are adjacent to each other in this embodiment may be defined as one unitary unit region constituting a pair and the antireflection layer 32 may be defined by the first refraction layer 31, And the second refraction layer 32 may be stacked to form a plurality of unit regions.

Here, the material to be deposited for forming the antireflection layer 30 may be at least one selected from TiO 2 , Al 2 O 3 , CeO 2 , MgF 2 and MgO.

In other words, each of the first material forming the first refraction layer 31 and the second material forming the second refraction layer 32 is selected from among TiO 2 , Al 2 O 3 , CeO 2 , MgF 2 and MgO Lt; / RTI >

Here, the difference in thermal expansion coefficient between the first material forming the first refractive layer 31 and the second material forming the second refractive layer 32 is preferably selected to be 1.0 x 10 -6 / K or less.

The residual stress between the first refraction layer 31 and the second refraction layer 32 is minimized when the first refraction layer 31 and the second refraction layer 32 are deposited on the substrate 30 and then dried, It is possible to prevent deformation.

Accordingly, the first material / second material is TiO 2, respectively (Thermal expansion coefficient: 9.4 x 10 -6 / K) / Al 2 O 3 (thermal expansion coefficient: 9.6 x 10 -6 / K), CeO 2 (thermal expansion coefficient: 13 x 10 -6 / K) / MgF 2 : 13.7 x 10 -6 / K), CeO 2 (thermal expansion coefficient: 13 x 10 -6 / K) / MgO (thermal expansion coefficient: 12.8 x 10 -6 / K)

In this embodiment, the hydrophilic layer 50 to be described later TiO 2 , The first material / second material is TiO 2 (thermal expansion coefficient: 9.4 x 10 -6 / K) / Al 2 O 3 ( Thermal expansion coefficient: 9.6 x 10 < -6 > / K).

The hydrophilic layer 50 may comprise an outermost layer of the multilayer deposition system 100 that is deposited on the antireflective layer 10 and has nitrogen (N) added to the titanium dioxide (TiO 2 ).

Here, when a thin film containing a titanium dioxide (TiO 2 ) material absorbs light including a predetermined light energy or more, electrons are transferred from the valence band region to the conduction band region. Electrons transferred to the conduction band region form Active Oxygen Species on the surface of the thin film and Active Oxygen Species react to the hydrophilicity of the thin film surface including TiO 2 The contact angle is in the range of about 1 deg. When exposed to the ultraviolet ray region.

However, when a thin film surface containing a titanium dioxide (TiO 2 ) material is exposed to a visible light region, the contact angle reaches 30 °, and an anti-fog effect in the visible light region, that is, I do not.

However, when the hydrophilic layer 50 is deposited by adding nitrogen (N) to titanium dioxide (TiO 2 ) according to this embodiment, the hydrophilicity of the surface in the visible light region can be further accelerated. The contact angle may vary depending on the degree of addition of nitrogen (N). If 1.9 mol% of nitrogen (N) is added to titanium dioxide (TiO 2 ), the contact angle in the visible light range can be reduced to about 10 ° or less .

Meanwhile, as a method of depositing a layer on a substrate, a method such as electron-beam evaporation deposition, thermal evaporation deposition, laser molecular beam epitaxy (L-MBE) A physical vapor deposition method which can be classified into a pulsed laser deposition (PLD) method and a sputtering method; A chemical vapor deposition (CVD) method, a thermal chemical vapor deposition (TCVD) method, a rapid thermal chemical vapor deposition (RTCVD) method, an inductively coupled plasma chemical vapor deposition method Vapor Deposition (ICP-CVD); and the like; Atomic Layer Deposition (ALD).

In this embodiment, the antireflection layer 30 and the hydrophilic layer 50 are preferably deposited by atomic layer deposition.

In this embodiment, the polycarbonate material used as the substrate 10 has a glass transition temperature of about 145 DEG C, and the deposition temperature of the physical vapor deposition method and the chemical vapor deposition method is in the range of glass transition of a polycarbonate material Temperature is higher than that of the polycarbonate material, whereas when the atomic layer deposition is used, the deposition can be performed at a temperature lower than the glass transition temperature of the polycarbonate material. In addition, since atomic layer deposition can be performed at the atomic layer level, it is advantageous that the layers can be precisely deposited with a thickness of several nm.

Here, it is preferable that the deposition thickness between the lower surface of the antireflection layer 30 and the upper surface of the hydrophilic layer 50 is 200 nm or less.

In other words, the thicknesses of the respective layers (the first refractive layer 31, the second refractive layer 32, and the hydrophilic layer 33) are adjusted in units of several nm, and the thicknesses of the antireflection layer 30 and the hydrophilic layer 50 When the total deposition thickness (d tot ) is set to 200 nm or less and the target reflectance is 7% or less, preferably 5% or less, in the entire range of the top light ray (400 to 700 nm) Time can be minimized.

In the case of the Atomic Layer Deposition used in the present embodiment, since the deposition is performed in atomic layer units as compared with the physical vapor deposition method and the chemical vapor deposition method, the processing time may take a relatively long time. However, the thickness of each layer (the first refraction layer 31, the second refraction layer 32, and the hydrophilic layer 33) may be adjusted by several nm in thickness by atomic layer deposition, The total deposition thickness d tot of the antireflection layer 30 and the hydrophilic layer 50 can be optimized to 200 nm or less while the processing time can be reduced.

 Hereinafter, a method of optimizing the thickness of each layer (the first refractive layer 31, the second refractive layer 32, and the hydrophilic layer 33) of the multilayer deposition system 100 according to an embodiment of the present invention Will be described.

Figure 2 is a schematic cross-sectional view of a multi-layer deposition system in which the deposition thickness of each layer is optimized in accordance with one embodiment of the present invention.

First, the evaporation material of the hydrophilic layer 50 is a material having TiO 2 added with N as a fixed variable, and the target reflectance limit in the entire range of visible light (400 to 700 nm) The total deposition thickness (d tot ) limits of layer 50, the refractive indices of the first and second materials, the deposition material of the hydrophilic layer 50, the thickness (d 31 ) limits of the first refractive layer 31, the thickness of the refractive layer 32 (d 32) limit value, the thickness of the hydrophilic layer (50) (d 50) limit and iteration number as an input variable, and the first refraction layer 31 and the second refractive layer 32 The thickness d 31 of the first refraction layer 31 and the thickness d 32 of the second refraction layer 32 and the thickness d 50 of the hydrophilic layer 50 in the unit area, ) As an output variable. Here, the input / output of the simulation function can be performed using a commercialized program.

In this embodiment, the input variable is set to 5% of the target reflectance limit in the entire range of the visible light range (400 to 700 nm), the total deposition thickness (d tot ) limit of the antireflection layer 30 and the hydrophilic layer 50 200nm, the type of the first material is TiO 2 As, the refractive index of the first material is 2.35, the type of the second material is Al 2 O 3 As, the refractive index of the second material of 1.67, the thickness of the first refraction layer (31) (d 31) limit the 100nm, the second to limit the 40nm, the iteration number of times of the thickness (d 32) of the refraction layer (32) 1000 Circuit.

An output variable that is input to the simulation function by inputting fixed variables and input variables defined in the present embodiment may be as follows.

The number of unit regions in which the first refractive layer 31 and the second refractive layer 32 are paired is 2 and the antireflection layer 30 is divided into the first unit region 30a and the second unit region 30b The thickness d 31a of the first refractive layer 31a in the first unit area 30a is 18 nm and the thickness d 32a of the second refractive layer 32a in the first unit area 30a is 13 nm The thickness d 31b of the first refraction layer 31b of the second unit area 30b is 78 nm and the thickness d 32b of the second refraction layer 32b of the second unit area 30b is 35 nm, the thickness (d 50) of the layer 50 may be 12nm.

The multi-layer deposition system 100 of the above-described structure comprises an antireflection layer 30 deposited on the substrate, a hydrophilic layer 30 deposited on the antireflection layer and containing nitrogen (N) added to titanium dioxide (TiO 2 ) The anti-reflection effect and the anti-fog effect including the layer 10 can be semi-permanently implemented at the same time.

In addition, the multilayer deposition system 100 has a merit that the substrate 10 includes a polycarbonate material and can be relatively lightweight while improving impact resistance as compared with a glass substrate.

The multilayered deposition system 100 is formed by depositing the antireflection layer 30 and the hydrophilic layer 50 by atomic layer deposition to optimize the thickness of each layer in several nm units to minimize the total deposition thickness There is an advantage to be able to do. In addition, when the substrate 10 includes a polycarbonate material, it can be deposited using atomic layer deposition at a temperature lower than the glass transition temperature, It can be minimized.

In the multilayered deposition system 100, the first material forming the first refraction layer 31 and the second material forming the second refraction layer 32 have a difference in thermal expansion coefficient of 1.0 x 10 < -6 > / K The residual stress between the first refraction layer 31 and the second refraction layer 32 can be minimized.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

[Description of Reference Numerals]
100: multilayer deposition system 10: substrate
30: antireflection layer 31: first refraction layer
32: second refraction layer 50: hydrophilic layer

Claims (6)

Board;
An antireflection layer disposed on the substrate and having a first refraction layer and a second refraction layer stacked with a material having a different refractive index; And
A hydrophilic layer deposited on the antireflective layer and comprising a material in which nitrogen (N) is added to titanium dioxide (TiO 2 );
≪ / RTI >
The method according to claim 1,
Wherein the substrate comprises a polycarbonate. ≪ Desc / Clms Page number 13 >
The method according to claim 1,
Wherein the antireflection layer and the hydrophilic layer are deposited by atomic layer deposition.
The method of claim 3,
Wherein the difference in thermal expansion coefficient between the first material forming the first refractive layer and the second material forming the second refractive layer is 1.0 x 10 < -6 > / K or less.
The method according to claim 1,
Wherein the deposition thickness between the lower surface of the antireflection layer and the upper surface of the hydrophilic layer is 200 nm or less.
The method according to claim 1,
The deposition material of the anti-
TiO 2 , Al 2 O 3 , CeO 2 , MgF 2 and MgO.
KR1020160021284A 2016-02-23 2016-02-23 Multilayer system by deposition KR20170048119A (en)

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