KR20170047907A - Mems device, mems package and user terminal comprising the same - Google Patents

Mems device, mems package and user terminal comprising the same Download PDF

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Publication number
KR20170047907A
KR20170047907A KR1020150148580A KR20150148580A KR20170047907A KR 20170047907 A KR20170047907 A KR 20170047907A KR 1020150148580 A KR1020150148580 A KR 1020150148580A KR 20150148580 A KR20150148580 A KR 20150148580A KR 20170047907 A KR20170047907 A KR 20170047907A
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KR
South Korea
Prior art keywords
plates
mems
stationary
mems device
movable plates
Prior art date
Application number
KR1020150148580A
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Korean (ko)
Inventor
문상희
서평보
이종성
Original Assignee
주식회사 스탠딩에그
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Priority to KR1020150148580A priority Critical patent/KR20170047907A/en
Publication of KR20170047907A publication Critical patent/KR20170047907A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B5/00—Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

Abstract

Provided are an MEMS device and an MEMS package, and a user terminal comprising the same. The MEMS device comprises: a group composed of a plurality of moving type plates arranged with a mirror; and a plurality of fixing type plates arranged with a mirror on an upper portion or a lower portion of the moving type plates. Moreover, the group composed of the moving type plates and the fixing type plates is used for z-axis sensing. According to the present invention, provided is a vertical plate to improve linearity by increasing pull-in voltage.

Description

MEMS DEVICE, MEMS PACKAGE AND USER TERMINAL COMPRISING THE SAME,

The present invention relates to a MEMS device, and more particularly, to a perpendicular-plate-based MEMS device, a MEMS package including the same, and a user terminal.

Micro Electro Mechanical Systems (MEMS) are used in the field of automobiles such as satellite, missile, and unmanned airplane, air bag, ESC (Electronic Stability Control) and automobile black box And motion sensors such as game machines, and navigation systems.

In a MEMS device that senses the capacitance between a plurality of plates, the parallel plate method has a drawback that the linearity is poor due to a pull-in effect, and a parasitic electrical effect occurs have. In addition, the parallel plate type has poor sensitivity characteristics due to the squeeze film damping effect.

U.S. Published Patent Applications 2014-0283605, 2014.09.25

SUMMARY OF THE INVENTION It is an object of the present invention to provide a vertical plate-based MEMS device capable of improving pull-in voltage and improving linearity.

It is another object of the present invention to provide a vertical plate-based MEMS device capable of improving bandwidth characteristics by minimizing damping.

It is still another technical object of the present invention to provide a vertical plate-based MEMS device capable of improving sensitivity characteristics.

It is still another technical object of the present invention to provide a MEMS package including a MEMS device and a user terminal.

The technical objects of the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a MEMS device including a plurality of movable plates arranged in a mirror, and a plurality of fixed plate groups arranged in a mirror on an upper portion or a lower portion of the plurality of movable plates, Wherein the plurality of movable plates and the plurality of fixed plate groups are used for z-axis sensing.

In some embodiments of the present invention, each of the movable plates has an opening, a pedestal formed in the opening, a torsion bar extending from at least one side of the pedestal, bar).

In addition, the pedestal of each of the movable plates may be connected to a wiring for driving each of the movable plates.

In some embodiments of the present invention, each of the stationary plate groups may include a first stationary plate constituting a first capacitor and a second stationary plate constituting a second capacitor.

In addition, the capacitance of the first capacitor and the capacitance of the second capacitor may be oppositely increased or decreased.

The plurality of first stationary plates of the plurality of stationary plate groups may be connected to each other, or the plurality of second stationary plates may be connected to each other.

In addition, a wiring for driving the plurality of stationary plate groups may be connected to at least one of the plurality of first stationary plates and the plurality of second stationary plates of the plurality of stationary plate groups.

Also, wiring for driving the plurality of stationary plate groups may be connected only to one stationary plate group of the plurality of stationary plate groups.

According to another aspect of the present invention, there is provided a MEMS package including any one of the MEMS devices described above.

According to another aspect of the present invention, there is provided a user terminal including any one of the above-described MEMS devices.

Other specific details of the invention are included in the detailed description and drawings.

According to the MEMS device of the present invention, since the vertical plate-based structure is provided, the spacing between a plurality of plates relative to the parallel plate is increased, thereby improving the linearity since the pull-in voltage is increased.

Further, since the plate for sensing the capacitance is disposed as a mirror, the size or length of the plate can be reduced, and the damping coefficient is reduced, thereby minimizing the damping and improving the bandwidth characteristic.

Further, the plate for sensing the capacitance can be arranged as a mirror, and the same type of plate can be connected to each other to improve the sensitivity characteristic.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 is a plan view schematically showing a MEMS device according to an embodiment of the present invention.
FIGS. 2 to 3 are cross-sectional views schematically showing an acceleration sensing operation of the MEMS device of FIG. 1. FIG.
4 is a plan view schematically showing a MEMS device according to another embodiment of the present invention.
5 to 6 are sectional views schematically showing an acceleration sensing operation of the MEMS device of FIG.
7 is a schematic view of a MEMS package including a MEMS device according to an embodiment of the present invention.
8 to 9 are views schematically showing a sensor hub including a MEMS device according to an embodiment of the present invention.
10 is a view schematically showing a user terminal including a MEMS device according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. However, it is to be understood that the present invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It is to be understood by those of ordinary skill in the art that the present invention is not limited to the above embodiments, but may be modified in various ways. Like reference numerals refer to like elements throughout the specification.

Although the first, second, etc. are used to describe various elements, components and / or sections, it is needless to say that these elements, components and / or sections are not limited by these terms. These terms are only used to distinguish one element, element or section from another element, element or section. Therefore, it goes without saying that the first element, the first element or the first section mentioned below may be the second element, the second element or the second section within the technical spirit of the present invention.

It is to be understood that when an element or layer is referred to as being "on" or " on "of another element or layer, All included. On the other hand, a device being referred to as "directly on" or "directly above" indicates that no other device or layer is interposed in between. The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figure, an element described as " below or beneath "of another element may be placed" above "another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, in which case spatially relative terms can be interpreted according to orientation.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. In addition, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Hereinafter, an acceleration sensor of various MEMS devices will be described as an example of the present invention. However, it should be understood that the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. It is to be understood that the present invention can be practically applied to any MEMS device that senses a plurality of MEMS devices without changing their technical ideas or essential features.

FIG. 1 is a plan view schematically showing a MEMS device according to an embodiment of the present invention, and FIGS. 2 to 3 are cross-sectional views schematically showing an acceleration sensing operation of the MEMS device of FIG.

Referring to Figure 1, a MEMS device 100 having a vertical plate-based structure is shown. The MEMS device 100 includes a plurality of movable plates 110, 160 and a plurality of stationary plate groups 120, 170.

The plurality of movable plates (110, 160) includes a first movable plate (110) and a second movable plate (160). The first movable plate 110 and the second movable plate 160 are arranged in a mirror with respect to each other. Each movable plate 110, 160 may be connected to a substrate (not shown) by support structures 130, 180. An opening can be formed in each of the movable plates 110 and 160 by removing a predetermined area inside each of the movable plates 110 and 160. [ The support structures 130 and 180 may then be formed in the opening. The support structures 130 and 180 may include pedestals 131 and 181 and torsion bars 132 and 182. The torsion bars 132 and 182 may extend from both sides of the pedestal 131 and 181 and be connected to the movable plates 110 and 160. 1, torsion bars 132, 182 may extend from one or more sides of pedestal 132, 182, although not explicitly shown. The movable plates 110 and 160 and the support structures 130 and 180 may include, but are not limited to, silicon or metal.

The torsion bars 132 and 182 may define a rotational axis through which the movable plates 110 and 160 move with respect to the pedestals 131 and 181 and the substrate. By the rotation axis, the movable plates 110 and 160 can be divided into a first region (for example, the outer frame of FIG. 1) and a second region (for example, the central portion of FIG. There is an empty space between the movable plates (110, 160) and the substrate, so that the movable plates (110, 160) can move. Wiring 153, 154 providing voltage may be connected to the pedestals 131, 181 for driving of the movable plates 110, 160.

A plurality of stationary plate groups 120, 170 are disposed below the plurality of movable plates 110, 160. The plurality of stationary plate groups 120 and 170 includes a first stationary plate group 120 and a second stationary plate group 170. The first stationary plate group 120 and the second stationary plate group 170 are arranged to correspond to the first movable plate 110 and the second movable plate 160 such that they overlap each other . Each stationary plate group 120, 170 may include a first stationary plate 121, 171 and a second stationary plate 122, 172. The first stationary plates 121 and 171 and the second stationary plates 122 and 172 may include but are not limited to metal. The first fixed plate 121 and the first fixed plate 121 constitute a first capacitor together with the corresponding movable plates 110 and 160 and the second fixed plates 122 and 172 constitute the corresponding movable plates 110 and 160 The second capacitor can be formed.

The first fixed plates 121 and 171 of the fixed plate groups 120 and 170 may be connected to each other and the second fixed plates 122 and 172 may be connected to each other. For driving, wires 151 and 152 for providing a voltage may be connected to the stationary plate groups 120 and 170. Since the first fixed plates 121 and 171 are connected to each other and the second fixed plates 122 and 172 are connected to each other, And the wiring 152 may be connected only to the second fixed plate 172 of the second fixed plate group 170. In this case, 1, the wiring 151 is connected only to the first fixed plate 171 of the second fixed plate group 170, and the wiring 152 is connected to the first fixed plate group (not shown) 120 of the first stationary plate 122. Alternatively, the wirings 151 and 152 may be connected to only one of the plurality of stationary plate groups 120 and 170, respectively.

By the movement of the movable plates 110 and 150, the capacitance of the first capacitor and the capacitance of the second capacitor can be increased or decreased inversely. That is, when the capacitance of the first capacitor is increased, the capacitance of the second capacitor is decreased, and when the capacitance of the first capacitor is decreased, the capacitance of the second capacitor may be increased. The direction and magnitude of the acceleration can be sensed using the increase and decrease of the capacitance.

2 to 3, the movable plates 110 and 160 and the fixed plates 121 to 122 and 171 to 172 may be used for z-axis acceleration sensing.

Mass mass may be connected to the movable plates 110 and 160, though not explicitly shown. Each mass may be connected to a movable plate 110, 160, or one mass may be connected to a movable plate 110, 160. The mass is movable according to an external force (or an inertial force due to an external force). When an external force is applied to the MEMS device 100, the movable plates 110 and 160 can move according to the movement of the mass body. At this time, the movable plates 110 and 160 can move to the mirror. The distance between the movable plates 110 and 160 and the fixed plates 121 to 122 and 171 to 172 is changed by the movement of the movable plates 110 and 160 and the acceleration Can be sensed.

2, when the acceleration in the first direction (acceleration in FIG. 2) is applied, the distance between the movable plates 110 and 160 and the first fixed plates 121 and 171 increases, The capacitances C11 and C21 of the first capacitor are decreased and the capacitances C21 and C22 of the second capacitor are increased because the interval between the first and second fixed plates 122 and 132 and the second fixed plates 122 and 172 is reduced. 3, the distance between the movable plates 110 and 160 and the first fixed plates 121 and 171 decreases, and when the accelerations in the second direction (acceleration in FIG. 3) are applied as shown in FIG. 3, The capacitance between the plates 110 and 160 and the second fixed plates 122 and 172 increases so that the capacitances C11 and C21 of the first capacitor are increased and the capacitances C21 and C22 of the second capacitor are decreased . When the acceleration is not applied, the movable plates 110 and 160 and the fixed plates 121 to 122 and 171 to 172 may be parallel to each other. The movement of the movable plates 110 and 160 according to the direction of the acceleration can be variously modified depending on the position of the mass body.

FIG. 4 is a plan view schematically showing a MEMS device according to another embodiment of the present invention, and FIGS. 5 to 6 are cross-sectional views schematically showing an acceleration sensing operation of the MEMS device of FIG. For convenience of description, differences from the MEMS device 100 described with reference to FIG. 1 will be mainly described.

Referring to FIG. 4, a MEMS device 100 'having a vertical plate-based structure is shown. The MEMS device 100 'includes a plurality of movable plates 110 and 160 and a plurality of fixed plate groups 120' and 170 '. A plurality of stationary plate groups 120 ', 170' are disposed on top of the plurality of movable plates 110, 160. The remaining components may be provided substantially the same as the MEMS device 100 described with reference to FIG.

5 to 6, the movable plates 110 and 160 and the fixed plates 121 'to 122' and 171 'to 172' may be used for z-axis acceleration sensing.

5, when the acceleration in the first direction (acceleration in FIG. 5) is applied, the distance between the movable plates 110 and 160 and the first fixed plates 121 'and 171' decreases, The capacitances C11 and C21 of the first capacitor increase and the capacitances C21 and C22 of the second capacitor decrease as the gap between the first and second fixed plates 122 and 122 increases. do. 6, when the acceleration in the second direction (acceleration in FIG. 6) is applied, the gap between the movable plates 110 and 160 and the first fixed plates 121 'and 171' increases The capacitances C11 and C21 of the first capacitor are decreased and the capacitances C21 and C22 of the second capacitor are decreased because the interval between the movable plates 110 and 160 and the second fixed plates 122 ' Is increased. When the acceleration is not applied, the movable plates 110 and 160 and the fixed plates 121 'to 122' and 171 'to 172' may be parallel to each other. Similarly, the movement of the movable plates 110 and 160 according to the direction of the acceleration can be variously modified depending on the position of the mass body.

7 is a schematic view of a MEMS package including a MEMS device according to an embodiment of the present invention.

Referring to FIG. 7, a MEMS package 1000 includes a PCB substrate 1100, a MEMS device 1200 stacked and bonded on a PCB substrate 1100, and an ASIC device 1300. The MEMS device 1200 may be formed substantially the same as the MEMS devices 100 and 100 'described with reference to FIG. 1 or FIG. Although FIG. 7 shows a wire bonding method, the present invention is not limited thereto, and a flip chip method may be used.

8 to 9 are views schematically showing a sensor hub including a MEMS device according to an embodiment of the present invention.

Referring to FIG. 8, the sensor hub 2000 may include a processing device 2100, a MEMS device 2200, and an application specific integrated circuit (ASIC) device 2300. The MEMS device 2200 may be formed substantially the same as the MEMS devices 100 and 100 'described with reference to FIG. 1 or FIG. The ASIC device 2300 can process the sensing signal of the MEMS device 2200. The processing device 2100, on behalf of the application processor, may serve as a coprocessor for professionally performing sensor data processing.

Referring to FIG. 9, the sensor hub 3000 may include a plurality of MEMS devices 3200 and 3400 and a plurality of ASIC devices 3300 and 3500. At least one of the plurality of MEMS devices 3200 and 3400 may be formed to be substantially the same as the MEMS devices 100 and 100 'described with reference to FIG. 1 or FIG. The first MEMS device 3200 may be an acceleration sensor and the second MEMS device 3400 may be a gyro sensor, but is not limited thereto. The plurality of ASIC devices 3300 and 3500 can process the sensing signals of the corresponding MEMS devices 3200 and 3400, respectively. The processing device 3100, on behalf of the application processor, may function as a coprocessor to professionally perform sensor data processing. As shown, three or more MEMS devices and ASIC devices may be provided in the sensor hub 3000.

10 is a view schematically showing a user terminal including a MEMS device according to an embodiment of the present invention.

10, the user terminal 200 includes a wireless communication unit 4100, an A / V input unit 4200, a user input unit 4300, a sensing unit 4400, an output unit 4500, a storage unit 4600, An interface unit 4700, a control unit 48000, and a power supply unit 4900.

The wireless communication unit 4100 can wirelessly communicate with an external device. The wireless communication unit 4100 may wirelessly communicate with an external device using various wireless communication methods such as mobile communication, WiBro, WiFi, Bluetooth, Zigbee, ultrasound, infrared, and RF . The wireless communication unit 4100 may transmit data and / or information received from an external device to the control unit 4800 and may transmit data and / or information transmitted from the control unit 4800 to the external device. For this purpose, the wireless communication unit 4100 may include a mobile communication module 4110 and a short-range communication module 4120.

Also, the wireless communication unit 4100 can acquire the location information of the user terminal 4000 including the location information module 4130. The location information of the user terminal 4000 may be provided from, for example, a GPS positioning system, a WiFi positioning system, a cellular positioning system, or beacon positioning systems, but is not limited thereto, Lt; / RTI > The wireless communication unit 4100 can transmit the position information received from the positioning system to the control unit 4800. [

The A / V input unit 4200 is for inputting video or audio signals, and may include a camera module 4210 and a microphone module 4220. The camera module 4210 may include an image sensor such as a CMOS (Complementary Metal Oxide Semiconductor) sensor, a CCD (Charge Coupled Device) sensor, or the like.

The user input unit 4300 receives various information from the user. The user input unit 4300 may include input means such as a key, a button, a switch, a touch pad, and a wheel. When the touch pad has a mutual layer structure with a display module 4510 described later, a touch screen can be configured.

The sensor unit 4400 detects the state of the user terminal 4000 or the state of the user. The sensing unit 4400 may include sensing means such as a touch sensor, a proximity sensor, a pressure sensor, a vibration sensor, a geomagnetic sensor, a gyro sensor, an acceleration sensor, and a biometric sensor. The sensing unit 240 may be used for user input.

The output unit 4500 notifies the user of various kinds of information. The output unit 4500 can output information in the form of text, image, or voice. To this end, the output unit 4500 may include a display module 4510 and a speaker module 4520. The display module 4510 may be provided in any form well known in the PDP, LCD, TFT LCD, OLED, flexible display, three-dimensional display, electronic ink display, or the art. The output unit 4500 may further comprise any type of output means well known in the art.

The storage unit 4600 stores various data and commands. The storage unit 4600 may store system software and various applications for operation of the user terminal 4000. The storage unit 4600 may include RAM, ROM, EPROM, EEPROM, flash memory, a hard disk, a removable disk, or any form of computer readable recording medium known in the art.

The interface unit 4700 serves as a channel with an external device connected to the user terminal 4000. The interface unit 4700 receives data and / or information from an external device, receives power and transmits the received data and / or information to the internal components of the user terminal 4000, Or supply internal power. The interface unit 4700 may include, for example, a wired / wireless headset port, a charging port, a wired / wireless data port, a memory card port, a universal serial bus An audio input / output port, a video input / output (I / O) port, and the like.

The control unit 4800 controls the overall operation of the user terminal 4000 by controlling other components. The control unit 4800 can execute the system software stored in the storage unit 4600 and various applications. The control unit 2800 may include an integrated circuit such as a microprocessor, a microcontroller, a digital signal processing core, a graphics processing core, an application processor, and the like.

The power supply unit 4900 includes a wireless communication unit 4100, an A / V input unit 4200, a user input unit 4300, a sensor unit 4400, an output unit 4500, a storage unit 4600, an interface unit 4700, And supplies power necessary for the operation of the control unit 4800. [ The power supply 4900 may include an internal battery.

The MEMS devices 100 and 100 'described with reference to FIGS. 1 and 4 or the sensor hub 2000 and 3000 described with reference to FIGS. 8 to 9 may be provided in the sensor portion 4400.

The methods described in connection with the embodiments of the present invention may be implemented with software modules executed by a processor. The software modules may reside in RAM, ROM, EPROM, EEPROM, flash memory, hard disk, removable disk, CD-ROM, or any form of computer readable recording medium known in the art .

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (10)

A plurality of movable plates disposed in a mirror; And
And a plurality of stationary plate groups arranged as a mirror on an upper portion or a lower portion of the plurality of movable plates,
Wherein the plurality of movable plates and the plurality of fixed plate groups are used for z-axis sensing. The method according to claim 1,
Wherein each of the movable plates comprises:
Opening,
A pedestal formed within the opening,
And a torsion bar extending from at least one side of the pedestal and connected to the movable plate. 3. The method of claim 2,
Wherein wiring for driving each of the movable plates is connected to the pedestal of each of the movable plates. The method according to claim 1,
Wherein each of the stationary plate groups comprises:
And a second fixed plate constituting a first fixed plate and a second capacitor constituting a first capacitor. 5. The method of claim 4,
Wherein a capacitance of the first capacitor and a capacitance of the second capacitor are oppositely increased or decreased. 5. The method of claim 4,
Wherein the plurality of first stationary plates of the plurality of stationary plate groups are connected to each other or the plurality of second stationary plates are connected to each other. The method according to claim 6,
Wherein wiring for driving the plurality of stationary plate groups is connected to at least one of the plurality of first stationary plates and the plurality of second stationary plates of the plurality of stationary plate groups. 8. The method of claim 7,
Wherein wiring for driving the plurality of stationary plate groups is connected only to one stationary plate group of the plurality of stationary plate groups. A MEMS package, comprising the MEMS device of any one of claims 1-8. 9. A user terminal comprising the MEMS device of any one of claims 1-8.
KR1020150148580A 2015-10-26 2015-10-26 Mems device, mems package and user terminal comprising the same KR20170047907A (en)

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