KR20170043359A - Atmospheric pressure plasma head having uniform distribution of gas and high input impedance - Google Patents

Atmospheric pressure plasma head having uniform distribution of gas and high input impedance Download PDF

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KR20170043359A
KR20170043359A KR1020150143023A KR20150143023A KR20170043359A KR 20170043359 A KR20170043359 A KR 20170043359A KR 1020150143023 A KR1020150143023 A KR 1020150143023A KR 20150143023 A KR20150143023 A KR 20150143023A KR 20170043359 A KR20170043359 A KR 20170043359A
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head
gas
block
electrode
gas distribution
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KR101761256B1 (en
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서영철
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주식회사 영신알에프
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32825—Working under atmospheric pressure or higher
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

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  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)

Abstract

The present invention relates to an atmospheric-pressure plasma head with uniform gas distribution and high input impedance, and more particularly to an atmospheric-pressure plasma head having a gas distribution flow path for gas injection and even distribution, The plasma processing apparatus according to any one of claims 1 to 3, further comprising: an atmospheric pressure plasma body part configured to accommodate a plasma operation tube made of an electrode dielectric tube, wherein a lower block is mounted on the lower end of the atmospheric plasma body part, So that a plasma is generated.

Description

[0001] The present invention relates to an atmospheric plasma head having uniform gas distribution and high input impedance,

The present invention relates to an atmospheric-pressure plasma head with uniform gas distribution and high input impedance, and more particularly to an atmospheric-pressure plasma head having a gas distribution flow path for gas injection and even distribution, The plasma processing apparatus according to any one of claims 1 to 3, further comprising: an atmospheric pressure plasma body part configured to accommodate a plasma operation tube made of an electrode dielectric tube, wherein a lower block is mounted on the lower end of the atmospheric plasma body part, So that a plasma is generated.

2. Description of the Related Art Generally, a plasma generating apparatus is used for depositing or patterning a structure implemented in a semiconductor or a liquid crystal display (LCD).

Plasma refers to the state of an ionized gas consisting of ions, electrons, radicals and the like, which are generated by high temperature, strong electric fields or RF electromagnetic fields.

In particular, plasma generation by glow discharge is caused by free electrons excited by direct current or high frequency electromagnetic fields. Excited free electrons collide with gas molecules to generate active species such as ions, radicals, and electrons do. Such active groups act on the surface of a material physically or chemically to change the characteristics of the surface. Such surface treatment by intentionally changing the surface property of a substance by an active group is referred to as surface treatment. Normally, surface treatment by plasma refers to cleaning or etching of a surface of a substance using a reactive substance in a plasma state.

This plasma processing method can also classify the atmospheric pressure within the chamber in which the plasma state is formed. If a discharge plasma is generated under a pressure near the atmospheric pressure (atmospheric pressure) The apparatus for generating a plasma under a pressure near atmospheric pressure to perform surface treatment is called an atmospheric plasma generating apparatus or an atmospheric plasma processing apparatus.

The above-mentioned atmospheric plasma generating apparatus is divided into a direct plasma generating apparatus and a remote plasma generating apparatus in accordance with the position of a plate to which a high frequency is applied. In the dual direct plasma generating apparatus, This is a method in which the plates are arranged in a direction perpendicular to the surface of the substrate requiring surface treatment, and is advantageously used in the industry because it has less damage to the metal wiring due to the gas in the plasma state.

1 is a perspective view of a conventional atmospheric plasma generating apparatus in which a high-frequency input cable 2 is connected to a high-frequency connecting terminal 2 'provided on a contour 4 forming an outer appearance of the apparatus, and a gas connecting terminal 3' And a gas such as argon (Ar) is injected into the gas inlet pipe 3 to generate a plasma, the gas inlet pipe 3 is connected to the gas inlet pipe 3, The gas flows into the lower part of the outer casing 4 through a head (not shown) built in the inner casing 4, and the gas flowing downward is installed inside the head to become a plasma state between the two plates to which the high- The surface treatment of the object is performed by applying the plasma to the object requiring surface treatment. The atmospheric pressure plasma treatment apparatus of Korean Patent Laid-open Publication No. 10-2005-54606 is known The.

In the atmospheric plasma generator, a high frequency is transmitted from a high frequency output device, and a matcher is connected between the high frequency output device and the atmospheric plasma generating device. The matching device reverses the high frequency output from the high frequency output device, The impedance matching between the high-frequency output device and the atmospheric-pressure plasma generating device is matched to reduce the possibility of damaging the high-frequency output device due to the reduced efficiency or the deteriorated reflected wave power. It is possible to supply a high frequency wave of the optimum quality to the load by eliminating the reverse feedback of the reflected wave power.

In the structure of the head of the conventional atmospheric plasma generator, an atmospheric-pressure plasma working tube in which an electrode made of a round bar is completely inserted into a circular quartz tube or an electrode dielectric tube in the form of a ceramic tube is inserted into the inside of the atmospheric plasma head body It is a method of putting and assembling.

However, a capacitor capacitance value C between these areas and the electrode dielectric tube and between the area of the inside of the atmospheric plasma body and the electrode dielectric tube is calculated based on the following equation, The contact area between the inside of the body enclosing the working tube and the working tube increases as the worker's length increases.

(Equation 1)

 C = ε. * K * S / d (ε = dielectric constant in vacuum, k = dielectric constant, S = contact area, d = contact distance)

Here, in order to increase the input impedance of the plasma head, the capacitance value (C) must be reduced.

This conventional atmospheric plasma has a problem that the longer the length of the atmospheric plasma head is, the more uniform distribution of the gas supplied to the head and the increase of the capacitance value of the internal input capacitors cause the lowering of the impedance, I had a problem.

Further, in the case of a high-frequency atmospheric pressure plasma generator, the impedance is remarkably low, so that a high temperature is extremely generated in the high frequency input cable connecting the output terminal of the matching device and the input terminal of the atmospheric plasma generator, A large amount of high frequency power has been lost.

This is because the large current flows into the atmospheric plasma generating apparatus, causing a problem. The larger the capacity is, the more serious it becomes and the plasma discharge becomes difficult. In order to solve such a problem, the input impedance of the atmospheric plasma head has been increased.

 SUMMARY OF THE INVENTION The present invention has been made in order to overcome the above-mentioned conventional problems in the atmospheric pressure plasma head, and improves the impedance of the atmospheric pressure plasma head itself which produces uniform distribution of the gas and plasma.

In addition, in the conventional method, a plurality of gas distribution pipes or the like installed at regular intervals, which are protruded from the upper end, are filled in the inside of the atmospheric plasma head for uniform distribution of the gas.

The present invention also provides a configuration of an atmospheric pressure plasma head device in which a matching device is installed on the upper end of the atmospheric plasma to integrate the same with the plasma head, and an impedance booster is installed to further increase the input impedance of the plasma head.

The present invention for solving the above problems resides in that the gas flow path inside the atmospheric pressure plasma head is solved by increasing the input impedance by arranging the dual distribution flow path and changing the structure of the plasma working tube. And the input impedance of the atmospheric plasma head.

Further, in the gas-even distribution of the atmospheric-pressure plasma head having a long length, a double-distributing gas flow passage is disposed inside the atmospheric-pressure plasma head without providing additional gas- Is an arrangement of an atmospheric pressure plasma head which allows the devices such as the matching device to be attached.

At this time, since the large-area high frequency atmospheric pressure plasma head has a very long length, the even distribution of the gas corresponding to the long length is the key. To this end, the gas is supplied at the center of the high-frequency atmospheric pressure plasma head, the gas is divided and distributed at a constant interval by the pressure difference of the gas flow using the primary and secondary gas hole rows, and then flows into narrow and long passages And the plasma is uniformly distributed in the longitudinal direction of the high frequency atmospheric pressure plasma head.

In addition, a configuration of an atmospheric pressure plasma head is provided in which all of the gas flow paths are laid in the high-frequency atmospheric pressure plasma head, and a space for installing an impedance booster, an impedance matching device, and an analysis sensor can be secured.

A method of reducing the capacitance of a plasma electrode having an electrode dielectric and an electrode as a whole, includes the steps of removing a part of the electrode in a longitudinal direction of the electrode dielectric, The capacitance value C is reduced by the principle that the value of the dielectric constant in the air, which is much smaller than the dielectric of the electrode dielectric tube, is filled in the electrode dielectric tube by a part of the spaced apart space, A method for solving the above problems, and a method for removing a part of the inner wall of the atmospheric plasma head body surrounding the electrode dielectric tube into which the electrode conductor is inserted, in a longitudinal direction to separate a contact distance between the electrode conductor and the inner wall of the atmospheric pressure plasma head body A method for reducing the capacitance value (C) to solve the problem, And a part of the surface area of the electrode conductor enclosed by the electrode dielectric is both removed in the longitudinal direction so that the contact distance between the electrode conductor and the inner wall of the atmospheric pressure plasma head body Thereby reducing the capacitance value (C).

The portion having the spacing distance is located at the upper end as opposed to the lower end portion where the plasma discharge is performed, thereby increasing the high frequency current density in the plasma discharge portion, thereby increasing the plasma density and facilitating the discharge.

The atmospheric pressure plasma generator of the present invention having the above-described structure suppresses the heat generation of the high frequency input cable connecting the output terminal of the matching device and the high frequency input terminal of the head to prevent burnout of the high frequency input cable, It is possible to stably operate the generator and to make the high-frequency input cable available as a material with good flexibility, so that the operating line of the atmospheric plasma generator can be enlarged.

In addition, the atmospheric pressure plasma generating apparatus of the present invention is characterized in that the gas is supplied to the working tube through the respective flow paths of the upper block, the first lower block, and the second lower block so that gas is directly transferred to the working tube, The plasma is uniformly flowed in the vertical direction, and the plasma can be stably produced through the flow of the uniform gas.

The atmospheric pressure plasma head according to the present invention is characterized in that in order to obtain a uniformly distributed plasma discharge in the atmospheric pressure plasma head having a long length, it is preferable to distribute the gas evenly in the longitudinal direction thereof, to increase the input impedance of the atmospheric pressure plasma head having a long length, It is possible to secure a space for installing an impedance booster or an impedance matcher on the upper portion of the atmospheric plasma head.

1 is a perspective view of a conventional atmospheric plasma head,
FIG. 2 is a perspective view of assembled state of the atmospheric pressure plasma head of the present invention,
3 is an exploded perspective view of the atmospheric pressure plasma head of the present invention,
4 is a perspective view and a sectional view of a head upper block of the atmospheric pressure plasma head of the present invention,
5 is a perspective view of a first lower block of the atmospheric pressure plasma head of the present invention,
6 is a perspective view of a second lower block of the atmospheric pressure plasma head of the present invention,
FIG. 7 is a cross-sectional view showing a gas flow state of the atmospheric pressure plasma head of the present invention,
8 is a sectional view of the atmospheric pressure plasma head of the present invention,
9 is a cross-sectional view of the atmospheric-pressure plasma head according to the present invention,
10 is a cross-sectional view of a state in which a portion of an inner wall of an upper head block into which an electrode dielectric tube of an atmospheric pressure plasma head of the present invention is inserted is removed,
11 is a cross-sectional view of a state in which a plurality of grooves are formed in a part of an inner wall of an upper block of a head into which an electrode dielectric tube of the atmospheric pressure plasma head of the present invention is inserted;
FIG. 12 is a cross-sectional view of a part of an inner wall of an upper block of a head into which an electrode dielectric tube of the atmospheric pressure plasma head of the present invention is inserted, and a plurality of grooves are formed in a part of the electrode.
13 is a perspective view and a partially enlarged perspective view of an embodiment of the dual head type atmospheric pressure plasma head of the present invention,
14 is a perspective view and a partially enlarged perspective view of another embodiment of the dual head type atmospheric pressure plasma head of the present invention,
15 is a perspective view and a partially enlarged perspective view of another embodiment of the dual head type atmospheric pressure plasma head of the present invention.

Hereinafter, the configuration and operation of the atmospheric plasma head of the present invention having a uniform gas distribution and a high input impedance will be described in detail with reference to the drawings.

It is to be noted, however, that the disclosed drawings are provided as examples for allowing a person skilled in the art to sufficiently convey the spirit of the present invention. Therefore, the present invention is not limited to the following drawings, but may be embodied in other forms.

In addition, unless otherwise defined, the terms used in the description of the present invention have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. In the following description and the accompanying drawings, A detailed description of known functions and configurations that may be unnecessarily blurred is omitted.

FIG. 3 is a perspective exploded view of the atmospheric pressure plasma head of the present invention, FIG. 4 is a perspective view and a cross-sectional view of a head upper block of the atmospheric pressure plasma head of the present invention, FIG. 6 is a perspective view of a second lower block of the atmospheric pressure plasma head of the present invention, and FIG. 7 is a cross-sectional view showing a gas flow state of the atmospheric pressure plasma head of the present invention.

2 and 3, the gas introduced through the gas inlet connected to the gas inlet plate 80 disposed at the upper center of the head upper block 10 flows into the inside of the head upper block 10 Passes through the upper block gas distribution port 102, the vertical flow paths 104a and 104b, the upper gas distribution flow paths 107a and 107b and the upper gas distribution hole columns 108a and 108b, The gas distributed evenly through the lower gas distribution flow paths 201 and 301 and the lower gas distribution hole rows 202 and 302 and the lower gas surface distribution paths 203 and 303 installed on the lower and upper gas distribution channels 20 and 30, Lt; / RTI >

On the other hand, the simple side block 70 and the electrode side block 71 block the gas pipe and the cooling medium flow path exposed on both end faces of the head upper block 10, Which is an electrode attached to one side end portion of the electrode 50 mounted on the inside of the head upper block 10 by securing a space in the head upper block 10, Move up to the top.

The overall size bar 60 as the electrode is coupled with the output of a boosting circuit (not shown) or the output of a matching circuit (not shown) to be attached to the upper end of the head upper block 10 to receive high frequency power, When the electrode at the lower end of the block 10 is transferred to the whole body 50, the gas supplied to the electrode dielectric tube 40 is changed into a plasma state to cause plasma to be applied to an object requiring surface treatment.

The cooling medium inlet 90a and the cooling medium outlet 90b serve to flow the cooling medium to the cooling medium flow paths 112a and 112b installed inside the head upper block 10.

The configuration and arrangement of the gas pipe installed in the head upper block 10 in the atmospheric pressure plasma head and the flow of the flowing gas will be described in more detail.

Referring to FIGS. 3, 4 and 7, the gas introduced from the outside through the gas inlet connected to the gas inlet plate 80 is supplied to the upper block Is supplied to the gas distribution port (102) and is filled therein.

The filled gas is distributed and flowed into two vertical flow paths 104a and 104b generated on both sides of the upper block gas distribution port 102. The two vertical flow paths 104a and 104b, Two upper gas distribution flow paths 107a and 107b laid up to the end of the upper block 10 are connected to the flow passages so that the distributed gases are supplied to the upper gas distribution flow paths 107a and 107b respectively .

Referring to the horizontal cross-sectional view AA of the upper block of Fig. 4, in order to distribute the distributed gas evenly in the upper gas distribution flow paths 107a, 107b, the gas pressures in the upper gas distribution flow paths 107a, The size and spacing of the holes of the upper gas distribution hole rows 108a and 108b formed at uniform intervals in the lower portion of the upper gas distribution flow paths 107a and 107b at regular intervals so as to be maintained at a predetermined value or more, By adjusting the length of the head upper block 10 according to the length of the head upper block 10.

When the pressure in the upper gas distribution flow paths 107a and 107b is maintained above a predetermined value in the above manner, the pressure causes the gas to flow out of all the holes under the upper gas distribution hole rows 108a and 108b.

5, 6 and 7, the head lower blocks 20 and 30 are divided into a first head lower block 20 and a second head lower block 30 according to a symmetrical shape, The head lower blocks 20 and 30 are formed by lower gas distribution flow paths 201 and 301 extending in the longitudinal direction of the body on the upper surface 205 and 305 of the lower block of the body, The lower gas distribution hole rows 202 and 302 horizontally penetrating in the longitudinal direction of the body are formed at closely spaced intervals on the side walls 206 and 306 of the body 100 and horizontally extended in the body length direction for supplying the gas to the plasma electrodes 40 and 50 The bottom surfaces 207 and 307 are formed.

The airtight squeeze ring 141 is inserted into the four grooves formed in the lower part of the head upper block 10 and the upper surface of the head lower blocks 20 and 30 is inserted into the head upper block 10, The spaces of the lower gas distribution flow paths 201 and 301 connected to the outlet and connected to the upper gas distribution hole rows 108a and 108b at the lower end of the head upper block 10 are formed.

The lower gas distribution flow path (201, 301) allows gas exhausted from the upper gas distribution hole rows (108a, 108b) arranged in wide spaced holes due to pressure regulation to diffuse between the holes and holes in the buffer space .

Further, lower gas distribution hole rows (202, 302) are formed uniformly in the lower gas distribution flow paths (201, 301) with narrower perforated small holes in the longitudinal direction, and the lower gas distribution hole rows (202, 302) Holes are formed in the upper and lower gas distribution flow paths 201 and 301 so as to interfere with the natural flow of the introduced gas from the lower gas distribution flow paths 201 and 301 to the outside, The secondary gas distribution is uniformly performed in all of the holes of the formed lower gas distribution hole rows 202 and 302, and then exit to the narrow and long gas surface distribution flow passages 203 and 303 in a planar manner.

The gas distribution flow paths 203 and 303 are formed by abutting the side surfaces of the head lower blocks 20 and 30 with the surfaces of the left and right upper gas surface distribution jaws 120a and 120b of the head upper block 10, As the gas passes through the gap, the gas diffused in the lower gas distribution hole rows 202 and 302 spreads more finely and evenly to the plasma electrodes 40 and 50.

In the series of gas flow paths as described above, the vertical flow paths 104a and 104b, the upper gas distribution flow paths 107a and 107b, the upper gas distribution hole rows 108a and 108b, Wherein the lower gas distribution hole rows and the lower gas distribution hole rows are formed symmetrically with respect to the center of the plasma electrodes. Respectively.

The upper part of the head upper block 10 is provided with a circular electrode plate 50 for receiving a high frequency power to form a plasma and an electrode dielectric 40 surrounding the electrode plate 50, Electrodes 40 and 50 are inserted.

3 and 7, the upper gas distribution flow paths 107a and 107b, the lower gas distribution hole rows 202 and 302, and the gas surface distribution flow paths 203 and 303 are formed in the upper side of the head upper block 10, The head lower blocks 20 and 30 are formed to be coupled to each other. In the structure, the space is not sealed to the outside but is exposed on both sides.

The gas flow path of the exposed end face is connected to the simple side block 70 and the simple side gas pads 701a and 701b and the electrode side gas pads 801a and 801b attached to the inner wall of the electrode side block 71 It is preferable that the simple side block 70 and the electrode side block 71 penetrating in a straight line with the electrode dielectric tube 40 are provided with circular holes (Not shown), and the simple side block 70 and the electrode side block 71 are brought into contact with the outer surface of the circular hole (not shown) on the surface to be attached to the head upper block 10, 712b and 712b to form an O-ring groove (not shown) for growing the outer diameter of the circular hole (not shown) with a predetermined depth, and the electrode dielectric tube 40 sandwiching the electrode O- (Not shown), the simple side block 70 and the electrode side block 71 are inserted into the head upper block 10, the electrode O-ring 712 is in close contact with the O-ring groove (not shown) and the left and right end faces of the head upper block 10a, and the gas supplied to the electrode dielectric tube 40 The gas discharged to the outside from the simple side block 70 and the electrode side block 71 is blocked.

The types and operating principles of the plasma electrodes 40 and 50 in the above-described atmospheric plasma head will be described in detail with reference to the drawings.

9 is a cross-sectional view of the atmospheric-pressure plasma head according to the present invention, in which a part of the electrode of the atmospheric-pressure plasma head is removed, and Fig. 10 is a cross- FIG. 11 is a cross-sectional view of a state in which a plurality of grooves are formed in a part of the inner wall of the head upper block into which the electrode dielectric tube of the atmospheric pressure plasma head of the present invention is inserted, FIG. 12 is a cross- A portion of the inner wall of the upper block of the head into which the electrode dielectric tube of the plasma head is inserted, and a plurality of grooves are formed in a part of the electrode.

A description will now be given of the principle of the technical solution of the plasma electrodes 40 and 50. When the plasma electrodes 40 and 50 are fitted to the head upper block 10, Capacitance (capacitor value) exists between the conductors 50, and the value increases as the length of the high-frequency atmospheric pressure plasma head for large-area processing becomes longer.

When the correction capacitance value is increased, the input impedance value of the atmospheric pressure plasma head becomes very small, so that a large amount of heat is generated in the connection conductor in the process of supplying the high frequency power to the plasma electrodes 40 and 50, So that the impedance of the plasma electrodes 40 and 50 itself can be increased effectively.

Fig. 8 is a cross-sectional view of the atmospheric pressure plasma head of the present invention, showing the configuration of an atmospheric pressure plasma head having a basic configuration.

That is, the electrode conductor 50 having the circular cross-section inserted into the electrode dielectric tube 40 is inserted into the lower portion of the head upper block 10 without a gap 521, so that the high frequency atmospheric pressure plasma head It is mainly used for processing small-sized objects having a short length.

9 is a plan view showing a state in which a top portion of a rod having a circular cross section is removed and in which a top surface of the electrode conductor 50 inserted into the electrode dielectric tube 40 is removed, It is possible to increase the impedance and to increase the high-frequency current density at the lower end of the electrode conductor 50 higher than the upper end by making the air gap 522 spaced at regular intervals between the upper ends.

10 shows a state in which a part of the upper end of the inner wall of the head upper block 10 into which the electrode dielectric tube 40 is inserted is removed and the upper end of the inner wall of the head upper block 10, A gap 523 is formed between the surfaces of the electrode conductor 50 inserted in the dielectric tube 40 at regular intervals to increase the impedance and to increase the high frequency current density at the lower end of the electrode conductor 50 to the upper .

11 shows a case where the electrode dielectric tube 40 is inserted into the upper part of the inner wall of the head upper block 10 in the form of a plurality of slots and a part of the upper end of the inner wall of the head upper block 10 The gap 524 is spaced apart from a slot at the upper end of the inner wall of which a plurality of slots are formed to increase the impedance and to increase the high frequency current density at the lower end of the electrode conductor 50 .

12 is a view illustrating a state in which a plurality of slots formed in an upper end portion of an inner wall of the head upper block 10 and an upper end portion of the electrode lead 50 into which the electrode dielectric tube 40 is inserted are alternately arranged, The impedance can be increased and the high frequency current density at the lower end of the electrode conductor 50 can be made higher than the upper end.

If a portion of the space between the upper end of the inner wall of the lower end of the head upper block 10 and the upper surface of the electrode conductor 50 is made a vacant space as described above, air is filled in the space instead of the dielectrics, It is possible to increase the input impedance of the atmospheric plasma head by decreasing the capacitance value and relatively increase the high frequency current density at the lower end of the electrode conductor 50 than at the upper end so that the plasma discharge is facilitated and the current flowing through the conductor It is possible to reduce the damage caused by the thermal loss.

Meanwhile, in order to prevent excessive heat from being generated during the plasma discharge, the high frequency atmospheric pressure plasma head has a structure in which the cooling hole lines 112a and 112b in the form of circular lines are connected to the head upper block 10).

2 and 3, when a cooling medium is injected into the cooling medium injection hole 110a through the cooling medium inlet 90a, the cooling medium flows along the cooling medium flow lines 113a and 113b, 110b to the cooling medium outlet 90b.

In order to maintain the cooling medium flow lines 113a and 113b, the cooling medium o-ring grooves 111a and 111b are formed at the edge of the end of the cooling hole lines 112a and 112b exposed on the left side surface of the head upper block 10, And the cooling medium o-rings 117a and 117b are inserted into the grooves and the simple side block 70 is joined, the left side surface leaks of the cooling medium are respectively sealed. A cooling connection o-ring groove 116 is formed at the edge of the cooling line connection path 114 formed on the right side of the head upper block 10 to insert the connection o-ring 115 into the groove and the electrode side block 71 , The two cooling hole lines 112a and 112b are connected to each other to secure the cooling medium flow lines 113a and 113b through which the cooling medium is circulated.

Hereinafter, a configuration of a dual head type atmospheric pressure plasma head using the above-described atmospheric pressure plasma head of the present invention will be described.

The dual head type atmospheric pressure plasma head of the present invention uses two of the atmospheric pressure plasma heads of the present invention as shown in FIG. 2, and an impedance matcher or a booster is installed at the upper end to integrate the dual atmospheric pressure plasma head. Three embodiments are described in detail.

13 is a perspective view and a partially enlarged perspective view of an embodiment of the dual head type atmospheric pressure plasma head of the present invention.

Referring to FIG. 13 and FIG. 3 described above, the upper surface areas 119a and 119b secured by affixing the two head upper blocks 10a and 10b and the upper and lower head areas 119a and 119b are formed on the sides of the first head lower block and the second head lower block, The fixing tabs 118 are formed so that the hexahedron housing for mounting the impedance matching device and the booster to be mounted can be fixed and an O-ring is inserted into the gas-tight O-ring groove 814 at the center of the upper end areas 119a and 119b A single gas manifold 81 sealed with a gas inlet 811 is laid on the gas manifold 81. The gas introduced from the gas inlet 811 is totally separated from the upper portion of the gas manifold 81 The lower space manifolds 812a and 812b in which the lower space is divided into two spaces by the lower cutoff manifold 813 formed at the lower portion thereof are filled with the gas formed at the center of the head upper blocks 10a and 10b The connection flow paths 104a1, Respectively, to flow into the dual atmospheric pressure plasma head.

The holes of the upper gas distribution flow paths 107a and 107b (shown in FIG. 3) exposed at the left and right end faces of the head upper blocks 10a and 10b are formed by the left side electrode side blocks 71a and 71b and the right side In order to shield the leakage of the gas supplied to the electrode dielectric tubes 40a and 40b with the airtight pads attached to the inside of the dual side block body 720 and to seal the outflow of the gas supplied to the electrode dielectric tubes 40a and 40b, (Not shown) in the left electrode side blocks 71a and 71b and the right dual side block 72 and the left electrode side blocks 71a and 71b and the right dual side block body 720 (Not shown) having an outer diameter of the circular hole (not shown) at a depth determined by the thickness of the electrode O-rings 712a and 712b in contact with the outer diameter of the circular hole (not shown) The electrode dielectric tubes 40a and 40b sandwiching the o-rings 712a and 712b are inserted into the circular holes (not shown) When the left electrode side blocks 71a and 71b and the right dual side block 72 are attached to the left and right end faces of the head upper blocks 10a and 10b, the electrode O-rings 712a and 712b are connected to the O- The gas supplied to the electrode dielectric tubes 40a and 40b while being in close contact with the left and right end faces of the head upper blocks 10a and 10b and the left electrode side blocks 71a and 71b and the right dual side block body (720). ≪ / RTI >

On the other hand, since the cooling hole lines 112a and 112b shown in FIG. 3 are formed in the upper parts of the head upper blocks 10a and 10b, the four cooling hole lines are arranged in a row, and the cooling medium inlets 90a1 ) Flows out to the cooling medium outlet 90b2 after the circulating flow.

In order to perform the circulating flow, the cooling line connecting passages 114a and 114b, in which the holes of the cooling hole lines 112a and 112b exposed on the left side surfaces of the head upper blocks 10a and 10b are connected to each other, 116b are formed at the edge of the cooling chamber 110 by inserting the connecting rods 115a, 115b into the cooling chamber 101a and then joined to the electrode side blocks 71a, 71b to prevent leakage of the cooling medium.

The whole size bars 60a and 60b serving as the electrodes are attached to the electrode mounting faces 711a and 711b of the electrode side blocks 71a and 71b to the electrode faces 50a and 50b, (119a, 119b) to be supplied with high-frequency power.

On the other hand, the cooling medium O ring grooves 111a1 and 111b2 formed at the edge of the holes of the cooling hole line 112a and the cooling hole line 112b respectively exposed on the right side surface of the head upper blocks 10a and 10b, After insertion of the O-rings 117a1 and 117b2, the dual side block body 720 is engaged to seal the exposed holes.

The cooling medium orifice grooves 111b1 and 111a2 formed at the edge of the cooling hole line 112b and the cooling hole line 112a respectively exposed on the right side surfaces of the head upper blocks 10a and 10b are provided with cooling medium Holes 170b1 and 117a2 to engage with the dual side block body 720 and connect the holes of the cooling block connection holes 724 and 725 formed in the dual side block body 720 to the cooling hole lines 112b and 112b, Creating a cooling block connection path 721 that coincides with the holes of the cooling hole line 112a and connects the holes of the cooling block connection holes 724 and 725 to each other and the cooling block connection o- And the cooling block connection O-ring 722 is inserted into the O-ring pressing plate 723 for pressing the cooling block connection O-ring 722. The O-ring pressing plate 723 is connected from the head upper block 10a to the head upper block 10b So that the flow path of the flowing cooling medium is secured.

Next, the configuration of another embodiment of the dual head type atmospheric pressure plasma head of the present invention will be described with reference to FIGS. 14 and 3. FIG.

14 is a perspective view and a partially enlarged perspective view of another embodiment of the dual head type atmospheric pressure plasma head of the present invention of Fig. 14.

As shown in FIG. 14, the upper end surfaces 119a and 119b secured by affixing the two upper head blocks 10a and 10b, and the housing fixing tabs 118 on the side surfaces of the first lower head block and the second lower head block, And the O-ring is inserted into the gas-tight O-ring groove 814 at the center of the upper end areas 119a and 119b to form the gas inlet 811 The gas introduced from the gas inlet 811 is filled and diffused in the upper part of the single gas manifold 81 as a whole, The lower space manifolds 812a and 812b in which the lower space is divided into two spaces by the lower cutoff manifold 813 formed at the lower portion are connected to the gas connection flow paths 104a1 and 104b2 formed at the center of the head upper blocks 10a and 10b, , 104b1 and the gas connection flow paths 104a2, 104b2 ) And flows into the inside of the dual atmospheric pressure plasma head, respectively.

The holes of the upper gas distribution flow paths 107a and 107b (shown in FIG. 3) exposed to the left and right end faces of the head upper blocks 10a and 10b are formed in the left dual side block body 720 and the right side In order to shield the outflow of the gas supplied to the electrode dielectric tubes 40a and 40b by blocking airtight pads (not shown) attached to the inside of the blocks 71a and 71b and aligning them with the electrode dielectric tubes 40a and 40b, (Not shown) in the left dual side block body 720 and the right side electrode side blocks 71a and 71b passing through the left dual side block body 720 and the right side electrode side blocks 71a and 71b, (Not shown) which has an outer diameter of the circular hole (not shown) at a depth determined by the thickness of the electrode o-rings 712a and 712b in contact with the outer diameter of the circular hole (not shown) , The electrode dielectric tubes (40a, 40b) sandwiching the electrode O-rings (712a, 712b) And the left dual side block body 720 and the right side electrode side blocks 71a and 71b are attached to the left and right end faces of the head upper blocks 10a and 10b so that the electrode o-rings 712a and 712b, The gas supplied to the electrode dielectric tubes 40a and 40b is adhered to the left and right end faces of the O-ring groove (not shown) and the left and right head top blocks 10a and 10b, Thereby blocking the gas flowing out from the side blocks 71a and 71b.

On the other hand, since the cooling hole lines 112a and 112b shown in FIG. 3 are formed in the upper portions of the head upper blocks 10a and 10b, the four cooling hole lines are arranged in a row, So that the cooling medium introduced into the medium inlet 90a1 flows out to the cooling medium outlet 90b2 after the circulating flow.

The cooling hole line 112a of the head upper block 10a and the cooling hole line 112b of the head upper block 10b are exposed to the left side of the hole, The cooling medium O rings 117a1 and 117b2 are inserted into the cooling medium O-ring grooves 111a1 and 111b2 respectively formed in the upper side block body 720 and the dual side block body 720 to seal the exposed holes, Cooling medium O-rings 117b1 and 117a2 are formed in the cooling medium O-ring grooves 111b1 and 111a2 respectively formed in the cooling hole line 112b of the head upper block 10a and the hole edge of the cooling hole line 112a of the head upper block 10b, And the holes of the cooling block connection holes 724 and 725 formed in the dual side block body 720 are inserted into the cooling hole lines 112b and 112b of the head upper block 10a, The cooling holes (10a) of the head upper block (10b) Creating a cooling block connection path 721 that coincides with the holes of the cooling block connection holes 724 and 725 and connects the holes of the cooling block connection holes 724 and 725 to each other, The cooling block connecting O-ring 722 is inserted and the cooling O-ring 722 is connected to the O-ring pressing plate 723 for pressing the O-ring 722 to cool the cooling medium flowing from the head upper block 10a to the head upper block 10b. So that the flow path of the fuel is secured.

In addition, cooling connection grooves 116a (116a) are formed at the edges of the cooling line connecting paths (114a, 114b) where the holes of the cooling hole lines (112a, 112b) exposed on the right side surface of the head upper blocks (10a, And the electrode side blocks 71a and 71b are attached thereto to prevent the leakage of the cooling medium so that the cooling medium inlets (not shown) attached to the head upper block 10a 90a1 flows out to the cooling medium outlet 90b2 attached to the head upper block 10b after the circulating flow in a row.

The whole size bars 60a and 60b serving as the electrodes are attached to the electrode plated bodies 50a and 50b in the conductor mounting spaces 711a and 711b of the electrode side blocks 71a and 71b, (119a, 119b) to supply high-frequency electric power.

Next, the configuration of another embodiment of the dual head type atmospheric pressure plasma head of the present invention will be described with reference to FIG. 15, FIG. 2, and FIG.

15 is a perspective view and a partially enlarged perspective view of another embodiment of the dual head type atmospheric pressure plasma head of the present invention.

2, two assembled single heads are turned in opposite directions to each other in the longitudinal direction, and the upper end areas 119a and 119b secured to the two upper head blocks 10a and 10b The housing fixing tabs 118 are formed on the side surfaces of the first head lower block and the second head lower block so that the hexahedron housing for mounting the impedance matcher and the booster to be mounted later can be fixed and the upper end surfaces 119a and 119b A dual gas manifold 82 having two gas inlet ports 821a and 821b is attached at the center and the gas supplied to the gas inlet port 821a is filled in the lower space manifold 822a, And the gas supplied to the gas inlet 821b is converted into a charge at the lower space manifold 822b and then flows into the central upper end of the head upper block 10b And flows into the vertical flow paths 104a2, Each is independently supplied with gas like a single head.

The holes of the upper gas distribution flow paths 107a and 107b (shown in FIG. 3) exposed at the left and right end faces of the head upper blocks 10a and 10b are formed by the left and right simple side blocks 70a and 70b, In order to shield the outflow of the gas supplied to the electrode dielectric tubes 40a and 40b with the airtight pads attached to the inside of the electrode side blocks 71a and 71b, (Not shown) on the left and right side side simple side blocks 70a and 70b and the electrode side blocks 71a and 71b and the left and right simple side blocks 70a and 70b and the electrode side block (Not shown) which has an outer diameter of the circular hole (not shown) at a depth determined by the thickness of the electrode o-rings 712a and 712b in contact with the outer diameter of the circular hole (not shown) And the electrode dielectric tubes 40a and 40b sandwiching the electrode O-rings 712a and 712b are inserted into the circular hole (not shown) The left and right simple side blocks 70a and 0b and the electrode side blocks 71a and 71b are attached to the left and right end faces of the head upper blocks 10a and 10b so that the electrode o-rings 712a and 712b, The gas supplied to the electrode dielectric tubes 40a and 40b is adhered to the left and right simple side blocks 70a and 70b of the head upper blocks 10a and 10b while the gas supplied to the electrode dielectric tubes 40a and 40b is in close contact with the left and right end surfaces of the O- Thereby blocking the gas flowing out from the electrode side blocks 71a and 71b.

On the left end face of the head upper block 10a, cooling medium o-rings 117a1 and 117b1 are formed in the cooling medium O-ring grooves 111a1 and 111b1 formed at the edges of the exposed holes of the cooling hole lines 112a and 112b shown in Fig. And 117b1 are inserted and joined together by a simple side block 70a and a cooling line connecting the cooling hole lines 112a and 112b shown in FIG. 3 to the right end surface of the head upper block 10a And the cooling air inlet port 115a is inserted into the cooling connection oval groove 116a formed at the edge of the head upper block 10a and joined to the electrode side block 71a to form a cooling medium inlet 90a1 to flow out to the cooling medium outlet 90b1 after circulating in a row. The whole area bar 60a which is the electrode is attached to the electrode conductor 50a in the conductor mounting space 711a of the electrode side block 71a coupled to the right end face, Frequency power is supplied from the high-frequency power supply.

The cooling medium o-rings 111a2 and 111b2 formed at the edges of the exposed holes of the cooling hole lines 112a and 112b shown in Fig. 3 on the right end surface of the head upper block 10b are provided with cooling medium o- And a cooling line connecting the cooling hole lines 112a and 112b shown in FIG. 3 to the left end surface of the head upper block 10b are connected to each other by a simple side block 70b, The cooling air is supplied to the cooling medium inlet port 115b attached to the right side of the head upper block 10b by inserting the connecting rod 115b into the cooling connection o-ring groove 116b formed at the edge of the head upper block 10b, 90a2 flows into the cooling medium outlet 90b2 after circulating in a row. The total area bar 60b as the electrode is attached to the electrode conductor 50b in the conductor mounting space 711b of the electrode side block 71b coupled to the left end face to form the upper end area 119b, Frequency power is supplied.

As described above, in order to process a large area object, an atmospheric pressure plasma head having a long length is required. In order to obtain a uniformly distributed plasma discharge in the atmospheric pressure plasma head having a long length, It is possible to increase the input impedance of the atmospheric-pressure plasma head having a longer length and to secure a space for installing an impedance booster or an impedance matcher on the upper surface of the atmospheric-pressure plasma head Effect.

Description of the Related Art [0002]
10; Head upper block
102; An upper block gas distribution port 104; Vertical flow path
107; An upper gas distribution flow path 108; Top gas distribution hole column
110a; Cooling medium inlet 110b; Cooling medium outlet
112; Cooling hole line
20; The first head lower block
201; A first lower gas distribution flow path 202; The first lower gas distribution hole column
203; A first gas surface distribution flow passage 205; The first lower block top surface
207; The first lower floor
30; The second head lower block
301; A second lower gas distribution flow path 302; The second lower gas distribution hole column
303; A second gas surface distribution flow passage 305; The upper surface of the second lower block
307; The second lower floor surface
40; Electrode dielectric tube
50; Electrode whole
60; Electrode size
70; Simple Side Block
71: electrode side block
72; Dual side block
720; Dual side block body 721; With cooling block connection
722: cooling block connection o-ring 723; Block O-ring press plate
80; Gas inlet plate
81; Single gas manifold
82; Dual gas manifold
90a; Cooling medium inlet
90b; Cooling medium outlet

Claims (18)

In an atmospheric pressure plasma head,
A head upper block 10 for introducing gas into the upper block gas distribution port 102 and circulating the cooling medium and applying the high frequency power;
A first head lower block 20 and a second head lower block 30 that flow the gas exhausted from the head upper block 10 to the right and left of the electrode dielectric tube 40 built in the head upper block 10, ;
An electrode conductor 50 inserted in the electrode dielectric tube 40 and supplied with high frequency power applied to the head upper block 10;
Wherein the plasma processing apparatus further comprises:
The method according to claim 1,
The upper block gas distribution port 102 for introducing an external gas into the upper center of the head upper block 10 is formed,
And two vertical flow passages 104a and 107b perpendicular to the bottom of the upper block gas distribution port 102 so as to coincide with the upper gas distribution flow paths 107a and 107b formed in the lower portion of the upper block gas distribution port 102, And 104b,
The gas introduced from the upper block gas distribution port 102 passes through the vertical flow paths 104a and 104b and flows into the upper gas distribution flow paths 107a and 107b formed in the body longitudinal direction of the head upper block 10, To the atmospheric pressure plasma head.
3. The method of claim 2,
Upper gas distribution hole rows (108a, 108b) vertically penetrating the bottom bottom of the upper gas distribution flow paths (107a, 107b) in the longitudinal direction are formed,
To maintain a constant gas pressure in the upper gas distribution flow path (107a, 107b) so that a primary distribution of the gas occurs in all of the holes in the upper gas distribution hole row (108a, 108b) .
3. The method of claim 2,
The airtight squeeze ring 141 is inserted into the four grooves made in the lower part of the head upper block 10,
Forming a space of the second gas distribution flow path (201, 301) in the first head lower block (20) and the second head lower block (30)
So that the gas exhausted from the upper gas distribution hole rows (108a, 108b) is diffused to the second gas distribution flow path (201, 301). 5. The method of claim 4,
Forming second gas distribution hole rows (202, 302) in the longitudinal direction on the side walls of the second gas distribution flow paths (201, 301)
The second gas distribution hole rows 202 and 302 interfere with the flow of the introduced gas to the outside from the second gas distribution flow paths 201 and 301,
To cause a secondary distribution of the gas in all of the holes of the second gas distribution hole array (202, 302) due to a pressure difference occurring inside and outside the second gas distribution flow path (201, 301).
6. The method of claim 5,
The gas surface distribution flow passages 203 and 303 having the narrow and long gap formed by the surfaces of the left and right upper gas surface distribution jaws 120a and 120b of the head upper block 10 and the side surfaces of the head lower blocks 20 and 30, Is formed,
The exhaust gas that is distributed and exhausted from the second gas distribution hole rows 202 and 302 is uniformly distributed while passing through the gas surface distribution flow paths 203 and 303 to form the plasma electrode 40 composed of the electrode dielectric tube 40 and the electrode conductor 50 40, 50). ≪ / RTI >
The method according to claim 6,
The upper gas distribution flow paths 107a and 107b and the upper gas distribution hole rows 108a and 108b and the first and second head lower blocks 20 and 20, Wherein the first gas distribution flow path (30), the second gas distribution flow path (201,301), the second gas distribution port row (108a, 108b) and the gas surface distribution flow path (203,303) Wherein the plasma is generated by the plasma.
The method according to claim 1,
The upper part of the electrode conductor 50 inserted in the electrode dielectric tube 40 inserted in the inner wall of the head upper block 10 is removed in the longitudinal direction,
A gap is formed between the inside of the electrode dielectric tube 40 and the upper end of the electrode conductor 50 at regular intervals,
Wherein an impedance between the inner wall of the head upper block (10) and the electrode conductor (50) is increased and a high frequency current density at the lower end of the electrode conductor (50) is higher than the upper end.
The method according to claim 1,
A part of the upper end of the inner wall of the head upper block 10 is removed in the longitudinal direction,
A gap is formed between the outer wall of the electrode dielectric tube 40 in which the electrode conductor 50 is inserted and the upper end of the inner wall of the head upper block 10 at regular intervals, And the electrode current collector (50), and the high frequency current density at the lower end of the electrode conductor (50) can be higher than the upper end.
The method according to claim 1,
A plurality of slots are formed in the longitudinal direction at a part of an upper end of an inner wall of the head upper block 10 into which the electrode dielectric tube 40 is inserted,
A gap is formed between the outer wall of the electrode dielectric tube 40 and the upper end of the inner wall of the head upper block 10 in which the electrode conductor 50 is inserted and is spaced apart from each other by a predetermined distance to shake the electrode dielectric tube 40, And the high frequency current density can be made higher than the upper end at the lower end of the electrode conductor pattern (50) by increasing the impedance between the inner wall of the head upper block (10) and the electrode pattern body (50) head.
The method according to claim 1,
A part of the upper end of the inner wall of the head upper block 10 and the upper end of the electrode cap 50 into which the electrode dielectric tube 40 is inserted are formed in a plurality of slots in the longitudinal direction,
A gap is formed between the outer wall of the electrode dielectric tube 40 and the upper end of the inner wall of the head upper block 10 in which the electrode conductor 50 is inserted and is spaced apart from each other by a predetermined distance to shake the electrode dielectric tube 40, And the high frequency current density can be made higher than the upper end at the lower end of the electrode conductor pattern (50) by increasing the impedance between the inner wall of the head upper block (10) and the electrode pattern body (50) head.
The method according to claim 1,
The two cooling medium injection ports 112a and 112b penetrating to the outside on the left side surface of the head upper block 10 are blocked with the simple side block 70 and the right side surface of the head upper block 10 is exposed to the outside The cooling medium connecting passage 113 is closed by the electrode side block 71,
Wherein the cooling medium is injected into the cooling medium inlet port (110a), flows along the cooling medium copper lines (113a, 113b), and is discharged to the cooling medium outlet (110b).
13. The method according to claim 12, wherein the cooling hole lines (112a, 112b) are formed as protrusions with a predetermined interval and height along the inner diameter of the circular bore to increase the contact area between the cooling medium and the cooling hole lines (112a, 112b) And the efficiency of the atmospheric pressure plasma head is increased.
The method according to claim 1,
A gas manifold 81 having one gas inlet 811 is attached to the center of the top areas 119a and 119b obtained by attaching the two head upper blocks 10a and 10b and an electrode side block 71a And the right and left upper end surfaces 119a and 119b are provided with cooling medium inlets 90a1 and cooling medium inlet ports 90a1 and 90b2, respectively, And an outlet (90b2) is attached.
The method according to claim 1,
A gas manifold 81 having one gas inlet port 811 is attached to the center of the upper end surface areas 119a and 119b secured with the two head upper blocks 10a and 10b and a dual side block 72 And the right and left top surfaces 119a and 119b are provided with cooling medium inlets 90a1 and 90a1 and cooling medium outlets 90a1 and 90b2, respectively, (90b2) is attached to the at least one of the first and second electrodes. The method according to claim 1,
A dual gas manifold 82 having two gas inflow ports 821a and 821b is attached to the center of the top areas 119a and 119b obtained by attaching the two head upper blocks 10a and 10b and the one side head upper block 10a A cooling medium inlet 90a1 and a cooling medium outlet 90b1 are formed in the upper left side areas 119a and 119b and an electrode side block 71a and an electrode inlet block 70b are formed in the right side end face, And the other side head upper block 10b is provided with an electrode side block 71b and an electrode side mass whole bar 60b on the left end face and a simple side block 70b on the right end face, And a cooling medium inlet (90a2) and a cooling medium outlet (90b2) are attached to the right upper end areas (119a, 119b), respectively.
The method according to claim 1,
On the side of the upper end 130 of the plasma head and the first head lower block 20 and the second head lower block 30,
And a housing fixing tab (118) for fixing the hexahedron housing for mounting the impedance matcher and the booster.
The method according to any one of claims 14, 15 and 16,
An upper surface area 119a and a lower surface area 119b of the plasma head having the two head upper blocks 10a and 10b attached thereto and a first head lower block and a second head lower block attached to the plasma heads,
And a housing fixing tab (118) for fixing the hexahedron housing for mounting the impedance matcher and the booster.
KR1020150143023A 2015-10-13 2015-10-13 Atmospheric pressure plasma head having uniform distribution of gas and high input impedance KR101761256B1 (en)

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