KR20170039871A - New busbar make Method for PDLCD film using FPCB - Google Patents

New busbar make Method for PDLCD film using FPCB Download PDF

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Publication number
KR20170039871A
KR20170039871A KR1020150138973A KR20150138973A KR20170039871A KR 20170039871 A KR20170039871 A KR 20170039871A KR 1020150138973 A KR1020150138973 A KR 1020150138973A KR 20150138973 A KR20150138973 A KR 20150138973A KR 20170039871 A KR20170039871 A KR 20170039871A
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KR
South Korea
Prior art keywords
film
contact surface
flexible circuit
pdlcd
circuit member
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Application number
KR1020150138973A
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Korean (ko)
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KR101880535B1 (en
Inventor
전영재
박상현
윤희영
Original Assignee
주식회사 리비콘
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Priority to KR1020150138973A priority Critical patent/KR101880535B1/en
Publication of KR20170039871A publication Critical patent/KR20170039871A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/14—Rails or bus-bars constructed so that the counterparts can be connected thereto at any point along their length
    • H01R25/145—Details, e.g. end pieces or joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Disclosed are a flexible printed circuit board and a method to form a bus bar of a PDLCD film by using the same. The present invention forms a flexible printed circuit board (FPCB) comprising a single connection circuit while having the same signal flowing in a plurality of contact surfaces during electric conduction, and meanwhile, the flexible printed circuit board is applied to a bus bar of a PDLCD film. As such, the present invention is capable of improving electric conductivity on the bus bar of the PDLCD film and enhancing bonding force between the PDLCD film and the bus bar as well as improving durability against an external shock by having a differentiated structure from an existing method, and also, easing connection with an external power supply while improving the product satisfaction of the PDLCD film.

Description

TECHNICAL FIELD [0001] The present invention relates to a flexible circuit member and a method of forming a bus bar of the PDLCD film using the flexible circuit member.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique of forming a bus bar portion for applying external power to a polymer dispersed liquid crystal display (PDLCD) film, and more particularly, (FPCB) in which the same signal flows at a plurality of contact surfaces at the time of electric conduction, and the flexible circuit member is applied to the bus bar portion of the PDLCD film to improve the electrical conductivity and durability of the PDLCD film. And a method of forming a bus bar of a PDLCD film using the flexible circuit member.

Generally, a polymer dispersed liquid crystal (PDLCD) is a polymer dispersed liquid crystal (PDLCD) in which a liquid crystal is dispersed in a polymer system, as disclosed in Korean Patent Registration No. 10-0269203 Which is transparent without being scattered.

In order for the incident light to appear transparent without being scattered, an external power supply 110V capable of driving the liquid crystal is required. Therefore, the portion where the external power source is applied to the PDLCD film must exist in the PDLCD film and is referred to as a bus bar.

The portion of the bus bar should be made of a material having a high electrical conductivity and adhesion to the PDLCD film. In a conventionally known method, a method of soldering a wire to a Cu-mesh and a copper foil is mainly used. However, in this method, it is difficult to use due to the problem of adhesion between the bus bar portion and the PDLCD film, low electric conductivity, low durability The above problems caused various quality problems when applying the actual products.

Accordingly, various attempts have been made to improve the adhesion and durability between the PDLCD film and the bus bar material. However, in the conventional PDLCD film, even if the bonding film is applied due to the thickness deviation at the soldering portion of the wire connecting portion, And the adhesive coated copper foil is adhered to the half-cutting portion of the PDLCD film. However, this method has a disadvantage in that the adhesive strength is lowered and the electrical conductivity is significantly lowered. Still, Electrical conductivity problems have been raised, and customers are constantly being asked to improve their PDLCD film construction.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a flexible printed circuit board (FPCB) having a single connection circuit, By applying the member to the portion of the bus bar of the PDLCD film, it is possible to improve the electrical conductivity of the PDLCD film to the bus bar portion and to improve the adhesion between the PDLCD film and the bus bar material, It is an object of the present invention to provide a flexible circuit member capable of improving durability from an external impact during construction and facilitating connection to an external power source, and a method of forming a bus bar of a PDLCD film using the flexible circuit member.

The flexible circuit member of the present invention for achieving the above object constitutes the first and second members of the flexible circuit which are constituted by one connection circuit and allow the same signal to flow in a plurality of contact surfaces at the time of electric conduction, A first conductor layer formed of a copper foil is formed on a second contact surface opposite to the first contact surface, and the second member is formed on the first contact surface A third non-conductor layer formed by coating a hard non-conductor on the second non-conductor layer and a second non-conductor layer coated on the second contact surface opposite to the first contact surface is formed, And a connector portion is formed so as to be connected.

In addition, the first and second members have a T-shaped structure.

In the connector portion, both of the first and second contact surfaces are formed of a copper foil.

According to another aspect of the present invention, there is provided a method of forming a bus bar of a PDLCD film, which is implemented by the flexible circuit member, comprising the steps of: removing one side of the two side liner of the bonding film; A first step of bonding; A second step of adhering a flexible circuit member to the other side of the bonding film to supply a power supply to the half-cutting portion of the PDLCD film; And applying the bonding film, the PDLCD film, and the flexible circuit member bonded from the first and second steps to the flexible circuit member at a predetermined temperature and a constant pressure, A third step of connecting an external power source to the flexible circuit member; .

Further, the bonding film is an ACF film in which a conductive ball composed of lead is mixed with a tape having an adhesive component.

In addition, the conductive balls constituting the ACF film are constructed so as to exhibit the adhesive force and the conductivity between the bonding film, the PDLCD film and the flexible circuit member, while being fractured at a constant temperature and constant pressure applied in the third step.

As described above, the present invention provides a flexible printed circuit board (FPCB) having a single connection circuit and flowing the same signal on a plurality of contact surfaces at the time of electric conduction, This improves the electrical conductivity of the PDLCD film to the bus bar area and improves the adhesion between the PDLCD film and the bus bar material. It also has a differentiated structure from the conventional one, The present invention can be expected to have an effect of improving the product satisfaction with the PDLC film while allowing easy connection with an external power source.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a structural view of a flexible circuit member viewed from the direction of a first contact surface according to an embodiment of the present invention; FIG.
2 is a structural view of a flexible circuit member viewed from the direction of a second contact surface according to an embodiment of the present invention.
3 is a view showing a state in which a flexible circuit member is applied to a bus bar in a PDLCD film according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a structural view of a flexible circuit member viewed from a first contact surface direction according to an embodiment of the present invention, and FIG. 2 is a structural view of a flexible circuit member viewed from a second contact surface direction according to an embodiment of the present invention.

1 and 2, a flexible circuit member A according to an embodiment of the present invention includes a T-shaped connection circuit and a single connection circuit, And the first and second members 10 and 20 of the circuit.

The first member 10 includes a first conductive layer 12 formed by coating a first contact surface with a hard non-conductive material and a second conductive layer 12 formed of a copper foil on a second contact surface opposite to the first contact surface. .

The second member (20) has a second nonconductor layer (21) formed by coating a first contact surface with a rigid nonconductor, and a third nonconductor layer formed by coating a second contact surface opposite to the first contact surface with a non- (22).

At this time, a connector portion 23 formed of a copper foil for connecting an external electric wire is formed at an end of the second member 20, and a first contact surface of the connector portion 23 and a second contact surface And the copper foil is formed on all of the contact surfaces.

That is, the flexible circuit member A according to the embodiment of the present invention is used as a bus in a PDLCD film, and the flexible circuit member A has a flexible circuit or multiple connection circuits such as a conventional flexible circuit 1, 1 and 2, respectively.

Therefore, the flexible circuit member A according to the embodiment of the present invention can flow the same signal even if it comes into contact with any contact surface during electrical conduction, and can also transmit the same signal to the first contact surface of the first member 10 The conductor layer 12 can flow electricity.

The flexible circuit member A is coated with a rigid non-conductive material on the first contact surface of the first member 10 and the first and second contact surfaces of the second member 20 to form the second and third conductive layers 21 ) 22 is formed in order to protect the contact of a possible person against electric shock.

Even if a conductor layer is formed by a copper foil on the second contact surface of the first member 10 and the first and second contact surfaces of the connector portion 23, To prevent electric shock accidents.

At this time, since the flexible circuit member A has a generally T-shaped structure and has a flat shape, it is possible to have a merit that a uniform pressing force and heat can be transmitted to all the surfaces at the time of pressing, The conventional bus bar method can prevent the occurrence of defective junctions due to the thickness variation of the soldered portions to which the wires are soldered, and it is expected that the defective rate at the time of glass bonding can be drastically reduced.

In addition, since the T-shaped flexible circuit member A can have strong durability such that the external power connection portion of the connector portion 23 is not easily broken or cut off due to the soft material property, It is possible to expect the effect of eliminating the risk that the wire is directly connected to the wire and the wire can be easily broken.

The method of forming a bus bar of a PDLCD film using the flexible circuit member (A) of FIG. 1 and FIG. 2 as described above may be applied to a double-sided liner of the bonding film 100 And one side of the bonding film 100 is adhered to the half-cutting portion (Silver Paste applying side) of the PDLCD film 200.

Here, the bonding film 100 uses an ACF film in which conductive balls composed of lead are mixed with a tape having an adhesive component.

Next, a flexible circuit member A shown in FIGS. 1 and 2 is attached to the other surface of the bonding film 100, which is a bus bar for supplying external power to the half-cutting portion of the PDLCD film 200, The first member 10 is adhered.

That is, the first conductor layer 12 formed on the second contact surface of the first member 10 is bonded to the other surface of the bonding film 100.

Next, the bonding film 100 and the PDLCD film 200 and the flexible circuit member A are heated to a predetermined temperature and constant pressure while applying the bonding film 100, the PDLCD film 200, (A). ≪ / RTI >

That is, when the bonding film 100, the PDLCD film 200, and the flexible circuit member A are applied with a constant temperature and a constant pressure, the conductive balls constituting the ACF film constituting the bonding film 100 The adhesive film 100 and the PDLCD film 200 and the flexible circuit member A can exhibit the adhesive force and the conductivity.

Therefore, the adhesive force between the flexible circuit member A and the ACF film as the bonding film 100 is greatly increased, and thus all the bonding surfaces of the PDLCD film 200 and the flexible circuit member A are bonded to the ACF film It is possible to maintain a firm adhesion state.

Next, when the external power source 300 is connected to the connector portion 23 formed at the end portion of the second member 20 constituting the flexible circuit member A and having the first and second contact surfaces as the copper foil, The power supplied from the external power supply 300 is supplied to the PDLCD film 200 through the connector portion 23 via the first conductor layer 12 formed on the second contact surface of the first member 10, so that it can be supplied to the cutting part.

While the present invention has been described with reference to the accompanying drawings, it is to be understood that the invention is not to be limited to the details of the foregoing description, no.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is to be understood that such changes and modifications are within the scope of the claims.

10; A first member 11; The first non-
12; A first conductor layer 20; The second member
21; A second non-conductive layer 22; Third conductive layer
23; A connector portion 100; Bonding film
200; PDLCD film 300; External Power
A; Flexible circuit member

Claims (9)

The first and second members of the flexible circuit are configured so as to allow the same signal to flow in a plurality of contact surfaces at the time of electric conduction,
Wherein the first member has a first conductive layer coated with a stiff non-conductive material on a first contact surface and a first conductive layer made of a copper foil on a second contact surface opposite to the first contact surface,
The second member includes a third non-conductive layer formed by coating a first non-conductive layer on the first contact surface, and a second non-conductive layer coated on the second contact surface opposite to the first contact surface,
Wherein a connector portion is formed at an end portion of the second member so as to connect external electric wires. The flexible circuit member according to claim 1, wherein the first and second members have a T-shaped structure. The flexible circuit member according to claim 1, wherein both of the first and second contact surfaces of the connector portion are formed of a copper foil. A first step of bonding the one side of the bonded film to a half-cutting portion (silver paste applied side) of the PDLCD film after removing the both-side liner of the bonded film;
A second step of adhering a flexible circuit member to the other side of the bonding film to supply a power supply to the half-cutting portion of the PDLCD film; And
After the adhesive film and the PDLCD film adhered from the first and second steps are applied to the flexible circuit member at a constant temperature and constant pressure, the adhesive force and conductivity between the adhesive film, the PDLCD film, and the flexible circuit member are developed, A third step of connecting an external power source to the flexible circuit member; ≪ / RTI > wherein the method further comprises: The bus bar forming method of claim 4, wherein the bonding film is an ACF film in which a conductive ball composed of lead is mixed with a tape having an adhesive component. 6. The method of claim 5, wherein the conductive balls constituting the ACF film are fractured at a constant temperature and a constant pressure applied in the third step, so that the adhesive force and the conductivity between the bonding film and the PDLCD film and the flexible circuit member are expressed ≪ RTI ID = 0.0 > 8. ≪ / RTI > The flexible printed circuit board according to claim 4,
The first and second members of the flexible circuit are configured so as to allow the same signal to flow in a plurality of contact surfaces at the time of electric conduction,
Wherein the first member has a first conductive layer coated with a stiff non-conductive material on a first contact surface and a first conductive layer made of a copper foil on a second contact surface opposite to the first contact surface,
The second member includes a third non-conductor layer formed by coating a first non-conductor on the first contact surface and a second non-conductor layer coated on the second contact surface opposite to the first contact surface, And a connector portion for connecting an external electric wire to the end portion of the two-piece member. 8. The method of claim 7, wherein the first and second members have a T-shaped structure. 8. The method of claim 7, wherein the connector portion comprises a copper foil on both the first and second contact surfaces.
KR1020150138973A 2015-10-02 2015-10-02 New busbar make Method for PDLCD film using FPCB KR101880535B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150138973A KR101880535B1 (en) 2015-10-02 2015-10-02 New busbar make Method for PDLCD film using FPCB

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KR101880535B1 KR101880535B1 (en) 2018-07-20

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11352508A (en) * 1998-06-08 1999-12-24 Hitachi Ltd Liquid crystal display device
JP3250216B2 (en) * 1998-08-13 2002-01-28 ソニーケミカル株式会社 Flexible printed wiring board and method of manufacturing the same
KR20080040828A (en) * 2006-11-06 2008-05-09 아이디 리써치 피티와이 리미티드 Method for making electrode terminal in polymer dispersed liquid crystal display
JP3195110U (en) * 2014-10-16 2014-12-25 住友電気工業株式会社 Wiring member

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049423A (en) * 1998-07-30 2000-02-18 Sony Chem Corp Flexible substrate
KR101483634B1 (en) * 2014-05-13 2015-01-16 일신전자 주식회사 Manufacturing method for branching type circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11352508A (en) * 1998-06-08 1999-12-24 Hitachi Ltd Liquid crystal display device
JP3250216B2 (en) * 1998-08-13 2002-01-28 ソニーケミカル株式会社 Flexible printed wiring board and method of manufacturing the same
KR20080040828A (en) * 2006-11-06 2008-05-09 아이디 리써치 피티와이 리미티드 Method for making electrode terminal in polymer dispersed liquid crystal display
JP3195110U (en) * 2014-10-16 2014-12-25 住友電気工業株式会社 Wiring member

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