KR20170035582A - Sensor package - Google Patents
Sensor package Download PDFInfo
- Publication number
- KR20170035582A KR20170035582A KR1020150134611A KR20150134611A KR20170035582A KR 20170035582 A KR20170035582 A KR 20170035582A KR 1020150134611 A KR1020150134611 A KR 1020150134611A KR 20150134611 A KR20150134611 A KR 20150134611A KR 20170035582 A KR20170035582 A KR 20170035582A
- Authority
- KR
- South Korea
- Prior art keywords
- glass cover
- sensor chip
- resin material
- bezel
- sensor
- Prior art date
Links
- 239000011521 glass Substances 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 57
- 229920005989 resin Polymers 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/26—Windows; Cover glasses; Sealings therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
-
- G06K9/00006—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Image Input (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
A sensor package of the present invention includes a base substrate, a sensor chip located on an upper surface of the base substrate, a glass cover located on an upper surface of the sensor chip, a bezel portion surrounding the glass cover, And a resin material formed around the chip, the resin material being bonded to the lower surface of the sensor chip and the glass cover.
Description
The present invention relates to a sensor package, and more particularly, to a package structure including a sensor chip and an upper surface of the sensor chip is covered with a cover.
Electronic devices such as smart phones, tablet computers, laptop computers and the like are equipped with various sensor devices. Such a sensor device is an electric device that mainly receives signals from outside and measures them. Therefore, at least a part of the signal is exposed to the outside of the electronic device to receive a signal from the outside.
The sensor package constituting the sensor device includes a sensor chip, which is often covered by another structure. Such a cover portion is required to be formed in a material and a shape which are capable of smoothly conveying a signal to be received by the sensor chip, but are also excellent in aesthetics. This is because the cover portion is exposed to the outside of the electronic device.
Conventionally, among the sensor devices, for example, in the case of the fingerprint recognition sensor, the sensor chip is sometimes molded with a resin material such as epoxy. However, such a resin material has a disadvantage in that the relative dielectric constant is not sufficiently high, and signal transmission may not be smooth. In order to overcome this, the resin material must be made thin and the process for this is very difficult. In addition, the resin material has a disadvantage in that it can not be aesthetically pleasing or tactile, and can damage the overall feel of the electronic product.
Accordingly, there is an increasing demand for a sensor package having a cover with excellent aesthetics while being able to smoothly transmit a signal or the like received by the sensor chip.
A problem to be solved by the present invention is to provide a sensor package which is improved in bonding between a glass cover and a bezel portion which are exposed to the outside, and which is excellent in aesthetics and feel.
Another problem to be solved by the present invention is to provide a sensor package in which a glass cover is stably fixed so that signals can be smoothly transmitted to a sensor chip while durability is excellent.
According to an aspect of the present invention, there is provided a sensor package including a base substrate, a sensor chip positioned on an upper surface of the base substrate, a glass cover positioned on an upper surface of the sensor chip, a bezel portion surrounding the glass cover, And a resin material formed around the sensor chip and coupled with the sensor chip and the lower surface of the glass cover.
In an embodiment of the present invention, the upper surface of the glass cover and the upper end of the bezel may be located on the same plane.
In an embodiment of the present invention, a resin material is filled between the glass cover and the bezel to couple the glass cover and the bezel, but the resin material may not protrude above the glass cover.
According to an embodiment of the present invention, the side surface of the glass cover and the bezel may be closely contacted to each other, and the resin material may be prevented from flowing between the side surface of the glass cover and the bezel.
In one embodiment of the present invention, the resin material is formed so as to cover the lower surface of the glass cover, and may be engaged with the inner peripheral surface of the bezel.
In one embodiment of the present invention, the resin material may be formed to expose the sensor chip without covering the lower surface of the sensor chip.
In one embodiment of the present invention, the resin material may be positioned between the upper surface of the sensor chip and the lower surface of the glass cover.
In an embodiment of the present invention, the sensor chip may be electrically connected to the base substrate through a solder ball coupled to a bottom surface.
In an embodiment of the present invention, the bezel portion may include a support jaw structure configured to support a rim portion of the glass cover.
The sensor package according to an embodiment of the present invention is advantageous in that the bezel portion and the glass cover, which are exposed to the outside, are closely contacted and the upper surface of the outer portion is flat, so that the sensor package is excellent in feel and feel.
In addition, the sensor package according to an embodiment of the present invention has an advantage that the glass cover is stably fixed by the resin material, and thus the durability is excellent.
In addition, the sensor package according to an embodiment of the present invention has an advantage that signals can be smoothly transmitted to the sensor chip through the glass cover.
1 is a cross-sectional view of a sensor package according to an embodiment of the present invention.
FIG. 2 is an enlarged view of a portion of the bezel of FIG. 1. FIG.
3 shows a cross-sectional view of a sensor package according to another embodiment of the present invention.
FIG. 4 is an enlarged view of a portion of the bezel of FIG. 3;
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that adding a detailed description of a technique or a configuration already known in the field can make the gist of the present invention unclear, some of it will be omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express the embodiments of the present invention, which may vary depending on the person or custom in the relevant field. Therefore, the definitions of these terms should be based on the contents throughout this specification.
Hereinafter, a sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 attached hereto.
Hereinafter, a sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 attached hereto.
Referring to FIG. 1, the sensor package of the present invention includes a
The
The
The space between the lower surface of the
The
When the
The
Since the
The
The
The
The
The
When the upper surface of the
The
2, the upper end of the
The
The
Hereinafter, a sensor package according to another embodiment of the present invention will be described with reference to FIGS. 3 to 4. For convenience of explanation, the sensor package key according to the present embodiment includes a sensor package We will focus on the differences from the package.
The
The sensor package described with reference to Figs. 1 to 4 has an advantage that the
The embodiments of the sensor package of the present invention have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.
100: base substrate 110: terminal on the upper surface
200: sensor chip 250: solder ball
300: Glass cover 400: Resin
500: Bezel part 510: Support chin
Claims (9)
A sensor chip positioned on an upper surface of the base substrate;
A glass cover positioned on an upper surface of the sensor chip;
A bezel portion surrounding the glass cover; And
And a resin material formed around the sensor chip, the resin material being bonded to the lower surface of the sensor chip and the glass cover.
Wherein an upper surface of the glass cover and an upper surface of the bezel are located on the same plane.
A resin material is filled between the glass cover and the bezel to join the glass cover and the bezel,
Wherein the resin material is formed so as not to protrude above the glass cover.
Wherein a side surface of the glass cover and the bezel portion are closely contacted and abutted to each other,
Wherein the resin material is formed so as not to flow between the side surface of the glass cover and the bezel.
Wherein the resin material is formed so as to cover the lower surface of the glass cover and is also engaged with the inner peripheral surface of the bezel.
Wherein the resin material does not cover the lower surface of the sensor chip, and the sensor chip is exposed.
Wherein the resin material is located between the upper surface of the sensor chip and the lower surface of the glass cover.
Wherein the sensor chip is electrically connected to the base substrate through a solder ball coupled to a bottom surface thereof.
And the bezel portion includes a supporting jaw structure configured to support a rim portion of the glass cover.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150134611A KR20170035582A (en) | 2015-09-23 | 2015-09-23 | Sensor package |
PCT/KR2016/009578 WO2017052089A1 (en) | 2015-09-23 | 2016-08-29 | Sensor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150134611A KR20170035582A (en) | 2015-09-23 | 2015-09-23 | Sensor package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20170035582A true KR20170035582A (en) | 2017-03-31 |
Family
ID=58386331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150134611A KR20170035582A (en) | 2015-09-23 | 2015-09-23 | Sensor package |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20170035582A (en) |
WO (1) | WO2017052089A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180135650A (en) | 2017-06-13 | 2018-12-21 | 주식회사 아모센스 | Window cover and sensor package |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59123259A (en) * | 1982-12-28 | 1984-07-17 | Nec Corp | Solid-state image pickup device |
JPH11340480A (en) * | 1998-05-21 | 1999-12-10 | Tokai Rika Co Ltd | Plastic package |
JP2007311454A (en) * | 2006-05-17 | 2007-11-29 | Sony Corp | Solid-state image sensing device |
JP2008305845A (en) * | 2007-06-05 | 2008-12-18 | Fujifilm Corp | Radiation detector |
KR20140016023A (en) * | 2012-07-30 | 2014-02-07 | 삼성전자주식회사 | Image sensor package |
-
2015
- 2015-09-23 KR KR1020150134611A patent/KR20170035582A/en not_active Application Discontinuation
-
2016
- 2016-08-29 WO PCT/KR2016/009578 patent/WO2017052089A1/en active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180135650A (en) | 2017-06-13 | 2018-12-21 | 주식회사 아모센스 | Window cover and sensor package |
Also Published As
Publication number | Publication date |
---|---|
WO2017052089A1 (en) | 2017-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |