KR20170035582A - Sensor package - Google Patents

Sensor package Download PDF

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Publication number
KR20170035582A
KR20170035582A KR1020150134611A KR20150134611A KR20170035582A KR 20170035582 A KR20170035582 A KR 20170035582A KR 1020150134611 A KR1020150134611 A KR 1020150134611A KR 20150134611 A KR20150134611 A KR 20150134611A KR 20170035582 A KR20170035582 A KR 20170035582A
Authority
KR
South Korea
Prior art keywords
glass cover
sensor chip
resin material
bezel
sensor
Prior art date
Application number
KR1020150134611A
Other languages
Korean (ko)
Inventor
이수길
Original Assignee
(주)파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)파트론 filed Critical (주)파트론
Priority to KR1020150134611A priority Critical patent/KR20170035582A/en
Priority to PCT/KR2016/009578 priority patent/WO2017052089A1/en
Publication of KR20170035582A publication Critical patent/KR20170035582A/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/26—Windows; Cover glasses; Sealings therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • G06K9/00006—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Image Input (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

A sensor package of the present invention includes a base substrate, a sensor chip located on an upper surface of the base substrate, a glass cover located on an upper surface of the sensor chip, a bezel portion surrounding the glass cover, And a resin material formed around the chip, the resin material being bonded to the lower surface of the sensor chip and the glass cover.

Description

Sensor package {Sensor package}

The present invention relates to a sensor package, and more particularly, to a package structure including a sensor chip and an upper surface of the sensor chip is covered with a cover.

Electronic devices such as smart phones, tablet computers, laptop computers and the like are equipped with various sensor devices. Such a sensor device is an electric device that mainly receives signals from outside and measures them. Therefore, at least a part of the signal is exposed to the outside of the electronic device to receive a signal from the outside.

The sensor package constituting the sensor device includes a sensor chip, which is often covered by another structure. Such a cover portion is required to be formed in a material and a shape which are capable of smoothly conveying a signal to be received by the sensor chip, but are also excellent in aesthetics. This is because the cover portion is exposed to the outside of the electronic device.

Conventionally, among the sensor devices, for example, in the case of the fingerprint recognition sensor, the sensor chip is sometimes molded with a resin material such as epoxy. However, such a resin material has a disadvantage in that the relative dielectric constant is not sufficiently high, and signal transmission may not be smooth. In order to overcome this, the resin material must be made thin and the process for this is very difficult. In addition, the resin material has a disadvantage in that it can not be aesthetically pleasing or tactile, and can damage the overall feel of the electronic product.

Accordingly, there is an increasing demand for a sensor package having a cover with excellent aesthetics while being able to smoothly transmit a signal or the like received by the sensor chip.

A problem to be solved by the present invention is to provide a sensor package which is improved in bonding between a glass cover and a bezel portion which are exposed to the outside, and which is excellent in aesthetics and feel.

Another problem to be solved by the present invention is to provide a sensor package in which a glass cover is stably fixed so that signals can be smoothly transmitted to a sensor chip while durability is excellent.

According to an aspect of the present invention, there is provided a sensor package including a base substrate, a sensor chip positioned on an upper surface of the base substrate, a glass cover positioned on an upper surface of the sensor chip, a bezel portion surrounding the glass cover, And a resin material formed around the sensor chip and coupled with the sensor chip and the lower surface of the glass cover.

In an embodiment of the present invention, the upper surface of the glass cover and the upper end of the bezel may be located on the same plane.

In an embodiment of the present invention, a resin material is filled between the glass cover and the bezel to couple the glass cover and the bezel, but the resin material may not protrude above the glass cover.

According to an embodiment of the present invention, the side surface of the glass cover and the bezel may be closely contacted to each other, and the resin material may be prevented from flowing between the side surface of the glass cover and the bezel.

In one embodiment of the present invention, the resin material is formed so as to cover the lower surface of the glass cover, and may be engaged with the inner peripheral surface of the bezel.

In one embodiment of the present invention, the resin material may be formed to expose the sensor chip without covering the lower surface of the sensor chip.

In one embodiment of the present invention, the resin material may be positioned between the upper surface of the sensor chip and the lower surface of the glass cover.

In an embodiment of the present invention, the sensor chip may be electrically connected to the base substrate through a solder ball coupled to a bottom surface.

In an embodiment of the present invention, the bezel portion may include a support jaw structure configured to support a rim portion of the glass cover.

The sensor package according to an embodiment of the present invention is advantageous in that the bezel portion and the glass cover, which are exposed to the outside, are closely contacted and the upper surface of the outer portion is flat, so that the sensor package is excellent in feel and feel.

In addition, the sensor package according to an embodiment of the present invention has an advantage that the glass cover is stably fixed by the resin material, and thus the durability is excellent.

In addition, the sensor package according to an embodiment of the present invention has an advantage that signals can be smoothly transmitted to the sensor chip through the glass cover.

1 is a cross-sectional view of a sensor package according to an embodiment of the present invention.
FIG. 2 is an enlarged view of a portion of the bezel of FIG. 1. FIG.
3 shows a cross-sectional view of a sensor package according to another embodiment of the present invention.
FIG. 4 is an enlarged view of a portion of the bezel of FIG. 3;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that adding a detailed description of a technique or a configuration already known in the field can make the gist of the present invention unclear, some of it will be omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express the embodiments of the present invention, which may vary depending on the person or custom in the relevant field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, a sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 attached hereto.

Hereinafter, a sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 attached hereto.

Referring to FIG. 1, the sensor package of the present invention includes a base substrate 100, a sensor chip 200, a glass cover 300, a bezel portion 500, and a resin material 400.

The base substrate 100 is formed in a flat plate shape. The base substrate 100 may be formed in a rectangular shape. The base substrate 100 may be formed of a printed circuit board (PCB). Terminals may be formed on the upper surface and the lower surface of the base substrate 100, respectively. The upper and lower terminals of the base substrate 100 may be electrically connected to each other. The sensor chip 200 or the ASIC may be mounted on the upper surface terminal of the base substrate 100. The lower terminal of the base substrate 100 can input / output signals or transmit power.

The sensor chip 200 is positioned on the upper surface of the base substrate 100. Specifically, the sensor chip 200 may be electrically connected to the terminal 110 on the upper surface of the base substrate 100 through a solder ball 250 or a wire (not shown). Through this connection, the sensor chip 200 can receive power from the base substrate 100 and transmit or receive signals. Although FIG. 1 shows a solder ball 250 connected thereto, it is not limited thereto.

The space between the lower surface of the sensor chip 200 and the base substrate 100 may be filled with the nonconductive resin material 400. [ Therefore, it is possible to prevent foreign matter from contacting the bottom surface of the sensor chip 200 or the solder ball 250, and the sensor chip 200 can be firmly coupled.

The sensor chip 200 may be an electric device that measures various information of an external environment and converts the information into an electric signal. For example, the sensor chip 200 may be a temperature sensor, an optical sensor, a pressure sensor, or a fingerprint recognition sensor.

When the sensor chip 200 is a fingerprint recognition sensor, the sensor chip 200 transmits an electric signal to a fingerprint to be recognized, receives a signal passing through the fingerprint again, and acquires information about the fingerprint. Therefore, when the sensor chip 200 is a fingerprint recognition sensor, the sensor chip 200 includes a transmitter and a receiver of an electric signal. The fingerprint to be recognized is normally positioned in the upper direction of the sensor chip 200. Therefore, the transmitter and receiver of the sensor chip 200 are preferably formed on the upper surface of the sensor chip 200.

The glass cover 300 is positioned on the upper surface of the sensor chip 200. The glass cover 300 may be located on the outermost side of the sensor package. Thus, the outer surface of the glass cover 300 can be brought into contact with the fingerprint to be recognized, and the glass cover 300 is positioned between the sensor chip 200 and the fingerprint to be recognized. The glass cover 300 may be formed in a flat plate shape. The glass cover 300 may be formed of a transparent material so that the sensor chip 200 or the like inside the glass cover 300 can be seen from the outside or may be formed of an opaque material so that the sensor chip 200, .

Since the glass cover 300 is positioned between the sensor chip 200 and the fingerprint to be recognized, the transmission / reception signals of the sensor chip 200 pass through. Therefore, it is preferable that the glass cover 300 is formed of a material having a predetermined relative dielectric constant. Conventional glass materials are suitable for transmitting / receiving signals when the glass cover 300 is formed to have an appropriate thickness with a relative dielectric constant of XX or more. For example, in the case of a sapphire glass material which is high in strength and is suitable for use as the glass cover 300, the relative dielectric constant is suitable for transmitting / receiving signals with a relative dielectric constant of XX.

The glass cover 300 has a high relative dielectric constant as described above, so that signal transmission is easier than molding the sensor chip 200 with a resin material 400 such as epoxy. Generally, the resin material 400 such as epoxy has a relative dielectric constant of about XX. In addition, the glass cover 300 has a higher hardness than the resin material 400 such as epoxy and has high durability against scratches and the like, and is excellent in aesthetics, which can contribute to improvement of the external design of the device on which the sensor package is mounted.

The glass cover 300 is positioned close to the upper surface of the sensor chip 200. Specifically, the glass cover 300 may be positioned in contact with the sensor chip 200, but may be spaced apart from the sensor chip 200. When the glass cover 300 and the upper surface of the sensor chip 200 are separated from each other, a resin material 400 to be described later may be filled therebetween. The resin material 400 may be fixed to the sensor chip 200 so that the glass cover 300 is fixed.

The resin material 400 can transmit a transmission / reception signal between the sensor chip 200 and the glass cover 300. Therefore, it is preferable that the resin material 400 is made of a material having a high dielectric constant. In addition, it is preferable that the sensor chip 200 and the glass cover 300 are brought into close contact with each other as much as possible so that the thickness of the resin material 400 is thin.

The bezel part 500 is formed so as to surround the sensor chip 200 and the glass cover 300. The sensor chip 200 is thus surrounded by the base substrate 100, the glass cover 300 and the bezel part 500 Space.

The resin material 400 is formed by being coupled to the lower surface of the glass cover 300. The resin material 400 is formed around the sensor chip 200 and is coupled to the sensor chip 200. In some cases, The resin material 400 may be a mixture of the glass cover 300 and the sensor chip 300. The resin material 400 may be a liquid material, (200) in a fixed state.

When the upper surface of the sensor chip 200 is disposed in close contact with the lower surface of the glass cover 300 as described above, the resin material 400 is placed between the upper surface of the sensor chip 200 and the lower surface of the glass cover 300 The upper surface of the sensor chip 200 can be in direct contact with the lower surface of the glass cover 300. However, as shown in FIG. 1, when the upper surface of the sensor chip 200 is in contact with the lower surface of the glass cover 300 But if the predetermined space is formed, the spacing space may be filled with the resin material 400.

The resin material 400 may be formed so as to cover at least a part of the side surfaces of the sensor chip 200. The resin material 400 may be formed to cover all the side surfaces of the sensor chip 200, The resin material 400 may be formed so as not to cover the lower surface of the sensor chip 200. The lower surface of the sensor chip 200 is covered with the resin material 400, And may be in an exposed state.

2, the upper end of the bezel portion 500 is formed to be positioned on the same plane as the upper surface of the glass cover 300. Thus, the upper surface of the sensor package can be formed flat. The bezel part 500 and the glass cover 300 are disposed close to each other but a slight spacing space may be formed between the bezel part 500 and the glass cover 300. The glass cover 300 and the bezel part 500 are filled with the resin material 600, The water-based resin material 600 may be formed integrally with the resin material 400 covering at least a part of the sensor chip 200 in a continuous manner.

The resin material 600 may be a resin material that is injected into the spacing space in a state of being liquid and filled with the resin material 600. The resin material 600 may be a resin material that is injected into the space between the bezel part 500 and the glass cover 300 and / The resin material 600 is formed so as not to protrude above the glass cover 300. The resin material 600 is formed to protrude upward from the glass cover 300 It is preferable that the resin material 600 completely fill the space between the side surface of the glass cover 300 and the bezel part 500 but overflow the space between the side surface of the glass cover 300 and the bezel part 500, It is preferable to form it so that it does not become.

The bezel portion 500 may include a support jaw structure 510 to support a rim portion of the glass cover 300. In this case, the upper surface of the support jaw structure 510 and the lower surface of the glass cover 300 And the space between the glass cover 300 and the support jaw structure 510 can be coupled with the resin material 600. As shown in FIG.

Hereinafter, a sensor package according to another embodiment of the present invention will be described with reference to FIGS. 3 to 4. For convenience of explanation, the sensor package key according to the present embodiment includes a sensor package We will focus on the differences from the package.

 The bezel part 500 and the glass cover 300 are completely in tight contact with each other at least at the side of the bezel part 500 and the glass cover 300. Therefore, The resin material 400 is formed so as to be in contact with only the lower surface of the glass cover 300 and the glass cover 300 300). ≪ / RTI >

The sensor package described with reference to Figs. 1 to 4 has an advantage that the glass cover 300 exposed to the outside is coupled to the bezel part 500 in close contact with each other, and the top surface of the outer part is flat, The glass cover 300 is stably fixed by the resin material 400 and the durability of the glass cover 300 is excellent. .

The embodiments of the sensor package of the present invention have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.

100: base substrate 110: terminal on the upper surface
200: sensor chip 250: solder ball
300: Glass cover 400: Resin
500: Bezel part 510: Support chin

Claims (9)

A base substrate;
A sensor chip positioned on an upper surface of the base substrate;
A glass cover positioned on an upper surface of the sensor chip;
A bezel portion surrounding the glass cover; And
And a resin material formed around the sensor chip, the resin material being bonded to the lower surface of the sensor chip and the glass cover. The method according to claim 1,
Wherein an upper surface of the glass cover and an upper surface of the bezel are located on the same plane. The method according to claim 1,
A resin material is filled between the glass cover and the bezel to join the glass cover and the bezel,
Wherein the resin material is formed so as not to protrude above the glass cover. The method according to claim 1,
Wherein a side surface of the glass cover and the bezel portion are closely contacted and abutted to each other,
Wherein the resin material is formed so as not to flow between the side surface of the glass cover and the bezel. The method according to claim 1,
Wherein the resin material is formed so as to cover the lower surface of the glass cover and is also engaged with the inner peripheral surface of the bezel. The method according to claim 1,
Wherein the resin material does not cover the lower surface of the sensor chip, and the sensor chip is exposed. The method according to claim 1,
Wherein the resin material is located between the upper surface of the sensor chip and the lower surface of the glass cover. The method according to claim 1,
Wherein the sensor chip is electrically connected to the base substrate through a solder ball coupled to a bottom surface thereof.
The method according to claim 1,
And the bezel portion includes a supporting jaw structure configured to support a rim portion of the glass cover.








KR1020150134611A 2015-09-23 2015-09-23 Sensor package KR20170035582A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150134611A KR20170035582A (en) 2015-09-23 2015-09-23 Sensor package
PCT/KR2016/009578 WO2017052089A1 (en) 2015-09-23 2016-08-29 Sensor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150134611A KR20170035582A (en) 2015-09-23 2015-09-23 Sensor package

Publications (1)

Publication Number Publication Date
KR20170035582A true KR20170035582A (en) 2017-03-31

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150134611A KR20170035582A (en) 2015-09-23 2015-09-23 Sensor package

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KR (1) KR20170035582A (en)
WO (1) WO2017052089A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180135650A (en) 2017-06-13 2018-12-21 주식회사 아모센스 Window cover and sensor package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123259A (en) * 1982-12-28 1984-07-17 Nec Corp Solid-state image pickup device
JPH11340480A (en) * 1998-05-21 1999-12-10 Tokai Rika Co Ltd Plastic package
JP2007311454A (en) * 2006-05-17 2007-11-29 Sony Corp Solid-state image sensing device
JP2008305845A (en) * 2007-06-05 2008-12-18 Fujifilm Corp Radiation detector
KR20140016023A (en) * 2012-07-30 2014-02-07 삼성전자주식회사 Image sensor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180135650A (en) 2017-06-13 2018-12-21 주식회사 아모센스 Window cover and sensor package

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Publication number Publication date
WO2017052089A1 (en) 2017-03-30

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