KR20170031039A - Substrate with bank - Google Patents

Abstract

According to one embodiment of the present invention, a substrate with a bank comprises a substrate, and a single-layered bank installed on the substrate to divide and form a predetermined section on the substrate. With respect to the bank, a contact angle of anisole is 35 or higher on an upper surface placed on the opposite side of the bottom surface of a substrate side. With respect to a direction perpendicular to a plate thickness direction of the substrate, D1/T1 satisfies 0 < D1/T1 <== 2.0, wherein D1 is a distance from a bank end part defined by a side surface facing the section and the bottom surface in the bank to an organic layer pinning position and T1 is the thickness of the bank. When one organic layer is formed in the section, the organic layer pinning position is a position of the end part around the upper surface in an interface between the organic layer and the bank.

Description

[0001] SUBSTRATE WITH BANK [0002]

The present invention relates to a substrate having banks.

There is a light emitting device using an organic EL (Electro Luminescence) element as a light source. As such a light emitting device, for example, there is an organic EL display (display device) using an organic EL element as a light source of a pixel. The organic EL display has a plurality of organic EL elements, and each organic EL element functions as a light source of the pixel. The organic EL display includes a substrate having a bank on which a bank for partitioning a partition defining a pixel is provided on a substrate. As the substrate having such a bank, for example, there is a substrate described in Patent Document 1 (Japanese Patent Laid-Open Publication No. 2011-170249).

In the organic EL display provided with the substrate having the banks, the organic EL element is formed by laminating a first electrode, a light emitting layer as an organic layer, and a second electrode in this order in each section. Another organic layer or an inorganic layer may be further formed between the first electrode and the light emitting layer or between the light emitting layer and the second electrode. The first electrode of the organic EL device may be part of a substrate having a bank.

The organic layer can be formed by a coating method. That is, the organic layer is formed by supplying a coating liquid containing a material to be an organic layer to a predetermined partition (a region surrounded by the banks) by a predetermined coating method, and drying and solidifying the coating liquid. An end (uppermost end) on the upper surface side of the bank at the interface between the organic layer formed after drying the coating liquid and the side surface of the bank facing the partition is known as a pinning position.

In the case of a substrate having banks, when the organic EL elements are formed in the partition defined by the banks, uniformity of the thickness of the organic layers of the organic EL elements is required. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a substrate having banks in which uniformity of the thickness of the organic layer is achieved in the case of forming the organic layer in the partition defined by the banks.

The inventors of the present invention conducted intensive studies in order to make uniform the thickness of the organic layer in the case of forming the organic layer in the partition defined by the bank. As a result, it has been found that the uniformity of the thickness of the organic layer can be achieved by satisfying the predetermined relationship between the thickness of the bank and the position of the organic layer pinning.

That is, a substrate having a bank according to one aspect of the present invention includes a substrate, and a bank of a single-layer structure provided on the substrate and partitioning a section set in advance on the substrate. The contact angle of the anisole on the upper surface located on the side opposite to the bottom surface of the substrate in the bank is 35 DEG or more. The distance from the side face facing the partition in the bank to the organic layer pinning position from the bank end defined by the bottom face is D1 and the thickness of the bank is T1 in the direction orthogonal to the thickness direction of the substrate , D1 / T1 satisfies 0 < D1 / T1 &amp;le; 2.0. The organic layer pinning position is a position of an end portion near the upper surface at the interface between the organic layer and the bank when one layer of the organic layer is formed in the partition.

In the above structure, the contact angle of the anisole on the upper surface of the bank is 35 占 or more, so that a desired thickness can be secured when the organic layer is formed in the partition. Further, by satisfying 0 < D1 / T1 &amp;le; 2.0, D1 / T1 satisfies the uniformity of the thickness of the organic layer while securing the height of the bank.

The angle defined by the bottom surface and the side surface of the bank may be less than 90 degrees. In this case, a bank in which the side surface is tapered toward the substrate side is obtained.

The bank may be a cured product of a photosensitive resin composition containing a liquid repellent agent. By including the liquid repellent agent, the bank has liquid repellency. Further, by including the photosensitive resin composition, the bank can be formed by, for example, exposure and development processing.

The liquid repellent agent may contain a fluororesin.

The composition ratio of the liquid repellent agent to the solid content contained in the photosensitive resin composition may be less than 0.2 mass%. As a result, the contact angle of the anisole on the upper surface of the bank can be made to be 35 DEG or more, and D1 / T1 can more easily satisfy 0 < D1 / T1 &amp;le; 2.0.

The organic layer pinning position may be the position of the end near the upper surface at the interface when the hole injection layer is formed as an organic layer by a coating method.

According to the present invention described above, it is possible to provide a substrate having banks in which uniformity of the thickness of the organic layer can be achieved in the case of forming the organic layer in the partition defined by the bank.

1 is a plan view of a substrate having banks according to one embodiment.
Fig. 2 is a partially enlarged view of a section taken along line II-II in Fig. 1;
3 is a schematic diagram for explaining a configuration of an organic EL display using a substrate having the banks shown in Fig.
4 is a schematic diagram showing an example of pixel arrangement of an organic EL display using a substrate having the banks shown in Fig.
Fig. 5 is a diagram for explaining conditions satisfying the bank of the substrate having the banks shown in Fig. 1; Fig.
6 is a view showing a state in which a thin film to be a bank is formed in the method of manufacturing a substrate having the banks shown in Fig.
7 is a view for explaining an exposure process in a method of manufacturing a substrate having the banks shown in Fig.
8 is a view for explaining a state after a developing process in a manufacturing process of a substrate having the banks shown in Fig.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. Identical elements are assigned the same number. Duplicate description is omitted. The dimensional ratios in the drawings do not necessarily coincide with those in the description.

The substrate 10 having the banks shown in Figs. 1 and 2 is a substrate applied to an organic EL device such as an organic EL display (display device). As shown in Figs. 1 and 2, a substrate 10 having banks includes a substrate 12 and a bank 14. A plurality of recesses 16 defined by the substrate 12 and the banks 14 are formed in the substrate 10 having the banks.

The substrate 12 has a substrate body 18 and a plurality of electrodes 20. The substrate main body 18 is a plate-shaped transparent member having transparency to visible light (light having a wavelength of 400 to 800 nm). The substrate body 18 is a support for supporting the electrode 20 and the bank 14. An example of the thickness of the substrate main body 18 is 30 占 퐉 or more and 1100 占 퐉 or less. The substrate main body 18 may be, for example, a rigid substrate such as a glass substrate and a silicon substrate, or a flexible substrate such as a plastic substrate and a polymer film. By using the flexible substrate, the organic EL device using the substrate 10 having the bank can have flexibility.

In the case where the substrate 10 having banks is applied to the organic EL device, a circuit for individually driving a plurality of organic EL elements included in the organic EL device may be formed in the substrate main body 18 in advance. For example, a TFT (Thin Film Transistor), a capacitor, or the like may be formed in the substrate main body 18 in advance.

The plurality of electrodes 20 are disposed discretely on the substrate main body 18, as shown in Figs. Specifically, the electrode 20 is provided on the surface 18a of the substrate main body 18 and in the region corresponding to the recess 16. The shape viewed from the plane of the electrode 20 (the shape seen from the plate thickness direction of the substrate 10 having the bank) is, for example, rectangular as shown in Fig. 1, but may be square, circular or elliptical.

Each of the electrodes 20 functions as one of a pair of electrodes (anode and cathode) of the organic EL element 30. Hereinafter, unless otherwise stated, the electrode 20 corresponds to the anode. The electrode 20 serving as an anode may be a thin film containing a metal oxide, a metal sulfide, a metal, or the like. Specifically, the electrode 20 may be formed of indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO) A thin film including indium zinc oxide (abbreviated as IZO), gold, platinum, silver and copper may be used. When the organic EL device including the substrate 10 having banks is a device that emits light from the side of the substrate 10 having banks, an electrode that exhibits light transmittance is used for the electrode 20.

The electrode 20 is provided on the surface 18a of the substrate main body 18 and constitutes a part of the substrate 12. [ The surface 20a (see FIG. 2) of the electrode 20 which is the surface opposite to the substrate main body 18 constitutes a part of the surface 12a of the substrate 12. Normally, the surface 20a is a flat surface. A portion of the surface 18a of the substrate main body 18 where the electrode 20 is not provided also constitutes a part of the surface 12a of the substrate 12. [ In one embodiment, a layer composed of an insulating layer or the like may be provided between the electrode 20 and the substrate main body 18. In this case, of the layers constituted by the insulating film or the like, the surface in contact with the electrode 20 corresponds to the surface 12a of the substrate main body 18. Further, a layer such as an insulating layer may also be regarded as a part of the substrate main body 18.

The bank 14 is provided on the substrate 12. The bank 14 is a partition wall that defines a partition that is set on the substrate 12 in advance. The partition defined by the bank 14 is the recess 16. The bank 14 is formed on the substrate 12, for example, in a lattice or stripe form. In one embodiment, a layer composed of a planarizing film or the like may be provided between the bank 14 and the substrate 12. [

The electrode 20 provided on the substrate main body 18 is provided on the surface 18a of the substrate main body 18 in a region corresponding to the recess 16 as described above. The concave portion 16 is partitioned by the bank 14. Therefore, the bank 14 is provided on the substrate main body 18 except for the region where the electrode 20 is provided. The bank 14 may be formed on the periphery of the electrode 20 so that the end portion (bank end portion) 14a of the bank 14 overlaps the electrode 20.

The bank 14 need not be formed so that its end portion 14a covers all the peripheral portions of the electrode 20. [ For example, in the case of forming the so-called stripe-shaped bank 14, a partition wall may be formed so as to cover the opposite sides of the four sides of the electrode 20 with the end of the partition. In the present embodiment, the end portion 14a of the bank 14 is formed so as to cover all the peripheral portions of the electrode 20.

The end portion 14a is an end portion defined by the side surface 14b facing the concave portion 16 and the bottom surface 14c of the bank 14 in the bank 14. The bottom surface 14c is an end portion defined by the bottom surface 14c of the bank 14, And the surface 12a of the substrate 12. As shown in Fig.

For convenience of explanation, as shown in Figs. 1 and 2, the plate thickness direction of the substrate 12 is referred to as a Z direction, and two directions orthogonal to the Z direction are referred to as an X direction and a Y direction. The X direction and the Y direction are orthogonal to each other.

Unless mentioned, in this embodiment, the banks 14 are formed in a lattice pattern as shown in Fig. In this case, as viewed in the plate thickness direction (Z direction) of the substrate 12, the plurality of recesses 16 are arranged in a matrix. That is, the concave portions 16 are arranged at predetermined intervals in the X direction (first axis direction) and at predetermined intervals in the Y direction (second axis direction). The X direction may be referred to as a row direction and the Y direction as a column direction based on the two-dimensional arrangement state of the concave portions 16 as shown in Fig. The shape seen from the plane of each concave portion 16 is not limited. For example, the concave portion 16 is formed in a substantially rectangular shape or in a substantially oval shape when viewed in plan view. In this embodiment, a substantially rectangular recess 16 is formed in a plan view.

The concave portion 16 is a portion that functions as a pixel when the substrate 10 having the bank is applied to the organic EL display. This point will be described. 3 is a diagram showing an example of a sectional configuration of an organic EL display using a substrate 10 having banks.

3, the organic EL display 22 includes an electrode 20 corresponding to a cathode arranged in a recess 16 as a section defined by the bank 14, a hole 20 formed on the electrode 20, An organic EL device 30 including an injection layer 24, a light emitting layer 26 stacked on the hole injection layer 24, and an electrode 28 corresponding to a cathode stacked on the light emitting layer 26. In this specification, the term &quot; above &quot; means that it can take a form that is provided in contact with the lower layer and a form that is provided apart from the lower layer.

4, the organic EL display 22 has a plurality of concave portions 16 formed in a matrix on the substrate 10 having the banks, (30), and the plurality of organic EL elements (30) are arranged in a matrix like the plurality of concave portions (16). That is, the organic EL elements 30 are arranged on the substrate main body 18 at a predetermined interval in the X direction and aligned at predetermined intervals in the Y direction.

The organic EL element 30 functions as a light source of the pixel in the organic EL display 22. [ The organic EL element 30 is provided corresponding to the concave portion 16. Therefore, the concave portion 16 is a portion which functions as a pixel.

In one embodiment, the organic EL display 22 is provided with three kinds of organic EL elements 30. That is, there are (1) a red organic EL element 30R for emitting red light, (2) a green organic EL element 30G for emitting green light, and (3) a blue organic EL element 30B for emitting blue light. These three kinds of organic EL elements 30R, 30G, and 30B are arranged and arranged by, for example, arranging the following columns (i), (ii), and (iii) repeatedly in this order in the Y direction (See Fig. 4).

(i) Rows in which the red organic EL elements 30R are arranged at a predetermined interval in the X direction.

(ii) the row in which the green organic EL devices 30G are arranged at a predetermined interval in the X direction.

(iii) Heat in which the blue organic EL elements 30B are arranged at a predetermined interval in the X direction.

As another embodiment, in addition to the three kinds of organic EL elements 30, for example, an organic EL element 30 for emitting white light may be further provided. In addition, by providing only one type of organic EL element 30, a monochrome display device can be realized.

Returning to Fig. 3, the structure of the organic EL element 30 will be described. Since the electrode 20 is as described above, the description is omitted.

The hole injection layer 24 is an organic layer having a function of improving the hole injection efficiency from the electrode 20 as the anode to the light emitting layer 26. The hole injection layer 24 is provided so as to have a different material or thickness for each type of the organic EL element 30, if necessary. All the hole injection layers 24 can be formed with the same material and the same thickness from the viewpoint of the simplicity of the process of forming the hole injection layer 24. [ Further, in the case of forming the organic EL element 30 having a micro cavity structure, the thickness of the hole injection layer 24 can be adjusted for each type of the organic EL element 30 according to the light emission wavelength so that light resonance occurs.

A known hole injecting material may be used for the material of the hole injecting layer 24. The hole injection layer 24 may be formed by a coating method. That is, the ink containing the material to be the hole injection layer 24 is supplied to the region (concave portion 16) surrounded by the bank 14. The method of supplying the ink is not particularly limited, but is supplied by, for example, an inkjet printing method, a nozzle coating method, an iron plate printing method or intaglio printing method. Thereafter, the supplied ink is solidified to form the hole injection layer 24.

The light emitting layer 26 is provided on the hole injection layer 24 in the recess 16. The light emitting layer 26 is an organic layer having a function of emitting light of a predetermined wavelength. The light emitting layer 26 is usually formed of an organic substance that mainly emits fluorescence and / or phosphorescence, or a corresponding organic substance and a dopant that assists the organic substance. The dopant is added, for example, in order to improve the luminous efficiency or to change the emission wavelength. The organic material contained in the light emitting layer 26 may be a low molecular weight compound or a high molecular weight compound. Examples of the light-emitting material constituting the light-emitting layer 26 include known dye-based materials, metal complex system materials, high molecular weight materials, and dopant materials.

The light emitting layer 26 is provided according to the kind of the organic EL element 30 (for example, the red organic EL element 30R, the green organic EL element 30G and the blue organic EL element 30B). A light emitting layer 26 for emitting red light is provided on the hole injection layer 24 of the concave portion 16 where the red organic EL device 30R is provided and the hole injection A light emitting layer 26 that emits green light is provided on the layer 24 and a light emitting layer 26 that emits blue light is provided on the hole injection layer 24 of the recess 16 where the blue organic EL device 30B is provided.

The light emitting layer 26 may be formed by a coating method in the same manner as the hole injecting layer 24. In this case, the light emitting layer 26 can be formed in the same manner as the hole injecting layer 24, except that the ink containing the material for forming the light emitting layer 26 is used.

The electrode 28 is provided on the light emitting layer 26. As described above, in the present embodiment, since the electrode 20 functions as an anode, the electrode 28 functions as a cathode. As the material of the electrode 28 serving as the cathode, a material having a small work function, easy injection of electrons into the light emitting layer 26, and high electric conductivity is preferable. In the display in which the organic EL display 22 takes out light from the anode side, the light emitted from the light emitting layer 26 is reflected from the cathode to the anode side, so that a material having a high visible light reflectance is preferable as a material for the cathode. As the cathode, for example, an alkali metal, an alkaline earth metal, a transition metal, and a Group 13 metal of the periodic table can be used. As the electrode 28 corresponding to the cathode, a transparent conductive electrode including a conductive metal oxide and a conductive organic material can be used.

The electrode 28 may be formed by vapor deposition or coating. In the case of forming the electrode 28 by the coating method, the electrode 28 may be formed in the same manner as the hole injection layer 24 except that the ink containing the material for forming the electrode 28 is used.

The electrode 28 may be provided on the light emitting layer 26. For example, a predetermined inorganic layer may be provided between the light emitting layer 26 and the electrode 28 provided thereon.

In the present embodiment, the electrodes 28 are formed on the entire surface in the display area where the organic EL elements 30 are provided. That is, the electrode 28 is formed continuously over the plurality of organic EL elements 30, and is provided as an electrode 28 common to all the organic EL elements 30. Therefore, the electrode 28 is formed not only on the light emitting layer 26, but also on the bank 14.

Although not shown in Fig. 3, a sealing substrate for sealing the organic EL element 30 is usually provided on the electrode 20 of the organic EL display.

Next, referring to Fig. 5, the bank 14 of the substrate 10 having the banks will be described in more detail. 5 schematically shows a configuration in the vicinity of one recess 16 in the case where the hole injection layer 24 is formed on the electrode 20 in order to explain the condition satisfied by the bank 14 .

The bank 14 has a single-layer structure. That is, the bank 14 is different from the bank 14 having a laminated structure in which a plurality of layers are stacked.

The shape and arrangement of the banks 14 are appropriately set according to the specifications of the organic EL display 22 such as the number of pixels and the resolution, ease of manufacture, and the like. For example, the width of the bank 14 in the X direction (row direction) or the Y direction (column direction) in the display area is about 5 to 50 mu m. The width in the predetermined direction (X direction or Y direction) of the bank 14 is the length of the bottom surface 14c of the bank 14 on the end face of the bank 14 orthogonal to the predetermined direction, And the distance between the end portions 14a of the bank 14 facing the adjacent recesses 16 in the predetermined direction. The height of the bank 14 is about 0.3 to 5 mu m. The interval between the banks 14 adjacent to the X direction or the Y direction, that is, the width of the concave portion 16 in the row direction (X direction) or the column direction (Y direction) is about 10 mu m to 300 mu m. The width of the concave portion 16 in a predetermined direction (X direction or Y direction) is the length of the bottom surface of the concave portion 16 in a predetermined direction (X direction or Y direction). When the concave portion 16 has such a size, the width of the electrode 20 in the row direction or the column direction is about 10 to 300 mu m. As described above, when the end portion 14a of the bank 14 is formed on the periphery of the electrode 20, the width of the electrode 20 in the row direction or the column direction is set to be the same as the row direction of the concave portion 16 Is larger than the width in the column direction.

The bank 14 has a net taper shape. The net tapered bank 14 refers to an angle? 1 (see FIG. 2) formed between the side surface 14b of the bank 14 and the bottom surface 14c, which corresponds to the inner surface of the concave portion 16, &Lt; / RTI &gt; is less than 90 degrees. 2 and 5, the vicinity of the end portion 14a of the bank 14 facing the concave portion 16 is formed so as to have a narrower shape as the closer to the substrate 12 is. The angle [theta] 1 is the inclination angle of the side surface 14b with respect to the substrate 12. [ In Fig. 2 it is shown as the angle between the surface 20a and the side 14b, but it can be the angle of the side 14b with respect to the surface 18a.

The bank 14 satisfies the following <Condition 1> and <Condition 2>.

<Condition 1>

The contact angle of the anisole on the upper surface 14d of the bank 14 is 35 DEG or more.

<Condition 2>

When the distance from the end portion 14a of the bank 14 to the organic layer pinning position P is D1 and the thickness of the bank 14 is T1 in a direction orthogonal to the thickness direction of the substrate 12, / T1 satisfies 0 < D1 / T1 &lt; / = 2.0. T1 is 0.3 mu m or more, for example.

The contact angle of the anisole in <Condition 1> is the contact angle of the anisole when the anisole was dropped on the upper surface 14d, and the LCD-700S automatic liquid crystal glass cleaned and processed by Kyoei Gym Kagaku Co., Ltd. In the inspection apparatus, it is a value obtained by measuring the droplet size to 1.0 mu m by the &amp;thetas; / 2 method in the software name FAMAS.

The organic layer pinning position P in the <condition 2> means that when the organic layer is formed with one layer in the recess 16 as shown in FIG. 5, the organic layer pinning position P is the top face 14d at the interface between the organic layer and the bank 14, (The uppermost end). The organic layer formed in the concave portion 16 is not limited, but may be an organic layer formed by a coating method. An example of the organic layer formed by the coating method is shown in Fig. 5 as the hole injection layer 24. If the above-mentioned D1 / T1 is satisfied, the organic layer pinning position P in the other concave portion 16 may be different.

The bank 14 is a cured product of a photosensitive resin composition containing a liquid repellent agent. In one embodiment, the liquid-repellent agent may contain a fluororesin. In one embodiment, the photosensitive resin composition includes a radical polymerization initiator.

The content of the liquid repellent agent is less than 0.2 mass% with respect to the solid content contained in the photosensitive resin composition. For example, <condition 1> and <condition 2> can be realized by adjusting the type and content of the liquid-repellent agent in the photosensitive resin composition. As described above, when the liquid repellent agent contains a fluororesin, <condition 1> and <condition 2> are easily satisfied. <Condition 1> and <Condition 2> are easily satisfied when the composition ratio of the liquid repellent agent is less than 0.2 mass% with respect to the solid content contained in the photosensitive resin composition. When the liquid repellent agent contains a fluorine resin and the content of the liquid repellent agent is less than 0.2 mass% with respect to the solid content contained in the photosensitive resin composition, <conditions 1> and <condition 2> are more easily satisfied.

The substrate 10 having the banks can be manufactured, for example, as follows.

First, the substrate 12 is prepared (step of preparing the substrate). In this case, the substrate 12 provided with the electrode 20 can be prepared in advance, and the electrode 20 can be formed on the substrate main body 18 in the step of preparing the substrate 12. A description will be given of a case where the electrodes 20 are formed in a matrix shape on the substrate main body 18.

The electrode 20 can be formed, for example, by forming a conductive thin film on the surface 18a of the substrate main body 18 and patterning the conductive thin film by patterning it into a matrix by photolithography. Further, for example, a mask in which an opening is formed in a predetermined portion is disposed on the substrate main body 18, and a conductive material is selectively deposited on a predetermined portion on the substrate main body 18 through the mask, The electrode 20 can be formed.

After the substrate 12 is prepared as described above, the bank 14 is formed on the substrate 12 (step of forming banks). The method of forming the bank 14 is not limited. Here, in the case where the bank 14 is a cured product of a photosensitive resin composition containing a liquid repellent agent and the liquid repellent agent contains a fluorocarbon resin, The formation method will be described with reference to Figs. 6 to 8. Fig.

6, first, a photosensitive resin composition containing a liquid repellent agent is applied on a substrate 12 to form a thin film 32 containing a photosensitive resin composition containing a liquid repellent agent. Examples of the application method of the photosensitive resin composition include a spin coat method and a slit coat method.

After forming the thin film 32 containing the photosensitive resin composition, it is possible to perform vacuum drying for removing the solvent. For example, the solvent is removed by evacuating the vacuum to 50 to 150 Pa. Then, pre-baking is performed. For example, the substrate 12 is pre-baked by heating the substrate 12 at a temperature of 70 to 120 DEG C for 50 to 120 seconds to remove the solvent remaining in the vacuum drying and to remove the thin film containing the photosensitive resin composition 32 are brought into close contact with the substrate 12.

When the pre-baking treatment is performed, the liquid repellent agent floats in the surface layer portion in the thin film 32 formed on the substrate 12. [

Then, exposure is performed. When a negative type photosensitive resin composition is used, light is irradiated to a portion where a pattern is to be formed. When a positive-type photosensitive resin composition is used, light is irradiated to a portion excluding a portion where a pattern is to be formed. In this embodiment mode, a mode of using a negative-type photosensitive resin composition will be described.

A photomask 34 for shielding light of a predetermined pattern is disposed on the substrate 12 and the thin film 32 is exposed through the photomask 34 as shown in Fig. In the photosensitive resin composition containing the polymerization initiator, when the exposure is performed, the liquid repellent agent floating on the surface layer portion is fixed in the prebaking treatment. In the present embodiment, light is irradiated onto a portion of the thin film 32 where a bank 14 should be mainly formed. In Fig. 7, light to be irradiated is schematically shown by using a white arrow mark.

In a photosensitive resin composition which is polymerized by an acid generator, heat treatment is performed after exposure. By heating the substrate 12 at a temperature of, for example, 70 캜 to 120 캜 for 50 seconds to 120 seconds, polymerization is initiated and the liquid repellent agent is immobilized.

Next, the exposed substrate 12 is subjected to development processing to remove unexposed portions, thereby forming a net tapered structure 36 as shown in Fig. The structure 36 is a structure to be a single tier-shaped bank 14 in a net taper shape. The developing process can be performed, for example, by immersing the exposed substrate 12 in a developing solution. In this case, examples of the developer used in the development include an aqueous solution of potassium chloride, an aqueous solution of tetramethylammonium hydroxide (TMAH), and the like.

The angle? 2 between the side surface 36a to be the side surface 14b and the bottom surface 36b of the structure 36 (or the surface 12a of the substrate 12 ) Is adjusted to be the angle [theta] 1 shown in FIG. 2 through a cure bake to be described later. The angle? 2 can be adjusted by adjusting at least one of the exposure amount, the development time, the distance between the photomask 34 and the substrate 12, and the thickness of the thin film 32.

In general, in the case of the negative-type photosensitive resin composition, the angle (inclination angle)? 2 of the side surface 36a of the structure 36 tends to decrease as the exposure amount increases. The exposure dose is set according to the angle? 2, but is preferably 40 mJ / m 2 to 300 mJ / m 2, more preferably 50 mJ / m 2 to 250 mJ / m 2. Generally, in the case of a negative-type photosensitive resin composition, the angle? 2 tends to increase as the developing time is lengthened. In general, in the case of a negative type photosensitive resin composition, the angle? 2 tends to approach 90 degrees as the distance between the photomask 34 and the substrate 12 is shortened.

As described above, since the liquid-repellent material is immobilized on the surface layer portion in the thin film 32, the structure 36 obtained by performing the exposure treatment and the development treatment, and the structure 36, which is the bank 14 of one layer, Also, the liquid-repellent material is distributed in the surface layer portion.

After development, cure baking is performed. Baking is performed by heating the substrate 12 at a temperature of, for example, 200 DEG C to 230 DEG C for 15 to 60 minutes to form a bank 14 of a pure tapered shape.

Here, an example of the photosensitive resin composition will be described in detail. An example of the photosensitive resin composition used for the bank 14 includes the following (A), (B), (C), (D) and (E).

(A) a copolymer comprising a constituent unit derived from at least one kind selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a constituent unit derived from an unsaturated compound having a cyclic ether structure having 2 to 4 carbon atoms (Provided that there is no constituent unit derived from an unsaturated compound having a perfluoroalkyl group having 4 to 6 carbon atoms) (hereinafter sometimes referred to as &quot; resin A &quot;),

(B) a polymer containing a constituent unit derived from an unsaturated compound having a perfluoroalkyl group having 4 to 6 carbon atoms (hereinafter sometimes referred to as &quot; resin B &quot;),

(C) a polymerizable compound

(D) Polymerization initiator

(E) Solvent

The above-mentioned resin B corresponds to a liquid-repellent agent containing a fluorine resin.

The photosensitive resin composition may contain at least one member selected from the group consisting of a resin different from the resin A and the resin B (hereinafter sometimes referred to as &quot; resin A1 &quot;), a polymerization initiator, and a polyfunctional thiol compound .

In the present specification, the compounds exemplified as respective components can be used alone or in combination, unless otherwise specified.

As the resin A, for example, the following resins A-1 and A-2 can be mentioned.

Resin A-1: at least one selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride (hereinafter also referred to as "(a)") and a cyclic ether structure having a carbon number of 2 to 4 (Hereinafter sometimes referred to as &quot; (b) &quot;).

Resin A-2: a monomer (c) copolymerizable with (a) and (b) (provided that there is no cyclic ether structure having 2 to 4 carbon atoms) (hereinafter occasionally referred to as "(c) (a) and (b).

Provided that (a), (b) and (c) do not have a perfluoroalkyl group having 4 to 6 carbon atoms.

Resin A is preferably resin A-1.

Specific examples of the unsaturated monocarboxylic acid (a) include unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, o-vinylbenzoic acid, m-vinylbenzoic acid and p-vinylbenzoic acid;

Maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, Unsaturated dicarboxylic acids such as tetrahydrophthalic acid and 1,4-cyclohexene dicarboxylic acid;

Methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo [2.2.1] hept- 5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-5-ethylbicyclo [2.2.1] hept- Cyclo [2.2.1] hept-2-ene, and 5-carboxy-6-ethylbicyclo [2.2.1] hept-2-ene;

Maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride , Unsaturated dicarboxylic acid anhydrides such as dimethyltetrahydrophthalic anhydride and 5,6-dicarboxybicyclo [2.2.1] hept-2-ene anhydride (hydroamic anhydride);

(Meth) acryloyloxyalkyl (meth) acrylate of a divalent or higher polyvalent carboxylic acid such as succinic acid mono [2- (meth) acryloyloxyethyl], phthalic acid mono [2- 〕ester;

and unsaturated acrylates containing a hydroxyl group and a carboxyl group in the same molecule, such as? - (hydroxymethyl) acrylic acid.

Of these, acrylic acid, methacrylic acid, maleic anhydride and the like are preferably used in terms of copolymerization reactivity and alkali solubility.

In the present specification, "(meth) acrylic acid" represents at least one kind selected from the group consisting of acrylic acid and methacrylic acid. Quot ;, &quot; (meth) acryloyl &quot;, and &quot; (meth) acrylate &quot;

(b) is an unsaturated compound having a cyclic ether structure having 2 to 4 carbon atoms (for example, at least one member selected from the group consisting of oxirane rings, oxetane rings, and tetrahydrofuran rings) A monomer having an ether structure and an ethylenically unsaturated double bond is preferable, and a monomer having a cyclic ether structure having 2 to 4 carbon atoms and a (meth) acryloyloxy group is more preferable.

(b1), an unsaturated compound (b2) having an oxetanyl group (hereinafter referred to as "(b2)"), an unsaturated compound (b1) having an oxiranyl group , And an unsaturated compound (b3) having a tetrahydrofuryl group (hereinafter occasionally referred to as "(b3)").

(b1-1) (hereinafter, sometimes referred to as "(b1-1)") having a structure in which a linear or branched unsaturated aliphatic hydrocarbon is epoxidized, an unsaturated alicyclic hydrocarbon having an unsaturated alicyclic hydrocarbon And an unsaturated compound (b1-2) having an epoxidized structure (hereinafter occasionally referred to as "(b1-2)").

As the monomer (b1), a monomer having an oxiranyl group and a (meth) acryloyloxy group is preferable, and a monomer having a structure in which an unsaturated alicyclic hydrocarbon is epoxidized and a (meth) acryloyloxy group is more preferable. If these monomers are used, the storage stability of the photosensitive resin composition is excellent.

(meth) acrylate,? -methyl glycidyl (meth) acrylate,? -ethyl glycidyl (meth) acrylate, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether,? -methyl-o-vinyl benzyl glycidyl ether,? -methyl- Vinylbenzyl glycidyl ether, 2,3-bis (glycidyloxymethyl) styrene, 2,4-bis (glycidyloxymethyl) styrene, 2,5-bis (Glycidyloxymethyl) styrene, 2,6-bis (glycidyloxymethyl) styrene, 2,3,4-tris (glycidyloxymethyl) styrene, 2,3,5- Methyl styrene, 2,3,6-tris (glycidyloxymethyl) styrene, 3,4,5-tris (glycidyloxymethyl) styrene, 2,4,6-tris (glycidyloxymethyl) Styrene, and compounds described in JP-A-7-248625.

(b1-2) include vinylcyclohexene monoxide, 1,2-epoxy-4-vinylcyclohexane (for example, Celloxide 2000 manufactured by Daicel Chemical Industries Ltd.), 3,4-epoxycyclo (For example, Cycroma A400 manufactured by Daicel Chemical Industries, Ltd.), 3,4-epoxycyclohexylmethyl methacrylate (for example, Cycroma M100; A compound represented by the formula (I), a compound represented by the formula (II), and the like.

[In the formulas (I) and (II), R ¹ and R ² represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and the hydrogen atom contained in the alkyl group may be substituted with a hydroxy group.

X ¹ and X ² represent a single bond, -R ³ -, -R ³ -O-, -R ³ -S-, or -R ³ -NH-.

R ³ represents an alkanediyl group having 1 to 6 carbon atoms.

* Represents the bonding hand with O]

Specific examples of the alkyl group having 1 to 4 carbon atoms include a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group and tert-butyl group.

Examples of the alkyl group substituted with a hydroxy group include a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group, a 1-hydroxypropyl group, a 2-hydroxypropyl group, a 3-hydroxypropyl group, 1-methylethyl group, 2-hydroxy-1-methylethyl group, 1-hydroxybutyl group, 2-hydroxybutyl group, 3-hydroxybutyl group and 4-hydroxybutyl group.

As R ¹ and R ² , a hydrogen atom, a methyl group, a hydroxymethyl group, a 1-hydroxyethyl group and a 2-hydroxyethyl group are preferable, and a hydrogen atom and a methyl group are more preferable.

Examples of the alkanediyl group include a methylene group, an ethylene group, a propane-1,2-diyl group, a propane-1,3-diyl group, a butane-1,4-diyl group, , 6-diyl group, and the like.

X ¹ and X ² are preferably a single bond, a methylene group, an ethylene group, * -CH ₂ -O- (* represents a bond with O), * -CH ₂ CH ₂ -O- group More preferably a single bond, * -CH ₂ CH ₂ -O- group.

(b2) is preferably a monomer having an oxetanyl group and a (meth) acryloyloxy group. (meth) acryloyloxymethyloxetane, 3-ethyl-3- (meth) acryloyloxymethyloxetane, 3-methyl-3- ) Acryloyloxyethyloxetane, 3-ethyl-3- (meth) acryloyloxyethyloxetane, and the like.

(b3), a monomer having a tetrahydrofuryl group and a (meth) acryloyloxy group is preferable. Specific examples of the compound (b3) include tetrahydrofurfuryl acrylate (for example, Viscot V # 150, manufactured by Osaka Yuki Kagaku Kogyo Co., Ltd.) and tetrahydrofurfuryl methacrylate.

(meth) acrylic acid esters, N-substituted maleimides, unsaturated dicarboxylic acid diesters, alicyclic unsaturated compounds, styrene, and other vinyl compounds. The (meth) acrylate ester is not limited to having an ethylenic unsaturated group.

In the resin A-1, it is preferable that the ratio of the constitutional unit derived from each monomer is within the following range with respect to the total number of moles of the constitutional unit constituting the resin A-1.

(a); 5 to 60 mol% (more preferably 10 to 50 mol%)

(b); 40 to 95% by mole (more preferably 50 to 90% by mole)

When the ratio of the constitutional unit of the resin A-1 is within the above-mentioned range, the storage stability of the photosensitive resin composition, the developability in forming the pattern with the photosensitive resin composition, and the solvent resistance, heat resistance and mechanical strength of the obtained coating film and pattern are satisfactory There is a tendency to disappear.

As the resin A-1, the resin (A-1) in which (b) is the (b1) is preferable, and the resin A-1 in which the (b1) is the (b1-2) is more preferable.

Resin A-1 can be synthesized by, for example, a method described in "Experimental Method of Polymer Synthesis" (published by Kagaku Dojin Co., Ltd., 1st Edition, 1st Edition, March 1, 1972, May be prepared by reference to the literature.

In the resin A-2, it is preferable that the ratio of the constitutional unit derived from each monomer is within the following range with respect to the total number of moles of all the constitutional units constituting the resin A-2.

(a); 2 to 40 mol% (more preferably 5 to 35 mol%),

(c); 1 to 65 mol% (more preferably 1 to 60 mol%),

(b); 2 to 95 mol% (more preferably 5 to 80 mol%),

When the ratio of the constitutional unit of the resin A-2 is in the above-mentioned range, the storage stability of the photosensitive resin composition, the developability in forming the pattern with the photosensitive resin composition and the solvent resistance, heat resistance and mechanical strength of the obtained coating film and pattern are satisfactory There is a tendency to disappear.

As the resin A-2, the resin A-2 in which (b) is (b1) is preferable, and the resin (A-2) in which (b1) is (b1-2) is more preferable. Resin A-2 can be produced by the same method as Resin A-1.

The weight average molecular weight of the resin A in terms of polystyrene is preferably 3,000 to 100,000, more preferably 5,000 to 50,000. When the weight average molecular weight of the resin A is within the above range, the coating property tends to be excellent, the film of the exposed portion is hardly reduced during development, and the unexposed portion is liable to be removed from the development.

The molecular weight distribution (weight average molecular weight (Mw) / number average molecular weight (Mn)) of Resin A is preferably 1.1 to 6.0, and more preferably 1.2 to 4.0. When the molecular weight distribution is in the above range, the developability tends to be excellent.

The acid value of the resin A is 20 to 150 mgKOH / g, preferably 40 to 135 mgKOH / g, and more preferably 50 to 135 mgKOH / g. Here, the acid value is a value measured as the amount (mg) of potassium hydroxide necessary for neutralizing 1 g of the resin and can be obtained by titration using an aqueous potassium hydroxide solution.

The content of the resin A is preferably 5 to 95 mass%, more preferably 20 to 80 mass%, and particularly preferably 40 to 60 mass%, based on the total amount of the resin A, the resin A1 and the polymerizable compound. When the content of the resin A is in the above range, the developability of the photosensitive resin composition, the adhesiveness of the resulting pattern, the solvent resistance, and the mechanical properties tend to be good.

As the resin B, a polymer containing a constituent unit derived from an unsaturated compound (d) having a perfluoroalkyl group having 4 to 6 carbon atoms (hereinafter may be referred to as "(d)") may be mentioned.

(d) includes, for example, a compound represented by the formula (d-0).

[In the formula (d-0), R ^f represents a perfluoroalkyl group having 4 to 6 carbon atoms.

R ^d represents a hydrogen atom, a halogen atom, a cyano group, a phenyl group, a benzyl group or an alkyl group having 1 to 21 carbon atoms, and the hydrogen atom contained in the alkyl group may be substituted with a halogen atom or a hydroxy group.

X ^d represents a single bond, a bivalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, a bivalent alicyclic hydrocarbon group having 3 to 10 carbon atoms, or a bivalent aromatic hydrocarbon group having 6 to 12 carbon atoms, and the aliphatic hydrocarbon group and the alicyclic hydrocarbon -CH ₂ - included in the group may be substituted with -O-, -CO-, -NR ^e -, -S- or -SO ₂ -.

R ^f is a perfluoroalkyl group having 4 to 6 carbon atoms, preferably a perfluorobutyl group and a perfluorohexyl group.

Examples of the alkyl group having 1 to 21 carbon atoms in R ^d include a methyl group, ethyl group, n-propyl group, n-butyl group, n-pentyl group, n- A straight chain alkyl group such as a methyl group,

A methylpentyl group, a 4-methylpentyl group, a 1-ethylbutyl group, a 2-ethylpentyl group, an isobutyl group, an isobutyl group, an isopentyl group, Propylphenyl group, 3-ethylpentyl group, 3-methylpentyl group, 3-methylpentyl group, 3-methylpentyl group, 3-methylpentyl group, Methylheptyl group, 2-methylheptyl group, 3-methylheptyl group, 4-methylheptyl group, 5-methylheptyl group, 6-methylheptyl group, 1-ethylhexyl group, 2-methylheptyl group, Ethylhexyl group, 2-propylpentyl group, 1-butylbutyl group, 1-butyl-2-methylbutyl group, 1-butyl- Dimethylbutyl group, 1, 2-dimethylbutyl group, 1, 3-dimethylbutyl group, 2,3-dimethylbutyl group, 1-ethyl- Methylpropyl group, 1,1-dimethylpentyl group, 1,2-dimethylpentyl group, 1,3-dimethylpentyl group, 1,4-dimethylpentyl group, 2,2-dimethylpentyl group, T-butyl group, 2,4-dimethylpentyl group, 3,3-dimethylphen And the like group, a 3,4-dimethyl pentyl group, 1-ethyl-1-methylbutyl group, a branched-chain alkyl group such as 2-ethyl-3-methylbutyl group.

As R ^d , a hydrogen atom, a halogen atom and a methyl group are preferable.

Examples of the divalent aliphatic hydrocarbon group having 1 to 10 carbon atoms in X ^d include a methylene group, an ethylene group, a propane-1,3-diyl group, a propane-1,2-diyl group, Butane-1, 2-diyl group, pentane-1,5-diyl group, hexane-1,6-diyl group, heptane-1,7-diyl group, - an alkanediyl group such as a diaryl group.

Examples of the divalent alicyclic hydrocarbon group having 3 to 10 carbon atoms in X ^d include a cyclopropane diaryl group, a cyclobutane diaryl group, a cyclopentanediyl group, a cyclohexanediyl group, a cycloheptanediyl group, a cycloheptanediyl group, . Examples of the divalent aromatic hydrocarbon group having 6 to 12 carbon atoms in X ^d include a phenylene group and a naphthalenediyl group.

Examples of X ^d substituted with -CH ₂ - by -O-, -CO-, -NR ^e -, -S- or -SO ₂ - include, for example, groups represented by formulas (xd-1) to And the like.

As X ^d , an alkanediyl group having 1 to 6 carbon atoms is preferable, and an ethylene group is more preferable.

The resin B is preferably a resin containing a constituent unit derived from (d) and a constituent unit derived from (a), and the constituent unit derived from (d), the constituent unit derived from (a) ) Is more preferable. Since the resin B contains the constitutional unit derived from (a), the developing property tends to be suppressed because of the excellent developing property, resulting from residual or phenomenon. When the resin B contains a constituent unit derived from (b), the solvent resistance tends to be excellent. The resin B may contain a constituent unit derived from (c) and does not have an ethylenically unsaturated bond derived from (c). (a), (b) and (c) may be the same as those described above.

When the resin B is a copolymer of (a) and (d), it is preferable that the ratio of the constitutional unit derived from each monomer is in the following range with respect to the total molar number of the constitutional unit constituting the resin B.

(a); 5 to 40% by mass (more preferably 10 to 30% by mass)

(d); 60 to 95% by mass (more preferably 70 to 90% by mass)

In the case where the resin (B) is a copolymer of (a), (b) and (d), the ratio of the constituent unit derived from each monomer is preferably within the following range .

(a); 5 to 40% by mass (more preferably 10 to 30% by mass)

(b); 5 to 80% by mass (more preferably 10 to 70% by mass)

(d); 10 to 80% by mass (more preferably 20 to 70% by mass)

In the case where the resin B is a copolymer of (a), (b), (c) and (d), the proportion of the constitutional unit derived from each monomer is, Or less.

(a); 5 to 40% by mass (more preferably 10 to 30% by mass)

(b); 5 to 70% by mass (more preferably 10 to 60% by mass)

(c); 10 to 50% by mass (more preferably 20 to 40% by mass)

(d); 10 to 80% by mass (more preferably 20 to 70% by mass)

When the proportion of each constituent unit is in the above range, there is a tendency that the liquid repellency and developability are excellent.

The weight average molecular weight of the resin B in terms of polystyrene is preferably 3,000 to 20,000, more preferably 5,000 to 15,000. When the weight average molecular weight of the resin (A) is within the above range, the coating property tends to be excellent, the film thickness of the exposed portion is hardly reduced at the time of development, and the unexposed portion is liable to be removed from the development.

The acid value of the resin B is 20 to 200 mgKOH / g, preferably 40 to 150 mgKOH / g.

The content of the resin B is preferably 0.001 to 10 parts by mass, more preferably 0.01 to 5 parts by mass based on 100 parts by mass of the total amount of the resin A, the resin A1 and the polymerizable compound. When the content of the resin B is in the above range, the developability at the time of pattern formation is excellent, and the obtained pattern tends to have excellent lyophobicity.

The photosensitive resin composition may contain the resin A1. As the resin A1,

Resin A1-1: Copolymer obtained by polymerizing (a) and (c)

Resin A1-2: A resin obtained by reacting (b) a copolymer obtained by polymerizing (a) and (c)

Resin A1-3: resins obtained by reacting (a) a copolymer obtained by polymerizing (b) and (c).

The content of the resin A1 is preferably 0 to 80% by mass, more preferably 0 to 50% by mass, based on the total amount of the resin A and the resin A1. When the content of the resin A1 is in the above range, the pattern can be formed with high sensitivity and the developing property is excellent.

The photosensitive resin composition includes a polymerizable compound.

The polymerizable compound is a compound that can be polymerized by an active radical generated from a polymerization initiator, such as a compound having an ethylenically unsaturated bond, and is preferably a (meth) acrylic acid ester compound.

The polymerizable compound having one ethylenically unsaturated bond may be the same as the compound exemplified above as (a), (b) and (c), and among them, (meth) acrylic acid ester is preferable.

Examples of the polymerizable compound having two ethylenic unsaturated bonds include 1,3-butanediol di (meth) acrylate, 1,3-butanediol (meth) acrylate, 1,6-hexanediol di (meth) (Meth) acrylate, diethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (Meth) acrylate, ethoxylated bisphenol A di (meth) acrylate, propoxylated neopentyl glycol di (meth) acrylate, ethoxylated neopentyl glycol di (meth) acrylate, bis (acryloyloxyethyl) ether of bisphenol A, Acrylate, 3-methylpentanediol di (meth) acrylate, and the like.

Examples of the polymerizable compound having three or more ethylenic unsaturated bonds include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tri (meth) (Meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated trimethylol propane tri (Meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol hepta (Meth) acrylate, pentaerythritol tri (meth) acrylate and acid anhydride, di (Meth) acrylate and caprolactone-modified trimethylolpropane tri (meth) acrylate, caprolactone-modified pentaerythritol tri (meth) acrylate and acid anhydride, Acrylate, caprolactone-modified pentaerythritol tetra (meth) acrylate, caprolactone-modified dipentaerythritol penta (meth) acrylate, caprolactone modified tris (2-hydroxyethyl) isocyanurate tri Acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate, caprolactone-modified tripentaerythritol tetra (meth) acrylate, caprolactone-modified tripentaerythritol penta (meth) acrylate, caprolactone- (Meth) acrylate, caprolactone-modified tripentaerythritol hepta (meth) acrylate, (Meth) acrylate, caprolactone-modified pentaerythritol tri (meth) acrylate and acid anhydride, caprolactone-modified dipentaerythritol penta (meth) acrylate and acid anhydride , Caprolactone-modified tripentaerythritol hepta (meth) acrylate, acid anhydride, and the like. Among them, a photopolymerizable compound (C) having three or more functionalities is preferable, and dipentaerythritol hexa (meth) acrylate is more preferable.

The content of the polymerizable compound is preferably 5 to 95% by mass, more preferably 20 to 80% by mass, based on the total amount of the resin A, the resin A1 and the polymerizable compound. When the content of the polymerizable compound is within the above range, the sensitivity and the strength, smoothness and reliability of the obtained pattern tend to be improved.

The photosensitive resin composition includes a polymerization initiator. The polymerization initiator is not limited as far as it is a compound capable of initiating polymerization by the action of light or heat, and a known polymerization initiator can be used. As the polymerization initiator, a radical polymerization initiator is preferable.

Examples of the polymerization initiator include alkylphenone compounds, imidazole compounds, triazine compounds, acylphosphine oxide compounds and oxime compounds. Further, the light and / or thermal cationic polymerization initiator disclosed in Japanese Patent Laid-Open No. 2008-181087 (for example, one comprising an onium cation and an anion derived from a Lewis acid) can be used. Among them, at least one selected from the group consisting of a nonimidazole compound, an alkylphenone compound and an oxime ester compound is preferable, and an oxime ester compound is particularly preferable. A polymerization initiator containing these compounds is particularly preferable because it tends to have a high sensitivity.

In the photosensitive resin composition, a polymerization initiator may be used together with the above-mentioned polymerization initiator. The polymerization initiator is used in combination with a polymerization initiator and is a compound or a sensitizer used for promoting polymerization of the polymerizable compound initiated by polymerization initiator. Examples of the polymerization initiator include a thioxanthone compound, an amine compound, and a carboxylic acid compound.

Examples of the combination of the polymerization initiator and the polymerization initiator include acetophenone compounds, thioxanthone compounds, acetophenone compounds and aromatic amine compounds. Specific examples thereof include 2-morpholino-1- (4- 2-benzyl-1- (4-morpholinophenyl) butan-1-one with 2,4-diethyl thioxanthone and 2-dimethylamino- Diethyl thioxanthone, 2-dimethylamino-2- (4-methylbenzyl) -1- (4-morpholinophenyl) butan- 2-methylpropan-1-one, 2-isopropylthioxanthone and 4-isopropylthioxanthone, 2-morpholino-1- (4 Methylphenyl) -2-methylpropan-1-one and 4,4'-bis (diethylamino) benzophenone, 2-dimethylamino- (4-methylphenyl) butan-1-one and 4, 4'-bis (diethylamino) benzophenone, 2-dimethylamino- ,4'- Switch and the like (diethylamino) benzophenone.

The content of the polymerization initiator is preferably 0.5 to 30 parts by mass, more preferably 1 to 20 parts by mass, and still more preferably 1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the resin A, the resin A1 and the polymerizable compound Wealth. When the content of the polymerization initiator is in the above range, a pattern with high sensitivity can be obtained.

The amount of the polymerization initiator to be used is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 7 parts by mass, based on 100 parts by mass of the total amount of the resin A, the resin A1 and the polymerizable compound. When the amount of the polymerization initiator is within the above range, a pattern can be obtained with high sensitivity, and the shape of the obtained pattern is favorable.

The photosensitive resin composition includes a solvent.

As the solvent, for example, an ester solvent (a solvent containing -COO- in the molecule and containing no -O-), an ether solvent (a solvent containing -O- in the molecule and containing -COO-) Ether ester solvents (solvents containing -COO- and -O- in the molecule), ketone solvents (solvents containing -CO- in the molecule and not containing -COO-), alcohol solvents, aromatic hydrocarbon solvents, amide solvents , Dimethylsulfoxide, and the like.

The content of the solvent in the photosensitive resin composition is preferably 60 to 95% by mass, and more preferably 70 to 90% by mass, based on the total amount of the photosensitive resin composition. In other words, the content of the solid content of the photosensitive resin composition is preferably 5 to 40% by mass, and more preferably 10 to 30% by mass. When the content of the solvent is within the above range, the flatness of the film coated with the photosensitive resin composition tends to be high. Here, the solid content refers to a component of the components of the photosensitive resin composition excluding the solvent.

The polyfunctional thiol compound that can be contained in the photosensitive resin composition means a compound having two or more sulfanyl groups (-SH) in the molecule. In particular, when a compound having two or more sulfanyl groups bonded to carbon atoms derived from an aliphatic hydrocarbon group is used, the sensitivity of the photosensitive resin composition tends to be high.

Specific examples of the polyfunctional thiol compound include hexane dithiol, decanediol, 1,4-bis (methylsulfanyl) benzene, butanediol bis (3-sulfanylpropionate), butanediol bis ), Trimethylolpropane tris (3-sulfanyl acetate), butanediol bis (3-sulfanyl propionate), trimethylolpropane tris (3-sulfanyl propionate) , Pentaerythritol tetrakis (3-sulfanyl acetate), pentaerythritol tetrakis (3-sulfanyl propionate), pentaerythritol tetrakis (3-sulfanyl acetate), trishydroxyethyl tris (3-sulfanylbutylate), 1,4-bis (3-sulfanylbutyloxy) butane, and the like.

The content of the polyfunctional thiol compound is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 7 parts by mass, based on 100 parts by mass of the polymerization initiator. When the content of the polyfunctional thiol compound is within the above range, the sensitivity of the photosensitive resin composition is high and the developing property tends to be good, which is preferable.

The photosensitive resin composition may contain a surfactant (however, different from the resin B). As the surfactant, for example, a silicone surfactant, a fluorinated surfactant, and a silicon surfactant having a fluorine atom can be given.

As the silicone surfactant, a surfactant having a siloxane bond can be mentioned. Specific examples thereof include TORAY Silicon DC3PA, Copper SH7PA, Copper DC11PA, Copper SH21PA, Copper SH28PA, Copper SH29PA, Copper SH30PA, Polyether Modified Silicone Oil SH8400 (trade name: manufactured by Toray / Dow Corning Co., Ltd.), KP321, KP322, KP323 , KP324, KP340, KP341 (manufactured by Shinetsu Kagaku Kogyo K.K.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452, TSF4460 (Momentive Performance Materials, And the like.

Further, the photosensitive resin composition may contain an adhesion-promoting agent. An example of the adhesion-improving agent is a silane coupling agent.

In the substrate 10 having the above-described banks, the bank 14 satisfies < Condition 1 >. That is, the contact angle of the anisole on the upper surface 14d of the bank 14 is 35 degrees or more. Thereby, when the organic layer (for example, the hole injection layer 24 and the light emitting layer 26) is formed in the concave portion 16, the influence of the pixel size (the size of the concave portion 16) It is possible to secure a desired thickness in the layer. For example, when forming the light emitting layer 26 or the like which requires a thick thickness at an angle of contact of less than 35 deg. (More specifically, 30 deg.) Or less, the material to be the light emitting layer 26 Ink may flow out of the concave portion 16 to be formed, and a necessary thickness may not be obtained. On the other hand, if the contact angle of the anisole is 35 DEG or more, it is possible to obtain a desired thickness as described above.

The organic layer pinning position P is formed in the bank 14 when the organic EL element is manufactured by forming the organic layer by the coating method on the concave portion 16 partitioned by the bank 14 provided in the substrate 10 having the banks. As shown in FIG. Therefore, when the organic EL element is fabricated in the concave portion 16, leakage of electric current is difficult to occur.

The bank 14 satisfies < Condition 2 >. That is, as described using FIG. 5, D1 / T1 satisfies 0 <D1 / T1? 2.0. Thereby, when the organic EL element is manufactured by forming the organic layer by the coating method in the concave portion 16 of the substrate 10 having the banks, the organic layer pinning position P is smaller than the thickness (height) of the bank 14 Is a short distance from the end 14a of the bank 14. As a result, relative to the height of the bank 14, the organic layer pinning position P is relatively low. In this case, since the solid content in the ink dried on the side surface 14b of the bank 14 decreases, the thickness of the organic layer becomes thinner and the uniformity of the thickness of the organic layer in the pixel is improved. Further, since the organic layer pinning position P is relatively lower than the height of the bank 14, the amount of ink filled in the pixel (concave portion 16) is reduced, and the material use efficiency for obtaining the thickness required for manufacturing the element is improved . In addition, by satisfying the above <Condition 2>, it is possible to secure a certain height of the bank 14 while realizing the uniformity of the thickness of the organic layer. If the height of the bank 14 is low, the liquid repellency due to the liquid repellent agent is difficult to manifest. However, by satisfying the <Condition 2>, a certain amount of the height of the bank 14 can be secured. It is possible to reliably maintain the ink for forming the organic layer in the concave portion 16 more reliably when the organic layer is formed in the concave portion 16 by the coating method It is possible.

For example, as shown in Fig. 5, assuming that the thickness of the thinnest portion of the organic layer in the concave portion 16 is a reference thickness d, the area having a thickness of (d + 10) nm or less is A _L1 , When the opening area of the portion 16 is represented by A _L2 and the uniformity of the thickness of the organic layer is represented by?, The value of? Can be defined by the following equation (1) and evaluated.

The opening area of the concave portion 16 is the area of a region surrounded by the end portion 14a of the bank 14 in the surface 12a of the substrate 12. [

For example, when one droplet ink amount is Q, the liquid droplet number is N, and the ink filling amount in the pixel (concave portion 16) is β, β is defined by the following formula (2) Can be evaluated.

A _L2 in the formula (2) is the opening area of the concave portion 16 described above.

The bank 14 may be formed so as to satisfy <condition 1> and <condition 2>. In the case of forming the organic layer to be the organic EL element in the concave portion 16, it is preferable that the organic layer pinning position P is made lower in view of reducing the thick film portion (the portion near the organic layer pinning position P) of the organic layer .

In the case of forming the organic layer to be the organic EL element in the concave portion 16, it is preferable that the filling amount of the ink (coating liquid) containing the organic material to be the organic layer is small to secure the flatness of the organic layer. This is because the thick film portion of the organic layer decreases.

Since the bank 14 has a net taper shape, the side surface 14b and the top surface 14d form an obtuse angle. Therefore, when the organic EL element is formed on the substrate 10 having the bank, the electrode 28 is hard to break.

In the case where the bank 14 is a cured product of a photosensitive resin composition containing a liquid repellent agent and the liquid repellent agent contains a fluorine resin, the bank 14 can be formed by photolithography as illustrated. At this time, the liquid repellent agent is distributed in the surface layer portion in the step of prebaking the thin film 32 shown in Fig. Therefore, when the bank 14 is formed of the thin film 32, the upper surface 14d side of the bank 14 tends to have liquid repellency. Therefore, when the organic layer is formed in the concave portion 16 by the coating method, the ink (coating liquid) can be held in the concave portion 16 more reliably. Further, by regulating the composition ratio of the liquid repellent agent, the region having lyophobicity can be adjusted in the bank 14, so that the organic layer pinning position P can be adjusted. Therefore, in the form in which the bank 14 is a cured product of a photosensitive resin composition containing a liquid repellent agent and the liquid repellent agent contains a fluorine resin, the bank 14 that satisfies <Condition 1> and <Condition 2> is formed easy to do.

Then, by satisfying <condition 1> and <condition 2>, the uniformity of the thickness of the organic layer can be achieved in the case of forming the organic layer in the partition defined by the bank of the bank having the bank Will be described in detail with reference to examples. In the following description, the substrate corresponding to the substrate 12 described above is called a &quot; supporting substrate &quot; in order to distinguish the substrate having the bank from the substrate having the bank.

(Synthesis Example 1)

In a flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was purged with an appropriate amount of nitrogen, and 166 parts by mass of propylene glycol monomethyl ether acetate and 52 parts by mass of methoxypropanol were added and heated to 85 deg. 233 parts by mass of a mixture of 3,4-epoxytricyclo [5.2.1.0 ^2,6 ] decane-8 and 9-yl acrylate, 77 parts by mass of p-vinylbenzoic acid, 125 parts by mass of propylene glycol monomethyl ether acetate, And 115 parts by mass of methoxypropanol was added dropwise to the flask over 4 hours. On the other hand, a mixed solution obtained by dissolving 32 parts by mass of 2,2-azobis (2,4-dimethylvaleronitrile) in 210 parts by mass of propylene glycol monomethyl ether acetate was dropped into the flask over 5 hours. After the completion of the dropwise addition, the mixture was kept at the same temperature for 3 hours and then cooled to room temperature to obtain a polymer (resin A _I ) solution having a B-type viscosity (23 캜) of 46 mPa 쨌 s, a solid content of 33.7% by mass and a solution acid value of 83 mgKOH / g &Lt; / RTI &gt; The resin A _{I thus} obtained had a weight average molecular weight Mw of 7.7 x 10 ³ and a molecular weight distribution (weight average molecular weight (Mw) / number average molecular weight (Mn)) of 1.90. Resin A _I has the following constitutional units.

(Synthesis Example 2)

A four-necked flask equipped with a reflux condenser, a nitrogen inlet tube, a thermometer and a stirrer was charged with 78 parts by mass of 3,3,4,4,5,5,6,6,6-nonafluorohexyl α-chloroacrylate, 19.5 parts by mass of isobornyl methacrylate, 13 parts by mass of glycidyl methacrylate, 12.7 parts by mass of dodecane thiol, and 266 parts by mass of propylene glycol monomethyl ether acetate were charged, And stirred under a nitrogen stream for 30 minutes. 1 part by mass of azobisisobutyronitrile was added thereto, followed by polymerization for 18 hours to obtain a solution of a polymer (resin Ba) having a solid content of 33% by mass and an acid value of 68 mgKOH / g (in terms of solid content). The weight average molecular weight of the obtained resin Ba was 7,500. Resin Ba has the following constitutional units.

(Example 1)

The photosensitive resin composition used in Example 1 will be described. Resin A in Example 1 is referred to as resin A _I. In Example 1, a photosensitive resin composition I containing a resin A _I , a polymerizable compound, a polymerization initiator, a polymerization initiator, an adhesion promoter, and a liquid repellent agent and adjusted to have a solid concentration of 21% by a solvent was prepared.

As the resin A _I , the resin synthesized in Synthesis Example 1 was used. Trimethylolpropane triacrylate (A-TMPT; manufactured by Shin Nakamura Kagaku Kogyo Co., Ltd.) was used as the polymerizable compound. Methyl-2-morpholino-1- (4-methylsulfanylphenyl) propan-1-one (Irgacure (registered trademark) 907; BASF) was used as the polymerization initiator. 4,4'-bis (diethylamino) benzophenone (EAB-F; manufactured by Hodogaya Chemical Industry Co., Ltd.) was used as a polymerization initiator. A silane coupling agent KBM-573 (manufactured by Shin-Etsu Silicone Co., Ltd.) was used as the adhesion enhancing agent. The resin obtained in Synthesis Example 2 was used as the liquid repellent agent. Propylene glycol monomethyl ether acetate was used as a solvent.

The content of each component in the photosensitive resin composition I was as follows.

Resin A _I : 44.4 parts by mass

Polymerizable compound: 44.4 parts by mass

Polymerization initiator: 5.4 parts by mass

Polymerization initiator: 5.4 parts by mass

Adhesion improving agent: 0.4 parts by mass

Liquid repellent agent (resin Ba): 0.15 mass%

The solid content is a remaining amount of the photosensitive resin composition I other than the solvent.

Next, the supporting substrate used in Example 1 will be described. In Example 1, a quadrangular glass substrate (Eagle XG, manufactured by Corning) having a 2-inch side on which an ITO film was deposited was used as a supporting substrate. The ITO film corresponds to the electrode, and the glass substrate corresponds to the substrate main body. In the supporting substrate used in Example 1, an ITO film as an electrode was formed on the entire surface of the glass substrate.

Using the support substrate and the photosensitive resin composition I, a substrate having banks was produced as follows.

The support substrate was sequentially washed with a neutral detergent, water and 2-propanol, and then dried. The photosensitive resin composition I was spin-coated on the support substrate and subjected to vacuum drying (vacuum drying) with a reduced pressure dryer (Microtech Corporation) until the degree of vacuum (degree of vacuum) reached 66 kPa, Prebaked at 90 캜 for 110 seconds and dried to form a thin film (coating film). After cooling, an exposure amount of 200 mJ / cm 2 was formed in an atmosphere at an interval of 100 m between the support substrate on which the thin film was formed and the quartz glass photomask using an exposure machine (TME-150RSK; light source, ultra-high pressure mercury lamp, Lt; 2 &gt; (based on 365 nm). As the photomask, a pattern (a shape in which the shape of the light-shielding portion was cut from a rectangle having a length of 300 mu m in the major axis direction and 100 mu m in the minor axis direction into a circle in a circular shape) was formed on the same plane.

After light irradiation, the thin film was immersed in a developing solution prepared by diluting an aqueous solution of tetramethylammonium hydroxide (TOKUSO SD25, manufactured by TOKUSHIMA CO., LTD.) To a concentration of 2.38% while shaking the thin film at 23 DEG C for 60 seconds Then, after rinsed with water, cure baking was performed in an oven at 230 캜 for 20 minutes to form a bank having a concave portion corresponding to the pattern of the photomask, thereby obtaining a substrate having banks.

In the substrate having the bank, the top surface (the surface opposite to the substrate) of the banks other than the recesses was regarded as the top of the bank, and anisole was dropped on the top surface of the bank, and the contact angle of the anisole was measured. The measurement was carried out with an LCD-700S automatic liquid crystal glass washing / processing inspection apparatus manufactured by Kyowa Geigenkagaku Kogyo Co., Ltd. using a θ / 2 method in a software name FAMAS with a droplet size of 1.0 μm. The contact angle of anisole was 40 °.

Subsequently, an organic layer was formed on the concave portion formed by the banks of the substrate having the banks, as follows.

First, an ink was prepared by mixing an organic solvent and a hole injecting material such that the solid concentration was 1.0 mass%, the viscosity was 8 cp (8 mPa.s), and the surface tension was 34.7 mN / m. This ink was applied to each concave portion using an inkjet apparatus (Litlex 142P manufactured by ULVAC).

The ink applied to each concave portion is repelled by the upper surface of the bank, so that the ink is prevented from overflowing from the concave portion, and is accommodated in the concave portion.

Was then placed in a vacuum drying chamber in the dry pump is connected and loading a substrate having a bank in a temperature controlled stage, and the temperature of that temperature control in the stage 10 ℃ and pressure to about 2.0 × 10 ^-1 ㎩, vacuum drying . Subsequently, the temperature of the temperature control stage was set at 230 DEG C and firing was performed for 15 minutes in an atmospheric pressure environment to form an organic layer (thickness: 45 nm) as a hole injection layer having a uniform thickness. Here, the thickness is the thickness of the center of the concave portion and means the thinnest portion.

The substrate having the bank in which the organic layer was formed as the hole injection layer as described above was thin-film processed in an FIB apparatus (XVision 20DB, manufactured by Seiko Instruments Inc.) so as to include recesses and observed by SEM to calculate D1 / T1. The calculated D1 / T1 was 0.33. The filling amount of the organic layer in the concave portion was 0.27 L / cm &lt; 2 &gt;. The uniformity of the thickness of the organic layer formed in the concave portion was 80%. The uniformity was defined as? Expressed by the above-mentioned equation (1). The charge amount is defined as? Represented by the above-described formula (2).

(Synthesis Example 3)

80 parts by mass of poly p-vinylphenol (weight average molecular weight: 6,000) and 20 parts by mass of novolak resin (weight average molecular weight: 4,000) 20 obtained by dehydration condensation of formaldehyde at an addition ratio of m-cresol / p- To obtain an alkali-soluble resin A _II containing a part by mass.

Next, Comparative Examples 1 and 2 will be described.

(Comparative Example 1)

The photosensitive resin composition used in Comparative Example 1 will be described. Resin A in Comparative Example 1 is referred to as Resin A _II . In Comparative Example 1, a photosensitive resin composition I comprising a resin A _II , a crosslinking agent, an acid generator, a polymerization initiator, and a liquid repellent agent and adjusted to have a solid concentration of 18% by a solvent was prepared.

As the resin A _II , the alkali-soluble resin synthesized in Synthesis Example 3 was used. As the crosslinking agent, a melamine resin crosslinking agent (Cymel 300 manufactured by Mitsui Scent Co., Ltd.) was used. A triazine-based acid generator (TAZ106, manufactured by Midori Kagaku Co., Ltd.) was used as the acid generator. The same polymerization initiator as that used in Example 1 was used for the polymerization initiation aid, the liquid repellent agent and the solvent.

In the photosensitive resin composition II, the composition ratios (mass%) of the respective components when the total amount of the resin A _II , the crosslinking agent, the acid generator, and the polymerization initiator were 100 parts by mass, were as follows.

Resin A _II : 82 mass%

Crosslinking agent: 16.5 mass%

Acid generator: 1.0 mass%

Polymerization initiator: 0.5% by mass

Liquid detergent: 0.2 mass%

In Comparative Example 1, a substrate having banks was prepared in the same manner as in Example 1, except that the same substrate as in Example 1 was used and a photosensitive resin composition II was used in place of the photosensitive resin composition I.

The anisole contact angle on the upper surface of the bank was measured in the same manner as in Example 1 and found to be 37 °.

Then, in the same manner as in Example 1, an organic layer as a hole injecting layer was formed in a recess, which is a partition defined by banks, in a substrate having banks. At this time, the droplet number of droplets (N in the equation (2)) was adjusted so that the thickness of the organic layer in the center of the concave portion in the plane viewed from the plane of the supporting substrate Respectively. The substrate having the organic layer having the bank was observed by SEM in the same manner as in Example 1 to calculate D1 / T1. Further, the charged amount of the organic layer in the concave portion was calculated, and the uniformity was calculated. As a result, D1 / T1 was 16.98, the charged amount was 0.35 L / cm2, and the uniformity was 42%.

(Synthesis Example 4)

70 parts by mass of poly p-vinylphenol (weight average molecular weight: 6,000) and novolak resin (weight average molecular weight: 4,000) 30 obtained by dehydration condensation of formaldehyde at an addition ratio of m-cresol / p- To obtain an alkali-soluble resin containing a part by mass.

(Comparative Example 2)

The photosensitive resin composition used in Comparative Example 2 will be described. Resin A in Comparative Example 2 is referred to as Resin A _III . In Comparative Example 2, a photosensitive resin composition III containing a resin A _III , a crosslinking agent, an acid generator, a polymerization initiator auxiliary, and a liquid repellent agent and adjusted to have a solid concentration of 18% by a solvent was prepared.

As the resin A _III , the alkali-soluble resin synthesized in Synthesis Example 4 was used. The same components as those of Comparative Example 1 were used for the crosslinking agent, acid generator, polymerization initiator aid, liquid repellent agent and solvent.

The composition ratios (mass%) of the respective components when the total amount of the resin A _III , the crosslinking agent, the acid generator and the polymerization initiation auxiliary in the photosensitive resin composition III was 100 parts by mass, were as follows.

Resin A _III : 78.8 mass%

Crosslinking agent: 19.7 mass%

Acid generator: 1.1 mass%

Polymerization initiator: 0.4 mass%

Liquid detergent: 0.2 mass%

In Comparative Example 2, a substrate having banks was manufactured in the same manner as in Example 1 except that the same substrate as in Example 1 was used and a photosensitive resin composition III was used in place of the photosensitive resin composition I.

The anisole contact angle on the upper surface of the bank was measured in the same manner as in Example 1, and found to be 45 degrees.

Then, in the same manner as in Example 1, an organic layer as a hole injecting layer was formed in a recess, which is a partition defined by banks, in a substrate having banks. At this time, the droplet number of droplets (N in the equation (2)) was adjusted so that the thickness of the organic layer in the center of the concave portion in the plane viewed from the plane of the supporting substrate Respectively. The substrate having the organic layer having the bank was observed by SEM in the same manner as in Example 1 to calculate D1 / T1. Further, the charged amount of the organic layer in the concave portion was calculated, and the uniformity was calculated. As a result, D1 / T1 was 4.54, the charged amount was 0.45 L / cm2, and the uniformity was 55%.

(Comparison of effects)

Table 1 shows the results of the anisole contact angle, D1 / T1, charge amount, and uniformity in Example 1 and Comparative Examples 1 and 2.

As shown in Table 1, in Example 1, the charged amount was reduced as compared with Comparative Examples 1 and 2. Therefore, the efficiency of using the material in forming the organic layer is improved. In Example 1, the uniformity of the thickness of the organic layer was improved as compared with Comparative Examples 1 and 2.

Therefore, when the organic layer is formed in the partition defined by the banks of the substrate having the banks, by satisfying the conditions <condition 1> and <condition 2>, the efficiency of using the material of the organic layer is improved Together, uniformity of the thickness of the organic layer is achieved.

While various embodiments and examples of the present invention have been described above, the present invention is not limited to the embodiments and examples described above.

The bank 14 may be formed so as to satisfy <Condition 1> and <Condition 2> and to be able to form a predetermined division (concave portion 16). The material of the bank 14 may be any material that can satisfy <Condition 1> and <Condition 2>.

However, the bank may be a bank having a shape in which the angle? 1 formed by the side surface of the bank facing the recess (section) and the bottom surface of the bank is a right angle, or a bank having a shape in which the angle? 1 is an obtuse angle Shape (reverse tapered shape).

An example of the configuration of the organic EL device is described with reference to Fig. 3. However, the configuration of the organic EL device is not limited to the configuration shown in Fig. The organic EL element may have a first electrode and a second electrode, which are a pair of electrodes, and a light emitting layer as an organic layer disposed therebetween. In addition to the light emitting layer, for example, the illustrated hole injecting layer, the hole transporting layer, the electron blocking layer, the hole blocking layer, the electron transporting layer, and the electron injecting layer may be provided between the pair of electrodes. The electron blocking layer is a layer having a function of blocking electrons, and the hole blocking layer is a layer having a function of blocking the transport of holes. The hole transporting layer, the electron transporting layer and the electron injecting layer will be described later.

An example of the layer configuration that can be taken by the organic EL device of the present embodiment is shown below.

(Configuration Example 1) anode / light emitting layer / cathode

(Configuration Example 2) anode / hole injection layer / light emitting layer / cathode

(Configuration Example 3) anode / hole injection layer / light emitting layer / electron injection layer / cathode

(Configuration 4) anode / hole injecting layer / light emitting layer / electron transporting layer / electron injecting layer / cathode

(Configuration Example 5) anode / hole injecting layer / hole transporting layer / light emitting layer / cathode

(Configuration 6) anode / hole injecting layer / hole transporting layer / light emitting layer / electron injecting layer / cathode

(Configuration 7) anode / hole injecting layer / hole transporting layer / light emitting layer / electron transporting layer / electron injecting layer / cathode

(Configuration 8) anode / light emitting layer / electron injection layer / cathode

(Configuration 9) anode / light emitting layer / electron transporting layer / electron injecting layer / cathode

(Here, the symbol &quot; / &quot; indicates that the layers sandwiching the symbol &quot; / &quot; are laminated adjacent to each other.

The organic EL device of the above-described configuration can take the form of laminating each layer in order from the anode and finally forming the cathode, and conversely, laminating each layer in order from the cathode and finally forming the anode. The configuration example 2 of the above configuration example corresponds to the configuration shown in Fig. Since the anode, the cathode, the hole injection layer, and the light emitting layer have already been described, the description of the hole transport layer, the electron transport layer, and the electron injection layer will be omitted.

The hole transport layer is a layer having a function of improving hole injection from the hole transport layer closer to the anode, the hole injection layer or the anode to the light emitting layer. A well-known hole transporting material can be used for the hole transporting layer. The hole transporting layer may be formed by a coating method like the hole injecting layer. In the case where the hole injecting layer and / or the hole transporting layer have a function of blocking electrons from being transported, these layers sometimes serve as an electron blocking layer.

The electron transporting layer is a layer having a function of improving electron injection from the electron transporting layer close to the cathode, the electron injection layer or the cathode. A known electron transporting material can be used for the electron transporting layer. The electron injection layer is a layer having a function of improving electron injection efficiency from the cathode to the light emitting layer. A known electron injecting material can be used for the electron injecting layer. The electron transporting layer and the electron injecting layer may be formed by a coating method in the same manner as the hole injecting layer. When the electron injecting layer and / or the electron transporting layer has a function of blocking the transport of holes, this layer may also serve as the hole blocking layer.

10: substrate with banks
12: substrate
12a: surface (surface of substrate)
14: Bank
14a: end (bank end)
14b: side
14c:
14d: upper surface
16: concave portion (compartment)
20: Electrode
24: Hole injection layer (organic layer)

Claims (6)

A substrate;
A bank of a single-layer structure provided on the substrate and partitioning a predetermined section on the substrate,
And,
The contact angle of the anisole on the upper surface of the bank located on the side opposite to the bottom surface of the substrate is 35 ° or more,
The distance from the side face facing the partition in the bank to the organic layer pinning position from the bank end defined by the bottom face is D1 and the thickness of the bank is T1 , &Lt; / RTI &
D1 / T1 satisfies 0 &lt; D1 / T1 &lt; / = 2.0,
Wherein the organic layer pinning position is a position of an end portion near the upper surface at an interface between the organic layer and the bank when one layer of the organic layer is formed in the partition,
A substrate having a bank. The apparatus of claim 1, wherein an angle defined by the bottom surface and the side surface of the bank is less than 90 [
A substrate having a bank. The method according to claim 1 or 2, wherein the bank is a cured product of a photosensitive resin composition comprising a liquid repellent agent,
A substrate having a bank. The liquid repellent agent according to claim 3, wherein the liquid repellent agent comprises a fluorocarbon resin,
A substrate having a bank. The photosensitive resin composition according to claim 3 or 4, wherein the composition ratio of the liquid repellent agent to the solid content contained in the photosensitive resin composition is less than 0.2 mass%
A substrate having a bank. The organic electroluminescent device according to any one of claims 1 to 5, wherein the organic layer pinning position is a position of an end portion near the upper surface at the interface when the hole injection layer is formed as the organic layer by a coating method,
A substrate having a bank.

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