KR20170014800A - Apparatus for Injecting Gas - Google Patents

Apparatus for Injecting Gas Download PDF

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Publication number
KR20170014800A
KR20170014800A KR1020150108699A KR20150108699A KR20170014800A KR 20170014800 A KR20170014800 A KR 20170014800A KR 1020150108699 A KR1020150108699 A KR 1020150108699A KR 20150108699 A KR20150108699 A KR 20150108699A KR 20170014800 A KR20170014800 A KR 20170014800A
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South Korea
Prior art keywords
gas
injection
inclined surface
central axis
passage
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KR1020150108699A
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Korean (ko)
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KR101755031B1 (en
Inventor
한찬희
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(주)나린테크
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Priority to KR1020150108699A priority Critical patent/KR101755031B1/en
Publication of KR20170014800A publication Critical patent/KR20170014800A/en
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Publication of KR101755031B1 publication Critical patent/KR101755031B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Treating Waste Gases (AREA)

Abstract

The present invention relates to a gas injection device which is located between exhaust pipes and forms a waste gas passage together with the exhaust pipe. The gas injection device forms a passage opening to one side and the other side in the direction of the central axis and has a predetermined thickness in a direction perpendicular to the direction of the center axis And a second inclined surface inclined from the first inclined surface in the direction of the inner circumferential surface of the injection body, and a second inclined surface inclined from the first inclined surface in the direction of the inner circumferential surface of the injection body. A gas buffer passage formed adjacent to the first inclined surface and penetrating from the gas buffer passage to the first inclined surface and formed to have a ring shape around the central axis within the body, And at least one injection nozzle formed in a hole shape for spraying a gas It discloses a.

Description

[0001] Apparatus for Injecting Gas [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas injection device installed in an exhaust pipe for exhausting waste gas used in a semiconductor manufacturing process equipment or a flat panel display manufacturing process equipment.

Semiconductor manufacturing process equipment or flat panel display manufacturing process equipment exhausts used waste gas through exhaust piping to the outside. The waste gas includes water vapor and various corrosive gases, and reacts or condenses inside the exhaust pipe while passing through the exhaust pipe, thereby blocking the pipe or corroding the pipe. Therefore, the exhaust pipe is equipped with a gas injection device for injecting a separate injection gas into the inside of the exhaust pipe.

In the conventional gas injection apparatus, a bottleneck-shaped venturi tube is formed in a passage through which waste gas flows, and a high-pressure nitrogen gas is injected into the venturi tube to form a vacuum at the front end of the venturi tube, thereby lowering the exhaust pressure, . However, the conventional gas injection apparatus has a problem that the flow of the waste gas is disturbed because the injection pipe for injecting the nitrogen gas is located in the passage to form the bottleneck structure. More specifically, in the conventional gas injection apparatus, when the amount of waste gas and reaction byproduct is large, a vortex is generated due to the bottleneck structure, and the waste gas flows backward or the piping is clogged due to reaction byproducts. In addition, in the conventional gas injection apparatus, the waste gas rapidly expands through the venturi tube, and the flow velocity is lowered, so that the flow of the waste gas becomes unstable and is not smooth.

In addition, since the conventional gas injection apparatus can not form a vacuum like the ejector, it is difficult to lower the exhaust pressure of the vacuum pump, and it is difficult to smoothly transfer reaction by-products.

The present invention provides a gas injection device capable of smoothly flowing a waste gas and minimizing accumulation of reaction byproducts in the waste gas passage.

Further, the present invention provides a gas injection device capable of reducing the exhaust pressure of a vacuum pump to reduce the power consumption of the vacuum pump.

The gas injection device according to the present invention is a gas injection device which is located between exhaust pipes and forms an exhaust gas passage together with the exhaust pipe. The gas injection device forms a passage opening to one side and the other side in the direction of the central axis, And a second inclined surface inclined from the first inclined surface in the direction of the inner circumferential surface of the injection body, and a second inclined surface inclined from the first inclined surface in the direction of the inner circumferential surface of the injection body. A gas buffer passage formed adjacent to the first inclined surface, and a through hole formed through the gas buffer passage to pass through the first inclined surface, the ring- And at least one spray nozzle for spraying the spray gas in the direction of the second inclined surface .

The injection guide groove may have a ring shape about the central axis and may be formed to be opened in the central axis direction.

The first inclination angle formed by the first inclined surface with the central axis may be larger than the second inclined angle formed between the second inclined surface and the central axis. Further, the gas buffer passage may be located at a position lower than the vertical height of the first inclined surface.

The plurality of through holes may be connected to each other to form a through-hole. The injection nozzle may be formed in a direction parallel to the central axis or in a direction parallel to the second inclined surface.

In addition, the gas injection device may further include a gas supply pipe connected to the gas buffer passage to supply the injection gas.

The gas injection device may include at least two injection guide grooves, a gas buffer passage, and an injection nozzle spaced apart from each other in the central axis direction.

The gas injection device may include a heater insertion hole, a gas inlet hole, and a gas outlet hole. The gas injection hole may be formed in the inner space through the gas outlet hole, A heater housing for supplying the gas to the gas buffer passage, and heating means having at least one heater unit, which is formed of a heating body, located in the inner space of the heater housing, and a power supply line for supplying power to the heater unit . At this time, the gas outlet hole of the heater housing may be connected to the gas supply hole of the gas buffer passage through a separate gas supply pipe. Further, the gas outlet hole of the heater housing may be directly connected to the gas supply hole of the gas buffer passage.

The gas injection device of the present invention has the effect of preventing the formation of a bottleneck structure in the waste gas passage because the injection gas is injected directly from the inner circumferential surface of the injection body forming the waste gas passage to smooth the flow of the waste gas and prevent the accumulation of reaction by- .

Further, the gas injection device of the present invention has an effect of reducing the exhaust pressure of the vacuum pump by reducing the suction force formed in the waste gas passage, thereby reducing the power consumption of the vacuum pump.

Further, the gas injection device of the present invention has an effect of increasing the suction force and improving the exhaust gas discharge performance when the exhaust gas is installed in a waste gas passage having a low exhaust pressure, thereby increasing the exhaust efficiency of the waste gas.

In addition, the gas injection device of the present invention has the effect of allowing the reaction by-products to be discharged more efficiently without being accumulated when the injection gas is heated and injected through the separate heating means.

Further, the gas injection device of the present invention has an effect of reducing the concentration of noxious gas contained in the waste gas by mixing the injection gas with the waste gas.

1 is a vertical sectional view of a gas injection device according to an embodiment of the present invention.
2 is a cross-sectional view taken along line AA of FIG.
3 is a cross-sectional view of BB of Fig.
4 is a vertical cross-sectional view of a gas injection device according to another embodiment of the present invention.
5 is a vertical sectional view of a gas injection device according to another embodiment of the present invention.
6 is a vertical sectional view of a gas injection device according to another embodiment of the present invention.

Hereinafter, the gas injection device of the present invention will be described in more detail with reference to the embodiments and the accompanying drawings.

First, a gas injection device according to an embodiment of the present invention will be described.

1 is a vertical sectional view of a gas injection device according to an embodiment of the present invention. 2 is a cross-sectional view taken along line A-A of Fig. 3 is a cross-sectional view taken along line B-B in Fig.

1 to 3, the gas injection device 100 according to an embodiment of the present invention includes an injection body 110, an injection induction groove 120, a gas buffer passage 130, and an injection nozzle 140, .

The gas injection device 100 is disposed between exhaust pipes for discharging the waste gas used in the semiconductor manufacturing process equipment or the flat panel display device manufacturing process equipment and forms the waste gas passage a through which the waste gas flows together with the exhaust pipe . The gas injection device 100 injects the injection gas supplied from the outside into the gas buffer passage 130 into the waste gas passage a formed inside the gas injection device 100 through the injection nozzle 140. The gas injection device 100 prevents reaction by-products of waste gas from adhering to the waste gas passage (a) and dilutes the noxious gas. The gas injection device 100 is installed in a scrubber system (not shown) or an exhaust pipe 10 connected to a process jig for discharging waste gas, so that water vapor and corrosive gas discharged from the scrubber system are introduced into the exhaust pipe 10 Thereby preventing the exhaust pipe 10 from being corroded.

An inert gas such as nitrogen or argon is used as the injection gas, and air may be used when the reactivity with the oxygen of the waste gas is not a problem depending on the kind of the waste gas.

The gas injection device 100 has a tubular shape with an inner hollow and an inner peripheral surface 111 and an outer peripheral surface 113, and has one side and the other side open in the direction of the central axis. The gas injection device 100 may have a circular or rectangular cross section perpendicular to the central axis of the injection body 110. The gas injection device 100 is formed such that its inner diameter has the same inner diameter as the inner diameter of the exhaust pipe 10 and a predetermined length. The gas injection device 100 is preferably formed such that the inner circumferential surface 111 is flush with the inner circumferential surface of the exhaust pipe. Further, the gas injection device 100 may be formed with an inner diameter smaller than the inner diameter of the exhaust pipe, if necessary. At this time, the gas injection device may be connected through a separate connection part of a reducer type whose inner diameter gradually becomes smaller or larger. In addition, the gas injection device 100 is formed to have a predetermined thickness in a direction perpendicular to the central axis. The gas injection device 100 is formed to have a thickness sufficient to form the gas buffer passages 130 between the inner circumferential surface 111 and the outer circumferential surface 113 in the region where the gas buffer passages 130 are formed. The gas injection device 100 is connected to the exhaust pipe 10 either directly or through a separate connection part 115 and forms a waste gas passage a through which waste gas flows. The exhaust pipe 10 is connected to a process equipment or a scrubber system to provide a path through which waste gas is discharged.

The injection guide groove 120 is recessed in the direction of the outer circumferential surface 113 from the inner circumferential surface 111 of the injection body 110 and is formed generally along the circumferential direction. Therefore, the injection guide groove 120 is formed in a ring shape as a whole. The injection guide groove 120 preferably has a first inclined surface 121 inclined outward from the inner circumferential surface 111 of the injection body 110 and an inner circumferential surface 111 of the injection body 110 from the first inclined surface 121 And a second inclined surface 123 which is inclined in the direction of the second inclined surface 123. The first inclined surface 121 and the second inclined surface 123 are ring-shaped. The first inclined angle formed by the first inclined surface 121 and the central axis is formed at an angle larger than a second inclined angle formed between the second inclined surface 123 and the central axis. The first inclination angle may be 45 degrees to 90 degrees. The second inclination angle may be 5 to 45 degrees. The first inclined surface 121 forms the injection nozzle 140 and the second inclined surface 123 guides the injection gas injected from the injection nozzle 140 to the waste gas passage a at a predetermined angle. The injection guide groove 120 reduces the angle at which the injection nozzle 140 is inclined with respect to the central axis direction of the gas injection device 100 so that the injection gas can be injected in a direction closer to the flow direction of the waste gas.

The gas buffer passage 130 has a predetermined length and width and is formed as an empty space having a ring shape along the inner circumferential surface 111 of the injection body 110 at one side of the gas injection device 100. That is, the gas buffer passage 130 is formed in a ring shape corresponding to the inner peripheral surface 111 at a predetermined depth in the direction from the inner peripheral surface 111 to the outer peripheral surface 113 of the injection body 110. The gas buffer passage 130 is also formed with an inner circumferential surface adjacent to the inner circumferential surface 111 of the injection body 110 and an outer circumferential surface opposed to the inner circumferential surface. The gas buffer passage 130 is formed such that the inner circumferential surface thereof is located at a position lower than the vertical height of the first inclined surface 121. Here, the vertical height of the first inclined surface 121 means a height from one side adjacent to the inner peripheral surface to the other side adjacent to the outer peripheral surface, which is perpendicular to the central axis. The gas buffer passage 130 has a gas supply hole 131 passing through the outer peripheral surface 113 of the injection body 110. A gas supply pipe 133 is connected to the gas supply hole 131. The gas buffer passage 130 receives the injection gas supplied from the outside through the gas supply pipe 133 and the gas supply hole 131 and provides a path through which the injection gas flows. The gas buffer passage 130 is connected to the injection nozzle 140 and supplies the injection gas supplied from the outside to the injection nozzle 140. Since the inner circumferential surface of the gas buffer passage 130 is located at a position lower than the vertical height of the first inclined surface 121, the injection nozzle 140 may be connected to the first inclined surface 121 at an angle close to the flow direction of the waste gas. That is, the gas buffer passage 130 connects the injection nozzle 140 in a direction parallel to the central axis of the gas injector 100 and parallel to the second inclined surface 123.

The injection nozzle 140 is formed in the shape of a through hole having a predetermined length and a diameter passing through the first inclined surface 121 from the gas buffer passage 130. The injection nozzles 140 are spaced apart from each other by a predetermined distance in the circumferential direction with respect to the central axis of the gas injection device 100. The injection nozzles 140 may be formed in various numbers depending on the diameter of the gas injection device 100, and preferably 8 to 60 nozzles. In addition, the injection nozzle 140 may be formed as a through-hole by connecting the holes. That is, the injection nozzle 140 is formed to have a ring shape with respect to the central axis of the injection body 110.

The injection nozzle 140 penetrates from one side of the gas buffer passage 130 to the first inclined surface 121. The injection nozzle 140 is formed such that its central axis is at an angle close to the flow direction of the waste gas. The injection nozzle 140 may be formed in a direction parallel to the center axis of the gas injection device 100 or in a direction parallel to the second inclined surface 123. That is, the injection nozzle 140 may be formed at an angle of 0 ° to a second inclination angle with respect to the central axis. Therefore, the injection nozzle 140 injects the injected gas in the flow direction of the waste gas, thereby smoothly flowing the waste gas.

Next, the operation of the gas injection device according to the embodiment of the present invention will be described.

First, the injection gas is supplied to the gas buffer passage 130 through the gas supply pipe 133 coupled to the gas supply hole 131. The injection nozzle 140 injects the injection gas supplied to the gas buffer passage 130 into the waste gas passage a of the injection body 110. Since the injection nozzle 140 is located on the first inclined surface 121 located on the outer side of the inner peripheral surface of the injection body 110 and does not form a bottleneck structure in the waste gas passage 130, the waste gas flows smoothly, . The injection gas injected from the injection nozzle 140 is injected into the waste gas passage a by the second inclined surface 123 according to the angle of the injection nozzle 140 or directly injected into the waste gas passage a. The second inclined surface 123 of the injection inducing groove 120 gradually decreases the diameter of the waste gas passage a to increase the flow rate of the waste gas by the venturi effect and forms a low pressure region in the rear. Since the injection gas is injected at a predetermined angle with respect to the flow direction of the waste gas, that is, the center axis of the injection body 110, the injection gas is injected into the waste gas passage (a) And air pockets. The injected gas increases the flow rate of the waste gas by the Bernoulli principle so that the waste gas can be rapidly transported up to about 15 times in proportion to the amount injected. Therefore, in the waste gas passage (a), a region with a relatively low pressure (measured at a pressure of about 20 to 30 mm H 2 O) is formed in the rear region of the position where the jetting gas is injected, and a strong suction force is generated. Since the gas injection device 100 forms a strong suction force in the waste gas passage, the exhaust pressure of the vacuum pump is lowered, thereby reducing the load and power consumption of the vacuum pump, and extending the service life and maintenance cycle of the vacuum pump. In addition, the gas injection apparatus 100 increases the flow rate of the waste gas to rapidly transfer waste gas and reaction by-products, and reduces deposition of reaction by-product particles in the exhaust pipe.

Next, a gas injection device according to another embodiment of the present invention will be described.

4 is a vertical cross-sectional view of a gas injection device according to another embodiment of the present invention.

4, at least two injection guide grooves 120, a gas buffer passage 130, and a plurality of injection nozzles 140 are formed in the injection body 110, As shown in Fig. Here, the injection guide groove 120, the gas buffer passage 130, and the injection nozzle 140 are formed in the same manner as in the embodiment of FIGS. 1 to 3.

The gas injector 200 makes the flow of waste gas more smooth and minimizes accumulation of by-product particles in the waste gas passage (a) when there are many by-products contained in the waste gas flowing in the exhaust pipe.

Next, a gas injection device according to another embodiment of the present invention will be described.

5 is a vertical sectional view of a gas injection device according to another embodiment of the present invention.

1 to 3 and 5, the gas injection device 300 according to one embodiment of the present invention includes a spray body 110, a jet guide groove 120, a gas buffer passage 130, (140) and a heating means (350). The gas injection device 300 may further include heating means as compared to the gas injection device 100 according to the embodiment of FIGS. Therefore, the gas injector 300 will be described mainly with reference to the heating means. In addition, the gas injection device 300 uses the same reference numerals for the same or similar parts as the gas injection device 100 according to the embodiment of FIGS. 1 to 3, and detailed description thereof is omitted here.

The heating unit 350 includes a heater housing 351, a heater unit 353, and a power supply line 355. The heating means 350 heats the injected gas and supplies it to the gas buffer passage 130.

The heater housing 351 may include a heater receiving hole 351a, a gas inlet hole 351b, a gas outlet hole 351c, and a gas inlet pipe 352.

The gas housing 351 is formed in a hollow cylindrical shape, and a heater is mounted inside the gas housing 351 to inject the injection gas. The gas housing 351 may be formed in an appropriate size and shape according to the size and shape of the gas injection device. For example, the heater housing 351 may be formed in a cylindrical or rectangular tube shape, and may have an outer wall such as a circular tube or a rectangular tube, and both side walls that seal both ends of the outer wall.

The heater insertion hole 351a is formed to penetrate from the outer surface to the inner surface of the heater housing 351 to be connected to the inner space of the heater housing 351. The heater insertion hole 351a provides a passage through which the heater unit 353 is inserted into and fixed to the inner space of the heater housing 351. [ The plurality of heater insertion holes 351a may be formed according to the structure of the heater unit 353.

The gas inlet hole 351b is formed to be connected to the inner space of the heater housing 351 through an inner surface of the heater housing 351 or an outer surface of the outer wall. The gas inlet hole 351b allows the injection gas supplied from the outside to flow into the inner space of the heater housing 351 to be heated.

The gas outlet hole 351c is formed so as to pass through the other side wall of the heater housing 351 or the outer surface of the outer wall to the inner space of the heater housing 351. The gas outlet hole 351c allows the heated gas injected from the inner space of the heater housing 351 to be supplied to the gas buffer passage 130. The gas outlet hole 351c is connected to the gas supply hole 131 of the gas buffer passage 130 through a gas supply pipe 133.

The gas inlet pipe 352 is connected to the gas inlet hole 351b and supplies the injection gas supplied from the outside to the gas inlet hole 351b.

The heater unit 353 is formed of a bar-shaped heating element and arranged in parallel with the axial direction of the heater housing 351 in the inner space of the heater housing 351. Further, the heater unit 353 may be formed of a heating element in the form of a pin heater having a radiating fin (not shown) attached to the bar-shaped heating element to increase heating efficiency.

  The heater unit 353 is formed of at least one heater unit, and may be formed of a plurality of heater units. When the heater unit 353 is formed in a plurality of units, the heater units 353 may be independently supplied with power and sequentially operate. In this case, the total service life of the heater unit 353 can be increased corresponding to the number.

The power supply line 355 is formed of a general wire, and is electrically connected to the heater unit 353 to supply power. The power supply lines 355 may be formed in a number corresponding to the heater unit 353 and connected to the heater unit 353 to independently supply power.

6, the inner space of the heater housing 451 constituting the heating means 450 and the gas buffer passage 130 may be directly connected to each other. have. That is, the gas outlet hole 451c of the heater housing 451 is directly connected to or integrally formed with the gas supply hole 131 of the gas buffer passage 130. In this case, the gas supply pipe 133 coupled to the gas supply hole 131 of the gas buffer passage 130 is omitted.

100, 200, 300, 400: gas injection device
110: injection body 120: injection guide groove
130: gas buffer passage 140: injection nozzle
350, 450: Heating means

Claims (11)

1. A gas injection device positioned between exhaust pipes to form a waste gas passage together with the exhaust pipe,
A tubular spray body forming a passage opening to one side and the other side in the central axis direction and having a predetermined thickness in a direction perpendicular to the central axis direction,
An injection guide groove having a first inclined surface inclined in an outer peripheral surface direction from an inner peripheral surface of the injection body and a second inclined surface inclined in an inner peripheral surface direction of the injection body from the first inclined surface,
A gas buffer passage formed in the injection body so as to form a ring shape about the central axis and located adjacent to the first inclined surface,
And at least one injection nozzle which is formed in the shape of a through hole penetrating from the gas buffer passage to the first inclined surface and injects the injected gas in the second inclined surface direction. The method according to claim 1,
Wherein the injection guide groove has a ring shape about the central axis and is formed to be opened in the direction of the central axis. The method according to claim 1,
Wherein the first inclination angle formed by the first inclined surface with the central axis is larger than the second inclined angle formed between the second inclined surface and the central axis. The method according to claim 1,
Wherein the gas buffer passage has an inner peripheral surface located at a position lower than a vertical height of the first inclined surface. The method according to claim 1,
Wherein the injection nozzle has a plurality of through holes connected to each other to form a through-hole. The method according to claim 1,
Wherein the injection nozzle is formed in a direction parallel to the central axis or in a direction parallel to the second inclined surface. The method according to claim 1,
Wherein the gas injection device further comprises a gas supply pipe connected to the gas buffer passage for supplying an injection gas. The method according to claim 1,
Wherein the gas injection device has at least two injection guide grooves, a gas buffer passage, and an injection nozzle spaced apart from each other in the direction of the central axis. The method according to claim 1,
A gas inlet hole and a gas outlet hole; and a heater for supplying a gas injected into the inner space through the gas inlet hole to the gas buffer passage through the gas outlet hole, A housing,
At least one heater unit which is formed of a heating element and is located in an inner space of the heater housing,
Further comprising: a heating unit having a power supply line for supplying power to the heater unit. 10. The method of claim 9,
And the gas outlet hole of the heater housing is connected to the gas supply hole of the gas buffer passage through a separate gas supply pipe. 10. The method of claim 9,
And the gas outlet hole of the heater housing is directly connected to the gas supply hole of the gas buffer passage.
KR1020150108699A 2015-07-31 2015-07-31 Apparatus for Injecting Gas KR101755031B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210041195A (en) * 2019-10-07 2021-04-15 박정민 Gas supplying apparatus for pipe and apparatus for manufacturing semiconductor comprising the same

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KR102105517B1 (en) * 2018-03-21 2020-04-29 우성이엔디 주식회사 Trnasfer for dilution of exhaust gas and exhaust gas dilution apparatus having the same

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JP2010084700A (en) * 2008-10-01 2010-04-15 Toyota Motor Corp Exhaust emission control device and method for manufacturing the exhaust emission control device
KR101434833B1 (en) * 2013-07-19 2014-11-04 김준규 Hot Nitrogen Transfer System

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210041195A (en) * 2019-10-07 2021-04-15 박정민 Gas supplying apparatus for pipe and apparatus for manufacturing semiconductor comprising the same

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