KR20170011569A - Metal tape for absorbing impact - Google Patents

Abstract

The present invention provides a metal tape comprising a thermally conductive layer, an impact-absorbing layer and an adhesive layer, wherein the impact-absorbing layer comprises a polymer foam body, and is formed on one surface or both surfaces of the thermally conductive layer, and the adhesive layer is formed on the other surface of the impact-absorbing layer having the thermally conductive layer. The metal tape comprises the thermally conductive layer, thereby having an excellent heat radiation effect and being able to show an excellent impact absorbing effect of a device in limited thickness by forming the impact absorbing layer without a separate adhesive layer on the thermally conductive layer.

Description

METAL TAPE FOR ABSORBING IMPACT

More particularly, the present invention relates to a metal tape comprising a thermally conductive layer, an impact absorbing layer and a pressure-sensitive adhesive layer, wherein the impact absorbing layer comprises a polymer foam, And the adhesive layer is formed on the other surface of the impact absorbing layer on which the thermally conductive layer is formed.

Electronic devices such as cell phones, hard disk drives (HDD), televisions and liquid crystal displays are made up of precision mechanical parts and electronic devices. In addition, recently, electronic devices and electronic parts tend to be thinned and shortened.

Electronic devices according to recent trends such as the above tend to easily break down when a physical impact is applied from the outside, and there is a tendency of breakage and shortening of lightness. Therefore, a large number of electronic devices must be installed in a narrow space. Was greatly increased. In addition, contaminants such as dust introduced from the outside interfere with the air flow in the electronic device, causing overheating of the electronic device, thereby shortening the lifetime of the electronic device.

The above-mentioned electronic devices use adhesive tapes for electronic parts for bonding and fixing electronic parts such as leads, heat sinks, semiconductor chips, and die pads, etc. Such adhesive tapes for electronic parts include adhesive tape for fixing lead frames, Heat sink bonding tape, TAB (Tape Automated Bonding) tape, and LOC (Lead On Chip) tape. These adhesive tapes for electronic parts should have sufficient physical properties to withstand the harsh conditions such as high temperature, humidity, and voltage applied from the outside until they are used as finished products after assembly process from assembly process as well as excellent adhesive strength.

Korean Patent Laid-Open No. 10-2011-0108055 discloses that a heat dissipation layer is bonded to a metal substrate using an adhesive layer, and the adhesive layer is made of a polymer. When such a polymer adhesive layer is used, This can cause the problem to fall.

Accordingly, there is an urgent need to develop an adhesive tape for electronic parts which has an excellent adhesive force, has an excellent heat radiation effect on the amount of heat generated in the internal electronic device, and can withstand harsh conditions externally applied.

An object of the present invention is to provide a shock absorbing metal tape.

Another object of the present invention is to provide a metal tape comprising a thermally conductive layer, an impact absorbing layer and an adhesive layer, and a metal tape providing impact absorption by the impact absorbing layer and heat radiation effect by the thermally conductive layer.

It is still another object of the present invention to provide a metal tape capable of forming a shock absorbing layer without an adhesive layer on a heat conduction layer and preventing a shock absorbing effect and a heat radiation effect from being reduced depending on the presence of an adhesive layer.

According to one embodiment of the present invention, there is provided a metal tape comprising a thermally conductive layer, an impact absorbing layer and an adhesive layer, wherein the impact absorbing layer comprises a polymer foam, the impact absorbing layer is formed on one surface or both surfaces of the heat conductive layer without an adhesive layer, And the adhesive layer is formed on the other surface of the impact absorbing layer on which the heat conductive layer is formed.

In one embodiment of the present invention, the polymeric foams are selected from the group consisting of polyurethane foams, polyethylene foams, polyolefin foams, polyvinyl chloride foams, polycarbonate foams, polyetherimide foams, polyamide foams, polyester foams, polyvinylidene chloride foams, poly A methyl methacrylate foam, and a polyisocyanurate foam. The present invention relates to a shock absorbing metal tape.

In one embodiment of the present invention, the thermally conductive layer is made of a metal such as a shock absorbing metal such as copper, stainless steel (SUS), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron, Tape.

In one embodiment of the present invention, the heat conductive layer is copper or copper foil, and the copper foil is a metal tape for shock absorption having an elongation of 3 to 30% and a surface roughness Ra of 0.3 to 3 탆.

In one embodiment of the present invention, the pressure-sensitive adhesive layer comprises a polyvinyl alcohol-based pressure-sensitive adhesive; Acrylic adhesive; Vinyl acetate-based tackifiers; Urethane based pressure sensitive adhesive; Polyester-based pressure-sensitive adhesives; Polyolefin-based pressure-sensitive adhesives; Polyvinyl alkyl ether-based pressure-sensitive adhesives; Rubber adhesives; Vinyl chloride-vinyl acetate-based pressure sensitive adhesive; Styrene-butadiene-styrene (SBS) tackifiers; Hydrogenated styrene-butadiene-styrene (SEBS) -based tackifiers; Ethylenic tackifiers; A silicone-based pressure-sensitive adhesive, and an acrylic ester-based pressure-sensitive adhesive.

In one embodiment of the present invention, the impact absorbing layer is a shock absorbing metal tape having an impact absorption rate of 25 to 45% and an initial elastic modulus of 15% to 35%.

In one embodiment of the present invention, the impact absorbing layer relates to a metal tape for shock absorption having an average cell diameter of 5 to 20 mu m.

In one embodiment of the present invention, the total thickness of the metal tape for impact absorption is 75 to 300 mu m, and the impact absorbing layer is 50 to 200 mu m.

In one embodiment of the present invention, the thickness of the pressure-sensitive adhesive layer is 5 to 100 占 퐉.

In one embodiment of the present invention, the shock-absorbing metal tape further comprises a release film layer on the other surface of the pressure-sensitive adhesive layer on which the impact-absorbing layer is formed.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more faithful and complete, and will fully convey the scope of the invention to those skilled in the art.

In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of description, and the same reference numerals refer to the same elements in the drawings. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

In the present invention, the pressure-sensitive adhesive layer may be, for example, a layer of a pressure-sensitive adhesive composition. As used herein, the term tacky layer may refer to a layer formed by coating or curing a tackifier or tackifier composition. The term " curing of a pressure-sensitive adhesive or pressure-sensitive adhesive composition " may mean the implementation of a crosslinking structure in a pressure-sensitive adhesive or pressure-sensitive adhesive composition through physical or chemical action or reaction of components contained in the pressure-sensitive adhesive or pressure-sensitive adhesive composition. The curing can be carried out, for example, at a temperature of room temperature, application of moisture, application of heat, irradiation of active energy rays, or a combination of two or more of the above processes, The pressure-sensitive adhesive or pressure-sensitive adhesive composition may be referred to, for example, as a room-temperature-curable pressure-sensitive adhesive composition, a moisture-curable pressure-sensitive adhesive composition, a thermosetting pressure-sensitive adhesive composition, an active energy ray-curable pressure-sensitive adhesive composition or a hybrid curing pressure-

In the present invention, heat conduction is a phenomenon in which thermal energy is continuously transferred from a high temperature portion to a low temperature portion without involving the movement of a material, and the heat conduction layer means a layer in which such heat conduction occurs. The thermal conductivity can be expressed by the thermal conductivity. The thermal conductivity is divided into the hot wire method, the guarded heat flow method, the guarded hot plate method, and the laser pulse method. mk). The measurement of the thermal conductivity is defined by the following formula.

를 도입하여 정리하면From the viewpoint of the similarity of heat and electricity, the relationship between voltage, current and resistance in an electric circuit is used to calculate the thermal resistance R =

In addition,

와 접촉면의 열저항

의 합이다. 여기에 오차 보정계수 F를 도입하면 다음과 같이 표현된다.The thermal resistance R is the thermal resistance of the specimen

And the thermal resistance of the contact surface

. The error correction factor F is introduced as follows.

을 구하면, 다음 관계식을 이용하여 시험편의 열전도율 k를 계산할 수 있다.Using the above equation, the thermal resistance of the specimen

, The following equation can be used to calculate the thermal conductivity k of the specimen.

According to an embodiment of the present invention, there is provided a metal tape comprising a thermally conductive layer, an impact absorbing layer and an adhesive layer, wherein the impact absorbing layer comprises a polymer foam, the impact absorbing layer is formed on one surface or both surfaces of the heat conductive layer without an adhesive layer, And the adhesive layer is formed on the other surface of the impact absorbing layer on which the heat conductive layer is formed. More specifically, the shock-absorbing metal tape may be a metal tape in which an impact absorbing layer, a heat conduction layer and an adhesive layer are sequentially laminated, or may be a metal tape having a first adhesive layer, a first impact absorbing layer, a heat conductive layer, To a sequentially stacked metal tape. The components of the first adhesive layer and the second adhesive layer are the same as those of the stacked positions, and the components of the first and second impact absorbing layers are the same as those of the laminated positions.

In one embodiment of the present invention, the polymeric foam may be a polyurethane foam, a polystyrene, a polyethylene foam, a polyolefin foam, a polyvinyl chloride foam, a polycarbonate foam, a polyetherimide foam, a polyamide foam, a polyester foam, A foam, a polymethyl methacrylate foam, and a polyisocyanurate foam, and is preferably a polyurethane foam or a polystyrene foam.

The polystyrene includes styrene, and may be selected from general purpose polystyrene (GPPS), styrene homopolymer, high impact polystyrene (HIPS) polymerized by styrene rubber, and expandable polystyrene (EPS) ) Is preferable. The foam includes a polyurethane, and the polyurethane includes a polyisocyanate. The polyurethane includes at least one selected from the group consisting of a polyether-based polyurethane including a polyol and a polyester-based polyurethane including a diol or a triol . It is preferable that the foam contains a polyurethane, and the polyurethane is a polyester-based polyurethane having a different specific gravity from a polyether-based polyurethane, a polyester-based polyurethane having a different specific gravity and a polyester-based polyurethane, Or may be constituted by laminating other polyether-series polyurethane and polyether-series polyurethane. It is also possible that the foam comprises a polyurethane, and the polyurethane is constituted by laminating with polystyrene.

In one embodiment of the present invention, the thermally conductive layer is at least one selected from the group consisting of copper, stainless steel (SUS), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron and copper foil, Or copper foil. The thermal conductivity of the thermally conductive layer is 237 (W / mK), 400 (W / mK) copper, 12 (w / mK) ), Carbon steel 36 to 53 (W / mK), bronze 110 (W / mK), nickel 59 to 90 W / mK, platinum 71.6 (W / mK), tungsten 53 to 66 (W / mK) and the copper foil 372 (W / mK), which is excellent in heat radiation effect against heat generated inside the electronic apparatus.

According to an embodiment of the present invention, the copper foil may have an elongation of 3 to 30%, a surface roughness Ra of 0.3 to 3 m, preferably an elongation of 5 to 25% and a surface roughness Ra of 0.5 to 2 m The present invention relates to a metal tape for use with a tape. When the elongation percentage of the copper foil is less than 3%, the elongation percentage of the copper foil is low, so that when the foaming of the polymer foams is performed on the copper foil, tension can not be given to the copper foil, the polymer foam layer can be formed unevenly, A problem may occur that the copper foil is broken. When the surface roughness Ra of the copper foil is more than 3 占 퐉, there is a problem that the thermal conductivity is low and there is a problem that a large amount of the polymer foam is used in order to fill the surface of the copper foil.

In one embodiment of the present invention, the pressure-sensitive adhesive layer comprises a polyvinyl alcohol-based pressure-sensitive adhesive; Acrylic adhesive; Vinyl acetate-based tackifiers; Urethane based pressure sensitive adhesive; Polyester-based pressure-sensitive adhesives; Polyolefin-based pressure-sensitive adhesives; Polyvinyl alkyl ether-based pressure-sensitive adhesives; Rubber adhesives; Vinyl chloride-vinyl acetate-based pressure sensitive adhesive; Styrene-butadiene-styrene (SBS) tackifiers; Hydrogenated styrene-butadiene-styrene (SEBS) -based tackifiers; Ethylenic tackifiers; A silicone adhesive, and an acrylic ester adhesive, and is preferably at least one adhesive selected from the group consisting of an acrylic pressure sensitive adhesive, a urethane pressure sensitive adhesive and a silicone pressure sensitive adhesive, more preferably the pressure sensitive adhesive composition is an acrylic polymer or a poly Based pressure-sensitive adhesive. As the acrylic polymer, for example, a polymer having a weight average molecular weight (Mw) of 400,000 or more can be used. The term weight average molecular weight is a conversion value relative to standard polystyrene measured by GPC (Gel Permeation Chromatograph), and in this specification, " molecular weight " may mean " weight average molecular weight " unless otherwise specified. When the molecular weight of the polymer is 400,000 or more, the durability of the pressure-sensitive adhesive can be maintained in an appropriate range. The upper limit of the molecular weight is not particularly limited, and can be adjusted within a range of about 2.5 million or less in consideration of, for example, coating properties. The acrylic polymer may include, for example, a polymerization unit derived from a (meth) acrylic acid ester compound. As the (meth) acrylic acid ester compound, alkyl (meth) acrylate can be exemplified. For example, an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms can be used in consideration of cohesion, glass transition temperature and adhesion. Examples of such monomers include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, (Meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, sec-butyl (Meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate or tetradecyl (meth) acrylate. As the (meth) acrylic acid ester compound, compounds other than alkyl (meth) acrylate may also be used. Polyurethane based pressure sensitive adhesives have the following properties: i) they have effective wettability on most of the surface of the adherend, ii) they are readily hydrogen bondable with the adherend, iii) they penetrate well into the porous adherend due to their small molecular size, The branch has the characteristic of forming a covalent bond with the adherend. Examples of the urethane adhesive include (1) one-pack type emulsion polyurethane adhesive, (2) two-pack type emulsion polyurethane adhesive, and (3) urethane / acrylic hybrid type adhesive.

In one embodiment of the present invention, the impact absorbing layer has an impact absorption rate of 25 to 45%, an initial elastic modulus of 15% to 35%, a shock absorption rate of 30 to 40%, and an initial elastic modulus of 20% to 30% To a metal tape for shock absorption. When the impact absorption rate is less than 25% and the initial elastic modulus is less than 15%, the initial elastic modulus is low and the shock absorption rate is low. In addition, when the initial modulus of elasticity exceeds 35% and the impact absorption rate exceeds 45%, there is a problem in durability because the adhesive force is reduced.

In one embodiment of the present invention, the impact absorbing layer relates to a metal tape for shock absorption having an average cell diameter of 5 to 20 占 퐉, and preferably an average cell diameter of 7 to 15 占 퐉. The average bubble size can be measured, for example, according to ASTM D3576-77. The impact absorbing layer comprises a polymer foam, and the polymer foam is a low density polymer crosslinked (partially crosslinked or completely crosslinked) and can be compressed by an external force, and has a property of recovering its original volume again when an external force is removed. This property absorbs the impact. However, when the average cell diameter is less than 5 占 퐉, the degree of compression due to external force is too small and the impact absorption effect is small. When the average cell diameter is more than 20 占 퐉, It can lose its nature.

In one embodiment of the present invention, the total thickness of the shock absorbing metal tape is 75 to 300 占 퐉, the thickness of the impact absorbing layer is 50 to 200 占 퐉, more preferably 100 to 250 占 퐉, Is 75 to 150 mu m. When the total thickness of the metal tape is less than 75 占 퐉 and the impact absorbing layer is less than 50 占 퐉, the impact absorbing layer is so thin that the shock absorbing effect against the external external force is insufficient and the thickness of the metal tape exceeds 300 占 퐉 and the thickness The thickness of the tape is too thick, which does not fit the tendency of thinning and shortening of the electronic device, and there is a problem that the profit for the cost is not large.

In one embodiment of the present invention, the thickness of the pressure-sensitive adhesive layer is 5 to 100 탆, preferably 5 to 50 탆. When the thickness of the pressure-sensitive adhesive layer is less than 5 mu m, the thickness of the pressure-sensitive adhesive layer is too thin, thereby deteriorating the adhesive effect. When the thickness exceeds 100 mu m, there is a problem that the cost- .

The metal tape for shock absorption according to one embodiment of the present invention relates to a metal tape for shock absorption, which further comprises a release film layer on the other surface of the adhesive layer on which the impact absorption layer is formed. Specifically, the metal tape may be a shock absorbing metal tape in which a heat conductive layer, an impact absorbing layer, a pressure sensitive adhesive layer and a release film layer are sequentially laminated, or the release film layer, the pressure sensitive adhesive layer, the impact absorbing layer, the heat conductive layer, To a metal tape for shock absorption. The thickness of the release film is not particularly limited, and may be 5-50 占 퐉. Within the above range, the adhesive layer and the adhesive film are protected from external physical impact, and the appropriate volume and weight of the finished product are maintained, thereby enabling an operator to perform an easy operation during movement and work.

The present invention relates to a metal tape for shock absorption, and more particularly, to a metal tape for shock absorption, which comprises a heat conductive layer having a high heat conductivity and excellent heat radiation effect.

The present invention prevents the problem that the impact absorbing layer and the heat conduction layer are deposited without using an adhesive layer to reduce the shock absorption and heat dissipation performance by the thickness of the adhesive layer, And the heat radiation effect against the internal heat is excellent.

1 is a structure of a shock absorbing metal tape in which a heat conductive layer, an impact absorbing layer, an adhesive layer, and a release film layer are sequentially laminated according to an embodiment of the present invention.
FIG. 2 is a structure of a metal tape for shock absorption in which a release film layer, an adhesive layer, an impact absorbing layer, a heat conduction layer, an impact absorbing layer, an adhesive layer, and a release film layer are sequentially laminated according to an embodiment of the present invention.
3 is a SEM photograph of the impact absorbing layer according to an embodiment of the present invention.
4 is a SEM photograph of the impact absorption layer according to an embodiment of the present invention.
1: heat conduction layer
2: shock absorbing layer
3: Adhesive layer
4: Release film layer

Hereinafter, the present invention will be described in more detail with reference to Examples. It is to be understood that both the foregoing description and the following detailed description are exemplary, explanatory and are intended to be illustrative, and not restrictive. The scope of the invention is defined by the appended claims rather than by the foregoing description. will be.

1, the configuration of the present invention is largely divided into three layers. A heat conduction layer (1); An impact-absorbing layer 2 and an adhesive layer 3. The adhesive layer 3 may further include a release film layer 4 for protecting the adhesive layer 3 from external foreign matter or impact. 2, an embodiment of the present invention includes a release film layer 4, an adhesive layer 3, an impact absorbing layer 2, a heat conduction layer 1, an impact absorbing layer 2, an adhesive layer 3, And a film layer 4 are sequentially laminated. That is, Fig. 1 relates to a metal tape including an adhesive layer on one side, and Fig. 2 relates to a double-sided metal tape including an adhesive layer on both sides. The total thickness of the metal tape is 75 to 300 mu m, preferably 100 to 200 mu m. The thickness of the impact absorbing layer 2 is 50 to 200 탆, preferably 75 to 150 탆. The thickness of the adhesive layer 3 is 5 to 100 占 퐉, preferably 5 to 50 占 퐉, and more preferably 5 to 25 占 퐉.

The thermally conductive layer 1 is at least one selected from the group consisting of copper, stainless steel (SUS), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron and copper foil, preferably copper or copper foil. The copper foil may be any conventional copper foil known in the art without limitation, including all copper foils manufactured by rolling and electrolytic methods. More preferably, the electrolytic copper foil is not limited to the examples.

Wherein the impact absorbing layer (2) comprises a polymer foam, wherein the polymer foam is selected from the group consisting of polyurethane foam, polystyrene, polyethylene foam, polyolefin foam, polyvinyl chloride foam, polycarbonate foam, polyetherimide foam, polyamide foam, Is at least one selected from the group consisting of a foam, a polyvinylidene chloride foam, a polymethyl methacrylate foam, and a polyisocyanurate foam, and is preferably a polyurethane foam or a polystyrene foam.

The polymer foam is formed by forming a large number of small bubbles inside the polymer, and is not only light but also widely used as a packaging material, a cushioning material, and a lightweight structural material because of its flexibility and impact resistance. Manufacturing methods include chemical methods and physical methods. The chemical method is a method in which a polymer resin and a foaming agent are mixed well and then subjected to appropriate operation to decompose the foaming agent to generate a gas to produce a foam. The physical method is a method of producing a foam by infiltrating the resin into the resin and then expanding under reduced pressure to be. Chemical methods are mainly applied to the foaming of polyurethanes and polyolefins, and physical methods are mainly applied to the foaming of polystyrene and polyolefins.

As environmental problems have arisen, methods of manufacturing synthetic resin expanded particles by physical methods rather than chemical methods have become widely adopted. Organic foaming agents such as CFC, propane, and butane and inorganic foaming agents such as carbon dioxide and nitrogen may be used as physical foaming agents. However, in consideration of air pollution, use of inorganic foaming agents such as carbon dioxide is increasing.

The pressure-sensitive adhesive layer (3) comprises a polyvinyl alcohol-based pressure-sensitive adhesive; Acrylic adhesive; Vinyl acetate-based tackifiers; Urethane based pressure sensitive adhesive; Polyester-based pressure-sensitive adhesives; Polyolefin-based pressure-sensitive adhesives; Polyvinyl alkyl ether-based pressure-sensitive adhesives; Rubber adhesives; Vinyl chloride-vinyl acetate-based pressure sensitive adhesive; Styrene-butadiene-styrene (SBS) tackifiers; Hydrogenated styrene-butadiene-styrene (SEBS) -based tackifiers; Ethylenic tackifiers; A silicone adhesive, and an acrylic ester adhesive, and is preferably at least one adhesive selected from the group consisting of an acrylic pressure sensitive adhesive, a urethane pressure sensitive adhesive and a silicone pressure sensitive adhesive, more preferably the pressure sensitive adhesive composition is an acrylic polymer or a poly Based pressure-sensitive adhesive.

Adhesion of the adhesive layer 3 to the impact absorbing layer can be made by a conventional method known in the art. For example, the acrylic resin composition or the polyurethane resin composition varnish may be coated on the surface of the impact absorbing layer, followed by heating, drying and curing, or may be obtained by heating and drying a resin varnish applied on a support, The film may be placed on the surface of the impact absorbing layer and then adhered.

When the acrylic resin composition or the polyurethane resin composition is coated on the substrate, the coating composition may be applied by a conventional coating method known in the art such as a dip coating, a die coating, a roll coating, a comma coating , Casting, or a combination thereof. The drying method and the drying conditions can be adjusted within a conventional range known in the art, and can be performed, for example, by drying at a temperature of 50 to 170 ° C for 1 to 30 minutes.

The release film layer 4 is located on one side (lower side in FIG. 1) of the adhesive layer 3 to protect the adhesive layer 3. The release film layer 4 may be formed of a cellulose film such as a TAC (triacetyl cellulose) film or the like, a polyester film such as a polyethylene terephthalate film, a polycarbonate film, a polyethersulfone film, an acrylic film, a polyethylene film, Polyolefin films such as polypropylene films, polyolefin films containing cyclo or norbornene structures, or ethylene-propylene copolymer films, but are not limited thereto. More preferably, a releasable PET film having a releasing force of about 10 g / in can be used so as to facilitate releasing.

[Example]

Manufacture of metal tape for shock absorption

[Example 1]

A foaming agent is mixed with a polyurethane resin in a copper foil layer having a thickness of 35 mu m and allowed to stand at a temperature of 110 to 280 DEG C to form a polyurethane foam layer having a thickness of 105 mu m. Thereafter, an acrylic pressure-sensitive adhesive was applied to a polyurethane foam layer by 10 탆 transfer coating and dried at 160 캜 for 3 minutes. The coating was carried out using a comma coater. A metal tape having a total thickness of 150 mu m was produced.

[Example 2]

A copper foil having a thickness of 40 占 퐉 was used and a polyurethane foam layer was formed to have a thickness of 100 占 퐉.

[Example 3]

A copper foil having a thickness of 45 占 퐉 was used and a polyurethane foam layer was formed to have a thickness of 95 占 퐉.

[Example 4]

Except that a copper foil having an elongation of 10% and a surface roughness Ra of 1 탆 was used.

[Comparative Example 1]

Except that a polyurethane adhesive layer having a thickness of 10 탆 was formed on a copper layer having a thickness of 35 탆 and a polyurethane foam layer was adhered thereto.

[Comparative Example 2]

A copper foil layer having a thickness of 70 탆 and a polyurethane foam layer were formed in a thickness of 70 탆.

[Comparative Example 3]

Except that a copper foil having an elongation of 2% and a surface roughness Ra of 0.1 mu m was used.

[Comparative Example 4]

An adhesive layer was coated on a copper foil which was not foamed with polyurethane to prepare a metal tape.

The thicknesses of the metal tapes of Examples 1 to 4 and Comparative Examples 1 to 4 are shown in Table 1 below.

Copper layer (copper foil) Adhesive layer Polyurethane foam layer Acrylic adhesive layer Total thickness Example 1 35 탆 0 105 탆 10 탆 150 탆 Example 2 40 탆 0 100 탆 10 탆 150 탆 Example 3 45 탆 0 95 탆 10 탆 150 탆 Example 4 35 탆 (copper foil having an elongation of 10% and a surface roughness Ra of 1 탆) 0 105 탆 10 탆 150 탆 Comparative Example 1 35 탆 10 탆 95 탆 10 탆 150 탆 Comparative Example 2 70 탆 0 70 탆 10 탆 150 탆 Comparative Example 3 35 mu m (copper foil having an elongation of 2% and a surface roughness Ra of 0.1 mu m) 0 105 탆 10 탆 150 탆 Comparative Example 4 Copper foil - - 10 탆 45 탆

Characteristics of physical properties of metal tape for impact absorption

Maximum cell diameter (cm) Minimum cell diameter (탆) Average cell diameter (占 퐉) Compressive strength
(kg / cm ² ) Recovery rate
(%) Dupont Impact
(mJ) Thermal conductivity
(W / mK) Example 1 54 11 27 2.32 99.51 0.187 103 Example 2 57 13 30 2.19 99.43 0.180 111 Example 3 55 17 24 2.03 99.64 0.172 125 Example 4 60 21 33 2.41 99.47 0.191 101 Comparative Example 1 55 23 30 2.17 99.71 0.165 100 Comparative Example 2 57 17 28 1.78 99.30 0.142 185 Comparative Example 3 65 32 48 Not measurable Not measurable Not measurable 105 Comparative Example 4 - - - - - 0.049 295

The results of evaluating the physical properties of the metal tapes of Examples 1 to 4 and Comparative Examples 1 to 4 are shown in Table 2 above.

The DuPont impact test is to evaluate the bond strength (cracking, peeling) by dropping the weights of a constant height and a constant load after contacting the specimen with a horizontally high punch with a radius. In the case of Comparative Example 1, which is a metal tape including an adhesive layer, the adhesive layer had a thickness of 10 mu m, which did not have a large specific gravity within the tape. However, the adhesive layer showed low values as a result of DuPont impact test, In the case of Comparative Example 2, the copper foil was thick at 70 탆 and had a high thermal conductivity. However, even when the impact absorbing layer was as thick as 70 탆, the recovery rate, the compressive strength and the DuPont impact test were low. In the case of Comparative Example 3, since the elongation rate of the copper foil was low and the tension was not given during the production of the metal tape, there was a problem that the coating thickness of the polyurethane foam layer was not uniform. It is impossible to measure physical properties such as compressive strength.

In Examples 1 to 4, the thermal conductivity was lower than that of the metal tape (Comparative Example 4) produced by using only copper foil, but the DuPont impact test result of the impact absorption test was better than that of Comparative Example 4 In addition, it shows good results in compression strength and recovery rate.

Claims (18)

As the metal tape comprising the heat conductive layer, the impact absorbing layer and the adhesive layer,
Wherein the impact absorbing layer comprises a polymer foam,
The impact absorbing layer is formed on one side or both sides of the heat conduction layer without an adhesive layer,
Wherein the adhesive layer is formed on the other surface of the impact absorbing layer in which the heat conductive layer is formed. The method according to claim 1,
The polymeric foam may be a polyurethane foam, a polyethylene foam, a polyolefin foam, a polyvinyl chloride foam, a polycarbonate foam, a polyetherimide foam, a polyamide foam, a polyester foam, a polyvinylidene chloride foam, a polymethyl methacrylate foam, And a socyanurate foamed body. 3. The method of claim 2,
Wherein the polymer foam is a polyurethane foam or a polystyrene foam. The method according to claim 1,
Wherein the thermally conductive layer is at least one selected from the group consisting of copper, stainless steel (SUS), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron and copper foil. 5. The method of claim 4,
Wherein the thermally conductive layer is copper or copper foil. 5. The method of claim 4,
Wherein the copper foil has an elongation of 3 to 30% and a surface roughness Ra of 0.3 to 3 탆. The method according to claim 6,
Wherein the copper foil has an elongation of 5 to 25% and a surface roughness Ra of 0.5 to 2 탆. The method according to claim 1,
Wherein the adhesive layer comprises a polyvinyl alcohol-based pressure-sensitive adhesive; Acrylic adhesive; Vinyl acetate-based tackifiers; Urethane based pressure sensitive adhesive; Polyester-based pressure-sensitive adhesives; Polyolefin-based pressure-sensitive adhesives; Polyvinyl alkyl ether-based pressure-sensitive adhesives; Rubber adhesives; Vinyl chloride-vinyl acetate-based pressure sensitive adhesive; Styrene-butadiene-styrene (SBS) tackifiers; Hydrogenated styrene-butadiene-styrene (SEBS) -based tackifiers; Ethylenic tackifiers; Wherein the adhesive is one or more selected from the group consisting of a silicone-based pressure-sensitive adhesive and an acrylic ester pressure-sensitive adhesive. 9. The method of claim 8,
Wherein the pressure-sensitive adhesive layer is at least one pressure-sensitive adhesive selected from the group consisting of an acrylic pressure-sensitive adhesive, a urethane pressure-sensitive adhesive and a silicone pressure-sensitive adhesive. The method according to claim 1,
Wherein the impact absorbing layer has an impact absorption rate of 25 to 45% and an initial elastic modulus of 15 to 35%. 11. The method of claim 10,
Wherein the impact absorbing layer has an impact absorption rate of 30 to 40% and an initial elastic modulus of 20 to 30%. The method according to claim 1,
Wherein the impact absorbing layer has an average cell diameter of 20 to 40 占 퐉. 13. The method of claim 12,
Wherein the impact absorbing layer has an average cell diameter of 25 to 35 占 퐉. The method according to claim 1,
Wherein the total thickness of the metal tape for impact absorption is 75 to 300 占 퐉 and the impact absorbing layer is 50 to 200 占 퐉. 15. The method of claim 14,
Wherein the total thickness of the shock absorbing metal tape is 100 to 200 占 퐉 and the thickness of the impact absorbing layer is 75 to 150 占 퐉. The method according to claim 1,
Wherein the thickness of the adhesive layer is 5 to 100 占 퐉. 17. The method of claim 16,
Wherein the thickness of the adhesive layer is 5 to 50 占 퐉. The method according to claim 1,
Wherein the metal tape for impact absorption further comprises a releasing film layer on the other surface of the adhesive layer on which the impact absorbing layer is formed.

Images