CN106366961A - Metal band for absorbing impact - Google Patents
Metal band for absorbing impact Download PDFInfo
- Publication number
- CN106366961A CN106366961A CN201610579684.4A CN201610579684A CN106366961A CN 106366961 A CN106366961 A CN 106366961A CN 201610579684 A CN201610579684 A CN 201610579684A CN 106366961 A CN106366961 A CN 106366961A
- Authority
- CN
- China
- Prior art keywords
- metal tape
- foam
- layer
- impact absorbing
- binding agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
The invention discloses a metal band for absorbing impact. The metal band comprises a heat conductive layer, an impact absorption layer and a binding agent layer, wherein the impact absorption layer comprises polymer foam; the impact absorption layer is formed on one surface or two surfaces of the heat conductive layer under a condition that a binding layer is absent and the binding layer is formed on the impact absorption layer, a surface where the heat conductive layer is not formed. The metal band is good in a heat radiation effect. The impact absorption layer is formed on the heat conductive layer under the condition that a single binding layer is absent, so that the metal band enables a device having a limited thickness to have a good impact absorption effect.
Description
This application claims Korea Spro 10-2015-0104388 submitting in Korean Intellectual Property Office on July 23rd, 2015
The priority of state's patent application and rights and interests, entire contents are incorporated herein by this.
Technical field
The present invention relates to a kind of metal tape for absorbing impact, more particularly, to a kind of bag for absorbing impact
Include the metal tape of heat-conducting layer, impact absorbing layer and adhesive phase, wherein, described impact absorbing layer includes foam of polymers and shape
Become on a surface or two surfaces of heat-conducting layer, what adhesive phase was formed at impact absorbing layer is formed without heat-conducting layer thereon
Surface on.
Background technology
The electronic installation of such as mobile phone, hard disk drive (hdd), television set and liquid crystal display is by accurate machinery
Part and electronic installation are formed.In addition, electronic installation and electronic unit become light, thin, short and little recently.
According to recent trend, electronic installation easily goes wrong or exists impaired when from outside applying physical impact
Problem, according to light, thin, short and little trend, substantial amounts of electronic installation needs in the small space be installed in electronic installation, from
And heat greatly increases produced by per unit volume.Additionally, the contaminant material interference electricity of the such as dust from flows outside
Air-flow in sub-device, so that electronic unit is overheated, thus leads to the lost of life of electronic installation.
In an electronic, the adherent zone for electronic unit is used for combining and fixing such as lead, heat sink, quasiconductor
Chip and the electronic unit of die pads, the adherent zone for electronic unit includes adherent zone for anchor leg framework, use
Automatically (tab) band, LOC (loc) band etc. are engaged in the band with reference to heat sink, belt.Adherent zone for electronic unit
Need to have can resist from assembling process to electronic unit assembled after as during finished product from the outside harsh conditions applying (such as
High epidemic disaster and voltage) property and excellent adhesion.
In this respect, 10-2011-0108055 Korean patent application publication discloses " heat radiation
Tape and manufacturing method thereof " (heat-radiation belt and its manufacture method), wherein, heat dissipating layer passes through to make
It is attached to metal matrix material with adhesive phase, adhesive phase is formed by polymer, and when using polymeric binder layer,
The thickness of adhesive phase leads to heat dispersion to deteriorate, and this becomes problem.
Therefore, it is urgent for developing such adherent zone for electronic unit, and described adherent zone has excellent adhesion
Power, has excellent radiating effect for the heat producing in internal electronics, and enough to resist from the outside sternness applying
Condition.
Content of the invention
The present invention is proposed to attempt to provide a kind of metal tape for absorbing impact.
In addition, proposing the present invention to attempt to provide a kind of metal tape, it includes heat-conducting layer, impact absorbing layer and binding agent
Layer, thus absorbed by impact absorbing layer and impacting and provide radiating effect by heat-conducting layer.
In addition, proposing the present invention to attempt to provide a kind of metal tape, wherein, impact absorbing layer is being not bound with the situation of layer
Under be formed on heat-conducting layer, to prevent from leading to impact absorbing effect and radiating effect deterioration due to the presence of binder courses.
The exemplary embodiment of the present invention provides the metal tape for absorbing impact, comprising: heat-conducting layer；Impact absorbing
Layer；Adhesive phase, wherein, impact absorbing layer includes foam of polymers, and impact absorbing layer is formed in the case of no binder courses
On one surface of heat-conducting layer or two surfaces, and adhesive phase be formed at impact absorbing layer do not form heat-conducting layer thereon
On surface.
Foam of polymers can be from by polyurethane foam, polyethylene, expanded polyolefin, polyvinyl chloride foam, poly-
Carbonic ester foam, polyethyerimide foam, polyamide foam, polyester form, polyvinylidene chloride foam, poly-methyl methacrylate
Any one or more kinds of selecting in the group of ester foam and polyisocyanurate foam composition.
Heat-conducting layer can be from by copper, rustless steel (sus), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron and Copper Foil group
Any one or more kinds of selecting in the group becoming.
Heat-conducting layer can be copper or Copper Foil, and Copper Foil can have 3% to 30% percentage elongation and 0.3 μm to 3 μm of surface
Roughness ra.
Adhesive phase can be from by polyvinyl alcohol series adhesive, acryl based adhesive, the bonding of vinyl acetate esters
Agent, ammonia ester adhesive, polyester adhesive, TPO binding agent, polyethylene alkyl ethers binding agent, rubber-like bonding
Agent, vinyl chloride-vinyl acetate class binding agent, s-B-S (sbs) class binding agent, hydrogenated styrene-fourth
In styrene (sebs) class binding agent, the group of vinyl binding agent, silicon class binding agent and acrylate adhesive composition
Any one or the more kinds of binding agent selecting.
Impact absorbing layer can have 25% to 45% impact absorbing rate and 15% to 35% initial elastic modulus.
Impact absorbing layer can have 5 μm to 20 μm of mean cell diameter.
Gross thickness for absorbing the metal tape of impact can be 75 μm to 300 μm, and the thickness of impact absorbing layer can be
50 μm to 200 μm.
The thickness of adhesive phase can be 5 μm to 100 μm.
As the exemplary embodiment of the present invention, the present invention relates to for the metal tape absorbing impact, it also includes bonding
On the surface not forming impact absorbing layer thereon of oxidant layer.
The present invention relates to for absorbing the metal tape impacting, specifically, there is provided such a is used for absorbing the gold of impact
Belong to band, it includes having the heat-conducting layer of high heat conductance to show excellent radiating effect.
In the present invention, setting impact absorbing layer and heat-conducting layer in the case of not using binder courses, therefore, it can prevent
Only because the thickness of adhesive phase leads to shock absorbing capability and the problem of heat dispersion deterioration, and according to light, thin, short and little
Electronic installation recent trend, even if in the case that the thickness of metal tape is restricted, absorb external impact effect and
The effect of the internal heat of radiation is also excellent.
Brief description
Fig. 1 shows the figure of the structure of the metal tape for absorbing impact of the exemplary embodiment according to the present invention,
In described metal tape, heat-conducting layer, impact absorbing layer, adhesive phase and disengaging film layer are sequentially laminated.
Fig. 2 shows the figure of the structure of the metal tape for absorbing impact of the exemplary embodiment according to the present invention,
In described metal tape, depart from film layer, adhesive phase, impact absorbing layer, heat-conducting layer, impact absorbing layer, adhesive phase and disengaging
Film layer is sequentially laminated.
Fig. 3 is the sem photo of the impact absorbing layer of the exemplary embodiment according to the present invention.
Fig. 4 is the sem photo of the impact absorbing layer of the exemplary embodiment according to the present invention.
Specific embodiment
There is provided the purpose that is merely to illustrate of exemplary embodiment of the present invention and in order to those skilled in the art is abundant
Understand the scope of the present invention, can in a variety of manners following illustrative embodiment be modified, and the scope of the present invention
It is not limited to exemplary embodiment.More properly, these examples are provided so that the disclosure be thoroughly with complete, and will be this
Bright design comprehensively conveys to those skilled in the art.
In addition, in the accompanying drawings, for convenience with describe clear, exaggerate phase in every layer of thickness or size, and accompanying drawing
Same label represents identical element.As used in this specification, term "and/or" includes one or more corresponding marks
Any one combination of note item or all combinations.
Term as used herein is for the purpose of describing particular example embodiments, and is not intended to limit the present invention.
As used in this, unless the context clearly indicates otherwise, otherwise singulative is also intended to including plural form.In the application
In it will be recognized that term " comprising " and " having " be intended to specify exist characteristic described by description, quantity, step, operation,
Element and part or combinations thereof, and in advance exclusion exist or add one or more further features, quantity,
Step, operation, element and part or the probability of combinations thereof.
In the present invention, adhesive phase can be the layer of such as adhesive composition.In this manual, term " bonding
Oxidant layer " can refer to by coating " binding agent or adhesive composition " or the layer making it harden and being formed.Term " make binding agent or
Adhesive composition hardening " can refer to the physically or chemically effect by being included in the component in binding agent or adhesive composition
Or the materialization of reaction and cross-linked structure in binding agent or adhesive composition." solidification " can be by for example tieing up at room temperature
Shield, applying dampness, hot, the radiation activated energy-ray of applying or above-mentioned at least two methods of combination are induced, and depend on
Every kind of situation, wherein the type of induced curing binding agent or adhesive composition be referred to alternatively as example room-temperature-curable bonding
Agent compositionss, moisture-curable adhesive composition, heat-curable adhesive composition, active energy ray-curable binding agent group
Compound or mixing curable adhesive or adhesive composition.
In the present invention, conduction of heat is that thermal energy continuously transmits from high-temperature part in the case of being not accompanied by material movement
To the phenomenon of low temperature part, heat-conducting layer refers to wherein the layer of conduction of heat.Conduction of heat can be represented by thermal conductivity, thermal conductivity
Rate is classified by heat wire method, protection heat flow method, protection hot plate method and laser pulse method, and the numerical value of thermal conductivity is by k or w/ (mk)
Represent.The measurement of thermal conductivity is defined by below equation.
When relation derivation thermal resistance r=by using voltage, electric current and resistance circuit from the similar views of heat and electricity
When δ t/q is to arrange thermal resistance,
In this case, thermal resistance r is thermal resistance r of samplesThermal resistance r with contact surfacecSummation.Here, when introducing misses
During difference correction factor f, thermal resistance is expressed as followsin.
R=rs+rc=f δ t/q
rs=f [(t1–t2)/q] rc
rs: the thermal resistance of sample
The penalty coefficient of f: conduction of heat
t1: the temperature above sample
t2: the temperature below sample
The pyroconductivity of q: per unit area
rc: thermal contact resistance
When thermal resistance r calculating sample using above formulasWhen, the heat transfer rate k of sample can count by using following formula
Calculate.
ls: thickness of sample
As the exemplary embodiment of the present invention, the present invention relates to for the metal tape absorbing impact, it include heat-conducting layer,
Impact absorbing layer and adhesive phase, wherein, impact absorbing layer include foam of polymers and in the case of being not bound with layer shape
Become on a surface or two surfaces of heat-conducting layer, and adhesive phase be formed at impact absorbing layer be formed without thereon lead
On the surface of thermosphere.More specifically, being such metal tape for absorbing the metal tape of impact, wherein, impact absorbing layer, heat conduction
Layer and adhesive phase are sequentially laminated, or such metal tape, wherein, first adhesive phase, the first impact absorbing layer, lead
Thermosphere, the second impact absorbing layer and second adhesive phase are sequentially laminated.First adhesive phase and second adhesive phase are layer
Folded position is different, but has identical component, and the first impact absorbing layer and the second impact absorbing layer are also only stratification position
Difference, but there is identical component.
As the exemplary embodiment of the present invention, foam of polymers is any one selecting from group consisting of the following
Or more kinds of: polyurethane foam, polystyrene foam, polyethylene, expanded polyolefin, polyvinyl chloride foam, Merlon
Foam, polyethyerimide foam, polyamide foam, polyester form, polyvinylidene chloride foam, polymethyl methacrylate foam
With polyisocyanurate foam it is preferable that foam of polymers is polyurethane foam or polystyrene foam.
Polystyrene includes styrene, and preferably select from group consisting of the following one or more of:
General purpose polystyrene (gpps) as styrene homopolymers；Shock proof high impact polystyrene (hips), wherein, rubber exists
It is polymerized in styrene；Expandable polystyrene (eps), wherein, is mixed with foaming agent.In addition, foam includes polyurethane, polyurethane
Including polyisocyanate, and preferably from by the polyether polyurethane including polyhydric alcohol and the polyesters including glycol or triol
Select in the group of polyurethane composition is one or more of.Additionally, foam includes polyurethane, polyurethane can be by having difference
The polyester-based polyurethane of proportion and polyether polyurethane, the polyester-based polyurethane with different specific weight and polyester-based polyurethane or
There is the polyether polyurethane of different specific weight and polyether polyurethane is laminated and forms.In addition, foam includes polyurethane, gather
Urethane can be laminated with polystyrene.
As the exemplary embodiment of the present invention, heat-conducting layer is any one or more selecting from group consisting of the following
Multiple: copper, rustless steel (sus), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron and Copper Foil composition.The thermal conductivity table of heat-conducting layer
Show very excellent heat conductivity, thus the effect that heat produced in electronic installation is radiated is excellent, wherein, aluminum
Thermal conductivity is 237w/mk, and the thermal conductivity of copper is 400w/mk, and stainless thermal conductivity is 12 to 45w/mk, and the thermal conductivity of silver is
429w/mk, the thermal conductivity of lead is 35w/mk, and the thermal conductivity of carbon steel is 36 to 53w/mk, and the thermal conductivity of bronze is 110w/mk, nickel
Thermal conductivity be 59 to 90w/mk, the thermal conductivity of platinum is 71.6w/mk, and the thermal conductivity of tungsten is 53 to 66w/mk, the thermal conductivity of cast iron
It is 64w/mk, the thermal conductivity of Copper Foil is 372w/mk.
As the exemplary embodiment of the present invention, the present invention relates to for the metal tape absorbing impact, wherein, the stretching of Copper Foil
Long rate is 3% to 30%, surface roughness ra of Copper Foil be 0.3 μm to 3 μm it is preferable that the percentage elongation of Copper Foil be 5% to
25%, surface roughness ra of Copper Foil is 0.5 μm to 2 μm.When the percentage elongation of Copper Foil is less than 3%, the percentage elongation of Copper Foil is low, because
This, when foam of polymers foams in Copper Foil it is impossible to apply tension to Copper Foil, thus polymer foaming layer can be uneven
Ground formed, and when excessive tension force is applied to Copper Foil in fact it could happen that Copper Foil disconnect problem.Surface roughness when Copper Foil
When ra is more than 3 μm, there is a problem of that thermal conductivity is low, but also there is substantial amounts of foam of polymers and need for filling copper foil surface
Problem, for production cost, profit is little.
As the exemplary embodiment of the present invention, adhesive phase be from group consisting of the following select any one or
More kinds of binding agents: polyvinyl alcohol series adhesive (polyvinyl alcohol-based adhesive), acryloyl base class glue
Mixture (acryl-based adhesive), vinyl acetate esters binding agent (vinyl acetate-based adhesive),
Ammonia ester adhesive (urethane-based adhesive), polyester adhesive (polyester-based adhesive),
TPO binding agent (polyolefin-based adhesive), polyethylene alkyl ethers binding agent (polyvinyl
Alkyl ether-based adhesive), rubber adhesive (rubber-based adhesive), vinyl chloride-acetic acid second
Alkene ester adhesive (vinyl chloride-vinyl acetate-based adhesive), styrene-butadiene-benzene second
Alkene (sbs) class binding agent (styrene-butadiene-styrene (sbs)-based adhesive), hydrogenated styrene-fourth
Styrene (sebs) class binding agent (styrene-butadiene-styrene hydrogenation (sebs)-based
Adhesive), vinyl binding agent (ethylene-based adhesive), silicon class binding agent (silicon-based
Adhesive) and acrylate adhesive (acrylic acid ester-based adhesive) it is preferable that be from by
The one or more of bondings selecting in the group of acryl based adhesive, polyurethane binding and silicon class binding agent composition
Agent, it is highly preferred that adhesive composition may include acrylate copolymer or polyurethane binding.As acrylate copolymer,
Can be using the polymer of the weight average molecular weight (mw) with 400,000 or more.Term " weight average molecular weight " is by gel infiltration
The transforming numerical for polystyrene standard that chromatograph (gpc) measures, and in this manual, unless otherwise prescribed, no
Then " molecular weight " can refer to " weight average molecular weight ".Can be by making the molecular weight of polymer for 400,000 or more in suitable model
Enclose the interior durability keeping binding agent.The upper limit of molecular weight is not particularly limited, for example, it is contemplated that arriving coating performance etc., molecular weight
The upper limit can be adjusted in about 2,500,000 or following scope.Acrylate copolymer may include from such as methyl
Polymerized unit derived from acrylate compounds.The example of methacrylate compound can include methacrylate
Ester.In view of cohesiveness, glass transition temperature and adhesiveness, alkyl methacrylate has the alkyl that carbon number is 1 to 10.
The example of monomer includes methyl methacrylate, ethyl methacrylate, n propyl methacrylate, methacrylic acid isopropyl
The secondary butyl ester of ester, n-BMA, Tert-butyl Methacrylate, methacrylic acid, pentylmethacrylate, metering system
Sour 2- Octyl Nitrite, methacrylic acid 2- ethyl butyl ester, n octyl methacrylate, 2-Propenoic acid, 2-methyl-, isooctyl ester, metering system
The different nonyl ester of acid, lauryl methacrylate or methacrylic acid tetradecane ester.As methacrylate compound it is also possible to make
With other compounds in addition to alkyl methacrylate.Polyurethane binding) have for most of adherends
The effective wetting on surface) have with adherend can characteristic that easily hydrogen is combined, and iii) have by small molecule chi
The very little readily permeable characteristic forming covalent bond to porous adherend and with the adherend of active hydrogen.Additionally, polyurethaness glue
The species of mixture includes 1. one-pack type (one pack type) emulsion polyurethane binding, 2. two-component-type (two pack
Type) emulsion polyurethane binder and 3. urethane/acrylic acid mixed adhesive, and not limited to this.
As the exemplary embodiment of the present invention, the present invention relates to for the metal tape absorbing impact, wherein, impact absorbing
Layer has 25% to 45% impact absorbing rate and 15% to 35% initial elastic modulus, and preferably, have 30% to
40% impact absorbing rate and 20% to 30% initial elastic modulus.When impact absorbing rate is less than 25% and initial elastic modulus
During less than 15%, initial elastic modulus are low, thus impact absorbing rate can represent the level of low numerical value, therefore, the rushing of metal tape
It can be slight for hitting assimilation effect.In addition, when initial elastic modulus more than 35% and impact absorbing rate more than 45% when, metal tape
Adhesion reduce, thus there is durability.
As the exemplary embodiment of the present invention, the present invention relates to for the metal tape absorbing impact, wherein, impact absorbing
Layer has 5 μm to 20 μm of mean cell diameter it is therefore preferable to 7 μm to 15 μm.Average bubble size can be according to such as astm
D3576-77 measures.Impact absorbing layer includes foam of polymers, and foam of polymers is that low-density crosslinking is (partial cross-linked
Or fully crosslinked) polymer, and have the properties that foam of polymers can be compressed by external force, and except going
During power, foam of polymers reverts to initial volume.Due to above-mentioned property, impact absorbing layer absorbs impact.However, when average
When cell diameter is less than 5 μm, when impact absorbing layer is by outer force compresses, the degree of compression is excessively slight, thus impact absorbing effect meeting
Low, and when mean cell diameter is more than 20 μm, impact absorbing layer can lose and revert to initial body after by outer force compresses
Long-pending property.
As the exemplary embodiment of the present invention, the gross thickness for absorbing the metal tape of impact is 75 μm to 300 μm, and
The thickness of impact absorbing layer is 50 μm to 200 μm, it is highly preferred that for absorb impact metal tape gross thickness be 100 μm extremely
250 μm, and the thickness of impact absorbing layer is 75 μm to 150 μm.When the gross thickness of metal tape is less than 75 μm and impact absorbing layer
When thickness is less than 50 μm, impact absorbing layer is too thin, and the impact absorbing effect hence for external force is slight, and works as metal tape
Gross thickness more than 300 μm and impact absorbing layer thickness more than 200 μm when, metal tape is too thick, thus metal tape is not suitable for
Light, thin, little, the short trend of electronic installation, and the profit of production cost is little.
As the exemplary embodiment of the present invention, the present invention relates to for the metal tape absorbing impact, wherein, adhesive phase
Thickness be 5 μm to 100 μm it is preferable that be 5 μm to 50 μm.When the thickness of adhesive phase is less than 5 μm, adhesive phase is too thin,
Thus there is a problem of that adhesiving effect reduces, when the thickness of adhesive phase is more than 100 μm, having problems in that, producing into
This profit is little, and thermal conduction effect deterioration.
As the exemplary embodiment of the present invention, the present invention relates to for the metal tape absorbing impact, it also includes being located at
The disengaging film layer being formed without thereon on the surface of impact absorbing layer of adhesive phase.In particular it relates to be used for absorbing
The metal tape of impact, wherein, heat-conducting layer, impact absorbing layer, adhesive phase and disengaging film layer are sequentially laminated, or are related to so
A kind of for absorb impact metal tape, wherein, depart from film layer, adhesive phase, impact absorbing layer, heat-conducting layer, impact absorbing layer,
Adhesive phase and disengaging film layer are sequentially laminated.The thickness departing from film is not particularly limited, but can be 5 μm to 50 μm.At this
In the range of, binder courses and binder film can be protected from external physical impact, and keep the volume and weight of suitable finished product,
So that operator is easily operated in movement and work.
Hereinafter, by example, the present invention will be explained in more detail.However, these examples are only used for description originally
The purpose of invention, it is apparent to those skilled in the art that according to the principle of the present invention, the scope of the present invention is not limited to down
The example in face.
As shown in figure 1, the structure of the present invention is generally divided into three layers.The present invention includes heat-conducting layer 1, impact absorbing layer 2 and glues
Mixture layer 3.The present invention can also be included for protecting adhesive phase 3 to avoid the disengaging film layer 4 of foreign or impact.As Fig. 2
Shown, as the exemplary embodiment of the present invention, the present invention has disengaging film layer 4, adhesive phase 3, impact absorbing layer 2, heat conduction
The structure that layer 1, impact absorbing layer 2, adhesive phase 3 and disengaging film layer 4 are sequentially laminated.That is, Fig. 1 is related to including being formed at metal
The metal tape of the adhesive phase on one surface of band, Fig. 2 is related to including the binding agent on two surfaces being formed at metal tape
The double-sided metal band of layer.The gross thickness of metal tape is 75 μm to 300 μm it is preferable that being 100 μm to 200 μm.Impact absorbing layer 2
Thickness be 50 μm to 200 μm it is preferable that be 75 μm to 150 μm.The thickness of adhesive phase 3 be 5 μm to 100 μm it is preferable that
For 5 μm to 50 μm, it is highly preferred that being 5 μm to 25 μm.
Heat-conducting layer 1 is from being made up of copper, rustless steel (sus), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron and Copper Foil
In group select any one or more kinds of it is preferable that be copper or Copper Foil.Typical Copper Foil as known in the art can be used as institute
State Copper Foil without limiting, Copper Foil includes all Copper Foils manufacturing by such as milling method and electrolytic method.It is highly preferred that copper
Paper tinsel is electrolytic copper foil, but not limited to this.
Impact absorbing layer 2 includes foam of polymers, and foam of polymers is from by polyurethane foam, polystyrene foam, poly-
Vinyl foam, expanded polyolefin, polyvinyl chloride foam, Merlon foam, polyethyerimide foam, polyamide foam, polyester
Select in foam, the group of polyvinylidene chloride foam, polymethyl methacrylate foam and polyisocyanurate foam composition
Any or more kinds of it is preferable that be polyurethane foam or polystyrene foam.
In foam of polymers, form substantial amounts of minute bubbles in polymeric inner, thus polymer is light and has excellent
Good pliability and resistance to impact, so that foam of polymers is widely used as packaging material, padded coaming, lightweight structural material
Deng.The preparation method of foam of polymers includes chemical method and physical method.Chemical method be by by fluoropolymer resin and send out
The method preparing foam that infusion well mixes and the agent that reduces foaming produces gas by the suitable operation of execution, physics
Method is the method preparing foam by making foaming agent penetrate in resin and then make foaming agent reduce pressure and expand.Chemical method
It is primarily adapted for use in and makes polyurethane and polyalkene foaming, and physical method is primarily adapted for use in and makes polystyrene and polyalkene foaming.
Due to the appearance of environmental problem, prepare the side of synthetic resin expanded beads by physical method rather than chemical method
Method is widely adopted.Foaming agent as physical method, it is possible to use organic of such as Chlorofluorocarbons (CFCs) (cfc), propane and butane
Infusion and such as carbon dioxide and the inorganic foaming agent of nitrogen, but consider atmospheric pollution, such as carbon dioxide inorganic foamed
The use of agent has increased.
Adhesive phase 3 be from by polyvinyl alcohol series adhesive, acryl based adhesive, vinyl acetate esters binding agent,
Ammonia ester adhesive, polyester adhesive, TPO binding agent, polyethylene alkyl ethers binding agent, rubber adhesive, chlorine
Ethylene-vinyl acetate class binding agent, s-B-S (sbs) class binding agent, hydrogenated styrene-butadiene-
Select in styrene (sebs) class binding agent, the group of vinyl binding agent, silicon class binding agent and acrylate adhesive composition
Any or more kinds of binding agent of selecting is it is preferable that be from being glued by acryl based adhesive, ammonia ester adhesive and silicon class
Any or more kinds of binding agent selecting in the group of mixture composition, it is highly preferred that adhesive composition may include acrylic acid
Polymer or ammonia ester adhesive.
Adhesive phase 3 is attached to impact absorbing layer to execute by typical method known in the art.For example, it is possible to
By following steps, adhesive phase 3 is attached to impact absorbing layer: by acrylic acid resin composition or polyurethane resin composition
Paint is applied to the surface of impact absorbing layer, then acrylic acid resin composition or polyurethane resin composition paint are carried out heating,
Be dried and solidify, or by by the lacquer type organic coating being applied on supporter is heated and the adhesive sheet that is dried and obtains or
Film is arranged on the surface of impact absorbing layer, is then combined adhesive sheet or film with impact absorbing layer.
In this case, when acrylic acid resin composition or polyurethane resin composition are applied on base material
When, typically various coating processes known in the art, such as dip-coating (dip coating), die coating can be used by without stint
(die coating), roller coat (roll coating), comma coating (comma coating), casting (casting) or they
Combination.In addition, drying meanss and dry regulation in the typical range that can be known in the art execute, for example, drying is permissible
Execute 1 minute to 30 minutes at a temperature of 50 DEG C to 170 DEG C.
Depart from film layer 4 to be arranged on a surface (lower surface in Fig. 1) of adhesive phase 3 to protect adhesive phase 3.De-
Cellulose membrane (such as triacetyl cellulose (tac) film), polyester film (such as poly terephthalic acid second two can be used from film layer 4
Ester (pet) film), polycarbonate membrane, poly (ether sulfone) film, acrylic film (acryl film), polyethylene film, polypropylene screen, include ring
The polyolefin film of base or norborene structure or TPO film (such as ethylene-propylene copolymer film), but not limited to this.More excellent
Selection of land, can be easy to depart from using the pet film (its breakaway force is of about 10g/in) for departing from.
[example]
Manufacture the metal tape for absorbing impact
[example 1]
Forming thickness by following steps is 105 μm of polyurethane foaming layer: thickness be 35 μm Copper Foil on mixing poly-
Urethane resin and foaming agent, and mixture is placed at a temperature of 110 DEG C to 280 DEG C make mixture foam.Then, 160
Made acryl based adhesive that 10 μm of coating is shifted on polyurethane foaming layer at DEG C in 3 minutes, then apply, in this feelings
Under condition, execute painting method by using comma coating machine.Manufacture the metal tape of the gross thickness with 150 μm.
[example 2]
Except being 40 μm of Copper Foil in addition to forming 100 μm of polyurethane foaming layer using thickness, by with example 1 in the way of
Identical mode manufactures the metal tape for absorbing impact.
[example 3]
Except being 45 μm of Copper Foil in addition to forming 95 μm of polyurethane foaming layer using thickness, by with example 1 in the way of
Identical mode manufactures the metal tape for absorbing impact.
[example 4]
Except the use of percentage elongation being 10% and in addition to surface roughness is 1 μm of Copper Foil, by with example 1 in the way of identical
Mode manufactures the metal tape for absorbing impact.
[comparative examples 1]
Except be 35 μm in thickness layers of copper on form the polyurethane adhesive layer that thickness is 10 μm and by polyurethane foam
Layer be attached to outside polyurethane adhesive layer, by with example 1 in the way of identical mode manufacture for absorb impact metal tape.
[comparative examples 2]
Except forming the layers of copper that thickness is 70 μm and being formed in addition to thickness is 70 μm of polyurethane foaming layer, with example 1
Mode identical mode manufacture for absorb impact metal tape.
[comparative examples 3]
Except the use of percentage elongation being 2% and in addition to surface roughness is 0.1 μm of Copper Foil, by identical in the way of example 1
Mode manufacture for absorb impact metal tape.
[comparative examples 4]
By adhesive phase is coated in manufacture metal tape on the Copper Foil be not performed polyurethane foam.
The numerical value of the thickness of the metal tape to example 4 and comparative examples 1 to comparative examples 4 for the example 1 represents in following table 1
In.
Table 1
Table 2 is used for absorbing the performance characteristic of the metal tape of impact
The result of the performance evaluation of the metal tape to example 4 and comparative examples 1 to comparative examples 4 for the example 1 represents in table 2
In.
Du Pont's impact test be by flatly place sample, make sample with the stamping machine being shaped like radius and contact and
Make to have the evaluation of the adhesive strength (separate and peel off) that the weight of certain loads falls and carries out under specified altitude assignment.Show in contrast
In the case of example 1 (that is, including the metal tape of adhesive phase), the thickness of adhesive phase is 10 μm, and (it is the little percentage in band
Than), but the result as Du Pont's impact test, metal tape shows low numerical value by adhesive phase, it can therefore be seen that adhesion
Less, in the case of comparative examples 2, Copper Foil has 70 μm of big thickness to intensity, so the thermal conductivity of metal tape is high, even if
Impact absorbing layer has 70 μm of big thickness, and metal tape shows low in terms of recovery rate, compressive strength and Du Pont's impact test
Numerical value.In the case of comparative examples 3, the percentage elongation of Copper Foil is low, therefore can not apply tension to during manufacturing metal tape
Metal tape, thus cause applying polyurethane foaming layer in uneven thickness, and because this problem leads to the table of metal tape
Face is rough, therefore cannot measure the property of such as compressive strength.
In the case of example 1 to 4, compared to the metal tape (comparative examples 4) only being manufactured using Copper Foil, the heat of metal tape
Conductance is low, but compared with the metal tape in comparative examples 4, metal tape table in the Du Pont's impact test tested as impact absorbing
Reveal more preferable result, additionally, metal tape shows more preferable result in terms of compressive strength and recovery rate.
Claims (18)
1. a kind of metal tape for absorbing impact, described metal tape includes:
Heat-conducting layer；
Impact absorbing layer；With
Adhesive phase,
Wherein, impact absorbing layer includes foam of polymers,
Impact absorbing layer is formed on a surface or two surfaces of heat-conducting layer in the case of being not bound with layer,
Adhesive phase is formed at being formed without thereon on the surface of heat-conducting layer of impact absorbing layer.
2. metal tape according to claim 1, wherein, foam of polymers is from by polyurethane foam, expanded polyolefin, poly-
Chloride foams, Merlon foam, polyethyerimide foam, polyamide foam, polyester form, polyvinylidene chloride foam,
Any one or more kinds of selecting in the group of polymethyl methacrylate foam and polyisocyanurate foam composition.
3. metal tape according to claim 2, wherein, foam of polymers is polyurethane foam or polystyrene foam.
4. metal tape according to claim 1, wherein, heat-conducting layer be from by copper, rustless steel, silver, lead, carbon steel, bronze,
Any one or more kinds of selecting in nickel, platinum, the group of tungsten, cast iron and Copper Foil composition.
5. metal tape according to claim 4, wherein, heat-conducting layer is copper or Copper Foil.
6. metal tape according to claim 4, wherein, Copper Foil have 3% to 30% percentage elongation and 0.3 μm to 3 μm
Surface roughness ra.
7. metal tape according to claim 6, wherein, Copper Foil have 5% to 25% percentage elongation and 0.5 μm to 2 μm
Surface roughness ra.
8. metal tape according to claim 1, wherein, adhesive phase is from by polyvinyl alcohol series adhesive, acryloyl group
Class binding agent, vinyl acetate esters binding agent, ammonia ester adhesive, polyester adhesive, TPO binding agent, polyethylene alkane
Base ethers binding agent, rubber adhesive, vinyl chloride-vinyl acetate class binding agent, s-B-S class are glued
Mixture, SEBS class binding agent, vinyl binding agent, silicon class binding agent and esters of acrylic acid bonding
Any or more kinds of binding agent selecting in the group of agent composition.
9. metal tape according to claim 8, wherein, adhesive phase is from being glued by acryl based adhesive, urethane class
Any or more kinds of binding agent selecting in the group of mixture and silicon class binding agent composition.
10. metal tape according to claim 1, wherein, impact absorbing layer have 25% to 45% impact absorbing rate and
15% to 35% initial elastic modulus.
11. metal tapes according to claim 10, wherein, impact absorbing layer have 30% to 40% impact absorbing rate and
20% to 30% initial elastic modulus.
12. metal tapes according to claim 1, wherein, impact absorbing layer has 20 μm to 40 μm of mean cell diameter.
13. metal tapes according to claim 12, wherein, the Average Cell that impact absorbing layer has 25 μm to 35 μm is straight
Footpath.
14. metal tapes according to claim 1, wherein, the gross thickness of the metal tape for absorbing impact is 75 μm to 300
μm, the thickness of impact absorbing layer is 50 μm to 200 μm.
15. metal tapes according to claim 14, wherein, for absorb impact metal tape gross thickness be 100 μm extremely
200 μm, the thickness of impact absorbing layer is 75 μm to 150 μm.
16. metal tapes according to claim 1, wherein, the thickness of adhesive phase is 5 μm to 100 μm.
17. metal tapes according to claim 16, wherein, the thickness of adhesive phase is 5 μm to 50 μm.
18. metal tapes according to claim 1, described metal tape also includes:
Depart from film layer, be formed at being formed without thereon on the surface of impact absorbing layer of adhesive phase.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0104388 | 2015-07-23 | ||
| KR1020150104388A KR101802951B1 (en) | 2015-07-23 | 2015-07-23 | Metal tape for absorbing impact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106366961A true CN106366961A (en) | 2017-02-01 |
Family
ID=57877876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610579684.4A Pending CN106366961A (en) | 2015-07-23 | 2016-07-21 | Metal band for absorbing impact |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101802951B1 (en) |
| CN (1) | CN106366961A (en) |
| TW (1) | TW201707966A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714916A (en) * | 2017-10-25 | 2019-05-03 | 日进材料股份有限公司 | Impact absorbing composite sheet |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102334411B1 (en) * | 2017-07-25 | 2021-12-03 | 삼성디스플레이 주식회사 | Display apparatus and manufacturing the same |
| KR101922938B1 (en) * | 2017-09-29 | 2018-11-29 | 일진머티리얼즈 주식회사 | Multi-functional composite sheet having function of controlling electromagnetic wave, thermal radiation, and absorbing impact |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014083890A1 (en) * | 2012-11-27 | 2014-06-05 | 積水化学工業株式会社 | Heat-conducting foam sheet for electronic instruments and heat-conducting laminate for electronic instruments |
| CN104553103A (en) * | 2013-10-29 | 2015-04-29 | 日东电工株式会社 | Laminate |
-
2015
- 2015-07-23 KR KR1020150104388A patent/KR101802951B1/en active IP Right Grant
-
2016
- 2016-07-15 TW TW105122318A patent/TW201707966A/en unknown
- 2016-07-21 CN CN201610579684.4A patent/CN106366961A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014083890A1 (en) * | 2012-11-27 | 2014-06-05 | 積水化学工業株式会社 | Heat-conducting foam sheet for electronic instruments and heat-conducting laminate for electronic instruments |
| CN104553103A (en) * | 2013-10-29 | 2015-04-29 | 日东电工株式会社 | Laminate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714916A (en) * | 2017-10-25 | 2019-05-03 | 日进材料股份有限公司 | Impact absorbing composite sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201707966A (en) | 2017-03-01 |
| KR101802951B1 (en) | 2017-11-29 |
| KR20170011569A (en) | 2017-02-02 |
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Application publication date: 20170201 |