KR20170003232A - Heat sink assembly for electric range - Google Patents

Abstract

According to the present invention, disclosed is a heat sink structure of an electric stove, to prevent main parts from being overheated in operation of the electric stove. The structure comprises: a main unit having a heating coil inside to heat a vessel put on an upper plate; a substrate installed inside the main unit and electrically connected to the heating coil; and a heat sink combined with the substrate to radiate heat transferred from the heating coil in the inside of the main unit. The heat sink has a fastening unit fastened to the substrate by a bolt on a lower surface of one end and a mounting tip inserted into an inner surface of the main unit is projected out in the other end of the heat sink.

Description

[0001] Heat sink assembly for electric range [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat dissipation structure for an electric range, and more particularly, to a heat dissipation structure for an electric range for preventing major components from being overheated when the electric range is operated.

Generally, an electric range is an appliance that cooks food with an electric heater or a separate heating element as a heat source. Such an electric range is generally mounted on a cook-top of an electric oven or the like. In recent years, there has been developed a method of heating the container itself by using an induction heating method without heating the container using a firebox. Since the induction heating method is free from flame, it is more safe than the conventional method using the flame of gas and its application is expanding

1 is an exploded perspective view showing a conventional electric range. The conventional electric range largely comprises the induction heating coil 3, the circuit board 10, and the heat sink 20. [

Specifically, the induction heating coil 3 is a part that generates a magnetic field by using an applied current when a current is applied. The circuit board 10 is mounted on the lower part of the induction heating coil 3 and controls the current applied to the induction heating coil 3 in response to the user's operation by mounting various kinds of transistors and semiconductors such as resistors, And adjusts the magnetic field generated in the heating coil 3.

The upper portion of the induction heating coil 3 is provided with a top plate (not shown) on which a container (not shown) containing food is placed. Therefore, when a current controlled by the circuit board 10 is applied to the induction heating coil 3, a magnetic field is generated in the induction heating coil 3. [ Then, the magnetic field acts on the container of the metal material that has passed through the upper plate, and induction current is generated by the magnetic field in the material of the container of the metal.

Generally, the metal used in the cooking device has a large resistance value, and when the induction current flows in the material, the resistance generates heat, thereby heating the food inside the container.

Therefore, in order to prevent the heat radiated from the container heated by the induction heating coil 3 and the magnetic field generated in the induction heating coil 3 from affecting the inner circuit board 10, And a circuit board (10).

A heat sink 20 for discharging the heat of the circuit board 10 to the outside is attached to the rear side of the circuit board 10. The heat sink 20 is generally made of an aluminum-based metal excellent in thermal conduction, and a radiating fin is formed on one side so that the conducted heat is smoothly discharged.

In order to smoothly discharge the heat transferred to one side of the heat sink 20, a blowing fan 25 for blowing air between the heat-radiating fins is provided.

Particularly, since the semiconductor 30 (see FIG. 2) such as an IGBT (Integrated Gate-Bipolar Transistor) mounted on a circuit board is sensitive to heat If the heat emission is not smooth, the control on the circuit board 10 may malfunction and the electric range may malfunction. Therefore, it is directly attached to the heat sink 20 in order to maximize the cooling effect.

2 is a partially enlarged view showing an engagement portion between a conventional heat sink and a circuit board.

As shown in FIG. 2, the semiconductor chip 30 is bent at a substantially right angle from the inverter circuit board 10 so as to be attached to the heat sink 20. A coupling hole 32 for fixing is formed on a central portion of the semiconductor chip 30 and on one surface of the heat sink 20 connected thereto. In order to prevent the current of the semiconductor chip 30 from being leaked to the heat sink 20 and to allow the heat of the semiconductor chip 30 to be smoothly transmitted to the heat sink 20, The manufactured insulating sheet 40 is provided between the semiconductor chip 30 and the heat sink 20. [

Therefore, when the fastening screw 62 is screwed into the coupling hole 32 formed in the semiconductor chip 30 and the heat sink 20 and tightened, the insulating sheet 40 is pressed and bonded to the semiconductor chip 30 and the heat sink 20 are in close contact with each other.

There is also a method in which the semiconductor chip 30 is pressed onto the surface of the heat sink 20 by using the fixing clip 50 instead of the fastening screw 62. The fixing clip 50 is provided with a fixing portion 52 which can be attached to the heat exchanger 20 as a screw 64 between the semiconductor chip 30 and the semiconductor chip 30, So that the semiconductor chip 30 can be pressed onto the surface of the heat sink 20 by bending.

Therefore, if the fixing clip 50 is fixed to the heat sink 20 by using the screw 64 after the fixing clip 50 is positioned between the semiconductor chips 30, 30 are tightly fixed to the heat sink 20. Therefore, the heat generated in the semiconductor chip 30 is transferred to the heat sink 20 through the coupling surface between the semiconductor chip 30 and the heat sink 20, and the semiconductor chip 30 is cooled.

However, the conventional method of coupling the heat sink and the semiconductor chip has the following problems.

First, in the conventional heat sink 20, since the radiating fin is formed in one direction, there is a limit to the improvement in heat radiation efficiency.

More specifically, both the method of fixing the semiconductor chip directly to the heat sink 20 through the fastening screw 62 and the method of fixing the semiconductor chip to the heat sink 20 and the method of fixing the semiconductor chip by using the fixing clip 50, The heat conduction is performed only on one side of the surface of the heat sink 30 that is connected to the heat sink 20 without heat conduction.

As a result, the semiconductor chip 30 such as an IGBT has a feature that the temperature instantly rises when operated by an element having a very large calorific value. Therefore, there is a problem that the cooling due to heat transfer on only one side with the heat sink 20 is insufficient, and the semiconductor chip 30 is damaged thereby.

The conventional heat sink 20 is a method of directly fixing the semiconductor chip 30 to the heat sink 20 through the fastening screw 62 and the fastening screw 62 is tightly fastened to the semiconductor chip 30 If the heat sink 20 is not fastened, it is difficult to transfer the heat sink 20 in the same manner as the fastening of the hook, in addition to the structure of the conventional heat sink 20. [ .

SUMMARY OF THE INVENTION The present invention has been made to overcome the above problems, and it is an object of the present invention to provide a heat radiating structure of an electric range which can improve a heat radiating performance of a device having a large heat generating amount by improving a heat radiating area, The purpose is to provide.

According to an aspect of the present invention, there is provided an apparatus for heating a container placed on a top plate, the apparatus comprising: a body; A substrate provided inside the body and electrically connected to the heating coil; And a heat sink coupled to the substrate and radiating heat from the heating coil inside the body, wherein the heat sink has a lower surface formed at one end thereof with a fastening portion for fastening the substrate with the bolt, And a mounting end protruding from an inner surface of the body is protruded from the other end.

A plurality of upper radiating fins may be formed on the upper surface of the heat sink at regular intervals, and a plurality of lower radiating fins may be formed on the lower surface of the heat sink at regular intervals.

The upper and lower widths of the radiating fins may become deeper from the region where the fastening portion of the heat sink is formed toward the side where the mounting end is formed.

Wherein the concave groove of the heat sink is formed in a slit shape with a predetermined depth and the heat sink is formed with a supporting surface contacting the upper surface of the substrate at a predetermined distance from the coupling portion, It is preferable that a part of the upper surface of the heat sink is formed with an inclined surface at a certain angle.

Wherein a front end supporting portion is formed on one side of the main body so that one end of the substrate is inserted and inserted, and a mounting end of the heat sink is inserted into the other side inner surface of the main body, And the other end supporting portion may be formed to be mounted.

According to the present invention, a plurality of radiating fins are formed on the upper surface and the lower surface of the heat sink, respectively, so that the radiating area is greatly improved to enable efficient heat dissipation to the high heat-dissipating element. So that it is possible to easily mount and construct the apparatus and improve the fastening efficiency.

1 is an exploded perspective view showing a conventional electric range,
FIG. 2 is a partially enlarged view showing an enlarged joint portion between a conventional heat sink and a circuit board,
3 is a perspective view of a heat sink of a heat dissipating structure of an electric range according to an embodiment of the present invention,
Fig. 4 is a side sectional view of Fig. 3,
FIG. 5 is a side sectional view showing a state in which the substrate is fastened in the state of FIG. 4,
FIG. 6 is a partially enlarged view of a fastening portion of a heat sink of a heat radiating structure of an electric range according to an embodiment of the present invention, and FIG.
7 is an installation view of a heat dissipating structure of an electric range according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a perspective view of a heat sink of a heat radiating structure of an electric range according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view of the heat sink of the conventional heat sink, FIG. 6 is a partially enlarged view of a fastening portion of a heat sink of a heat radiating structure of an electric range according to an embodiment of the present invention; FIG. 6 is a side cross- And FIG. 7 is an installation view of a heat-radiating structure of an electric range according to an embodiment of the present invention.

2 to 6, the heat sink 70 is fixed to the substrate 80 by a fastening bolt BT.

7, in order to fix the board 80 in a state where the board 80 is coupled to the board 80 by the bolts BT, the inner surface of the main body 100 is provided with a line- 120 are formed.

At this time, the line compartment 110 and the other compartment 120 have the shape of a latching protrusion protruding inward from the inner surface of the main body 100. The end of the substrate 80 is fixed to the duplex line 110 and the mounting end 74 of the heat sink 70 is fixed to the end of the main body 100 in a state where the substrate 80 and the heat sink 70 are engaged. It is possible to fasten the board 80 to the main body 100 without fixing the board 80 with the bolts.

Referring again to FIGS. 2 to 6, the heat sink 70 has the inclined surface 75a and the support surface 75b formed at its tip end, and the mounting tip 74 is formed at the other end to protrude laterally.

Specifically, the inclined surface 75a is provided in a form inclined at a constant angle with respect to the supporting surface 75b. Also, at the periphery of the support surface 75b, there is formed a fastening portion 71 formed to be concave at a predetermined depth and provided in a slit shape (see FIG. 6). As shown in FIG. 5, the fastening part 71 is fastened with a fastening bolt BT passing through the board 80 so as to be fixed to each other.

The support surface 75b of the heat sink 70 is installed in close contact with the upper surface of the substrate 80 in a state where the heat sink 70 is tightly coupled to the substrate 80 . That is, when the heat sink 70 is fastened to the substrate 80 through the fastening bolts BT, the heat sink 70 is fastened in a state in which the support surface 75b is in close contact with the upper surface of the substrate 80.

On the other hand, in the region where the fastening portion 71 of the heat sink 70 is formed, a plurality of radiating fins are formed in the region where the mounting tip end 74 is formed. Specifically, the radiating fins are formed by upper radiating fins 72 and lower radiating fins 73 formed at upper and lower portions of the heat sink 70, respectively. The heat dissipation fins 72 and 73 may have uneven surfaces 72a and 73b formed thereon to improve the heat dissipation area.

At this time, the upper heat radiating fin 72 and the lower radiating fin 73 may be formed deeper toward the mounting end 74 side to improve the heat radiating area. 4 and 5, the upper and lower heat radiating fins 72 and 73 are formed to have a larger width toward the mounting end 74 side. Accordingly, the heat radiation efficiency of the heat sink 70 can be improved to be closer to the mounting tip 74 side.

This can be applied to the inside of the main body 100 by varying the arrangement (width) of the radiating fins according to the arrangement of the high heat-dissipating elements, and this is only an example and various modifications are possible.

In the heat-radiating structure of the present invention having the above-described structure, heat dissipation fins 72 and 73 are formed on the upper and lower surfaces of the heat sink 70, respectively, The sink 70 can be mounted on the inner surface of the main body 100 without bolts in a state where the sink 70 is fastened to the substrate, thereby facilitating easy mounting and installation and improving the fastening efficiency.

While the present invention has been particularly shown and described with reference to the particular embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

70: Heatsink
71:
72: upper heat sink fin
73: Lower radiating fin
74: Mounting end
80: substrate
100:
110: Line only branch

Claims (5)

A body provided with a heating coil therein for heating a container placed on the upper plate;
A substrate provided inside the body and electrically connected to the heating coil; And
And a heat sink coupled to the substrate to dissipate heat from the heating coil inside the body,
Wherein the heat sink is formed with a fastening portion at one end of the heat sink to be bolted with the substrate, and a mounting end protruding from the inner surface of the body is formed at the other end of the heat sink. The method according to claim 1,
Wherein a plurality of upper radiating fins are formed on an upper surface of the heat sink at regular intervals and a plurality of lower radiating fins are formed on a lower surface of the heat sink with a predetermined gap therebetween. 3. The method of claim 2,
Wherein an upper and a lower width of the radiating fin are deeper toward a side where the mounting end is formed in an area where the fastening portion of the heat sink is formed. The method of claim 3,
Wherein the concave groove of the heat sink is formed in a slit shape having a predetermined depth and the heat sink is formed with a supporting surface contacting the upper surface of the substrate at a predetermined distance from the coupling portion,
Wherein an inclined surface of a certain angle is formed on a part of an upper surface of the heat sink opposite to the support surface. The method according to claim 1,
Wherein a front end supporting part is formed on one inner side surface of the main body so that one end of the substrate is inserted and mounted,
Wherein the other end supporting portion is formed on the other inner side surface of the main body so that the mounting tip of the heat sink is inserted and mounted in the state that the heat sink is fastened to the board with bolts.

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