KR20160149889A - Method for fabricating polymer laminate with moisture barrier, and method for fabricating electronic device comprising the same - Google Patents
Method for fabricating polymer laminate with moisture barrier, and method for fabricating electronic device comprising the same Download PDFInfo
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- KR20160149889A KR20160149889A KR1020150087690A KR20150087690A KR20160149889A KR 20160149889 A KR20160149889 A KR 20160149889A KR 1020150087690 A KR1020150087690 A KR 1020150087690A KR 20150087690 A KR20150087690 A KR 20150087690A KR 20160149889 A KR20160149889 A KR 20160149889A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/1307—Organic Field-Effect Transistor [OFET]
Abstract
(a) dissolving a metal oxide precursor in an organic solvent to prepare a metal oxide precursor solution; (b) coating the polymer substrate with a metal oxide precursor solution to prepare a solution-coated polymer substrate; And (c) irradiating the solution-coated polymer substrate with light while being heat-treated to produce a moisture-blocking polymer laminate having a moisture barrier film containing a metal oxide, wherein the moisture barrier polymer film A manufacturing method is provided. Thus, a water-blocking film containing a metal oxide is formed on a polymer substrate using a simple solution process applicable to a large-sized substrate, and a polymer having improved moisture barrier performance of a moisture barrier film by performing heat treatment and ultraviolet ray treatment together A laminate can be produced.
Description
The present invention relates to a method for producing a moisture barrier polymer layered product and a method for manufacturing an electronic device including the same, and more particularly to a moisture barrier polymer layered product having a moisture barrier film containing a metal oxide, And a method of manufacturing an electronic device including the same.
Over the past 25 years, organic semiconducting materials using monomolecular and polymeric materials have been making remarkable progress. Although semiconductor materials using basic inorganic materials have excellent characteristics and reliability, it is true that they are gradually transferring their role to the organic semiconductor material due to the disadvantages such as the high cost of manufacturing and the extreme conditions such as high temperature. Organic semiconductor materials are easier to manufacture than inorganic semiconductor materials because they are simple to manufacture and can be manufactured at low cost in the fabrication of devices. Due to the nature of organic materials, it is easy to develop materials that exhibit superior characteristics through simple structure modification .
Conventional organic electronic devices are more effective in causing changes in electrical performance by moisture than by oxygen, and most of the techniques for protecting against moisture and oxygen are made by a vacuum process. In the case of the metal oxide barrier film, a film having excellent characteristics can be obtained after complicated and long-time processing such as atomic layer deposition (ALD) and chemical vapor deposition (CVD). However, in order to maximize the advantages of organic electronics such as easy and simple, large-area application, it is necessary to develop a solution process.
In general solution process polymers, water permeability is 100 ~ 1 g / m 2 / day, which is very high compared to the water permeability required for organic electronic devices. Therefore, in order to solve this problem, it is necessary to improve the moisture barrier property by coating the polymer substrate or the electronic device used in the organic electronic device with the moisture barrier coating.
In the case of a material capable of being subjected to a solution process such as a fluorinated polymer or an organic hybrid as a moisture barrier film, it has a relatively low water permeability as compared with a general polymer, but is not expected to be applied to a long-life organic electronic device.
In addition, in the case of composite materials using layered self-assembly method and various nanofabric materials, they show low oxygen permeability, but they do not play a role as moisture barrier, and research on performance improvement is minimal.
On the other hand, in the case of metal oxide thin films, most of them are manufactured by using vacuum deposition. However, they show very good water permeability. However, in order to realize them by a solution process, they are usually applied to polymer substrates or organic electronic devices There is a problem that it is not suitable for the following.
An object of the present invention is to solve the above-described problems, and it is an object of the present invention to provide a moisture barrier film including a metal oxide on a polymer substrate by using a simple solution process applicable to large- The moisture barrier performance of the moisture barrier film can be improved.
Further, the present invention is to improve the driving stability and electrical characteristics by applying the water-blocking polymer laminate having the moisture barrier film to a flexible electronic device such as a flexible organic thin film transistor.
According to an aspect of the present invention, there is provided a method for producing a metal oxide precursor solution, comprising: (a) dissolving a metal oxide precursor in an organic solvent to prepare a metal oxide precursor solution; (b) coating the solution of the metal oxide precursor on the polymer substrate to prepare a solution-coated polymer substrate; And (c) irradiating the solution-coated polymer substrate with light while heat-treating to produce a moisture-blocking polymer laminate having a moisture barrier film containing a metal oxide, wherein the moisture barrier polymer laminate Is provided.
The metal oxide precursor is Al (NO 3) 3, Ti [OCH (CH 3) 2] 4, Zr (C 5 H 7 O 2) 4, Hf (OCH (CH 3) 2) 4, Al (OH) 3 , Ti (OC 4 H 9) 4, ZrO (NO 3) 2 And hydrates thereof.
The metal oxide may be at least one selected from Al 2 O 3 , TiO 2 , HfO 2 and ZrO 2 .
The organic solvent may be an alcohol-based solvent.
Wherein the alcoholic solvent is selected from the group consisting of methanol, ethanol, propanol, isopropanol, butanol, isobutanol, t-butanol, pentanol, 2-methoxyethanol, 1-methoxy-2-propanol and 3-methoxy- It may be more than one kind.
The polymer substrate may be a flexible polymer substrate.
Wherein the flexible polymer substrate is one selected from the group consisting of polyethylene terephthalide (PET), polyethylene naphthalate (PEN), polyethylene (PE), polyether sulfone (PES), polycarbonate (PC), polyarylate (PAR) And may include at least one selected.
The coating of step b may be performed by any one of the methods selected from spin coating, ink jet printing, dip coating, drop casting, bar coating, and slot die coating.
The heat treatment may be performed at 80 to 180 ° C.
The heat treatment may be performed for 5 to 60 minutes.
The light irradiation may be by ultraviolet rays.
The light irradiation may be performed with ultraviolet rays having a wavelength of 100 to 300 nm.
The light irradiation may be performed for 5 to 60 minutes.
The heat treatment and the light irradiation can be performed simultaneously.
After step (b), the step of drying the solution-coated polymer substrate may further comprise the step of drying.
The drying may be performed at 30 to 100 < 0 > C.
Step (c) can be carried out under a gas atmosphere selected from nitrogen gas or an inert gas.
The thickness of the moisture barrier film may be adjusted by performing the processes of (b) and (c) a plurality of times.
According to another aspect of the present invention, there is provided a method of manufacturing an electronic device including a method for producing a water-blocking polymer laminate having the moisture barrier film.
The electronic device may be a flexible electronic device.
The electronic device may be any one selected from a touch panel, an electroluminescent display, a backlight, a radio frequency identification (RFID) tag, a solar cell module, an electronic paper, a TFT for a flat display, and a TFT array.
The method for producing a moisture barrier polymer layer having a moisture barrier film of the present invention is characterized in that a moisture barrier film containing a metal oxide is formed on a polymer substrate using a simple solution process applicable to a large- Treatment can be performed together to improve the moisture barrier performance of the moisture barrier film.
In addition, driving stability and electrical characteristics can be improved by applying the water-blocking polymer laminate having such a moisture barrier film to a flexible electronic device such as a flexible organic thin film transistor.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flowchart sequentially showing a method for producing a moisture-blocking polymer laminate having a moisture barrier film of the present invention.
Fig. 2 is a process diagram showing a method for producing a moisture-blocking polymer laminate having a moisture barrier film of the present invention.
3 is a graph showing the measurement of the thickness of the aluminum oxide layer of the polymer laminate produced according to Example 1 and Comparative Example 2. Fig.
FIG. 4 is a graph showing FT-IR spectra of the polymer laminate produced according to Example 1 and Comparative Example 2. FIG.
FIG. 5 is a graph showing the X-ray photoemission spectroscopy (XPS) analysis results of the polymer laminate produced according to Example 1 and Comparative Example 2. FIG.
6 is a side cross-sectional view of a device manufactured for the analysis of leakage current density according to Test Example 4. Fig.
FIG. 7 is a graph showing leakage current density of a device in which a moisture barrier film is stacked according to Test Example 4. FIG.
8 is an exploded perspective view and a perspective view showing the structure of a calcium sensor including a polymer layered body for moisture-proof formed with a moisture barrier membrane manufactured according to Example 1, Comparative Example 1 and Comparative Example 2. FIG.
FIG. 9 is a graph showing electrical conductance of a Ca sensor including a moisture barrier polymer layer body formed with a moisture barrier membrane according to Example 1, Comparative Example 1, and Comparative Example 2. FIG.
Hereinafter, embodiments and examples of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention.
It is to be understood, however, that the following description is not intended to limit the invention to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises ", or" having ", and the like, specify that the presence of stated features, integers, steps, operations, elements, or combinations thereof is contemplated by one or more other features But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, or combinations thereof.
Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flowchart sequentially showing a method for producing a moisture-blocking polymer laminate having a moisture barrier film of the present invention. A method for producing a moisture-blocking polymer laminate having a moisture barrier film of the present invention will be described with reference to FIG.
First, a metal oxide precursor solution is prepared by dissolving a metal oxide precursor in an organic solvent (step a).
The metal oxide precursor is Al (NO 3) 3, Ti [OCH (CH 3) 2] 4, Zr (C 5 H 7 O 2) 4, Hf (OCH (CH 3) 2) 4, Al (OH) 3 , Ti (OC 4 H 9) 4, and ZrO (NO 3) 2 Luggage and so on. Preferably, Al (NO 3) may be 3 days.
The organic solvent may be an alcohol-based solvent.
The alcohol-based solvent may be at least one selected from the group consisting of methanol, ethanol, propanol, isopropanol, butanol, isobutanol, t-butanol, pentanol, 2-methoxyethanol, 1-methoxy- have. Preferably, the organic solvent may be 2-methoxyethanol. However, the scope of the present invention is not limited thereto, and any alcoholic solvent may be used.
Then, the metal oxide precursor solution is coated on the polymer substrate (step b).
The polymer substrate may be a flexible polymer substrate.
The polymer substrate may be at least one selected from the group consisting of polyethylene terephthalide (PET), polyethylene naphthalate (PEN), polyethylene (PE), polyether sulfone (PES), polycarbonate (PC), polyarylate (PAR), polyimide And so on. Preferably, the polymer substrate may be polyethylene naphthalate (PEN).
The coating may be spin coating, inkjet printing, dip coating, drop casting, bar coating, slot die coating, and the like. Preferably, the coating may be a spin coating.
Preferably, after step (b), a step of drying the solution-coated polymer substrate may be further performed.
The drying may be performed at 30 to 100 ° C, preferably at 40 to 90 ° C.
Thereafter, the polymer substrate coated with the solution is irradiated with light while being heat-treated to produce a moisture-blocking polymer laminate having a moisture barrier film containing metal oxide (step c).
The heat treatment may be performed at 80 to 180 ° C, preferably at 90 to 130 ° C. More preferably 100 to 120 < 0 > C
The heat treatment may be performed for 5 to 60 minutes, preferably 10 to 50 minutes. More preferably 20 to 40 minutes.
The light irradiation may be performed by ultraviolet light.
The wavelength of the ultraviolet ray may be 100 to 300 nm, and more preferably 150 to 280 nm, but the scope of the present invention is not limited thereto.
The light irradiation may be performed for 5 to 60 minutes, preferably 10 to 50 minutes. More preferably 20 to 40 minutes. That is, it is preferable that the heat treatment and the light irradiation are simultaneously performed for the same time.
The step (c) may be carried out under any one gas atmosphere selected from a nitrogen gas or an inert gas, and is preferably carried out under a nitrogen atmosphere.
The metal oxide is Al 2 O 3, TiO 2,
The thickness of the moisture barrier film including the metal oxide can be controlled by performing the steps of (b) and (c) a plurality of times.
The present invention provides a method of manufacturing an electronic device including a method for producing a moisture-blocking polymer laminate having the moisture barrier film formed thereon.
The electronic device may be a flexible electronic device.
The electronic device may be a touch panel, an electroluminescent display, a backlight, an RFID tag, a solar cell module, an electronic paper, a thin film transistor for a flat panel display, a thin film transistor array, , And an electronic device to which the moisture-blocking polymer laminate having the moisture barrier film formed thereon can be applied.
Hereinafter, preferred embodiments of the present invention will be described.
[Example]
Manufacturing example One
Al (NO 3 ) 3 was dissolved in a 2-methoxyethanol solvent to prepare a 0.2 M Al (NO 3 ) 3 solution.
Example One
0.3 ml of the Al (NO 3 ) 3 solution prepared according to Preparation Example 1 was applied to a PEN (polyethylene naphthalate) substrate (3.15 cm X 3.15 cm X 125um), followed by spin coating at 2000 rpm for 60 seconds.
The substrate coated with the Al (NO 3 ) 3 solution was put on a hot plate at 80 ° C and the solvent was sufficiently removed for 30 minutes.
Thereafter, the substrate was sufficiently filled with nitrogen to form an oxygen-free gas atmosphere, and the substrate coated with the Al (NO 3 ) 3 solution was exposed at 254 nm and 185 nm (UV lamp) for irradiating ultraviolet rays at a distance of about 1 cm from a UV lamp (low-pressure mercury lamp) for emitting ultraviolet rays of wavelength simultaneously, and simultaneously heat treatment was performed for 30 minutes on a hot plate at 110 DEG C to form aluminum oxide 2 O 3 ) coated PEN substrate was prepared.
The process of Example 1 is schematically shown in Fig.
Comparative Example One
A PEN (Polyethylene naphthalate) substrate was prepared and subjected to no treatment.
Comparative Example 2
A PEN substrate coated with aluminum oxide was prepared in the same manner as in Example 1 except that only the heat treatment was performed instead of the UV treatment and the heat treatment.
Production conditions and characteristics of the polymer laminate or polymer substrate prepared according to Example 1, Comparative Example 1 and Comparative Example 2 are summarized in Table 1 below.
(minute)
[ Test Example ]
Test Example 1. Density analysis of metal oxide layer
3 is a graph showing the thickness of an aluminum oxide layer of a substrate manufactured according to Example 1 and Comparative Example 2, measured.
Referring to FIG. 3, it was confirmed that the thickness of the moisture barrier layer of the substrate of Example 1 in which the heat treatment and the ultraviolet ray treatment were simultaneously performed was thinner than that of the substrate of Comparative Example 2 in which only the heat treatment was performed. The thickness of the aluminum oxide layer as the moisture barrier layer indicates the density of the moisture barrier layer and it means that the density of the moisture barrier layer including the aluminum oxide layer is increased by simultaneously performing the heat treatment and the ultraviolet ray treatment as in
Test Example 2. FT-IR analysis
FIG. 4 is a graph showing FT-IR spectra of the polymer laminate produced according to Example 1 and Comparative Example 2. FIG.
4, in the case of the polymer laminate of Example 1 in which the heat treatment and the ultraviolet ray treatment were simultaneously performed, the amount of CH, -OH functional groups, and NO in comparison with the polymer laminate of Comparative Example 2, which was performed only by heat treatment without light irradiation Of the total population.
It can be inferred that the moisture barrier membrane of the polymer laminate of Example 1 is reduced in the amount of C-H, -OH functional groups and N-O, so that the content of aluminum oxide is increased and the structure becomes dense and thus the moisture barrier performance is further improved.
Test Example 3. XPS analysis
FIG. 5 is a graph showing the X-ray photoemission spectroscopy (XPS) analysis results of the polymer laminate produced according to Example 1 and Comparative Example 2. FIG.
Referring to FIG. 5, it can be seen that the polymer laminate of Example 1 has a lower carbon content in the moisture barrier film than the polymer laminate of Comparative Example 2.
It can be inferred that the moisture barrier film of the polymer laminate of Example 1 has a reduced carbon content and an increased content of aluminum oxide to make the structure denser and thereby further improve the moisture barrier performance.
Test Example 4. Leakage current density analysis
Three n-doped silicon wafers were prepared, 0.3 ml of Al (NO 3 ) 3 solution prepared according to Preparation Example 1 was applied thereto, and spin-coated at 2000 rpm for 60 seconds.
The silicon wafer coated with the Al (NO 3 ) 3 solution was put on a hot plate at 80 ° C and the solvent was sufficiently removed for 30 minutes.
Thereafter, the laminate (laminate 1) subjected to the heat treatment and the ultraviolet ray treatment simultaneously, and the laminate (laminate 2) subjected only to the heat treatment. And a laminate (laminate 3) without heat treatment and ultraviolet ray treatment. Here, the heat treatment and ultraviolet ray treatment were performed under the same conditions as those of Example 1 or Comparative Example 2.
Aluminum was deposited on each of the aluminum oxide layers of the
FIG. 7 shows the measurement result of the leakage current divided by the substrate width by using the above-described
Referring to FIG. 7, the
Test Example 5. Moisture permeability analysis
8 is an exploded perspective view and a perspective view showing the structure of a calcium sensor including a polymer layered body for moisture-proof formed with a moisture barrier membrane manufactured according to Example 1, Comparative Example 1 and Comparative Example 2. FIG. FIG. 9 shows the electric conductivity of the calcium sensor.
Referring to FIG. 8, the calcium sensor includes two aluminum electrodes stacked on a glass substrate at predetermined intervals, and a calcium layer between the two aluminum electrodes. The horizontal and vertical widths of the calcium layer were the same length. In addition, a structure is shown in which a support layer is formed on the electrode, and a moisture barrier polymer laminate having the moisture barrier film formed according to Example 1, Comparative Example 1, and Comparative Example 2 is laminated thereon.
The amount of change in electrical conductivity is measured using the calcium sensor, and the water permeability of the water-blocking polymer laminate having the moisture barrier of the present invention can be measured.
The water permeability (P) was measured by measuring the change in electric conductivity (1 /? R) by exposing the calcium sensor to a temperature condition of 25 占 폚 at a relative humidity of 50% per day.
Specifically, the water permeability (P) was calculated according to the following equation (1).
[Formula 1]
R: resistance, ρ: Ca resistivity, b: width of Ca layer, l: length of Ca layer
n is the molar equivalent of the degradation reaction, and δ is the density of Ca
Experimental values according to the present invention are as follows.
n: 2, δ (g / cm 3): 1.55,
M (H 2 O) (g / mol): 18,
M (Ca) (g / mol): 40.1,
ρ (Ωm): 3.4 × 10 -8 ,
Area (Ca) (cm < 2 >): 4,
Window area (cm²): 6.76
[Formula 2]
Referring to FIG. 9, it can be seen that the higher the change in the conductance per unit time, the gentler the slope and the lower the moisture permeability.
The calcium sensor including the polymer substrate of Comparative Example 1 in which the moisture barrier film was not formed on the PEN substrate exhibited the most abrupt gradient. Next, the calcium sensor including the polymer laminate of Comparative Example 2 in which the heat treatment was performed only, The sensor (Ca sensor) showed a large slope. On the contrary, the Ca sensor including the polymer laminate of Example 1 in which the heat treatment and the ultraviolet ray treatment were performed at the same time showed a relatively gentle slope. The results show that the moisture barrier performance of the polymer laminate forming the moisture barrier film of Example 1 in which the heat treatment and the ultraviolet ray treatment are simultaneously performed is greatly improved.
The moisture permeability results are shown in Table 2 below.
(g / m 2 / day)
The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.
Claims (20)
(b) coating the solution of the metal oxide precursor on the polymer substrate to prepare a solution-coated polymer substrate; And
(c) irradiating the solution-coated polymer substrate with light while heat-treating to produce a moisture-blocking polymer laminate having a moisture barrier film containing a metal oxide;
Wherein the moisture barrier layer comprises a water-absorbing polymer.
The metal oxide precursor is Al (NO 3) 3, Ti [OCH (CH 3) 2] 4, Zr (C 5 H 7 O 2) 4, Hf (OCH (CH 3) 2) 4, Al (OH) 3 , Ti (OC 4 H 9) 4, and ZrO (NO 3) 2 A hydrate thereof, and a hydrate thereof. The method for producing a water-barrier polymer layered body according to claim 1,
Wherein the metal oxide is at least one selected from the group consisting of Al 2 O 3 , TiO 2 , HfO 2 , and ZrO 2 .
Wherein the organic solvent is an alcohol-based solvent.
Wherein the alcoholic solvent is selected from the group consisting of methanol, ethanol, propanol, isopropanol, butanol, isobutanol, t-butanol, pentanol, 2-methoxyethanol, 1-methoxy-2-propanol and 3-methoxy- Wherein at least one of the water-blocking polymer and the water-blocking polymer is one or more selected from the group consisting of water-soluble polymer and water-soluble polymer.
Wherein the polymer substrate is a flexible polymer substrate. ≪ RTI ID = 0.0 > 11. < / RTI >
Wherein the flexible polymer substrate is at least one selected from the group consisting of polyethylene terephthalide (PET), polyethylene naphthalate (PEN), polyethylene (PE), polyethersulfone (PES), polycarbonate (PC), polyarylate (PAR) Wherein the water-blocking layer is formed of at least one selected from the group consisting of water-soluble polymer and water-soluble polymer.
Wherein the coating of step b is carried out by any one of the following methods: spin coating, inkjet printing, dip coating, drop casting, bar coating, and slot die coating. Way.
Wherein the heat treatment is performed at 80 to 180 ° C.
Wherein the heat treatment is performed for 5 to 60 minutes. ≪ RTI ID = 0.0 > 11. < / RTI >
Wherein the light irradiation is performed by ultraviolet rays. ≪ RTI ID = 0.0 > 11. < / RTI >
Wherein the light irradiation is performed with ultraviolet rays having a wavelength of 100 to 300 nm. ≪ RTI ID = 0.0 > 18. < / RTI >
Wherein the light irradiation is performed for 5 to 60 minutes. ≪ RTI ID = 0.0 > 11. < / RTI >
Wherein the heat treatment and the light irradiation are simultaneously performed. ≪ RTI ID = 0.0 > 11. < / RTI >
And drying the polymer substrate coated with the solution after the step (b). ≪ RTI ID = 0.0 > 11. < / RTI >
Wherein the drying is performed at 30 to 100 ° C.
Wherein the step (c) is performed under any one of a gas atmosphere selected from a nitrogen gas and an inert gas.
Wherein the moisture barrier layer is formed by repeating the steps of (b) and (c) a plurality of times to adjust the thickness of the moisture barrier layer.
Wherein the electronic device is any one selected from a touch panel, an electroluminescent display, a backlight, a radio frequency identification (RFID) tag, a solar cell module, an electronic paper, a TFT for a flat display, and a TFT array.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180125800A (en) | 2017-05-16 | 2018-11-26 | 한국세라믹기술원 | Method for manufacturing resistive oxide thin film and method of manufacturing bolometer |
| KR20180138273A (en) * | 2017-06-20 | 2018-12-31 | 삼성디스플레이 주식회사 | Forming method of thin film and fabrication method of display apparatus using the same |
| KR20230116558A (en) * | 2022-01-28 | 2023-08-04 | 한국과학기술연구원 | Forming method of compound using moisture barrier, and manufacturing methods of chalcopyrite compound thin film and solar cell using the forming method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101089715B1 (en) | 2009-11-05 | 2011-12-07 | 한국기계연구원 | Multi layer thin film for encapsulation and the method thereof |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101089715B1 (en) | 2009-11-05 | 2011-12-07 | 한국기계연구원 | Multi layer thin film for encapsulation and the method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180125800A (en) | 2017-05-16 | 2018-11-26 | 한국세라믹기술원 | Method for manufacturing resistive oxide thin film and method of manufacturing bolometer |
| KR20180138273A (en) * | 2017-06-20 | 2018-12-31 | 삼성디스플레이 주식회사 | Forming method of thin film and fabrication method of display apparatus using the same |
| KR20230116558A (en) * | 2022-01-28 | 2023-08-04 | 한국과학기술연구원 | Forming method of compound using moisture barrier, and manufacturing methods of chalcopyrite compound thin film and solar cell using the forming method |
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