KR20160138672A - System and method to deposition substrate - Google Patents

System and method to deposition substrate Download PDF

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Publication number
KR20160138672A
KR20160138672A KR1020150072813A KR20150072813A KR20160138672A KR 20160138672 A KR20160138672 A KR 20160138672A KR 1020150072813 A KR1020150072813 A KR 1020150072813A KR 20150072813 A KR20150072813 A KR 20150072813A KR 20160138672 A KR20160138672 A KR 20160138672A
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substrate
module
chamber
compartment space
deposition
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KR1020150072813A
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Korean (ko)
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KR101688398B1 (en
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황인호
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주식회사 선익시스템
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    • H01L51/56—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L51/0002—
    • H01L51/0026—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A substrate deposition system according to an embodiment of the present invention is a substrate deposition system for forming an organic electroluminescent device on a substrate, the substrate deposition system comprising: a transfer module chamber; And a cluster type process chamber disposed along the circumferential direction around the transfer module chamber and transferring the substrate from the transfer module chamber to perform a deposition process and a curing process for the substrate, A chamber housing having a partition wall for partitioning a space in a center region thereof; A chucking portion for holding the substrate in each space of the chamber housing; And a processing module that moves along one direction of the substrate in the chamber housing and injects organic materials onto the substrate to deposit organic materials on the substrate and transport them along the other direction and cures the organic materials deposited on the substrate. According to the embodiment of the present invention, not only the deposition process of the substrate but also the curing process can be performed by the reciprocating movement of the process module, and the efficiency of the process for the substrate can be improved.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate deposition system,

A substrate deposition system and a method of depositing a substrate thereon are disclosed. More particularly, the present invention relates to a substrate deposition system and a substrate deposition method thereof, which can improve the efficiency of a process with respect to a substrate as well as a deposition process as well as a curing process by reciprocating the process module.

Organic Luminescence Emitting Device (OLED) is a self-luminous device that emits light by itself using an electroluminescent phenomenon that emits light when a current flows through a fluorescent organic compound. A backlight for applying light to a non- It is possible to manufacture a lightweight thin flat panel display device. A flat panel display device using such an organic electroluminescent device has a fast response speed and wide viewing angle, and is emerging as a next generation display device.

The organic electroluminescent device includes an organic thin film such as a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer, which are organic layers other than the anode and the cathode. The organic thin film is deposited on the substrate by a vacuum thermal deposition method do.

Herein, as an equipment system for forming an organic thin film or a metal thin film by a vacuum thermal deposition method, an inline deposition system is applied to a cluster type deposition system.

The clustered deposition system is a method for depositing an organic thin film on a substrate by clustering a plurality of vacuum chambers to form various organic thin films, for example, as described in Korean Patent Application No. 10-2007-0063691, A system is a system in which a plurality of substrates are mounted on a shuttle while a plurality of process chambers are arranged in a row, and the deposition process is performed while continuously transferring the substrates.

In the vacuum thermal deposition method, a substrate is transferred into a vacuum chamber, a mask having a predetermined pattern is aligned with the transferred substrate, a liquid organic material in a monomer form is transferred from the organic material container to an evaporator, and the liquid organic material is vaporized in an evaporator, Is deposited on the substrate in the vacuum chamber. There is also a process of curing the evaporation material by irradiating ultraviolet rays onto the evaporated substrate.

However, in the conventional vapor deposition system, since the vapor deposition process and the curing process are individually performed on the substrate, there is a limit in which a certain tact time is required in the process.

Therefore, it is required to develop a deposition apparatus of a new structure that can shorten the time required for the process of curing after depositing the substrate.

It is an object of the present invention to provide a substrate deposition system and a method of depositing a substrate on the substrate which can improve the efficiency of the process for the substrate as well as the deposition process of the substrate by the reciprocating movement of the process module as well as the curing process .

It is another object of the present invention to provide a swinging structure of a processing module, which can process a substrate disposed in one compartment space and subsequently process a substrate disposed in the next compartment space immediately after processing, And to provide a substrate deposition system and a substrate deposition method thereof that can simplify the structure of the process chamber as well as improve efficiency.

A substrate deposition system according to an embodiment of the present invention is a substrate deposition system for forming an organic electroluminescent device on a substrate, the substrate deposition system comprising: a transfer module chamber; And a cluster type process chamber disposed along the circumferential direction around the transfer module chamber and transferring the substrate from the transfer module chamber to perform a deposition process and a curing process for the substrate, A chamber housing having two substrates arranged in parallel and having a partition wall for partitioning a space in a central region; A chucking portion for holding the substrate in each space of the chamber housing; And a processing module that moves along one direction of the substrate in the chamber housing and sprays an organic material on the substrate to deposit organic materials on the substrate and to transport the organic materials along another direction and to cure the organic materials deposited on the substrate By this configuration, not only the deposition process of the substrate but also the curing process can be performed by the reciprocating movement of the process module, so that the efficiency of the process for the substrate can be improved.

According to one aspect, the processing module comprises: a module body; An organic material spraying unit mounted on the module main body and spraying the organic material onto the substrate; A hardening unit mounted on the module body and irradiating ultraviolet rays toward the substrate; And a moving part mounted on the module body and reciprocating the module body in the chamber housing.

According to one aspect of the present invention, the module body is movable from a first compartment space, which is one compartment space of the chamber housing defined by the partition wall, to a second compartment space which is another compartment space.

According to one aspect of the present invention, when the module body moves along one direction of the substrate in the first compartment space according to the driving of the moving unit, the organic material is injected from the organic material spray unit to perform a deposition process on the substrate, The curing process for the substrate is performed by the curing unit when the module body moves along the other direction of the substrate in the first compartment space according to the driving of the moving unit, Is moved to the second compartment space, and the module body moves reciprocally through the second compartment space by driving the moving unit, the deposition process and the curing process for another substrate arranged in the second compartment space can be executed have.

According to one aspect, the chamber housing may be formed such that the first compartment space and the second compartment space of the chamber housing have a radial direction with respect to a virtual reference point of the transfer module chamber.

According to one aspect of the present invention, the module body or the inner wall of the chamber housing may be provided with a confinement part for trapping a part of organic matter suspended in the organic material sprayed from the organic material spray part without being directed to the substrate.

According to one aspect of the present invention, a plurality of transfer module chambers are provided, and a plurality of the process chambers are disposed along the perimeter of the transfer module chamber, and the transfer module chambers may be connected to a buffer chamber for buffering the substrate.

According to one aspect, a mask stocker may be disposed around the transfer module chamber to store a mask for masking the substrate in the process chamber.

Meanwhile, a method of depositing a substrate in a substrate deposition system according to an embodiment of the present invention includes: transferring a substrate from the transfer module to a first compartment space or a second compartment space of the chamber housing having two compartment spaces, An incoming step; And a deposition and curing step of performing a deposition and curing process on the substrate drawn into the first compartment space or the second compartment space by driving the processing module.

According to one aspect, after completing the deposition and curing steps, the processing module moves to the second compartment space and performs the deposition and curing steps for the substrate disposed in the second compartment space, and in the second compartment space During the deposition and curing of the substrate, the substrate having been deposited and cured in the first compartment space may be transferred to the transfer module chamber and a new substrate may be introduced into the first compartment space.

According to one aspect, the processing module comprises: a module body; An organic material spraying unit mounted on the module main body and spraying the organic material onto the substrate; A hardening unit mounted on the module body and irradiating ultraviolet rays toward the substrate; And a moving part mounted on the module main body and reciprocating the module main body in the chamber housing, wherein the deposition and curing step moves the module main body in one direction of the substrate by driving the moving part, Depositing an organic material on the substrate by spraying an organic material from the organic material spraying unit; And a curing step of moving the module body in the other direction of the substrate by driving the moving part and irradiating ultraviolet rays from the curing part to cure the organic substances deposited on the substrate.

According to the embodiment of the present invention, not only the deposition process of the substrate but also the curing process can be performed by the reciprocating movement of the process module, and the efficiency of the process for the substrate can be improved.

Further, according to the embodiment of the present invention, since the swinging structure of the processing module can process the substrate disposed in one compartment space, the substrate disposed in the next compartment space can be processed immediately, thereby improving the efficiency of the process In addition, the structure of the process chamber can be simplified,

FIG. 1 is a schematic view of a substrate deposition system according to an embodiment of the present invention. Referring to FIG.
FIG. 2 is a view schematically showing the internal structure of the cluster type process chamber shown in FIG. 1. FIG.
FIGS. 3A and 3B are views schematically showing a process of depositing and hardening a substrate by a processing module in the process chamber shown in FIG. 2. FIG.
Fig. 4 is a plan view of Fig. 3. Fig.

Hereinafter, configurations and applications according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE INVENTION The following description is one of many aspects of the claimed invention and the following description forms part of a detailed description of the present invention.

In the following description, well-known functions or constructions are not described in detail for the sake of clarity and conciseness.

FIG. 1 is a view schematically showing a configuration of a substrate deposition system according to an embodiment of the present invention, FIG. 2 is a view schematically showing an internal configuration of a cluster type process chamber shown in FIG. 1 3A and 3B are views schematically showing a process of depositing and curing a substrate by a processing module in the process chamber shown in FIG. 2, and FIG. 4 is a plan view of FIG. 3.

Referring to FIG. 1, a substrate deposition system 100 according to an embodiment of the present invention includes an organic light emitting diode (OLED) A deposition system (100) comprising: a plurality of transfer module chambers (10,10a, 10b) spaced apart from one another continuously and a transfer module chamber (10,10a, 10b) And a process chamber 110, 110a, 110b provided in each transfer module chamber for performing a deposition process for the substrate W. The buffer chambers 30a,

In the case of the substrate deposition system 100 shown in Fig. 1, a total of three transfer module chambers 10, 10a and 10b are provided, and each transfer module chamber 10, 10a and 10b is subjected to another deposition process Process chambers 110, 110a and 110b are provided.

For example, in the case of the transfer module chamber 10b disposed at the leftmost end in FIG. 1, a total of two process chambers 110b are provided and a mask stocker 20b in which a mask is stacked is provided. 110b, a process of depositing an organic EL on the thin film transistor substrate may be performed.

In the case of the middle transfer module chamber 10a, a total of four process chambers 110a are provided. In this process chamber 110a, a process of depositing an inorganic material on the substrate on which the organic EL is deposited may be performed.

In the case of the transfer module chamber 10 disposed on the rightmost side, a total of two process chambers 110, i.e., a process chamber 110 according to an embodiment of the present invention, are provided, A mask 20 may be provided to provide a mask to the process chamber 110 immediately when a mask replacement is required. In the case of performing the deposition process for the substrate W, it is necessary to replace the mask when the number of deposition processes is approximately equal to a certain degree. In this embodiment, the mask stocker 20 ), So that the mask can be quickly replaced. In the process chamber 110, a process of depositing an organic material, that is, a polymer, on the substrate W on which an inorganic substance is deposited may be performed.

Here, the deposition process for the substrate W can be performed by alternately depositing inorganic materials, organic materials, and inorganic materials on the substrate W. However, it goes without saying that the configuration of the process chambers 110, 110a, and 110b disposed in the respective transfer module chambers 10, 10a, and 10b may be different depending on the necessary deposition accuracy of each organic layer of the organic electroluminescent device.

The buffer chambers 30a and 30b connect the adjacent transfer module chambers 10, 10a and 10b to form an in-line system. The buffer chambers 30a and 30b are disposed between the transfer modules 10,10a and 10b as shown in Figure 1 and the substrate W is temporarily accommodated in the transfer module chambers 10,10a and 10b So that the robot arm (not shown) provided therein can easily transfer the substrate W.

Hereinafter, a process chamber 110 disposed in the transfer module chamber 10, which is the rightmost transfer chamber among the process chambers described above, for depositing organic materials will be described.

The process chamber 110 of the substrate deposition system 100 according to an embodiment of the present invention may be configured such that two substrates W can be arranged in parallel, as shown in FIGS. 2 to 4, A chucking part 130 for holding the substrate W as an object to be deposited in each of the compartment spaces S1 and S2 of the chamber housing 120, (150) reciprocating in one direction of the substrate (W) within the substrate (120) and performing a deposition process and a curing process for the substrate (W).

The chamber housing 120 of the present embodiment is partitioned into two compartment spaces S1 and S2, that is, a first compartment space S1 and a second compartment space S2, in a cluster type. A first partition space S1 and a second partition space S2 are divided into a first partition space S1 and a second partition space S2 by providing a partition wall 121 at the center of the chamber housing 120, They can be kept completely blocked from being affected by each other's processes.

The second compartment space S2 is not affected by the conditions in the first compartment space S1 when the deposition and curing process for the substrate W proceeds in the first compartment space S1, This is also the case.

On the other hand, the chamber housing 120 maintains a vacuum state during the process so that a reliable process for the substrate W can proceed.

Referring to FIG. 2, the chamber housing 120 has a shape in which two compartment spaces S1 and S2 having a rectangular shape are in contact with each other. Due to this structure, the first compartment space S1 and the second compartment space S2 can have a radial direction with respect to a virtual reference point of the transfer module chamber 10, for example, a portion on which the robot arm is mounted 1).

A chucking part 130 is provided in each of the compartment spaces S1 and S2 of the chamber housing 120 so as to be vertically movable. When the chucking portion 130 is lowered while grasping the substrate W, the substrate W is aligned by an alignment portion (not shown), so that the substrate W is held in each of the partition spaces S1, S2 of the chamber housing 120, (W) can be disposed at the correct position.

In the chamber housing 120, organic substances injected through the organic material injecting unit 151 of the processing module 150, that is, monomers floating in the chamber housing 120 without being directed to the substrate W (Not shown) may be provided for trapping. If the organic matter is suspended in the chamber housing 120 rather than the substrate W, the reliability of the deposition process for the substrate W may be deteriorated and a contamination problem may occur in the chamber housing 120. In this embodiment, It is possible to trap a part of the organic material (the organic material floating without being deposited), thereby preventing the occurrence of such a problem.

2 to 4, the processing module 150 of the present embodiment includes a module main body 153 and an upper portion of the module main body 153 so as to communicate with the inner space of the module main body 153 An organic material spraying unit 151 for spraying organic matter or monomers toward the substrate W, a hardening unit 155 mounted on the upper portion of the module body 153 to selectively irradiate ultraviolet rays toward the substrate W, And a moving unit 157 mounted on the main body 153 and reciprocating the module main body 153 in the chamber housing 120 in the longitudinal direction of the substrate W. [

The module body 153 reciprocates by driving the moving part 157 along the long side of the fixed substrate W in the chamber housing 120 to perform the deposition and curing on the substrate W Can be performed.

The module main body 153 is installed in the lower part of the substrate W in the chamber housing 120. The inside of the module main body 153 and the injection port 152 of the organic spray part 151 are mutually communicated .

The internal space of the module main body 153 is interconnected with an evaporator (not shown) for providing organic matter, that is, a monomer. The inner pressure of the chamber housing 120 becomes substantially vacuum so that the pressure of the inner space of the evaporator becomes a high pressure, Is sprayed onto the substrate W through the injection port 152 of the substrate 151 to deposit the organic material on the substrate W. [

At this time, since the organic material injected through the organic material spraying unit 151 must reach over the entire surface of the substrate W, the injection port of the organic material spraying unit 151 is located at the short side of the substrate W And has a corresponding length. The organic material spraying portion 151 having such a structure moves from the side of the substrate W to the other end along the long side direction of the substrate W by driving the moving portion 157 to be described later, It can be done.

On the other hand, the hardened portion 155 of this embodiment is located on the side of the organic material spraying portion 151 at the upper portion of the module main body 153, as shown in Figs. 3A and 3B. The hardened portion 155 may also have a length corresponding to the short side of the substrate W. [

3A, when the module body 153 is moved in one direction along the long side of the substrate W by driving of the moving part 157, organic matter is injected from the organic material spraying part 151, So that a deposition process for the substrate W can be performed.

3B, the module body 153 moves in the opposite direction along the long side of the substrate W by driving the moving unit 157. At this time, the ultraviolet rays are irradiated from the hardened unit 155 So that the organic substances deposited on the substrate W can be cured. At this time, by controlling the moving speed of the module body 153, it is possible to provide enough ultraviolet light to cure the organic substances deposited on the substrate W.

When the deposition and curing processes are performed on the substrate W disposed in the first compartment space S1 of the chamber housing 120 by the above-described configurations, The deposition and curing processes must also be performed on the substrate W. [ In this case, the process for the substrate W may be performed by providing the respective processing modules 150 in the respective partition spaces S1 and S2. However, in this case, the process is disadvantageous in terms of cost, The space efficiency can be lowered because it is required a lot.

Therefore, in the case of the present embodiment, the processing module 150 not only has a structure of reciprocating in one compartment space S1 or S2 as described above, but also moves between the first compartment space S1 and the second compartment space S2 Lt; / RTI >

That is, the module main body 153 of the processing module 150 can reciprocate along the long side of the substrate W in one compartment space S1 or S2 by the driving force provided from the moving part 157, The beginning of the first compartment space S1 and the beginning of the second compartment space S2.

For example, the processing module 150 reciprocates with respect to the substrate W provided in the first compartment space S1, performs the deposition and curing process on the substrate W, The deposition and curing process can be performed on the substrate W which is moved in the second compartment space S2 and reciprocally moved and disposed in the second compartment space S2.

Here, when the substrate W is processed in the first compartment space S1 and then the substrate W is processed in the second compartment space S2, at the same time, in the first compartment space S1, W can be unloaded to the outside and the new substrate W can be loaded into the first compartment space S1. This structure can increase the efficiency of the treatment process.

The moving part 157 of this embodiment can be applied to any driving principle as far as it can reciprocate and swing the module main body 153 on which the organic material spraying part 151 and the hardening part 155 are mounted.

For example, the moving part 157 may be provided in a rail shape so that the module main body 153 can be moved. Alternatively, the moving unit 157 may be provided in the form of a conveyor so that movement of the module body 153 may be realized. Or the moving part 157 may be provided in a linear motor structure so that the movement of the module main body 153 linearly takes the vibration to the maximum extent. However, the present invention is not limited to this and other applications of the moving part 157 may be possible as long as the module body 153 can be moved smoothly and accurately within the chamber housing 120 as described above.

Hereinafter, the substrate deposition method of the substrate deposition system 100 having the above-described structure will be described once again.

The substrate deposition method of the substrate deposition system 100 according to an embodiment of the present invention is a method of depositing a substrate W from a transfer module chamber 10 into a first compartment space S1 of a chamber housing 120, And a deposition and curing process for carrying out a deposition and curing process for the substrate W while reciprocally moving the module main body 153 in the longitudinal direction of the substrate W by driving the moving section 157 of the processing module 150 and Curing step.

After the process for the substrate W disposed in the first compartment space S1 is completed and the process module 150 is moved to the second compartment space S2, A step of carrying out the deposition and curing process for the substrate W while moving the module body 153 in the long-side direction of the substrate W by driving of the substrate 157 can be performed.

At this time, when the process for the substrate W is proceeded in the second compartment space S2, the substrate W disposed in the first compartment space S1 is taken out and the new substrate W is taken out of the first compartment space S2, And can be loaded into the space S1.

As described above, according to the embodiment of the present invention, not only the deposition process of the substrate W but also the curing process can be performed by the reciprocal movement of the process module 150, thereby improving the efficiency of the process for the substrate W There are advantages to be able to.

In addition, after the substrate W disposed in the one compartment space S1 is processed by the swing movement structure of the processing module 150, the substrate W disposed in the next compartment space S2 is processed The efficiency of the process can be improved and the structure of the process chamber 110 can be simplified.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: substrate deposition system
110: Process chamber
120: chamber housing
150: Processing module
151:
153: Module body
155:
157:
S1: First compartment space
S2: second compartment space

Claims (11)

A substrate deposition system for forming an organic electroluminescent device on a substrate,
Transfer module chambers; And
A cluster type process chamber disposed along the circumferential direction around the transfer module chamber and transferring the substrate from the transfer module chamber to perform a deposition process and a curing process on the substrate;
/ RTI >
The process chamber includes:
A chamber housing having two substrates arranged in parallel and having a partition wall for partitioning a space in a central region;
A chucking portion for holding the substrate in each space of the chamber housing; And
A processing module moving along one direction of the substrate in the chamber housing and spraying an organic material onto the substrate to deposit organic material on the substrate and transporting the organic material along another direction and curing the organic material deposited on the substrate;
≪ / RTI >
The method according to claim 1,
The processing module comprises:
A module body;
An organic material spraying unit mounted on the module main body and spraying the organic material onto the substrate;
A hardening unit mounted on the module body and irradiating ultraviolet rays toward the substrate; And
And a moving part mounted on the module body for reciprocating the module body in the chamber housing.
3. The method of claim 2,
Wherein the module body is movable from the first compartment space, which is one compartment space of the chamber housing partitioned by the partition wall, to the second compartment space which is another compartment space.
The method of claim 3,
The organic material is injected from the organic material spraying part when the module body moves along one direction of the substrate in the first compartment space in accordance with the driving of the moving part to perform the deposition process on the substrate, The curing process for the substrate is performed by the curing unit when the module body moves along the other direction of the substrate in the first compartment space according to the driving of the moving unit, And a deposition process and a curing process are performed on another substrate disposed in the second compartment space as the module body reciprocates in the second compartment space by driving the moving unit after moving to the compartment space.
The method of claim 3,
Wherein the chamber housing is formed such that the first compartment space and the second compartment space of the chamber housing have a radial direction with respect to a virtual reference point of the transfer module chamber.
3. The method of claim 2,
And a concatenation part for trapping a part of organic matter suspended in the organic material sprayed from the organic material spraying part without being directed to the substrate is provided on the inner surface of the module body or the chamber housing.
The method according to claim 1,
A plurality of transfer module chambers are provided,
Wherein the transfer module chamber is provided with a plurality of the process chambers along the circumference thereof,
Wherein the transfer module chambers are connected to a buffer chamber that buffers the substrate.
8. The method of claim 7,
And a mask stocker is disposed around the transfer module chamber to store a mask for stacking the mask for masking the substrate in the process chamber.
A substrate deposition method of a substrate deposition system according to claim 1,
Drawing the substrate from the transfer module into a first compartment space or a second compartment space of the chamber housing having two compartment spaces; And
A deposition and curing step of performing a deposition and curing process on the substrate drawn into the first or second compartment space by driving the processing module;
≪ / RTI >
10. The method of claim 9,
After the deposition and curing step is completed, the processing module moves to the second compartment space and executes the deposition and curing steps for the substrate disposed in the second compartment space,
The substrate having been deposited and cured in the first compartment space is transferred to the transfer module chamber and a new substrate is introduced into the first compartment space in the deposition and curing of the substrate in the second compartment space, ≪ / RTI >
10. The method of claim 9,
The processing module comprises:
A module body;
An organic material spraying unit mounted on the module main body and spraying the organic material onto the substrate;
A hardening unit mounted on the module body and irradiating ultraviolet rays toward the substrate; And
And a moving part mounted on the module body and reciprocating the module body in the chamber housing,
Wherein the deposition and curing comprises:
A deposition step of moving the module body in one direction of the substrate by driving the moving part and spraying an organic material from the organic material spray part to deposit an organic material on the substrate; And
And a curing step of moving the module body in the other direction of the substrate by driving the moving part and irradiating ultraviolet rays from the curing part to cure the organic substances deposited on the substrate.
KR1020150072813A 2015-05-26 2015-05-26 Substrate deposition System KR101688398B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190132198A (en) * 2018-05-18 2019-11-27 삼성전자주식회사 Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080003911A (en) * 2005-04-22 2008-01-08 바이텍스 시스템즈 인코포레이티드 Apparatus for depositing a multilayer coating on discrete sheets
KR20080026168A (en) * 2005-07-13 2008-03-24 후지필름 디마틱스, 인크. Fluid deposition cluster tool
KR20130089039A (en) * 2012-02-01 2013-08-09 삼성디스플레이 주식회사 Deposition source, deposition apparatus and method of manufacturing organic light emitting display apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080003911A (en) * 2005-04-22 2008-01-08 바이텍스 시스템즈 인코포레이티드 Apparatus for depositing a multilayer coating on discrete sheets
KR20080026168A (en) * 2005-07-13 2008-03-24 후지필름 디마틱스, 인크. Fluid deposition cluster tool
KR20130089039A (en) * 2012-02-01 2013-08-09 삼성디스플레이 주식회사 Deposition source, deposition apparatus and method of manufacturing organic light emitting display apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190132198A (en) * 2018-05-18 2019-11-27 삼성전자주식회사 Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus

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