KR20160131185A - Carrier for substrate and chemical mechanical polishing apparatus having the same - Google Patents

Abstract

According to the present invention, disclosed are a substrate carrier, capable of uniformly applying application pressure to a substrate during a substrate polishing process, and a chemical mechanical substrate polishing apparatus including the same. The substrate carrier comprises: a main unit receiving rotary driving force from the outside to be rotated; a membrane fixed in the main unit to be rotated with the main unit and holding a substrate; a divided member installed inside the main unit in a state separated from the membrane, lowered and combined with the membrane for a polishing process to form a plurality of pressure chambers and press the membrane; and a holder unit combined with the divided member to vertically move the divided member and pressing the divided member with respect to the membrane.

Description

TECHNICAL FIELD [0001] The present invention relates to a substrate carrier and a chemical mechanical polishing apparatus having the same,

The present invention relates to a chemical mechanical polishing apparatus for a substrate, and more particularly, to a substrate carrier capable of uniformly applying a pressing force to a substrate during a polishing process of the substrate and a chemical mechanical polishing apparatus having the same.

BACKGROUND ART [0002] Recently, with the rapid spread of an information medium such as a computer, semiconductor devices are rapidly developing. In terms of its function, the semiconductor device is required to operate at high speed and to have a large storage capacity. In response to this demand, semiconductor processing technology is being developed in the direction of improving the degree of integration, reliability, and response speed and the like.

A silicon substrate widely used as a material for manufacturing semiconductor devices refers to a single crystal silicon thin plate made of polycrystalline silicon as a raw material. The substrate manufacturing process includes a slicing process for cutting a grown silicon single crystal ingot into thin plates, a lapping process for uniformizing and flattening the thickness of the substrate, a process for eliminating or alleviating damages caused in the slicing process and the lapping process A polishing process for mirror-polishing the surface of the substrate, and a cleaning process for cleaning the polished substrate and removing foreign matters adhered to the surface.

Here, the polishing step is divided into stock polishing, which removes the surface alteration layer of the substrate and improves the thickness uniformity, and final polishing, which polishes the surface of the substrate to mirror surface.

The final polishing process is a polishing process in which a substrate carrier (polishing carrier) which fixes and fixes a substrate with a certain pressure is mechanically reacted by rotation of a table, which is a table with a polishing cloth, and a chemical reaction by a polishing slurry composed of colloidal silica A chemical mechanical polishing (CMP) apparatus is used.

In such a CMP apparatus, a substrate carrier is used as an apparatus for holding a substrate. The substrate carrier holds the substrate directly and indirectly by vacuum suction, and a membrane type is mainly used. In addition, there has been proposed a multi-layer split polishing type substrate carrier capable of variously adjusting the polishing profile of a substrate by applying a different local pressure to one substrate, beyond simply polishing the surface of the substrate by applying a uniform pressure have.

Here, the substrate carrier presses the substrate against the polishing pad with the polishing surface of the substrate facing the polishing pad before and after the polishing process, and moves to the next process while grasping the substrate directly or indirectly when the polishing process is completed . However, in the conventional substrate carrier, the membrane to be held in contact with the substrate is fixed by the main body portion and the ring-shaped retainer ring surrounding the main body portion. A plurality of pressure chambers for applying pressure to the membrane are formed in the body to adjust the pressure applied to the substrate through the membrane and the membrane by injecting or discharging air into the pressure chamber.

However, the conventional substrate carrier does not uniformly transfer the pressure applied to the pressure chamber to the membrane. Specifically, as the force acting in the pressure chamber is transmitted downward along the side surface, pressure is concentrated on the edge portion of the substrate, which causes a problem that the polishing amount becomes excessive due to an excessive pressing force. As the pressure is concentrated on the edge portion of the substrate, a rebound phenomenon of the polishing pad is generated in the inner region adjacent to the edge region, and a rather small pressing force acts on the polishing pad. Accordingly, it is possible to uniformly polish the substrate by applying different pressures at a part, instead of applying a single pressure to the membrane. That is, a technology is used in which ribs are formed on a membrane, and different pressures are locally applied to one substrate to variously adjust the polishing profile of the substrate. However, in the conventional substrate carrier, pressure can not be transmitted due to its thickness and structure in the lip region, so that the polishing rate during polishing is lowered.

According to embodiments of the present invention, there is provided a substrate carrier and a chemical mechanical polishing apparatus having the substrate carrier capable of preventing a reduction in the polishing rate in a lip region dividing the membrane in the substrate carrier.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to embodiments of the present invention, a substrate carrier for a substrate polishing apparatus includes a main body that rotates by receiving a rotational driving force from the outside, and a main body fixed to the main body, A plurality of pressure chambers formed inside the main body and spaced apart from the membrane in a polishing process and coupled to the membrane to form a plurality of pressure chambers, And a holder coupled to the dividing member to move the dividing member vertically and press the dividing member against the membrane.

According to one aspect, the partitioning member may include a base portion coupled to the holder portion and a partition wall extending from the base portion toward the membrane to form the plurality of pressure chambers when coupled with the membrane. For example, the partition may be formed to open the lower portion and seal the space between the plurality of pressure chambers when the partition is engaged with the membrane. In addition, the end of the barrier rib may be formed as a tip portion whose sectional area gradually decreases. The inner surface of the membrane may be formed with an engagement groove to which the end of the barrier rib is coupled. In addition, the base may be provided with a plurality of injection ports for injecting and discharging air into the plurality of pressure chambers, and each of the injection ports may be formed to communicate the holder and each of the pressure chambers. For example, the dividing member may be formed as a rigid body.

According to one aspect, the holder portion may be formed of a flexible material so as to press and move the dividing member up and down. And a guide portion for transmitting the pressure from the holder portion to the partitioning member may be provided between the holder portion and the partitioning member.

According to one aspect of the present invention, a pressure regulating unit may be provided for injecting or discharging air into the holder unit to adjust the pressure inside the holder unit. For example, the pressure regulator may adjust the pressure of the pressure chamber by injecting or discharging air into the plurality of pressure chambers through the holder. The pressure regulator may apply a pressure greater than a pressure inside the pressure chamber to the inside of the holder when the holder part presses the partitioning member. The pressure regulator may apply different pressures to the plurality of pressure chambers.

According to another aspect of the present invention, there is provided a substrate polishing apparatus including: a polishing pad on which a chemical mechanical polishing process of a substrate is performed; a polishing pad provided on an upper surface of the polishing pad; And a substrate carrier for holding the substrate and moving the substrate while pressing the substrate to contact the polishing pad while the polishing process of the substrate is being performed, A membrane that is fixed to the main body and rotates together with the main body to grasp the substrate, a membrane that is spaced apart from the membrane in the main body, is lowered during the polishing process and is coupled to the membrane, A partition member for forming a pressure chamber and pressing the membrane, and a partition member coupled to the partition member, A is moved up and down, and comprises a holder portion for pressing the partition member with respect to the membrane.

According to one aspect, the partitioning member may include a base portion coupled to the holder portion and a partition wall extending from the base portion toward the membrane to form the plurality of pressure chambers when coupled with the membrane. In addition, the barrier rib may be formed to have an open bottom, and a coupling groove may be formed in the membrane to which the end of the barrier rib is coupled. In addition, the base may be provided with a plurality of injection ports for injecting and discharging air into the plurality of pressure chambers, and each of the injection ports may be formed to communicate the holder and each of the pressure chambers.

According to one aspect of the present invention, the holder portion is formed of a flexible material so as to press and move the partitioning member, and a guide portion for transmitting pressure from the holder portion to the partitioning member is provided between the holder portion and the partitioning member .

According to one aspect of the present invention, there is provided a pressure control unit for controlling the pressure inside the holder unit by injecting or discharging air into the holder unit. The pressure control unit injects or discharges air into the plurality of pressure chambers, Can be adjusted. The pressure regulator may adjust the pressure of the holder to be greater than the pressure inside the pressure chamber when the holder presses the partitioning member.

Various embodiments of the present invention may have one or more of the following effects.

As described above, according to the embodiments of the present invention, removal of the lip of the membrane in the substrate carrier can be prevented to prevent a decrease in the polishing rate in the lip region, and the structure of the membrane can be simplified to improve the mechanical stability.

Further, by applying a zone divider which removes the lip from the membrane and functions as a lip, different pressures can be applied to the substrate, and a reduction in the local polishing rate can be prevented and improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing a chemical mechanical polishing apparatus and an arrangement structure for carrying out a cleaning process according to an embodiment of the present invention; FIG.
FIGS. 2 and 3 are cross-sectional views of main portions of a substrate carrier according to an embodiment of the present invention.
Fig. 4 is an enlarged view of the substrate carrier of Fig. 3; Fig.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference symbols as possible even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the difference that the embodiments of the present invention are not conclusive.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected,""coupled," or "connected. &Quot;

Hereinafter, referring to the drawings, a substrate carrier 100 capable of uniformly applying a pressing force to a substrate W during a polishing process according to embodiments of the present invention, and a chemical mechanical substrate polishing apparatus 1 having the substrate carrier 100, . 1 is a plan view showing a chemical mechanical polishing apparatus 1 according to an embodiment of the present invention and a layout structure for performing a cleaning process. 2 and 3 are sectional views of principal parts of the substrate carrier 100 according to an embodiment of the present invention. Fig. 2 shows a state before the polishing process of the substrate W, Fig. 3 shows a state before the polishing process of the substrate W Respectively. And Figure 4 is an enlarged view of the substrate carrier 100 of Figure 3

1, a chemical mechanical polishing apparatus 1 according to an embodiment of the present invention includes a chemical mechanical polishing module X1 on which chemical mechanical polishing of a substrate W is performed, And a cleaning module X2. The chemical mechanical polishing module X1 is provided with a plurality of polishing plates P1, P2, P3 and P4: P so that the polishing process can be simultaneously or sequentially performed on a plurality of substrates W, The guide rails G1, G2 and G3 may be provided to form a circulation path connecting the base plates P1, P2, P3 and P4: P. However, the present invention is not limited thereto, and it is also possible that the polishing process is performed only on a part of the polishing table among a plurality of polishing tables P1, P2, P3 and P4: P. Similarly, the polishing platens P1, P2, P3, and P4: P are arranged along the circulation path, and only a part of the polishing platen shown in the figure can be disposed along the circulation path. It is also possible that a plurality of polishing platens P, but one polishing platen is provided.

Specifically, the substrate polishing apparatus 1 includes a substrate carrier 100 that moves in a state holding a substrate W, and a substrate carrier 100 which is arranged to pass through the first polishing table P1 and the second polishing table P2, A first guide rail G1 provided so as to allow the carrier 100 to move and a second guide rail G2 arranged so as to pass through the third polishing table P3 and the fourth polishing table P4, A third guide rail G3 which is arranged between the first guide rail G1 and the second guide rail G2 and on which the substrate carrier 100 moves and a second guide rail G2 arranged between the first guide rail G1 and the second guide rail G2, A first connecting rail CR1 connecting a first position S4 spaced apart from one end of the first guide rail G1 and a second position S4 'spaced apart from one end of the second guide rail G2, A second connecting rail CR2 connecting the third position S1 and a fourth position S1 'spaced apart from the other end of the second guide rail G2 by the first connecting rail CR1, as the group moves along A first carrier holder H1 and a second carrier holder H2 capable of receiving the carrier 100 and a third carrier capable of receiving the substrate carrier 100 while moving along the second connection rail CR2, A holder H3 and a fourth carrier holder H4.

The substrate carrier 100 is moved independently in the guide rails G1, G2 and G3 while the carrier rails CR1 and CR2 are accommodated in the carrier holders H1, H2, H3 and H4 And is moved by the movement of the carrier holder (H). A rectangular shape formed by a plurality of vertical lines in the layout of FIG. 1 and FIG. 2 is a simplified representation of the substrate carrier 100.

The first guide rail G1 is disposed so that the substrate W held by the substrate carrier 100 can be subjected to the chemical mechanical polishing process in the first polishing table P1 and the second polishing table P2. Similarly, the second guide rail G2 is disposed such that the substrate W held by the substrate carrier 100 can be subjected to a chemical mechanical polishing process in the third polishing table P3 and the fourth polishing table P4, respectively do. A polishing platen is not disposed on the third guide rail G3, and a path through which the substrate carrier 100 moves is formed. In order to move from the ends S1 and S4 of the connecting rail CR to the other ends S1 'and S4', the carrier holder H can be moved at one time because two carrier holders H are disposed on the connecting rail CR. The substrate carrier 100 serves as a temporary storage space TS for replacing the carrier holder H at any position where the third guide rail G3 is arranged.

The connecting rails CR are spaced apart from the guide rails G and may be disposed with a difference in height between the up and down directions.

The carrier holder H includes a holder rail HR for accommodating the substrate carrier 100 and accommodates the substrate carrier 100 moving along the guide rail G irrespective of the arrangement of the connecting rails CR . Two carrier holders H are arranged for each connection rail CR. A first carrier holder H1 and a second carrier holder H2 may be provided for the first connection rail CR1 and may move along the first connection rail CR1. A third carrier holder H3 and a fourth carrier holder H4 are provided for the second connection rail CR2 and can move along the second connection rail CR2.

The first carrier holder H1 can receive the substrate carrier 100 positioned in any one of the first guide rail G1 and the third guide rail G3 and can hold the substrate carrier 100 in a state The substrate carrier 100 reciprocatingly moved along the first connection rail CR1 is reciprocally movable along the first connection rail CR1 between the first guide rail G1 and the third guide rail G3 Move to a position where you can move to either one. Similarly, the second carrier holder H2 can receive the substrate carrier 100 located in either the third guide rail G3 or the second guide rail G2 and can receive the substrate carrier 100 The substrate carrier 100 reciprocating along the first connection rail CR1 is reciprocable along the first connection rail CR1 while being supported by the third guide rail G3 and the second guide rail CR1, (G2). ≪ / RTI > The third carrier holder H3 can accommodate the substrate carrier 100 located in any one of the first guide rail G1 and the third guide rail G3 and can hold the substrate carrier 100 The substrate carrier 100 reciprocating along the second connecting rail CR2 is reciprocable along the second connecting rail CR2 to the first guide rail G1 and the third guide rail G3 To a position where it can be moved to any one of them. Similarly, the fourth carrier holder H4 may receive the substrate carrier 100 located in either the third guide rail G3 or the second guide rail G2 and may receive the substrate carrier 100 The substrate carrier 100 reciprocating along the second connecting rail CR2 is reciprocably movable along the second connecting rail CR2 while being held between the third guide rail G3 and the second guide rail CR2, (G2). ≪ / RTI >

The substrate carrier 100 moves along the second connection rail CR2 while being accommodated in the third carrier holder H3 or the fourth carrier holder H4 so that a new substrate W, Is supplied from the loading unit (20). The loading unit 20, the preliminary cleaning device 30 and the unloading unit 10 are respectively disposed in the moving regions of the third carrier holder H3 and the fourth carrier holder H4.

The substrate W having undergone the chemical mechanical polishing process is preliminarily cleaned in the preliminary cleaner 30 and the preliminarily cleaned substrate W is inverted by 180 DEG in the unloading unit 10 To the cleaning units C1, C2 (C1 ', C2'). The preliminary cleaning apparatus 30 is provided with a cleaning nozzle (not shown) for spraying a cleaning liquid with a high water pressure on the polishing surface of the substrate W mounted on the substrate carrier 100, High-pressure spraying of the cleaning liquid on the entire polishing surface of the substrate W removes large foreign substances such as slurry and abrasive particles on the polishing surface of the substrate W. Then, the foreign material is removed from the polishing surface of the substrate W by the preliminary cleaning device 30, so that the reversing device of the unloading unit 10 in which the substrate carrier 100 moves next moves the substrate W to the polishing surface It is possible to prevent the substrate W from being contaminated by the arm of the inverter in the process of inverting the position of the substrate W by 180 DEG.

An embodiment for carrying out the chemical mechanical polishing process of the substrate W using the chemical mechanical polishing apparatus 1 according to the embodiment of the present invention constituted as described above will be described in detail.

First, when a new first substrate W1 and a second substrate W2 are supplied to the two loading units 20, the first substrate W1 is transferred to the substrate carrier 100 of the third carrier holder H3 And the second substrate W2 is mounted on the substrate carrier 100 of the fourth carrier holder H4.

Next, the third carrier holder H3 and the fourth carrier holder H4 move to the third position S1 and the fourth position S1 ', respectively, and then the third carrier holder H3 and the fourth carrier holder H4 move from the third carrier holder H3 to the substrate holder The carrier 100 moves to the first guide rail G1 and the substrate carrier 100 moves from the fourth carrier holder H4 to the third guide rail G3. Here, the substrate carrier 100 moving along the first guide rail G1 is subjected to a first chemical mechanical polishing process on the first substrate W1 on the first polishing surface P1, After completion of the process, the wafer W is moved to the position S2 along the first guide rail G1 to perform a second chemical mechanical polishing process on the first substrate W1 on the second polishing table P2.

The substrate carrier 100 is then moved from the S3 position to the first carrier holder H1 moving along the first connection rail CR1 so that the first carrier holder H1 moves along the first connection rail CR1 Moves to the S6 position of the third guide rail G3 again in the first branching position S5 and moves along the third guide rail G3 and then moves in the second branching position S7 After being transferred to the third carrier holder (H1), it moves to the preliminary cleaning device (30). That is, the two-step chemical mechanical polishing process is performed while moving along the path shown in the drawing.

Thereafter, the polished surface of the first substrate W1 subjected to the chemical mechanical polishing process of the second step is cleaned, transferred to the unloading unit 10 and transferred to the reverser, and then transferred to the main cleaning process do.

Similarly, the substrate carrier 100 moving along the second guide rail G2 performs a first chemical mechanical polishing process on the second substrate W2 on the fourth polishing table P4, and the first chemical mechanical polishing After finishing the polishing process, the wafer W is moved along the second guide rail G2 again (S2) to perform a second chemical mechanical polishing process on the second substrate W2 on the third polishing table P3.

Subsequently, the substrate carrier 100 is transferred from the S3 position to the second carrier holder H2, which moves along the first connecting rail CR1, and the second carrier holder H2 is moved along the first connecting rail CR1 Moves from the position S7 to the third carrier holder H1 after moving from the position S5 to the position S6 of the third guide rail G3 and moving along the third guide rail G3, Thereafter, it moves to the preliminary washing device 30. That is, the two-step chemical mechanical polishing process is performed while moving along the indicated path.

Next, the polished surface of the second substrate W2 subjected to the two-step chemical mechanical polishing process is cleaned, transferred to the unloading unit 10 and transferred to the inverter 50, And transferred to the cleaning process.

As described above, the two-step chemical mechanical polishing process for the two different substrates W1 and W2 can be performed at the same time by using the chemical mechanical polishing apparatus 1 configured as described above.

A polishing pad (not shown) for polishing the substrate W is attached to the surface of the polishing platen P and a driving force for rotating the polishing platen P is applied to the bottom of the polishing platen P A rotating shaft is connected to a driving unit (not shown). The substrate polishing apparatus 1 is configured such that as the substrate carrier 100 and the polishing platen P rotate at a predetermined speed in a state in which the substrate W is pressed against a polishing pad do.

The substrate carrier 100 for holding the substrate W during the polishing process presses the substrate W against the polishing pad with the polishing surface of the substrate W facing the polishing pad. When the polishing process is completed, the substrate carrier 100 moves directly to the next process while holding the substrate directly or indirectly.

The substrate carrier 100 includes a main body 110 rotated by an external rotational driving force, a membrane 130 fixed to a lower portion of the main body 110 and contacting the substrate W to hold the substrate W, And a carrier ring 120 formed in a ring shape surrounding the body 110 to fix the membrane 130 to the body 110.

The substrate carrier 100 is provided with a pressure chamber CP for applying pressure to the substrate W inside the body portion 110 and by injecting or discharging air into the pressure chamber 132, (W). The substrate carrier 100 is also provided with a plurality of pressure chambers 132 to apply different pressures locally to the substrate W by applying different pressures to the plurality of pressure chambers 132, The polishing profile can be varied.

According to the present embodiment, a plurality of pressure chambers 132 are not previously partitioned in the main body 110, but are combined with the membrane 130 selectively in the polishing process to partition the plurality of pressure chambers 132 A partitioning member 140 is provided. As shown in FIG. 2, the partitioning member 140 is provided in the main body 110 before and after the polishing process in a state of being separated from the membrane 130, and as shown in FIG. 3, The membrane 130 is lowered to be connected to the membrane 130 and a plurality of pressure chambers 132 are formed together with the membrane 130 to press the membrane 130.

The partitioning member 140 is formed of a rigid body and is formed to be air-tight so as to form the pressure chamber 132. [

The partition member 140 includes a base portion 141 and a plurality of pressure chambers 142 extending in a predetermined length from the base portion 141 toward the lower membrane 130, And a partition wall 143 that forms a partition wall 132.

The base portion 141 is coupled to the holder portion 150 for pressing the partitioning member 140 and supports the partitioning member 140. An injection port 142 is formed in the base portion 141 so that air can be injected into the plurality of pressure chambers 132 formed in the partitioning member 140 and the holder portion 150 is inserted through the injection port 142. [ . For example, the base portion 141 may have a plate shape parallel to the membrane 130. However, the present invention is not limited to the drawings, and the shape of the base portion 141 may be substantially varied.

The partition 143 is formed so that the lower portion thereof is opened, and when the lower portion of the partition 143 is coupled with the membrane 130, a predetermined space is formed therein, and the space thus formed becomes the pressure chamber 132. The barrier ribs 143 are formed to prevent the plurality of pressure chambers 132 from communicating with each other when the barrier ribs 143 are coupled to the membrane 130.

The end portion 144 of the partition 143 may be formed as a tip portion whose sectional area gradually decreases toward the end portion in order to improve a coupling force with the membrane 130 and a sealing force. Since the end portion 144 of the partition 143 is formed as a tip portion to reduce the contact area between the membrane 130 and the partition wall 143, the membrane 130 is not transferred due to its thickness and structure in the region of the partition wall 143 It is possible to prevent the polishing rate from being lowered during polishing.

An engaging groove 131 may be formed in the inner surface of the membrane 130 to allow the end 144 of the partition 143 to be engaged with the membrane 130 in order to improve the coupling force and sealing force between the partition 143 and the membrane 130. However, the present invention is not limited to the drawings, and it is also possible that the coupling groove 131 is omitted.

The substrate carrier 100 is provided with a holder 150 for moving up and down the partitioning member 140 and for pressing the partitioning member 140 above the partitioning member 140. For example, the holder portion 150 is formed of a flexible material and is formed to expand and contract as the air is injected and discharged into the interior (hereinafter referred to as the inner chamber 151). The holder 150 is expanded when the air is injected into the inner chamber 151 so that the partitioning member 140 is lowered to be coupled to the membrane 130 and presses the partitioning member 140 against the membrane 130. When the air is exhausted from the inner chamber 151, the holder 150 contracts to lift the partitioning member 140 and separate it from the membrane 130.

A guide portion 152 is provided between the holder portion 150 and the partitioning member 140 so that the pressure in the holder portion 150 is uniformly transmitted to the partitioning member 140 and the holder portion 150 is simultaneously lowered and raised. do.

Here, the substrate carrier 100 moves up and down the partitioning member 140 by injecting air into the holder unit 150 or discharging air from the holder unit 150, as well as moving the partitioning member 140 between the membrane 130 As shown in Fig. The substrate carrier 100 also pressurizes the membrane 130 against the substrate W by injecting air into the pressure chamber 132 when the dividing member 140 is coupled to the membrane 130, The air injected into the inside of the holder 132 is supplied through the holder 150.

The pressure regulating unit 160 regulates the pressure in the inner chamber 151 of the holder 150 and regulates the pressure in the pressure chamber 132. The pressure regulator 160 adjusts the pressure of the air injected into and discharged from the holder 150 to adjust the pressure of the holder 150 and adjusts the pressure of the air injected into and discharged from the pressure chamber 132 Thereby adjusting the pressure of the pressure chamber 132. Here, the pressure regulator 160 allows the pressure of the holder 150 to be larger than the pressure of the pressure chamber 132 during the polishing process. This is because the pressure of the holder portion 150 acts in the direction in which the holder portion 150 presses the partitioning member 140 and the pressure of the pressure chamber 132 is such that the partitioning member 140 is separated from the membrane 130 The pressure of the holder part 150 and the pressure of the pressure chamber 132 act in directions opposite to each other with respect to the partitioning member 140. [ When the pressure of the holder part 150 is greater than the pressure of the pressure chamber 132, the partition member 140 accurately pressurizes the membrane 130 and the coupling state between the partition member 140 and the membrane 130 .

According to these embodiments, the removal of the lip structure of the membrane 130 for partitioning the plurality of pressure chambers 132 in the substrate carrier 100 can be prevented to prevent the reduction in the polishing rate in the lip region. In addition, since the membrane 130 according to the present embodiment has a single planar structure, the structure of the membrane 130 can be simplified to improve the mechanical stability. Further, by applying a zone divider 140 which is combined with the membrane 130 to partition the plurality of pressure chambers 132, different pressures can be locally applied to the substrate W, and a local polishing rate It is possible to prevent the decrease and improve the polishing rate and the polishing quality.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

1: substrate polishing apparatus
10: Loading unit
20: unloading unit
30: Spare cleaner
100: substrate carrier
110:
120: Carrier ring
130: Membrane
131: coupling groove
132: pressure chamber
140:
141: Base portion
142: inlet
143:
144: end
150:
151: inner chamber
152: guide portion
160: Pressure regulator
CR: Connection rail
C1, C2, C1 ', C2': cleaning unit
D: Docking unit
G: Guide rail
H: Carrier holder
P: abrasive plate
PP: Polishing pad
R: Carrier ring
X1: Polishing module
X2: Cleaning module
W: substrate

Claims (20)

A main body rotatably receiving an external rotational driving force;
A membrane fixed to the body and rotating with the body to grip the substrate;
A dividing member provided in the main body to be spaced apart from the membrane and connected to the membrane to descend during the polishing process to form a plurality of pressure chambers therein and to press the membrane; And
A holder unit coupled to the partitioning member to vertically move the partitioning member and press the partitioning member against the membrane;
Wherein the substrate carrier is a substrate carrier.
The method according to claim 1,
The partition member
A base portion coupled to the holder portion; And
A partition wall extending from the base portion toward the membrane to form the plurality of pressure chambers when coupled with the membrane;
Wherein the substrate carrier is a substrate carrier.
3. The method of claim 2,
Wherein the partition wall is open at the bottom and is configured to seal between the plurality of pressure chambers when engaged with the membrane.
The method of claim 3,
Wherein the end portion of the partition wall is formed as a tip portion whose sectional area gradually becomes smaller.
The method of claim 3,
And a coupling groove is formed on an inner surface of the membrane for coupling the end of the barrier rib.
3. The method of claim 2,
Wherein the base portion is provided with a plurality of injection ports for injecting and discharging air into the plurality of pressure chambers,
Wherein each of the injection ports is configured to communicate the holder section and each of the pressure chambers.
3. The method of claim 2,
Wherein the dividing member is formed of a rigid body.
The method according to claim 1,
And the holder portion is formed of a flexible material so as to press and move the dividing member up and down.
9. The method of claim 8,
And a guide portion for transmitting the pressure from the holder portion to the partitioning member is provided between the holder portion and the partitioning member.
9. The method of claim 8,
And a pressure regulating unit for controlling the pressure inside the holder unit by injecting or discharging air into the holder unit.
11. The method of claim 10,
Wherein the pressure regulator injects or discharges air into the plurality of pressure chambers through the holder portion to regulate the pressure in the pressure chambers.
12. The method of claim 11,
Wherein the pressure regulating portion applies a pressure within the holder portion to a pressure greater than a pressure inside the pressure chamber when the holder portion presses the partitioning member.
12. The method of claim 11,
Wherein the pressure regulating portion applies pressure of different magnitudes to the plurality of pressure chambers.
An abrasive plate on which a chemical mechanical polishing process of the substrate is performed;
A polishing pad provided on an upper surface of the polishing platen; And
A substrate carrier holding and moving the substrate and pressing the substrate to contact the polishing pad while the polishing process of the substrate is being performed;
Lt; / RTI >
Wherein the substrate carrier comprises:
A main body rotatably receiving an external rotational driving force;
A membrane fixed to the body and rotating with the body to grip the substrate;
A dividing member provided in the main body to be spaced apart from the membrane and connected to the membrane to descend during the polishing process to form a plurality of pressure chambers therein and to press the membrane; And
A holder unit coupled to the partitioning member to vertically move the partitioning member and press the partitioning member against the membrane;
And a polishing pad.
15. The method of claim 14,
The partition member
A base portion coupled to the holder portion; And
A partition wall extending from the base portion toward the membrane to form the plurality of pressure chambers when coupled with the membrane;
And a polishing pad.
16. The method of claim 15,
The partition wall is formed so that its lower portion is open,
Wherein the membrane has an engaging groove to which an end of the partition wall is engaged.
16. The method of claim 15,
Wherein the base portion is provided with a plurality of injection ports for injecting and discharging air into the plurality of pressure chambers,
Wherein each of the injection ports is configured to communicate the holder portion and each of the pressure chambers.
16. The method of claim 15,
Wherein the holder portion is formed of a flexible material so as to press and move the dividing member up and down,
And a guide portion for transmitting pressure from the holder portion to the partitioning member is provided between the holder portion and the partitioning member.
19. The method of claim 18,
And a pressure regulating unit for regulating a pressure inside the holder unit by injecting or discharging air into the holder unit,
Wherein the pressure regulator injects or discharges air into the plurality of pressure chambers to adjust the pressure of the pressure chambers.
20. The method of claim 19,
Wherein the pressure regulating portion adjusts the pressure in the holder portion to be larger than the pressure inside the pressure chamber when the holder portion presses the partitioning member.

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