KR20220026793A - Retainer ring - Google Patents

Abstract

A retaining ring according to an embodiment includes: an upper part including a body formed in a ring shape and a receiving groove recessed on one surface of the body; and a lower part injected into the receiving groove and coupled to the upper part. According to the present invention, it is possible to prevent the lower part from being detached from the upper part.

Description

retainer ring {RETAINER RING}

The example below relates to retaining.

BACKGROUND ART In manufacturing a semiconductor device, a CMP (chemical mechanical polishing) operation including polishing, buffing, and cleaning is required. A semiconductor device has a multilayer structure, and a transistor device having a diffusion region is formed on a substrate layer. In the substrate layer, connecting metal lines are patterned and electrically connected to the transistor elements forming the functional elements. As is known, the patterned conductive layer is insulated from the other conductive layers with an insulating material such as silicon dioxide. As more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the production of additional metal layers becomes substantially more difficult because of the many variations in surface morphology. In addition, the metal line pattern is formed of an insulating material, so that the metal CMP operation removes the excess metal.

The CMP process includes a process of physically abrading the surface of a substrate through a polishing pad. This process is performed by pressing the substrate against the polishing head while holding the substrate through the substrate carrier. In general, since the polishing pad has elasticity, a pressing force applied to the substrate during the polishing process is non-uniform, so that the substrate is separated from the carrier head. Accordingly, the substrate carrier has a retaining ring that supports the edge region of the substrate.

On the other hand, since the retaining ring is worn while in contact with the polishing pad during the polishing process of the substrate, the flatness of the surface becomes non-uniform as the polishing process progresses. Accordingly, a method has been introduced in which the retaining ring is composed of an upper part and a lower part and used while replacing the worn lower parts. However, in the case of such a structure, there is a problem that the lower part is separated from the upper part due to friction with the polishing pad. Accordingly, there is a need for a retaining ring having a structure capable of stably fastening the lower part to the upper part so as to prevent the lower part from being separated.

The above-mentioned background art is possessed or acquired by the inventor in the process of deriving the disclosure of the present application, and it cannot necessarily be said to be a known technology disclosed to the general public prior to the present application.

SUMMARY OF THE INVENTION It is an object of one embodiment to provide a retaining ring capable of preventing a lower part from detaching from an upper part.

It is an object of an embodiment to provide a retaining ring that facilitates replacement of a lower part.

The retaining ring according to an embodiment includes: an upper part including a body part formed in a ring shape and a receiving groove recessed in one surface of the body part; and a lower part injected into the receiving groove and coupled to the upper part.

The lower part may include: a receiving part formed in a shape corresponding to the receiving groove and coupled to the receiving groove; and a plate part integrally formed with the receiving part, in contact with one surface of the upper part, and having a predetermined thickness.

The upper part may further include a fastening groove recessed in an inner surface of the receiving groove.

The lower part may further include a fastening part integrally formed with the receiving part and formed in a shape corresponding to the fastening groove.

A plurality of the receiving grooves may be formed to be spaced apart from each other at a predetermined interval along a circumferential direction of the upper part.

The lower part may be injected into the plurality of receiving grooves, respectively, and a flow path may be formed between the plate portions of the lower parts positioned adjacent to each other.

The retaining ring according to an embodiment includes: an upper part including a body part formed in a ring shape and a through hole penetrating the body part in a vertical direction; and a lower part injected into the through hole and coupled to the upper part.

The lower part may include a through portion formed in a shape corresponding to the through hole and coupled to the through hole; and a plate part integrally formed with the through part, in contact with one surface of the upper part, and having a predetermined thickness.

The upper part may further include a fixing groove recessed in the other surface of the body to communicate with the through hole.

The lower part may further include a fixing part which is integrally formed with the through part and has a shape corresponding to the fixing groove.

The fixing groove may have a larger cross-sectional area than the through hole.

The upper part may further include a receiving groove recessed in one surface of the body portion to communicate with the through hole.

The lower part may further include a accommodating part integrally formed with the through part and formed in a shape corresponding to the accommodating groove.

The receiving groove may have a larger cross-sectional area than the through hole.

A plurality of the through-holes may be formed to be spaced apart from each other at a predetermined interval in a circumferential direction of the upper part.

The lower part may be injected into the plurality of through holes, respectively, and a flow path may be formed between the plate portions of the lower parts positioned adjacent to each other.

The retaining ring according to an embodiment may prevent the lower part from being separated from the upper part through the fastening of the fastening protrusion and the fastening groove.

The retaining ring according to an embodiment may have a structure in which a lower part can be easily replaced.

Effects of retaining according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a schematic diagram of a substrate polishing apparatus according to an embodiment.
2 is a cross-sectional view of a substrate carrier according to an embodiment.
3 is a lower perspective view of a retaining ring according to an embodiment;
4 is a perspective view of an upper part according to an embodiment;
5 is a cross-sectional view of a receiving groove of an upper part according to an embodiment.
6 is a combined cross-sectional view of an upper part and a lower part according to an exemplary embodiment.
7 is a combined cross-sectional view of an upper part and a lower part according to an exemplary embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various changes may be made to the embodiments, the scope of the patent application is not limited or limited by these embodiments. It should be understood that all modifications, equivalents and substitutes for the embodiments are included in the scope of the rights.

The terms used in the examples are used for the purpose of description only, and should not be construed as limiting. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as "comprise" or "have" are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiment belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

In addition, in the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and the overlapping description thereof will be omitted. In describing the embodiment, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Components included in one embodiment and components having a common function will be described using the same names in other embodiments. Unless otherwise stated, descriptions described in one embodiment may be applied to other embodiments as well, and detailed descriptions within the overlapping range will be omitted.

1 is a schematic diagram of a substrate polishing apparatus according to an embodiment. 2 is a cross-sectional view of a substrate carrier according to an embodiment.

1 and 2 , a substrate polishing apparatus 1 according to an exemplary embodiment may be used for a CMP process of a substrate W. Referring to FIG.

The substrate W may be a silicon wafer for manufacturing a semiconductor device. However, the type of the substrate W is not limited thereto. For example, the substrate W may include glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) or a plasma display panel (PDP).

The substrate polishing apparatus 1 can polish the substrate W. The substrate polishing apparatus 1 may include a substrate carrier 10 and a polishing unit U.

The polishing unit may polish the to-be-polished surface of the substrate W. The polishing unit U may include a polishing platen T and a polishing pad P.

A polishing pad P may be connected to the polishing plate T. For example, the polishing pad P may be attached to the upper portion of the polishing platen T. The polishing platen T may orbitally polish the polished surface of the substrate W in contact with the polishing pad P while rotating about the axis. The polishing surface plate T can adjust the position of the polishing pad P with respect to the ground while moving in the vertical direction. The polishing pad P may be in contact with the surface to be polished of the substrate W to physically abrade the surface to be polished of the substrate W. The polishing pad P may include a polyurethane (polyurethane) material.

Referring to FIG. 2 , the substrate carrier 10 may hold the substrate W . The substrate carrier 10 may chuck and hold the substrate W to be polished, and move the gripped substrate W to the upper portion of the polishing pad P. The substrate carrier 10 may perform polishing of the substrate W by bringing the substrate W transferred to the upper portion of the polishing pad into contact with the polishing pad P. The substrate carrier 10 presses the substrate W in contact with the polishing pad P, thereby controlling the friction force between the substrate W and the polishing pad P to determine the degree of polishing of the substrate W. The substrate carrier 10 may include a carrier head 11 , a membrane 12 and a retaining ring 13 .

The carrier head 11 may adjust the position of the substrate W. The carrier head 11 may receive power from the outside and may rotate about an axis perpendicular to the surface of the polishing pad P. The substrate W gripped by the rotation of the carrier head 11 may be polished while rotating while in contact with the polishing pad P.

The carrier head 11 may move the substrate W horizontally. For example, the carrier head 11 may translate in a first direction parallel to the surface of the polishing pad P and a second direction perpendicular to the first direction. Through the combined movement in the first direction and the second direction, the carrier head 11 may move the substrate W on a plane parallel to the surface of the polishing pad P. As a result, according to the horizontal movement of the carrier head 11 , the substrate W may be transferred to or removed from the polishing position.

The carrier head 11 may move the substrate W in the vertical direction with respect to the ground. The carrier head 11 can move up and down with respect to the substrate W support for chucking/dechucking the substrate W, or move up and down with respect to the polishing pad P for polishing the substrate W. there is.

The membrane 12 is connected to the carrier head 11 and may form a pressure chamber C for applying pressure to the substrate W. According to the pressure fluctuation of the pressure chamber C formed by the membrane 12 , the pressure acting on the substrate W may be adjusted. For example, the degree to which the substrate W is pressed against the polishing pad P may be increased by increasing the pressure of the pressure chamber C while the substrate W is in contact with the polishing pad P. The membrane 12 may include a bottom plate that forms a bottom surface of the pressure chamber C, and a flap that forms a sidewall of the pressure chamber C. A plurality of flaps may be formed to have different radii based on the center of the bottom plate, and each pressure chamber C may be formed for each space between adjacent flaps. Different pressures may be applied to the pressure chambers C, and a portion of the substrate W corresponding to each pressure chamber C may be locally pressurized according to the pressure applied to each pressure chamber C.

The retaining ring 13 may be connected to the carrier head 11 so as to surround the periphery of the gripped substrate W . The retaining ring 13 may prevent the substrate W from being separated from the gripped position. For example, the retaining ring 13 may support the side surface of the substrate W so that the substrate W does not separate from the substrate carrier 10 due to vibration generated during the polishing process of the substrate W .

The retaining ring 13 may be directly connected to the carrier head 11 or indirectly connected through a separate connecting member. The retaining ring 13 may be connected to the carrier head 11 to move up and down relative to the substrate carrier 10 via a separate actuator, for example.

The retaining ring 13 may include an upper part 131 and a lower part 132 . The upper part 131 may have an upper side connected to the carrier head 11 . A lower part 132 may be connected to a lower side of the upper part 131 . A lower side of the lower part 132 may be in contact with the polishing pad P. When the lower side of the lower part 132 is worn by contact with the polishing pad, the lower part 132 may be replaced.

3 is a lower perspective view of a retaining ring according to an embodiment; 4 is a perspective view of an upper part according to an embodiment; 5 is a cross-sectional view of a receiving groove of an upper part according to an embodiment. 6 is a combined cross-sectional view of an upper part and a lower part according to an exemplary embodiment.

3 to 6 , the upper part 131 may be formed in a ring shape. The upper part 131 may include a metal material. For example, the upper part 131 may include stainless steel.

The upper part 131 may include a body portion 1311 , a receiving groove 1312 , and a fastening groove 1313 .

The body portion 1311 may be formed in a ring shape. A substrate may be positioned and held in the inner space of the body portion 1311 . The body 1311 may have a carrier head 11 connected to its upper side and a lower part 132 to its lower side.

The receiving groove 1312 may be formed to be depressed upwardly on the lower surface of the body portion 1311 . A plurality of receiving grooves 1312 may be formed. The plurality of receiving grooves 1312 may be disposed to be spaced apart from each other at predetermined intervals along the circumferential direction of the upper part 131 . The receiving groove 1312 may be a space into which the lower part 132, which will be described later, is injected.

The fastening groove 1313 may be recessed in the inner surface of the receiving groove 1312 . The fastening groove 1313 may extend along the inner surface of the receiving groove 1312 . For example, the fastening groove 1313 may form a closed loop along the inner surface of the receiving groove 1312 . The fastening groove 1313 may be formed in the vicinity of the middle of the recessed depth of the receiving groove 1312 .

The lower part 132 may be coupled to a lower side of the upper part 131 . The lower part 132 may be formed by injection. For example, a plurality of lower parts 132 may be formed by injection into each of the receiving grooves 1312 and the fastening grooves 1313 . The plurality of lower parts 132 may be spaced apart from each other in a circumferential direction of the upper part 131 . According to such a structure, a flow path F through which a slurry or a chemical is discharged may be formed between the lower parts 132 positioned adjacent to each other. Accordingly, the slurry or chemical may be discharged from the inside to the outside through the flow path F.

The lower part 132 may include a plate part 1321 , a receiving part 1322 , and a fastening part 1323 .

The receiving portion 1322 may be a portion formed by injection into the receiving groove 1312 of the upper part 131 . Accordingly, the receiving portion 1322 may be formed in a shape corresponding to the receiving groove 1312 . Through injection molding, the receiving portion 1322 may be coupled to the receiving groove 1312 .

The plate portion 1321 may be integrally formed with the receiving portion 1322 . The plate portion 1321 may be a portion in contact with the lower surface of the upper part 131 . The plate part 1321 may be formed to have a predetermined thickness. In order to inject the plate part 1321 , an injection mold having a shape corresponding to the plate 1321 may be provided. The plate portions 1321 of the lower parts 132 positioned adjacent to each other may be spaced apart from each other. That is, the flow path F may be formed between the plate portions 1321 of the lower parts 132 positioned adjacently. Slurry or chemicals may be discharged from the inside of the retaining ring 13 to the outside through the flow path F. The flow path F may be formed in the radial direction of the retainer ring 13 or may be formed inclined in the radial direction of the retainer ring 13 .

The fastening part 1323 may be integrally formed with the receiving part 1322 . The fastening portion 1323 may be a portion formed by injection into the fastening groove 1313 . Accordingly, the fastening part 1323 may be formed in a shape corresponding to the fastening groove 1313 . Through injection molding, the fastening part 1323 may be fastened to the fastening groove 1313 . The coupling part 1323 may strengthen the coupling force between the upper part 131 and the lower part 132 .

According to such injection molding, the bonding force between the upper part 131 and the lower part 132 may be improved. Accordingly, it is possible to prevent the lower part 132 from being separated from the upper part 131 even by friction and vibration generated by the contact between the lower part 132 and the polishing pad P. In addition, when the lower part 132 is worn, the lower part 132 can be easily replaced through re-injection.

7 is a combined cross-sectional view of an upper part and a lower part according to an exemplary embodiment.

Referring to FIG. 7 , the upper part 231 may include a body part 2311 , a receiving groove 2312 , a fastening groove 2313 , a through hole 2314 , and a fixing groove 2315 .

The body part 2311 may be formed in a ring shape. A substrate may be positioned and held in the inner space of the body portion 2311 . The body 2311 may have a carrier head connected to its upper side and a lower part 232 to its lower side.

The through hole 2314 may penetrate the body part 2311 in the vertical direction. A plurality of through holes 2314 may be formed. The plurality of through-holes 2314 may be disposed to be spaced apart from each other at predetermined intervals along the circumferential direction of the upper part 231 . The cross-section of the through hole 2314 may have various shapes such as a circle, a triangle, or a square.

The fixing groove 2315 may be recessed downwardly in the upper surface of the body part 2311 to communicate with the through hole 2314 . The fixing groove 2315 may be formed for each through hole 2314 . The fixing groove 2315 may have a larger cross-sectional area than the through hole 2314 .

The receiving groove 2312 may be formed to be depressed upwardly on the lower surface of the body portion 2311 to communicate with the through hole 2314 . The receiving groove 2312 may be formed for each through hole 2314 . The receiving groove 2312 may have a larger cross-sectional area than the through hole 2314 .

The fastening groove 2313 may be recessed in the inner surface of the receiving groove 2312 . The fastening groove 2313 may extend along the inner surface of the receiving groove 2312 . For example, the fastening groove 2313 may form a closed loop along the inner surface of the receiving groove 2312 . The fastening groove 2313 may be formed in the vicinity of the middle of the recessed depth of the receiving groove 2312 .

The lower part 232 may be coupled to a lower side of the upper part 231 . The lower part 232 may be formed by injection. For example, a plurality of lower parts 232 may be formed by injection into each of the through-holes 2134 , the fixing grooves 2315 , the receiving grooves 2312 , and the fastening grooves 2313 . The plurality of lower parts 232 may be spaced apart from each other in a circumferential direction of the upper part 231 . According to such a structure, a flow path F through which a slurry or a chemical is discharged may be formed between the lower parts 232 positioned adjacent to each other. Accordingly, the slurry or chemical may be discharged from the inside to the outside through the flow path F.

The lower part 232 may include a through part 2324 , a fixing part 2325 , a plate part 2321 , a receiving part 2322 , and a fastening part 2323 .

The through portion 2324 may be a portion formed by injection into the through hole 2314 of the upper part 231 . Accordingly, the through portion 2324 may be formed to have a shape corresponding to the through hole 2314 . Through injection molding, the through portion 2324 may be coupled to the through hole 2314 .

The fixing part 2325 may be integrally formed with the through part 2324 . The fixing part 2325 may be a part formed by injection into the fixing groove 2315 . Accordingly, the fixing part 2325 may be formed in a shape corresponding to the fixing groove 2315 . Through injection molding, the fixing part 2325 may be coupled to the fixing groove 2315 . Since the cross section of the fixing groove 2315 is larger than that of the through hole 2314 , the fixing part 2325 can prevent the through part 2324 from being separated.

The receiving portion 2322 may be integrally formed with the through portion 2324 . The receiving portion 2322 may be a portion formed by injection into the receiving groove 2312 . Accordingly, the receiving portion 2322 may be formed in a shape corresponding to the receiving groove 2312 . The receiving portion 2322 may be coupled to the receiving groove 2312 through injection molding. Since the cross section of the receiving groove 2312 is larger than that of the through hole 2314 , the receiving portion 2322 may prevent the through portion 2324 from being separated.

The plate part 2321 may be integrally formed with the through part 2324 . The plate part 2321 may be a part in contact with the lower surface of the upper part 231 . The plate part 2321 may be formed to have a predetermined thickness. In order to inject the plate part 2321, an injection mold having a shape corresponding to the plate 2321 may be provided. The plate portions 2321 of the lower parts 232 positioned adjacent to each other may be spaced apart from each other. That is, the flow path F may be formed between the plate portions 2321 of the lower parts 232 positioned adjacently. Slurry or chemicals may be discharged from the inside of the retaining ring 23 to the outside through the flow path F. The flow path F may be formed in the radial direction of the retaining ring 23 or may be formed inclined in the radial direction of the retaining ring 23 .

The fastening part 2323 may be integrally formed with the receiving part 2322 . The fastening part 2323 may be a part formed by injection into the fastening groove 2313 . Accordingly, the fastening part 2323 may be formed in a shape corresponding to the fastening groove 2313 . Through injection molding, the fastening part 2323 may be fastened to the fastening groove 2313 . The coupling part 2323 may strengthen the coupling force between the upper part 231 and the lower part 232 .

According to such injection molding, the bonding force between the upper part 231 and the lower part 232 may be improved. Accordingly, it is possible to prevent the lower part 232 from being separated from the upper part 231 even by friction and vibration generated by the contact between the lower part 232 and the polishing pad P. In addition, when the lower part 232 is worn, the lower part 232 can be easily replaced through re-injection.

As described above, although the embodiments have been described with reference to the limited drawings, those skilled in the art may apply various technical modifications and variations based on the above. For example, the described techniques are performed in an order different from the described method, and/or the described components of the system, structure, apparatus, circuit, etc. are combined or combined in a different form than the described method, or other components Or substituted or substituted by equivalents may achieve an appropriate result.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

1: substrate polishing device
13: Retaining
131: upper part
132: lower part

Claims (16)

An upper part comprising a body portion formed in a ring shape and a receiving groove recessed in one surface of the body portion; and
and a lower part injected into the receiving groove and coupled to the upper part. According to claim 1,
The lower part is
a receiving part formed in a shape corresponding to the receiving groove and fastened to the receiving groove; and
and a plate portion integrally formed with the accommodating portion and in contact with one surface of the upper part and having a predetermined thickness. 3. The method of claim 2,
The upper part, retaining ring, further comprising a fastening groove recessed formed in the inner surface of the receiving groove. 4. The method of claim 3,
The lower part is
The retaining ring further comprising a fastening part integrally formed with the receiving part and formed in a shape corresponding to the fastening groove. 3. The method of claim 2,
A retaining ring, wherein a plurality of the receiving grooves are spaced apart from each other at predetermined intervals along a circumferential direction of the upper part. 6. The method of claim 5,
The lower part is respectively injected into the plurality of receiving grooves, and a flow path is formed between the plate portions of the lower parts positioned adjacently. an upper part including a body portion formed in a ring shape and a through hole penetrating the body portion in a vertical direction; and
and a lower part injected into the through hole and coupled to the upper part. 8. The method of claim 7,
The lower part is
a through portion formed in a shape corresponding to the through hole and coupled to the through hole; and
and a plate portion integrally formed with the through portion and in contact with one surface of the upper part and having a predetermined thickness. 9. The method of claim 8,
The upper part may further include a fixing groove recessed in the other surface of the body to communicate with the through hole. 10. The method of claim 9,
The lower part may further include a fixing portion integrally formed with the through portion and formed in a shape corresponding to the fixing groove. 11. The method of claim 10,
and the fixing groove has a larger cross-sectional area than the through hole. 11. The method of claim 10,
The upper part further includes a receiving groove recessed in one surface of the body portion to communicate with the through hole. 13. The method of claim 12,
The lower part may further include a receiving portion integrally formed with the through portion and formed in a shape corresponding to the receiving groove. 14. The method of claim 13,
and the receiving groove has a larger cross-sectional area than the through hole. 9. The method of claim 8,
The retaining ring, wherein a plurality of the through-holes are spaced apart from each other at a predetermined interval in a circumferential direction of the upper part. 16. The method of claim 15,
The lower part is respectively injected into the plurality of through-holes, and a flow path is formed between the plate portions of the lower parts positioned adjacent to each other.

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